JP4167631B2 - Manufacturing method of liquid crystal display - Google Patents

Description

  The present invention relates to a component adhesion release device useful for removing a component adhered to an apparatus or a plate in a production process. In particular, the present invention relates to a component close-contact release device that can shorten the operation time when removing a component that has been contacted and fixed by an operator, a transport robot, or the like, and a method of manufacturing a liquid crystal display using the device.

As an example, an outline of production of parts related to a liquid crystal display (LCD) will be described. Schematic production of liquid crystal displays consists of an array process for making thin film transistors (TFTs), a cell process for sealing liquid crystal material between the array substrate and the substrate facing it, and a drive circuit mounted on a printed circuit board. And a module process to be attached to the liquid crystal panel.
In particular, in the above-described module process, a flexible substrate circuit (FPC) equipped with a driving electronic circuit IC is mounted so that the cell substrate can be electrically controlled, starting from an acceptance test for checking the quality of the cell substrate. It is attached to the substrate, and further, a backlight of the light source, a cable, a housing frame and the like are attached.

In the module process, in order to attach the FPC to the cell substrate, an anisotropic conductive film (ACF) is used to connect a large number of electrodes of the FPC and the cell substrate together. I do.
In the above connection work, the cell substrate is adhered to the plate, the anisotropic conductive film is attached to the electrode of the cell substrate, and after the attaching work, the cell substrate to which the anisotropic conductive film is attached is removed from the plate, Furthermore, the cell substrate on which the anisotropic conductive film is attached is adhered to another plate, the FPC is placed on the anisotropic conductive film, and the adhesive is applied by applying heat and pressure. After curing, the FPC electrode and the cell substrate electrode are directly connected.

The cell substrate is adhered to the plate, the anisotropic conductive film is attached to the electrode of the cell substrate, and after the attaching operation, the cell substrate to which the anisotropic conductive film is attached is removed from the plate. There's a problem.
FIG. 8 is a side sectional view for explaining an operation of removing the cell substrate on which the anisotropic conductive film is attached, from the plate, which is a premise of the present invention. Note that the same components are denoted by the same reference numerals and symbols throughout the drawings.

As shown in the figure, a substrate set plate 101 is provided for attaching an anisotropic conductive film, and a plurality of positioning pins 102 are provided on the substrate set plate 101.
A plurality of positioning holes 104 are provided in the cell substrate 103, and the plurality of positioning holes 104 correspond to the plurality of positioning pins 102 in position.
The cell substrate 103 is set on the substrate set plate 101 and positioned on the substrate set plate 101 such that each of the positioning pins 102 is inserted into each of the positioning holes 104.

  After the operator sets the cell substrate 103 on the substrate set plate 101, the cell substrate 103 is adhered and fixed to the substrate set plate 101 by air adsorption (not shown), and an anisotropic conductive film (not shown) is attached to the cell substrate 103. paste. In this case, the air adsorption is performed in order to prevent the cell substrate 103 from moving when the anisotropic conductive film is attached to the cell substrate 103 and to improve the accuracy of attaching the anisotropic conductive film.

  After the anisotropic conductive film is attached to the cell substrate 103, when the operator removes the cell substrate 103 from the substrate set plate 101, the thickness of the cell substrate 103 is thin, and the cell substrate 103 is not easily sandwiched between the operator's fingers. However, even if the air adsorption is released, the adhesion and fixation of the cell substrate 103 to the substrate set plate 101 cannot be easily released, and it is difficult to remove the cell substrate 103 from the substrate set plate 101.

  Furthermore, since the cell substrate 103 is positioned on the substrate set plate 101 by the positioning pins 102 and the positioning holes 104, the cell substrate 103 can be pulled up vertically if the above-mentioned adhesion and fixation are released. The pin 102 and the positioning hole 104 can be removed without interference, but when the above-mentioned close contact and fixation are released and the pulling is performed at the same time, the positioning pin 102 and the positioning hole 104 interfere if the cell substrate 103 is tilted up slightly. However, there is a problem that the cell substrate 103 is caught by the positioning pins 102 and it becomes difficult to remove the cell substrate 103.

For this reason, when the cell substrate 103 is removed from the substrate set plate 101 by an operator or a transfer robot, the operation time cannot be shortened.
Furthermore, as described above, the cell substrate on which the anisotropic conductive film is pasted is adhered to another plate, the FPC is placed on the anisotropic conductive film, and heat and pressure are applied for pasting. When the adhesive is cured and the FPC electrode and the cell substrate electrode are directly connected, the application of heat and pressure causes the cell substrate 103 to adhere to the substrate set plate 101, and the adhesion release There is a problem that it becomes difficult.

  2. Description of the Related Art Conventionally, a transfer unit has a plurality of holes (through holes) at regular pitch intervals, for example, in order to provide an apparatus for applying cream solder that can improve the service life when applying cream solder to terminal portions of a printed wiring board. A transfer pin that is inserted into the stage hole and moves up and down, a holder that supports the base of the transfer pin, a squeegee that moves the cream solder placed on the stage in a horizontal direction, and a stage And a support means that moves up and down by vacuum suction of the printed wiring board. In this configuration, when the cream solder is moved in the horizontal direction by a squeegee, a part of the cream solder is inserted into the hole. When the printed circuit board adsorbed by the support means is lowered to an appropriate position, the holder is mounted. Transfer pin is raised by the operation of are those cream solder is transferred to the terminal portion of the printed circuit board (for example, see Patent Document 1).

  However, Patent Document 1 discloses that the transfer pin is raised by the operation of the holder and the cream solder is transferred to the terminal portion of the printed wiring board. It does not solve the problem that it is difficult to remove the cell substrate 103 from the substrate set plate 101 because the adhesion and fixation to the substrate set plate 101 cannot be easily released.

  Also, conventionally, in order to make it easy to manufacture a device including a printed circuit on a flexible substrate, it is obtained by a device for supplying a molded product to a manufacturing machine, where the device is arranged on a roll. It consists of a long flexible film, and the film has a first protective layer on which each molded product is placed, and an adhesive is applied between the molded product and the protective layer to adhere the molded product to the protective layer. The first protective layer and the adhesive cooperate so that when the molded article is detached from the first protective layer, substantially all of the adhesive is disposed on the molded article or on the protective layer, wherein Then, some molded products include a printed circuit (for example, refer to Patent Document 2).

However, although the said patent document 2 is disclosing manufacturing the apparatus containing the printed circuit on a flexible substrate, as above-mentioned, especially the close_contact | adherence and fixation to the substrate set plate 101 of the cell substrate 103 are easy. However, the problem that it is very difficult to remove the cell substrate 103 from the substrate set plate 101 is not solved.
Conventionally, in order to provide an exposure apparatus that can easily clean the substrate holding surface of the substrate holder, the substrate holding has the same thickness and shape as the photosensitive substrate and the substrate holding surface is formed on the surface. Adapter is prepared as a separate member, the substrate holding adapter is vacuum-adsorbed on the base stage of the substrate stage, the photosensitive substrate is vacuum-adsorbed and held on it, and the substrate holding adapter is removed from the base stage by the substrate transport system Transported in the exposure apparatus, transported and stored in the cleaning section or substrate storage box in the exposure apparatus, returned to the substrate storage box after cleaning, or a substrate holding adapter that was cleaned by the cleaning section and removed foreign matter Some of the substrate holding adapters are returned to the base stage by the substrate transport system again (see, for example, Patent Document 3).

  However, Patent Document 3 discloses that the photosensitive substrate is held by vacuum suction, and the substrate holding adapter is removed from the base stage by the substrate transport system and transported in the exposure apparatus. However, the adhesion and fixation of the cell substrate 103 to the substrate set plate 101 cannot be easily released, and the problem that it is very difficult to remove the cell substrate 103 from the substrate set plate 101 is not solved.

  Conventionally, for the purpose of reducing the amount of deposits formed on the circuit board by the outgas generated when the IC chip and the circuit board are connected using the anisotropic conductive film, the connection for holding the circuit board. A stage, a connection tool for bonding an IC chip to the surface of the circuit board held by the connection stage via an anisotropic conductive film piece, and the IC chip and the circuit board bonded by the connection tool. (1) a heater that heats and cures the anisotropic conductive film piece interposed between the two, and a gas injection nozzle that removes outgas in the vicinity of the anisotropic conductive film piece during heating by the heater ( For example, see Patent Document 4).

However, although the said patent document 4 is disclosing connecting an IC chip and a circuit board using an anisotropic conductive film, as above-mentioned, especially to the board | substrate setplate 101 of the cell board | substrate 103. FIG. However, it is difficult to remove the cell substrate 103 from the substrate set plate 101, and the problem that it is very difficult to remove the cell substrate 103 from the substrate set plate 101 is not solved.
Also, conventionally, in order to repair a defective IC chip mounted with FCA, a heat-resistant cylindrical jig is fixed to the ACF connection defective IC chip portion to be repaired with a double-sided tape, and then, in the cylindrical jig. After the solvent is supplied to the substrate, the repaired portion is locally heated to swell the ACF, thereby reducing the adhesive force between the defective IC chip and the substrate, removing the chip, and finally remounting a new chip ( For example, see Patent Document 5).

  However, although Patent Document 5 discloses repairing a defective IC chip mounted with FCA, as described above, in particular, the adhesion and fixation of the cell substrate 103 to the substrate set plate 101 cannot be easily released. This does not solve the problem that it is very difficult to remove the cell substrate 103 from the substrate set plate 101.

JP 05-275844 A Special Table 2002-536939 JP-A-10-116760 JP-A-10-116855 JP 09-191029 A

  Therefore, in view of the above problems, the present invention can easily release the adhesion and fixation of the cell substrate 103 to the substrate set plate 101, and can easily remove the cell substrate 103 from the substrate set plate 101. It is an object of the present invention to provide an adhesion release device and a method for manufacturing a liquid crystal display using the device.

In order to solve the above problems, the present invention provides a method for manufacturing a liquid crystal display in which a flexible substrate circuit on which a driving electronic circuit IC is mounted is attached to a cell substrate. A step of setting the substrate on the first substrate set plate with the substrate surface facing up, and bringing the cell substrate and the first substrate set plate into close contact with each other by air adsorption; and contacting the first substrate set plate with the first substrate set plate A process of attaching an anisotropic conductive film to the cell substrate and releasing air adsorption, and a cylinder located on the surface opposite to the surface of the first substrate set plate on which the cell substrate is set as a spring pin The cell substrate is raised or lowered so that the cell substrate protrudes into the jump pin through the hole of the first substrate set plate when the jump pin is raised. A step of releasing the adhesion between the cell substrate and the first substrate set plate, and the cell substrate is secondly placed with the surface of the cell substrate to which the adhesion is released and the anisotropic conductive film is attached facing up. A step of closely adhering the cell substrate and the second substrate set plate by air adsorption and placing the flexible substrate circuit on the anisotropic conductive film attached to the cell substrate, heat, Applying pressure to connect the electrodes of the cell substrate and the flexible substrate circuit to each other, releasing air adsorption, and adsorbing part of the surface of the cell substrate that is in close contact with the second substrate set plate portion And a step of lifting and releasing the adhesion between the cell substrate and the substrate set plate. A method for manufacturing a liquid crystal display is provided.

In a manufacturing method of a liquid crystal display in which a flexible substrate circuit on which a driving electronic circuit IC is mounted is attached to a cell substrate, the first substrate is placed with the surface of the cell substrate to which an anisotropic conductive film is to be attached facing upward. A step of adhering the cell substrate and the first substrate set plate by air adsorption and attaching an anisotropic conductive film to the cell substrate adhering to the first substrate set plate A step of releasing the air adsorption, a step of releasing the adhesion of the cell substrate and the substrate set plate by adsorbing and pulling up a part of the surface of the cell substrate that is in close contact with the first substrate set plate portion, The cell substrate is attached to the second substrate set plate with the surface of the cell substrate to which the adhesion is released and the anisotropic conductive film is attached facing up. And then adhering the cell substrate and the second substrate set plate by air adsorption, placing the flexible substrate circuit on the anisotropic conductive film affixed to the cell substrate, and applying heat and pressure Connecting the electrodes of the cell substrate and the flexible substrate circuit to each other and releasing air adsorption; and a cylinder located on a surface opposite to the surface of the second substrate set plate on which the cell substrate is set. The cell substrate is raised or lowered to the jump pin, and when the jump pin is raised, the cell substrate is caused to protrude to the jump pin through the hole of the second substrate set plate, and the cell substrate and the second substrate set plate And a step of releasing the adhesion of the liquid crystal display.

The jump pin is raised or lowered manually.
The jump pin is locked by the contraction of the spring when manually lowered, and is lifted by the spring force when the lock is released.
The jump pin is raised or lowered electrically.
Part of the surface of the adsorbed cell substrate is manually pulled up.
Part of the surface of the adsorbed cell substrate is pulled up electrically.

As described above, according to the present invention, after the air adsorption is released, the component adhesion release device is operated to easily release the adhesion and fixation of the cell substrate to the substrate set plate and reduce the thickness of the cell substrate. Even if it is difficult to sandwich the cell substrate with the operator's finger, the cell substrate on which the anisotropic conductive film is attached can be easily removed from the substrate set plate.
In addition, since the cell substrate is released from close contact with and fixed to the substrate set plate, the cell substrate can be easily lifted vertically from the substrate set plate, and the positioning pin and the positioning hole do not interfere with each other. The cell substrate can be easily removed.

  The workability when the operator takes out the cell substrate is improved, and the parts can be easily removed by the transfer robot or the like. As a result, the operation time in the line work can be shortened, and the productivity is improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a side cross-sectional view illustrating a schematic configuration for removing a cell substrate having an anisotropic conductive film attached thereto from a plate, which is a component adhesion release device according to the present invention. FIGS. 9A, 9B, and 9C show examples of a component close-contact release device that employs a manual type, spring type, and electric type spring-out mechanism.

As shown in FIG. 8A, compared to FIG. 8, the substrate set plate 101 is provided with a cylinder 105, and the cylinder 105 is located on the side opposite to the side on which the cell substrate 103 is set.
Further, the cylinder 105 is provided with a jump pin 106, and the jump pin 106 jumps out of the cylinder 105 through the hole 111 of the substrate set plate 101 when the cylinder 105 is raised or lowered in the cylinder 105, and is set. 103 is pushed and the adhesion and fixation of the substrate set plate 101 are released.

The pair of the cylinder 105 and the jump pin 106 is provided at an arbitrary position of the substrate set plate 101 facing the cell substrate 103, and the position of the pair of the cylinder 105 and the jump pin 106 can be released from the above-mentioned contact and fixation. There is no particular limitation as long as it is possible.
The jump pin 106 is provided with a knob 107, and the operator moves the jump pin 106 up and down via the knob 107.

Further, as shown in FIG. 5B, a spring 108 is provided in the lower part of the cylinder 105, and the spring 108 gives a spring force to the spring pin 106 when the spring pin 106 is raised.
The knob portion 107 is provided with a lock function. The lock function of the knob portion 107 locks the contraction of the spring 108 when the spring pin 106 is lowered by the knob portion 107.

Further, as shown in FIG. 5C, the jump pin 106 is provided with a vertical drive unit 109, and the vertical drive unit 109 raises or lowers the jump pin 106.
A control unit 110 is connected to the vertical drive unit 109, and the control unit 110 controls the vertical drive unit 109 to raise or lower the jump pin 106.
FIG. 2 is a side sectional view for explaining the operation of the manual component part releasing device in FIG. As shown in FIG. 6A, the positioning holes 104 are aligned with the positioning pins 102 as a target, the cell substrate 103 is set on the substrate set plate 101, and the cell substrate 103 is placed on the substrate set plate 101 by air suction (not shown). Adhere. In this case, the operator lowers the jump pin 106 in the cylinder 105 by the knob 107 and performs a process of attaching an anisotropic conductive film to the cell substrate 103 that is in close contact with the substrate set plate 101. Is called.

  As shown in this figure (b), when the anisotropic conductive film is attached to the cell substrate 103 that is in close contact, the air adsorption is released, and the operator pushes the jump pin 106 in the cylinder 105 with the knob 107. Then, the jump pin 106 is pushed out from the cylinder 105, the substrate set plate 101 is pushed, and the adhesion and fixation of the cell substrate 103 from the substrate set plate 101 are released.

In this state, since the cell substrate 103 is floating, the cell substrate 103 can be easily grasped and taken out easily.
As shown in FIG. 5C, when the cell substrate 103 is brought into close contact with the substrate set plate 101 and released from being fixed, the operator pushes the pin 106 that jumps from the cylinder 105 to the substrate set plate 101 at the knob 107. The inside of the cylinder 105 is lowered. In this state, the cell substrate 103 does not float, but the cell substrate 103 can be easily taken out because the contact and fixation are released.

  In this way, after the air adsorption is released, the flip-out mechanism of the present invention is manually operated by the operator, so that the adhesion and fixation of the cell substrate 103 to the substrate set plate 101 are easily released, and the thickness of the cell substrate 103 is increased. Even if it is thin and it is difficult to sandwich the cell substrate 103 with an operator's finger, the cell substrate 103 to which the anisotropic conductive film is attached can be easily detached from the substrate set plate 101.

Further, since the cell substrate 103 is released from the close contact with and fixed to the substrate set plate 101, the cell substrate 103 can be easily lifted vertically from the substrate set plate 101, and the positioning pins 102 and the positioning holes 104 may interfere with each other. Therefore, the cell substrate 103 can be prevented from being caught by the positioning pins 102, and the cell substrate 103 can be easily detached.
FIG. 3 is a side sectional view for explaining the operation of the component close contact releasing device in the spring type of FIG. As shown in FIG. 6A, the positioning holes 104 are aligned with the positioning pins 102 as a target, the cell substrate 103 is set on the substrate set plate 101, and the cell substrate 103 is placed on the substrate set plate 101 by air suction (not shown). Adhere. In this case, the spring 108 is contracted in a state where the popping pin 106 in the cylinder 105 is lowered by the knob portion 107, and the contraction of the spring 108 is locked by the knob portion 107, and the cell substrate 103 is in close contact with the substrate set plate 101. Is processed by attaching an anisotropic conductive film.

As shown in this figure (b), when the anisotropic conductive film is attached to the closely contacted cell substrate 103, the air adsorption is released, the lock function of the knob 107 is released, and the cylinder 105 is released by the spring 108. The inner jump pin 106 is raised, the jump pin 106 is ejected from the cylinder 105, the substrate set plate 101 is pushed, and the adhesion and fixation of the cell substrate 103 from the substrate set plate 101 are released.
In this state, since the cell substrate 103 is floating, the cell substrate 103 can be easily grasped and taken out easily.

  As shown in FIG. 3C, when the cell substrate 103 is brought into close contact with the substrate set plate 101 and is released from being fixed, the knob 105 causes the jumper pin 106 jumped from the cylinder 105 to the substrate set plate 101 to be connected to the cylinder 105. The inside is lowered, and the contraction of the spring 108 is locked at the end of the lowering of the spring pin 106. In this state, the cell substrate 103 does not float, but the cell substrate 103 can be easily taken out because the contact and fixation are released.

  In this way, after the air adsorption is released, the spring mechanism of the present invention is operated using the spring force, and the cell substrate 103 is easily released from the close contact with the substrate set plate 101 and fixed. Even if the substrate 103 is thin and it is difficult for the operator's fingers to sandwich the cell substrate 103, the cell substrate 103 with the anisotropic conductive film attached thereto can be easily removed from the substrate set plate 101.

  Further, as described above, since the cell substrate 103 is released from the close contact with and fixed to the substrate set plate 101, the cell substrate 103 can be easily lifted vertically from the substrate set plate 101, and the positioning pins 102 and the positioning holes 104 can be lifted. Can be prevented, and the cell substrate 103 can be prevented from being caught by the positioning pins 102, and the cell substrate 103 can be easily removed.

  FIG. 4 is a sectional side view for explaining the operation of the electric component close-contact release device in FIG. As shown in FIG. 6A, the positioning holes 104 are aligned with the positioning pins 102 as a target, the cell substrate 103 is set on the substrate set plate 101, and the cell substrate 103 is placed on the substrate set plate 101 by air suction (not shown). Adhere. In this case, the control unit 110 controls the vertical drive unit 109 to attach an anisotropic conductive film to the cell substrate 103 in close contact with the substrate set plate 101 in a state where the jump pin 106 in the cylinder 105 is lowered. Processing is performed.

  As shown in this figure (b), when the anisotropic conductive film is attached to the cell substrate 103 that is in close contact, the air adsorption is released, and the vertical drive unit 109 is controlled by the control unit 110 to jump in the cylinder 105. The ejection pin 106 is raised, the ejection pin 106 can be ejected from the cylinder 105, the substrate set plate 101 is struck, and the adhesion and fixation of the cell substrate 103 from the substrate set plate 101 are released.

In this state, since the cell substrate 103 is floating, the cell substrate 103 can be easily grasped and taken out easily.
As shown in FIG. 3C, when the cell substrate 103 is brought into close contact with the substrate set plate 101 and released from being fixed, the control unit 110 controls the vertical drive unit 109 and jumps from the cylinder 105 to the substrate set plate 101. The inside of the cylinder 105 is lowered by the spring pin 106. In this state, the cell substrate 103 does not float, but the cell substrate 103 can be easily taken out because the contact and fixation are released.

  In this way, after the air adsorption is released, the jumping mechanism of the present invention is operated electrically, and the cell substrate 103 is easily released from the close contact with the substrate set plate 101, and the thickness of the cell substrate 103 is increased. Even if it is thin and it is difficult to sandwich the cell substrate 103 with an operator's finger, the cell substrate 103 to which the anisotropic conductive film is attached can be easily detached from the substrate set plate 101.

  Further, as described above, since the cell substrate 103 is released from the close contact with and fixed to the substrate set plate 101, the cell substrate 103 can be easily lifted vertically from the substrate set plate 101, and the positioning pins 102 and the positioning holes 104 can be lifted. Can be prevented, and the cell substrate 103 can be prevented from being caught by the positioning pins 102, and the cell substrate 103 can be easily removed.

  Therefore, according to the jumping mechanism of the present invention, a manual type, a spring type or an electric type can be selected according to the work environment, and the workability when the operator takes out the cell substrate 103 is improved. As a result, parts can be easily removed. As a result, the operation time in line work can be shortened, leading to improved productivity.

FIG. 5 is a side cross-sectional view illustrating a schematic configuration for removing a cell substrate having an anisotropic conductive film attached thereto from a plate, which is a component adhesion release device according to a modification of FIG. Compared to FIG. 1, FIGS. 1A and 1B show an example of a component close-release device that employs a manual and electric air suction mechanism instead of the pair of the cylinder 105 and the jump pin 106. .
As shown in this figure (a), the component adhesion releasing device includes an air air adsorption unit 112 that employs a manual air adsorption mechanism, and the air adsorption unit 112 can be moved by an operator, and It has an operation unit that manually operates and stops the air adsorption function.

The air adsorbing unit 112 adsorbs and pulls up the cell substrate 103 that has been processed to attach the anisotropic conductive film, and releases the adsorbing and fixing from the substrate set plate 101. The place of the cell substrate 103 that adsorbs air is an arbitrary place except the place where the anisotropic conductive film is attached. The same applies hereinafter.
As shown in FIG. 4B, the component close contact releasing device employs a manual air suction mechanism and includes an air suction unit 112, an air suction operation unit 113, and a control unit 114.

The air adsorbing unit 112 rises or descends, air adsorbs the cell substrate 103 that has been processed to attach the anisotropic conductive film, and releases the adsorbing and fixing from the substrate set plate 101.
Further, the air adsorption unit 112 is provided with an air adsorption operation unit 113. The air adsorption operation unit 113 raises or lowers the air adsorption unit 112, and operates / stops the air adsorption of the air adsorption unit 112.

Further, a control unit 114 is connected to the air adsorption operation unit 113, and the control unit 114 controls the air adsorption operation unit 113.
FIG. 6 is a side sectional view for explaining the operation of the manual component part releasing device in FIG. 5 (a). As shown in FIG. 6A, the positioning holes 104 are aligned with the positioning pins 102 as a target, the cell substrate 103 is set on the substrate set plate 101, and the cell substrate 103 is placed on the substrate set plate 101 by air suction (not shown). Adhere. In this case, the operator moves the air adsorption unit 112 to a position away from the cell substrate 103 to stop the air adsorption, and attaches an anisotropic conductive film to the cell substrate 103 in close contact with the substrate set plate 101. Processing is performed.

As shown in this figure (b), when an anisotropic conductive film is attached to the cell substrate 103 that is in close contact, the operator moves the air adsorption unit 112 to the cell substrate 103, and air adsorption is performed on the air adsorption unit 112. The cell substrate 103 is operated to start the close contact and the fixed release.
As shown in FIG. 4C, the operator moves the air adsorption unit 112 adsorbed to the cell substrate 103 to lift the cell substrate 103 from the substrate set plate 101 and peel it off, so that the cell substrate 103 and the substrate set plate 101 are separated. Release contact and fixation.

In the above example, the cell substrate 103 is lifted obliquely, but may be lifted completely.
As shown in FIG. 4D, when the cell substrate 103 is brought into close contact with the substrate set plate 101 and the fixation is released, the operator lowers the air adsorbing portion 112 adsorbed on the cell substrate 103 to the substrate set plate 101 to make contact. , End the unlocking.
As shown in FIG. 4E, after the contact and fixation are released, the operator stops the air adsorption of the air adsorption unit 112 and moves the air adsorption unit 112 to a position away from the cell substrate 103.

  In this way, after the air adsorption between the cell substrate 103 and the substrate set plate 101 is released, the component adhesion release device of the present invention by air adsorption according to the present invention is operated manually by the operator, and the substrate set plate 101 of the cell substrate 103 is operated. The cell substrate 103 to which the anisotropic conductive film is attached is set as a substrate set even if the cell substrate 103 is thin and the cell substrate 103 is not easily sandwiched between the fingers. It can be easily removed from the plate 101.

  Further, as described above, since the cell substrate 103 is released from the close contact with and fixed to the substrate set plate 101, the cell substrate 103 can be easily lifted vertically from the substrate set plate 101, and the positioning pins 102 and the positioning holes 104 can be lifted. Can be prevented, and the cell substrate 103 can be prevented from being caught by the positioning pins 102, and the cell substrate 103 can be easily removed.

  FIG. 7 is a side sectional view for explaining the operation of the electric component close-contact release device in FIG. 5B. As shown in FIG. 6A, the positioning holes 104 are aligned with the positioning pins 102 as a target, the cell substrate 103 is set on the substrate set plate 101, and the cell substrate 103 is placed on the substrate set plate 101 by air suction (not shown). Adhere. In this case, the control unit 114 controls the air adsorption operation unit 113, raises the air adsorption unit 112, stops the air adsorption, and puts an anisotropic conductive film on the cell substrate 103 which is in close contact with the substrate set plate 101. A pasting process is performed.

As shown in this figure (b), when the anisotropic conductive film is attached to the cell substrate 103 that is in close contact, the control unit 114 controls the air adsorption operation unit 113 and the air adsorption unit 112 is lowered to the cell substrate 103. Then, the air suction unit 112 is operated to perform air suction, and the cell substrate 103 is started to be brought into close contact and unfixed.
As shown in FIG. 4C, the control unit 114 controls the air adsorption operation unit 113 to raise the air adsorption unit 112 adsorbed to the cell substrate 103, and lift the cell substrate 103 from the substrate set plate 101 to separate it. Then, the adhesion and fixation between the cell substrate 103 and the substrate set plate 101 are released.

In the above example, the cell substrate 103 is lifted obliquely, but may be lifted completely.
As shown in FIG. 4D, when the cell substrate 103 is brought into close contact with the substrate set plate 101 and released from being fixed, the control unit 114 controls the air adsorption operation unit 113 to adsorb the air adsorption unit 112 adsorbed on the cell substrate 103. Is lowered to the substrate set plate 101, and the close contact and fixation release are completed.

As shown in FIG. 4E, after the close contact and the fixed release, the control unit 114 controls the air adsorption operation unit 113 to stop the air adsorption of the air adsorption unit 112 and raise the air adsorption unit 112.
Thus, after the air adsorption between the cell substrate 103 and the substrate set plate 101 is released, the component adhesion release device of the present invention by air adsorption of the present invention is operated electrically, and the cell substrate 103 is attached to the substrate set plate 101. The cell substrate 103 to which the anisotropic conductive film is attached is attached to the substrate set plate 101 even if the adhesion and fixation are easily released, and the cell substrate 103 is thin and the operator's fingers do not easily sandwich the cell substrate 103. It can be easily removed from.

  Further, as described above, since the cell substrate 103 is released from the close contact with and fixed to the substrate set plate 101, the cell substrate 103 can be easily lifted vertically from the substrate set plate 101, and the positioning pins 102 and the positioning holes 104 can be lifted. Can be prevented, and the cell substrate 103 can be prevented from being caught by the positioning pins 102, and the cell substrate 103 can be easily removed.

Therefore, according to the component adhesion release device of the air adsorption method of the present invention, it is possible to select a manual type or an electric type according to the work environment, the workability when the operator takes out the cell substrate 103 is improved, Parts can be easily removed by a transfer robot, etc., and as a result, operation time in line work can be shortened, leading to improved productivity.
In particular, in the component adhesion release device of the method of FIGS. 1 and 6, the installation location is located on the opposite side with respect to the substrate set plate 101. It becomes possible to select.

  In the above description, the component adhesion releasing device for releasing the adhesion and fixation between the cell substrate 103 and the substrate set plate 101 in the case of attaching the anisotropic conductive film to the cell substrate 103 has been disclosed. The attached cell substrate is removed from the substrate set plate 101, and the cell substrate on which the anisotropic conductive film is adhered is further adhered to another plate so that the cell substrate can be electrically controlled. Place the flexible printed circuit (FPC) with a position on the anisotropic conductive film, apply heat and pressure to bond, harden the adhesive, and connect the electrode of the FPC and the electrode of the cell substrate. Even in the case of processing that connects directly, the parts that are in close contact with the plate by air adsorption, heat, and pressure during the processing are ejected by the present invention, air adsorption. Application of configuration components adhesion releasing device are possible.

That is, not only when the cell substrate 103 is adhered and fixed to the plate by air adsorption and processed, but also when the cell substrate 103 and the FPC that are adhered and fixed to the plate with heat and pressure during processing are removed. Application of the component adhesion release device of the present invention is possible.
In this case, a component adhesion release device of a jumping mechanism is adopted for the processing of attaching the anisotropic conductive film to the cell substrate 103, and heating and pressure bonding between the cell substrate and the FPC through the anisotropic conductive film A component adhesion release device of an air adsorption mechanism may be adopted for the processing for performing the connection. Further, on the contrary, the component adhesion release device of the air adsorption mechanism is adopted for the processing of attaching the anisotropic conductive film to the cell substrate 103, the heating of the FPC and the cell substrate through the anisotropic conductive film, A component contact release device of a spring-out mechanism may be employed for the processing that performs connection by pressure bonding. This is because it can be adapted to the work environment.

In the production of a liquid crystal display (LCD), it is possible to use the component adhesion release device of the present invention in a module process for attaching a drive circuit mounted on a printed circuit board to a liquid crystal panel.
In addition, it is possible to make it easy to remove parts by setting automobile parts etc. in the press machine and applying the part adhesion release device of the present invention when removing the parts that are in close contact with the press machine after pressing. become. That is, it is possible to use the component adhesion release device of the present invention in devices in all fields in which parts are set in the device, processed, and removed.

1 is a side cross-sectional view illustrating a schematic configuration for removing a cell substrate having an anisotropic conductive film attached thereto from a plate, which is a component adhesion release device according to the present invention. It is a sectional side view explaining operation | movement of the component close_contact | release apparatus in the manual type of Fig.1 (a). It is a sectional side view explaining operation | movement of the component close_contact | release cancellation | release apparatus in the spring type of FIG.1 (b). It is a figure explaining operation | movement of the component close_contact | release cancellation apparatus in the electric type of FIG.1 (c). FIG. 5 is a side cross-sectional view illustrating a schematic configuration for removing a cell substrate having an anisotropic conductive film attached thereto from a plate, which is a component adhesion release device according to a modification of FIG. 1. It is a sectional side view explaining operation | movement of the component close_contact | release cancellation apparatus in the manual type of Fig.5 (a). It is a sectional side view explaining operation | movement of the component adhesion release apparatus in the electric type of FIG.5 (b). It is a sectional side view explaining the operation | work which removes from the plate the cell board | substrate with which the anisotropic conductive film was affixed which is a premise of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 101 ... Substrate set plate 102 ... Positioning pin 103 ... Cell board 104 ... Positioning hole 105 ... Cylinder 106 ... Bounce pin 107 ... Picking part 108 ... Spring 109 ... Vertical drive part 110, 114 ... Control part 111 ... Hole 112 ... Air adsorption Part 113 ... Air adsorption operation part

Claims (7)

In a manufacturing method of a liquid crystal display that performs processing for attaching a flexible substrate circuit mounted with a driving electronic circuit IC to a cell substrate,
Setting the substrate on the first substrate set plate with the surface of the cell substrate to which the anisotropic conductive film is to be attached facing up, and closely contacting the cell substrate and the first substrate set plate by air adsorption;
Attaching an anisotropic conductive film to the cell substrate in close contact with the first substrate set plate, and releasing air adsorption;
A cylinder located on a surface opposite to the surface of the first substrate set plate on which the cell substrate is set is raised or lowered to a jump pin, and when the jump pin is lifted, a hole of the first substrate set plate is formed. The step of causing the cell substrate to protrude through the jump pin and releasing the adhesion between the cell substrate and the first substrate set plate;
The cell substrate is set on the second substrate set plate with the surface of the cell substrate to which adhesion is released and the anisotropic conductive film is attached facing upward, and the cell substrate and the second substrate set plate are adsorbed by air. A step of adhering
Placing the flexible substrate circuit on the anisotropic conductive film affixed to the cell substrate, applying heat and pressure to mutually connect the electrodes of the cell substrate and the flexible substrate circuit, and releasing air adsorption When,
A step of adsorbing and pulling up a part of the surface of the cell substrate that is in close contact with the second substrate set plate portion to release the close contact between the cell substrate and the substrate set plate. Production method. In a manufacturing method of a liquid crystal display that performs processing for attaching a flexible substrate circuit mounted with a driving electronic circuit IC to a cell substrate,
Setting the substrate on the first substrate set plate with the surface of the cell substrate to which the anisotropic conductive film is to be attached facing up, and closely contacting the cell substrate and the first substrate set plate by air adsorption;
Attaching an anisotropic conductive film to the cell substrate in close contact with the first substrate set plate, and releasing air adsorption;
Adsorbing and pulling up a part of the surface of the cell substrate that is in close contact with the first substrate set plate portion to release the adhesion between the cell substrate and the substrate set plate;
The cell substrate is set on the second substrate set plate with the surface of the cell substrate to which adhesion is released and the anisotropic conductive film is attached facing upward, and the cell substrate and the second substrate set plate are adsorbed by air. A step of adhering
Placing the flexible substrate circuit on the anisotropic conductive film affixed to the cell substrate, applying heat and pressure to mutually connect the electrodes of the cell substrate and the flexible substrate circuit, and releasing air adsorption When,
A cylinder located on a surface opposite to the surface of the second substrate set plate on which the cell substrate is set is raised or lowered to a jump pin, and when the jump pin is raised, a hole in the second substrate set plate is formed. And a step of causing the cell substrate to protrude from the jump pin to release contact between the cell substrate and the second substrate set plate. The method of manufacturing a liquid crystal display according to claim 1, wherein the jump pin is manually raised or lowered. 4. The method of manufacturing a liquid crystal display according to claim 3, wherein the spring pin is locked by contraction of a spring when manually lowered, and is lifted by a spring force when unlocked. The method of manufacturing a liquid crystal display according to claim 1, wherein the jump pin is lifted or lowered electrically. 3. The method of manufacturing a liquid crystal display according to claim 1, wherein a part of the surface of the adsorbed cell substrate is manually pulled up. 3. The method of manufacturing a liquid crystal display according to claim 1, wherein a part of the surface of the adsorbed cell substrate is pulled up electrically.

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