JP4172291B2 - Method for producing organosilicon compound - Google Patents
Method for producing organosilicon compound Download PDFInfo
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- JP4172291B2 JP4172291B2 JP2003052031A JP2003052031A JP4172291B2 JP 4172291 B2 JP4172291 B2 JP 4172291B2 JP 2003052031 A JP2003052031 A JP 2003052031A JP 2003052031 A JP2003052031 A JP 2003052031A JP 4172291 B2 JP4172291 B2 JP 4172291B2
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- hexafluorocarbinol
- organosilicon compound
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- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 150000003961 organosilicon compounds Chemical class 0.000 title claims description 6
- 150000001875 compounds Chemical class 0.000 claims description 19
- 238000006459 hydrosilylation reaction Methods 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 description 15
- 239000002994 raw material Substances 0.000 description 9
- -1 chlorosilyl group Chemical group 0.000 description 8
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 8
- 239000003054 catalyst Substances 0.000 description 7
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000007788 liquid Substances 0.000 description 5
- 239000005046 Chlorosilane Substances 0.000 description 4
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- KOPOQZFJUQMUML-UHFFFAOYSA-N chlorosilane Chemical compound Cl[SiH3] KOPOQZFJUQMUML-UHFFFAOYSA-N 0.000 description 4
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 4
- 229910052697 platinum Inorganic materials 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 125000000962 organic group Chemical group 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 3
- 239000005052 trichlorosilane Substances 0.000 description 3
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 3
- 238000005160 1H NMR spectroscopy Methods 0.000 description 2
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 2
- JGFZNNIVVJXRND-UHFFFAOYSA-N N,N-Diisopropylethylamine (DIPEA) Chemical compound CCN(C(C)C)C(C)C JGFZNNIVVJXRND-UHFFFAOYSA-N 0.000 description 2
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000004821 distillation Methods 0.000 description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 150000002484 inorganic compounds Chemical class 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 238000005580 one pot reaction Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 125000002572 propoxy group Chemical group [*]OC([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000005051 trimethylchlorosilane Substances 0.000 description 2
- GSNUFIFRDBKVIE-UHFFFAOYSA-N DMF Natural products CC1=CC=C(C)O1 GSNUFIFRDBKVIE-UHFFFAOYSA-N 0.000 description 1
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- DSVGQVZAZSZEEX-UHFFFAOYSA-N [C].[Pt] Chemical compound [C].[Pt] DSVGQVZAZSZEEX-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000005370 alkoxysilyl group Chemical group 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- FSIJKGMIQTVTNP-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical compound C[Si](C)(C)O[Si](C)(C=C)C=C FSIJKGMIQTVTNP-UHFFFAOYSA-N 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical group OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000010511 deprotection reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000004687 hexahydrates Chemical class 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 125000002524 organometallic group Chemical class 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000006884 silylation reaction Methods 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000012756 surface treatment agent Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 125000000026 trimethylsilyl group Chemical group [H]C([H])([H])[Si]([*])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Images
Description
【0001】
【発明の属する技術分野】
本発明は、ヘキサフルオロカルビノール基を有するトリアルコキシシランの製造方法に関する。
【0002】
【従来の技術】
フェノール基又はカテコール基を有するアルコキシシランとして、各種の化合物が知られている。これらのアルコキシシランから調製される有機ケイ素樹脂は、優れたアルカリ可溶性を発現し、樹脂添加剤、電子材料、各種反応基材として使われている〔特許文献1、特許文献2〕。しかし、これらの樹脂は、フェニル基を有するために、UV光を吸収し、透明性、耐候性、微細加工等の点で問題があった。
最近、フェニル基を有しない各種のアルカリ可溶性樹脂が開発され、カルボキシル基が導入された有機ケイ素樹脂が報告されている〔特許文献3〕。
しかし、これらカルボキシル基を有する有機ケイ素樹脂では、フェノール基に匹敵する優れたアルカリ可溶性を発現させることは困難であり、アルカリ可溶性の向上が望まれていた。そこで、フェノールと同程度のpKa(9.82)をもち、優れたアルカリ可溶性を発現する官能基として、ヘキサフルオロカルビノール基が注目されるようになった。
【0003】
これまでに、ヘキサフルオロカルビノール基を有機基で保護したトリクロロシランが知られている〔特許文献4〕。この化合物を得る反応は、有機基で保護したヘキサフルオロカルビノール基と炭素炭素不飽和基を有する化合物及びトリクロロシランを反応原料とするヒドロシリレーション反応である。この反応において、ヘキサフルオロカルビノール基を有機基で保護した原料を用いるのは、もう一方の反応原料であるクロロシランのクロロシリル基とヘキサフルオロカルビノール基が反応してしまうのを防ぐためである。
トリクロロシランを反応原料とする上記の製造方法では、ヒドロシリレーション反応後、ヘキサフルオロカルビノール基の脱保護工程を実施することによりはじめてヘキサフルオロカルビノール基を有する化合物が得られ、製造工程が複雑になるという問題点があった。
【0004】
【特許文献1】
特開2002−179795号公報
【特許文献2】
、特開2002−338583号公報
【特許文献3】
特開2001−005185号公報
【特許文献4】
特開2002−55456号公報
【0005】
【発明が解決しようとする課題】
本発明は、ヘキサフルオロカルビノール基を有する有機ケイ素化合物を、複雑な製造工程を経ることなく、工業的規模で容易に製造することができる方法を提供することを課題とするものである。
【0006】
【課題を解決するための手段】
【0007】
本発明者らは、鋭意検討した結果、トリアルコキシシランを原料に用いた場合、アルコキシシリル基とヘキサフルオロカルビノール基は反応しないため、一段階反応でヘキサフルオロカルビノール基を有するトリアルコキシシランを製造することができることを見出し、本発明を完成した。
即ち、本発明は、下記化合物(1)とトリアルコキシシランとをハイドロシリレーション反応させることにより、下記化合物(2)を得ることを特徴とする有機ケイ素化合物の製造方法である。
【0008】
【化3】
【0009】
【化4】
(式中、Rは炭素数1から3のアルコキシ基である)
【0010】
以下、本発明について詳述する。
本発明により得られる有機ケイ素化合物(以下、HFC有機ケイ素化合物)において、Rは炭素数1から3のアルコキシ基である。Rの好ましい具体例として、メトキシ基、エトキシ基及びプロピルオキシ基があり、プロピルオキシ基は直鎖状でも分岐状でも差し支えない。その中でも、原料が得易く、合成が容易なことから、一般にRについてはエトキシ基が好ましい。
HFC有機ケイ素化合物の好ましい具体例は、以下の構造式で示される化合物(3)である。
【0011】
【化5】
【0012】
HFC有機ケイ素化合物は、上記化合物(1)とトリアルコキシシランとをヒドロシリレーション反応させることにより得られる。
これらの原料化合物の好ましい反応仕込み比は、トリアルコキシシランが上記化合物(1)に対して10〜20モル%過剰となる比である。
上記化合物(3)を製造する場合、化合物(1)をトリエトキシシランと反応させる。この反応は、通常、触媒の存在下で行われる。好ましい触媒としては、コバルト、ニッケル、ルテニウム、ロジウム、パラジウム、イリジウム、白金等の第8属から第10属金属の単体、有機金属錯体、金属塩、金属酸化物等があり、通常、白金系の触媒が使用される。
好ましい白金系触媒としては、塩化白金酸六水和物(H2PtCl6・6H2O)、cis-PtCl2(PhCN)2、白金カーボン、ジビニルテトラメチルジシロキサンが配位した白金錯体(PtDVTMDS)等が例示される。なお、Phはフェニル基を表わす。触媒の好ましい添加量は、化合物(1)の量に対して、0.1〜1,000ppmである。
また、反応温度は、反応系外部からの加熱操作およびトリエトキシシランの供給速度に依存するため、一概に決められないが、通常、反応温度を室温〜110℃の範囲に保持することで、ヒドロシリレーション反応を円滑に進行させることができる。反応終了後、溶媒および揮発成分を減圧下留去し、減圧蒸留により精留することにより化合物(3)を得る。
HFC有機ケイ素化合物は、クロロシラン類を用いて容易に官能基を導入することができ、有機合成中間体としても有用である。好ましいクロロシラン類として、トリメチルクロロシラン等がある。クロロシラン類との反応に用いる好ましい塩基として、トリエチルアミン、ジイソプロピルエチルアミン、ピリジン、水酸化カリウム及び水酸化ナトリウム等がある。好ましい溶媒として、ジエチルエーテル、ジイソプロピルエーテル、THF等のエーテル類、ジクロロメタン、クロロホルム、ピリジン、DMF及びDMSO等の極性溶媒がある。
【0013】
【実施例】
以下、本発明を参考例および実施例によって具体的に説明する。
[実施例1]
攪拌機、温度計及び冷却管を備えた反応器を乾燥窒素雰囲気下にして、化合物(1)50.0g(240mmol)、トリエトキシシラン47.3g(288mmol)を仕込み、系内を攪拌させながらオイルバスで加熱した。内温度が80℃に達したところで、白金触媒であるPtDVTMDSのキシレン溶液(124μl,0.012mmol)を加えた。触媒滴下後、7時間、80℃で攪拌放置した。その後、減圧下、揮発成分を留去し、減圧蒸留にて目的化合物を精製した(68.3g, 76%)。
この液体について270MHzの1H-NMRの測定を行ったところ、第1図のスペクトルを得た。δ値とその帰属は第1表のとおりであった。これにより得られた液体は、ヘキサフルオロカルビノール基を有するトリアルコキシシラン(3)であることが確認できた。
【0014】
【化6】
【0015】
【表1】
【0016】
【化7】
【0017】
参考例
攪拌機、温度計及び冷却管を備えた反応器を乾燥窒素雰囲気下にして、化合物(3)41.3g(111mmol)、トリメチルクロロシラン13.2g(122mmol )、塩化メチレン100gを仕込み、系内を攪拌させながらトリエチルアミン12.3g(122mmol)をゆっくり滴下した。室温で24時間攪拌させ、生じた塩をろ別し、溶媒を減圧下留去し、無色透明の液体を得た(44.4g, 90%)。
この液体について270MHzの1H-NMRの測定を行ったところ、δ値とその帰属は第2表のとおりであった。これにより得られた液体は、トリメチルシリル基で保護されたヘキサフルオロカルビノール基を有するトリアルコキシシラン(4)であることが確認できた。
【0018】
【化8】
【0019】
【表2】
【0020】
【化9】
【0021】
【発明の効果】
本発明によって、ヘキサフルオロカルビノール基を有するトリアルコキシシランを一段階反応で得ることができる。
本発明の製造方法は、ヘキサフルオロカルビノール基を有するトリアルコキシシランの工業的製法として有用である。
HFC有機ケイ素化合物は、ケイ素原子に結合した加水分解性のトリアルコキシ基が存在するため、他の有機ケイ素化合物(ポリマーを含む)との反応によりシロキサン結合を形成したり、無機化合物中のシラノール基とカップリング反応させることができる。また、3官能性アルコキシシランであるため、架橋反応を利用することにより、シリコーンレジン、シルセスキオキサンを構築することができる。一方、ヘキサフルオロカルビノール基は優れたアルカリ水溶性基として機能する。
HFC有機ケイ素化合物は、有機合成の中間原料、ポリマー樹脂の合成原料、ポリマーの改質剤、無機化合物の表面処理剤、各種材料カップリング剤として有用である。
【0022】
【図面の簡単な説明】
【図1】図1は実施例1で得られた生成物の1H-NMRスペクトルである。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for producing trialkoxysilane having a hexafluorocarbinol group.
[0002]
[Prior art]
Various compounds are known as alkoxysilanes having a phenol group or a catechol group. Organosilicon resins prepared from these alkoxysilanes exhibit excellent alkali solubility and are used as resin additives, electronic materials, and various reaction substrates [Patent Documents 1 and 2]. However, since these resins have a phenyl group, they absorb UV light and have problems in terms of transparency, weather resistance, fine processing, and the like.
Recently, various alkali-soluble resins having no phenyl group have been developed, and an organosilicon resin having a carboxyl group introduced has been reported [Patent Document 3].
However, these organosilicon resins having a carboxyl group have difficulty in expressing excellent alkali solubility comparable to that of a phenol group, and improvement in alkali solubility has been desired. Therefore, a hexafluorocarbinol group has been attracting attention as a functional group having a pKa (9.82) comparable to that of phenol and exhibiting excellent alkali solubility.
[0003]
So far, trichlorosilane in which a hexafluorocarbinol group is protected with an organic group is known [Patent Document 4]. The reaction to obtain this compound is a hydrosilylation reaction using a compound having a hexafluorocarbinol group protected with an organic group and a carbon-carbon unsaturated group and trichlorosilane as reaction raw materials. In this reaction, the raw material in which the hexafluorocarbinol group is protected with an organic group is used in order to prevent the chlorosilyl group and hexafluorocarbinol group of chlorosilane, which is the other reaction raw material, from reacting.
In the above production method using trichlorosilane as a reaction raw material, a compound having a hexafluorocarbinol group can be obtained only after carrying out a deprotection step of the hexafluorocarbinol group after the hydrosilylation reaction, and the production process is complicated. There was a problem of becoming.
[0004]
[Patent Document 1]
JP 2002-179795 A [Patent Document 2]
JP-A-2002-338583 [Patent Document 3]
JP 2001-005185 A [Patent Document 4]
Japanese Patent Laid-Open No. 2002-55456
[Problems to be solved by the invention]
An object of the present invention is to provide a method capable of easily producing an organosilicon compound having a hexafluorocarbinol group on an industrial scale without going through a complicated production process.
[0006]
[Means for Solving the Problems]
[0007]
As a result of intensive studies, the present inventors have determined that trialkoxysilane having a hexafluorocarbinol group in a one-step reaction because an alkoxysilyl group and a hexafluorocarbinol group do not react when trialkoxysilane is used as a raw material. The present invention has been completed by finding that it can be produced.
That is, this invention is a manufacturing method of the organosilicon compound characterized by obtaining the following compound (2) by hydrosilylating the following compound (1) and trialkoxysilane.
[0008]
[Chemical 3]
[0009]
[Formula 4]
(Wherein R is an alkoxy group having 1 to 3 carbon atoms)
[0010]
Hereinafter, the present invention will be described in detail.
In the organosilicon compound obtained by the present invention (hereinafter referred to as HFC organosilicon compound), R is an alkoxy group having 1 to 3 carbon atoms. Preferable specific examples of R include a methoxy group, an ethoxy group, and a propyloxy group, and the propyloxy group may be linear or branched. Of these, ethoxy groups are generally preferred for R because raw materials are easy to obtain and synthesis is easy.
A preferred specific example of the HFC organosilicon compound is the compound (3) represented by the following structural formula.
[0011]
[Chemical formula 5]
[0012]
The HFC organosilicon compound can be obtained by subjecting the compound (1) and trialkoxysilane to a hydrosilylation reaction.
A preferable reaction charge ratio of these raw material compounds is a ratio at which trialkoxysilane is in excess of 10 to 20 mol% with respect to the compound (1).
When manufacturing the said compound (3), a compound (1) is made to react with a triethoxysilane. This reaction is usually performed in the presence of a catalyst. Preferred catalysts include cobalt, nickel, ruthenium, rhodium, palladium, iridium, platinum and other group 8-10 group metals, organometallic complexes, metal salts, metal oxides, etc. A catalyst is used.
Preferred platinum-based catalysts include chloroplatinic acid hexahydrate (H 2 PtCl 6 · 6H 2 O), cis-PtCl 2 (PhCN) 2 , platinum carbon, and a platinum complex coordinated with divinyltetramethyldisiloxane (PtDVTMDS). ) Etc. are exemplified. Ph represents a phenyl group. A preferable addition amount of the catalyst is 0.1 to 1,000 ppm with respect to the amount of the compound (1).
In addition, the reaction temperature depends on the heating operation from the outside of the reaction system and the supply rate of triethoxysilane, and thus cannot be determined in general. Usually, the reaction temperature is maintained in the range of room temperature to 110 ° C. The silylation reaction can proceed smoothly. After completion of the reaction, the solvent and volatile components are distilled off under reduced pressure, and rectification is performed by distillation under reduced pressure to obtain compound (3).
The HFC organosilicon compound can be easily introduced with a functional group using chlorosilanes and is also useful as an organic synthesis intermediate. Preferred chlorosilanes include trimethylchlorosilane. Preferred bases used for the reaction with chlorosilanes include triethylamine, diisopropylethylamine, pyridine, potassium hydroxide and sodium hydroxide. Preferred solvents include ethers such as diethyl ether, diisopropyl ether and THF, and polar solvents such as dichloromethane, chloroform, pyridine, DMF and DMSO.
[0013]
【Example】
Hereinafter, the present invention will be specifically described with reference examples and examples.
[Example 1]
A reactor equipped with a stirrer, a thermometer and a cooling tube is placed in a dry nitrogen atmosphere, charged with 50.0 g (240 mmol) of compound (1) and 47.3 g (288 mmol) of triethoxysilane, and stirred in the oil bath while stirring the system. Heated. When the internal temperature reached 80 ° C, a platinum catalyst PtDVTMDS xylene solution (124 µl, 0.012 mmol) was added. After dropping the catalyst, the mixture was left stirring at 80 ° C. for 7 hours. Thereafter, the volatile component was distilled off under reduced pressure, and the target compound was purified by reduced pressure distillation (68.3 g, 76%).
When this liquid was subjected to 1 H-NMR measurement at 270 MHz, the spectrum shown in FIG. 1 was obtained. The δ value and its attribution are shown in Table 1. It was confirmed that the liquid thus obtained was trialkoxysilane (3) having a hexafluorocarbinol group.
[0014]
[Chemical 6]
[0015]
[Table 1]
[0016]
[Chemical 7]
[0017]
Reference Example A reactor equipped with a stirrer, thermometer and condenser was placed in a dry nitrogen atmosphere, charged with 41.3 g (111 mmol) of compound (3), 13.2 g (122 mmol) of trimethylchlorosilane, and 100 g of methylene chloride, and the system was stirred. Then, 12.3 g (122 mmol) of triethylamine was slowly added dropwise. The mixture was stirred at room temperature for 24 hours, the resulting salt was filtered off, and the solvent was distilled off under reduced pressure to obtain a colorless transparent liquid (44.4 g, 90%).
When this liquid was subjected to 1 H-NMR measurement at 270 MHz, the δ value and its attribution were as shown in Table 2. The liquid thus obtained was confirmed to be trialkoxysilane (4) having a hexafluorocarbinol group protected with a trimethylsilyl group.
[0018]
[Chemical 8]
[0019]
[Table 2]
[0020]
[Chemical 9]
[0021]
【The invention's effect】
According to the present invention, trialkoxysilane having a hexafluorocarbinol group can be obtained by a one-step reaction.
The production method of the present invention is useful as an industrial production method of trialkoxysilane having a hexafluorocarbinol group.
Since HFC organosilicon compounds have hydrolyzable trialkoxy groups bonded to silicon atoms, they form siloxane bonds by reaction with other organosilicon compounds (including polymers), or silanol groups in inorganic compounds. And a coupling reaction. Moreover, since it is a trifunctional alkoxysilane, a silicone resin and silsesquioxane can be constructed by utilizing a crosslinking reaction. On the other hand, the hexafluorocarbinol group functions as an excellent alkaline water-soluble group.
HFC organosilicon compounds are useful as intermediate raw materials for organic synthesis, synthetic raw materials for polymer resins, polymer modifiers, surface treatment agents for inorganic compounds, and various material coupling agents.
[0022]
[Brief description of the drawings]
1 is a 1 H-NMR spectrum of the product obtained in Example 1. FIG.
Claims (1)
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| JP6268111B2 (en) * | 2015-02-06 | 2018-01-24 | 信越化学工業株式会社 | Fluorine-containing silicon compound, method for producing the same, and method for producing fluorine-containing silicon resin |
| JP7189453B2 (en) | 2018-02-28 | 2022-12-14 | セントラル硝子株式会社 | Silicon compound containing hexafluoroisopropanol group, and method for producing the same |
| WO2019167771A1 (en) | 2018-02-28 | 2019-09-06 | セントラル硝子株式会社 | Silicon-containing layer-forming composition, and method for producing pattern-equipped substrate which uses same |
| CN116802186A (en) | 2021-02-05 | 2023-09-22 | 中央硝子株式会社 | Silicon compound containing hexafluoroisopropanol group, method for producing silicon compound, polysiloxane, and method for producing polysiloxane |
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