JP4177626B2 - Electroplating method of wire, electroplating apparatus, and electroplated wire - Google Patents
Electroplating method of wire, electroplating apparatus, and electroplated wire Download PDFInfo
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- JP4177626B2 JP4177626B2 JP2002275386A JP2002275386A JP4177626B2 JP 4177626 B2 JP4177626 B2 JP 4177626B2 JP 2002275386 A JP2002275386 A JP 2002275386A JP 2002275386 A JP2002275386 A JP 2002275386A JP 4177626 B2 JP4177626 B2 JP 4177626B2
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- 238000009713 electroplating Methods 0.000 title claims description 29
- 238000000034 method Methods 0.000 title claims description 29
- 238000007747 plating Methods 0.000 claims description 56
- 239000000463 material Substances 0.000 claims description 19
- 229910052782 aluminium Inorganic materials 0.000 description 16
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 16
- 238000007743 anodising Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000002048 anodisation reaction Methods 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 238000010828 elution Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1637—Composition of the substrate metallic substrate
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
- C25D5/42—Pretreatment of metallic surfaces to be electroplated of light metals
- C25D5/44—Aluminium
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
- C25F1/02—Pickling; Descaling
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は線材に各種の金属を電気メッキする方法及び装置及び電気めっき線材に関し、特にアルミニウム線の軽量である特長を生かし、更に通電性耐熱性、耐食性などの諸機能を向上せしめて電気機器分野、自動車関連の電気部品関係に使用及び活用せしめようとするものである。
【０００２】
【従来の技術】
アルミニウムは銅、鉄などに比較して、その比重が１／３程度、チタニウムの１／２程度でまさに軽量化金属の代表的存在であり、軟らかく加工性がよくしかも通電性もよく、現在電送関係や軽量化機器類に巾広く使用されている。しかしアルミニウム線材は、その最大の欠点として、他の金属の電気メッキが線などに連続して行うことが出来ず、さらにその機能の向上が出来ないことにある。この理由は、アルミニウムが非常に酸化し易い金属で、酸素に触れると、直ちに酸化してアルミナを生成し、この酸化膜が通電性を損い電気メッキを困難にしているためである。特に線状物を走行せしめた状態で処理する場合、処理時間が数分〜数秒と短時間であり、強固なアルミナを完全に除去することは極めて困難である。このためアルミニウム線への連続した電気メッキ法は行われていない。
【０００３】
【発明が解決しようとする課題】
本発明は上記事情に鑑みてなされたもので、その目的とするところは、アルミニウム等の非常に酸化し易い線材であっても、連続して電気めっきすることができる方法及び装置及び電気めっき線材を提供することにある。
【０００４】
【課題を解決するための手段】
上述のように、アルミニウム線の表面には強固な酸化アルミニウム（アルミナ）が生成するが、これを除去するには、強酸で長時間（＋数分以上）処理するかまたは大電流で陽極処理する必要がある。通常線の連続電気メッキ法では、その前処理時間は、数秒〜数分で、通電電流も数Ａ／ｄｍ2 〜数＋Ａ／ｄｍ2と制限されている。
【０００５】
そこで本発明は、大電流（数１０Ａ／ｄｍ2 〜数１００Ａ／ｄｍ2 ）を流して線をプラス側に帯電させ、このプラス側に帯電されたゾーンで酸化アルミニウムを完全に除去し（陽極処理）、新鮮な表面肌となった線をそのまま線をマイナスに帯電するゾーンに送りこみ、このゾーンで電気メッキを施す。このような操作を繰り返すことによりめっき被膜を形成するものである。
【０００６】
すなわち、本発明は以下の構成を備えている。
【０００７】
（１） 同一槽内にて、めっき液内を走行する被めっき線材を陽極として被めっき線材表面の酸化物を除去する工程と、被めっき線材を陰極として電気めっきする工程を繰り返して、被めっき線材表面に電気めっき被膜を形成する線材の電気めっき方法であって、
最初の酸化物を除去する工程は、陰極電極体に対応する個所を、被めっき線材が走行して、被めっき線材が陽極となる時に行われ、２回目以降の酸化物を除去する工程は、陰極電極体に対応する個所に筒状の陽極補助電極体を設け、この陽極補助電極体内を被めっき線材が走行する時に行われる線材の電気めっき方法。
この方法により陽極処理で酸化被膜を除去した後めっき被膜を形成する操作を繰り返すので、酸化被膜を形成しやすい線材に対して連続的にめっきすることができる。
特に、陽極補助電極体を用いることにより、これが犠牲陽極となり、陽極処理時にめっきが溶離するのを防止することができる。即ち、陽極処理時に、被メッキ線材の表面から、めっき被膜が再び溶液の中に溶け出すので、その作用を極力防止し少くするため陽極補助電極体を陽極として用いる。具体的には被めっき線材と陽極補助電極体とを接触せしめて設置し、溶出をこの陽極補助電極体が受け持つ。陽極補助電極体の形状を筒状、特に円筒状としてその中を線が通過するような構造とすれば線の表面積と円筒状との表面積の比率が非常に大きくなり、それだけ線からの溶出が少なくなり線へのメッキが完全なものとなる。
【０００８】
この方法では、めっき液に超音波振動を与えることができる。特に、高電流密度でめっきした場合、ポーラスなめっき被膜となりやすいが、超音波振動を与えることによりこれを防ぐ。
【０００９】
めっき液は、走行する被めっき線材との相対流速が３０〜１００ｍ／分であるであることが好ましい。
【００１０】
この流速とすることにより特に高電流密度でめっきした場合に、ポーラスなめっき被膜となるのを防ぐ。
【００１１】
被めっき線材は、アルミニウム線とすることができる。
従来、アルミニウム線材は連続めっきできなかったが、この方法によりアルミニウム線の軽量である特長を生かし、更に通電性耐熱性、耐食性などの諸機能を向上せしめて電気機器分野、自動車関連の電気部品関係に使用及び活用を図ることができる。
【００１２】
被めっき線材は、予めその表面に浸漬法により、電気めっき被膜とは異なる材質のめっき被膜を形成することができる。
浸漬法を併用することにより、電気めっき被膜とは異なる材質のめっき被膜が形成されるので、酸化被膜も形成されにくく、本発明方法を容易におこなうことができる。
【００１３】
酸化物を除去する工程は、電流密度５０Ａ／ｄｍ２以上で行われるのがよい。
高電流密度とすることにより、陽極処理により被めっき線材表面の酸化被膜を除去することができる。
【００１４】
酸化物を除去する工程は、電流密度５０Ａ／ｄｍ２以上、３００Ａ／ｄｍ２以下で行われるのがよい。
電流密度が高すぎると、めっき被膜がポーラスとなる懸念があるが、この電流密度範囲とすることにより、陽極処理とめっき被膜の形成とを調和をもっておこなうことができる。
【００１５】
酸化物を除去する工程は、陰極電極体に対応する個所を、被めっき線材が走行して、被めっき線材が陽極となる時に行うことができる。
被めっき線材を陽極とすることにより酸化物を電気的に除去することができる。
【００１７】
（２） 陽極補助電極体は、被めっき線材に対して面積比が２５倍以上である（１）に記載の方法。
この面積比とすることにより、めっき被膜の流出防止が特に有効に機能する。
（３） 陽極補助電極体は、被めっき線材表面に形成される電気めっき被膜と実質同じ材質である（１）または（２）に記載の方法。
同じ材質とすることにより、陽極補助電極体からイオンがめっき液中に流出し、被めっき線材表面の電気めっき被膜からめっき被膜が流出するのを防止することができる。そして、被めっき線材表面に析出することによって失われる溶液中の金属イオンを補充することができる。
【００１９】
陽極補助電極体は、被めっき線材に対して面積比が２５倍以上、１５０倍以下とするのがよい。
陽極補助電極体の面積比を大きくするとメッキ槽が大きくしなければならないので、両者の兼ね合いで上限を設定するのがよい。
【００２０】
本発明で用いる陽極補助電極体は、上記方法における被めっき線材表面の酸化物を除去する工程で使用され、この中を被めっき線材が走行する筒型形状をなし、材質が被めっき線材と実質同じで、陽極となる。
この陽極補助電極体を用いることにより、陽極処理時におけるメッキ被膜の流出を防ぎ本発明方法の実効化をはかることができる。
【００２１】
陽極補助電極体は、その中を走行する被めっき線材に対して面積比が２５倍以上であるのがよい。
この面積比とすることにより、めっき被膜の流出防止が特に有効に機能する。
【００２２】
陽極補助電極体は、その中を走行する被めっき線材に対して面積比が２５倍以上、１５０倍以下であるのがよい。
陽極補助電極体の面積比を大きくするとメッキ槽が大きくしなければならないので、両者の兼ね合いで上限を設定した。
【００２３】
本発明に用いる電気めっき装置は、めっき液を充填し、被めっき線材が走行するめっき槽と、被めっき線材の走行経路に対応して交互に配置された陽極電極体と陰極電極体とを備え、陰極電極体と被めっき線材との間で被めっき線材の陽極処理をおこない、陽極電極体と被めっき線材との間で被めっき線材表面にめっき被膜を形成するようにした。
この装置により、本発明方法を有効におこなうことができる。
【００２４】
電気めっき装置は、陽極処理をおこなう領域に、その中を被めっき線材が走行する陽極としての筒状陽極補助電極体を配置している。
【００２５】
この陽極補助電極体を用いることにより、陽極処理時におけるメッキ被膜の流出を防ぎ本発明装置の実効化をはかることができる。
電気めっき装置は、陽極補助電極体の材質が被めっき線材と実質同じである。
電気めっき装置は、陽極補助電極体は、被めっき線材に対して面積比が２５倍以上である。
この面積比とすることにより、めっき被膜の流出防止が特に有効に機能する。
【００２６】
電気めっき装置は、陽極補助電極体は、被めっき線材に対して面積比が２５倍以上、１５０倍以下である。
陽極補助電極体の面積比を大きくするとメッキ槽が大きくしなければならないので、両者の兼ね合いで上限を設定した。
【００２７】
電気めっき装置は、陽極電極体が板状又は筒状の形状である。
陽極電極体の形状は板状でも筒状でも構わない。
【００２８】
電気めっき装置は、陰極電極体は、板状又はこの中を被めっき体が走行する筒状の形状である。
陰極電極体の形状は板状でも筒状でも構わない。
【００２９】
電気めっき線材は、上記方法で作られる。
上記方法で作られるアルミニウム線材は、表面に電気めっき被膜を形成している。
【００３０】
【発明の実施の形態】
図１は本発明のめっき装置の一例を示す。この装置は、めっき液を入れたメッキ槽１０内に被めっき線材Ａ（例えばアルミニウム線材）の走行経路を形成し、この走行路に沿って平行に板状の陽極電極体２０と陰極電極体３０とを一定間隔で交互に配置している。被めっき線材Ａの走行経路には陰極電極体３０に対応した個所に陽極補助電極体４０が配置されている。陽極補助電極体３０は、図２に拡大して示すように、円筒状をなし、その内部を被めっき線材が走行するもので、被めっき線材と陽極補助電極体４０を接点棒５０により電気的に接続することにより、陽極補助電極体が陽極として機能するようになっている。また、この陽極補助電極体の周面には多数の液流通孔４２が形成され、めっき液がこの孔を通って流通するようになっている。
【００３１】
しかして、このめっき装置のめっき液内に被めっき線材を走行させる。児の時、被めっき線材がプラスに帯電した時に陽極処理により被めっき線材表面の酸化物が除去され、マイナスに帯電した時にメッキが行われる。すなわち、まず、陰極電極体と被めっき線材（陽極として機能する）との間に高電流密度の電流（１００Ａ／ｄｍ２以上、５００Ａ／ｄｍ２以下）が流れて、被めっき線材表面に形成された酸化物を陽極処理して除去する。次いで、陽極電極体と被めっき線材（陰極として機能する）との間に高電流密度の電流が流れて、大電流でめっきされる。そして、このような処理を順次繰り返すことにより、所望の厚さのめっき被膜が形成される。また、陽極補助電極体は、陽極処理時にめっきの溶出を防止するためのものであるが、その機能を特に発揮させるために材質を被めっき線材表面に形成される電気めっき被膜と実質同じとし、被めっき線材に対して面積比が２５倍以上、１５０倍以下とするのがよい。また、高電流密度でめっきしてもメッキがポーラス状にならないようにするために、超音波振動を与え、走行する被めっき線材に対するめっき液の相対流速を３０〜１００ｍ／分とするのがよい。
【００３２】
なお、本発明では、図１に示すように、被めっき線材への給電は無接触で大電流を流して入る。従ってスパークの恐れは全くない。
また、メッキ直前にイオン化傾向を利用したアルミ表面に亜鉛や錫などの金属体を予め析出せしめてメッキ前の表面の活性化を計りその後、本発明方法をおこなうことも可能である。
また、実操業で使用するめっき装置の一例を挙げれば、めっき槽は長さ１ｍ程度のものを数個列設し、陽極補助電極体は長さ１００ｍｍ程度、直径５０ｍｍくらいのものを所定個所に複数個並べ、陽極板、陰極板は長さ１００ｍｍ程度で、２０ｍｍの間隔を空けて交互に配置される。
【００３３】
なお、上記実施の態様では、陽極電極体２０及び陰極電極体３０は板状としたが、板状に限らず、例えば図３に示すように、円筒状としてもよい。
【００３４】
【実施例】
ミニチュアープラント（構造は図１に示すもの）により１．０ｍφのアルミニウム線に銅メッキを実施した。電流密度は１０Ａ／ｄｍ2 〜１００Ａ／ｄｍ2、線速は１５〜５０ｍ／分、めっき液の相対流速３０〜１００ｍ／分、めっき液は通常の銅めっきをおこなった。うめっき液、アルミニウム線に対する陽極補助電極体の面積比は２５倍とした。その結果を表１に示す。また、比較のために、通常の接触通電方式による電気めっきを行なった。その結果、表１に併記する。
【００３５】
【表１】
【００３６】
なお、本発明は線材に適用されるものであるが、帯状のものなど連続的にめっきされる工程、装置、及び金属材にも有効に適用される。また、めっきすべき被膜の厚さ、装置の構成などによっては、めっき液内を走行する被めっき線材を陽極として被めっき線材表面の酸化物を除去する工程と、被めっき線材を陰極として電気めっきする工程を一度だけ行なうことによって所定のメッキ被膜を形成することも可能である。さらに、被めっき線材を陰極として電気めっきする工程を行なってから、めっき液内を走行する被めっき線材を陽極として被めっき線材表面の酸化物を除去する工程を行ない、これを繰り返すことによっても、本発明の実施が可能である。さらに、最終工程は、めっき液内を走行する被めっき線材を陽極として被めっき線材表面の酸化物を除去する工程と、被めっき線材を陰極として電気めっきする工程とのいずれでもよい。
【００３７】
【発明の効果】
以上説明したように、本発明によれば、アルミニウム等の非常に酸化し易い線材であっても、連続して電気めっきすることができる。
【図面の簡単な説明】
【図１】本発明のめっき装置の一例を示す説明図。
【図２】図１の装置の陽極補助電極体の拡大図。
【図３】本発明のめっき装置の他の陽極電極体、陰極電極体の説明図。
【符号の説明】
１０・・・メッキ槽
２０・・・陽極電極体
３０・・・陰極電極体
４０・・・陽極補助電極体
４２・・・液流通孔
５０・・・接点棒
Ａ・・・被めっき線材[0001]
BACKGROUND OF THE INVENTION
TECHNICAL FIELD The present invention relates to a method and apparatus for electroplating various metals on a wire and an electroplated wire, and in particular, takes advantage of the light weight of an aluminum wire and further improves various functions such as current resistance, heat resistance, and corrosion resistance. It is intended to be used and utilized for automobile-related electrical parts.
[0002]
[Prior art]
Aluminum has a specific gravity of about 1/3 compared to copper, iron, etc., and is about 1/2 of titanium, and it is a typical light weight metal. It is soft and has good workability and good electrical conductivity. Widely used in relations and lightweight equipment. However, the biggest drawback of aluminum wire is that electroplating of other metals cannot be performed continuously on the wire, and the function cannot be improved. This is because aluminum is a metal that is very easy to oxidize, and when exposed to oxygen, it immediately oxidizes to produce alumina, and this oxide film impairs conductivity and makes electroplating difficult. In particular, when the treatment is performed while the linear object is running, the treatment time is as short as several minutes to several seconds, and it is extremely difficult to completely remove the strong alumina. For this reason, the continuous electroplating method to the aluminum wire is not performed.
[0003]
[Problems to be solved by the invention]
The present invention has been made in view of the above circumstances, and the object of the present invention is a method and an apparatus capable of continuously electroplating even if the wire is very easily oxidized, such as aluminum, and an electroplated wire. Is to provide.
[0004]
[Means for Solving the Problems]
As described above, strong aluminum oxide (alumina) is formed on the surface of the aluminum wire. To remove this, treatment with a strong acid for a long time (+ several minutes or more) or anodization with a large current is performed. There is a need. In the normal line continuous electroplating method, the pretreatment time is several seconds to several minutes, and the energization current is also limited to several A / dm 2 to several + A / dm 2 .
[0005]
Therefore, in the present invention, a large current (several tens A / dm 2 to several hundreds A / dm 2 ) is passed to charge the wire to the plus side, and the aluminum oxide is completely removed in the zone charged to the plus side (anodic treatment). ), Send the line with fresh skin to the zone where the line is negatively charged, and apply electroplating in this zone. A plating film is formed by repeating such an operation.
[0006]
That is, the present invention has the following configuration.
[0007]
(1) in the same vessel, to be plated wire material travels plating solution by repeating the step of removing the oxides of the plated wire material surface as an anode, the step of electroplating to be plated wire material as the cathode, to be plated An electroplating method of a wire material that forms an electroplating film on the surface of the wire material,
The step of removing the first oxide is performed when the wire to be plated travels at a position corresponding to the cathode electrode body and the wire to be plated becomes an anode, and the step of removing the oxide after the second time is performed. electroplating method of the wire that takes place when the cylindrical anode auxiliary electrode body provided at a location corresponding to the cathode electrode body, the plated wire material travels the positive pole auxiliary electrode body.
Since the operation of forming the plating film is repeated after removing the oxide film by anodizing by this method, it is possible to continuously plate the wire material on which the oxide film is easily formed.
In particular, by using an anode auxiliary electrode body, this becomes a sacrificial anode, and it is possible to prevent the plating from eluting during anodizing. That is, during the anodizing process, the plating film dissolves again into the solution from the surface of the wire to be plated. Therefore, the anode auxiliary electrode body is used as the anode in order to prevent the action as much as possible. Specifically, the wire to be plated and the anode auxiliary electrode body are placed in contact with each other, and the anode auxiliary electrode body takes charge of elution. If the anode auxiliary electrode body has a cylindrical shape, in particular a cylindrical shape, and the wire passes through it, the ratio of the surface area of the wire to the cylindrical shape will be very large, and the elution from the line Fewer wires are plated on the wire.
[0008]
In this method, ultrasonic vibration can be applied to the plating solution. In particular, when plating is performed at a high current density, a porous plating film tends to be formed, but this is prevented by applying ultrasonic vibration.
[0009]
The plating solution preferably has a relative flow rate of 30 to 100 m / min with the traveling wire to be plated .
[0010]
This flow rate prevents a porous plating film from being formed, particularly when plating is performed at a high current density.
[0011]
The wire to be plated can be an aluminum wire .
Previously, aluminum wires could not be continuously plated, but this method takes advantage of the light weight of aluminum wires and further improves various functions such as current-carrying heat resistance and corrosion resistance. Can be used and utilized.
[0012]
A plated film made of a material different from the electroplated film can be formed in advance on the surface of the wire to be plated by an immersion method .
By using the dipping method in combination, a plating film made of a material different from the electroplating film is formed. Therefore, an oxide film is hardly formed, and the method of the present invention can be easily performed.
[0013]
The step of removing the oxide is preferably performed at a current density of 50 A / dm 2 or more.
By setting it as a high current density, the oxide film on the surface of a to-be-plated wire can be removed by anodizing.
[0014]
The step of removing the oxide is preferably performed at a current density of 50 A / dm 2 or more and 300 A / dm 2 or less .
If the current density is too high, there is a concern that the plating film becomes porous. By setting the current density range, anodization and formation of the plating film can be performed in harmony.
[0015]
The step of removing the oxide can be performed when the wire to be plated travels at a position corresponding to the cathode electrode body and the wire to be plated becomes an anode.
The oxide can be electrically removed by using the wire to be plated as an anode.
[0017]
(2) The method according to (1) , wherein the anode auxiliary electrode body has an area ratio of 25 times or more with respect to the wire to be plated.
By setting this area ratio, prevention of the plating film from flowing out functions particularly effectively.
(3) The method according to (1) or (2) , wherein the anode auxiliary electrode body is substantially the same material as the electroplated film formed on the surface of the wire to be plated.
By using the same material, it is possible to prevent ions from flowing out from the anode auxiliary electrode body into the plating solution and flowing out from the electroplated film on the surface of the wire to be plated. And the metal ion in the solution lost by depositing on the to-be-plated wire surface can be replenished.
[0019]
Anode sub-electrode body, the area ratio of 25 times or more with respect to the plated wire material, preferably set to 150 times or less.
If the area ratio of the anode auxiliary electrode body is increased, the plating tank must be enlarged. Therefore, it is preferable to set the upper limit in consideration of the balance between the two.
[0020]
The anode auxiliary electrode body used in the present invention is used in the step of removing oxides on the surface of the wire to be plated in the above method, has a cylindrical shape in which the wire to be plated travels, and the material is substantially the same as the wire to be plated. Same as the anode.
By using this anode auxiliary electrode body, it is possible to prevent the plating film from flowing out at the time of anodizing and to make the method of the present invention effective.
[0021]
Anode auxiliary electrode body, it is preferable area ratio is 25 times or more with respect to the plated wire material travels therethrough.
By setting this area ratio, prevention of the plating film from flowing out functions particularly effectively.
[0022]
The anode auxiliary electrode body preferably has an area ratio of 25 times or more and 150 times or less with respect to the wire to be plated running through the anode auxiliary electrode body.
When the area ratio of the anode auxiliary electrode body is increased, the plating tank has to be enlarged. Therefore, the upper limit is set in consideration of both.
[0023]
An electroplating apparatus used in the present invention includes a plating tank in which a plating solution is filled and a wire to be plated travels, and an anode electrode body and a cathode electrode body that are alternately arranged corresponding to the travel path of the wire to be plated. The anodizing of the wire to be plated was performed between the cathode electrode body and the wire to be plated, and a plating film was formed on the surface of the wire to be plated between the anode electrode body and the wire to be plated.
With this apparatus, the method of the present invention can be performed effectively.
[0024]
In the electroplating apparatus, a cylindrical anode auxiliary electrode body serving as an anode through which a wire to be plated travels is disposed in a region where anodization is performed.
[0025]
By using this anode auxiliary electrode body, it is possible to prevent the plating film from flowing out at the time of anodizing and to make the apparatus of the present invention effective.
In the electroplating apparatus, the material of the anode auxiliary electrode body is substantially the same as the wire to be plated.
In the electroplating apparatus, the anode auxiliary electrode body has an area ratio of 25 times or more with respect to the wire to be plated.
By setting this area ratio, prevention of the plating film from flowing out functions particularly effectively.
[0026]
In the electroplating apparatus, the anode auxiliary electrode body has an area ratio of 25 to 150 times with respect to the wire to be plated.
When the area ratio of the anode auxiliary electrode body is increased, the plating tank has to be enlarged. Therefore, the upper limit is set in consideration of both.
[0027]
In the electroplating apparatus, the anode electrode body has a plate shape or a cylindrical shape.
The shape of the anode electrode body may be plate-shaped or cylindrical.
[0028]
In the electroplating apparatus, the cathode electrode body has a plate shape or a cylindrical shape in which the object to be plated travels.
The shape of the cathode electrode body may be plate-shaped or cylindrical.
[0029]
The electroplated wire is made by the above method.
The aluminum wire produced by the above method has an electroplated film formed on the surface.
[0030]
DETAILED DESCRIPTION OF THE INVENTION
FIG. 1 shows an example of the plating apparatus of the present invention. This apparatus forms a traveling path of a wire to be plated A (for example, an aluminum wire) in a
[0031]
Thus, the wire to be plated is caused to run in the plating solution of this plating apparatus. In the case of an infant, when the wire to be plated is positively charged, the oxide on the surface of the wire to be plated is removed by anodizing, and when the wire is negatively charged, plating is performed. That is, first, a high current density current (100 A / dm 2 or more, 500 A / dm 2 or less) flows between the cathode electrode body and the wire to be plated (functioning as an anode), and is formed on the surface of the wire to be plated. The oxide is removed by anodization. Next, a high current density current flows between the anode electrode body and the wire to be plated (functioning as a cathode), and plating is performed with a large current. A plating film having a desired thickness is formed by sequentially repeating such a process. Further, the anode auxiliary electrode body is for preventing elution of plating at the time of anodizing, but the material is substantially the same as the electroplated film formed on the surface of the wire to be plated in order to exert its function in particular, The area ratio of the wire to be plated is preferably 25 times or more and 150 times or less. Further, in order to prevent the plating from becoming porous even when plating is performed at a high current density, it is preferable to apply ultrasonic vibration and set the relative flow rate of the plating solution to the traveling wire to be moved to 30 to 100 m / min. .
[0032]
In the present invention, as shown in FIG. 1, power is supplied to the wire to be plated without contact and a large current flows. So there is no fear of sparking.
It is also possible to preliminarily deposit a metal body such as zinc or tin on the aluminum surface utilizing the ionization tendency just before plating, measure the activation of the surface before plating, and then perform the method of the present invention.
In addition, as an example of the plating apparatus used in actual operation, several plating tanks having a length of about 1 m are arranged in a row, and the anode auxiliary electrode body is about 100 mm in length and about 50 mm in diameter at a predetermined location. A plurality of anode plates and cathode plates are about 100 mm in length and are alternately arranged with an interval of 20 mm.
[0033]
In the above embodiment, the
[0034]
【Example】
Copper plating was performed on a 1.0 mφ aluminum wire by a miniature plant (structure shown in FIG. 1). The current density was 10 A / dm 2 to 100 A / dm 2 , the linear velocity was 15 to 50 m / min, the relative flow rate of the plating solution was 30 to 100 m / min, and the plating solution was subjected to normal copper plating. The area ratio of the anode auxiliary electrode body to the plating solution and the aluminum wire was 25 times. The results are shown in Table 1. For comparison, electroplating was performed by a normal contact current method. The results are also shown in Table 1.
[0035]
[Table 1]
[0036]
In addition, although this invention is applied to a wire, it is effectively applied also to the process, apparatus, and metal material which are continuously plated, such as a strip | belt shape. In addition, depending on the thickness of the coating to be plated and the configuration of the apparatus, the step of removing the oxide on the surface of the wire to be plated using the wire to be plated running in the plating solution as the anode, and the electroplating using the wire to be plated as the cathode It is also possible to form a predetermined plating film by performing the process of performing only once. Furthermore, after performing the step of electroplating with the wire to be plated as the cathode, performing the step of removing the oxide on the surface of the wire to be plated with the wire to be plated running in the plating solution as the anode, and repeating this, Implementation of the present invention is possible. Furthermore, the final step may be either a step of removing oxide on the surface of the wire to be plated using the wire to be plated running in the plating solution as an anode or a step of electroplating using the wire to be plated as a cathode.
[0037]
【The invention's effect】
As described above, according to the present invention, even a wire material that is very easily oxidized, such as aluminum, can be electroplated continuously.
[Brief description of the drawings]
FIG. 1 is an explanatory view showing an example of a plating apparatus of the present invention.
FIG. 2 is an enlarged view of an anode auxiliary electrode body of the apparatus of FIG.
FIG. 3 is an explanatory view of another anode electrode body and cathode electrode body of the plating apparatus of the present invention.
[Explanation of symbols]
DESCRIPTION OF
Claims (3)
最初の酸化物を除去する工程は、陰極電極体に対応する個所を、被めっき線材が走行して、被めっき線材が陽極となる時に行われ、２回目以降の酸化物を除去する工程は、陰極電極体に対応する個所に筒状の陽極補助電極体を設け、この陽極補助電極体内を被めっき線材が走行する時に行われる、線材の電気めっき方法。 In the same tank, repeat the steps of removing oxide on the surface of the wire to be plated using the wire to be plated running in the plating solution as the anode and the step of electroplating using the wire to be plated as the cathode to the surface of the wire to be plated. An electroplating method of a wire material for forming an electroplating film,
The step of removing the first oxide is performed when the wire to be plated travels at a position corresponding to the cathode electrode body and the wire to be plated becomes an anode, and the step of removing the oxide after the second time is performed. A method of electroplating a wire , which is performed when a cylindrical anode auxiliary electrode body is provided at a location corresponding to a cathode electrode body, and the wire to be plated travels within the anode auxiliary electrode body .
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002275386A JP4177626B2 (en) | 2002-09-20 | 2002-09-20 | Electroplating method of wire, electroplating apparatus, and electroplated wire |
| CNB031249175A CN100500948C (en) | 2002-09-20 | 2003-09-19 | Wire electroplating method, electroplating device and electroplating wire |
| KR1020030065079A KR20040025854A (en) | 2002-09-20 | 2003-09-19 | Method of electroplating wire, device for electroplating wire, and electroplated wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002275386A JP4177626B2 (en) | 2002-09-20 | 2002-09-20 | Electroplating method of wire, electroplating apparatus, and electroplated wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004107776A JP2004107776A (en) | 2004-04-08 |
| JP4177626B2 true JP4177626B2 (en) | 2008-11-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002275386A Expired - Fee Related JP4177626B2 (en) | 2002-09-20 | 2002-09-20 | Electroplating method of wire, electroplating apparatus, and electroplated wire |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4177626B2 (en) |
| KR (1) | KR20040025854A (en) |
| CN (1) | CN100500948C (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102888634A (en) * | 2011-07-18 | 2013-01-23 | 天津市大港镀锌厂 | Method for enhancing corrosion resistance of galvanizing layer |
| CN103590079A (en) * | 2012-08-14 | 2014-02-19 | 亚洲电镀器材有限公司 | Electroplating method |
| JP5880364B2 (en) * | 2012-09-05 | 2016-03-09 | 住友電気工業株式会社 | Aluminum plating apparatus and aluminum film manufacturing method using the same |
| CN107142485B (en) * | 2017-05-18 | 2019-04-09 | 广西正润新材料科技有限公司 | A method for comprehensively modifying the surface of high-purity aluminum foil for medium and high voltage anodes |
| CN108342753A (en) * | 2018-04-24 | 2018-07-31 | 哈尔滨秋冠光电科技有限公司 | A kind of method of continuous production diamond wire |
| CN109807554B (en) * | 2019-01-15 | 2020-09-22 | 江阴润源机械有限公司 | Manufacturing process of cold roll |
-
2002
- 2002-09-20 JP JP2002275386A patent/JP4177626B2/en not_active Expired - Fee Related
-
2003
- 2003-09-19 KR KR1020030065079A patent/KR20040025854A/en not_active Withdrawn
- 2003-09-19 CN CNB031249175A patent/CN100500948C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN100500948C (en) | 2009-06-17 |
| CN1495296A (en) | 2004-05-12 |
| KR20040025854A (en) | 2004-03-26 |
| JP2004107776A (en) | 2004-04-08 |
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