JP4179060B2 - Electronic component mounting system and electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting system and an electronic component mounting method for mounting electronic components on a substrate.
[0002]
[Prior art]
An electronic component mounting system that mounts electronic components on a substrate is configured by connecting a plurality of electronic component mounting devices, and the substrate to be mounted passes through each electronic component mounting device from the upstream side to the downstream side. The electronic components are sequentially mounted. At this time, there is a case where the mounting order of electronic components is restricted between a plurality of types of electronic components mounted on the same substrate depending on the mounting operation constraints such as the mounting position and the shape of the electronic components.
[0003]
For example, after mounting a small electronic component, a large component such as a shield portion is mounted so as to cover the upper part (for example, see Patent Document 1), or the mounting position is close and the mounting operation of the subsequent component is hindered. In some cases, these electronic components need to be mounted according to a predetermined preceding / following relationship.
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 10-335869
[Problems to be solved by the invention]
By the way, in an electronic component mounting system, an appearance inspection may be performed on a mounted substrate before the substrate on which the electronic component is mounted is sent to a reflow apparatus for solder bonding. In the appearance inspection, it is necessary to image an electronic component on the substrate. Therefore, it is necessary to perform an appearance inspection before a component that covers the other electronic components such as the shield component described above and prevents the imaging is mounted. For this reason, when there is an electronic component that requires an appearance inspection among the electronic components covered with the shield component, an inspection for an appearance inspection is performed upstream of the electronic component mounting apparatus that executes the mounting of the shield component. Arranging the device is done.
[0006]
However, in the electronic component mounting system configured as described above, the following inconvenience occurs when a defect is detected in the appearance inspection. In other words, since a repair is required for a substrate in which a defect is detected, the shield component cannot be mounted in the electronic component mounting apparatus in the next process, and this substrate is discharged from the mounting line by the defect discharge mechanism. .
[0007]
Then, repair work is performed off-line on the ejected board. In this repair work, a defective part is identified by comparing inspection data output from the inspection apparatus, and necessary for the defective part. After the treatment was performed, the process was sent again to the reflow device. For this reason, the post-processing load on the defect detection substrate is large, and time and effort are required.
[0008]
Accordingly, an object of the present invention is to provide an electronic component mounting system and an electronic component mounting method that can reduce the post-processing load of a defect detection substrate.
[0009]
[Means for Solving the Problems]
The electronic component mounting system according to claim 1 includes a plurality of electronic component mounting devices arranged in series, and one electronic component mounting device and another electronic component located downstream of the one electronic component mounting device. An electronic component mounting system configured by interposing an inspection device that inspects upstream work performed upstream from the one electronic component mounting device between the mounting device and the upstream work The upstream electronic component that is the target of the inspection, the predecessor / success relationship derived from the restriction on the mounting operation between the upstream work and the downstream work performed by the other electronic component mounting apparatus, and the inspection work by the inspection apparatus Based on component association means for creating component-related data to be associated with the downstream electronic component that is the target of the downstream operation based on the feasibility condition, based on the inspection result and the component-related data of the inspection apparatus And a work execution determination instruction means for instructing the determined said another electronic component mounting apparatus as to whether or not to perform downstream operations in the other electronic component mounting apparatus, the upstream electronic component electronic components mounted on a substrate The downstream electronic component is a shield component that is mounted so as to cover the electronic component mounted on the substrate, and the preceding / following relationship is a shield component unless the electronic component belonging to the shield area of the substrate is mounted. The inspection work execution condition is a condition that the inspection cannot be performed after the shielded part is mounted so as to cover the electronic component during the inspection .
[0010]
The electronic component mounting apparatus according to claim 2 includes a plurality of electronic component mounting apparatuses arranged in series, and one electronic component mounting apparatus and another electronic component located downstream of the one electronic component mounting apparatus. An electronic component mounting method by an electronic component mounting system configured by interposing an inspection device for performing inspection on upstream work performed upstream from the one electronic component mounting device between the mounting device and the mounting device The upstream electronic component that is the target of the upstream work, the predecessor / success relationship derived from the restrictions on the mounting operation between the upstream work and the downstream work performed in the other electronic component mounting apparatus, and the inspection Component-related data to be associated with the downstream electronic component that is the target of the downstream work is created based on the conditions for whether or not the inspection work can be performed by the apparatus. Results and are those determined whether to execute downstream operations in the other electronic component mounting apparatus commanding the other electronic component mounting apparatus based on the part-related data, the upstream electronic components mounted on the board The downstream electronic component is a shield component that covers and mounts the electronic component mounted on the substrate, and the preceding / following relationship is after mounting the electronic component belonging to the shield area of the substrate. Otherwise, the shield component cannot be mounted, and the inspection work execution condition is a condition that the inspection cannot be performed after the shield component is mounted so as to cover the electronic component in the inspection .
[0011]
According to the present invention, based on the preceding / following relationship derived from the restrictions on the mounting operation of the upstream electronic component that is the target of the upstream work and the inspection work execution availability condition in the inspection device, If component-related data for associating the downstream electronic component with the upstream electronic component is created and inspection is performed by the inspection device, the downstream in other electronic component mounting devices is based on this inspection result and component-related data. By determining whether or not the side work can be performed and instructing another electronic component mounting apparatus, it is possible to perform an operation on an electronic component that can be safely performed, and to reduce the post-processing load on the defect detection board.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an explanatory diagram of a configuration of an electronic component mounting system according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of a process of manufacturing a mounting board by the electronic component mounting system according to an embodiment of the present invention, and FIGS. FIG. 4 is a cross-sectional view of a mounting board manufactured by the electronic component mounting system according to the embodiment of the present invention, FIG. 4 is a block diagram showing the configuration of the electronic component mounting system control system according to the embodiment of the present invention, and FIG. FIG. 7 is a plan view of a mounting board manufactured by the electronic component mounting system according to the embodiment of the present invention, FIG. 7 is a flowchart of mounting board manufacturing by the electronic component mounting system according to the embodiment of the present invention, and FIG. It is process explanatory drawing of the mounting board manufacture by the electronic component mounting system of one embodiment.
[0013]
First, the configuration of the electronic component mounting system will be described with reference to FIG. In FIG. 1, the electronic component mounting system is configured by arranging five electronic component mounting devices (MA, MB, MC, MD, ME) in series, and these electronic component mounting devices are LAN systems. 9 and the host computer 10.
[0014]
The bases 1A, 1B, 1C, 1D, and 1E of each electronic component mounting apparatus are provided with transport conveyors 2A, 2B, 2C, 2D, and 2E on the upper surface, and these transport conveyors are connected in series and are continuous. It constitutes a transport path. The board 3 to be mounted by the electronic component mounting system is transported through the transport path sequentially from the upstream side (left side in FIG. 1) to the downstream. Solder has already been supplied to the connection electrodes of the substrate 3 in the upstream solder printing process.
[0015]
Next, the function of each electronic component mounting apparatus constituting the electronic component mounting system will be described. Among these electronic component mounting apparatuses, MA, MB, and MD are electronic component mounting apparatuses, and include component mounting mechanisms 4A, 4B, and 4D having mounting heads 5A, 5B, and 5D, respectively. Electronic components taken out from a component supply unit (not shown) are mounted on the substrate 3 carried into the conveyors 2A, 2B, and 2D by the mounting heads 5A, 5B, and 5D.
[0016]
MC is an inspection device and includes an imaging mechanism 6 having a camera 7. The board 3 on which the electronic components are mounted by the electronic component mounting apparatuses MA and MB is carried into the transfer conveyor 2C of the inspection apparatus MC, and here, a mounting inspection for imaging the board 3 by the camera 7 is performed. The imaging result is subjected to recognition processing by a recognition processing unit (not shown), thereby inspecting the mounting state of the electronic component mounted on the substrate 3, that is, the presence / absence of the electronic component and displacement.
[0017]
The ME is a reflow apparatus and includes a reflow furnace 8 for heating the substrate 3. The substrate 3 that has been mounted by the electronic component mounting apparatus MD is carried into the reflow furnace 8 by the conveyor 2E, and the solder that has already been supplied is melted by being heated here, and the electronic component is soldered to the connection electrode. Be joined.
[0018]
Next, with reference to FIG. 2 and FIG. 3, the mounting board manufactured by the electronic component mounting system and the work contents executed by each of the above-described apparatuses will be described. This mounting board has a structure in which a large number of electronic components 11 are mounted on a substrate 3 and these electronic components 11 are covered with three shield components 13A, 13B, and 13C (see FIG. 3). FIG. 2 shows operations sequentially performed on the substrate 3 in order to manufacture the mounted component.
[0019]
In the electronic component mounting apparatuses MA and MB, the electronic component 11 is mounted on the substrate 3. Here, the electronic component 11 is mounted in an area covered by the two shield components 13A and 13B, that is, the electronic component 11 belonging to the shield areas 12A and 12B. In the electronic component mounting apparatus MB, the electronic component 11 belonging to the shield area 12C covered with the seal member 13C is mounted.
[0020]
The board 3 on which the electronic component 11 is mounted in all the shield areas 12A, 12B, 12C is inspected for the mounting state of the electronic component 11 by the inspection device MC. In the electronic component mounting apparatus MD, the shield components 13A, 13B, and 13C are mounted on the inspected substrate 3, and the subsequent substrate 3 is sent to the reflow device ME.
[0021]
That is, the electronic component mounting system having the above configuration includes a plurality of electronic component mounting apparatuses MA, MB, MD arranged in series, and includes an electronic component mounting apparatus MB (one electronic component mounting apparatus) and an electronic component mounting apparatus MB. The upstream work (electrons belonging to shield areas 12A, 12B, and 12C) executed upstream from the electronic component mounting apparatus MB between the electronic component mounting apparatus MD (another electronic component mounting apparatus) positioned on the downstream side. The electronic component mounting system is configured by interposing an inspection device MC for performing an inspection on the component 11 mounting operation). With such a configuration, it is possible to inspect the mounting of the electronic component 11 on the substrate 3 before downstream work (mounting work of the shield parts 13A, 13B, and 13C).
[0022]
Next, the configuration of the control system of the electronic component mounting system will be described with reference to FIG. In FIG. 4, the electronic component mounting apparatuses MA, MB, and MC include mounting control units 21A, 21B, and 21C and communication units 22A, 22B, and 22C, and the communication units 22A, 22B, and 22C are connected via the LAN system 9. Connected to the host computer 10. The mounting controllers 21A, 21B, and 21C control the component mounting mechanisms 4A, 4B, and 4C (see FIG. 1) in accordance with instructions from the host computer 10.
[0023]
The inspection device MC and the reflow device ME each include an inspection control unit 23, a reflow control unit 24, and communication units 22D and 22E. The communication units 22A, 22B, and 22C are connected to the host computer 10 via the LAN system 9. Has been. The inspection control unit 23 and the reflow control unit 24 control the imaging mechanism 6 and the reflow furnace 8 (see FIG. 1) according to instructions from the host computer 10.
[0024]
The function of the host computer 10 will be described. The communication unit 15 exchanges signals with each device constituting the electronic component mounting system via the LAN system 9. The calculation unit 16 is a CPU, and executes a component-related data creation process and a work execution availability command process, which will be described later, by executing a component-related data creation program 19a and a work execution availability instruction program 19b stored in the program storage unit 19. To do.
[0025]
The data storage unit 20 stores mounting data 20a and component related data 20b. The mounting data 20a is data indicating the types and sizes of components mounted on the substrate 3, that is, the electronic component 11 and the shield components 13A, 13B, and 13C, the mounting position on the substrate 3, and the like. The component-related data 20b is obtained when the three electronic component mounting apparatuses MA, MB, MD are divided into the upstream electronic component mounting apparatuses MA, MB and the downstream electronic component mounting apparatus MD by the inspection apparatus MC. This is data for automatically determining whether or not the mounting operation of the shield components 13A, 13B, and 13C on the downstream side can be performed according to the inspection result of the inspection device MC for the electronic component 11 mounted on the side.
[0026]
That is, between the electronic component 11 mounted on the substrate 3 and the shield components 13A, 13B, and 13C mounted so as to cover these electronic components 11, as shown in FIG. , 12B, and 12C, there is a predecessor / successor relationship derived from the restrictions on the mounting operation that the shield components 13A, 13B, and 13C can only be mounted after mounting the electronic component 11 belonging to.
[0027]
Then, in mounting inspection of the electronic component 11 by the inspection apparatus MC, after the shielding component is mounted so as to cover the electronic component 11 as shown in FIG. 3, imaging with the camera 7 is impossible and inspection cannot be performed. The inspection work execution availability condition exists. The above-described assignment of the mounting work to each of the electronic component mounting apparatuses MA, MB, MD is determined based on the preceding / following relationship and the inspection work execution availability condition. The preceding / following relationship and the inspection work execution availability condition are derived based on the mounting data 20a of the board.
[0028]
Then, when the preceding / following relationship and the inspection work execution availability condition are derived, based on the preceding / following relationship and the inspection work execution availability condition, the upstream electronic component (electronic component 11) that is the target of the upstream work is Component-related data associated with downstream electronic components (shield components 13A, 13B, and 13C) that are targets of downstream operations are created.
[0029]
In the example of the mounting substrate shown in the present embodiment, the electronic component 11 and the shield components 13A, 13B, and 13C are associated with each other through the shield areas 12A, 12B, and 12C shown in FIG. That is, on the component-related data, the electronic component 11 belonging to the shield area 12A is associated with the shield component 13A, and similarly, the electronic component 11 belonging to the shield areas 12B and 12C is associated with the shield components 13B and 13C, respectively.
[0030]
The component-related data 20b is created by the calculation unit 16 executing the component-related data creation program 19a while referring to the mounting data 20a, and is stored in the data storage unit 20. Accordingly, the calculation unit 16 that executes the component-related data creation program 19a sets the upstream electronic component that is the target of the upstream operation in the mounting operation between the upstream operation and the downstream operation performed by the electronic component mounting apparatus MD. Based on the preceding / following relationship derived from the constraint condition and the inspection work execution availability condition in the inspection apparatus, the component association means for creating the component related data associated with the downstream electronic component that is the target of the downstream operation is configured.
[0031]
In the manufacturing process of the mounting board, the component-related data 20b is read out, and the shield components 13A, 13B, 13C in the electronic component mounting apparatus MD are based on the inspection result of the inspection device MC and the read-out component-related data 20b. Whether or not the mounting work can be executed is determined, and a work execution propriety command process for instructing the electronic component mounting apparatus MD to execute or not is executed. That is, as a result of inspecting the electronic component 11 mounted in the upstream operation with the inspection device MC, if any of the electronic components 11 fails the inspection, it is associated with the rejected component in the downstream operation. A command to the effect that the downstream electronic component mounting operation cannot be performed is transmitted to the electronic component mounting apparatus MD, which is the downstream apparatus.
[0032]
This processing is performed by the calculation unit 16 of the host computer 10 executing the work execution permission / inhibition command program 19b, and the processing result is transmitted to the electronic component mounting apparatus MD via the communication unit 15. Accordingly, the calculation unit 16 that executes the work execution availability instruction program 19b determines whether or not the downstream work in the electronic component mounting apparatus MD can be executed based on the inspection result of the inspection apparatus and the component-related data, and the electronic component mounting apparatus MD A work execution propriety command means for commanding is configured.
[0033]
Here, as an example of the component-related data and the work execution permission / inhibition command processing, the relationship between the electronic component 11 and the shield components 13A, 13B, and 13C mounted so as to cover the electronic component 11 is described as an example. 6, that is, a case where a large electronic component 11 a is mounted on a small electronic component 11, and the same preceding / following relationship and inspection work execution availability condition exist. In this case, the same can be applied.
[0034]
The electronic component mounting system is configured as described above. Next, an electronic component mounting method by the electronic component mounting system will be described with reference to FIG. 8 along the flow of FIG. Prior to the start of the mounting operation, the component-related data 20b is already created.
[0035]
First, component mounting is performed by the electronic component mounting apparatuses MA and MB (ST1). Thus, as shown in FIG. 8A, the electronic component 11 is mounted on the three shield areas 12A, 12B, and 12C of the substrate 3. Next, the substrate 3 after the component mounting is carried into the inspection device MC, and a mounting inspection for inspecting the mounting state of the electronic component is performed (ST2). In this mounting inspection, the pass / fail inspection for each shield area is determined (ST4). Here, it is determined whether or not all the shield areas have passed the inspection, and if all the shield areas have passed the inspection, the electronic component mounting apparatus MD applies the entire shield area to the substrate 3 as shown in FIG. The shield component is mounted (ST5), and then the solder reflow is performed by the reflow device ME (ST6).
[0036]
In (ST4), if all the shield areas do not pass the inspection, as described above, the host computer 10 uses the inspection result and the component-related data 20b created in advance as described above to shield the component in the electronic component mounting apparatus MD. It is determined whether or not the mounting work (downstream side work) can be executed, and the electronic component mounting apparatus MD is instructed. In the example shown in FIG. 8C, a mounting failure is detected in any of the electronic components 11 belonging to the shield area 12B and the inspection fails, and the shield associated with the electronic component 11 in the component-related data 20b. A command is issued that component 13B cannot be mounted.
[0037]
Then, the electronic component mounting apparatus MD performs a mounting operation in accordance with this command, so that the shield components 13A and 13C are mounted only in the passed shield areas 12A and 12C (ST7). That is, in this case, operations in a range that can be safely performed based on the inspection result are performed online without discharging the substrate 3 offline.
[0038]
Thereafter, solder reflow is performed by the reflow device ME (ST8). After that, the board 3 is sent to the recovery process, and after repairing the electronic components in the shield area 12B where the mounting failure is detected, a recovery process for mounting the unmounted shield component 12B is executed (ST9). .
[0039]
In this recovery process, it is only necessary to work on only a portion where a mounting failure is detected by the inspection apparatus MC. Therefore, the processing required for the defect detection board in the conventional apparatus for manufacturing the same mounting board, that is, for the board discharged from the mounting line by the defect discharge mechanism, first, the defective parts are compared with the inspection data. It is possible to significantly reduce the post-processing load of the defect detection board as compared with a series of processes that are specified and performed on the defective part and then sent to the reflow apparatus again.
[0040]
In the above-described embodiment, an example in which the entire electronic component mounting system is controlled by the host computer 10 has been described. However, the function of the host computer 10 described above may be the devices constituting the electronic component mounting system or any one of the devices. It may be in the form of
[0041]
【The invention's effect】
According to the present invention, based on the preceding / following relationship derived from the restrictions on the mounting operation of the upstream electronic component that is the target of the upstream work and the inspection work execution availability condition in the inspection device, If component-related data for associating the downstream electronic component with the upstream electronic component is created and inspection is performed by the inspection device, the downstream in other electronic component mounting devices is based on this inspection result and component-related data. Since it is determined whether or not the side work can be performed and commands are given to other electronic component mounting apparatuses, it is possible to perform work on an electronic component that can be safely executed, and to reduce the post-processing load on the defect detection board. .
[Brief description of the drawings]
FIG. 1 is an explanatory diagram of a configuration of an electronic component mounting system according to an embodiment of the present invention. FIG. 2 is an explanatory diagram of a process of manufacturing a mounting board by the electronic component mounting system according to an embodiment of the present invention. FIG. 4 is a cross-sectional view of a mounting board manufactured by an electronic component mounting system according to an embodiment of the present invention. FIG. 4 is a block diagram showing a configuration of an electronic component mounting system control system according to an embodiment of the present invention. FIG. 6 is a plan view of a mounting board manufactured by the electronic component mounting system according to the embodiment. FIG. 6 is a cross-sectional view of the mounting board manufactured by the electronic component mounting system according to the embodiment of the invention. FIG. 8 is a flow chart of manufacturing a mounting board by the electronic component mounting system according to the embodiment. FIG. 8 is a process explanatory diagram of mounting board manufacturing by the electronic component mounting system according to the embodiment of the invention.
3 Substrate 4A, 4B, 4D Component mounting mechanism 6 Imaging mechanism 8 Reflow furnace 10 Host computer 11 Electronic component 12A, 12B, 12C Shield area 13A, 13B, 13C Shield component 19a Component related data creation program 19b Work execution enable / disable command program 20b Component Related data MA, MB, MD Electronic component mounting equipment

Claims (2)

A plurality of electronic component mounting devices arranged in series, and the one electronic component mounting device between the one electronic component mounting device and another electronic component mounting device positioned downstream of the one electronic component mounting device. An electronic component mounting system configured by interposing an inspection device for inspecting upstream work executed upstream from a component mounting device, wherein the upstream electronic component to be subjected to the upstream work is Of the downstream work based on the preceding / following relationship derived from the restriction condition on the mounting operation between the side work and the downstream work performed in the other electronic component mounting apparatus and the inspection work execution availability condition in the inspection apparatus. Component association means for creating component-related data associated with the target downstream electronic component, and downstream in the other electronic component mounting device based on the inspection result and component-related data of the inspection device And a work execution determination command means for determining whether to execute tasks commanding the other electronic component mounting apparatus, the upstream electronic component is an electronic component mounted on a substrate, the downstream electronic components board The shield component is mounted so as to cover the electronic component mounted thereon, and the preceding / following relationship is a relationship in which the shield component can be mounted only after the electronic component belonging to the shield area of the board is mounted. The work execution availability condition is a condition that inspection cannot be performed after a shield part is mounted so as to cover the electronic part at the time of inspection . A plurality of electronic component mounting devices arranged in series, wherein the one electronic component mounting device is disposed between the one electronic component mounting device and another electronic component mounting device positioned downstream of the one electronic component mounting device. An electronic component mounting method by an electronic component mounting system configured by interposing an inspection device for performing inspection on upstream work performed upstream from the component mounting device, the upstream side being the target of the upstream work Based on the predecessor / successor relationship derived from the restrictions on the mounting operation between the upstream work and the downstream work performed in the other electronic component mounting apparatus, and the inspection work execution availability condition in the inspection apparatus. If component-related data to be associated with the downstream electronic component that is the target of the downstream work is created and the inspection by the inspection device is performed, the inspection result and the component-related data are based on the inspection result. There are is intended to command to the determined said another electronic component mounting apparatus as to whether or not to perform downstream operations in the other electronic component mounting apparatus, the upstream electronic component is an electronic component mounted on a substrate, wherein The downstream electronic component is a shielded component that covers and mounts the electronic component mounted on the board, and the preceding / following relationship is that the shielded component can be mounted only after the electronic component belonging to the shield area of the substrate is mounted. In addition, the condition for checking whether or not the inspection work can be performed is a condition that the inspection cannot be performed after the shield part is mounted so as to cover the electronic part in the inspection .

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