JP4190622B2 - How to install components in a housing for electronic equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for mounting components on a casing for an electronic device used in various electronic devices such as a notebook personal computer, a portable information device, and a portable audio device, and in particular, an electronic device made of aluminum or an aluminum alloy. The present invention relates to a component mounting method in a device casing.
[0002]
[Prior art]
Conventional casings for electronic devices are mainly made of plastic. However, the plastic casing is likely to be thick to increase the rigidity, the heat dissipation is poor, and the effect of electromagnetic shielding is small.
[0003]
Therefore, in recent years, a housing for electronic equipment made of magnesium or a magnesium alloy has come to be used. Magnesium has a higher rigidity than plastic, so it can be thinned, has good heat dissipation, and also has an electromagnetic shielding effect. An electronic device casing made of a magnesium or magnesium alloy compact is disclosed in, for example, Japanese Patent Application Laid-Open No. 10-151410.
[0004]
Further, a casing for electronic equipment using an aluminum panel having high strength and light weight is disclosed in, for example, Japanese Patent Application Laid-Open No. 10-147857.
[0005]
[Problems to be solved by the invention]
Usually, an electronic device casing made of a molded body of magnesium or magnesium alloy is manufactured by molding using a die casting apparatus. However, casting defects such as warpage and shrinkage may occur, and the yield is low and the supply tends to be unstable. Moreover, since such a casting defect must be corrected, it takes time and cost to do so. Moreover, since magnesium or a magnesium alloy is inferior in corrosion resistance, it may be immediately oxidized in the atmosphere and a thin film may be formed on the surface, which may impair the appearance. Therefore, it is necessary to perform surface treatment such as painting, which takes time and cost. In addition, casting products are less adaptable to design changes, resulting in higher development costs.
[0006]
On the other hand, a housing for an electronic device using an aluminum panel is excellent in heat dissipation, but heat generated from an electronic component is transmitted to the surface of the housing, and the temperature of the surface of the housing becomes excessively high. Since the touch when the hand touches the surface of the case where the temperature has become high is usually not preferred, it is necessary to apply a thermal insulation coating to the case. However, such a thermal insulation coating is expensive in cost. In addition, when mounting or reinforcing components in the housing, it is necessary to newly mount an attachment member, a reinforcing rib, a protrusion, a screw hole, and the like, which increases the number of components and increases the production time.
[0007]
The present invention has been made to solve the above-mentioned problems, and has a high yield, high quality, high degree of response to design changes, good heat insulation, reduced number of parts, and production. and to provide a component mounting method for easy electronics housing.
[0008]
[Means for Solving the Problems]
The component mounting method of the present invention for an electronic device casing includes an inner plate member made of aluminum or an aluminum alloy, and an outer plate member made of aluminum or an aluminum alloy joined to the inner plate member with an adhesive. In the component mounting method to the electronic device casing, the step of cutting and raising a part of the inner plate member to form the cut and raised portion, and the bonding of the portion before the cut and raised portion is cut and raised And mounting a part on the outer plate member with an agent .
[0010]
The inner plate member and the outer plate member may have different thicknesses.
[0011]
Each of the divided inner plate members may be joined to the outer plate member.
[0013]
In the electronic device casing according to the present invention, the component mounting method may also be such that the hinge portion between the screen portion and the main body portion of the portable personal computer includes the inner plate member. The hinge part between the screen part of the portable personal computer and the main body part may include a cut-and-raised part of the inner plate member and a component made up of a block member. A method of mounting parts may be used.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. As shown in FIG. 1 (A), an electronic device casing of the present invention includes an inner plate member 1 made of a metal plate and an outer plate member joined to the inner plate member 1 and made of a metal plate. 2 are provided. The inner plate member 1 and the outer plate member 2 are made of, for example, aluminum or an aluminum alloy, and are joined by an adhesive 3. The adhesive 3 also has a role as a heat insulating layer for preventing heat generated inside the casing from being transmitted to the outer plate member 2. The thicknesses of the inner plate member 1 and the outer plate member 2 are appropriately designed according to the application.
[0015]
In the electronic device casing of the present invention, as shown in FIG. 1B, each of the divided inner plate members 1 may be joined to the outer plate member 2. Alternatively, a part of the inner plate member 1 may be cut and raised to form the cut and raised portion 1a.
[0016]
In the component mounting method to the electronic device casing of the present invention, after forming the cut-and-raised portion 1a, as shown in FIG. 1 (C), the adhesive before the cut-and-raised portion 1a is cut and raised. by 3, Ru mounting parts 4 outside plate member 2. In this case, in order to increase the strength of the cut and raised portion 1 a and to stably fix the component 4, a resin filling 5 may be inserted between the cut and raised portion 1 a and the component 4.
[0017]
2 to 4 show another embodiment of the present invention. As shown in FIG. 2 (A), a part of the inner plate member 1 may be cut and raised to provide vertical ribs 5, or as shown in FIG. 2 (B), protruding ribs 6 may be provided. As shown in FIG. 2C, the hook-like pawl portion 7 may be provided by bending the upper part of the inner plate member 1 to the outside of the outer plate member 2. As shown in FIG. 2D, the reinforcing ribs 8 may be provided by bending the corners of the inner plate member 1.
[0018]
Further, as shown in FIG. 3A, when inserting the pin 9 into the outer plate member 2, when it is necessary to take the insertion hole 10 deeply, the portion of the inner plate member 1 corresponding to the insertion hole 10 is formed. You may provide the recessed part 10a. As shown in FIG. 3B, a screw hole 12 may be formed on the upper surface of the cut-and-raised portion 11 having a substantially L-shaped cross section, and the component 4 may be mounted with a screw 13.
[0019]
Further, as shown in FIG. 4, cut and raised portions 14 and 14 formed by cutting and folding two portions separated by an interval of the inner plate member 1 are provided, and a component 15 is provided between the cut and raised portions 14 and 14. May be mounted or positioned.
[0020]
According to the component mounting method for the electronic device casing of the present invention , the inner plate member 1 and the outer plate member 2 are joined together by the adhesive 3, and a part of the inner plate member 1 is cut and raised. Since the part 4 is attached to the outer plate member 2 by the adhesive 3 before the cut and raised part 1a is cut and raised, the part 4 can be easily attached and manufactured. The time can be shortened, and the adhesive 3 serves as a heat insulating layer, thereby preventing the temperature of the housing surface from increasing.
[0021]
In addition, by processing the inner plate member 1, it is possible to provide component mounting members, reinforcing ribs, protrusions, screw holes, and the like, so that the number of components can be greatly reduced and the manufacturing time is shortened. be able to.
[0023]
The present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the technical matters described in the claims. For example, the inner side plate member 1 and the outer side plate member 2 may be joined by spot welding. In addition, the electronic device casing of the present invention is used in an affiliated (notebook) personal computer, and the hinge portion between the screen portion and the main body portion of the portable personal computer is constituted by the inner plate member 1. It may be. Moreover, said hinge part may be provided with the cut-and-raised part 1a of the inner side board member 1, and the block member with which the cut-and-raised part 1a was mounted | worn or positioned.
[0024]
【The invention's effect】
According to the component mounting method to the electronic device casing of the present invention , the inner plate member and the outer plate member are joined by an adhesive, and a part of the inner plate member is cut and raised to form a cut and raised portion. Since the parts are mounted on the outer plate member by the adhesive before the cut-and-raised part is cut and raised, the parts can be easily mounted, the production time can be shortened, and the bonding can be performed. An agent becomes a heat insulation layer and can prevent that the temperature of the housing | casing surface becomes high.
[0025]
Also, by machining the inner plate member, it is possible to provide component mounting members, reinforcing ribs, protrusions, screw holes, etc., so the number of components can be greatly reduced and the production time can be shortened. Can do.
[Brief description of the drawings]
1A to 1C are cross-sectional views illustrating an embodiment of the present invention.
FIGS. 2A to 2D are cross-sectional views illustrating an embodiment of the present invention.
FIGS. 3A and 3B are cross-sectional views showing an embodiment of the present invention. FIGS.
FIG. 4 is a perspective view showing an embodiment of the present invention.
[Explanation of symbols]
1: Inner plate member 1a: Cut and raised portion 2: Outer plate member 3: Adhesive 4: Parts

Claims (7)

In a component mounting method on an electronic device housing having an inner plate member made of aluminum or an aluminum alloy, and an outer plate member joined to the inner plate member by an adhesive and made of aluminum or an aluminum alloy ,
Cutting and raising a part of the inner plate member to form a cut and raised portion;
Attaching the component to the outer plate member with the adhesive before the cut and raised portion is cut and raised; and
A method of mounting a component on a casing for electronic equipment, comprising : Component mounting method of the electronic device enclosure of claim 1, characterized by the step of Ru put Umabutsu between the component and the cut-raised portions. 3. The method for mounting a component on an electronic device casing according to claim 1, further comprising a step of mounting the component with a screw through a screw hole formed in the cut and raised portion. 4. The electronic device casing according to claim 1 , wherein a component is mounted on the electronic device housing having a thickness different between the inner plate member and the outer plate member . 5. How to install parts . 5. The component according to claim 1, wherein each of the plurality of divided inner plate members is mounted on an electronic device casing that is joined to the outer plate member. 6. A method for mounting components in a housing for electronic equipment. 6. A component is mounted on a case for electronic equipment in which a hinge portion between a screen portion and a main body portion of a portable personal computer is constituted by the inner plate member. The component mounting method to the housing | casing for electronic devices as described in one term. The hinge between the screen and the body portion of the portable personal computer, attaching the component and the cut-raised portion of the inner plate member, the housing for the electronic component must and a component made of the block member The component mounting method to the electronic device casing according to any one of claims 1 to 5, wherein:

Images