JP4193681B2 - Gallium phosphide single crystal production equipment - Google Patents
Gallium phosphide single crystal production equipment Download PDFInfo
- Publication number
- JP4193681B2 JP4193681B2 JP2003391946A JP2003391946A JP4193681B2 JP 4193681 B2 JP4193681 B2 JP 4193681B2 JP 2003391946 A JP2003391946 A JP 2003391946A JP 2003391946 A JP2003391946 A JP 2003391946A JP 4193681 B2 JP4193681 B2 JP 4193681B2
- Authority
- JP
- Japan
- Prior art keywords
- single crystal
- graphite heater
- cylindrical portion
- height
- gap
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Description
本発明は、液体封止引上げ法(LEC法)を用いるリン化ガリウム単結晶の製造装置に関する。 The present invention relates to an apparatus for producing a gallium phosphide single crystal using a liquid sealing pulling method (LEC method).
可視発光ダイオード(LED)基板として用いられるリン化ガリウム(GaP)単結晶は、LEC法により育成される。 A gallium phosphide (GaP) single crystal used as a visible light emitting diode (LED) substrate is grown by the LEC method.
従来のGaP単結晶製造装置の一例を、図3に断面図で示す。図4は、図3の加熱用の黒鉛ヒータを示す断面図である。 An example of a conventional GaP single crystal manufacturing apparatus is shown in a sectional view in FIG. 4 is a cross-sectional view showing the heating graphite heater of FIG.
LEC法によるGaP単結晶製造装置は、100気圧程度の圧力に耐える高圧容器(1)からなり、通常、GaP単結晶の製造は、該高圧容器(1)内で、50気圧の窒素やアルゴンといった不活性ガス雰囲気下で行われる。高圧容器(1)の中心部には、保温筒(10)と、加熱用の黒鉛ヒータ(3a)に囲まれた石英ルツボ(2)が配置され、上方には単結晶の引上げシャフト(8)が備えられる。 The GaP single crystal manufacturing apparatus by the LEC method is composed of a high-pressure vessel (1) that can withstand a pressure of about 100 atm. Usually, the GaP single crystal is produced in a high-pressure vessel (1) such as nitrogen or argon at 50 atm. Performed in an inert gas atmosphere. At the center of the high-pressure vessel (1), a heat insulating cylinder (10) and a quartz crucible (2) surrounded by a heating graphite heater (3a) are arranged, and a single crystal pulling shaft (8) is disposed above. Is provided.
加熱用の黒鉛ヒータ(3a)は、図4に示すように、径の異なる上段円筒部(31a)および下段円筒部(32a)が一体に形成され、上段円筒部(31a)は、上部(33a)、スリットを有するスリット部(34a)、および下部(35a)で構成され、上段円筒部(34a)の底部(36a)から下方に凸状に下段円筒部(32a)が形成される。このうち、上段円筒部のスリット部(34a)のみが発熱に寄与する。スリット部(34a)は、上下方向を長手方向としたつづら折れ状に構成され、発熱体として機能する。 As shown in FIG. 4, the graphite heater (3a) for heating has an upper cylindrical portion (31a) and a lower cylindrical portion (32a) with different diameters formed integrally, and the upper cylindrical portion (31a) has an upper portion (33a). ), A slit portion (34a) having a slit, and a lower portion (35a), and a lower cylindrical portion (32a) is formed to protrude downward from a bottom portion (36a) of the upper cylindrical portion (34a). Of these, only the slit portion (34a) of the upper cylindrical portion contributes to heat generation. The slit portion (34a) is formed in a zigzag shape with the vertical direction as the longitudinal direction, and functions as a heating element.
通常、上段円筒部(31a)の底部(36a)と石英ルツボ(2)の底はできるだけ近づけるように設計することで、黒鉛ヒータ(3a)の保温性を向上させるとともに、50気圧の雰囲気ガスの対流による温度揺らぎを防ぎ、育成中のGaP単結晶(6)がGaP融液(5)と接する界面である固液界面を、安定に保って、長尺のGaP単結晶の育成を可能にしている。 Usually, by designing the bottom part (36a) of the upper cylindrical part (31a) and the bottom of the quartz crucible (2) as close as possible, the heat retention of the graphite heater (3a) is improved and the atmosphere gas of 50 atmospheres Prevents temperature fluctuations due to convection and keeps the solid-liquid interface where the growing GaP single crystal (6) is in contact with the GaP melt (5) stable, enabling the growth of long GaP single crystals Yes.
結晶育成の初期から終了までの間、石英ルツボ(2)内の温度分布を一定にし、固液界面付近の温度勾配を一定に保ちつつ、結晶育成を行うために、結晶育成に伴い降下する融液上面を、黒鉛ヒータ(3a)に対して一定位置に維持するように、石英ルツボ(2)を押し上げる押上げシャフト(11)が下方に備えられる。 In order to perform crystal growth while keeping the temperature distribution in the quartz crucible (2) constant and maintaining the temperature gradient near the solid-liquid interface from the beginning to the end of crystal growth, A push-up shaft (11) that pushes up the quartz crucible (2) is provided below so as to maintain the liquid upper surface at a fixed position with respect to the graphite heater (3a).
GaP単結晶製造装置で結晶育成を行うにあたって、まず、石英ルツボ(2)の中に、原料のリン化ガリウム(GaP)多結晶を入れ、n型不純物のS、TeおよびSiのいずれかを添加する。その上に、原料融解時のリンの揮発分解を防止する封止剤(4)であるB2O3を載せて、アルゴンや窒素などの高圧不活性ガス雰囲気下で、黒鉛ヒータ(3a)により、GaPの融点1465℃以上まで加熱する。原料融解後、引上げシャフト(8)に取り付けた種結晶(7)を降下させて、封止剤(4)の下に位置するGaP融液表面に浸けた後に、融液温度を下げ、石英ルツボ(2)を回転させ、かつ、種結晶(7)を回転させながら引き上げて、GaP単結晶(6)を育成する。 When crystal growth is performed with a GaP single crystal manufacturing apparatus, first, a raw material gallium phosphide (GaP) polycrystal is put in a quartz crucible (2), and any of n-type impurities S, Te and Si is added. To do. On top of that, B 2 O 3 which is a sealing agent (4) for preventing volatile decomposition of phosphorus at the time of melting the raw material is placed, and a graphite heater (3a) is used in a high-pressure inert gas atmosphere such as argon or nitrogen. And heating to a melting point of GaP of 1465 ° C. or higher. After melting the raw material, the seed crystal (7) attached to the pulling shaft (8) is lowered and immersed in the surface of the GaP melt located under the sealant (4), then the melt temperature is lowered, and the quartz crucible The GaP single crystal (6) is grown by rotating (2) and pulling up the seed crystal (7) while rotating it.
得られた単結晶(6)は、外形を整えるために、円筒研削を行った後、ワイヤーソーや内周刃切断機などで、厚さ300〜500μm程度のウエハに切断する。ウエハは、電気特性、結晶欠陥の有無、外観の汚れやキズなどの有無の検査を行い、規格に合格したウエハを製品とする。 The obtained single crystal (6) is subjected to cylindrical grinding to adjust the outer shape, and then cut into a wafer having a thickness of about 300 to 500 μm with a wire saw or an inner peripheral cutting machine. Wafers are inspected for electrical characteristics, crystal defects, appearance stains, scratches, etc., and wafers that pass the standards are used as products.
前述の方法で得られたGaP単結晶(6)は、結晶直胴部や結晶底部に転位が線上に集積するリネージ不良、あるいはリネージの発達による多結晶化不良が発生する。また、結晶育成の途中で結晶質量をモニターする結晶質量センサ(図示略)に急激な質量増加信号が入って育成中止となる固化が、発生する。 In the GaP single crystal (6) obtained by the above-described method, a lineage failure in which dislocations are accumulated on the straight line portion or the bottom portion of the crystal or a polycrystallization failure due to the development of lineage occurs. Further, solidification that causes a sudden mass increase signal to enter a crystal mass sensor (not shown) that monitors the crystal mass during the crystal growth and stops the growth occurs.
転位が線状に集積するリネージ不良、あるいはリネージの発達による多結晶化不良が発生する原因は、固液界面形状が融液に対して全体的あるいは部分的に凹になるために、固液界面に垂直に伝播する性質を持つ転位が、凹形状の箇所で集積することにある。したがって、転位の集積を抑制するためには、固液界面の凸度を適度な大きさにすればよい。 The cause of the lineage failure in which dislocations accumulate linearly, or the failure of polycrystallization due to the development of lineage occurs because the solid-liquid interface shape is entirely or partially concave with respect to the melt. Dislocations having the property of propagating perpendicular to the surface are accumulated at concave portions. Therefore, in order to suppress the accumulation of dislocations, the convexity of the solid-liquid interface may be set to an appropriate level.
これまでにも、特開2003−212698号公報に記載されるように、直径50mm程度のGaP単結晶の育成では、得られた固液界面形状を測定することにより得られる凸度のデータを基に、適度な固液界面の凸度を得て、多結晶化不良を低減することが提案されている。 Until now, as described in Japanese Patent Application Laid-Open No. 2003-212698, the growth of GaP single crystals having a diameter of about 50 mm is based on the convexity data obtained by measuring the obtained solid-liquid interface shape. In addition, it has been proposed to obtain an appropriate degree of convexity of the solid-liquid interface to reduce poor polycrystallization.
LEDの需要増加に伴い、直径65〜80mmの大口径GaP基板が求められている。直径65〜80mmの大口径GaP単結晶育成用の石英ルツボの直径は130mm程度、加熱用黒鉛ヒータの直径、すなわち上段円筒部(31a)の直径は140〜170mmが、一般的に用いられる。しかし、直径65〜80mmの大口径GaP単結晶を育成するために、単純に石英ルツボを大型化して130mm程度とすると、石英ルツボ底の温度を調節しても、小さな固液界面の凸度しか得られず、転位が線上に集積するリネージ不良や、転位の集積が発達した多結晶化不良を防止することはできない。
本発明は、LEC法による直径65〜80mmのGaP単結晶を製造する際に、転位が線上に集積するリネージ不良や、転位の集積がさらに発達した多結晶化不良の発生を抑え、GaP単結晶の収率を向上させることを目的とする。 The present invention suppresses the occurrence of lineage defects in which dislocations accumulate on a line and polycrystallization failure in which dislocation accumulation further develops when a GaP single crystal having a diameter of 65 to 80 mm is manufactured by the LEC method. The purpose is to improve the yield of.
本発明のGaP単結晶製造装置は、径の異なる上段円筒部および下段円筒部が一体に形成された黒鉛ヒータを備え、上段円筒部には発熱体として機能するスリット部が設けられ、液体封止引上げ法により直径65〜80mmのGaP単結晶を製造するための装置において、該黒鉛ヒータの上段円筒部のスリット部の下端から下段円筒部の下端までの鉛直方向の長さを、黒鉛ヒータ全体の高さに対して31.5%以上36%以下とし、かつ、下段円筒部の高さを、黒鉛ヒータ全体の高さに対して12%以上17%以下とすることに特徴を有する。 The GaP single crystal manufacturing apparatus of the present invention includes a graphite heater in which an upper cylindrical portion and a lower cylindrical portion having different diameters are integrally formed. The upper cylindrical portion is provided with a slit portion that functions as a heating element, and is liquid-sealed. In an apparatus for producing a GaP single crystal having a diameter of 65 to 80 mm by a pulling method, the vertical length from the lower end of the slit portion of the upper cylindrical portion of the graphite heater to the lower end of the lower cylindrical portion is set to The height is 31.5% or more and 36% or less , and the height of the lower cylindrical portion is 12 % or more and 17% or less with respect to the height of the entire graphite heater.
本発明は、黒鉛ヒータ全体の高さが228〜232mmであるGaP単結晶製造装置へ適用することが好ましい。 The present invention is preferably applied to a GaP single crystal manufacturing apparatus in which the entire graphite heater has a height of 228 to 232 mm.
本発明により、LEC法による直径65〜80mmのGaP単結晶を製造する際において、転位が線上に集積するリネージ不良や、転位の集積がさらに発達した多結晶化不良の発生を著しく低減することができ、GaP単結晶の収率を向上させることができる。 According to the present invention, when producing a GaP single crystal having a diameter of 65 to 80 mm by the LEC method, it is possible to remarkably reduce the occurrence of lineage failure in which dislocations are accumulated on the line and polycrystallization failure in which dislocation accumulation is further developed. And the yield of GaP single crystal can be improved.
一般に、上段円筒部のスリット部の下端より下にある黒鉛ヒータ下部の空間を大きく取ると、該黒鉛ヒータ下部は発熱に寄与しないため、石英ルツボの底付近の保温性を減少させ、結晶育成中の固液界面付近の温度勾配は大きくなることから、固液界面の凸度が大きくなることが知られている。しかし、該黒鉛ヒータ下部の空間を大きく取りすぎると、50気圧の雰囲気ガスの対流による温度揺らぎは大きくなり、結晶育成中の固液界面を安定に保ちながら長尺の単結晶を製造することは困難である。本発明者らは、固液界面の凸度を適度にとれ、かつ、安定な結晶育成を可能とするために、該黒鉛ヒータ下部の空間を調節することが有効であるとの知見を得て、本発明に至った。 In general, if the space under the graphite heater below the lower end of the slit portion of the upper cylindrical portion is made large, the lower portion of the graphite heater does not contribute to heat generation. Since the temperature gradient in the vicinity of the solid-liquid interface increases, it is known that the convexity of the solid-liquid interface increases. However, if the space under the graphite heater is made too large, the temperature fluctuation due to the convection of the atmospheric gas at 50 atm becomes large, and it is possible to produce a long single crystal while keeping the solid-liquid interface stable during crystal growth. Have difficulty. The present inventors have obtained the knowledge that it is effective to adjust the space under the graphite heater in order to obtain an appropriate degree of convexity at the solid-liquid interface and enable stable crystal growth. The present invention has been reached.
本発明のGaP単結晶製造装置は、径の異なる上段円筒部および下段円筒部が一体に形成された黒鉛ヒータを備え、該黒鉛ヒータの上段円筒部のスリット部の下端から下段円筒部の下端までの鉛直方向の長さを、黒鉛ヒータ全体の高さに対して31.5%以上36%以下とし、かつ、下段円筒部の高さを、黒鉛ヒータ全体の高さに対して12%以上17%以下とする。 The GaP single crystal manufacturing apparatus of the present invention includes a graphite heater in which an upper cylindrical portion and a lower cylindrical portion having different diameters are integrally formed, from the lower end of the slit portion of the upper cylindrical portion of the graphite heater to the lower end of the lower cylindrical portion. The vertical length is 31.5% or more and 36% or less with respect to the overall height of the graphite heater, and the height of the lower cylindrical portion is 12 % or more and 17 with respect to the overall height of the graphite heater. % Or less .
すなわち、本発明では、上段円筒部と下段円筒部を一体に形成することで、下段円筒部により空間を絞ることで対流により温度揺らぎを減少させる作用と、上段円筒部のスリット部の下端より下にある黒鉛ヒータ下部の空間を大きくすることで、石英ルツボの底付近の保温性を減少させ、結晶育成中の固液界面付近の温度勾配を大きくするという作用を、黒鉛ヒータの上段円筒部のスリット部の下端から下段円筒部の下端までの鉛直方向の長さと、下段円筒部の高さを、規定することにより、固液界面の凸度を適切に制御し、リネージ不良と多結晶化不良を減少させている。 That is, in the present invention, the upper cylindrical portion and the lower cylindrical portion are integrally formed, thereby reducing the temperature fluctuation by convection by constricting the space by the lower cylindrical portion, and lower than the lower end of the slit portion of the upper cylindrical portion. By increasing the space under the graphite heater in Fig. 1, the heat retention near the bottom of the quartz crucible is reduced and the temperature gradient near the solid-liquid interface during crystal growth is increased. By regulating the vertical length from the lower end of the slit part to the lower end of the lower cylindrical part and the height of the lower cylindrical part, the convexity of the solid-liquid interface is properly controlled, and lineage failure and polycrystallization failure Is decreasing.
なお、黒鉛ヒータの形状は、3つ以上の円筒部からなっていてもよいが、目的を最小限達成し、かつ、黒鉛ヒータの加工による製造コストの増加を最小に抑えるために、2つの円筒部からなることが望ましい。 The shape of the graphite heater may be composed of three or more cylindrical portions, but two cylinders are used in order to achieve the minimum object and minimize the increase in manufacturing cost due to the processing of the graphite heater. It is desirable to consist of parts.
スリット部の下端から下段円筒部の下端までの鉛直方向の長さが、黒鉛ヒータ全体の高さに対して32%未満では、固液界面の凸度が不十分となり、リネージ不良と多結晶化不良が多発することとなり好ましくない。一方、36%を超えると、凸度が過大となり、結晶育成の途中で結晶質量をモニターする結晶質量センサに急激な質量増加信号が入って、育成中止となる固化が発生しやすくなり好ましくない。 If the length in the vertical direction from the lower end of the slit portion to the lower end of the lower cylindrical portion is less than 32% of the total height of the graphite heater, the convexity of the solid-liquid interface becomes insufficient, resulting in poor lineage and polycrystallization. It is not preferable because defects frequently occur. On the other hand, if it exceeds 36%, the degree of convexity becomes excessive, and an abrupt mass increase signal enters the crystal mass sensor that monitors the crystal mass during the crystal growth, so that solidification that causes the growth to stop is likely to occur.
下段円筒部の高さが、黒鉛ヒータ全体の高さに対して12%未満では、凸度が過大となり固化が発生しやすくなり好ましくない。一方、17%を超えると、凸度が不十分となり好ましくない。 If the height of the lower cylindrical portion is less than 12% with respect to the total height of the graphite heater, the convexity becomes excessive and solidification tends to occur, which is not preferable. On the other hand, if it exceeds 17%, the convexity becomes insufficient, which is not preferable.
黒鉛ヒータ全体の高さは、必要に応じて変更できる。しかし、LEC法によるGaP単結晶製造装置は、100気圧程度の圧力に耐える高圧容器からなり、通常、GaP単結晶の製造は、50気圧の窒素やアルゴンといった不活性ガス雰囲気で行われることから、使用する高圧容器の高さで制限されることになる。前述の一般的に用いられる石英ルツボを用いて、直径65〜80mmのGaP単結晶を製造するためには、黒鉛ヒータ全体の高さは、228〜232mmであることが望ましい。 The overall height of the graphite heater can be changed as necessary. However, the GaP single crystal production apparatus by the LEC method is composed of a high-pressure vessel that can withstand a pressure of about 100 atm. Usually, the production of GaP single crystal is performed in an inert gas atmosphere such as nitrogen or argon at 50 atm. It will be limited by the height of the high-pressure vessel used. In order to produce a GaP single crystal having a diameter of 65 to 80 mm using the above-described generally used quartz crucible, the overall height of the graphite heater is preferably 228 to 232 mm.
(実施例1)
図2に断面図を示した黒鉛ヒータ(3)を用いた。黒鉛ヒータ全体の高さ(T)を230mm±2mm、スリット部(34)の下端から下段円筒部(32)の下端までの鉛直方向の長さ(F1)を73mm、下段円筒部の高さ(S1)を38mmとした。すなわち、F1はTに対して31.5〜32%であり、S1はTに対して16〜17%である。
(Example 1)
The graphite heater (3) whose sectional view was shown in FIG. 2 was used. The total height (T) of the graphite heater is 230 mm ± 2 mm, the vertical length (F1) from the lower end of the slit portion (34) to the lower end of the lower cylindrical portion (32) is 73 mm, and the height of the lower cylindrical portion ( S1) was 38 mm. That is, F1 is 31.5 to 32% with respect to T, and S1 is 16 to 17% with respect to T.
図1に断面図を示したGaP単結晶製造装置を用いて、通常のLEC法で直径65〜80mmのGaP単結晶の結晶育成を3回、行った。 Crystal growth of a GaP single crystal having a diameter of 65 to 80 mm was performed three times by a normal LEC method using the GaP single crystal manufacturing apparatus whose sectional view is shown in FIG.
その結果、平均質量1860gの単結晶(6)が得られ、リネージ不良および多結晶化不良発生率は9%であった。また、単結晶育成中の固液界面形状の目安となる単結晶インゴットの底部は、周囲に対して中央が5〜9mm凸の形状であった。 As a result, a single crystal (6) having an average mass of 1860 g was obtained, and the incidence of defective lineage and defective polycrystallization was 9%. Moreover, the bottom part of the single crystal ingot which becomes a standard of the solid-liquid interface shape during the growth of the single crystal had a shape with a center of 5 to 9 mm with respect to the periphery.
(実施例2)
スリットの下端から下段円筒部の下端までの鉛直方向高低差(F1)を83mmとした以外は、実施例1と同様にして、結晶育成を4回、行った。なお、F1はTに対して35〜36%であった。
(Example 2)
Crystal growth was performed four times in the same manner as in Example 1 except that the vertical height difference (F1) from the lower end of the slit to the lower end of the lower cylindrical portion was 83 mm. In addition, F1 was 35 to 36% with respect to T.
その結果、平均質量1860gの単結晶(6)が得られ、リネージ不良および多結晶化不良発生率は0%であった。また、単結晶育成中の固液界面形状の目安となる単結晶インゴットの底部は、周囲に対して中央が6〜7mm凸の形状であった。 As a result, a single crystal (6) having an average mass of 1860 g was obtained, and the incidence of defective lineage and defective crystallization was 0%. In addition, the bottom of the single crystal ingot, which is a measure of the solid-liquid interface shape during single crystal growth, had a shape with a center of 6 to 7 mm with respect to the periphery.
(実施例3)
下段円筒部の高さ(S1)を28mmとした以外は、実施例1と同様にして、結晶育成を2回、行った。なお、S1はTに対して12%であった。
(Example 3)
Crystal growth was performed twice in the same manner as in Example 1 except that the height (S1) of the lower cylindrical portion was 28 mm. S1 was 12% with respect to T.
その結果、平均質量1860gの単結晶(6)が得られ、リネージ不良および多結晶化不良発生率は0%であった。また、単結晶育成中の固液界面形状の目安となる単結晶インゴットの底部は、周囲に対して中央が5〜7mm凸の形状であった。 As a result, a single crystal (6) having an average mass of 1860 g was obtained, and the incidence of defective lineage and defective crystallization was 0%. In addition, the bottom of the single crystal ingot, which is a measure of the solid-liquid interface shape during single crystal growth, had a shape with a center protruding 5 to 7 mm from the periphery.
(比較例1)
図4に断面図を示した黒鉛ヒータ(3a)を用いた。下段円筒部の高さ(S2)を49.5mmとした以外は、実施例1と同様にして、結晶育成を12回、行った。なお、S2はTに対して21〜22%であった。
(Comparative Example 1)
The graphite heater (3a) whose sectional view was shown in FIG. 4 was used. Crystal growth was carried out 12 times in the same manner as in Example 1 except that the height (S2) of the lower cylindrical portion was 49.5 mm. In addition, S2 was 21-22% with respect to T.
その結果、平均質量1860gの単結晶(6)が得られ、リネージ不良および多結晶化不良発生率は36%であった。また、単結晶育成中の固液界面形状の目安となる単結晶インゴットの底部は、周囲に対して中央が2〜4mm凸の形状であった。 As a result, a single crystal (6) having an average mass of 1860 g was obtained, and the incidence of defective lineage and defective crystallization was 36%. In addition, the bottom of the single crystal ingot, which is a measure of the solid-liquid interface shape during single crystal growth, had a shape with a center of 2 to 4 mm with respect to the periphery.
上記実施例および比較例の結果を表1にまとめて示す。表1の結果より、本発明に係る実施例は、比較例に対して、リネージおよび多結晶化不良の発生が著しく低減している。
1 高圧容器
2 石英ルツボ
3,3a 黒鉛ヒータ
31,31a 上段円筒部
32,32a 下段円筒部
34,34a スリット部
4 封止剤
5 GaP融液
6 GaP単結晶
7 種結晶
8 引上げシャフト
9 石英キャップ
10 保温筒
11 押上げシャフト
T 黒鉛ヒータ全体の高さ
F1、F2 スリットの下端から下段円筒部の下端までの鉛直方向高低差
S1、S2 下段円筒部の高さ
DESCRIPTION OF SYMBOLS 1
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003391946A JP4193681B2 (en) | 2003-11-21 | 2003-11-21 | Gallium phosphide single crystal production equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003391946A JP4193681B2 (en) | 2003-11-21 | 2003-11-21 | Gallium phosphide single crystal production equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005154166A JP2005154166A (en) | 2005-06-16 |
| JP4193681B2 true JP4193681B2 (en) | 2008-12-10 |
Family
ID=34718808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003391946A Expired - Fee Related JP4193681B2 (en) | 2003-11-21 | 2003-11-21 | Gallium phosphide single crystal production equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4193681B2 (en) |
-
2003
- 2003-11-21 JP JP2003391946A patent/JP4193681B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005154166A (en) | 2005-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5768785B2 (en) | Indium phosphide substrate and indium phosphide crystal | |
| US10526721B2 (en) | Method for growing β-GA2O3-based single crystal | |
| CN108823636A (en) | Monocrystalline silicon growing device and monocrystalline silicon growing method | |
| EP2933359B1 (en) | Method for growing a beta-ga2o3-based single crystal | |
| KR20180101586A (en) | Manufacturing method of silicon single crystal | |
| US20100127354A1 (en) | Silicon single crystal and method for growing thereof, and silicon wafer and method for manufacturing thereof | |
| JP4844428B2 (en) | Method for producing sapphire single crystal | |
| US20060191468A1 (en) | Process for producing single crystal | |
| JP4193681B2 (en) | Gallium phosphide single crystal production equipment | |
| CN102465344B (en) | The manufacture method of GaAs wafer and GaAs wafer | |
| JP4178989B2 (en) | III-V compound semiconductor wafer manufacturing method | |
| JPH11116373A (en) | Compound semiconductor single crystal of low dislocation density, its production and apparatus for producing the same | |
| CN110284183B (en) | ScAlMgO4Single crystal substrate and method for producing same | |
| JP5172881B2 (en) | Compound semiconductor single crystal manufacturing apparatus and manufacturing method thereof | |
| JP2002274995A (en) | Method for producing silicon carbide single crystal ingot | |
| JP7554215B2 (en) | Indium phosphide substrates and semiconductor epitaxial wafers | |
| JP2010132510A (en) | Method for producing silicon carbide single crystal | |
| JP2855408B2 (en) | Single crystal growth equipment | |
| KR100635428B1 (en) | Si addition gallium arsenide single crystal substrate | |
| KR101681129B1 (en) | Method for growing silicon single crystal ingot | |
| JP2003192498A (en) | Gallium phosphide single crystal manufacturing method | |
| JP2016169112A (en) | Method for producing sapphire single crystal | |
| JP2005047797A (en) | InP SINGLE CRYSTAL, GaAs SINGLE CRYSTAL, AND METHOD FOR PRODUCING THEM | |
| JP2005132717A (en) | Compound semiconductor single crystal and its manufacturing method | |
| JPS6389497A (en) | Production of silicon-added gallium arsenic single crystal |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20051101 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20080516 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20080520 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20080718 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20080902 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20080915 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111003 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111003 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121003 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131003 Year of fee payment: 5 |
|
| LAPS | Cancellation because of no payment of annual fees |