JP4193982B2 - Heating element laminate and parts using the heating element laminate - Google Patents

Description

The present invention uses a heating element laminate material in which a conductive plate having excellent thermal conductivity and conductivity and a heating plate capable of generating required heat energy are laminated one by one, and a heating element laminate material. Related to parts.

  In recent years, development of a non-invasive DDS (drug delivery system) that does not use swallowing drugs (oral medication) or injection has been promoted as a method for supplying drugs to living bodies and the like. For example, in patients with diabetes, there are many patients who have to take insulin injections every day, and they feel a little painful, and their mental and physical burden is never light. In such a background, a noninvasive supply method by transdermal absorption has been proposed. Patent Document 1 discloses a method for joining metal plates without applying excessive heat or pressure. Patent Document 2 discloses a method for forming a metal thin film on a polymer film, or a metal thin film. And a method of laminating a metal foil is disclosed.

Prior art document information relating to the present application includes the following.
JP-A-1-224184 Japanese Patent Laid-Open No. 2002-113811

  The present invention is applied to a heating element laminating material in which a conductive plate having excellent thermal conductivity and conductivity and a heating plate for generating required thermal energy are laminated one by one, and transdermal absorption of drugs, etc. It is an object of the present invention to provide a component using a heat-generating laminate that can be produced.

The heating element laminate of the present invention as a first solution to the above problems is a conductive plate having a specific resistance of 1 to 20 μΩ · cm at 20 ° C. and a specific resistance of 21 to 300 μΩ · cm at 20 ° C., And a heating element laminate in which at least one heating plate made of a copper-manganese alloy, nickel-phosphorus alloy, nickel-boron-phosphorus alloy, or iron-carbon alloy is laminated. At least one joining surface of the laminated material is configured to be joined by pressure welding. Alternatively, the specific resistance is a conductive plate of 1 to 20 μΩ · cm at 20 ° C., and the specific resistance is 21 to 300 μΩ · cm at 20 ° C., and a copper-manganese alloy, nickel-phosphorus alloy, nickel-boron A heating element laminate in which at least one heating plate made of a phosphorus alloy or an iron-carbon alloy is laminated, and at least one joint surface of the heating element laminate is made of a conductive plate and a heating plate After each surface to be bonded is activated, the conductive plate and the heat generating plate are brought into contact with each other so that the activated surfaces face each other, and are laminated and bonded. Preferably, the heating element laminate has a two-layer structure composed of a conductive plate and a heating plate. Alternatively, the conductive plate is made of a copper plate.

As a second solution to the above problem, the component of the present invention is configured to use the heating element laminate according to claim 1 or 2 . Preferably, the component has a three-layer structure including a support plate, a conductive plate, and a heat generating plate. Or it was set as the structure which forms the heat-emitting part in at least one place of the said components. More preferably, the component is adapted to be used for transdermal or transmucosal absorption of drugs.

  Such heating element laminates and components can be suitably used for percutaneous absorption, and there are the following uses. As a first application, it can be used to maintain the drug at a suitable temperature so that the transdermal and transmucosal absorption efficiency of the drug is optimized by warming the drug, skin, and mucous membrane by the heat generating part. As a second application, it can serve as an electrode in the iontophoresis method. Furthermore, as a third application, in order to remove at least a part of the stratum corneum as a barrier against percutaneous absorption, the exothermic part can be burned out to facilitate the peeling treatment. In particular, when the heat generating portion is formed of a stainless alloy, there is no problem even if it directly contacts the skin. In addition, what this stainless alloy reduced the element harmful | toxic to human bodies, such as nickel, is suitable for medical use. In addition, a circuit for voltage control and current control as an electrode in temperature control at the heat generation part or an ion introduction method is formed on a part of the heating element laminated material or part of the present invention, and a control IC or a control part is mounted. Thus, it is possible to obtain a sustained and appropriate dosing effect.

  Hereinafter, embodiments of the present invention will be described. FIG. 1 is a schematic cross-sectional view showing an embodiment of a heating element laminate 20 of the present invention, showing an example in which a conductive plate 26 and a heating plate 28 are laminated and joined. FIG. 2 is a schematic sectional view showing an embodiment of the component 30 of the present invention, and shows an example in which the support plate 24, the conductive plate 26, and the heat generating plate 28 are laminated and joined. The three-layer component can adopt not only the support plate 24-conductive plate 26-heat generating plate 28 structure but also the support plate 24-heat generating plate 28-conductive plate 26 structure. Heat generating plate 28-conductive plate 26-support plate 24-conductive plate 26-heat generating plate 28 structure and conductive plate 26-heat generating plate 28-support plate 24- It is also possible to adopt a five-layer structure such as a conductive plate 26-heat generating plate 28 structure.

  The material of the conductive plate 26 is not particularly limited as long as it is a material that can produce a heating element laminate and has excellent conductivity, and can be appropriately selected depending on the use of the heating element laminate. . For example, a metal having excellent thermal conductivity and conductivity that is solid at room temperature (for example, Al, Cu, Ag, Pt, Au, etc.) or an alloy having excellent conductivity including at least one of these metals ( For example, an alloy specified in JIS) can be applied. The electrical conductivity is preferably in the range of 1 to 20 μΩ · cm at 20 ° C., for example. If the application of the heating element laminate material is a percutaneous absorption application or the like, the conductive plate 26 includes Cu, Al, etc., which are metals having excellent thermal conductivity and conductivity, and at least one of these metals. An alloy having excellent conductivity can be used. That is, a copper plate, an aluminum plate, etc. can be applied as the conductive plate 26. As a copper plate, in addition to Cu, oxygen-free copper specified in JIS, tough pitch copper, phosphor bronze, brass, copper-beryllium alloy (for example, an alloy of 2 wt. As an aluminum plate such as an alloy (for example, an alloy of 3 to 5% by weight of silver and the balance being copper), aluminum alloy plates such as 1000 series and 3000 series defined in JIS can be applied in addition to Al.

  The material of the heating plate 28 is not particularly limited as long as it is a material capable of producing a heating element laminate and capable of generating the required thermal energy, and is appropriately selected depending on the use of the heating element laminate. Can do. For example, when Joule heat is used, a metal or alloy that is solid at room temperature and has a required specific resistance (for example, an alloy specified in JIS) can be applied. The specific resistance is, for example, 21 to 300 μΩ · cm at 20 ° C. Preferably, it is 21-100 microhm * cm at 20 degreeC. If the heating element laminate is used for transdermal absorption or the like, a resistance alloy having a required specific resistance capable of forming a resistance portion in the heating portion pattern can be applied. Examples of resistance alloys include copper-manganese alloys (eg, manganese 12-15% by weight, nickel 2-4% by weight, balance of copper, etc.), copper-nickel alloys (eg, copper 55% by weight, nickel 45). An alloy comprising, for example, 80% by weight of nickel, an alloy comprising 20% by weight of chromium, etc., a nickel-phosphorous alloy (for example, 1-20% by weight of phosphorus, the balance being nickel) Alloys), nickel-boron-phosphorous alloys (for example, boron 2% by weight, phosphorus 8-16% by weight, the balance being nickel, etc.), iron-chromium alloys (for example, chromium 20% by weight, aluminum 3% by weight) %, The balance being iron alloy, etc.), iron-nickel alloy, iron-carbon alloy, stainless steel alloy and the like can be applied. In the case of direct contact with the skin, a stainless alloy or the like is preferable.

  The thickness of the conductive plate 26 and the heat generating plate 28 is not particularly limited as long as the heat generating member laminate can be manufactured, and can be appropriately selected and used depending on the use of the heat generating member laminate. For example, it is preferable that it is 1-1000 micrometers. When the conductive plate or the heat generating plate is made of a plate material such as a foil, if it is less than 1 μm, it is difficult to manufacture it as a conductive plate or a heat generating plate, and if it exceeds 1000 μm, it is difficult to manufacture it as a heat generating member laminate. More preferably, it is 10-500 micrometers. The conductive plate and the heat generating plate may be a plate material such as electrolytic foil or rolled foil, or may be a laminate of film materials by plating or vapor deposition.

  The material of the support plate 24 is not particularly limited as long as it is a material capable of manufacturing a part using a heating element laminate and has excellent insulation and thermal conductivity, and the heating element lamination is used. It can be appropriately selected depending on the use of the part. For example, organic polymer substances such as plastics and mixtures of powders and fibers mixed with plastics can be applied. For application to transdermal absorption, polyimide, polyetherimide, polyethylene terephthalate, etc. Aromatic polyamides such as polyester and nylon, liquid crystal polymers (LCP, Liquid Crystal Polymer), and the like can be used. Examples of the plastic include acrylic resin, amino resin (melamine resin, urea resin, benzoguanamine resin, etc.), allyl resin, alkyd resin, urethane resin, liquid crystal polymer, EEA resin (Ethylene Ethylacrylate resin), AAS resin (Acrylonitrile Acrylate Styrene resin) ), ABS resin (Acrylonitrile Butadiene Styrene resin), ACS resin (Acrylnitrile Chlorinated polyethylene Styrene resin), AS resin (Acrylonitrile Styrene resin), ionomer resin, ethylene polytetrafluoroethylene copolymer, epoxy resin, silicon resin, styrene butadiene resin , Phenol resin, fluorinated ethylene propylene, fluorine resin, polyacetal, polyarylate, polyamide (6 nylon, 11 nylon, 12 nylon, 66 nylon, 610 nylon, 612 nylon, etc.), poly Doimide, polyimide, polyetherimide, polyetheretherketone, polyethersulfone, polyester (polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polycyclohexine dimer terephthalate, polytrimethylene terephthalate, polytrimethylene naphthalate, etc.) Polyolefin (polyethylene, polypropylene, etc.), polycarbonate, polychlorotrifluoroethylene, polysulfone, polystyrene, polyphenylene sulfide, polybutadiene, polybutene, polymethylpentene and the like may be used.

  The thickness of the support plate 24 can be appropriately selected depending on the application of the component using the heating element laminate. For example, it is 1-1000 micrometers. When the thickness is less than 1 μm, it is difficult to produce the support plate, and when it exceeds 1000 μm, the plate becomes too heavy. For example, if the support plate is used for percutaneous absorption, the range of 3 to 300 μm is preferable. If it is less than 3 μm, the mechanical strength is poor, and if it exceeds 300 μm, the flexibility is poor. Preferably, it is 10-150 micrometers. More preferably, it is 20-75 micrometers. In addition, an adhesive or the like can be used for the bonding between the support plate and the heating element laminate, and the support plate and the heating element laminate can be laminated by heat fusion.

  A heating element laminated material is a laminate of a plurality of conductive plates and heating plates, which can be joined by hot rolling or cold rolling at a high rolling rate, and can be cold rolled or annealed. To obtain the required plate thickness. In addition, there is a method in which a conductive plate or a heat generating plate having a predetermined thickness is subjected to activation treatment and laminated and bonded, and the activated bonding method will be described below. When the following activated bonding method is used, the residual stress can be suppressed, so the annealing process can be omitted, and the formation of an unfavorable alloy layer at the bonded portion can be suppressed. High-precision processing is possible without reducing processing performance in processing and etching processing.

  A method for manufacturing the heating element laminate 20 shown in FIG. 1 by the activation bonding method will be described. As shown in FIG. 4, in the vacuum chamber 52, an activation processing device 70 activates the surface to be joined to the conductive plate 26 of the heat generating plate 28 installed on the rewinding reel 62. Similarly, the surface of the conductive plate 26 installed on the rewind reel 64 to be joined to the heat generating plate 28 is activated by the activation processing device 80. By this activation treatment, foreign compounds such as dust and dirt attached to the surface, and unnecessary compounds such as oxides and nitrides can be removed.

The activation process is performed as follows. That is, the conductive plate 26 and the heat generating plate 28 loaded in the vacuum chamber 52 are brought into contact with one electrode A which is grounded, and between the other electrode B which is insulated and supported, 10 to 1 × 10 ^{− In} an extremely low pressure inert gas atmosphere of ³ Pa, an AC of 1 to 50 MHz is applied to cause glow discharge, and a conductive plate 26 and a heating plate 28 that are in contact with the electrode A exposed in the plasma generated by the glow discharge. Sputter etching is performed so that the area of each of these is effectively 1/3 or less of the area of the electrode B. As the inert gas, argon, neon, xenon, krypton, or a mixture containing these can be used. Argon is preferable. If the inert gas pressure is less than 1 × 10 ⁻³ Pa, stable glow discharge is difficult to perform and high-speed etching is difficult, and if it exceeds 10 Pa, the activation treatment efficiency decreases. If the alternating current applied is less than 1 MHz, it is difficult to maintain a stable glow discharge, and continuous etching is difficult, and if it exceeds 50 MHz, oscillation tends to occur and the power supply system becomes complicated, which is not preferable. In order to etch efficiently, it is necessary to make each area of the conductive plate 26 and the heat generating plate 28 in contact with the electrode A smaller than the area of the electrode B. It becomes possible to etch with efficiency.

  Thereafter, the activated conductive plate 26 and heat generating plate 28 are laminated and joined. Laminate bonding is achieved by performing cold pressure welding with the overlapping pressure welding unit 60 by bringing the conductive plate 26 and the heat generating plate 28 into contact with each other so that the activated surfaces face each other. In this case, the lamination bonding can be performed at a low temperature, and adverse effects such as a change in structure and formation of an alloy layer in the conductive plate 26, the heat generating plate 28, and the bonded portion can be reduced or eliminated. When T is the temperature (° C.) of the conductive plate and the heat generating plate, a good pressure contact state can be obtained at 0 ° C. <T ≦ 300 ° C. If the temperature is 0 ° C. or lower, a special cooling device is required, and if it exceeds 300 ° C., adverse effects such as a change in structure occur. The rolling rate R (%) is preferably 0.01% ≦ R ≦ 30%. If it is less than 0.01%, sufficient bonding strength cannot be obtained, and if it exceeds 30%, deformation and residual stress increase, which is not preferable in terms of processing accuracy. More preferably, 0.1% ≦ R ≦ 3%.

  Thus, by carrying out lamination | stacking joining, the heat generating body laminated material 20 which has required layer thickness can be formed, and it is wound up by the winding roll 66. FIG. Further, the heating element laminate 20 shown in FIG. 1 can be manufactured by cutting it into a predetermined size if necessary. Further, the heating element laminate 20 manufactured in this way may be subjected to heat treatment for removing or reducing the residual stress as long as the joint alloy layer does not cause a problem if necessary. In addition to conductive plate-heat generating plate bonding, conductive plate-conductive plate bonding and heat generating plate-heat generating plate bonding are also possible.

  In addition, a batch process can be used for manufacture of a heat generating body laminated material. That is, a plurality of conductive plates or heat generating plates that have been cut into a predetermined size in the vacuum chamber are loaded and transported to the activation processing apparatus so that the surface to be processed at an appropriate position such as vertical or horizontal is opposed or If the device that holds the plate material of the conductive plate or heat generating plate also serves as a pressure welding device, it is installed or gripped in a juxtaposed state, etc. When the device for holding the conductive plate or the heat generating plate does not serve as a pressure welding device, it is achieved by conveying the pressure plate to a pressure welding device such as a press device to perform pressure welding. The activation treatment is preferably performed between the conductive plate and the heating plate as one electrode A that is insulated and supported, and the other electrode B that is grounded.

  A heating element laminate having a structure of three or more layers can be manufactured by using a heating element laminate having a structure of two or more layers instead of the conductive plate 26 and / or the heating plate 28 in the above description. In addition to the conductive plate-heat generating plate-conductive plate structure, the heat generating plate-conductive plate-heat generating plate structure and the like can be appropriately manufactured. Furthermore, by using a plurality of layers of heat generating member laminates in place of the conductive plate 26 and the heat generating plate 28, a multilayer heat generating member laminate can be manufactured. Further, instead of the conductive plate 26 and the heat generating plate 28, a laminated material obtained by laminating a film by plating or vapor deposition on the plate material can be used. Further, a film formed by plating or vapor deposition may be laminated on the heating element laminate. For example, solder plating.

  The component of the present invention is made of a heating element laminate formed by laminating a plurality of conductive plates and heating plates. The heating element laminate is laminated with a support plate, etc., and the heating element laminate is etched. Etching, etc., coating or fixing with resin, etc., heating element laminate material laminated to a substrate made of polymer, metal, alloy, etc. using an adhesive, etc., further etching It has been subjected to processing such as processing. For example, there are laminated parts as shown in FIG. 2, and parts subjected to etching as shown in FIG.

  3 is obtained by laminating a heating element laminate 20 having a two-layer structure of a conductive plate 26 and a heating plate 28 as shown in FIG. 1 on a support plate 24 by heat fusion or the like. And it can manufacture by giving an etching process etc. to a heat generating body laminated material part. Alternatively, the support plate 24 may be laminated by first etching the heating element laminate 20. At this time, by etching, the heating element laminate material is appropriately formed with a pattern of only the heating plate, a pattern only of the conduction plate, and a lamination pattern of the conduction plate and the heating plate, depending on the use of the heating element laminate material and parts. can do. By appropriately combining these patterns, a conductive wiring portion and a heating portion due to Joule heat can be formed. Further, since the heat generating portion can be used as a resistance portion, an electric circuit that can reduce the number of resistance components can be formed.

  Such a heating element laminate or component can be suitably used for transdermal absorption. The following uses etc. exist as a transdermal absorption use. First, as a first use, the drug, skin, and mucous membrane can be warmed by a heat generating part to maintain the drug at a suitable temperature so that the transdermal and transmucosal absorption efficiency is optimized. Next, as a second application, it can serve as an electrode in the iontophoresis method. Furthermore, as a third application, in order to remove at least a part of the stratum corneum as a barrier against percutaneous absorption, the exothermic part can be burned out to facilitate the peeling treatment. In particular, when the heat generating portion is formed of a stainless alloy, there is no problem even if it directly contacts the skin. In addition, what this stainless alloy reduced the element harmful | toxic to human bodies, such as nickel, is suitable for medical use. In addition, a circuit for voltage control and current control as an electrode in temperature control at the heat generation part or an ion introduction method is formed on a part of the heating element laminated material or part of the present invention, and a control IC or a control part is mounted. Thus, it is possible to obtain a sustained and appropriate dosing effect.

  Embodiments will be described below with reference to the drawings. A copper foil having a thickness of 50 μm was used as the conductive plate 26, and a stainless alloy foil having a thickness of 10 μm was used as the heating plate 28. Copper foil and stainless alloy foil were set in the heating element laminate manufacturing apparatus 50, and activated by the sputter etching method in the activation processing units 70 and 80 in the vacuum chamber 52, respectively. Next, using the press contact unit 60, these activated copper foils and stainless steel alloy foils were stacked and joined by pressing the activated surfaces together to produce the heating element laminate 20. Further, this heating element laminate 20 was etched to laminate a polymer film support plate 24 to produce a component.

  As described above, the heating element laminate of the present invention is formed by laminating at least one conductive plate and a heating plate, and the component of the present invention is formed using the heating element laminate. For this reason, application to a percutaneous absorption use etc. is also suitable.

It is a schematic sectional drawing which shows one Embodiment of the heat generating body laminated material of this invention. It is a schematic sectional drawing which shows one Embodiment of the components of this invention. It is a schematic sectional drawing which shows other one Embodiment of the components of this invention. It is a schematic sectional drawing which shows one Embodiment of the apparatus used for manufacture of the heat generating body laminated material of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 20 Heat generating body laminated material 24 Support plate 26 Conductive plate 28 Heat generating plate 50 Heat generating body laminated material manufacturing apparatus 52 Vacuum tank 60 Pressure contact unit 62 Rewinding reel 64 Rewinding reel 66 Winding roll 70 Activation processing apparatus 72 Electrode roll 74 Electrode 80 Activation treatment device 82 Electrode roll 84 Electrode A Electrode A
B Electrode B

Claims (8)

As the specific resistance, the conductive plate of 1~20μΩ · cm at 20 ° C., as the specific resistance, a 21~300μΩ · cm at 20 ° C., and copper - manganese alloy, a nickel - phosphorus alloy, a nickel - boron - phosphorous A heating element laminated material obtained by laminating at least one heating plate made of an alloy or an iron-carbon alloy , wherein at least one joining surface of the heating element laminate is joined by pressure welding. Heating element laminate material. As the specific resistance, the conductive plate of 1~20μΩ · cm at 20 ° C., as the specific resistance, a 21~300μΩ · cm at 20 ° C., and copper - manganese alloy, a nickel - phosphorus alloy, a nickel - boron - phosphorous A heating element laminate in which at least one heating plate made of an alloy or an iron-carbon alloy is laminated, and at least one joining surface of the heating element laminate is bonded to the conductive plate and the heating plate. A heating element laminated material, wherein the conductive plate and the heat generating plate are brought into contact with each other and are laminated and bonded so that the activation processing surfaces face each other after the activation treatment.   The heating element laminate according to claim 1 or 2, wherein the heating element laminate has a two-layer structure including a conductive plate and a heating plate.   The heating element laminate according to any one of claims 1 to 3, wherein the conductive plate is made of a copper plate. A component comprising the heating element laminate according to claim 1 . The heating element laminate according to claim 5 , wherein the component has a three-layer structure including a support plate, a conductive plate, and a heating plate. The component according to claim 5 or 6 , wherein a heat generating portion is formed in at least one portion of the component. The component according to any one of claims 5 to 7 , wherein the component is applied to percutaneous absorption or transmucosal absorption of a drug.

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