JP4195911B2 - Method for forming hetero hard material - Google Patents
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- JP4195911B2 JP4195911B2 JP23430498A JP23430498A JP4195911B2 JP 4195911 B2 JP4195911 B2 JP 4195911B2 JP 23430498 A JP23430498 A JP 23430498A JP 23430498 A JP23430498 A JP 23430498A JP 4195911 B2 JP4195911 B2 JP 4195911B2
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Description
【0001】
【発明の属する技術分野】
本発明は硼素−炭素−窒素、及び炭素−窒素から成るヘテロ系硬質物質の成膜方法に関するものであり、その一つの目的は、高い硬度と耐熱性が必要な摺動材料を提供することである。
【0002】
【従来の技術】
ダイヤモンドやこれと同様な構造を有する等軸晶系窒化硼素(以下、c−BNと記す)は極めて硬く、高性能の研磨剤や切削剤として産業上不可欠の物質となっており、また近年は優れた半導体としての利用が注目されている。ダイヤモンドは最も硬い物質であるが、空気中で燃焼する事実が示すように、高温下では酸化雰囲気で酸化されること、また、鉄系統の材料には浸食されやすいという欠点をもつ。c−BNは、硬度はダイヤモンドの約1/2程度であるが、前記のようなダイヤモンドの有する欠点を持たないのが利点である。近年、このような欠点を克服するための究極の材料として、B−C−N系のヘテロダイヤモンドが火薬を利用した衝撃圧縮法によって合成された(特開平6−316411号)。また、C−N系の硬質物質については、β構造及び立方晶C3N4が、Liuらによって提案され(A. Y. Liu and M. L. Cohen, Science 245, 841 (1989) 及びA. Y. Liu and R. M. Wentzcovitch, Phys. Rev. B50, 10362 (1994) )、PVD法によって原子状の炭素と窒素を基板上にデポジションすることによってその生成が確認された(E. E. Haller, M. L. Cohen, and W. L. Hansen, U. S. Patent 5,110,679 (1992) )。
【0003】
これらの硬質物質は、非常に高価であるので、従来より成膜の研究が積極的に行われてきた。例えば、ダイヤモンドの成膜は、メタン−水素系を原料ガスに用いた高周波CVD法によって達成された。しかし、上述のB−C−N系ヘテロダイヤモンドの成膜は未だ達成されていないし、β構造及び立方晶C3N4についても、基板上に析出した膜状物質の中に電子顕微鏡で観察できる程度の極微小な部分にしか生成が確認されていないのが現状である。
【0004】
【発明が解決しようとする課題】
本発明は、上記の事情に鑑み、ヘテロ系の硬質物質の成膜方法を提供することを目的として成されたものである。
【0005】
【課題を解決するための手段】
本発明者らは、鋭意検討の結果、ヘテロ系硬質物質の種結晶を用いてCVD法及びPVD法での成膜を試みることによって、前記目的を達成することを見出し、この知見に基づいて本発明を完成するに至った。
すなわち、本発明は、基板として、種結晶である立方晶 B − C − N 系ダイヤモンド、立方晶 C − N 系ダイヤモンド、及びβ構造 C 3 N 4 の中から選ばれたヘテロ系硬質物質の微結晶を付着させた基板を用い、原料物質として、アセトニトリル−三塩化硼素、及びアンモニア−水素−メタンの中から選ばれたヘテロ原子から成る原料物質を用いて、CVD処理を行なうことを特徴とする、ヘテロ系硬質物質の成膜方法を提供するものである。
【0006】
以下、本発明を詳細に説明する。
【0007】
本発明のヘテロ系硬質物質とは、B−C−N系ヘテロダイヤモンド、β構造及び立方晶C3N4のことであり、これらの物質は、特開平6−316411号、及び、U.S.Patent5,110,679(1992)においてそれぞれ公開されている。本発明の特徴の一つは、成膜のための種結晶としてこれらの硬質物質の微結晶を用いることである。微結晶は、その一次結晶の大きさが1〜100nmの範囲であるのが良好な成膜を得るのに好ましい。1nm以下の種結晶を用いても成膜は可能であるが、CVD及びPVD条件によっては種結晶の消滅の可能性があるので好ましくない。また、種結晶の大きさが100nm以上では、成膜が不均一となりやすいので好ましくない。次に、基板上に付着させた種結晶ヘテロ系硬質物質の付着率は、基板表面積の1〜10%であることが好ましい。1%以下であると成膜速度が非常に遅くなり、また、10%以上であると成膜速度は早くなるが成膜が不均一となるので好ましくない。さらに、成膜時の基板温度の調整も重要な特徴であり、通常600〜1400℃の範囲でおこなう。600℃以下では、不純物のデポディションが起きやすいので好ましくない。また、1400℃以上では、種結晶の相分離の可能性があるので好ましくない。本発明で用いる種結晶としては、B−C−N系については、例えば、特開平6−316411号によって作られるB−C−N系ヘテロダイヤモンド、C−N系については、α型構造のC3N4を火薬を用いた衝撃圧縮処理によって構造変換して得られる立方晶のC3N4を用いることができる。本発明は、これらの種結晶をあらかじめ付着させた基板上に、CVDおよびPVD処理によって活性化したヘテロ原子から成る原料物質をデポジションすることによって、種結晶と同質の膜状ヘテロ系硬質物質を得る。CVD処理に用いるヘテロ原子から成る原料物質としては、B−C−N系については、アセトニトリル−三塩化硼素、アクリルニトリル−三塩化硼素、四塩化炭素−三塩化硼素−窒素−水素、三塩化硼素−エチレン−アンモニア、メタン−アンモニア−三塩化硼素、ジメチルアミン−ジボラン−塩素、メタン−水素−アンモニア−ジボラン、の組み合わせを、C−N系については、メタン−アンモニア−水素、メタン−窒素−塩素、ピリジン−塩素、の系を好適な例として挙げることができる。これらの組み合わせにおける組成比は、CVD条件によって適宜決められる。また、PVD処理に用いるヘテロ原子から成る原料物質は、B−C−N系については、無定型及び六方晶系の炭窒化硼素、C−N系については無定型及び六方晶系の窒化炭素を好適な例として挙げることができる。無定型及び六方晶系の炭窒化硼素は、例えば、特開平1−252519号に記載の方法で合成することができる。また、無定型の窒化炭素及び六方晶系の窒化炭素は、例えばトリアジン系の高分子物質、ポリメチレンイミン、ポリアミノメチレンイミン、パラシアノゲン、シクロヘキサメチレンテトラミン、ヘキサアザトリフェニレンヘキサカーボンニトリル、CVD法によって容易に生成する種々の窒素含有の炭化物質などを好適な例として挙げることができる。また、本発明で用いるCVD法及びPVD法は、原料物質を活性化するのに十分なエネルギーを発生するものであれば特に限定するものではなく、従来より知られている、熱CVD、高周波CVD、プラズマCVD、microwave plasma assisted CVDなどのCVD法、laser ablation, ion beam sputtering, reactive sputtering, magnetron reactive sputtering, arc discharge, ion beam assisted deposition, electron−cyclotron−resonance plasma vapor deposition, 等のPVD法を用いることができる。
【0008】
【実施例】
以下に、実施例により、本発明をさらに詳細に説明するが、本発明はこれらの例によってなんら限定されるものではない。
【0009】
実施例1
特開平6−316411号に記載の方法に従って立方晶BC2.5Nの粉末を得た。この物質の一次粒子の平均粒径は、約8nmであった。これを種結晶として用いた。基板には、シリコン板(直径30mm、厚み1mm)を用いた。該シリコン基板の表面をc−BN粉末(昭和電工:c−BN,SBN−M no.325/400(B46))で均一に研磨した後、フッ化水素酸の液に1分間浸漬し、蒸留水で洗浄後、風乾した。立方晶BC2.5N粉末をエタノールに分散し、これに上記のシリコン基板を1日浸漬した後、取り出して、100℃で1時間、10~6torrで真空乾燥した。種結晶の基板表面における付着率は約6%であった。この基板を高周波CVD装置(AsTex 5kW)に取り付け、10~4の真空下で1000℃に昇温した後、原料ガスをチャンバーに導入しながら2.45GHz−3kWの出力で高周波デポジションした。チャンバーの圧力は約80torrであった。原料ガスとして、等量のアセトニトリルと三塩化硼素を用いた。ガスはそれぞれ別々の配管から、高周波帯域に導入した。5時間に基板を取り出して分析した。走査型電子顕微鏡(日本電子JSM−6400F)によって、基板の全面が結晶質の物質で被覆されていることが観察された。基板をフッ化水素酸の液に浸して基板から被膜を剥離させ、得られた被膜をX回折装置(理学RINT2500)で測定した結果、種結晶と同一の回折図が得られた。
【0010】
実施例2
トリクロロメラミン1当量とホルマリン2当量から合成した重合物質を、溶媒としてDMSOを用い、脱塩酸剤として3当量のDBUを用い、5時間環流して、黒褐色のトリアジン重合物質を得た。この物質の組成は、窒素:炭素:水素=1:0.83:0.34であった。これを、特開平6−316411号に記載の方法に準じて平面衝撃圧縮装置を用いて衝撃圧縮した。原料物質と銅粉の重量比率は2:98とし、衝撃圧は、約30GPaとした。得られた粉末から銅を30%硝酸で取り除き、さらに、50%過塩素酸を用いて未反応の原料物質を分解除去し、残った粉末をX線回折装置で測定した。回折図から、文献記載(A. Y. Liu, and R. M. Wentzcovitch, Phys. Rev., B50, 10362 (1994) )と同一の立方晶C3N4が得られていることがわかった。この物質の一次粒子の粒径は、約10nmであった。該物質を種結晶として用い、実施例1と同様な操作を行い基板上に析出した被膜を得た。シリコン基板上の種結晶の付着率は、約8%であった。基板温度は、約1000℃であった。原料ガスとして、アンモニア:水素:メタン=1:1:0.125の比率の混合ガスを用いた。チャンバーのガス圧は、約30torrであった。高周波の出力は2.45GHz−3kWとした。成膜した基板を走査型電子顕微鏡(日本電子JSM−6400F)によって観察した結果、基板の全面が結晶質の物質で被覆されていることが観察された。また、成膜した基板をフッ化水素酸の液に浸して基板から被膜を剥離させ、得られた被膜をX回折装置(理学RITN2500)で測定した結果、種結晶と同一の回折図が得られた。
【0011】
【発明の効果】
以上説明したように、本発明によれば基板上にヘテロ系硬質物質膜を形成することができる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for forming a hetero-hard material composed of boron-carbon-nitrogen and carbon-nitrogen, and one object thereof is to provide a sliding material that requires high hardness and heat resistance. is there.
[0002]
[Prior art]
Diamond and equiaxed boron nitride (hereinafter referred to as c-BN) having a similar structure are extremely hard and have become an industrially indispensable material as a high performance abrasive and cutting agent. The use as an excellent semiconductor attracts attention. Diamond is the hardest substance, but as shown by the fact that it burns in air, it has the disadvantages that it is oxidized in an oxidizing atmosphere at high temperatures and that it is easily eroded by ferrous materials. Although c-BN has a hardness of about ½ that of diamond, it is advantageous in that it does not have the disadvantages of diamond as described above. In recent years, as an ultimate material for overcoming such drawbacks, a B—C—N hetero diamond was synthesized by an impact compression method using an explosive (Japanese Patent Laid-Open No. 6-316411). For CN hard materials, β structure and cubic C 3 N 4 were proposed by Liu et al. (AY Liu and ML Cohen, Science 245, 841 (1989) and AY Liu and RM Wentzcovitch, Phys Rev. B50, 10362 (1994)), and its formation was confirmed by depositing atomic carbon and nitrogen on the substrate by the PVD method (EE Haller, ML Cohen, and WL Hansen, US Patent 5,110,679 ( 1992)).
[0003]
Since these hard materials are very expensive, research on film formation has been actively conducted. For example, diamond film formation was achieved by a high-frequency CVD method using a methane-hydrogen system as a source gas. However, the film formation of the above-mentioned B—C—N-based heterodiamond has not yet been achieved, and the β structure and cubic C 3 N 4 can also be observed with an electron microscope in the film-like substance deposited on the substrate. At present, the generation is confirmed only in a very small portion.
[0004]
[Problems to be solved by the invention]
In view of the above circumstances, the present invention has been made with the object of providing a method for forming a hetero hard material.
[0005]
[Means for Solving the Problems]
As a result of intensive studies, the present inventors have found that the above object can be achieved by attempting to form a film by a CVD method and a PVD method using a seed crystal of a hetero hard material. The invention has been completed.
That is, the present invention provides a microscopic material of a hetero hard material selected from among cubic B — C — N diamond, cubic C — N diamond, and β-structure C 3 N 4 as seed crystals. A CVD process is performed using a substrate on which crystals are attached and using a source material composed of heteroatoms selected from acetonitrile-boron trichloride and ammonia-hydrogen-methane as a source material. The present invention provides a method for forming a hetero hard material.
[0006]
Hereinafter, the present invention will be described in detail.
[0007]
The hetero hard material of the present invention is a B—C—N hetero diamond, β structure and cubic C 3 N 4 , and these materials are disclosed in JP-A-6-316411 and US Pat. S. Patent 5, 110, 679 (1992). One of the features of the present invention is that microcrystals of these hard substances are used as seed crystals for film formation. In order to obtain good film formation, it is preferable that the size of the primary crystal is in the range of 1 to 100 nm. Although a film can be formed using a seed crystal of 1 nm or less, depending on the CVD and PVD conditions, the seed crystal may disappear, which is not preferable. Further, if the seed crystal size is 100 nm or more, the film formation tends to be non-uniform, which is not preferable. Next, the adhesion rate of the seed crystal hetero hard material deposited on the substrate is preferably 1 to 10% of the substrate surface area. If it is 1% or less, the film formation rate becomes very slow, and if it is 10% or more, the film formation rate becomes high, but the film formation becomes non-uniform. Furthermore, the adjustment of the substrate temperature during film formation is also an important feature, and is usually performed in the range of 600 to 1400 ° C. When the temperature is 600 ° C. or lower, impurity deposition tends to occur, which is not preferable. Further, if it is 1400 ° C. or higher, there is a possibility of seed crystal phase separation, which is not preferable. As the seed crystal used in the present invention, for the B—C—N system, for example, a B—C—N hetero diamond produced by JP-A-6-316411, and for the C—N system, an α-type C Cubic C 3 N 4 obtained by structural transformation of 3 N 4 by impact compression treatment using explosives can be used. In the present invention, a film-like hetero hard material having the same quality as that of the seed crystal is formed by depositing a raw material consisting of hetero atoms activated by CVD and PVD treatment on a substrate on which these seed crystals are previously attached. obtain. As the source material consisting of heteroatoms used for the CVD process, for BCN, acetonitrile-boron trichloride, acrylonitrile-boron trichloride, carbon tetrachloride-boron trichloride-nitrogen-hydrogen, boron trichloride A combination of ethylene-ammonia, methane-ammonia-boron trichloride, dimethylamine-diborane-chlorine, methane-hydrogen-ammonia-diborane, and methane-ammonia-hydrogen, methane-nitrogen-chlorine for the CN system. , Pyridine-chlorine system can be mentioned as a suitable example. The composition ratio in these combinations is appropriately determined depending on the CVD conditions. The source material consisting of heteroatoms used for PVD treatment is amorphous and hexagonal boron carbonitride for the B—C—N system, and amorphous and hexagonal carbon nitride for the C—N system. It can be mentioned as a suitable example. Amorphous and hexagonal boron carbonitride can be synthesized, for example, by the method described in JP-A-1-252519. In addition, amorphous carbon nitride and hexagonal carbon nitride can be easily obtained by, for example, triazine-based polymer material, polymethyleneimine, polyaminomethyleneimine, paracyanogen, cyclohexamethylenetetramine, hexaazatriphenylenehexacarbonnitrile, CVD method. Various examples of nitrogen-containing carbonized substances produced in the above can be mentioned as suitable examples. Further, the CVD method and the PVD method used in the present invention are not particularly limited as long as they generate energy sufficient to activate the raw material, and are conventionally known thermal CVD and high frequency CVD. , Plasma CVD, CVD methods such as microwave plasma assisted CVD, PVD methods such as laser ablation, ion beam sputtering, reactive sputtering, magnetron reactive sputtering, arc discharge, ion beam assisted deposition, electron-cyclotron-resonance plasma vapor deposition, etc. be able to.
[0008]
【Example】
Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to these examples.
[0009]
Example 1
According to the method described in JP-A-6-316411, cubic BC 2.5 N powder was obtained. The average primary particle size of this material was about 8 nm. This was used as a seed crystal. A silicon plate (diameter 30 mm, thickness 1 mm) was used as the substrate. The surface of the silicon substrate was uniformly polished with c-BN powder (Showa Denko: c-BN, SBN-M no. 325/400 (B46)), then immersed in a hydrofluoric acid solution for 1 minute, and distilled. After washing with water, it was air-dried. Cubic BC 2.5 N powder was dispersed in ethanol, and the above silicon substrate was immersed in it for 1 day, then taken out and vacuum-dried at 100 ° C. for 1 hour and 10 to 6 torr. The adhesion rate of the seed crystal on the substrate surface was about 6%. This substrate was attached to a high-frequency CVD apparatus (AsTex 5 kW), heated to 1000 ° C. under a vacuum of 10 to 4 , and then subjected to high-frequency deposition at an output of 2.45 GHz-3 kW while introducing the raw material gas into the chamber. The chamber pressure was about 80 torr. As source gases, equal amounts of acetonitrile and boron trichloride were used. The gases were introduced into the high frequency band from separate pipes. The substrate was taken out and analyzed at 5 hours. It was observed with a scanning electron microscope (JEOL JSM-6400F) that the entire surface of the substrate was covered with a crystalline substance. The substrate was immersed in a hydrofluoric acid solution to peel off the coating from the substrate, and the resulting coating was measured with an X diffractometer (Science RINT 2500). As a result, the same diffraction pattern as that of the seed crystal was obtained.
[0010]
Example 2
A polymer material synthesized from 1 equivalent of trichloromelamine and 2 equivalents of formalin was refluxed for 5 hours using DMSO as a solvent and 3 equivalents of DBU as a dehydrochlorinating agent to obtain a black-brown triazine polymer. The composition of this material was nitrogen: carbon: hydrogen = 1: 0.83: 0.34. This was subjected to impact compression using a plane impact compression device in accordance with the method described in JP-A-6-316411. The weight ratio of the raw material and copper powder was 2:98, and the impact pressure was about 30 GPa. Copper was removed from the obtained powder with 30% nitric acid, and unreacted raw material was decomposed and removed using 50% perchloric acid, and the remaining powder was measured with an X-ray diffractometer. From the diffraction pattern, it was found that the same cubic C 3 N 4 as described in the literature (AY Liu, and RM Wentzcovitch, Phys. Rev., B50, 10362 (1994)) was obtained. The primary particle size of this material was about 10 nm. Using this substance as a seed crystal, the same operation as in Example 1 was performed to obtain a film deposited on the substrate. The adhesion rate of the seed crystal on the silicon substrate was about 8%. The substrate temperature was about 1000 ° C. As the raw material gas, a mixed gas of ammonia: hydrogen: methane = 1: 1: 0.125 was used. The gas pressure in the chamber was about 30 torr. The high frequency output was 2.45 GHz-3 kW. As a result of observing the formed substrate with a scanning electron microscope (JEOL JSM-6400F), it was observed that the entire surface of the substrate was covered with a crystalline substance. In addition, the film was peeled off from the substrate by immersing the film-formed substrate in a hydrofluoric acid solution, and the obtained film was measured with an X diffractometer (Science RITN2500). As a result, the same diffractogram as the seed crystal was obtained. It was.
[0011]
【The invention's effect】
As described above, according to the present invention, a hetero hard material film can be formed on a substrate.
Claims (4)
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| Application Number | Priority Date | Filing Date | Title |
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| JP23430498A JP4195911B2 (en) | 1998-08-20 | 1998-08-20 | Method for forming hetero hard material |
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| JP23430498A JP4195911B2 (en) | 1998-08-20 | 1998-08-20 | Method for forming hetero hard material |
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| JP2000064045A JP2000064045A (en) | 2000-02-29 |
| JP4195911B2 true JP4195911B2 (en) | 2008-12-17 |
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