JP4210357B2 - Semiconductor device frame cutting method and frame cutting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a frame cutting method and a frame cutting apparatus for a semiconductor device used for manufacturing a resin mold type semiconductor device.
[0002]
[Prior art]
FIG. 11 shows a frame body 14 in which a plurality of resin mold portions 12 are provided on a substrate 10 formed in a strip shape. In a resin mold type semiconductor device, after mounting a semiconductor chip on a lead frame or a frame formed like a strip like the substrate 10 shown in FIG. 11, each semiconductor chip is resin molded by a resin molding device. After the resin molding, the semiconductor devices are separated into individual pieces from the strip-shaped substrate.
[0003]
  Recently, a resin film such as a resin substrate or a TAB tape has been used as a substrate of a semiconductor device. In the manufacture of such a semiconductor device, a semiconductor chip is mounted on a substrate formed in a strip shape, After the molding, the substrate is cut along the outer shape of each resin mold part to obtain a semiconductor device product separated into individual pieces.
  The semiconductor device is separated into individual pieces from the substrate 10 by punching using a mold. FIG. 12 shows a conventional method of punching the semiconductor device 20 from the substrate 10 with the die 16 and the punch 18. The substrate 10 is clamped by the die 16 and the punch 18, and the punch 18It is separated into individual pieces by punching out.
[0004]
[Problems to be solved by the invention]
By the way, when the semiconductor device is separated from the frame body 14 as shown in FIG. 11, the distance between the outer surface of the resin mold portion 12 and the punch 18 is set so that the resin mold portion 12 and the punch 18 do not interfere with each other. Leave about 0.2 to 0.3 mm. This is because (1) the pilot pin of the die is inserted into the pilot hole 15 provided in the frame body 14 for positioning, so that a hole position tolerance is generated, and (2) the mold press die for resin molding the frame body 14 is dimensioned. This is because (3) the resin mold part 12 contracts after the frame body 14 is resin-molded, resulting in a contraction difference. The clearance between the resin mold part 12 and the punch is taken to obtain these errors. Must be absorbed.
[0005]
In actuality, the punch and die are designed by measuring the sample of the frame body after resin molding in consideration of the above dimensional difference. However, since semiconductor devices tend to become smaller and smaller, a smaller clearance ( For example, it has come to be required to cut within 0.05 mm from the position of the outline of the resin mold portion. It is impossible to reliably perform such high-accuracy cutting with a conventional cutting device, and there is a problem that the resin mold portion 12 is scraped with a punch 18 during cutting as shown in FIG. Arise.
[0006]
Therefore, the present invention has been made to solve these problems. The semiconductor device can be accurately separated into individual pieces from the frame body after resin molding, and various kinds of frame body cutting devices can be easily used. It is an object of the present invention to provide a frame cutting method and a frame cutting apparatus for a semiconductor device that can be applied to products.
[0007]
  In order to achieve the above object, the present invention comprises the following arrangement.
  That is, a frame body in which a plurality of resin mold parts are formed at predetermined intervals on a substrate is cut into a mold for cutting.Cutting with a dieA frame cutting method for a semiconductor device in which a pitch is fed while being aligned with a processing position, and the substrate is cut along the outer surface of the resin mold portion to form a semiconductor device in a piece.Because,The frame body is formed with a plurality of resin mold portions in one row, and the frame body is cut into individual pieces for each row of the resin mold portions in the row by a mold. In a method of forming a device,In the processing planeDie set positionAnd the frame bodyEach time the pitch is fed, only one resin mold part in each rowPlane position andTotalMeasureBased on the measurement results,During the pitch feed,The resin mold portion is cut by moving the frame body to a position that coincides with the processing position.
MaFurther, the planar arrangement position of the resin mold partMeasurement ofBy performing the cutting at a position one pitch before the frame body is pitch-fed to the processing position, it is possible to perform cutting with higher accuracy.
[0008]
  In addition, the frame body in which a plurality of resin mold parts are formed on the substrate at predetermined intervals is aligned with the processing position of the punching and die unit for cutting, and is fed along the outer surface of the resin mold part. In a semiconductor device frame cutting device that cuts a substrate and forms it into a piece of semiconductor device,The punch / die unit is provided so as to be separable from the frame body in which a plurality of resin mold portions are formed in one row for each resin mold portion for each row,Of the die in the processing planeSet positionA die position detector for measuring and detectingEach time the frame body is pitch fed, only one resin mold part in each row of the frame bodyA workpiece position detection unit that detects an arrangement position in a processing plane, and the frame body is moved to the processing position based on measurement results of the die position detection unit and the workpiece position detection unit. An arithmetic control unit that calculates the amount of movement in the −Y direction, and an XY conveyance device that moves the frame body to the processing position based on the calculation result of the arithmetic control unit. .
MaThe processed productpositionThe detection unit detects a resin mold portion at a position one pitch before the frame body is pitch-fed to the processing position.
MaIn addition, the identification means for identifying the type of the frame body and the die position detection unitProvidedIdentification means for identifying the type of punch / die unitAnd with,The arithmetic control unit includes: an identification unit for the frame body; and the punch / die unit.Identification meansAnd byThe identified frame body is compared with the punch / die unit to control the supply of the frame body to the processing position.RukoAnd features.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a frame cutting method and a frame cutting apparatus for a semiconductor device according to the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a plan view showing a schematic configuration of an embodiment of a frame cutting device. This frame cutting device accurately measures the position of the resin mold portion 12 on the frame body 14 by image recognition, and based on the measurement result, accurately positions the resin mold portion 12 on the die and cuts it. It is configured.
[0010]
Below, the example which makes the frame body 14 which has the three resin mold parts 12 in the width direction as shown in FIG. 11 to be processed is demonstrated.
In FIG. 1, reference numeral 22 denotes a magazine storage unit that stores the frame body 14, 24 denotes a supply unit that sends out the frame body 14 from the magazine, and 26 denotes a support frame that supports the frame body 14 sent out from the supply unit 24. The support frame 26 is supported by an XY transport device 96 that moves the support frame 26 to an arbitrary position in the XY plane, which is a processing plane, and the support frame 26 is moved by the XY transport device 96. The frame body 14 supported by the support frame 26 is transferred in accordance with the processing position of the mold.
[0011]
The XY transport device 96 includes a motor 28 for moving the Y axis, a motor 30 for moving the X axis, and a joint plate 32 that is connected to the motors 28 and 30 and moves in the XY direction. A guide rail 34 guides the movement of the joint plate 32 in the Y-axis direction. The movement in the X-axis direction is slight, and the motor 30 moves in the Y-axis direction together with the joint plate 32, and the joint plate 32 is slightly moved in the X-axis direction by the motor 30 at the moving position.
The support frame 26 is fixedly supported by the joint plate 32 and is transported to a predetermined position under the control of the XY transport device 96. In FIG. 1, the frame body 14 is pitch-fed in the Y-axis direction from the left side to the right side, and after being gradually cut, the processed frame body 14 is discharged to the right side.
[0012]
Reference numeral 36 denotes a frame take-out device for pulling out the frame body 14 from the magazine and setting it on the support frame 26. Reference numeral 38 denotes a frame discharge device for discharging the frame body 14 that has been punched. The frame body 14 drawn out by the frame discharge device 38 is dropped into the dust chute 40 and discharged.
[0013]
Reference numeral 42 denotes a punching unit for punching a semiconductor device into individual pieces from the frame body 14. Above the punching part 42, a pickup part 44 for picking up the semiconductor device product separated from the frame body 14 into individual pieces is arranged. FIG. 1 shows a state in which the pickup portion 44 is above the punching portion 42. Reference numeral 46 denotes another pickup unit used in combination with the pickup unit 44. In this embodiment, by using these two pickup parts 44 and 46, the semiconductor device product can be carried out efficiently.
[0014]
Reference numeral 48 denotes a guide rail that guides the movement of the pickup units 44 and 46. The pip-up portions 44 and 46 reciprocate in a direction perpendicular to the pitch feed direction of the workpiece 14 and carry the semiconductor device product separated into individual pieces to the product alignment portion 50. Reference numeral 52 denotes a storage unit of a storage tray for storing products.
[0015]
The frame body 14 is supported by the support frame 26 and the image of the resin mold portion 12 is recognized. However, in order to accurately recognize the resin mold portion 12 and transfer it, the frame body 14 is securely attached to the support frame. 26 needs to be supported. FIG. 2 is a plan view of the support frame 26, and FIG. 3 is a side view of the support frame 26 and the punching portion 42. In FIG. 3, 42a is a die bed, 42b is a punch holder, and 42c is a guide post.
[0016]
As shown in FIG. 2, the support frame 26 includes hinge plates 60 a and 60 b that are clamped at a side edge portion of the frame body 14 and a stopper 62 that defines the front end position of the frame body 14 in the longitudinal direction. The hinge plates 60a and 60b are opened by pushing up the push-up plate 64 from below by the air cylinder 63 and projecting from below by the push-up pin 64a. In this state, the frame body 14 is pulled out by the frame take-out device 36 and fed between the hinge plates 60a and 60b and the support frame.
[0017]
When the frame body 14 is set on the support frame 26, the front end of the frame body 14 is brought into contact with the stopper 62, and the side edge of the frame body 14 is brought into contact with the one hinge plate 60a to be positioned. While the frame body 14 is fed in until the frame 62 comes into contact with the stopper 62 by the frame take-out device 36, the frame body 14 is pushed in the width direction by the pusher 66 while being sandwiched between the hinge plates 60 a and 60 b, and the hinge plate 60 a side The frame body 14 can be brought into contact with the frame. If the hinge plates 60a and 60b are closed in this state, the frame body 14 can be supported at a predetermined position of the support frame 26 at all times.
[0018]
The pusher 66 is driven by an air cylinder 68, and the hinge plates 60a and 60b are closed by the urging force of a spring 69 mounted between the hinge plates 60a and 60b and the support frame. Therefore, it is not necessary to replace the support frame 26 even if the width dimension of the frame body 14 changes at the time of product type switching. Bridge portions 60c and 60c are provided at both ends in the longitudinal direction of the support frame 26, and support the end portions of the hinge plates 60a and 60b. Thereby, in the area | region which supports the frame body 14, areas other than the site | part which clamps the side edge part of the frame body 14 are perforated. Since the support frame 26 always supports the frame body 14 until it passes through the punching portion 42, the frame body 14 is supported by the support frame 26 by making holes except for the side edge portion of the frame body 14. It becomes possible to punch.
The support frame 26 is commonly used for different types of frame bodies 14, but if the width of the frame body 14 is wider than the support frame 26, the support frame 26 may be replaced and attached to the joint plate 32. Good.
[0019]
In order to accurately position the resin mold portion 12 of the frame body 14 on the mold by image recognition, it is necessary to accurately recognize the die position of the mold and accurately position the resin mold portion 12 with respect thereto. In this embodiment, therefore, the die position of the mold is accurately measured in advance by image recognition, the position of the resin mold portion 12 on the frame body 14 is measured, and the resin mold portion 12 is placed on the die of the mold. The positions are matched.
[0020]
FIG. 4 is a plan view of the die bed 42a installed in the punching section 42. FIG. Reference numeral 70 denotes a die fixed to the die bed 42a. A movable block 72 supports the die 70, and acts to push up the die 70 toward the punch holder 42b by a push-up mechanism when separating the semiconductor device from the frame body 14 into individual pieces. 74 is a roller bearing which guides and supports the movable block 72 up and down. Reference numeral 76 denotes a return spring for returning the movable block 72 to the original position.
[0021]
FIG. 5 shows a plan view of the die 70. The frame cutting device according to the present embodiment is configured to cut the resin mold parts 12 in one row, that is, three pieces at a time, in accordance with the arrangement position of the resin mold parts 12 in the row. Cutting protrusions 70a, 70a, 70a are provided. These three cutting projections 70a are positioned by measuring a sample of the substrate 10 that has been resin-molded and contracted.
[0022]
  Reference numeral 80 denotes an image measurement area for identifying the type of the die 70 and measuring the set position of the die 70. This image measurement area 80 is provided with a position measurement hole 81 and a product type determination hole 82 for measuring the position where the die 70 is set. The type identification hole 82 depends on whether the hole is opened or closed.ofIdentify the variety. The kind discrimination hole 82 has four holes arranged in two rows, and tens of kinds can be identified by a combination of the opening and the closing hole. The position measurement hole 81 consists of one hole, and the product type discrimination hole 82 consists of eight holes.
  The position measurement hole 81 is for recognizing the hole position and detecting its XY position. Of course, the positional relationship between the cutting projection 70a and the position measurement hole 81 is set accurately at the time of manufacturing the die. However, by recognizing the position measurement hole 81 as an image, the arithmetic control unit 94 can detect the position of the cutting projection 70a and the position. The positional relationship with the measurement hole 81 is stored. The product type discrimination hole 82 discriminates the product type of the die 70 depending on whether the hole is opened or closed. This type discrimination of the die 70 is for surely excluding in advance a dissimilar product that cannot be processed by the die 70.
[0023]
A region 84 indicates an escape hole of the punch holder 42b in order to visually recognize the image measurement region 80 from the punch holder 42b side. A CCD camera is installed above the escape hole 84 to visually recognize the image measurement area 80.
The image measurement area 80 is also a measurement area for measuring the position of the resin mold portion 12 in the frame body 14 of the workpiece. In other words, the setting position of the die 70 and the discrimination of the die 70 may be performed and stored before setting the mold in the apparatus and starting the processing, so that the workpiece is actually punched while being conveyed. At this time, the image measurement region 80 is visually recognized in order to detect the position of each resin mold portion 12.
[0024]
FIG. 6 shows a state where the image of the resin mold part 12 of the frame body 14 is recognized in the image measurement region 80. In the present embodiment, among the resin mold portions 12 arranged in three rows, one end of the resin mold portion 12a is measured by recognizing the L-shaped portion of the lower left corner portion C. Of course, if the corner portions at the diagonal positions of the resin mold portion 12a are combined and measured, the XY position can be measured with higher accuracy.
[0025]
In some cases, instead of measuring the position of the resin mold portion 12 for each row, a method of measuring the position of the frame body 14 by measuring the corner portions of the pair of resin mold portions 12 at the diagonal positions of the frame body 14. Is also possible. For example, the resin mold portion 12a at the diagonal position in the frame body 14 shown in FIG.₁And 12j_ThreeResin mold part 12a_ThreeAnd 12j₁Since the position of the entire frame body 14 can be measured by measuring the outer corner portion of the frame, cutting can be performed by sequentially feeding the pitch based on the measurement result of the entire frame body 14. This method has an advantage that the processing speed can be increased because the position of the resin mold portion 12 is not measured for each row.
[0026]
In this embodiment, the XY position is measured only for one resin mold portion 12 of the three resin mold portions in the row. The measurement time is shorter than the total position measurement time of the resin mold portion 12. This is because the processing speed can be increased. Further, since the resin mold part 12 can measure the sample of the substrate 10 contracted in advance and accurately position other resin mold parts 12 in the row, the cutting projection part 70a positioned with high precision at the time of manufacture and attachment can be obtained. The position is stored in the arithmetic control unit 94 by image processing and is aligned with the resin mold unit 12 so that cutting with high accuracy is possible.
[0027]
As described above, when the frame body 14 is set on the support frame 26, the frame body 14 is aligned with the stopper 62 and the one hinge plate 60 a so that the frame body 14 is securely mounted on the support frame 26. By aligning and setting the body 14, accurate cutting can be performed only by measuring the position of only one resin mold portion 12 a in the row.
[0028]
In FIG. 6, the row position indicated by the arrow A is a row position where the resin mold portion 12 a is measured, and the row position indicated by the arrow B is a position where the resin mold portion 12 is cut by the die 70. That is, the position of the resin mold portion 12 is measured at the position of the A row, and it is obtained by calculating how much the frame body 14 is moved in the XY direction with respect to the cutting position of the die 70, and based on the calculation result. The die body 70 and the resin mold part 12 are aligned by pitch-feeding the frame body 14 in the XY direction.
[0029]
The image measurement area 80 is disposed at a position one line ahead of the cutting position on the die 70, and the resin mold portion 12 in the next line performs image measurement each time the frame body 14 is pitch-feeded by one line. Since it moves to the area 80, the image of the corner part of the resin mold part 12 is recognized for each feeding operation, and it is calculated how to move the row in the next pitch feeding and sequentially sent. It cuts by repeating.
[0030]
The meaning of detecting the position of the resin mold portion 12 at the position of the A row is that the position of the resin mold portion 12 in the XY plane is determined in advance in order to accurately transfer the resin mold portion 12 to the cutting position of the mold. It corresponds to detecting accurately. Therefore, it is not always necessary to detect the position of the resin mold portion 12 at a position one pitch before the position where the resin mold portion 12 moves to the cutting position, and it is sufficient if the position of the resin mold portion 12 can be detected in advance. However, in consideration of the movement error of the XY transport device, it is most accurate to detect the position of the resin mold portion 12 at a position one pitch before moving to the cutting position.
[0031]
FIG. 7 shows a block diagram of a control system for cutting the frame body 14 by image recognition. The die position detection unit 90 is a means for detecting where the die 70 is set on the XY plane when the mold is set. In this embodiment, the position measurement hole 81 provided in the die 70 is recognized by image recognition. The workpiece position detection unit 92 is a means for detecting the position of the resin mold portion 12 in the XY plane of the workpiece 14 in the frame body 14, and detects and detects the corner portion of the resin mold portion 12. ing.
[0032]
The calculation control unit 94 calculates how much the frame body 14 is moved in the XY direction when the frame body 14 is pitch-fed to the cutting position by the die 70 and the punch. Then, based on the calculation result, the support frame 26 is moved in the XY direction by a predetermined amount by the XY transport device 96, so that the resin mold portion 12 of the frame body 14 is accurately placed in the die 70 and punch cutting position. Can be processed to match.
[0033]
Since the frame cutting device of this embodiment detects the position of the resin mold part 12 for all the rows of the frame body 14 and cuts the resin mold part 12 in accordance with the cutting processing position, the resin mold part 12 is displaced. Even in such a case, it is possible to accurately cut by correcting the positional deviation. As a result, it is possible to perform cutting with a highly accurate clearance of 0.05 mm, which is impossible with the conventional cutting method based on alignment.
[0034]
In this embodiment, since the resin mold portions 12 in one row are cut by one punching process, the position is detected only for one resin mold portion 12 in one row. When the resin mold parts 12 are cut individually one by one, the positions of all the resin mold parts 12 may be detected and aligned. For example, if there is no problem in processing speed and the like with a frame body having a plurality of resin mold portions in one row, it is possible to control the position of all the resin mold portions to be individually cut and processed. is there.
[0035]
8 and 9 show the configuration of the die 70 and the punch 100 used in the frame cutting apparatus of this embodiment. As shown in FIG. 8, on the upper surface of the die 70, three cutting projections 70a for punching out the three resin mold portions 12 in one row are arranged in parallel. An escape recess is provided on the upper surface of the cutting projection 70a to allow the solder balls joined to the lower surface of the frame body 14 to escape. The punch 100 supported by the punch holder 42b is provided with three punch holes 100a corresponding to the cutting projections 70a provided in the die 70.
[0036]
In FIG. 9, 84 is a relief hole provided through the punch plate 102 so that the image measurement region 80 can be viewed from above the mold. Reference numeral 104 denotes a spring that biases the die 70 downward. After the movable block 72 is pushed up to remove the resin mold portion 12 from the frame body 14 between the die 70 and the punch 100, the die 70 is returned to the lower position. To act.
[0037]
In addition, when the die 70 and the punch 100 are exchanged and set in accordance with the type change, only the die 70 can be exchanged using the movable block 72 in common, and the punch holder 42b is used in common for the punch. Only 100 can be exchanged. Thereby, it can be used universally for cutting processing of a wide variety of workpieces.
[0038]
Reference numeral 106 denotes a suction pad that supports the semiconductor device in which the resin mold portion 12 is cut into individual pieces by the die 70 and the punch 100 by air suction. When the semiconductor device is separated into individual pieces by the die 70 and the punch 100, the semiconductor device is pushed up by the die 70, and the semiconductor device separated into the individual pieces is supported by air suction by the upper suction pad 106. The suction pad 106 is supported by the pickup units 44 and 46, and the semiconductor device supported by the suction pad 106 is carried out to the product alignment unit 50 side as shown in FIG.
[0039]
FIG. 10 shows the arrangement of a CCD camera that recognizes an image by visually recognizing the image measurement area 80. Reference numeral 108 denotes a first CCD camera for visually recognizing the image measurement area 80, and reference numeral 110 denotes a second CCD camera for determining the type of the frame body 14. The first CCD camera 108 is disposed above the punching section 42, and the second CCD camera 110 is disposed above the exit position of the supply section 24 of the frame body 14. 112 and 114 are ring illumination units, and 116 and 118 are support columns.
[0040]
The first CCD camera 108 detects the set position of the die 70 by visually recognizing the image measurement area 80 by switching the program software with one camera, and at the same time, the resin mold portion 12 of the frame body 14 of the workpiece. The position of is detected. The second CCD camera 110 is for discriminating the product of the frame body 14. In the present embodiment, the product is identified by detecting the outer dimension of the resin mold portion 12. The reason why the product is discriminated using the second CCD camera 110 is to check that a product that does not match the die 70 set in the apparatus is not supplied. In the frame cutting apparatus, since the die 70 and the punch 100 are exchanged and set, a workpiece that does not match the mold may be supplied. In this apparatus, the die 70 and the workpiece are compared before processing, and when a workpiece that does not match is loaded, the supply is stopped so that a supply error does not occur.
[0041]
In this embodiment, the position of the die and the position of the resin mold portion are detected by the image recognition method. However, various methods are possible for detecting these positions, and the present invention is not limited to the above-described methods. Absent. Further, the type discrimination of the workpiece is not limited to the method of the embodiment, and other discrimination methods such as discriminating and discriminating marks provided on the workpiece can be used.
[0042]
As described above, in the frame cutting method according to the present invention, the arrangement position of the resin mold portion 12 on the frame body 14 which is a workpiece is individually detected, and the resin mold portion is made gold based on the detection position. Cutting is performed by aligning with the cutting position of the mold. Therefore, when the arrangement of the resin mold portion 12 on the frame body 14 is slightly shifted, or there is a slight error in feeding the frame body 14. Even in such a case, it is possible to accurately cut the workpiece, and even if an extremely small clearance is set, reliable cutting can be performed.
[0043]
【The invention's effect】
  According to the semiconductor device frame cutting method and cutting device according to the present invention, as described above, in the processing plane.Die set position and one in each row of frame bodyResin mold partAbout onlySince the placement position is measured and the resin mold part is aligned with the predetermined cutting position of the mold and cut based on the measurement result, the frame body is highly accurate.InCan be cutIn addition, the processing speed can be increased as compared with the case where all the resin mold parts are measured and processed.As a result, the clearance with the resin mold portion can be set to be extremely small, and it can be surely cut into individual semiconductor devices, which can be suitably used for manufacturing a small semiconductor device such as a chip size package.The
[Brief description of the drawings]
FIG. 1 is a plan view showing an overall configuration of an embodiment of a frame cutting device.
FIG. 2 is a plan view of a support frame.
FIG. 3 is a side view of a support frame and a punching portion.
FIG. 4 is a plan view of a die bed.
FIG. 5 is a plan view of a die.
FIG. 6 is an explanatory diagram showing an image recognition method.
FIG. 7 is a block diagram of a control system for punching a frame body.
FIG. 8 is a side sectional view showing a configuration of a die and a punch of the frame cutting device.
FIG. 9 is a front sectional view showing a configuration of a die and a punch of the frame cutting device.
FIG. 10 is an explanatory diagram showing the arrangement of a CCD camera.
FIG. 11 is a plan view of the frame body.
FIG. 12 is an explanatory view showing a method of separating a semiconductor device from a frame body into individual pieces by a die and a punch.
FIG. 13 is an explanatory view showing a state in which a resin mold portion is scraped by a punch.
[Explanation of symbols]
10 Substrate
12 Resin mold part
14 frame body
22 Magazine storage
24 Supply section
26 Support frame
28, 30 Motor
32 Joint plate
36 Frame extractor
42 Punching part
42a Die bed
42b Punch holder
42c guide post
44, 46 Pickup section
60a, 60b Hinge plate
62 Stopper
66 Pusher
70 dies
70a Cutting protrusion
72 Movable block
80 Image measurement area
81 Position measurement hole
82 Product identification hole
84 Escape hole
90 Die position detector
92 Workpiece position detector
94 Operation control unit
96 XY transport device
100 punches
108 First CCD camera
110 Second CCD camera

Claims (5)

A frame body in which a plurality of resin mold portions are formed at predetermined intervals on a substrate is positioned and fed to a cutting processing position by a die of a cutting die, and is sent to the outer surface of the resin mold portion. A method of cutting a frame of a semiconductor device, wherein the substrate is cut along the substrate and formed into individual semiconductor devices,
The frame body is formed with a plurality of resin mold portions in one row, and the frame body is cut into individual pieces for each row of the resin mold portions in the row by a mold. In a method of forming a device,
And set position of the die in the processing plane, every time pitch feeding said frame member, and a planar position of one resin mold portion only to measure total in each row,
Based on the measurement results, the during pitch feed, the frame cutting method of a semiconductor device in which the resin mold portion, characterized in that the cutting machining by moving the frame member to a position corresponding to the working position. 2. The frame cutting method for a semiconductor device according to claim 1, wherein the measurement of the planar arrangement position of the resin mold part is performed at a position one pitch before the frame body is pitch-fed to the processing position. A frame body in which a plurality of resin mold portions are formed at predetermined intervals on a substrate is positioned and fed to a processing position of a punch / die unit for cutting processing, and the substrate is disposed along the outer surface of the resin mold portion In a frame cutting device of a semiconductor device that forms a piece of semiconductor device by cutting
The punch / die unit is provided so as to be separable from the frame body in which a plurality of resin mold portions are formed in one row for each resin mold portion for each row,
A die position detector for measuring and detecting the set position of the die in a processing plane;
Each time the frame body is pitch-fed, a workpiece position detection unit that detects an arrangement position in the processing plane for only one resin mold part in each row of the frame body ,
Based on the measurement results of the die position detection unit and the workpiece position detection unit, an arithmetic control unit that calculates a movement amount in the XY direction for moving the frame body to the processing position;
An apparatus for cutting a frame of a semiconductor device, comprising: an XY transfer device that moves the frame body to the processing position based on a calculation result of the calculation control unit. 4. The semiconductor device according to claim 3 , wherein the workpiece position detecting unit detects a resin mold portion at a position one pitch before the frame body is pitch-fed to the processing position. Frame cutting device. Identifying means for identifying varieties of the frame body, and a discrimination means for discriminating a type of the punch die unit provided on the die position detection unit,
The arithmetic control unit includes identification means of said frame body, the supply of comparing the punch die the frame body identified by the identification means of the unit and the punch-die unit to the machining position of the frame member frame cutting device as claimed in claim 3, wherein the control to Turkey.

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