JP4237566B2 - Socket device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a structure of a socket device used for connection or holding with an IC chip, an IC module, or the like.
[0002]
[Prior art]
As a conventional socket device for holding an IC chip or the like, a conductive metal in which an upper end is folded back into a U-shape in a recessed storage portion formed in a housing, and an inner piece on the tip side protrudes into the storage portion. A plurality of terminal members made of a plate are arranged side by side and are connected to a plurality of external contact pieces of an electrical component mounted in the storage portion by utilizing elastic deformation of an inner piece portion of the terminal member. Things are known. (For example, refer to Patent Document 1).
[0003]
Hereinafter, the structure of a conventional socket device will be described with reference to the drawings. FIG. 12 is a perspective view showing a state before the conventional socket device and IC device are mounted.
[0004]
In the figure, a quadrilateral IC socket 11 in plan view is made of synthetic resin, and a storage portion 12 having a square concave shape is provided at the center. A plurality of contact pieces 13 made of a conductive metal plate are arranged on the four sides of the inner periphery of the storage portion 12. The contact piece 13 is formed of a base portion held by the IC socket 11 and an inner piece portion folded back in a U shape from the distal end side of the base portion. The inner piece portion can be elastically deformed. Is formed.
[0005]
The IC device 22 is also made of a resin module having a quadrilateral shape in plan view, and a plurality of plate-like IC leads 23 are arranged on the four sides of the outer side of the IC device 22.
[0006]
When the IC device 22 is attached to the storage portion 12 of the IC socket 11, the IC leads 23 of the IC device 22 are in contact with the inner pieces of the plurality of contact pieces 13 of the IC socket 11, The IC lead 23 of the IC device 22 and the contact piece 13 are connected by being inserted toward the bottom surface 14 of the storage unit 12.
In this case, the IC lead 23 and the contact piece 13 are elastically pressed by the spring property of the contact piece 13 itself.
[0007]
[Patent Document 1]
Japanese Patent Laid-Open No. 2001-203552
[Problems to be solved by the invention]
However, some IC modules to be mounted on the socket device have an upper portion protruding from the lower portion, and some have an external contact piece (IC lead) formed on the side surface of the lower portion. When this IC module is mounted on a conventional socket device, there is a problem that the upper part of the IC module easily comes into contact with the terminal member (contact piece) and the contact with the lower external contact piece becomes unstable. It was. Moreover, since the height dimension of the socket member is prescribed | regulated by the length dimension of the inner side piece part of a terminal member, there existed a problem that thickness reduction was difficult.
[0009]
Therefore, the present invention solves the above-mentioned problems, enables the mounting of an IC module whose upper portion projects from the lower portion, and ensures a sufficient length of the inner piece of the terminal member to reduce the thickness of the socket. An object is to provide an apparatus.
[0010]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, in the present invention, as a first solving means, a housing having a concave storage portion to which an electrical component is mounted, and a peripheral portion of the storage portion are arranged side by side on the outer surface of the electrical component. A plurality of terminal members connected to a plurality of external contact pieces arranged in parallel, wherein the external contact pieces are provided at corners where at least the side surface and the bottom surface of the electrical component are connected, Is a flat base that is held by the housing and extends along the inner wall of the storage portion, a contact plate that is formed by bending one end of the base parallel to the base, and a tip side of the contact plate A bent piece bent inward of the storage portion, and the bent piece can be brought into contact with an external contact piece provided at a corner of the electric component. Pull out to hold and hold in the storage Comprising a stop member, the electrical component was configured to be held by retaining the member exits said the bent piece of the terminal member.
[0011]
Further, as a second solving means, the bent piece is formed with an inclined surface extending inward of the storage portion, and the electric component is arranged on the side of the retaining member by the inclined surface of the bent piece. The configuration is energized.
As a third solution, the retaining member includes a thin plate-like substrate portion disposed along the outer surface of the housing and an elastic arm portion provided on the substrate portion so as to be elastically deformable. The elastic arm portion is elongated in the lateral direction of the substrate portion, and an engaging portion is formed on the distal end side of the elastic arm portion to engage and prevent the electric component from coming off. The configuration was as follows.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention are shown in FIGS. 1 is a plan view of a socket device according to the present invention, FIG. 2 is a front view showing a part of a terminal member of the socket device in a cutaway state, and FIG. 3 is a side view showing a part of a retaining member of the socket device in a cutaway state. 4 is a plan view showing a state in which the IC module is mounted, FIG. 5 is a front view in which a part of the terminal member is broken with the IC module mounted, and FIG. 6 is a retainer in the state in which the IC module is mounted. FIG. 7 is a side view showing a state where the retaining member is bent, FIG. 8 is a perspective view showing the retaining member, and FIG. 9 is a plan view showing the IC module. 10 is a front view showing an IC module, and FIG. 11 is a perspective view showing a terminal member.
In FIG. 4, the state where the retaining member is partially bent is also shown for convenience.
[0013]
In the figure, the housing 1 is made of an insulating material such as synthetic resin, and is formed in a rectangular box shape having a concave storage portion 1a having an upper surface opened. A plurality of terminal members 2 are arranged side by side and attached to the peripheral edges of the four sides of the concave storage portion 1a.
[0014]
The terminal member 2 is made of a conductive metal plate, and is formed by flat plate-like base 2e held in the housing 1, bent in a U-shape at one end of the base 2e, and bent in parallel with the base 2e. The contact plate 2a is connected to the other end of the housing 1 and bent at the other end in the same L-shape. Further, the tip end side of the contact plate 2a is further bent inward of the storage portion 1a, and the bent piece 2c comes into contact with an external contact piece 4c of the IC module 4 to be described later. .
Further, the bent piece 2c is provided with an inclined surface 2d composed of an inclined surface extending from the front end side of the contact plate 2a to the inside of the storage portion. Further, the upper end of the U-shaped bent portion of the base portion 2 e of the terminal member 2 is formed to be substantially the same height as the upper surface of the housing 1.
[0015]
The retaining member 3 is made of a thin plate-like conductive metal plate, and the retaining member 3 is provided with a substrate portion 3a formed into a rectangular shape by being bent continuously four times. The retaining members 3 are arranged along the outer surfaces of the four sides of the housing 1 so that the respective substrate portions 3a surround the outside of the rectangular housing 1.
Further, on the upper surface side of the substrate portion 3a, there are formed crosspieces 3b for connecting the respective substrate portions 3a. The crosspieces 3b are engaged with the upper surface of the outer portion of the storage portion 1a of the housing 1 and are removed. A stop member 3 is attached to the housing 1.
[0016]
Further, at least on the upper surface side of the two substrate portions 3a facing each other, in a lateral direction (a direction orthogonal to an insertion direction of an IC module 4 described later) so as to be elastically deformable via an L-shaped slit 3c. An elastic arm portion 3d extending in a long shape is formed. The elastic arm portion 3d is formed to be elongated along the lateral direction that is the longitudinal direction of the substrate portion 3a, and the direction in which the concave storage portion 1a of the housing 1 is formed (the insertion direction of the IC module 4). ) To be elastically deformed in a direction orthogonal to the above. The elastic arm portion 3d may be formed on all the four substrate portions 3a.
[0017]
As described above, if the elastic arm portions 3d are arranged on at least two opposing surfaces of the opposing four sides of the housing 1, the elastic force of the elastic arms acts in the opposing direction. Therefore, the IC module 4 to be described later can be securely held on the retaining member 3.
Further, since the retaining member 3 is formed of a conductive metal plate and is bent along the outer surface of the housing 1 by bending the metal plate, even if it is formed in a thin plate shape, it has elastic force. It can be obtained reliably and can be processed easily and at low cost.
[0018]
An engaging portion 3e is formed on the free end side of the elastic arm portion 3d on the upper surface side of the housing 1 so as to engage and prevent the IC module 4 inserted into the housing portion 1a from coming off. The engagement portion 3e is formed by being bent from the elastic arm portion 3d and bent toward the bottom surface side of the storage portion 1a. The engagement portion 3e is an inclined surface 3f inclined toward the center of the bottom surface of the storage portion 1a. It is formed to have. By providing the inclined surface 3f, when the IC module 4 is inserted, the elastic arm portion 3d is elastically deformed outwardly of the housing 1 along the inclined surface 3f and bent.
By providing the inclined surface 3f, the elastic arm portion 3d can be elastically deformed with a simple configuration, so that a reliable engagement force between the IC module 4 and the retaining member 3 can be obtained.
[0019]
Further, a grounding piece 3g projecting downward is provided on the lower surface side of the board portion 3a of the retaining member 3, and this grounding piece 3g is grounded to the ground of the circuit board on which the socket device is mounted. It has become.
In this case, the plurality of terminal members 2 arranged side by side in the housing 1 are arranged in parallel at the peripheral edge portion of the concave storage portion 1 a, and the substrate portion 3 a of the retaining member 3 is disposed in the vicinity of the terminal member 2. Since the terminal member 2 is disposed along the outer peripheral surface of the housing 1 so as to surround the terminal member 2 from the outside, the retaining member 3 serves as a shield plate, so that the shielding effect on the terminal member 2 is achieved. Can be increased.
[0020]
An IC module 4, which is a camera module as an example of an electrical component, is a circuit component in which elements such as a semiconductor (IC) are integrated, and includes a rectangular base portion 4a and an upper surface side of the base portion 4a. And a circular lens portion 4b protruding in the shape.
Further, the base portion 4 a is provided with a plurality of external contact pieces 4 c that are continuous from the lower end side to the bottom surface of the four side surfaces, and the external contact pieces 4 c are a plurality of terminal members 2 of the housing portion 1 a of the housing 1. It is to be connected with.
[0021]
As shown in FIG. 5, the external contact piece 4c is formed inside a recessed groove portion 4e provided on the lower end side of the side surface of the base portion 4a. Therefore, the external contact piece 4c is provided. The surface on the lower end side is recessed from the surface on the upper end side of the side surface of the base portion 4a. In other words, the upper surface portion projects from the lower surface portion.
[0022]
In addition, locking grooves 4d are provided at the two corners on the upper surface side of the base portion 4a that face diagonally. An engaging portion 3e formed on the elastic arm portion 3d of the retaining member 3 is engaged with the locking groove portion 4d so that the IC module 4 is held in the housing portion 1a of the housing 1.
The lens unit 4b is used as a camera lens when used as a photographing function of a mobile phone or a digital camera.
[0023]
Next, the operation when the IC module 4 is mounted on the socket device having the above configuration will be described with reference to FIGS.
First, the IC module 4 is inserted from above the housing part 1a of the housing 1 with the bottom side of the base part 4a facing down. At this time, the bottom surface and the side surface of the base portion 4a of the IC module 4 move downward along the inclined surface 3f of the engaging portion 3e formed on the free end side of the elastic arm portion 3d of the retaining member 3, Along with this movement, the elastic arm portion 3d is elastically deformed outward and bent due to its own springiness as partially shown in FIGS.
At this time, since the elastic arm portion 3d is formed in an elongated shape along the lateral direction of the substrate portion 3a of the retaining member 3, the elastic arm portion 3d is bent with sufficient elasticity.
[0024]
Then, when the tip of the engaging portion 3e reaches the locking groove 4d formed on the upper surface side of the IC module 4, the engaging portion 3e is locked as shown partially in FIGS. It is engaged by dropping into the groove 4d.
At this time, the engaging portion 3e is urged inward by the spring property of the elastic arm portion 3d itself, that is, urged toward the locking groove portion 4d side of the IC module 4, and is elastically pressed with spring property. The IC module 4 is securely held in the storage portion 1a of the housing 1.
[0025]
As described above, the elastic arm portion 3d is elongated in the lateral direction of the substrate portion 3a, and is engaged with the tip of the elastic arm portion 3d above the IC module 4 to prevent the elastic arm portion 3d from coming off. 3e is formed, so that the length of the elastic arm portion 3d can be sufficiently secured and the size can be reduced while maintaining the elastic force of the engaging portion 3e. Can be planned.
[0026]
When the IC module 4 is held in the storage portion 1a, as shown in FIG. 5, a plurality of external contact pieces 4c provided on the base portion 4a of the IC module 4 are arranged on the peripheral portion of the storage portion 1a. By making contact with the bent piece 2 c provided at the tip of the contact plate 2 a of the plurality of terminal members 2, the electrical connection is established.
At this time, the contact plate 2a of the terminal member 2 is formed by being bent in a U-shape, and the bent piece 2c is elastically contacted with the external contact piece 4c by its own spring property, so that the contact is surely made and stable Contact is obtained.
[0027]
At this time, the bent piece 2c is formed with an inclined surface 2d extending inward of the storage portion 1a. By providing the inclined surface 2d, the IC module 4 is provided with an inclined surface of the bent piece 2c. Since the surface 2d is biased upward, that is, toward the engaging portion 3e side of the elastic arm portion 3d, an upward elastic force acts on the IC module 4, and therefore the housing portion 1a of the housing 1 Thus, the vertical movement is surely held without occurrence.
The plurality of external contact pieces 4c provided on the base part 4a of the IC module 4 are formed in the recessed groove part 4e that is recessed from the side surface, but are provided at the tip of the contact plate 2a of the terminal member 2. The tip of the bent piece 2c is inserted into the recessed groove portion 4e, so that the inclined surface 2d of the bent piece 2c and the external contact piece 4c are surely in contact with each other.
[0028]
According to the above-described embodiment of the present invention, the external contact piece 4c is provided at a corner portion connected to the bottom surface of the lower side surface of the IC module 4, and the terminal member 2 is held by the housing 1 and accommodated therein. A flat plate-like base portion 2e extending along the inner wall portion of 1a, a contact plate 2a formed by being bent in a U-shape on one end side of the base portion 2e and bent in parallel with the base portion 2e, and the contact plate 2a Since it has a bent piece 2c bent inward of the storage portion 1a on the distal end side, the bent piece 2c can be brought into contact with the external contact piece 4c provided at the corner of the IC module 4. By providing the contact plate 2a bent in parallel with the base 2e, it is possible to mount the IC module 4 with the upper portion protruding from the lower portion, and the bent piece 2c formed on the tip side of the contact plate 2a and the IC mourning. The corner of Joule 4 By contacting the external contact pieces 4c provided, along with thinning can be achieved, it has been assumed that the length of the contact plate 2a of the terminal member 2 can be sufficiently ensured.
[0029]
In the above embodiment, the grounding piece 3g is formed on the lower surface side of the board portion 3a of the retaining member 3, and this grounding piece 3g is grounded to the ground of the circuit board on which the socket device is mounted. In addition to this, a contact piece (not shown) for grounding is also formed in the locking groove 4d of the IC module 4, and the contact piece for grounding and the elastic arm portion 3d of the retaining member 3 are engaged. The IC module 4 may be directly grounded to the ground of the circuit board on which the socket device is mounted by connecting the joint portion 3e.
[0030]
【The invention's effect】
As described above, the socket device according to the present invention includes a housing having a concave storage portion on which an electrical component is mounted, and a plurality of parallel connections on the outer peripheral surface of the electrical component. A plurality of terminal members connected to the external contact piece, the external contact piece is provided at a corner where at least the side surface and the bottom surface of the electrical component are connected, and the terminal member is held by the housing and A flat base extending along the inner wall, a contact plate formed by being bent in parallel with the base at one end of the base, and a bent piece bent inward of the storage portion at the tip of the contact plate Since the bent piece can be in contact with the external contact piece provided at the corner of the electrical component, the electrical component with the upper part protruding from the lower part can be mounted by providing a contact plate bent in parallel with the base part. Can also be contacted By making the bent piece formed on the front end side of the metal plate and the external contact piece provided at the corner of the electrical component come into contact with each other, the thickness can be reduced and the length of the contact plate of the terminal member can be sufficiently secured. .
[0031]
In addition, the housing includes a retaining member that retains the electrical component in the housing portion and prevents the electrical component from being detached. The electrical component is sandwiched between the bent piece of the terminal member and the retaining member, so that the electrical component is held in the housing portion of the housing. Holds securely.
Further, the bent piece is formed with an inclined surface extending inward of the storage portion, and since the electric component is urged toward the retaining member side by the inclined surface of the bent piece, Since an upward elastic force acts on the housing, it is securely held without any vertical play in the housing housing.
[0032]
The retaining member includes a thin plate-like substrate portion disposed along the outer surface of the housing and an elastic arm portion provided on the substrate portion so as to be elastically deformable. The length of the elastic arm portion is sufficiently long because the engagement portion that extends in the lateral direction and is formed on the distal end side of the elastic arm portion to engage and prevent the electric component from being pulled upward is formed. Since the size can be reduced while securing and maintaining the elastic force of the engaging portion, the socket device can be reduced in size and thickness.
[0033]
[Brief description of the drawings]
FIG. 1 is a plan view showing a socket device according to an embodiment of the present invention.
FIG. 2 is a front view showing a part of the terminal member of the socket device of the present invention in a cutaway manner.
FIG. 3 is a side view showing a part of the retaining member of the socket device according to the present invention in a broken state.
FIG. 4 is a plan view showing a state where an IC module is mounted on the socket device of the present invention.
FIG. 5 is a front view showing a part of the terminal member with the IC module mounted on the socket device of the present invention.
FIG. 6 is a side view showing a part of the retaining member in a state where the IC module is mounted on the socket device of the present invention.
FIG. 7 is a side view showing a state in which the retaining member of the socket device of the present invention is bent.
FIG. 8 is a perspective view showing a retaining member of the socket device of the present invention.
FIG. 9 is a plan view showing an IC module of the present invention.
FIG. 10 is a front view showing an IC module of the present invention.
FIG. 11 is a perspective view showing a terminal member of the socket device of the present invention.
FIG. 12 is a perspective view showing a state before the conventional socket device and IC device are mounted.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Housing 1a Storage part 2 Terminal member 2a Contact board 2b Connection board 2c Bending piece 2d Inclined surface 2e Base part 3 Retaining member 3a Substrate part 3b Crosspiece part 3c Slit 3d Elastic arm part 3e Engaging part 3f Inclining surface 3g Grounding piece 4 IC Module 4a Base 4b Lens 4c External contact piece 4d Locking groove 4e Concave groove

Claims (3)

A housing having a concave storage portion on which an electrical component is mounted, and a plurality of terminal members which are connected in parallel to the peripheral portion of the storage portion and connected to a plurality of external contact pieces provided in parallel on the outer surface of the electrical component The external contact piece is provided at a corner portion where at least a side surface and a bottom surface of the electrical component are connected, and the terminal member is held by the housing and extends along an inner wall portion of the storage portion. A flat plate-shaped base portion; a contact plate formed by being bent in parallel with the base portion at one end of the base portion; and a bent piece bent inward of the storage portion at the front end side of the contact plate. The bent piece can be brought into contact with an external contact piece provided at a corner of the electrical component, and the housing includes a retaining member that retains the electrical component in the housing portion and prevents the electrical component from being detached. The component is a bent piece of the terminal member. Serial retaining socket apparatus characterized by being held between members. The bent piece is formed with an inclined surface extending inward of the storage portion, and the electric component is urged toward the retaining member side by the inclined surface of the bent piece. The socket device according to claim 1 . The retaining member includes a thin plate-like substrate portion disposed along the outer surface of the housing, and an elastic arm portion provided on the substrate portion so as to be elastically deformable. claim the lateral direction of the substrate portion while extending in an elongated shape, characterized in that the formation of the engagement portion for retaining engages above the electrical components on the distal end side of the elastic arm portion 1 Or the socket device according to 2 .

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