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JP4238683B2 - Substrate detection method in electronic component mounting apparatus - Google Patents
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JP4238683B2 - Substrate detection method in electronic component mounting apparatus - Google Patents

Substrate detection method in electronic component mounting apparatus Download PDF

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JP4238683B2
JP4238683B2 JP2003325844A JP2003325844A JP4238683B2 JP 4238683 B2 JP4238683 B2 JP 4238683B2 JP 2003325844 A JP2003325844 A JP 2003325844A JP 2003325844 A JP2003325844 A JP 2003325844A JP 4238683 B2 JP4238683 B2 JP 4238683B2
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substrate
stopper
detection
detection sensor
electronic component
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JP2005093765A (en
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成孝 阿部
正幸 萬谷
公幸 山崎
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

本発明は、電子部品実装用装置において基板搬送機構の基板停止位置における基板の有無を検出する電子部品実装用装置における基板検出方法に関するものである。   The present invention relates to a substrate detection method in an electronic component mounting apparatus that detects the presence or absence of a substrate at a substrate stop position of a substrate transport mechanism in the electronic component mounting apparatus.

電子部品実装装置やスクリーン印刷装置などの電子部品実装用装置では、基板をコンベアなどの基板搬送機構によって移動させながら所定位置において位置決めすることが行われる。この位置決めは、機械的に駆動される位置決め用のストッパに基板の端部を押し付けることによって行われる。そしてこのストッパによる基板停止位置に実際に基板が存在するか否かは、反射型の光学センサなどを用いた基板検出センサによって検出され、この検出信号に基づいて後続の動作シーケンスが進行する(例えば特許文献1参照)。
特開平7−208920号公報
In an electronic component mounting apparatus such as an electronic component mounting apparatus or a screen printing apparatus, a substrate is positioned at a predetermined position while being moved by a substrate transport mechanism such as a conveyor. This positioning is performed by pressing the end of the substrate against a mechanically driven positioning stopper. Whether or not a substrate actually exists at the substrate stop position by this stopper is detected by a substrate detection sensor using a reflective optical sensor or the like, and a subsequent operation sequence proceeds based on this detection signal (for example, Patent Document 1).
JP 7-208920 A

ところで、同一の装置によって搬送・位置決めされる基板の種類は様々であり、基板によって基板検出センサの検出対象部位の色や表面光沢が異なる場合がある。このため、上述の基板検出センサによる検出結果が基板の色や表面性状によって左右される不具合が生じていた。そして基板が所定の基板停止位置に存在するにも拘わらず、基板無しの信号が出力される結果、基板検出センサの基板誤検出に起因して誤動作を生じる場合があった。   By the way, there are various types of substrates to be transported and positioned by the same apparatus, and the color and surface gloss of the detection target part of the substrate detection sensor may differ depending on the substrate. For this reason, the malfunction which the detection result by the above-mentioned board | substrate detection sensor was influenced by the color and surface property of the board | substrate had arisen. In spite of the presence of the substrate at a predetermined substrate stop position, a signal indicating no substrate is output, and as a result, a malfunction may occur due to erroneous detection of the substrate by the substrate detection sensor.

そこで本発明は、基板検出センサによる基板誤検出を防止することができる電子部品実装用装置における基板検出方法を提供することを目的とする。   Therefore, an object of the present invention is to provide a substrate detection method in an electronic component mounting apparatus that can prevent erroneous detection of a substrate by a substrate detection sensor.

本発明の電子部品実装用装置における基板検出方法は、基板に電子部品を実装した実装基板を製造する過程で使用される電子部品実装用装置において、基板搬送機構の基板停止
位置における基板の有無を検出する電子部品実装用装置における基板検出方法であって、前記基板停止位置に起倒自在に設けられた基板ストッパと、前記基板ストッパの起倒動作を駆動する起倒機構と、前記起倒機構を制御する制御部とを備え、前記基板ストッパを起立させて前記基板搬送機構における基の移動を阻止可能な状態にするストッパ起立工程と、前記基板ストッパの上流側の直近位置に投光方向を基板搬送レベル側に向けて配設された回帰反射型の光学センサを用いた基板検出センサによる検出信号を受信可能状態にする検出準備工程と、基板が前記基板停止位置に未到着の状態において前記基板検出センサの投光部から照射された光が前記基板ストッパの端部に設けられた反射部で反射された反射光を基板検出センサの受光部によって受光することにより「基板無」を検出する基板無検出工程と、基板が前記基板停止位置に到着して前記基板ストッパにより移動が阻止された状態において前記基板検出センサの投光部から照射された光が前記基板によって遮光され前記反射光を前記受光部が受光しないことにより「基板有」を検出する基板有検出工程と、前記基板ストッパを倒伏させるとともに前記基板検出センサによる検出信号を受信不可状態にする検出停止工程とを含み、前記制御部は動作シーケンス上で予め定められた所定タイミングにおいて前記基板検出センサからの検出信号を受信し、この検出信号に基づいて前記起倒機構を制御することにより、基板の移動を停止させる目的で基板ストッパを起立させた状態においてのみ、前記基板検出センサの検出信号を前記制御部が取り込むようにした。
The substrate detection method in the electronic component mounting apparatus of the present invention is the electronic component mounting apparatus used in the process of manufacturing the mounting substrate in which the electronic component is mounted on the substrate. A substrate detection method in an electronic component mounting apparatus for detecting, wherein a substrate stopper provided to be freely tiltable at the substrate stop position, a tilting mechanism for driving a tilting operation of the substrate stopper, and the tilting mechanism and a control unit for controlling the stopper standing step of the movable blocking state of the base plate in the substrate transfer mechanism by standing the substrate stopper projecting direction to the nearest position of the upstream side of the substrate stopper A detection preparation step for receiving a detection signal by a substrate detection sensor using a retroreflective optical sensor disposed toward the substrate transport level side, and The light irradiated from the light projecting portion of the substrate detection sensor in a state where it has not arrived at the plate stop position is reflected by the light receiving portion of the substrate detection sensor and is reflected by the reflecting portion provided at the end of the substrate stopper. Substrate non-detection step of detecting “no substrate”, and light emitted from the light projecting portion of the substrate detection sensor in a state where the substrate arrives at the substrate stop position and is prevented from moving by the substrate stopper Is detected by the substrate and the reflected light is not received by the light receiving unit, so that the presence of the substrate is detected, and the substrate stopper is lowered and the detection signal from the substrate detection sensor is not received. A detection stop step, and the control unit outputs a detection signal from the substrate detection sensor at a predetermined timing on the operation sequence. The control unit captures the detection signal of the substrate detection sensor only in a state where the substrate stopper is raised for the purpose of stopping the movement of the substrate by controlling the raising / lowering mechanism based on the detection signal. I did it.

本発明によれば、基板検出センサとして、投光部からの光を反射部によって反射して受光部に入光させる構成の回帰反射型の光学センサを用い、基板ストッパの端部に反射部を配置した構成とするとともに、基板検出センサの検出信号の受信・非受信を基板ストッパ20の動作と同期させて制御しながら基板検出処理を行うことにより、基板停止位置における基板の誤検出を確実に防止することができる。   According to the present invention, as the substrate detection sensor, the retroreflective optical sensor configured to reflect the light from the light projecting unit by the reflecting unit and enter the light receiving unit is used, and the reflecting unit is provided at the end of the substrate stopper. The substrate detection processing is performed while controlling the reception / non-reception of the detection signal of the substrate detection sensor in synchronization with the operation of the substrate stopper 20, thereby ensuring erroneous detection of the substrate at the substrate stop position. Can be prevented.

次に本発明の実施の形態を図面を参照して説明する。図1は本発明の一実施の形態のスクリーン印刷装置の側面図、図2は本発明の一実施の形態のスクリーン印刷装置の平面図、図3は本発明の一実施の形態のスクリーン印刷装置の基板ストッパの構成説明図、図4は本発明の一実施の形態のスクリーン印刷方法における基板検出方法の説明図である。   Next, embodiments of the present invention will be described with reference to the drawings. 1 is a side view of a screen printing apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the screen printing apparatus according to an embodiment of the present invention, and FIG. 3 is a screen printing apparatus according to an embodiment of the present invention. FIG. 4 is an explanatory view of a substrate detection method in the screen printing method of one embodiment of the present invention.

まず図1、図2を参照して、スクリーン印刷装置の構造を説明する。図1において、基板位置決め部1は、Y軸テーブル2およびX軸テーブル3よりなる移動テーブル上にZ軸テーブル4を段積みして構成されている。Z軸テーブル4上の上面は、電子部品が実装される基板8を保持し下受けする下受け部となっている。基板位置決め部1を駆動することにより、下受け部に保持された基板8をX方向およびY方向に移動させて、スクリーン印刷時の基板8の位置を調整する。   First, the structure of the screen printing apparatus will be described with reference to FIGS. In FIG. 1, the substrate positioning unit 1 is configured by stacking Z-axis tables 4 on a moving table composed of a Y-axis table 2 and an X-axis table 3. The upper surface on the Z-axis table 4 serves as a lower receiving portion for holding and receiving the substrate 8 on which electronic components are mounted. By driving the substrate positioning unit 1, the substrate 8 held by the lower receiving unit is moved in the X direction and the Y direction to adjust the position of the substrate 8 during screen printing.

基板位置決め部1の上方には搬送コンベア6を備えた基板搬送機構5が配設されている。搬送コンベア6は図2に示すように搬入コンベア19A、搬出コンベア19Bと接続されており、搬送コンベア6は上流側の搬入コンベア19Aから受け取った基板8を基板位置決め部1までX方向(紙面に垂直方向)に搬送する。そして印刷後の基板8は、搬送コンベア6から下流側の搬出コンベア19Bに渡される。   A substrate transport mechanism 5 including a transport conveyor 6 is disposed above the substrate positioning unit 1. As shown in FIG. 2, the transport conveyor 6 is connected to a carry-in conveyor 19A and a carry-out conveyor 19B. The carry conveyor 6 receives the substrate 8 received from the upstream carry-in conveyor 19A to the substrate positioning unit 1 in the X direction (perpendicular to the paper surface). Direction). Then, the printed substrate 8 is transferred from the conveyor 6 to the downstream conveyor 19B.

搬送コンベア6、搬入コンベア19A、搬出コンベア19Bはいずれも水平方向に展張された搬送ベルト(図5参照)を備えており、搬送駆動部(図3参照)を駆動することにより、搬送ベルト上に載置した基板8を搬送する。搬送コンベア6は1対のクランパ7を備えており、クランパ7はクランプ駆動機構17により水平方向に駆動されて、基板位置決め部1に位置決めされた基板8の側端部を挟み込んで保持する。   Each of the conveyor 6, the carry-in conveyor 19A, and the carry-out conveyor 19B includes a conveyor belt (see FIG. 5) that is stretched in the horizontal direction. By driving a conveyor drive unit (see FIG. 3), The placed substrate 8 is transported. The conveyor 6 includes a pair of clampers 7, which are driven in the horizontal direction by a clamp driving mechanism 17 so as to sandwich and hold the side end portion of the substrate 8 positioned by the substrate positioning unit 1.

基板位置決め部1の上方には、スクリーン印刷部10が配設されている。スクリーン印刷部10はマスクホルダ11に展張されたマスクプレート12およびスキージヘッド13を備えている。スキージヘッド13は、移動プレート14配設されたスキージ昇降機構15によって昇降する1対のスキージ16を備えており、図示しない移動手段によって水平方向(Y方向)に往復動自在となっている。基板8がマスクプレート12の下面に当接した状態で、マスクプレート12上にクリーム半田を供給し、スキージ16をマスクプレート12の表面に当接させて摺動させることにより、基板8の表面にはパターン孔12aを介してクリーム半田が印刷される。   A screen printing unit 10 is disposed above the substrate positioning unit 1. The screen printing unit 10 includes a mask plate 12 and a squeegee head 13 that are spread on a mask holder 11. The squeegee head 13 includes a pair of squeegees 16 that are raised and lowered by a squeegee raising / lowering mechanism 15 provided on the moving plate 14, and can be reciprocated in a horizontal direction (Y direction) by a moving means (not shown). In a state where the substrate 8 is in contact with the lower surface of the mask plate 12, cream solder is supplied onto the mask plate 12, and the squeegee 16 is brought into contact with the surface of the mask plate 12 and is slid on the surface of the substrate 8. The cream solder is printed through the pattern holes 12a.

搬送コンベア6には基板停止機構9が配設されており、基板停止機構9は搬送コンベア6によって搬送された基板8を所定の基板停止位置に停止させる。基板停止位置9には、基板検出センサ18が配置されている。基板検出センサ18は、反射部と組み合わされた回帰反射型の光学センサを用いて、基板搬送機構5の基板停止位置における基板8の有無を検出する。   A substrate stop mechanism 9 is disposed on the transport conveyor 6, and the substrate stop mechanism 9 stops the substrate 8 transported by the transport conveyor 6 at a predetermined substrate stop position. A substrate detection sensor 18 is disposed at the substrate stop position 9. The substrate detection sensor 18 detects the presence or absence of the substrate 8 at the substrate stop position of the substrate transport mechanism 5 using a retroreflective optical sensor combined with the reflection unit.

次に図3を参照して、基板停止機構9および基板検出センサ18の機能を説明する。図3(a)に示すように、基板停止機構9は、基板ストッパ20を搬送コンベア6に沿った基板停止位置にピン20a廻りに起倒自在に設けた構造となっている。基板ストッパ20の起倒動作は起倒機構22によって駆動され、起倒機構22は制御部23によって制御される。   Next, functions of the substrate stopping mechanism 9 and the substrate detection sensor 18 will be described with reference to FIG. As shown in FIG. 3A, the substrate stop mechanism 9 has a structure in which a substrate stopper 20 is provided at a substrate stop position along the transfer conveyor 6 so as to be able to rise and fall around a pin 20a. The raising / lowering operation of the substrate stopper 20 is driven by the raising / lowering mechanism 22, and the raising / lowering mechanism 22 is controlled by the control unit 23.

基板ストッパ20が起立した状態では、図3(b)に示すように、基板ストッパ20は搬送コンベア6による基板搬送レベルLを横切った状態で直立する。そして搬送コンベア6上を搬送された基板8が停止位置に接近し、基板ストッパ20に基板8の前端部が当接
することにより、基板8の移動が停止する。また基板ストッパ20が倒伏した状態では、搬送コンベア6上の基板8は基板ストッパ20との干渉を生じることなく、搬送方向へ移動する。
In the state where the substrate stopper 20 stands upright, the substrate stopper 20 stands upright while crossing the substrate transport level L by the transport conveyor 6 as shown in FIG. Then, the substrate 8 transported on the transport conveyor 6 approaches the stop position, and the front end of the substrate 8 comes into contact with the substrate stopper 20, whereby the movement of the substrate 8 is stopped. Further, in a state where the substrate stopper 20 is laid down, the substrate 8 on the transport conveyor 6 moves in the transport direction without causing interference with the substrate stopper 20.

基板ストッパ20の搬送方向の上流側の直近位置には、基板検出センサ18が投光方向を基板搬送レベル側に向けて配設されている。基板検出センサ18は投光部と受光部を有し、投光部からの光が特定の反射面によって反射される反射光の有無によって検出対象の有無を検出する回帰反射型の光学センサである。基板ストッパ20の頂部には反射面21aが設けられた反射部21が固着されており、投光部から投光された光が反射面21aによって反射されて受光部に受光されるか否かによって、検出対象の基板8の有無を検出する。   A substrate detection sensor 18 is disposed at a position closest to the upstream side of the transport direction of the substrate stopper 20 with the light projecting direction toward the substrate transport level. The substrate detection sensor 18 includes a light projecting unit and a light receiving unit, and is a regressive reflection type optical sensor that detects the presence / absence of a detection target based on the presence / absence of reflected light reflected from a specific reflecting surface. . A reflecting portion 21 provided with a reflecting surface 21a is fixed to the top of the substrate stopper 20, and the light projected from the light projecting portion is reflected by the reflecting surface 21a and received by the light receiving portion. The presence or absence of the substrate 8 to be detected is detected.

すなわち、図3(b)に示すように、基板搬送機構の基板停止位置に基板8が基板ストッパ20によって停止した状態では、基板検出センサ18から投光された光は基板8によって遮光され、反射部21には照射されない。したがって基板検出センサ18は反射面21aからの反射光を受光せず、「基板有」が検出される。そして基板停止位置に基板8がまだ到着していないときには、基板検出センサ18から投光された光は遮光されることなく反射部21に照射され、反射面21aによって反射されて基板検出センサ18によって反射光が受光される。これにより、「基板無」が検出される。   That is, as shown in FIG. 3B, when the substrate 8 is stopped by the substrate stopper 20 at the substrate stop position of the substrate transport mechanism, the light projected from the substrate detection sensor 18 is blocked by the substrate 8 and reflected. The part 21 is not irradiated. Therefore, the substrate detection sensor 18 does not receive the reflected light from the reflecting surface 21a, and “substrate presence” is detected. When the substrate 8 has not yet arrived at the substrate stop position, the light projected from the substrate detection sensor 18 is irradiated to the reflecting portion 21 without being blocked, reflected by the reflecting surface 21a, and then reflected by the substrate detection sensor 18. The reflected light is received. Thereby, “no substrate” is detected.

この基板検出センサ18による検出信号は制御部23に送られ、制御部23がこの検出信号に基づいて、搬送駆動部24及び起倒機構22を制御することにより、所定の搬送動作が行われる。制御部23による基板検出処理において、制御部23は動作シーケンス上で予め定められた所定タイミングにおいてのみ、基板検出センサ18からの検出信号を受信し、基板検出結果を出力するようにしている。すなわち、基板ストッパ20の起倒動作との組み合わせにおいて、基板8の移動を停止させる目的で基板ストッパ20を起立させた状態においてのみ、基板検出センサ18の検出信号を制御部23が取り込むようにしている。   A detection signal from the substrate detection sensor 18 is sent to the control unit 23, and the control unit 23 controls the transport driving unit 24 and the raising / lowering mechanism 22 based on the detection signal, whereby a predetermined transport operation is performed. In the substrate detection process by the control unit 23, the control unit 23 receives a detection signal from the substrate detection sensor 18 and outputs a substrate detection result only at a predetermined timing predetermined in the operation sequence. That is, in combination with the raising / lowering operation of the substrate stopper 20, the control unit 23 captures the detection signal of the substrate detection sensor 18 only when the substrate stopper 20 is raised for the purpose of stopping the movement of the substrate 8. Yes.

次にこの搬送動作において、基板搬送機構5の基板停止位置における基板8の有無を検出する基板検出方法について、図4を参照して説明する。図4(a)に示すように、搬送コンベア6の搬送ベルト上には基板8が載置されており、上流側から移動経路に沿って移動している。このとき、基板停止機構9の基板ストッパ20は倒伏状態にある。そして図4(b)に示すように基板8が更に移動して基板停止位置に更に近接するタイミングにおいて、起倒機構22を駆動して基板ストッパ20を起立させ、板搬送機構5における基板8の移動を阻止可能な状態にする(ストッパ起立工程)。   Next, a substrate detection method for detecting the presence or absence of the substrate 8 at the substrate stop position of the substrate transport mechanism 5 in this transport operation will be described with reference to FIG. As shown to Fig.4 (a), the board | substrate 8 is mounted on the conveyance belt of the conveyance conveyor 6, and is moving along the movement path | route from the upstream. At this time, the substrate stopper 20 of the substrate stopping mechanism 9 is in a lying state. Then, as shown in FIG. 4B, at a timing when the substrate 8 further moves and comes closer to the substrate stop position, the raising / lowering mechanism 22 is driven to raise the substrate stopper 20, and the substrate transfer mechanism 5 moves the substrate 8. A state in which the movement can be blocked is made (stopper standing step).

基板ストッパ20を起立させたならば、制御部23によって基板検出センサ18による検出信号を受信可能な状態にする(検出準備工程)。これにより、基板検出センサ18によって基板停止位置における基板8の有無を検出可能な状態となる。そして図4(b)に示すように、基板ストッパ20が設けられた基板停止位置に基板8が未到着の状態において、基板検出センサ20の投光部から照射された光が基板ストッパ20の端部に設けられた反射部21で反射された反射光を、基板検出センサ18の受光部によって受光することにより、「基板無」を検出する(基板無検出工程)。   If the board | substrate stopper 20 is stood up, it will be in the state which can receive the detection signal by the board | substrate detection sensor 18 by the control part 23 (detection preparation process). As a result, the substrate detection sensor 18 can detect the presence or absence of the substrate 8 at the substrate stop position. Then, as shown in FIG. 4B, in a state where the substrate 8 has not arrived at the substrate stop position where the substrate stopper 20 is provided, the light irradiated from the light projecting portion of the substrate detection sensor 20 is the end of the substrate stopper 20. The reflected light reflected by the reflecting part 21 provided in the part is received by the light receiving part of the substrate detection sensor 18 to detect “no substrate” (substrate no detection step).

この後、基板8がさらに下流側に移動すると、図4(c)に示すように、基板8の前端部3aが基板ストッパ20に当接する。これにより、基板8は移動を停止する。この状態において、基板検出センサ18の投光部からの投射光は基板8によって遮光され、停止位置における基板8の存在が検出される。すなわち、基板8が基板停止位置に到着して基板ストッパ20により移動が阻止された状態において、基板検出センサ20の投光部から照
射された光が基板8によって遮光され、反射部21からの反射光を基板検出センサ20の受光部が受光しないことにより、「基板有」を検出する(基板有検出工程)。
Thereafter, when the substrate 8 moves further downstream, the front end portion 3a of the substrate 8 comes into contact with the substrate stopper 20, as shown in FIG. Thereby, the substrate 8 stops moving. In this state, the projection light from the light projecting portion of the substrate detection sensor 18 is shielded by the substrate 8, and the presence of the substrate 8 at the stop position is detected. That is, when the substrate 8 arrives at the substrate stop position and is prevented from moving by the substrate stopper 20, the light emitted from the light projecting unit of the substrate detection sensor 20 is blocked by the substrate 8 and reflected from the reflecting unit 21. When the light receiving unit of the substrate detection sensor 20 does not receive the light, “substrate presence” is detected (substrate presence detection step).

そしてこの検出信号に基づいて、基板位置決め動作などの後続の動作シーケンスが進行する。この基板検出において、検出対象となる基板8の検出位置は常に基板8の前端部の直近位置であり、基板8内に設けられた開孔部などの不規則部分が検出位置となる事態が発生しない。したがって、このような形状の不規則部分に基板検出センサの投射光が照射されることによる誤検出を防止することができる。   Based on this detection signal, a subsequent operation sequence such as a substrate positioning operation proceeds. In this substrate detection, the detection position of the substrate 8 to be detected is always the closest position to the front end portion of the substrate 8, and an irregular portion such as an opening provided in the substrate 8 becomes the detection position. do not do. Therefore, it is possible to prevent erroneous detection due to irradiation of projection light of the substrate detection sensor to the irregular portion having such a shape.

この後、基板位置決め部1によって基板8をマスクプレート12に対して位置決めする位置決め作業が終了したならば、図4(d)に示すように、基板ストッパ20を倒伏させるとともに、基板検出センサ18による検出信号を受信不可状態にする(検出停止工程)。これにより、上方に位置するマスクプレート12からの反射光を受光することによる誤検出が発生しない。   Thereafter, when the positioning operation for positioning the substrate 8 with respect to the mask plate 12 by the substrate positioning unit 1 is completed, the substrate stopper 20 is laid down as shown in FIG. The detection signal is disabled (detection stop process). Thereby, the erroneous detection by receiving the reflected light from the mask plate 12 located above does not occur.

次いで、図4(e)に示すようにZ軸テーブル4を駆動して基板8を上昇させ、基板8をマスクプレート12の下面に当接させた後、基板8へのスクリーン印刷が実行される。そしてスクリーン印刷が終了して基板8をマスクプレート12から離隔させる版離れの後、基板8を下流側へ搬送してスクリーン印刷作業の1サイクルが終了する。そして次の基板が搬入される際には、ストッパ起立、検出準備、基板無検出、基板有検出および検出停止の各工程が順次実行される。   Next, as shown in FIG. 4 (e), the Z-axis table 4 is driven to raise the substrate 8, the substrate 8 is brought into contact with the lower surface of the mask plate 12, and then screen printing on the substrate 8 is executed. . After the screen printing is finished and the plate is separated to separate the substrate 8 from the mask plate 12, the substrate 8 is transported to the downstream side, and one cycle of the screen printing operation is completed. When the next substrate is carried in, the steps of stopper erection, detection preparation, substrate non-detection, substrate presence detection, and detection stop are sequentially executed.

上記説明したように、本実施の形態に示す基板検出方法は、基板検出センサ18として回帰反射型の光学センサを用い、基板ストッパ20の端部に反射部21を配置した構成とするとともに、基板検出センサ18の検出信号の受信・非受信を基板ストッパ20の動作と同期させて制御しながら基板検出処理を行うようにしている。   As described above, the substrate detection method shown in the present embodiment has a configuration in which a retroreflective optical sensor is used as the substrate detection sensor 18 and the reflection portion 21 is disposed at the end of the substrate stopper 20. Substrate detection processing is performed while controlling reception / non-reception of the detection signal of the detection sensor 18 in synchronization with the operation of the substrate stopper 20.

したがって、検出対象の基板種類によって、検出対象部位の色や表面光沢が異なる場合にあっても、基板検出センサによる検出結果が基板の色や表面性状によって左右されることがない。これにより、基板停止位置における基板検出センサによる基板誤検出を確実に防止することができる。   Therefore, even when the color and surface gloss of the detection target part differ depending on the type of the detection target substrate, the detection result by the substrate detection sensor does not depend on the color or surface property of the substrate. Accordingly, it is possible to reliably prevent erroneous substrate detection by the substrate detection sensor at the substrate stop position.

なお上記実施の形態では、電子部品実装用装置としてスクリーン印刷装置に対して本発明を適用する例を示したが、本発明はこれに限定されるものではなく、基板に電子部品を実装するの実装装置など、同様の基板搬送機構によって基板を搬送する装置に対しても適用可能である。   In the above embodiment, an example in which the present invention is applied to a screen printing apparatus as an electronic component mounting apparatus has been described. However, the present invention is not limited to this, and an electronic component is mounted on a substrate. The present invention can also be applied to a device that transports a substrate by a similar substrate transport mechanism, such as a mounting device.

本発明の電子部品実装用装置における基板検出方法は、基板停止位置における基板検出センサの誤検出を確実に防止することができるという効果を有し、電子部品実装装置やスクリーン印刷装置などの電子部品実装用装置において基板搬送機構の基板停止位置における基板の有無を検出する用途に利用可能である。   The substrate detection method in the electronic component mounting apparatus according to the present invention has an effect that the erroneous detection of the substrate detection sensor at the substrate stop position can be surely prevented, and an electronic component such as an electronic component mounting apparatus or a screen printing apparatus. The mounting apparatus can be used for detecting the presence or absence of a substrate at a substrate stop position of the substrate transport mechanism.

本発明の一実施の形態のスクリーン印刷装置の側面図The side view of the screen printing apparatus of one embodiment of this invention 本発明の一実施の形態のスクリーン印刷装置の平面図The top view of the screen printing apparatus of one embodiment of this invention 本発明の一実施の形態のスクリーン印刷装置の基板ストッパの構成説明図Structure explanatory drawing of the board | substrate stopper of the screen printing apparatus of one embodiment of this invention 本発明の一実施の形態のスクリーン印刷方法における基板検出方法の説明図Explanatory drawing of the board | substrate detection method in the screen printing method of one embodiment of this invention

符号の説明Explanation of symbols

1 基板位置決め部
5 基板搬送機構
6 搬送コンベア
8 基板
9 基板停止機構
18 基板検出センサ
20 基板ストッパ
21 反射部
22 起倒機構
DESCRIPTION OF SYMBOLS 1 Substrate positioning part 5 Substrate transport mechanism 6 Conveyor 8 Substrate 9 Substrate stop mechanism 18 Substrate detection sensor 20 Substrate stopper 21 Reflector 22 Tilting mechanism

Claims (1)

基板に電子部品を実装した実装基板を製造する過程で使用される電子部品実装用装置において、基板搬送機構の基板停止位置における基板の有無を検出する電子部品実装用装置における基板検出方法であって、前記基板停止位置に起倒自在に設けられた基板ストッパと、前記基板ストッパの起倒動作を駆動する起倒機構と、前記起倒機構を制御する制御部とを備え、
前記基板ストッパを起立させて前記基板搬送機構における基の移動を阻止可能な状態にするストッパ起立工程と、前記基板ストッパの上流側の直近位置に投光方向を基板搬送レベル側に向けて配設された回帰反射型の光学センサを用いた基板検出センサによる検出信号を受信可能状態にする検出準備工程と、基板が前記基板停止位置に未到着の状態において前記基板検出センサの投光部から照射された光が前記基板ストッパの端部に設けられた反射部で反射された反射光を基板検出センサの受光部によって受光することにより「基板無」を検出する基板無検出工程と、基板が前記基板停止位置に到着して前記基板ストッパにより移動が阻止された状態において前記基板検出センサの投光部から照射された光が前記基板によって遮光され前記反射光を前記受光部が受光しないことにより「基板有」を検出する基板有検出工程と、前記基板ストッパを倒伏させるとともに前記基板検出センサによる検出信号を受信不可状態にする検出停止工程とを含み、
前記制御部は動作シーケンス上で予め定められた所定タイミングにおいて前記基板検出センサからの検出信号を受信し、この検出信号に基づいて前記起倒機構を制御することにより、基板の移動を停止させる目的で基板ストッパを起立させた状態においてのみ、前記基板検出センサの検出信号を前記制御部が取り込むようにしたことを特徴とする電子部品実装用装置における基板検出方法。
In the electronic component mounting apparatus used in the process of manufacturing the mounting substrate in which the electronic component is mounted on the substrate, the substrate detection method in the electronic component mounting apparatus for detecting the presence or absence of the substrate at the substrate stop position of the substrate transport mechanism, A substrate stopper provided at the substrate stop position so as to be tiltable, a tilting mechanism for driving the tilting operation of the substrate stopper, and a control unit for controlling the tilting mechanism,
Distribution wherein the stopper standing step to prevent ready movement of the base plate in the substrate transfer mechanism for the substrate stopper is erected, with its projecting direction to the substrate conveying level side to the nearest position of the upstream side of the substrate stopper A detection preparation step for receiving a detection signal from a substrate detection sensor using a retroreflective optical sensor provided, and a light emitting unit of the substrate detection sensor in a state where the substrate has not arrived at the substrate stop position. A substrate non-detecting step of detecting “no substrate” by receiving the reflected light reflected by the reflecting portion provided at the end of the substrate stopper by the light receiving unit of the substrate detection sensor; and The light emitted from the light projecting portion of the substrate detection sensor in the state where the substrate stop position is reached and the movement is blocked by the substrate stopper is blocked by the substrate. Includes a substrate chromatic detection step of detecting a "substrate present" by the light receiving unit does not receive Shako, a detection stopping step of the reception disabled state detection signal by said substrate detecting sensor causes the collapsed said substrate stopper,
The control unit receives a detection signal from the substrate detection sensor at a predetermined timing predetermined in an operation sequence, and controls the raising / lowering mechanism based on the detection signal to stop the movement of the substrate. The substrate detection method in the electronic component mounting apparatus, wherein the control unit captures a detection signal of the substrate detection sensor only in a state where the substrate stopper is erected.
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