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JP4239129B2 - Plate-shaped body polishing apparatus and polishing pad truing method - Google Patents
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JP4239129B2 - Plate-shaped body polishing apparatus and polishing pad truing method - Google Patents

Plate-shaped body polishing apparatus and polishing pad truing method Download PDF

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Publication number
JP4239129B2
JP4239129B2 JP2000115185A JP2000115185A JP4239129B2 JP 4239129 B2 JP4239129 B2 JP 4239129B2 JP 2000115185 A JP2000115185 A JP 2000115185A JP 2000115185 A JP2000115185 A JP 2000115185A JP 4239129 B2 JP4239129 B2 JP 4239129B2
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JP
Japan
Prior art keywords
polishing
polishing pad
plate
expansion
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP2000115185A
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Japanese (ja)
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JP2001293651A (en
Inventor
逸郎 渡邉
正敏 大山
真 福田
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AGC Inc
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Asahi Glass Co Ltd
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Publication date
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Priority to JP2000115185A priority Critical patent/JP4239129B2/en
Publication of JP2001293651A publication Critical patent/JP2001293651A/en
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Publication of JP4239129B2 publication Critical patent/JP4239129B2/en
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、板状体の研磨装置に係り、特に液晶ディスプレイ用ガラス基板を製造するための研磨装置、及びそれに備えられた研磨パッドのツルーイング方法に関する。
【0002】
【従来の技術】
図6、図7は、液晶ディスプレイ用ガラス基板を製造する連続式研磨装置の概略構成図である。図6は円形の研磨パッドを設けた定盤を回転させてガラス板を研磨する装置、図7は矩形の研磨パッドを設けた定盤を揺動させてガラス板を研磨する装置を示している。
【0003】
図6、図7において研磨装置1、1´は、ガラス基板となるガラス板2を、ワーク定盤3上に設けた発泡ウレタン製のテーブルパッド4で固定し、これを搬送手段5で搬送しながら、その搬送ラインに設置されている複数台の研磨装置1、1´によってガラス板2を少量ずつ研磨して所定厚さのガラス基板を製造する。
【0004】
研磨装置1は、図8に示すように研磨パッド6が支持されたアルミプレート7を研磨定盤8に固定することにより構成されている。この研磨装置1の下方に、ワーク定盤3(図6参照)上のテーブルパッド4(図8参照)に固定されたガラス板2が搬送され、ガラス板2が研磨装置1を通過する際に研磨パッド6により研磨される。
【0005】
【発明が解決しようとする課題】
しかしながら、連続式研磨装置1は、研磨パッド6の外側からガラス板2が入り込む装置であり、研磨パッド6の端部6Aに圧力が集中するという特性があるため、研磨パッド6を通過したガラス板2の研磨面に研磨むらが発生するという問題があった。
【0006】
本発明はこのような事情に鑑みてなされたもので、研磨パッドの端部に発生する圧力集中を緩和して板状体の研磨面に発生する研磨むらを抑えることができる板状体の研磨装置を提供することを目的とする。
【0007】
【課題を解決するための手段】
本発明は、前記目的を達成するために、研磨定盤に研磨パッドを設け、該研磨パッドを板状体に押し付けるとともに、研磨パッドと板状体とを相対的に移動させて板状体を研磨する研磨装置において、前記研磨定盤の端部と前記研磨パッドとの間に膨縮自在な膨縮手段を設け、該膨縮手段を膨縮させることにより、研磨パッドの端部の加圧を制御可能にし、前記膨縮手段は、前記研磨パッドをツルーイング用砥石で面出しする際に膨張され、研磨パッドの端部がツルーイング砥石で研削されることを特徴とする。
【0010】
本発明によれば、研磨パッドを板状体に押し付けると、膨縮手段が研磨パッドの端部において押圧されて収縮するので、研磨パッドの端部が板状体から逃げる。これにより、研磨パッドの端部に発生する圧力集中が緩和されるので、板状体に発生する研磨むらを抑えることができる。
【0011】
請求項に記載の発明は、前記膨縮手段としてエアーバッグを適用したものであり、エアーバッグは、エアを供給するだけで膨張するので、簡易な構造で膨縮手段を構成することができる。
請求項3に記載の発明は、板状体が液晶ディスプレイ用ガラス基板である。
また、請求項4に記載の発明は、研磨定盤に研磨パッドを設け、該研磨パッドを板状体に押し付けるとともに、研磨パッドと板状体とを相対的に移動させて板状体を研磨する研磨装置における研磨パッドのツルーイング方法であって、前記研磨定盤の端部と前記研磨パッドとの間に膨縮自在な膨縮手段を設け、該膨縮手段を膨縮させることにより、研磨パッドの端部の加圧を制御可能にし、前記膨縮手段は、前記研磨パッドをツルーイング用砥石で面出しする際に膨張させ、研磨パッドの端部をツルーイング砥石で研削することを特徴とする板状体を研磨する研磨装置における研磨パッドのツルーイング方法である。
【0012】
本発明によれば、研磨パッドをツルーイング用砥石で面出しする時に、膨縮手段を膨張させて研磨パッドの端部を加圧し、該端部をツルーイング用砥石に押し付けて研削する。これにより、面出しされた研磨パッドには、従来のような突起が発生せず、良好に面出しされる。よって、板状体の研磨精度を向上させることができる。
【0013】
【発明の実施の形態】
以下添付図面に従って本発明に係る板状体の研磨装置の好ましい実施の形態を詳説する。
【0014】
第1の実施の形態の研磨装置は、図1の如く研磨パッド6の端部6Aの位置に対応する研磨定盤8の端部を切除している。かかる研磨装置によれば、研磨定盤8の端部を切除して形成された空間部9に、アルミプレート7の弾性変形により研磨パッド6の端部6Aが逃げ込むので、圧力集中が緩和され、研磨むらを抑えることができる。
【0015】
しかしながら、図1の研磨装置は、研磨パッド6をツルーイング用砥石に押し付けて面出しする時に、研磨パッド6の端部6Aがツルーイング用砥石から逃げてしまうので、その端部6Aが面出しされず、ツルーイング後に前記逃げが戻り、図2の如く突起のような形状として残存するという問題があった。
【0016】
図3は、第2の実施の形態の研磨装置10の構成を示す断面図である。この研磨装置10は、液晶ディスプレイ用ガラス基板の連続式研磨装置に適用される装置であり、不図示のガラス板搬送ラインに沿って複数台設置されている。
【0017】
研磨装置10は、主として支持定盤12、研磨定盤14、研磨パッド16、アルミプレート17及びエアーバッグ(膨縮手段)18等から構成される。この支持定盤12の上端軸部12Aが、不図示のモータの駆動軸に連結され、このモータからの回転駆動力によって所定の回転数で回転される。なお、支持定盤12、研磨定盤14及びアルミプレート17には、研磨パッド16に研磨液(スラリ)を供給するためのスラリ供給路13が設けられている。
【0018】
研磨定盤14は、鋳鉄製の高剛性構造であり、その表面形状は円形、若しくは矩形状に形成されている。なお、本実施の形態では、円形形状として研磨定盤14を説明する。
【0019】
支持定盤12と研磨定盤14との間には、複数の空気ばね20、20…が配設されている。この空気ばね20は、支持定盤12に形成されたエア通路22、圧力調整装置及び不図示のロータリージョイントを介してエアポンプに接続されている。また、支持定盤12と研磨定盤14とは、複数の積層ゴム24、24…を介して連結されている。
【0020】
一方、エアーバッグ18は、研磨定盤14の下面の端部外周に形成された凹条溝26に配設されている。このエアーバッグ18は、略リング状に形成された1枚のゴムシートで形成されている。また、図4に示すようにエアーバッグ18の外周部18A及び内周部18Bが、研磨定盤14にボルト28、30で固定されたリング状パッキン32、34によってシールされている。
【0021】
更に、エアーバッグ18と凹条溝26との空間部19に連通するように、研磨定盤14の外周部にはエア通路36が形成される。このエア通路36は、図3の如くバルブ38及び圧力調整装置を介してエア通路22と連結されている。したがって、バルブ38が開放されると、エアポンプからの圧縮エアがロータリージョイント及びエア通路36を介して図4の空間部19に供給される。これにより、エアーバッグ18が膨張するので、アルミプレート17に支持された研磨パッド16の端部が下方に向けて押圧され、下方に弾性変形される。
【0022】
次に、前記の如く構成された研磨装置10の作用について説明する。
【0023】
まず、ガラス板の研磨時には、圧縮エアがエアーバッグ18に供給されないようにバルブ38を閉じておくか、又は、バルブ38を開けたままで圧縮エアー圧をツルーイング用砥石で面出しする時よりも低い適当に選択された圧力に保っておく。この状態で研磨パッド16をガラス板に押し付けると、エアーバッグ18が研磨パッド16の端部に押圧されて収縮するので、研磨パッド16の端部がガラス板から逃げる。これにより、研磨パッド16の端部に発生する圧力集中が緩和されるので、ガラス板に発生する研磨むらを抑えることができる。
【0024】
次に、研磨パッド16をツルーイング用砥石で面出しする時には、バルブ38を開放し、エアーバッグ18を図5(A)の如く膨張させるか、又は、前述の様に研磨中にバルブ38を開けたままにする時には、前記で選択された圧力よりも高い適当に選択された圧力に保っておく。これにより、エアーバッグ18によって研磨パッド16の端部16Aがアルミプレート17ごと加圧され、この端部16Aが図5(B)のツルーイング用砥石40に押し付けられて研削される。したがって、面出しされた研磨パッド16の端部16Aには、従来のような突起が発生せず、図5(C)に示すようなR面16Bが形成され、良好に面出しされる。
【0025】
このように面出しされた研磨パッド16で、ガラス板の研磨を継続して実施すると、研磨パッド16の端部16AはR面16Bが形成されているので、エアーバッグ18が収縮するまでもなく、端部16Aに発生する圧力集中が緩和される。よって、ガラス板の研磨精度が向上する。
【0026】
本実施の形態では、膨縮手段として、エアを供給するだけで膨張するエアーバッグ18を適用したので、簡易な構造で膨縮手段を構成することができる。
【0027】
なお、本実施の形態では、膨縮手段としてエアーバッグ18を適用したが、エアーバッグ18に代えて、圧電素子等の膨縮可能な膨縮手段を適用し、研磨パッド16のツルーイング時に膨張動作させるようにしてもよい。
【0028】
【発明の効果】
以上説明したように本発明に係る板状体の研磨装置によれば、研磨定盤の端部と研磨パッドの端部との間に、研磨パッドの端部が逃げ込む空間部を形成し、板状体の研磨時において、前記空間部に研磨パッドの端部が逃げ込むので、圧力集中が緩和され、研磨むらを抑えることができる。
【0029】
また、本発明によれば、支持定盤の端部と研磨パッドとの間に膨縮自在な膨縮手段を設け、膨縮手段を膨張させることにより、研磨パッドの端部を加圧可能に構成したので、膨縮手段の収縮作用によって研磨パッドの端部に発生する圧力集中を緩和でき、また、膨縮手段を膨張させて研磨パッドの端部をツルーイング用砥石で研削させることにより、研磨パッドを良好に面出しすることができる。
【0030】
また、本発明は、前記膨縮手段としてエアーバッグを適用したので、簡易な構造で膨縮手段を構成することができる。
【図面の簡単な説明】
【図1】支持定盤の端部の剛性を低くして圧力集中を防止した説明図
【図2】ツルーイング終了した研磨パッドの要部拡大断面図
【図3】実施の形態の研磨装置の構造を示す断面図
【図4】図3の研磨装置に設けられたエアーバッグの要部拡大断面図
【図5】エアーバッグによる研磨パッドのツルーイング方法を示す遷移図
【図6】円形の研磨パッドを使用した連続式研磨装置の概略図
【図7】矩形の研磨パッドを使用した連続式研磨装置の概略図
【図8】従来の研磨装置によるガラス板研磨状況を示す説明図
【符号の説明】
6、16…研磨パッド、8、14…研磨定盤、9…空間部、10…研磨装置、12…支持定盤、18…エアーバッグ(膨縮手段)、20…空気ばね、40…ツルーイング用砥石
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a plate-like body polishing apparatus, and more particularly to a polishing apparatus for manufacturing a glass substrate for a liquid crystal display , and a truing method for a polishing pad provided therein.
[0002]
[Prior art]
6 and 7 are schematic configuration diagrams of a continuous polishing apparatus for manufacturing a glass substrate for liquid crystal display. 6 shows an apparatus for polishing a glass plate by rotating a surface plate provided with a circular polishing pad, and FIG. 7 shows an apparatus for polishing a glass plate by swinging the surface plate provided with a rectangular polishing pad. .
[0003]
In FIGS. 6 and 7, the polishing apparatuses 1 and 1 ′ fix the glass plate 2 as a glass substrate with a urethane foam table pad 4 provided on the work surface plate 3, and convey it by the conveying means 5. However, the glass plate 2 is polished little by little by a plurality of polishing apparatuses 1, 1 ′ installed in the transfer line to manufacture a glass substrate having a predetermined thickness.
[0004]
The polishing apparatus 1 is configured by fixing an aluminum plate 7 on which a polishing pad 6 is supported to a polishing surface plate 8 as shown in FIG. When the glass plate 2 fixed to the table pad 4 (see FIG. 8) on the work surface plate 3 (see FIG. 6) is conveyed below the polishing apparatus 1, and when the glass plate 2 passes through the polishing apparatus 1, Polishing is performed by the polishing pad 6.
[0005]
[Problems to be solved by the invention]
However, the continuous polishing apparatus 1 is an apparatus in which the glass plate 2 enters from the outside of the polishing pad 6 and has a characteristic that pressure is concentrated on the end portion 6A of the polishing pad 6. Therefore, the glass plate that has passed through the polishing pad 6 is used. There was a problem that uneven polishing occurred on the polished surface of No. 2.
[0006]
The present invention has been made in view of such circumstances, and polishing of a plate-like body that can alleviate the pressure concentration generated at the end of the polishing pad and suppress uneven polishing generated on the polishing surface of the plate-like body. An object is to provide an apparatus.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a polishing pad on a polishing surface plate, presses the polishing pad against the plate-like body, and moves the plate-like body relative to each other by moving the polishing pad and the plate-like body relative to each other. In a polishing apparatus for polishing , an expansion / contraction means is provided between an end of the polishing surface plate and the polishing pad, and the end of the polishing pad is pressurized by expanding / contracting the expansion / contraction means. The expansion / contraction means is expanded when the polishing pad is surfaced with a truing grindstone, and the end of the polishing pad is ground with a truing grindstone .
[0010]
According to the onset bright, pressed against the polishing pad to the plate-like body, so is pressed to shrink at the end of the polishing pad deflating means, the ends of the polishing pad to escape from the plate-like body. As a result, the pressure concentration generated at the end of the polishing pad is alleviated, so that polishing unevenness generated in the plate-like body can be suppressed.
[0011]
The invention according to claim 2 applies an air bag as the inflating / contracting means, and the air bag inflates only by supplying air, so that the inflating / contracting means can be configured with a simple structure. .
In the invention described in claim 3, the plate-like body is a glass substrate for liquid crystal display.
According to a fourth aspect of the present invention, a polishing pad is provided on the polishing surface plate, the polishing pad is pressed against the plate-like body, and the plate-like body is polished by relatively moving the polishing pad and the plate-like body. A polishing pad truing method in a polishing apparatus, wherein an expansion / contraction means is provided between an end portion of the polishing surface plate and the polishing pad, and the expansion / contraction means is expanded and contracted to polish the polishing pad. The pressurization of the end of the pad is made controllable, and the expansion / contraction means expands when the polishing pad is chamfered with a truing grindstone, and the end of the polishing pad is ground with a truing grindstone. A polishing pad truing method in a polishing apparatus for polishing a plate-like body.
[0012]
According to the onset bright, when put face polishing pad truing grindstone, pressurizing the end portion of the polishing pad to inflate the inflation and deflation means, by pressing the end portion in the truing grindstone for grinding. As a result, the surface-exposed polishing pad is satisfactorily surfaced without any conventional protrusions. Therefore, the polishing accuracy of the plate-like body can be improved.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
A preferred embodiment of a plate-like body polishing apparatus according to the present invention will be described below in detail with reference to the accompanying drawings.
[0014]
The polishing apparatus according to the first embodiment cuts off the end of the polishing surface plate 8 corresponding to the position of the end 6A of the polishing pad 6 as shown in FIG. According to such a polishing apparatus, since the end portion 6A of the polishing pad 6 escapes to the space portion 9 formed by cutting the end portion of the polishing surface plate 8 due to elastic deformation of the aluminum plate 7, the pressure concentration is relieved. Uneven polishing can be suppressed.
[0015]
However, in the polishing apparatus shown in FIG. 1, when the polishing pad 6 is pressed against the truing grindstone to face the end, the end 6A of the polishing pad 6 escapes from the truing grindstone, so that the end 6A is not chamfered. However, there was a problem that the escape returned after truing and remained as a projection as shown in FIG.
[0016]
FIG. 3 is a cross-sectional view illustrating a configuration of the polishing apparatus 10 according to the second embodiment. The polishing apparatus 10 is an apparatus applied to a continuous polishing apparatus for glass substrates for liquid crystal displays, and a plurality of polishing apparatuses 10 are installed along a glass plate conveyance line (not shown).
[0017]
The polishing apparatus 10 is mainly composed of a support surface plate 12, a polishing surface plate 14, a polishing pad 16, an aluminum plate 17, an air bag (expansion / contraction means) 18, and the like. An upper end shaft portion 12A of the support surface plate 12 is connected to a drive shaft of a motor (not shown), and is rotated at a predetermined rotational speed by a rotational driving force from the motor. The support surface plate 12, the polishing surface plate 14, and the aluminum plate 17 are provided with a slurry supply path 13 for supplying a polishing liquid (slurry) to the polishing pad 16.
[0018]
The polishing surface plate 14 is a cast iron high-rigidity structure, and its surface shape is formed in a circular or rectangular shape. In the present embodiment, the polishing surface plate 14 will be described as a circular shape.
[0019]
A plurality of air springs 20, 20... Are arranged between the support surface 12 and the polishing surface 14. The air spring 20 is connected to an air pump through an air passage 22 formed in the support surface plate 12, a pressure adjusting device, and a rotary joint (not shown). Further, the supporting surface plate 12 and the polishing surface plate 14 are connected via a plurality of laminated rubbers 24, 24.
[0020]
On the other hand, the airbag 18 is disposed in a groove 26 formed on the outer periphery of the end of the lower surface of the polishing surface plate 14. The airbag 18 is formed of a single rubber sheet formed in a substantially ring shape. As shown in FIG. 4, the outer peripheral portion 18 </ b> A and the inner peripheral portion 18 </ b> B of the airbag 18 are sealed by ring-shaped packings 32 and 34 fixed to the polishing surface plate 14 with bolts 28 and 30.
[0021]
Further, an air passage 36 is formed in the outer peripheral portion of the polishing surface plate 14 so as to communicate with the space 19 between the airbag 18 and the groove 26. The air passage 36 is connected to the air passage 22 via a valve 38 and a pressure adjusting device as shown in FIG. Therefore, when the valve 38 is opened, the compressed air from the air pump is supplied to the space 19 in FIG. 4 through the rotary joint and the air passage 36. As a result, the airbag 18 is inflated, so that the end of the polishing pad 16 supported by the aluminum plate 17 is pressed downward and elastically deformed downward.
[0022]
Next, the operation of the polishing apparatus 10 configured as described above will be described.
[0023]
First, at the time of polishing the glass plate, the valve 38 is closed so that compressed air is not supplied to the air bag 18, or the compressed air pressure is lower than when the valve 38 is opened and the compressed air pressure is chamfered with a truing grindstone. Maintain a suitably selected pressure. When the polishing pad 16 is pressed against the glass plate in this state, the airbag 18 is pressed against the end of the polishing pad 16 and contracts, so that the end of the polishing pad 16 escapes from the glass plate. Thereby, since the pressure concentration generated at the end of the polishing pad 16 is alleviated, polishing unevenness generated in the glass plate can be suppressed.
[0024]
Next, when the polishing pad 16 is chamfered with a truing grindstone, the valve 38 is opened and the airbag 18 is inflated as shown in FIG. 5A, or the valve 38 is opened during polishing as described above. When left open, it is kept at a suitably selected pressure that is higher than the pressure selected above. Thus, the end portion 16A of the polishing pad 16 is pressed together with the aluminum plate 17 by the air bag 18, and the end portion 16A is pressed against the truing grindstone 40 of FIG. Therefore, the protrusion 16 as in the prior art does not occur on the end portion 16A of the polished polishing pad 16, and the R surface 16B as shown in FIG.
[0025]
When polishing of the glass plate is continued with the polishing pad 16 thus surfaced, the end surface 16A of the polishing pad 16 is formed with the R surface 16B, so the air bag 18 does not need to contract. The pressure concentration generated at the end 16A is alleviated. Therefore, the polishing accuracy of the glass plate is improved.
[0026]
In the present embodiment, since the airbag 18 that is inflated simply by supplying air is applied as the inflating / contracting means, the inflating / contracting means can be configured with a simple structure.
[0027]
In the present embodiment, the airbag 18 is applied as the expansion / contraction means. However, instead of the airbag 18, an expansion / contraction means such as a piezoelectric element is applied, and the expansion operation is performed when the polishing pad 16 is truing. You may make it make it.
[0028]
【The invention's effect】
As described above, according to the polishing apparatus for a plate-like body according to the present invention, a space part into which the end of the polishing pad escapes is formed between the end of the polishing surface plate and the end of the polishing pad, At the time of polishing the shaped body, the end of the polishing pad escapes into the space, so that the pressure concentration is alleviated and polishing unevenness can be suppressed.
[0029]
In addition, according to the present invention, the expansion / contraction means is provided between the end portion of the support surface plate and the polishing pad, and the end portion of the polishing pad can be pressurized by expanding the expansion / contraction means. Since it is configured, the pressure concentration generated at the end of the polishing pad due to the contracting action of the expansion / contraction means can be relieved, and the expansion / contraction means is expanded and polished by grinding the end of the polishing pad with a truing grindstone. The pad can be surfaced satisfactorily.
[0030]
In the present invention, since the airbag is applied as the expansion / contraction means, the expansion / contraction means can be configured with a simple structure.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram in which pressure is prevented from being concentrated by lowering the rigidity of an end portion of a supporting surface plate. FIG. 2 is an enlarged cross-sectional view of a main part of a polishing pad after truing. FIG. 3 is a structure of a polishing apparatus according to an embodiment. FIG. 4 is an enlarged cross-sectional view of the main part of an air bag provided in the polishing apparatus of FIG. 3. FIG. 5 is a transition diagram showing a truing method of the polishing pad by the air bag. Schematic diagram of the continuous polishing apparatus used. [Fig. 7] Schematic diagram of the continuous polishing apparatus using a rectangular polishing pad. [Fig. 8] An explanatory diagram showing the state of glass plate polishing by a conventional polishing apparatus.
6, 16 ... Polishing pad, 8, 14 ... Polishing surface plate, 9 ... Space part, 10 ... Polishing device, 12 ... Support surface plate, 18 ... Air bag (expansion / contraction means), 20 ... Air spring, 40 ... For truing Whetstone

Claims (4)

研磨定盤に研磨パッドを設け、該研磨パッドを板状体に押し付けるとともに、研磨パッドと板状体とを相対的に移動させて板状体を研磨する研磨装置において、
前記研磨定盤の端部と前記研磨パッドとの間に膨縮自在な膨縮手段を設け、該膨縮手段を膨縮させることにより、研磨パッドの端部の加圧を制御可能にし
前記膨縮手段は、前記研磨パッドをツルーイング用砥石で面出しする際に膨張され、研磨パッドの端部がツルーイング砥石で研削されることを特徴とする板状体の研磨装置。
In a polishing apparatus for providing a polishing pad on a polishing platen, pressing the polishing pad against a plate-like body, and polishing the plate-like body by relatively moving the polishing pad and the plate-like body,
By providing expansion / contraction means that can freely expand and contract between the end of the polishing surface plate and the polishing pad, by allowing the expansion / contraction means to expand and contract, pressurization of the end of the polishing pad can be controlled ,
The expansion / contraction means is expanded when the polishing pad is chamfered with a truing grindstone, and an end portion of the polishing pad is ground with a truing grindstone .
前記膨縮手段は、エアーバッグであることを特徴とする請求項に記載の板状体の研磨装置。The plate-like body polishing apparatus according to claim 1 , wherein the expansion / contraction means is an air bag. 板状体が液晶ディスプレイ用ガラス基板であることを特徴とする請求項1または2に記載の板状体の研磨装置。The plate-like body polishing apparatus according to claim 1 or 2, wherein the plate-like body is a glass substrate for a liquid crystal display. 研磨定盤に研磨パッドを設け、該研磨パッドを板状体に押し付けるとともに、研磨パッドと板状体とを相対的に移動させて板状体を研磨する研磨装置における研磨パッドのツルーイング方法であって、A polishing pad truing method in a polishing apparatus in which a polishing pad is provided on a polishing platen, the polishing pad is pressed against a plate-like body, and the polishing pad and the plate-like body are moved relative to each other to polish the plate-like body. And
前記研磨定盤の端部と前記研磨パッドとの間に膨縮自在な膨縮手段を設け、該膨縮手段を膨縮させることにより、研磨パッドの端部の加圧を制御可能にし、  By providing expansion / contraction means that can be expanded and contracted between an end portion of the polishing surface plate and the polishing pad, by allowing the expansion / contraction means to expand and contract, pressurization of the end portion of the polishing pad can be controlled,
前記膨縮手段は、前記研磨パッドをツルーイング用砥石で面出しする際に膨張させ、研磨パッドの端部をツルーイング砥石で研削することを特徴とする板状体を研磨する研磨装置における研磨パッドのツルーイング方法。  The expansion / contraction means expands when the polishing pad is chamfered with a truing grindstone, and grinds the end of the polishing pad with a truing grindstone. Truing method.
JP2000115185A 2000-04-17 2000-04-17 Plate-shaped body polishing apparatus and polishing pad truing method Expired - Fee Related JP4239129B2 (en)

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CN1326662C (en) * 2005-03-10 2007-07-18 浙江工业大学 Magnetic control type flexible polisher with air bag
CN1326661C (en) * 2005-03-10 2007-07-18 浙江工业大学 Magnetic rheology type flexible polisher with air bag
WO2007043263A1 (en) * 2005-10-14 2007-04-19 Asahi Glass Company, Limited Truing member for abrasive pad and truing method of abrasive pad
JP2009184074A (en) * 2008-02-06 2009-08-20 Sd Future Technology Co Ltd Polishing device
JP5408789B2 (en) * 2009-03-06 2014-02-05 エルジー・ケム・リミテッド Float glass polishing system
JP5408790B2 (en) * 2009-03-06 2014-02-05 エルジー・ケム・リミテッド Float glass polishing system
KR101342952B1 (en) * 2009-10-08 2013-12-18 주식회사 엘지화학 method and system for polishing glass
CN101823228B (en) * 2010-04-29 2011-12-21 浙江工业大学 Gas bag polishing tool capable of initiatively distributing abrasive particles
CN109676507B (en) * 2019-01-23 2020-03-27 厦门大学 High-speed air floatation main shaft air bag polishing device
KR20230127998A (en) * 2021-01-08 2023-09-01 가부시키가이샤 에바라 세이사꾸쇼 Substrate processing apparatus and substrate processing method

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