JP4243053B2 - Printed wiring board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a printed wiring board, and more particularly, when a surface mountable component or package component is mounted on a printed wiring board, it can be surface mounted with multiple types of external shapes that have the same function and are compatible with respect to mounting. The present invention relates to a printed wiring board capable of mounting various parts or package parts.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, BGA (Ball Grid Array) has been developed and widely used as an integrated circuit and surface-mountable component used in small computers having high functions. The BGA is a surface-mount type component in which spherical solder balls are arranged in a matrix corresponding to the electrode portions on the back surface of the component, and solder balls are used as connection portions of the printed wiring board.
[0003]
Further, CSP (Chip Size Package) in which BGA is further miniaturized has been used. Since these BGA or CSP packages are provided with electrode terminals on the bottom surface, there is a drawback that mounting displacement after component mounting cannot be confirmed at the connection portion of the printed wiring board.
[0004]
For example, Japanese Patent Laid-Open No. 2000-133898 proposes a simple method for confirming misalignment after mounting a BGA.
[0005]
In the BGA described in this patent publication, an outer edge of a package component to be mounted is surrounded by silk printing on a printed wiring board, and a shift is confirmed by a positional relationship between the silk printing and the component package.
[0006]
[Problems to be solved by the invention]
However, recent BGA package sockets have been developed by several companies, have the same functions, and are compatible in terms of mounting, but have different external sizes. Since it can only be displayed, it can be a socket only for a specific manufacturer, and it is advantageous in terms of purchasing parts from several companies that are advantageous in terms of supply and price, and mounting them selectively on a printed wiring board as appropriate. It cannot be fully utilized.
[0007]
In view of the above, the present invention takes into account the above-described conventional technology, and does not complicate the conventional manufacturing process, and is a low-cost, BGA having several types of external shapes that have the same functions and are compatible with respect to mounting. It is an object of the present invention to provide a printed wiring board capable of confirming the deviation of the mounting position.
[0008]
[Means for Solving the Problems]
To achieve the above object, according to the present invention, functions are the same, have a plurality kinds of profile compatible relates implementation, which can implement a surface mount component electrode terminals during mounting is not visible from the appearance In the wiring board, there is provided a printed wiring board characterized in that a confirmation line of an outer shape corresponding to each component is provided on the surface at a portion corresponding to the mounting position of the plurality of types of components.
[0009]
In the present invention, the confirmation line is characterized by being formed on the outer side by a predetermined dimension than the outer shape of the component. Alternatively, the confirmation line is formed outside the component outer shape by a dimension corresponding to an allowable error range of the component mounting .
[0010]
Furthermore, the confirmation line is provided at a plurality of locations along the component outline for one type of component.
[0011]
According to these configurations, since a misalignment confirmation line can be formed by forming a plurality of external shapes by silk printing or the like for one component, the conventional manufacturing process is complicated with a simple configuration. Therefore, it is possible to confirm a mounting position shift of a package component whose appearance such as solder joints such as BGA and CSP having several types of external features characterized by several types of functions / mounting compatibility is not visible at low cost.
[0012]
Further, according to the present invention, it is possible to determine at a glance which line should be confirmed when confirming the positional deviation.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[0014]
FIG. 1 shows a BGA package as an example of a package part whose appearance such as solder joint such as BGA / CSP having several types of external features characterized by function / mounting compatibility is not visible. Although these parts have different external shapes, they are the same in terms of function and have mounting compatibility.
[0015]
That is, BGA (type I) 1, BGA (type II) 2, and BGA (type III) 3 shown in FIG. 1A are all surface-mounted components, and connection terminals (for mounting on a printed wiring board ( (Not shown) cannot be distinguished from the appearance when the component is mounted on the printed circuit board. Further, when these components are arranged at predetermined mounting positions on the printed wiring board, the connection terminals on the printed wiring board cannot be seen.
[0016]
Although these parts are shown in a plan view in FIG. 1, the external shapes of the parts seen in the plan view are different from each other as shown. In other words, in a state where these components are mounted at predetermined positions on the printed wiring board, the positions of the outlines of the components are different from each other. FIG. 2 shows a state in which confirmation lines 6, 7, and 8 corresponding to the components 1, 2, and 3 are formed on the printed wiring board by silk printing.
[0017]
3 to 5 show the relationship between the outlines of the components 1, 2, and 3 and the check lines 6, 7, and 8 corresponding thereto.
[0018]
Since the BGA (type I) 1 has a rectangular outer shape in the mounted state, as shown in FIG. 3, the upper right corner and the lower left corner forming the opposite corner are used as a reference. On the printed wiring board, an L-shaped confirmation line 6 corresponding to the outer shape of the upper right corner of the BGA (Type I) at the predetermined mounting position and the lower left corner forming the diagonal is printed by silk printing. 4 Draw in advance. In consideration of a predetermined allowable error range, it is preferable to place the confirmation line 6 of the printed wiring board 4 outside the actual part outline of the BGA (type I) 1 by a slight dimension x.
[0019]
Since BGA (type II) 2 also has a rectangular outer shape in the mounted state, as shown in FIG. 4, a location different from the standard of BGA (type I) 1 is used as a reference. That is, in BGA (Type II) 2, the upper left corner of BGA (Type II) and its corner at a predetermined mounting position on the printed circuit board with reference to the upper left corner and the lower right corner that forms the opposite corner. An L-shaped confirmation line 7 corresponding to the outer shape of the diagonally lower right corner is previously drawn on the printed wiring board 4 by silk printing. In the same manner as described above, in consideration of a predetermined allowable error range, it is preferable to place the confirmation line 7 of the printed wiring board 4 outside by a slight dimension x from the outer shape of the BGA (type II) 2 component.
[0020]
In BGA (type III), as shown in FIG. 5, a different point from the above two BGA standards is used as a reference. That is, since the BGA (Type III) has an outer portion protruding outward at the upper center, a predetermined mounting position on the printed circuit board with reference to the convex outer portion, the left and right sides, and the lower center. A reverse cup shape corresponding to the outer shape of the protruding portion at the upper center of the BGA (Type III) 3 in FIG. 1, a straight line corresponding to a part of the left and right sides, and a linear confirmation line 8 corresponding to a part of the lower center. It is drawn in advance on a printed wiring board by silk printing. In exactly the same manner as described above, in consideration of a predetermined tolerance range, the confirmation line 8 of the printed wiring board 4 is placed outside the outline of the BGA (type III) part by a slight dimension x by silk printing. Is preferred.
[0021]
FIG. 6 shows confirmation lines 6, 7, 8 corresponding to the respective parts 1, 2, 3, and part names TYPE 1, TYPE 2, TYPE 3 corresponding to the respective confirmation lines when the above three types of parts are mounted. Each one is displayed. The confirmation lines 6, 7, 8 and the component display can be printed by any method, but in general, it is preferable to use silk printing widely used for various displays on the printed wiring board. It is possible to clearly grasp which part should be set at which confirmation line by the part name displayed in the vicinity of each confirmation line of each part.
[0022]
When a component to be mounted on the printed wiring board 4, for example, in this embodiment, BGA (types 1 to 3) is mounted on the printed wiring board 4, the printed wiring board 4 is set in a predetermined position in advance, and the robot is in that state. A component held by an arm (not shown) or the like is brought to a predetermined mounting position on the printed wiring board.
[0023]
In any case, it is possible to visually confirm whether or not the component is arranged at a predetermined mounting position before actual soldering. That is, when the component is set at the mounting position, if the outer shape of the component is inside the confirmation line corresponding to the component, it can be determined that the component is set at the proper mounting position. If the outer shape of the component is not within the confirmation line corresponding to the component, it is determined that the component is not set at the proper mounting position, and the setting position is corrected by appropriate means. Since the confirmation line is formed on the outer side by a slight dimension x from the outer shape of the actual part, it can be easily determined whether or not the part is within the allowable range.
[0024]
Even after the solder bonding, it is possible to confirm the positional deviation of the component due to the thermal shock of the board due to the heating to the printed wiring board during the solder bonding.
[0025]
Although the embodiments of the present invention have been described with reference to the accompanying drawings, the present invention is not limited to the above-described embodiments, and various forms, modifications, corrections, and the like are within the spirit and scope of the present invention. Is possible.
[0026]
(Supplementary note 1) In a wiring board capable of mounting surface mount components having the same functions and having multiple types of external shapes that are compatible with respect to mounting,
A printed wiring board, wherein a confirmation line for a component outer shape corresponding to a mounting position of a component having a plurality of types of outer shapes is provided on the surface.
[0027]
(Supplementary note 2) The printed wiring board according to supplementary note 1, wherein the confirmation line is formed on the outside by a slight dimension with respect to a part outline line corresponding to a mounting position.
[0028]
(Supplementary note 3) The printed wiring board according to Supplementary note 1 or 2, wherein the confirmation line is provided at a plurality of locations along a component outer shape for one type of component.
[0029]
(Additional remark 4) The some confirmation line with respect to one type of components is formed in the L-shape along the corner | angular part of the diagonal position of components, Component mounting to the printed wiring board of Additional remark 3 characterized by the above-mentioned Construction.
[0030]
(Supplementary note 5) The component mounting structure on the printed wiring board according to supplementary note 3, wherein the plurality of confirmation lines for one type of component are formed in a straight line along a part of the side of the component.
[0031]
(Supplementary Note 6) The linear confirmation line includes two parallel straight lines along a part of two parallel sides of the part and a straight line along a part of at least one other side not parallel to the side. The component mounting structure on the printed circuit board according to appendix 5, characterized by including:
[0032]
(Additional remark 7) When there exists a convex part or a recessed part in the planar shape of the components external shape of a mounting state, the confirmation line along the said convex part or a recessed part is contained in at least 1 of these several confirmation lines, It is characterized by the above-mentioned. The component mounting structure on the printed wiring board according to Appendix 3.
[0033]
(Supplementary note 8) The component mounting structure according to any one of supplementary notes 1 to 7, wherein when the component is mounted, the solder joint portion is not visible from the appearance.
[0034]
(Supplementary note 9) The component mounting structure according to supplementary note 8, wherein the component is a package component such as BGA or CSP.
[0035]
【The invention's effect】
As described above, according to the present invention, even if one part has a different external shape for each manufacturer or at the time of manufacture, the part external shape confirmation line is formed by silk printing or the like. Therefore, the proper mounting position of the component can be easily confirmed. As a result, it is possible to use parts having the same function and having compatibility with respect to mounting, even those of a plurality of manufacturers, in terms of supply and price, although the external shapes of the parts are different.
[Brief description of the drawings]
FIG. 1A to FIG. 1C are plan views showing surface-mounted parts such as BGA / CSP having the same functions and having several types of external mounting compatibility, as an example of a BGA package. is there.
FIG. 2 shows an example of a confirmation line formed by silk printing on the surface of a printed wiring board.
FIG. 3 shows a state in which a confirmation line and BGA (type I) are set at a mounting position.
FIG. 4 shows a state in which a confirmation line and BGA (type II) are set at a mounting position.
FIG. 5 shows a state in which a confirmation line and BGA (type III) are set at a mounting position.
FIG. 6 shows an example in which a confirmation line and a part name corresponding to each part are formed on a printed wiring board by silk printing.
[Explanation of symbols]
1 ... BGA (Type I)
2 ... BGA (Type II)
3 ... BGA (Type III)
4 ... Printed wiring board 5 ... Board 6 ... BGA (type I) confirmation line 7 ... BGA (type II) confirmation line 8 ... BGA (type III) confirmation line

Claims (11)

Functions are identical, have a plurality kinds of profile compatible relates implementation, the electrode terminals in the wiring board can implement a surface mount component invisible from the appearance during mounting,
A wiring board, wherein a confirmation line of an outer shape corresponding to each component is provided on a surface at a portion corresponding to the mounting position of the plurality of types of components.   The wiring board according to claim 1, wherein the confirmation line is formed outside the part outer shape by a predetermined dimension.   The wiring board according to claim 1, wherein the confirmation line is formed outside the component outer shape by a dimension corresponding to an allowable error range of the component mounting.   The wiring board according to claim 1, wherein the confirmation line is provided at a plurality of locations along a component outer shape for one type of component. 5. The wiring board according to claim 4, wherein a plurality of confirmation lines for one type of component are formed in an L shape along a corner of the component.   The wiring board according to claim 5, wherein the plurality of L-shaped confirmation lines are formed at diagonal positions of the component.   The wiring board according to claim 4, wherein the plurality of confirmation lines for one type of component is formed in a straight line along a part of the side of the component.   The straight confirmation line includes two parallel straight lines along a part of two parallel sides of the part and a straight line along a part of at least one other side not parallel to the side. The wiring board according to claim 7.   When there is a convex portion or a concave portion in the planar shape of the component outer shape in the mounted state, a confirmation line along the convex portion or the concave portion is included in at least one of the plurality of confirmation lines. The wiring board according to any one of 4. The plurality of types of components that may be mounted at the position where any of a plurality of types of components having the same function and mounting compatibility and having different external shapes are selectively mounted. A wiring board provided with a line indicating an outer shape corresponding to each;
It is mounted at a position where the lines of the wiring substrate is provided, and the electrode terminals and having a, a part which is not visible from the exterior during mounting, the component mounting structure. The component, the component mounting structure according to claim 10, characterized in that the packaging component such as a BGA or CSP.

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