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JP4245253B2 - Conductive member - Google Patents
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JP4245253B2 - Conductive member - Google Patents

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JP4245253B2
JP4245253B2 JP2000140065A JP2000140065A JP4245253B2 JP 4245253 B2 JP4245253 B2 JP 4245253B2 JP 2000140065 A JP2000140065 A JP 2000140065A JP 2000140065 A JP2000140065 A JP 2000140065A JP 4245253 B2 JP4245253 B2 JP 4245253B2
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conductive
contact
conductor
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metal member
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JP2001326478A (en
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英雄 由見
勝 八木
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Kitagawa Industries Co Ltd
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Kitagawa Industries Co Ltd
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Description

【0001】
【発明の属する技術分野】
本発明は、半田付け処理によってプリント配線板に表面実装され、弾性変形する接触部を接地導体に圧接させて、プリント配線板を接地導体に接地する導電部材に関する。
【0002】
【従来の技術】
従来より、プリント配線板に導電部材を表面実装し、その状態でプリント配線板を固定すると導電部材がケースなどの接地導体に圧接するようにして、導電部材を介してプリント配線板の導電パターンを接地導体に電気的に接続する(接地する)技術が知られている。特に近年、コンピュータ技術の発達に伴いマイクロコンピュータを組み込んだ機器が多く製品化されており、このような機器内部のプリント配線板を接地するのに欠かせない技術となっている。
【0003】
このような導電部材には、接地導体との接触部に金属バネを用いるものが多く見受けられる。しかし、導電部材自体の大きさが数ミリ程度と小型であるため、作業中にバネ部分を誤って引っかけてしまい、バネ部分を永久変形させてしまうことがあった。また、接地導体との接触面のメッキがはがれて良好な接地がなされなくなる可能性があった。
【0004】
そのため、本出願人は、接触部に導電エラストマを用いた導電部材を提案している(特願2000−103534号)。この導電部材は、図5に示すように、メッキした金属ワイヤをプレス加工した板状部材100を用意し、この板状部材100の接合面100aの反対側の上面100bに、液状の導電エラストマ200を塗布したものである。この導電部材では、導電エラストマ200が接地導体に当接し弾性変形して圧接する。これによって、金属バネを用いた場合と異なり、接触部の永久変形や接触面のメッキはがれ等、金属バネを用いた場合の欠点を解消でき、良好な接地が可能となる。
【0005】
【発明が解決しようとする課題】
しかしながら、上述した導電部材にも、以下の点では改良の余地がある。それは、導電エラストマ200と板状部材100との接着強度、導電エラストマ200の高さ調節という2点である。
【0006】
すなわち、板状部材100から導電エラストマ200がはがれ落ちるようなことがあると、プリント配線板上でのパターンのショートを招く事態にもなりかねない。したがって、板状部材100のような金属部材と導電エラストマ200のような接触部材とを強固に固定することが望まれる。
【0007】
また、上述した技術では、液状の導電エラストマ200を塗布して形成するのが一般的であるため、導電エラストマ200のような接触部材を高く形成することが困難であった。金属部材の面積を大きくすれば、接触部材を高く形成できるが、導電部材自体が大きくなってしまう。
【0008】
本発明は、上述した課題を解決するためになされたものであり、金属バネを用いた場合の欠点を解消することを前提とし、接触部材が金属部材から脱落することを防止でき、かつ、接触部材の高さ調節が容易な導電部材を提供することを目的とする。
【0009】
【課題を解決するための手段及び発明の効果】
本発明の導電部材は、金属部材と、接触部材とを備えている。金属部材は、薄板棒状であり、プリント配線板の導体パターンに半田付けされる接合面を有している。この金属部材には、例えばメッキされた金属ワイヤをプレスしたいわゆる平角線などを用いることが考えられる。そして、この金属部材の接合面が半田付けされて導電部材は、プリント配線板に実装される。
【0010】
このように導電部材がプリント配線板に表面実装された状態で、プリント配線板を所定位置に固定すると、接触部材は、本体ケースなどの接地導体に当接して弾性変形する。これによって、導体パターンと接地導体とが電気的に接続されることになる。
【0011】
このような構成を前提として、請求項1に記載の発明では特に、接触部材を柱状の導電体とした。導電体には、上述したような導電エラストマを採用することが考えられる。一方、金属部材は、この接触部材の一方の端部から他方の端部までを貫通し、両先端部が折り返されている。そして、この折り返し部分に接合面を有する。
【0012】
このように例えば導電エラストマといった接触部材に金属部材を貫通させたため、金属部材から接触部材が脱落することがない。また、このような導電部材は、金属部材を通した導電体をいわゆる「押出し成形」にて形成し、所定の長さに切断した後、金属部材の先端部を折り返して形成できる。したがって、押出し成形における口金の形状如何によって、接触部材の高さも容易に調節できる。
【0013】
ただし、接触部材としての導電体は、例えば弾性ゴムや高分子発泡体に銀などの微粒子を混入したものとすることが考えられる。そのため、接触部材の高さを高くする場合には特に、その強度が低くなる可能性がある。
そこで、請求項2に示す構成を採用することが考えられる。本発明でも、基本的構成は、請求項1に記載の発明と同様である。
【0014】
本発明では特に、接触部材が、芯材としての柱状の誘電体と、当該誘電体の側面に積層された導電層とを有している。誘電体には、弾性ゴムや高分子発泡体を用いることが考えられる。また、導電層は、上述した導電体と同様の導電エラストマを採用することが考えられる。このとき、金属部材は、接触部材の誘電体の一方の端部から他方の端部までを貫通し、両先端部が折り返されている。そして、当該折り返し部分に接合面を有すると共に、当該折り返し部分で導電層に接触している。
【0015】
この場合も、上述した効果が得られることはもちろんである。この場合は、金属部材を通した誘電体を「押出し成形」にて形成し、その後、導電層をコーディングするという具合に形成できるためである。そして、誘電体を芯材とするため接触部材の強度も高くなる。
【0016】
また、金属部材の折り返し部分が導電層に接触しており、この接触部分を経由して電流が流れるが、高周波になるほどインピーダンスが高くなるのが一般的である。しかし、この構成によれば、金属部材と導電層とが誘電体を挟んで対向し、コンデンサ的な役割を果たす。したがって、高周波になった場合のインピーダンスの上昇を抑えることができる。これによって、良好な接地が確保される。
【0017】
なお、以上は金属部材を接触部材に貫通させる構成であったが、請求項3に示すように構成してもよい。
本発明も、基本的な構成は、上述した発明と同様である。本発明では、接触部材を柱状の導電体とし、金属部材は、接合面の反対側へ両先端部が折り返されており、当該折り返した両先端部で接触部材を挟み込んで保持する。上述した構成と比較すれば接触部材が金属部材から離脱する可能性が高くなるものの、従来のように液状の導電エラストマを単に塗布する構成に比べると、このようにしても接触部材と金属部材との結合は十分強固になる。さらに、接触部材は「押出し成形」にて形成できるため、上述した発明と同様に、接触部材の高さ調節が容易になる。
【0018】
また、接触部材の強度を高くするため、請求項4に示す構成を採用してもよい。この場合も、基本的な構成は、上述した発明と同様である。
ここでは特に、接触部材が、芯材としての柱状の誘電体と、当該誘電体の側面に積層された導電層とを有している。一方、金属部材は、接合面の反対側へ両先端部が折り返され、当該折り返した両先端部で接触部材を挟み込んで保持すると共に、一部が導電被覆層に接触する。このようにしても、請求項3に記載の発明と同様の効果が得られ、さらに、接触部材の強度が高くなるという点で有利である。
【0019】
ところで、請求項5に示すように、接触部材内部に中空部分を形成することによって、接触部材の変形度合いを大きくしてもよい。このように中空部分を内部に設ければ、接触部材の材料は変えずに接地導体との接触圧を調節することができる。このように接触部材に中空部分を設ける場合も、「押出し成形」にて形成できる。したがって、接触部材の高さの調節は容易になる。
【0020】
【発明の実施の形態】
以下、本発明を具体化した実施例を図面を参照して説明する。
[第1実施例]
図1(a)は第1実施例の導電部材1を示す斜視図であり、図1(b)は、導電部材1の正面図である。
【0021】
本実施例の導電部材1は、金属部材10と、接触部材20とを備えている。
金属部材10は、例えば断面寸法が約0.8〜1mm×約0.3〜0.5mmの薄板棒状の部材である。例えばスズメッキされた銅製の金属ワイヤを、その側方よりプレスして形成することが考えられる。既成の平角線を用いてもよい。ワイヤにメッキするのは良好な半田付けを確保するためであり、その意味では、スズ以外に、ニッケル、金、銀などでメッキしてもよい。
【0022】
一方、接触部材20は、芯材としての柱状の誘電体22の側面に導電層21が積層されたものである。導電層21は、導電性及び弾性を有する材料であり、シリコーンラバー等の弾性ゴムやクロロプレン、ネオプレン、サンプトプレン、ポリウレタン等の高分子発砲体に、銀、銅、アルミニウム、ニッケル、炭素、グラファイト等の微粒子を混入したものである。誘電体22は、弾性を有する材料であるため、シリコーンラバー等の弾性ゴムやクロロプレン、ネオプレン、サンプトプレン、ポリウレタン等の高分子発砲体で形成される。
【0023】
柱状に形成された接触部材20に対し、上述した誘電体22の一方の端部から他方の端部までを金属部材10が貫通しており、金属部材10の両先端部が折り返されている。この折り返し部分の下面が接合面10aとなっている。そして、折り返し部分の接合面10aの反対側の上面10bが導電層21に接触している。これによって、金属部材10と接触部材20とは電気的に接続されている。
【0024】
本導電部材1は、例えば次のように製造される。まず、金属部材10を通した誘電体22を「押出し成形」にて形成し、さらに、導電層21をコーティングする。そして、所定の長さに切断した後、金属部材10の両先端部が露出するように接触部材20のみをさらに切断し、金属部材10の先端部を折り返す。
【0025】
このように構成された導電部材1は、プリント配線板の導体パターンに接合面10aで半田付けされる。そして、その状態でプリント配線板が所定位置に固定されると、接触部材20が、本体ケース等の接地導体に当接し弾性変形して圧接する。これによって、プリント配線板の導体パターンと接地導体とを電気的に接続する。
【0026】
本実施例の導電部材1では、接地導体に圧接する接触部材20を弾性を有する導電層21及び誘電体22で形成したため、金属バネを用いる場合の欠点を解消することができる。すなわち、作業途中でバネ部分を引っかけてしまい導電部材が変形するということがなく、また、接地導体との接触面のメッキがはがれることもない。
【0027】
しかも、接触部材20の誘電体22に金属部材10を貫通させたため、接触部材20が金属部材10から脱落することがない。また、金属部材10を通した誘電体22を「押出し成形」にて形成できるため、接触部材20の高さ調節が容易になる。
【0028】
ところで、金属部材10の折り返し部分の上面10bが導電層21に接触しており、この接触部分で金属部材10と接触部材20とが電気的に接続されている。したがって、通常はこの接触部分を経由して電流が流れる。ただし、高周波になるほどインピーダンスは一般的に高くなる。
【0029】
これに対して、本導電部材1では、図1(b)に示すように、導電層21と金属部材10とが誘電体22を挟んで対向するように配置されており、コンデンサ的な役割を果たす。したがって、高周波になった場合のインピーダンスの上昇を抑えることができる。これによって良好な接地が確保される。
【0030】
また、本導電部材1では、芯材としての誘電体22に導電層21を積層(コーティング)しているため、銀などの微粒子を混入した導電体だけで接触部材20を形成する場合と比べ、接触部材20の強度が高くなる。なお、接触部材20全体を導電性及び弾性を有する導電体で形成してもよい。幾分強度が低くなるものの、このようにしても、接触部材20が金属部材10から脱落することを防止でき、接触部材20の高さ調節が容易になる。
[第2実施例]
図2(a)は第2実施例の導電部材3を示す斜視図であり、図2(b)は、導電部材3の正面図である。
【0031】
本実施例の導電部材3は、金属部材30と、接触部材40とを備えている。
金属部材30は、上記第1実施例の金属部材10と同様の薄板棒状の部材であり、例えば既成の平角線を用いて構成する。
接触部材40も、上記第1実施例と同様に、誘電体42の側面に導電層41が積層されて柱状に形成されている。
【0032】
そして、本実施例では、金属部材30は、両先端部が折り返され、折り返されて対向する先端30bで柱状の誘電体42の両端部を挟み込むようにして、接触部材40を保持している。そして、金属部材30は、その中央部分下面をプリント配線板との接合面30aとし、この接合面30aの反対側の上面30cで導電層41に接触している。これによって、金属部材30と接触部材40とは電気的に接続されている。
【0033】
本導電部材3は、例えば次のように製造される。まず、誘電体42を「押出し成形」にて形成し、さらに、導電層41をコーティングする。そして、所定の長さに切断した後、合わせて切断された金属部材30の両先端部を折り返し、先端30bで接触部材40を挟み込むように固定する。
【0034】
このように構成された導電部材3は、プリント配線板の導体パターンに接合面30aで半田付けされる。そして、その状態でプリント配線板が所定位置に固定されると、接触部材40が、本体ケース等の接地導体に当接し弾性変形して圧接する。これによって、プリント配線板の導体パターンと接地導体とを電気的に接続する。
【0035】
本実施例の導電部材3では、接地導体に圧接する接触部材40を弾性を有する導電層41及び誘電体42で形成したため、上記第1実施例と同様に、金属バネを用いる場合の欠点を解消することができる。
しかも、金属部材30の両先端部を折り返して、先端30bで接触部材40を挟み込むようにしたため、金属部材30から接触部材40が脱落するのを防止できる。また、誘電体42を「押出し成形」にて形成できるため、接触部材40の高さ調節が容易になる。
【0036】
また、本導電部材3でも、上記第1実施例と同様に、芯材としての誘電体42に導電層41を積層しているため、銀などの微粒子を混入した導電体だけで接触部材40を形成する場合と比べ、接触部材40の強度が高くなる。なお、接触部材40全体を導電性及び弾性を有する導電体で形成してもよい。幾分強度は低くなるものの、接触部材40が金属部材30から脱落することを防止できるからであり、接触部材40の高さ調節が容易になるからである。
[第3実施例]
図3(a)は第3実施例の導電部材5を示す斜視図であり、図3(b)は、導電部材5の正面図である。
【0037】
本実施例の導電部材5は、金属部材50と、接触部材60とを備えている。
金属部材50及び接触部材60は、上記第1及び第2実施例と同様の材料で形成されているため説明は省略する。そして、柱状に形成された接触部材60に対し、誘電体62の一方の端部から他方の端部までを金属部材50が貫通しており、金属部材50の両先端部が折り返されている。この折り返し部分の下面が接合面50aとなっている。そして、接合面50aの反対側の上面50bが導電層61に接触している。これによって、金属部材50と接触部材60とは電気的に接続されている。
【0038】
また、本実施例ではさらに、誘電体62内部を貫通する金属部材50の上方部分に金属部材50と平行な中空部分が、誘電体62に形成されている。
本導電部材5は、例えば次のように製造される。まず、金属部材50を通した誘電体62を「押出し成形」にて形成し、さらに、導電層61をコーティングする。このとき、口金の形状によって中空部分も形成される。そして、所定の長さに切断した後、金属部材50の両先端部が露出するように接触部材60のみをさらに切断し、金属部材50の先端部を折り返す。
【0039】
このように構成された導電部材5は、プリント配線板の導体パターンに接合面50aで半田付けされる。そして、その状態でプリント配線板が所定位置に固定されると、接触部材60が、本体ケース等の接地導体に当接し弾性変形して圧接する。このとき、中空部分があるため弾性変形量が大きくなる。これによって、プリント配線板の導体パターンと接地導体とを電気的に接続する。
【0040】
本実施例の導電部材5では、弾性を有する導電層61及び誘電体62によって接触部材60を形成したため、上記第1及び第2実施例と同様、金属バネを用いる場合の欠点を解消することができる。また、金属部材50を貫通させたため接触部材60が金属部材50から脱落することがないこと、「押出し成形」にて形成できるため接触部材60の高さ調節が容易になることも、上記第1実施例と同様である。さらに、図3(b)に示すように、導電層61と金属部材50とが誘電体62及び中空部分を挟んで対向するように配置されているため、高周波になった場合のインピーダンスの上昇を抑えることもできる。
【0041】
加えて、誘電体62に中空部分を設けたため、接触部材60の変形度合いが大きくなり、接触部材60を構成する材料は変えずに、接地導体への接触圧が低くなっている。つまり、中空部分の大きさや位置を適宜変更することによって接触圧を変更できるのである。
【0042】
なお、芯材としての誘電体62を用いていることで接触部材60の強度が高くなっている。このときも、接触部材60全体を導電性及び弾性を有する導電体で形成してもよい。幾分強度は低くなるものの、接触部材60が金属部材50から脱落することを防止できるからであり、かつ、接触部材60の高さ調節も容易になるからである。
[その他]
(イ)上記第1〜3の実施例では、導電層21,41,61として弾性ゴムや高分子発砲体に銀などの微粒子を混入した材料を用いているが、例えば導電布を用いてもよい。この場合は、シリコーンゴムなどの誘電体22,42,62を形成し、その後、巻き付けることが考えられる。また、導電層に、金属箔や金属網を用いることもできる。これらは使用環境に応じて使い分ければよい。
【0043】
また、上記第1〜3の実施例では、接触部材20,40,60の側面のみに導電層21,41,61が積層(コーティング)されているが、接触部材20,40,60の端部までコーティングするようにしてもよい。この場合は、押出し成形された誘電体22,42,62を切断した後、第1及び第3実施例ではさらに金属部材10,50の先端部を露出させた後に、コーディングを行うようにすればよい。
【0044】
(ロ)また、上記第2実施例では、金属部材30の両側先端30bにて接触部材40を挟み込んで固定する構成を示した。このとき、金属部材30の下面全体を接合面30aとしていたが、例えば図4(a)に示すように、金属部材70の中央部分を上に凸に折り曲げて2つの接合面70aを設けることも考えられる。このようにすれば、プリント配線板が撓んでも、半田付け部分にかかる応力が軽減されることになり、導電部材が導体パターンから外れることを防止できる。また、金属部材70によって、導電部材の高さを調節することもできる。なお、接合面を3つ以上設けても、差し支えない。
【0045】
(ハ)さらにまた、上記第2実施例では、金属部材30の先端30bを誘電体42に両端部から差し込んで接触部材40を固定していたが、例えば図4(b)に示すように、接触部材80の端部下方に凸部80aを設け、この凸部80aに先端30bを引っかけるようにして接触部材80を保持する構成にすることも考えられる。
【図面の簡単な説明】
【図1】(a)は第1実施例の導電部材の斜視図であり、(b)は正面図である。
【図2】(a)は第2実施例の導電部材の斜視図であり、(b)は正面図である。
【図3】(a)は第3実施例の導電部材の斜視図であり、(b)は正面図である。
【図4】第2実施例の変形例を示す説明図である。
【図5】従来の導電部材を示す説明図である。
【符号の説明】
1,3,5…導電部材
10,30,50,70…金属部材
20,40,60,80…接触部材
10a,30a,50a,70a…接合面
10b,30c,50b…上面
30b…先端
21,41,61…導電層
22,42,62…誘電体
80a…凸部
100…板状部材
100a…接合面
100b…上面
200…導電エラストマ
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a conductive member that is surface-mounted on a printed wiring board by a soldering process, presses an elastically deforming contact portion to a ground conductor, and grounds the printed wiring board to the ground conductor.
[0002]
[Prior art]
Conventionally, when a conductive member is surface-mounted on a printed wiring board, and the printed wiring board is fixed in that state, the conductive member is pressed against a grounding conductor such as a case so that the conductive pattern of the printed wiring board is formed via the conductive member. A technique of electrically connecting (grounding) to a ground conductor is known. In particular, in recent years, with the development of computer technology, many devices incorporating a microcomputer have been commercialized, and this is an indispensable technology for grounding a printed wiring board inside such a device.
[0003]
Many of such conductive members use a metal spring at the contact portion with the ground conductor. However, since the size of the conductive member itself is as small as several millimeters, the spring part may be caught by mistake during operation, and the spring part may be permanently deformed. In addition, the contact surface with the ground conductor may be peeled off and good grounding may not be achieved.
[0004]
Therefore, the present applicant has proposed a conductive member using a conductive elastomer for the contact portion (Japanese Patent Application No. 2000-103534). As shown in FIG. 5, a plate-like member 100 obtained by pressing a plated metal wire is prepared as the conductive member, and a liquid conductive elastomer 200 is formed on the upper surface 100b opposite to the joining surface 100a of the plate-like member 100. Is applied. In this conductive member, the conductive elastomer 200 comes into contact with the ground conductor and is elastically deformed to be pressed. Thus, unlike the case of using a metal spring, the disadvantages of using a metal spring, such as permanent deformation of the contact portion and peeling of the contact surface, can be eliminated, and good grounding can be achieved.
[0005]
[Problems to be solved by the invention]
However, the above-described conductive member also has room for improvement in the following points. That is two points: adhesive strength between the conductive elastomer 200 and the plate-like member 100 and height adjustment of the conductive elastomer 200.
[0006]
That is, if the conductive elastomer 200 is peeled off from the plate-like member 100, a pattern short circuit on the printed wiring board may be caused. Therefore, it is desirable to firmly fix a metal member such as the plate member 100 and a contact member such as the conductive elastomer 200.
[0007]
In the above-described technique, since the liquid conductive elastomer 200 is generally formed by coating, it is difficult to form a contact member such as the conductive elastomer 200 high. If the area of the metal member is increased, the contact member can be formed higher, but the conductive member itself becomes larger.
[0008]
The present invention has been made to solve the above-described problems, and is based on the premise of eliminating the drawbacks of using a metal spring, and can prevent the contact member from falling off from the metal member. An object of the present invention is to provide a conductive member in which the height of the member can be easily adjusted.
[0009]
[Means for Solving the Problems and Effects of the Invention]
The conductive member of the present invention includes a metal member and a contact member. The metal member has a thin bar shape and has a joint surface soldered to the conductor pattern of the printed wiring board. For example, a so-called rectangular wire obtained by pressing a plated metal wire may be used as the metal member. And the joint surface of this metal member is soldered, and a conductive member is mounted in a printed wiring board.
[0010]
When the printed wiring board is fixed at a predetermined position in a state where the conductive member is surface-mounted on the printed wiring board in this way, the contact member comes into contact with a ground conductor such as a main body case and is elastically deformed. As a result, the conductor pattern and the ground conductor are electrically connected.
[0011]
On the premise of such a configuration, the contact member is a columnar conductor, particularly in the first aspect of the invention. It is conceivable to employ a conductive elastomer as described above for the conductor. On the other hand, the metal member penetrates from one end portion to the other end portion of the contact member, and both end portions are folded back. And it has a joint surface in this folding | turning part.
[0012]
As described above, since the metal member is passed through the contact member such as a conductive elastomer, the contact member does not fall off from the metal member. Further, such a conductive member can be formed by forming a conductor through a metal member by so-called “extrusion molding”, cutting it to a predetermined length, and then folding back the tip of the metal member. Therefore, the height of the contact member can be easily adjusted depending on the shape of the die in the extrusion molding.
[0013]
However, it is conceivable that the conductor as the contact member is made of, for example, elastic rubber or polymer foam mixed with fine particles such as silver. Therefore, particularly when the height of the contact member is increased, the strength may be decreased.
Therefore, it is conceivable to employ the configuration shown in claim 2. The basic configuration of the present invention is the same as that of the first aspect of the present invention.
[0014]
Particularly in the present invention, the contact member has a columnar dielectric as a core material and a conductive layer laminated on the side surface of the dielectric. It is conceivable to use elastic rubber or polymer foam as the dielectric. In addition, it is conceivable that the conductive layer employs a conductive elastomer similar to the above-described conductor. At this time, the metal member penetrates from one end portion of the dielectric of the contact member to the other end portion, and both end portions are folded back. The folded portion has a joint surface and is in contact with the conductive layer at the folded portion.
[0015]
In this case as well, the above-described effects can be obtained. In this case, it is because the dielectric material which let the metal member pass can be formed by "extrusion molding", and a conductive layer can be coded after that. And since a dielectric is used as a core material, the strength of the contact member is also increased.
[0016]
Further, the folded portion of the metal member is in contact with the conductive layer, and a current flows through this contact portion, but generally the impedance increases as the frequency becomes higher. However, according to this configuration, the metal member and the conductive layer face each other with the dielectric interposed therebetween, and serve as a capacitor. Therefore, an increase in impedance when the frequency becomes high can be suppressed. This ensures good grounding.
[0017]
In addition, although the above is the structure which makes a metal member penetrate the contact member, you may comprise as shown in Claim 3.
The basic configuration of the present invention is the same as that of the above-described invention. In the present invention, the contact member is a columnar conductor, and the metal member has both tip portions folded back to the opposite side of the joint surface, and the contact member is sandwiched and held between the folded tip portions. Compared with the configuration described above, the contact member is more likely to be detached from the metal member. However, compared with the conventional configuration in which the liquid conductive elastomer is simply applied, the contact member and the metal member are also configured in this way. The bond becomes sufficiently strong. Furthermore, since the contact member can be formed by “extrusion molding”, the height of the contact member can be easily adjusted as in the above-described invention.
[0018]
Further, in order to increase the strength of the contact member, the configuration shown in claim 4 may be adopted. Also in this case, the basic configuration is the same as that of the above-described invention.
Here, in particular, the contact member has a columnar dielectric as a core material and a conductive layer laminated on the side surface of the dielectric. On the other hand, both end portions of the metal member are folded back to the opposite side of the joint surface, and the contact member is sandwiched and held between the folded both end portions, and part of the metal member is in contact with the conductive coating layer. Even if it does in this way, the effect similar to the invention of Claim 3 is acquired, and also the point that the intensity | strength of a contact member becomes high is advantageous.
[0019]
By the way, as shown in claim 5, the deformation degree of the contact member may be increased by forming a hollow portion inside the contact member. If the hollow portion is provided in this way, the contact pressure with the ground conductor can be adjusted without changing the material of the contact member. Thus, also when providing a hollow part in a contact member, it can form by "extrusion molding". Therefore, the height of the contact member can be easily adjusted.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[First embodiment]
FIG. 1A is a perspective view showing the conductive member 1 of the first embodiment, and FIG. 1B is a front view of the conductive member 1.
[0021]
The conductive member 1 of this embodiment includes a metal member 10 and a contact member 20.
The metal member 10 is a thin bar member having a cross-sectional dimension of about 0.8 to 1 mm × about 0.3 to 0.5 mm, for example. For example, it is conceivable to form a tin-plated copper metal wire by pressing it from the side. A pre-made rectangular wire may be used. The reason for plating the wire is to ensure good soldering. In that sense, in addition to tin, the wire may be plated with nickel, gold, silver, or the like.
[0022]
On the other hand, the contact member 20 is obtained by laminating a conductive layer 21 on a side surface of a columnar dielectric 22 as a core material. The conductive layer 21 is a material having conductivity and elasticity, such as an elastic rubber such as silicone rubber or a polymer foam such as chloroprene, neoprene, samptoprene, and polyurethane, and silver, copper, aluminum, nickel, carbon, graphite, etc. It is a mixture of fine particles. Since the dielectric 22 is an elastic material, it is formed of an elastic rubber such as silicone rubber, or a polymer foam such as chloroprene, neoprene, samptoprene, or polyurethane.
[0023]
With respect to the contact member 20 formed in a columnar shape, the metal member 10 penetrates from one end portion of the dielectric 22 to the other end portion, and both end portions of the metal member 10 are folded back. The lower surface of the folded portion is a joint surface 10a. The upper surface 10 b opposite to the joint surface 10 a at the folded portion is in contact with the conductive layer 21. Thereby, the metal member 10 and the contact member 20 are electrically connected.
[0024]
For example, the conductive member 1 is manufactured as follows. First, the dielectric 22 through the metal member 10 is formed by “extrusion molding”, and the conductive layer 21 is further coated. And after cutting | disconnecting to predetermined length, only the contact member 20 is further cut | disconnected so that both the front-end | tip parts of the metal member 10 may be exposed, and the front-end | tip part of the metal member 10 is turned back.
[0025]
The conductive member 1 configured in this manner is soldered to the conductor pattern of the printed wiring board at the joint surface 10a. When the printed wiring board is fixed at a predetermined position in this state, the contact member 20 comes into contact with a grounding conductor such as a main body case and is elastically deformed to be in pressure contact. This electrically connects the conductor pattern of the printed wiring board and the ground conductor.
[0026]
In the conductive member 1 of this embodiment, since the contact member 20 that is in pressure contact with the ground conductor is formed of the conductive layer 21 and the dielectric 22 having elasticity, the disadvantages in the case of using a metal spring can be solved. That is, the conductive member is not deformed by catching the spring part during the operation, and the contact surface with the ground conductor is not peeled off.
[0027]
In addition, since the metal member 10 is passed through the dielectric 22 of the contact member 20, the contact member 20 does not fall off the metal member 10. Further, since the dielectric 22 through the metal member 10 can be formed by “extrusion molding”, the height of the contact member 20 can be easily adjusted.
[0028]
By the way, the upper surface 10b of the folded portion of the metal member 10 is in contact with the conductive layer 21, and the metal member 10 and the contact member 20 are electrically connected at this contact portion. Therefore, a current usually flows through this contact portion. However, the impedance generally increases as the frequency increases.
[0029]
On the other hand, in the present conductive member 1, as shown in FIG. 1B, the conductive layer 21 and the metal member 10 are disposed so as to face each other with the dielectric 22 interposed therebetween, and thus the role as a capacitor is achieved. Fulfill. Therefore, an increase in impedance when the frequency becomes high can be suppressed. This ensures good grounding.
[0030]
Further, in the present conductive member 1, the conductive layer 21 is laminated (coated) on the dielectric 22 as the core material, and therefore, compared with the case where the contact member 20 is formed only by a conductor mixed with fine particles such as silver. The strength of the contact member 20 is increased. In addition, you may form the contact member 20 whole with the conductor which has electroconductivity and elasticity. Although the strength is somewhat lowered, even in this case, the contact member 20 can be prevented from falling off the metal member 10, and the height of the contact member 20 can be easily adjusted.
[Second Embodiment]
FIG. 2A is a perspective view showing the conductive member 3 of the second embodiment, and FIG. 2B is a front view of the conductive member 3.
[0031]
The conductive member 3 of the present embodiment includes a metal member 30 and a contact member 40.
The metal member 30 is a thin bar-like member similar to the metal member 10 of the first embodiment, and is configured by using, for example, an established rectangular wire.
Similarly to the first embodiment, the contact member 40 is also formed in a columnar shape by laminating a conductive layer 41 on the side surface of the dielectric 42.
[0032]
In the present embodiment, the metal member 30 holds the contact member 40 such that both ends are folded back and the both ends of the columnar dielectric 42 are sandwiched between the folded-back opposing ends 30b. The metal member 30 has a lower surface of the central portion as a bonding surface 30a with the printed wiring board, and is in contact with the conductive layer 41 on an upper surface 30c opposite to the bonding surface 30a. Thereby, the metal member 30 and the contact member 40 are electrically connected.
[0033]
The conductive member 3 is manufactured as follows, for example. First, the dielectric 42 is formed by “extrusion”, and the conductive layer 41 is further coated. And after cutting | disconnecting to predetermined length, both the front-end | tip parts of the metal member 30 cut | disconnected together are turned back, and it fixes so that the contact member 40 may be inserted | pinched with the front-end | tip 30b.
[0034]
The conductive member 3 configured in this manner is soldered to the conductor pattern of the printed wiring board at the joint surface 30a. When the printed wiring board is fixed at a predetermined position in this state, the contact member 40 comes into contact with a grounding conductor such as a main body case and is elastically deformed to be in pressure contact. This electrically connects the conductor pattern of the printed wiring board and the ground conductor.
[0035]
In the conductive member 3 of the present embodiment, since the contact member 40 that is pressed against the ground conductor is formed of the elastic conductive layer 41 and the dielectric 42, the disadvantages in the case of using a metal spring are eliminated as in the first embodiment. can do.
In addition, since both the front end portions of the metal member 30 are folded back and the contact member 40 is sandwiched between the front ends 30b, the contact member 40 can be prevented from falling off from the metal member 30. Further, since the dielectric 42 can be formed by “extrusion molding”, the height of the contact member 40 can be easily adjusted.
[0036]
Also in this conductive member 3, as in the first embodiment, since the conductive layer 41 is laminated on the dielectric 42 as the core material, the contact member 40 can be formed only by a conductor mixed with fine particles such as silver. Compared with the case where it forms, the intensity | strength of the contact member 40 becomes high. In addition, you may form the contact member 40 whole with the conductor which has electroconductivity and elasticity. This is because the contact member 40 can be prevented from falling off the metal member 30 although the strength is somewhat lowered, and the height adjustment of the contact member 40 is facilitated.
[Third embodiment]
FIG. 3A is a perspective view showing the conductive member 5 of the third embodiment, and FIG. 3B is a front view of the conductive member 5.
[0037]
The conductive member 5 of this example includes a metal member 50 and a contact member 60.
Since the metal member 50 and the contact member 60 are made of the same material as in the first and second embodiments, description thereof is omitted. The metal member 50 penetrates the contact member 60 formed in a columnar shape from one end of the dielectric 62 to the other end, and both ends of the metal member 50 are folded back. The lower surface of the folded portion is a joint surface 50a. The upper surface 50 b opposite to the bonding surface 50 a is in contact with the conductive layer 61. Thereby, the metal member 50 and the contact member 60 are electrically connected.
[0038]
Further, in this embodiment, a hollow portion parallel to the metal member 50 is formed in the dielectric 62 in the upper portion of the metal member 50 that penetrates the inside of the dielectric 62.
The conductive member 5 is manufactured, for example, as follows. First, the dielectric 62 passed through the metal member 50 is formed by “extrusion molding”, and the conductive layer 61 is further coated. At this time, a hollow portion is also formed by the shape of the base. And after cutting | disconnecting to predetermined length, only the contact member 60 is further cut | disconnected so that both the front-end | tip parts of the metal member 50 may be exposed, and the front-end | tip part of the metal member 50 is turned back.
[0039]
The conductive member 5 configured as described above is soldered to the conductor pattern of the printed wiring board at the joint surface 50a. In this state, when the printed wiring board is fixed at a predetermined position, the contact member 60 comes into contact with a ground conductor such as a main body case and is elastically deformed to be in pressure contact. At this time, since there is a hollow portion, the amount of elastic deformation increases. This electrically connects the conductor pattern of the printed wiring board and the ground conductor.
[0040]
In the conductive member 5 of the present embodiment, since the contact member 60 is formed by the conductive layer 61 and the dielectric 62 having elasticity, it is possible to eliminate the drawbacks when using a metal spring, as in the first and second embodiments. it can. In addition, the contact member 60 does not fall off the metal member 50 because the metal member 50 is penetrated, and the height of the contact member 60 can be easily adjusted because it can be formed by “extrusion molding”. It is the same as that of an Example. Further, as shown in FIG. 3B, since the conductive layer 61 and the metal member 50 are arranged so as to face each other with the dielectric 62 and the hollow portion interposed therebetween, the impedance rise when the frequency becomes high. It can also be suppressed.
[0041]
In addition, since the hollow portion is provided in the dielectric 62, the degree of deformation of the contact member 60 is increased, and the contact pressure to the ground conductor is reduced without changing the material constituting the contact member 60. That is, the contact pressure can be changed by appropriately changing the size and position of the hollow portion.
[0042]
Note that the strength of the contact member 60 is increased by using the dielectric 62 as the core material. Also at this time, the entire contact member 60 may be formed of a conductive material having conductivity and elasticity. This is because the contact member 60 can be prevented from falling off the metal member 50, although the strength is somewhat lowered, and the height adjustment of the contact member 60 is facilitated.
[Others]
(A) In the first to third embodiments, the conductive layers 21, 41, 61 are made of a material in which fine particles such as silver are mixed into elastic rubber or a polymer foam, but a conductive cloth may be used, for example. Good. In this case, it is conceivable that dielectrics 22, 42, 62 such as silicone rubber are formed and then wound. Further, a metal foil or a metal net can be used for the conductive layer. These may be properly used according to the use environment.
[0043]
In the first to third embodiments, the conductive layers 21, 41, 61 are laminated (coated) only on the side surfaces of the contact members 20, 40, 60. You may make it coat. In this case, after the extruded dielectrics 22, 42, 62 are cut, in the first and third embodiments, the tips of the metal members 10, 50 are further exposed, and then the coding is performed. Good.
[0044]
(B) Further, in the second embodiment, the configuration in which the contact member 40 is sandwiched and fixed by the both side tips 30b of the metal member 30 is shown. At this time, the entire lower surface of the metal member 30 is used as the joint surface 30a. However, for example, as shown in FIG. 4A, the center portion of the metal member 70 may be bent upward to provide two joint surfaces 70a. Conceivable. In this way, even if the printed wiring board is bent, the stress applied to the soldered portion is reduced, and the conductive member can be prevented from being detached from the conductor pattern. Further, the height of the conductive member can be adjusted by the metal member 70. Note that three or more joining surfaces may be provided.
[0045]
(C) Furthermore, in the second embodiment, the tip 30b of the metal member 30 is inserted into the dielectric 42 from both ends to fix the contact member 40. For example, as shown in FIG. It is also conceivable that a convex portion 80a is provided below the end of the contact member 80, and the contact member 80 is held such that the tip 30b is hooked on the convex portion 80a.
[Brief description of the drawings]
FIG. 1A is a perspective view of a conductive member of a first embodiment, and FIG. 1B is a front view.
FIG. 2A is a perspective view of a conductive member of a second embodiment, and FIG. 2B is a front view.
FIG. 3A is a perspective view of a conductive member according to a third embodiment, and FIG. 3B is a front view.
FIG. 4 is an explanatory view showing a modification of the second embodiment.
FIG. 5 is an explanatory view showing a conventional conductive member.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1, 3, 5 ... Conductive member 10, 30, 50, 70 ... Metal member 20, 40, 60, 80 ... Contact member 10a, 30a, 50a, 70a ... Joining surface 10b, 30c, 50b ... Upper surface 30b ... Tip 21, 41, 61 ... conductive layers 22, 42, 62 ... dielectric 80a ... convex portion 100 ... plate member 100a ... bonding surface 100b ... upper surface 200 ... conductive elastomer

Claims (5)

プリント配線板の導体パターンに半田付けされる接合面を有する薄板棒状の金属部材と、前記接合面が前記導体パターンに半田付けされた状態で、前記プリント配線板を所定位置に固定することによって接地導体に当接して弾性変形する接触部材とを備え、前記導体パターンと前記接地導体とを電気的に接続する導電部材において、
前記接触部材は、柱状の導電体であり、
前記金属部材は、前記接触部材の一方の端部から他方の端部までを貫通し、両先端部が折り返され、当該折り返し部分に前記接合面を有していること
を特徴とする導電部材。
A thin bar metal member having a joint surface soldered to the conductor pattern of the printed wiring board, and grounding by fixing the printed wiring board in place with the joint surface soldered to the conductor pattern A conductive member that contacts the conductor and elastically deforms, and electrically connects the conductive pattern and the ground conductor;
The contact member is a columnar conductor,
The conductive member is characterized in that the metal member penetrates from one end portion to the other end portion of the contact member, both end portions are folded back, and the joint surface is provided at the folded portion.
プリント配線板の導体パターンに半田付けされる接合面を有する薄板棒状の金属部材と、前記接合面が前記導体パターンに半田付けされた状態で、前記プリント配線板を所定位置に固定することによって接地導体に当接して弾性変形する接触部材とを備え、前記導体パターンと前記接地導体とを電気的に接続する導電部材において、
前記接触部材は、芯材としての柱状の誘電体と、当該誘電体の側面に積層された導電層とを有しており、
前記金属部材は、前記接触部材の誘電体の一方の端部から他方の端部までを貫通し、両先端部が折り返され、当該折り返し部分に前記接合面を有すると共に、当該折り返し部分で前記導電層に接触すること
を特徴とする導電部材。
A thin bar metal member having a joint surface soldered to the conductor pattern of the printed wiring board, and grounding by fixing the printed wiring board in place with the joint surface soldered to the conductor pattern A conductive member that contacts the conductor and elastically deforms, and electrically connects the conductive pattern and the ground conductor;
The contact member has a columnar dielectric as a core material, and a conductive layer laminated on a side surface of the dielectric,
The metal member penetrates from one end portion to the other end portion of the dielectric of the contact member, both end portions are folded back, the folded portion has the joint surface, and the folded portion is electrically conductive. A conductive member in contact with the layer.
プリント配線板の導体パターンに半田付けされる接合面を有する薄板棒状の金属部材と、前記接合面が前記導体パターンに半田付けされた状態で、前記プリント配線板を所定位置に固定することによって接地導体に当接して弾性変形する接触部材とを備え、前記導体パターンと前記接地導体とを電気的に接続する導電部材において、
前記接触部材は、柱状の導電体であり、
前記金属部材は、前記接合面の反対側へ両先端部が折り返され、当該折り返した両先端部で前記接触部材を挟み込んで保持すること
を特徴とする導電部材。
A thin bar metal member having a joint surface soldered to the conductor pattern of the printed wiring board, and grounding by fixing the printed wiring board in place with the joint surface soldered to the conductor pattern A conductive member that contacts the conductor and elastically deforms, and electrically connects the conductive pattern and the ground conductor;
The contact member is a columnar conductor,
Both ends of the metal member are folded back to the opposite side of the joint surface, and the contact member is sandwiched and held by the folded both ends.
プリント配線板の導体パターンに半田付けされる接合面を有する薄板棒状の金属部材と、前記接合面が前記導体パターンに半田付けされた状態で、前記プリント配線板を所定位置に固定することによって接地導体に当接して弾性変形する接触部材とを備え、前記導体パターンと前記接地導体とを電気的に接続する導電部材において、
前記接触部材は、芯材としての柱状の誘電体と、当該誘電体の側面に積層された導電層とを有しており、
前記金属部材は、前記接合面の反対側へ両先端部が折り返され、当該折り返した両先端部で前記接触部材を挟み込んで保持すると共に、一部が前記導電被覆層に接触すること
を特徴とする導電部材。
A thin bar metal member having a joint surface soldered to the conductor pattern of the printed wiring board, and grounding by fixing the printed wiring board in place with the joint surface soldered to the conductor pattern A conductive member that contacts the conductor and elastically deforms, and electrically connects the conductive pattern and the ground conductor;
The contact member has a columnar dielectric as a core material, and a conductive layer laminated on a side surface of the dielectric,
Both ends of the metal member are folded back to the opposite side of the joining surface, the contact member is sandwiched and held by the folded both ends, and a part of the metal member is in contact with the conductive coating layer. Conductive member.
請求項1〜4のいずれかに記載の導電部材において、
前記接触部材内部に中空部分を形成することによって、前記接触部材の変形度合いを大きくしたこと
を特徴とする導電部材。
In the electrically-conductive member in any one of Claims 1-4,
A conductive member, wherein a degree of deformation of the contact member is increased by forming a hollow portion inside the contact member.
JP2000140065A 2000-05-12 2000-05-12 Conductive member Expired - Fee Related JP4245253B2 (en)

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* Cited by examiner, † Cited by third party
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MY147054A (en) * 2008-03-07 2012-10-15 Joinset Co Ltd Solderable elastic electric contact terminal
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