JP4266838B2 - Electronic keyboard instrument mounting structure - Google Patents

Description

  The present invention relates to an electronic component mounting structure for an electronic keyboard instrument such as an electronic piano.

  Conventionally, as an electronic component mounting structure for this type of electronic keyboard musical instrument, the one described in Patent Document 1 is known. In this electronic component mounting structure, an electronic component unit is configured by attaching a large number of electronic components to a chassis formed by appropriately bending a metal plate such as an iron plate, and this is built into the instrument body. Yes. Specifically, the chassis has a flat bottom plate portion and a side plate portion bent at a right angle upward from the rear end of the bottom plate portion. In the former case, a board on which a large number of electronic components are assembled is interposed via a spacer. The latter is mounted in a state where an electronic component that generates heat when energized, such as a power IC or a power transistor (hereinafter referred to as “heating component” in this section) is in contact. By attaching the heat generating component in contact with the side plate portion of the chassis in this manner, the electronic component unit configured as described above is placed on the shelf plate of the instrument body using the chassis as a heat sink. It is attached with.

  In the electronic component unit described above, since the heat generating component is attached to the chassis which is simply a bent metal plate, the heat generating component may not be sufficiently radiated. Of course, it is possible to appropriately perform heat dissipation during energization by using a heat radiating plate having a large number of fins and attaching a heat generating component thereto. However, such a finned heat sink is expensive, and in recent years, there has been a demand for installation of electronic components in a space-saving manner due to the recent demand for miniaturization of musical instrument bodies.

  In the above electronic component unit, the periphery of the substrate, specifically, the front, left and right sides, and the upper side are exposed to the outside. May be adversely affected. Of course, it is possible to shield electromagnetic waves from the substrate by covering the periphery of the substrate with a metal shield box. However, such a shield box needs to be processed according to the size of the board and the electronic parts attached to it, and in addition, a cable for connecting the board to external electronic parts, power supply, etc. is passed. Therefore, there is a problem in that the shape tends to be complicated as a whole and the processing cost is high.

  The present invention has been made to solve the above-described problems, and can appropriately dissipate heat generated by electronic components at low cost while utilizing an existing chassis of an electronic keyboard instrument, An object of the present invention is to provide an electronic component mounting structure for an electronic keyboard instrument that can appropriately mount components.

Japanese Utility Model Publication No. 58-41597

An electronic component mounting structure for an electronic keyboard instrument according to claim 1 of the present invention is an electronic component mounting structure for an electronic keyboard instrument for mounting an electronic component that performs power control, and is an electronic component that is mounted in a state in which the electronic component is in contact. It has a component mounting part, is formed by extruding a metal material, and is arranged behind the plurality of keys in a state extending along the direction in which the plurality of keys are arranged. An action chassis that supports an action including a hammer for transmitting and dissipates heat generated by the electronic component, and a board that is formed integrally with the action chassis when the action chassis is molded and to which the electronic component is electrically connected. And an attached board attaching portion.

According to this configuration, the action chassis is formed by extruding a metal material, and the board mounting part is formed integrally with the action chassis at the time of molding, so when attaching the board mounting part after forming the action chassis, etc. In comparison, the board mounting portion can be formed inexpensively and easily. In addition, since the electronic component mounting portion of the action chassis is mounted in a state where the electronic component that is electrically connected to the board and performs power control is in contact with the action chassis, when the electronic component generates heat by energization, Can dissipate heat. In addition, since the action chassis is arranged behind the plurality of keys in a state of extending along the arrangement direction of the plurality of keys, the action chassis has a large surface area and appropriately dissipates heat generated by the electronic components. Can do. As described above, according to the electronic component mounting structure having the above-described configuration, an existing action that is normally used in an electronic keyboard instrument and supports an action including a hammer for transmitting key press information of a plurality of keys to an electronic circuit. While effectively utilizing the chassis, it is possible to appropriately dissipate heat generated by the electronic components at low cost, and it is possible to appropriately attach the board and the electronic components to the action chassis.

  The electronic component mounting structure for an electronic keyboard instrument according to claim 2 is characterized in that the metal material contains aluminum as a main component.

  According to this structure, since the metal material which has aluminum as a main component is employ | adopted for shaping | molding of the chassis by an extrusion process, a chassis can be shape | molded accurately and at low cost. In addition, since aluminum has a higher thermal conductivity than iron or the like, the heat radiation effect of heat generated by the electronic component can be further enhanced by molding the chassis with a metal material mainly composed of aluminum.

It is a side view which shows the keyboard apparatus of the electronic piano to which the electronic component attachment structure by 1st Embodiment of this invention is applied. It is a perspective view which expands and shows a part of keyboard apparatus of FIG. 1 from the back side. It is a side view of the keyboard apparatus of the electronic piano to which the electronic component mounting structure by 2nd Embodiment of this invention is applied, The state which removed the shield cover from the action chassis is shown. It is a side view which expands and shows the action chassis of FIG. It is a disassembled perspective view which expands and shows a part of keyboard apparatus of FIG. 3 from the back side.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 shows a keyboard device of an electronic piano to which an electronic component mounting structure according to a first embodiment of the present invention is applied in a key release state. As shown in the figure, the keyboard device 1 includes a large number of keys 2 (only one white key 2a and one black key 2b are shown) arranged in the left-right direction (front and back direction in FIG. 1), and these keys 2 A keyboard chassis 3 that supports the keyboard 2 from below and an action (such as a hammer 5 and a key switch 15 to be described later) connected to the rear end of the keyboard chassis 3 for transmitting key pressing information of the key 2 to an electronic circuit. An action chassis 4 and a number of hammers 5 (only one is shown) that are supported by the action chassis 4 so as to be rotatable and that rotate when the keys 2 are pressed.

  The keyboard chassis 3 is obtained by assembling iron plates and the like punched and bent by a press into a cross-beam shape, and is fixed horizontally to the shelf board 6. In addition, a large number of balance pins 7 (only one is shown) are erected side by side in the center of the keyboard chassis 3 in the front-rear direction (left-right direction in FIG. 1). The corresponding key 2 is loosely inserted into a later-described balance pin hole 2e.

  The key 2 includes a white key 2a and a black key 2b, each of which includes a wooden keyboard body 2c having a rectangular cross section and a synthetic resin key cover 2d bonded to the surface of the front half thereof. The balance pin hole 2e is formed in the center of the keyboard body 2c in the front-rear direction, and the key 2 is rotatably supported by the balance pin 7 through the balance pin hole 2e.

  The hammer 5 is provided for each key 2 and has a rod-shaped synthetic resin hammer body 5a and weight plates 5b (only one is shown) attached to the front end portions of the left and right side surfaces thereof. The rear end of the hammer body 5a is formed with an arc-shaped shaft hole 5c that opens obliquely downward to the rear. The hammer 5 engages with a later-described fulcrum shaft portion 12b of the action chassis 4. By doing so, the action chassis 4 is rotatably supported. A capstan 8 is screwed into the lower surface of the hammer body 5a in the vicinity of the shaft hole 5c, and the hammer 5 is placed on the rear end portion of the upper surface of the corresponding key 2 via the capstan 8. ing.

  The action chassis 4 is composed of a hollow extruded product formed by extruding a metal material containing aluminum as a main component, extends over all the hammers 5, that is, extends in the left-right direction, which is the direction in which the keys 2 are arranged, It is connected to the chassis 3 and is fixed to the shelf board 6. The action chassis 4 includes a back wall 11 (electronic component mounting portion) extending in the vertical direction, a hammer support portion 12 that forms a vertically long hollow portion 12 a with the back wall 11, and a back wall 11. A hollow portion 13a having a right triangle shape is formed above 12 and has a switch mounting portion 13 extending obliquely forward and upward.

  The hammer support portion 12 has an arcuate fulcrum shaft portion 12b that protrudes slightly forward and obliquely upward at the front upper end thereof, and the fulcrum shaft portion 12b has a shaft hole 5c of each hammer 5. Are rotatably engaged. A chassis connecting portion 12c is formed at a position slightly below the intermediate portion in the vertical direction of the hammer support portion 12 and extends forward in a staircase shape and placed on the rear end portion of the keyboard chassis 3. Yes. The action chassis 4 is connected to the keyboard chassis 3 by a plurality of connecting screws 14 (only one is shown) provided at the front end of the chassis connecting portion 12c. A felt 12d that extends in the left-right direction so as to cover all the keys 2 and supports the rear end of the lower surface of each key 2 in a key-released state is provided at the middle portion in the front-rear direction of the chassis connecting portion 12c.

  In addition, a key switch 15 for detecting key press information of each key 2 is attached to the switch attachment portion 13 on the hammer 5 side. The key switch 15 includes a switch board 15a made of a printed board, and a switch body 15b made of a rubber switch attached to each key 2 on the hammer 5 side of the switch board 15a. The key switch 15 includes first and second screws 17a and 17b via a spacer 16 in a state where the rear end of the switch board 15a is inserted into an engagement recess 13b formed at the base end of the switch mounting portion 13. Thus, it is screwed to the switch mounting portion 13. Further, a stopper 18 made of urethane foam or the like that restricts the upward rotation of the hammer 5 is provided at the tip of the switch mounting portion 13.

  1 and 2, on the back wall 11 of the action chassis 4, a plurality of boards 20 (only one is shown) made of a printed board having a rectangular planar shape protruding rearward at a position near the lower end. A substrate attachment portion 21 for attaching the substrate is formed. The board attachment portion 21 is formed so as to extend in the extrusion direction integrally with the action chassis 4 at the time of extrusion molding. In the drawing, the printed circuit on the substrate 20 and a plurality of electronic components directly attached to the substrate 20 are omitted, and the printed circuit is not formed at the four corners of the substrate 20.

  Further, as shown in FIG. 2, the substrate attachment portion 21 corresponds to the dimension in the left-right direction (depth direction in FIG. 2) of the substrate 20 to be attached, and is cut slightly shorter than that dimension. And while straddling the cutting part 21a of the board | substrate attachment part 21 cut in this way, both the corner parts by the side of the back wall 11 of the board | substrate 20 are mounted on the board | substrate attachment part 21, and the board | substrate 20's Both corners on the opposite side of the back wall 11 are respectively placed on board mounting brackets 22 and 22 having predetermined shapes screwed to the shelf board 6 with screws 24, and each corner of the board 20 is mounted with board mounting screws 23. It is screwed. As described above, by providing the cutting portion 21a in the substrate mounting portion 21, the terminals of the electronic components attached to the portion near the back wall 11 of the substrate 20 and the terminals 26 and 26 of the electronic components 25 described later are provided on the substrate 20. Even when projecting downward from the terminal, it is possible to reliably prevent a short circuit caused by such a terminal coming into contact with the board mounting portion 21.

  Also, a plurality of electronic components 25 (only one shown) such as a CPU and an amplifier that generate heat when energized are electrically connected to the substrate 20 via terminals 26 and 26. The electronic component 25 is screwed with mounting screws 27 and 27 with a relatively wide surface of the electronic component 25 being in contact with the back wall 11 of the action chassis 4.

  As described above, in the keyboard device 1, when the action chassis 4 is formed, the board mounting portion 21 is formed integrally with the action chassis 4. Therefore, when the board mounting portion 21 is retrofitted after the action chassis 4 is formed, etc. As compared with the above, the board mounting portion 21 can be formed inexpensively and easily. Moreover, since the action chassis 4 extends long in the left-right direction, the surface area is large, and the electronic component 25 is attached in contact with the back wall 11, so that a heat sink having a large number of fins is not used. The heat generated by the electronic component 25 when energized can be appropriately radiated. Furthermore, since the action chassis 4 is formed of a metal material mainly composed of aluminum having a higher thermal conductivity (for example, 3 to 4 times) than iron or the like, in addition to being able to be molded with high accuracy and low cost, The heat radiation effect of the heat generated by the electronic component 25 can be further enhanced. As described above, according to the present embodiment, while effectively utilizing the existing action chassis 4 used in the keyboard device 1, the heat generated by the electronic component 25 can be appropriately radiated at a low cost, and the board 20. And the electronic component 25 can be appropriately attached to the action chassis 4.

  In the present embodiment, the cutting part 21 a is formed in the board attaching part 21 of the action chassis 4, and both corners on the back wall 11 side of the board 20 are directly placed on the board attaching part 21. Although screwed, instead of this, a spacer made of an insulating material having a predetermined height may be interposed between the corners of the substrate 20 and the substrate mounting portion 21. As a result, the board 20 is attached to the board mounting portion so that the terminals of the electronic components, including the terminals 26 and 26 of the electronic component 25, attached to the portion near the back wall 11 of the board 20 do not contact the board mounting portion 21. It can be attached in a state of being lifted by 21 from the height of the spacer. In this case, the formation of the cutting part 21a in the board attaching part 21 can be omitted.

  Next, a second embodiment of the present invention will be described with reference to FIGS. In the following description, only the parts different from the first embodiment will be described, and the same components as those in the first embodiment will be denoted by the same reference numerals, and detailed description thereof will be omitted.

  As shown in FIGS. 3 to 5, in the electronic component mounting structure of the present embodiment, when the action chassis 4 is extruded, a plurality of substrates 30 (only one is shown) are integrally formed on the back wall 11 of the action chassis 4. A substrate housing portion 31 for housing the substrate 30 is formed, and each substrate 30 is mounted in the substrate housing portion 31 in an upright state, and a shield cover 32 (only one is shown) is provided so as to cover each substrate 30. Attached to the back wall 11.

  The substrate housing portion 31 is formed in a housing recess 33 opened rearward and a side wall (front side wall) 34 in the housing recess 33 with a space in the vertical direction from each other. Grooves 35 and 35 (substrate fixing part) are provided. Each U-shaped groove 35 corresponds to the dimension in the left-right direction of the substrate 30 to be attached, and is cut slightly shorter than the dimension. And in the state which straddled the cutting part 35a of each U-shaped groove | channel 35 cut in this way, the board | substrate 30 is up-and-down U-shaped with the board | substrate attachment screw 36 via the attachment hole 30a each formed in the four corners. Screwed into the grooves 35, 35. Thus, by providing the cutting part 35 a in each U-shaped groove 35, terminals of electronic components (not shown) attached to the respective portions near the upper end and the lower end of the substrate 30 are moved from the substrate 30 to the U-shaped groove 35 side. Even when it protrudes, it is possible to reliably prevent a short circuit due to contact with the U-shaped groove 35. A female screw (not shown) is formed on each U-shaped groove 35 near the cutting portion 35a by a tap or the like.

  The board 30 is made of a printed board having a rectangular planar shape, the mounting holes 30a are formed at the four corners, respectively, and two connectors 37, 37 are arranged in parallel in one end of the surface in the left-right direction. Yes. For example, in addition to the key switch 15, a control panel and a power supply unit (not shown) are connected to the connectors 37 and 37 via a cable (not shown). In the drawing, the printed circuit of the substrate 30 and the plurality of electronic components directly attached to the substrate 30 are omitted as in the case of the substrate 20 of the first embodiment.

  The shield cover 32 is formed by pressing a metal plate such as an iron plate having a predetermined shape. As shown in FIG. 4, the shield cover 32 is slightly larger than the substrate 30 and has a rectangular cover body portion 38 whose vertical dimension is longer than that of the housing recess 33, and the right and left sides of the cover body portion 38. Side walls 39 and 39 are bent at right angles in the same direction from both ends. Each side wall 39 is formed so that the vertical dimension is slightly shorter than that of the housing recess 33, and the longitudinal dimension is substantially the same as the distance from the opening of the housing recess 33 to the tip of the U-shaped groove 35. Has been. In addition, on the side wall 39 on the connector 37 side of the shield cover 32, two upper and lower cutouts 39 a and 39 a corresponding to both the connectors 37 and 37 are formed.

  The shield cover 32 formed as described above is screwed to the back wall 11 with cover mounting screws 40 via mounting holes 38a formed at the four corners of the cover main body 38, respectively. 3 and 4, in the state where the shield cover 32 is attached to the back wall 11, the connector 37 of the board 30 is connected via both notches 39a and 39a of the side wall 39. 37 faces outward, and a cable (not shown) connected to the key switch 15 or the like is connected to the connector 37 from the outside through a notch 39a.

  As described above, in the keyboard device 1 of the second embodiment, when the action chassis 4 is formed, the board housing part 31 is formed integrally with the action chassis 4, so that the board housing part 31 can be formed inexpensively and easily. Can do. Further, since the board 30 is screwed into the housing recess 33 and the board 30 is covered with a shield cover 32 having a simple shape, the electromagnetic waves radiated from the board 30 are caused to cooperate with the housing recess 33 and the shield cover 32. , Can be effectively shielded. As described above, according to the present embodiment, while effectively utilizing the existing action chassis 4 used in the keyboard device 1, the electromagnetic waves radiated from the substrate 30 can be appropriately shielded at low cost, and the electronic The board 30 to which the components are attached can be appropriately attached to the action chassis 4.

  In the present embodiment, the cutting portions 35a are formed in both the U-shaped grooves 35 and 35 of the substrate housing portion 31, respectively, and the four corners of the substrate 30 are in contact with the tips of the U-shaped grooves 35 and 35, respectively. Although screwed, a spacer made of an insulating material having a predetermined thickness may be interposed between the four corners of the substrate 30 and the U-shaped grooves 35 and 35 instead. Thus, the substrate 30 is separated from the U-shaped grooves 35, 35 by the thickness of the spacer so that terminals of electronic components (not shown) attached to the upper and lower ends of the substrate 30 do not contact the U-shaped grooves 35, 35, respectively. Can be installed in the state. In this case, formation of the cutting parts 35a and 35a in both U-shaped grooves 35 and 35 can be omitted.

  Further, instead of the U-shaped grooves 35 and 35, grooves and rails extending in the pushing direction integrally with the action chassis 4 are formed at predetermined positions on the ceiling surface and the bottom surface of the housing recess 33, and these are formed. The substrate 30 may be mounted in the receiving recess 33 by engaging the upper and lower ends of the substrate 30 with each other. In this case, the board attachment screw 36 for attaching the board 30 can be omitted, and the board 30 can be easily attached.

  Moreover, you may combine the attachment structure of the electronic component 25 of 1st Embodiment mentioned above with the said 2nd Embodiment. That is, in addition to housing the substrate 30 in the housing recess 33 and attaching the shield cover 32 to the back wall 11 of the action chassis 4, the electronic component 25 that generates heat when energized is placed above the housing recess 33 in the back wall 11. You may make it attach. In this case, in addition to the effect by 2nd Embodiment mentioned above, the effect by 1st Embodiment, ie, the heat dissipation effect of the heat | fever which the electronic component 25 emits, can also be acquired.

  Furthermore, the detailed configurations of the action chassis 4, the boards 20, 30, and the shield cover 32 shown in the first and second embodiments are merely examples, and may be appropriately changed within the scope of the present invention. it can.

Explanation of symbols

1 keyboard device 2 keys 3 keyboard chassis 4 action chassis 6 shelf board 11 back wall (electronic component mounting part)
20 Substrate 21 Substrate mounting portion 25 Electronic component

Claims (2)

An electronic component mounting structure for an electronic keyboard instrument for mounting an electronic component for power control ,
It has an electronic component mounting portion that is mounted in a state where the electronic component is in contact, is formed by extruding a metal material, and is arranged behind the plurality of keys in a state of extending along the arrangement direction of the plurality of keys. An action chassis for supporting an action including a hammer for transmitting the key pressing information of the plurality of keys to the electronic circuit, and for radiating heat generated by the electronic component;
A board mounting portion formed integrally with the action chassis at the time of molding the action chassis, to which a board to which the electronic components are electrically connected is attached;
An electronic component mounting structure for an electronic keyboard instrument, comprising:   The electronic component mounting structure for an electronic keyboard instrument according to claim 1, wherein the metal material contains aluminum as a main component.

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