JP4271908B2 - DIE PICKUP DEVICE AND DIE PICKUP METHOD - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a die pick-up apparatus and a die pick-up method for recognizing the position of a die on a wafer table by comparing an image of a die to be picked up picked up by a component recognition camera with a registered template. . More specifically, the present invention relates to an apparatus and method for registering a die on a wafer table as the template.
[0002]
[Prior art]
In this type of conventional die pick-up apparatus, as one means for recognizing the position of the die on the wafer table using an image processing apparatus, an image obtained by imaging the die on the wafer table with a component recognition camera is used as a reference. There is a method of registering as a master template, which is image data, and recognizing the position of the die using this template.
[0003]
[Problems to be solved by the invention]
However, when a die on a wafer table is registered as a template, if the wafer is attached to the wafer table in a tilted manner, there is a problem that it is not suitable for registration as a master template. In such a case, a method of rotating the wafer table by manual operation and removing the tilt before registration is conceivable. However, there is a problem that the wafer table cannot be rotated depending on the type of the wafer table and the structure of the die pickup device. It was.
[0004]
Therefore, the present invention enables registration when a die on a wafer table is registered as a template, without rotating the wafer table, even when the wafer is tilted and attached to the wafer table. With the goal.
[0005]
[Means for Solving the Problems]
Therefore, a first invention relates to a die pick-up apparatus for recognizing the position of a die on a wafer table by comparing an image of a die to be picked up picked up by a component recognition camera with a registered template. A recognition processing device that captures an image of a die on a table captured by the component recognition camera, a display device that displays an image captured by the recognition processing device, and an angle of inclination of the image displayed on the display device An instruction device for an operator to instruct to rotate only in the opposite direction, a control device for controlling to rotate an image displayed on the display device based on an instruction from the instruction device, and rotation by the control device And a storage device for storing the processed image as the template.
[0006]
According to a second aspect of the present invention, there is provided a die pick-up apparatus for recognizing the position of a die on a wafer table by comparing an image of a die to be picked up picked up by a component recognition camera with a registered template. A recognition processing device that captures an image obtained by capturing the image of the die with the component recognition camera, and detecting the tilt of the die based on the image captured in the recognition processing device, and the captured image is reversed in the opposite direction by the tilt angle. A control device that controls to rotate, and a storage device that stores an image rotated by the control device as the template are provided.
[0007]
According to a third aspect of the present invention, there is provided a die pick-up method for recognizing the position of a die on a wafer table by comparing an image of a die to be picked up picked up by a component recognition camera with a registered template. The upper die is imaged by the component recognition camera, the image captured by the component recognition camera is captured by the recognition processing device, the image captured by the recognition processing device is displayed on the display device, and displayed on the display device. The operator instructs the display device to rotate the displayed image in the opposite direction by the tilted angle, and controls the control device to rotate the image displayed on the display device based on the instruction from the pointing device. The image rotated by the control device is stored in the storage device as the template.
[0008]
According to a fourth aspect of the present invention, there is provided a die pick-up method for recognizing the position of a die on a wafer table by comparing an image of a die to be picked up picked up by a component recognition camera with a registered template. The image of the die is captured by the component recognition camera, the image captured by the component recognition camera is captured by the recognition processing device, the inclination of the die is detected based on the image captured by the recognition processing device, and the captured image is The control device controls to rotate in the opposite direction by the tilted angle, and the image rotated by the control device is stored in the storage device as the template.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment applied to a taping device as a die pickup device of the present invention will be described with reference to the drawings. First, the taping device will be described with reference to a plan view and a left side view of the taping device shown in FIGS. Reference numeral 1 denotes a main body of the taping device. A tape supply reel 2 is rotatably locked to a pin erected on the main body 1 and is wound around the tape supply reel 2 (also referred to as a carrier tape). An appropriate tension is applied to the tape body 3A by a pulley (not shown) and the tip of 3A is fixed to the take-up reel 5 via the transport rail 4.
[0010]
Then, while the tape main body 3A is successively conveyed by a predetermined amount in accordance with the rotation of the take-up reel 5 by a rotation drive system (not shown), the storage groove 3B of the tape main body 3A is taken. The die D is inserted therein, and further conveyed to a predetermined position, and the opening on the upper surface of the storage groove 3B is covered with the cover tape 3C supplied from the cover tape supply reel 6, and then wound around the take-up reel 5. Go. As described above, the tape 3 is formed by the tape main body 3A, the storage groove 3B provided in the tape main body 3A, and the cover tape (top tape) 3C that is pressure-bonded to the upper surface of the tape main body 3A. It is formed with a tape and a spacer.
[0011]
Then, after the die D is inserted into the storage groove 3B of the tape main body 3A by the component loading device 10, this die D is inspected by the component inspection mechanism 7, and the tape main body 3A and the cover tape 3C are inspected by the tape crimping mechanism 8. Is pressure-bonded and wound around the take-up reel 5.
[0012]
Next, the component loading apparatus 10 will be described. First, an X table 12 movable in the X direction by an X axis drive motor 12A is provided on the Y table 11 movable in the Y direction by the Y axis drive motor 11A, and a frame 13 is provided on the X table 12. Is fixed. An index unit 15 is provided at the center of the horizontal plate 14 of the frame 13, and a recognition camera 16 and a recognition camera 17 are provided facing the front and rear portions.
[0013]
A rotating plate 20 is provided on the lower surface of the horizontal plate 14 to rotate intermittently (at intervals of 90 degrees) via the index unit 15 by a drive motor (not shown). Adsorption loading nozzles 22 are arranged on the respective mounting heads 21 arranged at intervals of four.
[0014]
The suction loading nozzle 22 is configured such that the mounting head 21 can be moved up and down by a vertical axis drive motor 18 (not shown) and can be rotated around a vertical line by a θ axis drive motor 19.
[0015]
Further, a Y table 24 movable in the Y direction by a Y axis drive motor 24A is provided on the X table 12, and further moved on the Y table 24 in the X direction by an X axis drive motor 25A. An X table 25 is provided. A die supply table 27 is provided on the X table 25 via a support table 26. The die supply table 27 is rotatable by a predetermined rotation range about the vertical direction. A wafer attached to a sheet 28 is placed on the supply table 27. It is diced and fixed in a state of being divided into individual dies D, and this die D is taken out while being pushed up from the back by a push-up pin 29.
[0016]
Reference numeral 30 denotes a θ-axis drive motor. A gear 31 formed around the drive shaft of the θ-axis drive motor 30 meshes with a gear 32 formed around the lower portion of the die supply table 27. The two gears 31 and 32 are rotated by the rotation of the drive shaft by driving, and the die supply table 27 is rotated by, for example, 90 degrees, 180 degrees, and 270 degrees through the bearings 33.
[0017]
Below the recognition camera 17 in FIG. 1 is a component suction (takeout) station, which recognizes the state of FIG. 1, that is, the die D to be taken out and the next die D to be taken out on the die supply table 27 during the rotation of the turntable 20. The image is picked up by the camera 17 and the position of the die D is recognized by the recognition processing device 34, and the Y table 24 and the X table 25 are moved so as to be positioned immediately below the moving suction loading nozzle 22. The suction loading nozzle 22 that has lowered the die D on the die supply table 27 at the suction station sucks and takes out.
[0018]
Next, it is transported to the next recognition station in accordance with the 90 ° rotation of the turntable 20 via the index unit, and further transported to the next component insertion station. The component recognition camera 9 is arranged at this recognition station, and the die D sucked and held by the suction loading nozzle 22 is imaged, and the suction posture, appearance shape, bump size and position, etc. are recognized by the recognition processing device 34. The In this case, if the appearance shape (such as a chip) and the size and position of the bump are abnormal, they are discarded as described later.
[0019]
Next, it is conveyed to the next component insertion station in accordance with the 90 ° rotation of the turntable 20 via the index unit. During this conveyance, the three storage grooves of the tape main body 3A on the conveyance rail 4 by the recognition camera 16 are conveyed. 3B is imaged. That is, whether or not the die D has been inserted into the leftmost storage groove 3B, whether it is not inserted into the rightmost storage groove 3B (empty), and In order to recognize the position of the rightmost storage groove 3B, the three storage grooves 3B are imaged simultaneously.
[0020]
Therefore, after the image is picked up, the recognition processing device 34 recognizes the position of the rightmost storage groove 3B, and based on the result, the CPU 35, which is a control device, drives the drive motor 11A of the Y table 11 and the drive motor of the X table 12. 12A and the θ-axis drive motor 19 are corrected and controlled, and the die D is inserted by the suction loading nozzle 22 that descends to an appropriate position in the middle storage groove 3B. That is, in this component insertion station, the correction movement in the XY directions of the rotary disk 20 and the storage groove 3B of the tape main body 3A on the transport rail 4 waiting below the die D sucked by the suction loading nozzle 22 and The suction loading nozzle 22 can be inserted and loaded at an appropriate position by the correction movement in the θ direction.
[0021]
After the insertion and loading, while the tape main body 3A is sequentially transported by a predetermined amount in accordance with the rotation of the take-up reel 5 (taken up by the take-up reel 5), the component inspection mechanism 7 makes the tape main body 3A. A component inspection (for example, an electrical property inspection) is performed on the chip component inserted into the storage groove 3B of the tape, and the tape body 3A and the cover tape 3C after the inspection of the die D by the tape crimping mechanism 8 are completed. The taping is completed to complete the taping.
[0022]
The component inspection mechanism 7 includes a mark recognition camera 7A and an inspection unit 7B, and the mark recognition camera 7A captures an image of the die D inserted in the storage groove 3B while illuminating with a lighting device. The camera recognizes a mark such as a model number attached to the die D in the storage groove 3B, and the inspection unit 7B has a probe needle on the lower surface and is movable in the plane direction and a vertical movement mechanism (not shown). ), The probe needle is brought into contact with the die D inserted into the storage groove 3B, and, for example, the electrical characteristics are inspected.
[0023]
In addition, in order to confirm whether or not the die D has been inserted into the leftmost storage groove 3B, it has been determined that the die D has not been inserted as a result of the recognition processing by the recognition processing device 34 based on the imaging of the recognition camera 16. In that case, the CPU 35 controls to stop the taping device.
[0024]
Further, even when it is determined that the tape is already inserted in the rightmost storage groove 3B, the CPU 35 controls to stop the taping device.
[0025]
Next, a control block diagram of the taping device will be described with reference to FIG. Reference numeral 35 denotes a CPU as a control device that performs overall control of operations related to removal and loading of chip parts of the taping device, 36 denotes a RAM (Random Access Memory) as a storage device, and 37 denotes a ROM (Read Only Memory). ). Then, based on the data stored in the RAM 36, the CPU 35 determines each drive source via the interface 38 and the drive circuit 39 for operations related to the removal and loading of the chip parts of the taping device in accordance with the program stored in the ROM 37. Take overall control. It should be noted that a hard disk may be used instead of the ROM 37, and the CPU 35 may control each drive source according to a program read from the hard disk into the RAM 36.
[0026]
Reference numeral 40 denotes an operation unit, which is a numeric keypad 41 for keying in numbers, a cursor key 42, a SET key 43 for setting a mode, a teaching key 44 for setting the electronic component mounting apparatus to a teaching mode, and setting the apparatus to an automatic operation mode. An automatic key 45, a manual key 46 for setting the apparatus to a manual operation mode, a start key 47, an operation key 48, and a stop key 49.
[0027]
The recognition processing device 34 captures images captured by the respective recognition cameras 16 and 17, 50 is a CRT that displays the captured images, and 51 is a CRT that displays an editing screen for teaching. 52 is a mouse.
[0028]
Here, a teaching operation for registering a die on the die supply table 27 as a template with the above configuration will be described. First, when the operator presses the teaching key 44, the CPU 35 controls the Y-axis drive motor 24A and the X-axis drive motor 25A to move the Y table 24 and the X table 25, and below the recognition camera 17, the die supply table 27. The recognition camera 17 captures an image captured by the recognition camera 17, the image captured by the component recognition camera is captured, and the captured image is captured by the recognition processing device 34. It is displayed on the CRT 50 (see FIG. 4).
[0029]
When the teaching key 44 is pressed, the CPU 35 displays a teaching editing screen on the CRT 51 (see FIG. 5). In this editing screen, when the operator inputs a reference angle at which the image displayed on the CRT 50 is to be rotated into the editing box above the portion where “Rotation” is displayed using the numeric keypad 41, the reference is input to the RAM 36. Stores the angle. Then, when the operator clicks on the portion displayed as “Rotate” using the mouse 52 while viewing the image displayed on the CRT 50, the CPU 35 causes the image to rotate by the reference angle for each click. Control.
[0030]
Accordingly, as shown in FIG. 4, the die D was slightly inclined upward to the right on the screen, but the operator displayed “Rotate” using the mouse 52 while viewing the image displayed on the CRT 50. When the portion is clicked, the CPU 35 can rotate the displayed image in the opposite direction by the tilted angle to eliminate the tilt. At this time, the current rotation angle is displayed in the portion displayed as Static.
[0031]
Then, in a state where the tilt with respect to the camera center C is eliminated (see FIG. 6), the operator operates the operation unit 40 to register the size and position of the registration template window W1 indicated by a broken line in FIG. When the SET key 43 is operated, the CPU 35 stores the image of the rotated die D in the RAM 36 as a template which is reference image data. Thus, the teaching operation for registering the die on the die supply table 27 as a template is completed.
[0032]
The operation of taking out the die D with the above configuration will be described below. First, the die D to be taken out on the die supply table 27 is imaged by the recognition camera 17 during the movement of the turntable 20 to the component adsorption (takeout) station, and the position of the die D is recognized by the recognition processing device 34. At this time, the image of the die D to be taken out picked up by the recognition camera 17 is compared with the template stored and registered in the RAM 36, and the recognition processing device 34 recognizes the position of the die D. Then, based on the recognition result, the Y table 24 and the X table 25 are moved so as to be located immediately below the moving suction loading nozzle 22, and the die D on the chip component supply table 27 is moved at this component suction station. The suction loading nozzle 22 descends and sucks it out.
[0033]
Next, the rotary disk 20 is rotated 90 degrees to be conveyed to the next recognition station, and the recognition camera 9 takes an image of the die D sucked and held by the suction loading nozzle 22 to pick up the suction posture, appearance shape, bump size, etc. The position and the like are recognized by the recognition processing device 34. In this case, if the appearance shape (such as chipping) and the size and position of the bump are abnormal, they are discarded in a collection tray (not shown). At this time, the image of the die D to be taken out picked up by the recognition camera 9 is compared with the template stored and registered in the RAM 36, and the recognition processor 34 recognizes the position of the die D.
[0034]
Then, during the conveyance by the 90-degree rotation of the further turntable 20, the three storage grooves 3B of the tape body 3A on the conveyance rail 4 are imaged by the recognition camera 16. That is, whether or not the chip component 30 has been inserted into the leftmost storage groove 3B, and whether it is not inserted into the rightmost storage groove 3B (is empty). The three storage grooves 3B are simultaneously imaged for recognizing the position of the rightmost storage groove 3B.
[0035]
Therefore, after the image is picked up, the recognition processing device 34 recognizes the position of the rightmost storage groove 3B, and based on the result, a control device (not shown) controls the Y-axis drive motor 11A of the Y table 11 and the X of the X table 12. The axis drive motor 12A and the θ-axis drive motor 19 are corrected and controlled, and the chip component 30 is inserted by the suction loading nozzle 22 that descends to an appropriate position in the middle storage groove 3B. That is, in this component insertion station, the image of the component recognition camera 9 and the recognition camera 16 is captured in the storage groove 3B of the tape body 3A on the transport rail 4 waiting below the die D sucked by the suction loading nozzle 22. Based on the result, recognition processing is performed, and insertion and loading can be performed at an appropriate position by the correction movement in the XY direction of the turntable 20 and the correction movement in the θ direction of the suction loading nozzle 22.
[0036]
Then, after the insertion and loading, while the tape main body 3A is sequentially conveyed by a predetermined amount (taken up by the take-up reel 5) in accordance with the rotation of the take-up reel 5 by a rotation drive system (not shown), the storage groove Component inspection is performed by the component inspection mechanism 7 on the die D inserted into 3B.
[0037]
That is, the die D inserted in the storage groove 3B is imaged by the mark recognition camera 7A while being illuminated by the illumination device, and a mark such as a model number attached to the chip component 30 is recognized. Further, the inspection unit 7B provided with the probe needle moves in the plane direction and the vertical direction, and the probe needle is brought into contact with the die D inserted into the storage groove 3B, for example, to inspect electric characteristics and the like.
[0038]
In this way, the dies D are inserted one after another, and after completion of the inspection, the tape body 3A and the cover tape 3C are crimped by the tape crimping mechanism 8 to complete the taping, and the tape 3 is sequentially wound around the take-up reel 5. It will be taken.
[0039]
Next, another embodiment of a teaching operation for registering a die on the die supply table 27 as a template will be described.
[0040]
First, when the operator presses the teaching key 44, the CPU 35 controls the Y-axis drive motor 24A and the X-axis drive motor 25A to move the Y table 24 and the X table 25, and below the recognition camera 17, the die supply table 27. The recognition camera 17 captures an image captured by the recognition camera 17, the image captured by the component recognition camera is captured, and the captured image is captured by the recognition processing device 34. It is displayed on the CRT 50 as shown in FIG. In this state, while confirming the display of the image, the operator substantially matches the size and position of the temporary registration template window W2 indicated by the broken line in FIG. 7 with the die D to be registered, and operates the SET key 43. Then, the image of the die D is stored in the RAM 36 as a temporary template. Then, based on the temporary template stored in the RAM 36 by the recognition processing device 34, for example, in the range of the inclination detection window W3 indicated by the one-dot chain line in FIG. It is recognized how much the image is tilted with respect to the camera center C based on, for example, the sequence of the center coordinates (indicated by X in FIG. 7) of the matched images.
[0041]
Then, the CPU 35 can rotate the displayed image in the opposite direction by the tilted angle based on the recognition result by the recognition processing device 34 to eliminate the tilt, and the tilt with respect to the camera center C is eliminated. When the operator switches to the state image, that is, the image shown in FIG. 6 and the operator operates the operation unit 40 and operates the SET key 43 in the same manner as in the manual registration, the CPU 35 uses the rotated image as a template. The data is stored in the RAM 36. Thus, the teaching operation for registering the die on the die supply table 27 as a template is completed.
[0042]
Although the present invention is applied to the taping apparatus, it can also be applied to die template registration in a die bonder or the like.
[0043]
Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.
[0044]
【The invention's effect】
According to the present invention, when a die on a wafer table is registered as a template, an angle at which an image captured by the recognition processing apparatus is inclined even when the wafer is inclined and attached to the wafer table . It is possible to perform registration without rotating the wafer table by rotating it in the opposite direction .
[Brief description of the drawings]
FIG. 1 is a plan view of a taping device.
FIG. 2 is a left side view of the taping device.
FIG. 3 is a control block diagram of the taping device.
FIG. 4 is a diagram illustrating a display screen of an image captured by the recognition processing apparatus.
FIG. 5 is a diagram showing a teaching edit screen.
FIG. 6 shows a display screen in a state where there is no inclination with respect to the camera center.
FIG. 7 is a diagram illustrating a display screen of an image captured by a recognition processing apparatus according to another embodiment.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Taping apparatus main body 3 Storage tape 3A Tape main body 3B Storage groove 3C Cover tape 10 Component loading apparatus 20 Turntable 21 Mounting head 22 Adsorption loading nozzle 34 Recognition processing apparatus 35 CPU
36 RAM
43 SET key 44 Teaching key 50 CRT
51 CRT
C Camera Center D Die

Claims (4)

  In a die pick-up apparatus for recognizing the position of a die on a wafer table by comparing an image of a die to be picked up picked up by a component recognition camera with a registered template, the component recognition of the die on the wafer table is performed. A recognition processing device that captures an image captured by a camera, a display device that displays an image captured by the recognition processing device, and an image displayed on the display device that is rotated in the opposite direction by an angle of inclination. An instruction device for an operator to instruct, a control device that controls to rotate an image displayed on the display device based on an instruction from the instruction device, and an image rotated by the control device is stored as the template A die pickup device comprising a storage device. In a die pick-up apparatus for recognizing the position of a die on a wafer table by comparing an image of a die to be picked up picked up by a component recognition camera with a registered template, the component recognition of the die on the wafer table is performed. A recognition processing device that captures an image captured by a camera, and detecting the tilt of the die based on the image captured by the recognition processing device, and controlling the captured image to rotate in the opposite direction by the tilt angle. A die pick-up apparatus comprising: a control device; and a storage device for storing an image rotated by the control device as the template. In a die pickup method for recognizing the position of a die on a wafer table by comparing an image of a die to be picked up picked up by a component recognition camera with a registered template,
The die on the wafer table is imaged by the component recognition camera,
The image captured by this component recognition camera is captured by the recognition processing device,
Display the image captured in this recognition processing device on the display device,
The operator instructs the pointing device to rotate the image displayed on the display device in the opposite direction by the tilted angle,
Control the image displayed on the display device based on the instruction by the instruction device to rotate by the control device,
A die pick-up method, wherein an image rotated by the control device is stored in a storage device as the template. In a die pickup method for recognizing the position of a die on a wafer table by comparing an image of a die to be picked up picked up by a component recognition camera with a registered template,
The die on the wafer table is imaged by the component recognition camera,
The image captured by this component recognition camera is captured by the recognition processing device,
The controller detects the tilt of the die based on the image captured by the recognition processing device, and controls the captured image to rotate in the opposite direction by the tilted angle.
A die pick-up method, wherein an image rotated by the control device is stored in a storage device as the template.

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