JP4273135B2 - Pattern forming method and pattern forming apparatus - Google Patents

Description

  The present invention relates to a pattern forming method and a pattern forming apparatus for forming a conductive pattern on a substrate using a liquid discharge method.

  Circuit boards on which semiconductors such as LSIs and various electronic components are mounted are now widely used as the heart of electronic devices, communication devices, computers, and the like. As a base material of such a circuit board, a composite material of a reinforcing material such as ceramic or glass fiber and a synthetic resin such as an epoxy resin is often applied. However, in the case of a circuit board to be incorporated in a small device such as a mobile phone or a digital camera, in order to further improve the mountability, by using a polyester resin, an aramid resin, etc., the base material is flexible. There are many cases that have. As for the number of circuit pattern layers of circuit boards, once they were mostly single-sided or double-sided boards, but now, with the miniaturization and higher density of devices, multilayer circuit boards such as 8 layers and 16 layers have become mainstream. ing. In addition, with the increase in the speed of electronic circuits, circuit patterns have been miniaturized and densified rapidly.

  There are various methods for forming a circuit pattern on a circuit board. Patent Document 1 discloses a method for forming a circuit pattern by using a technique of a liquid discharge method (inkjet recording method). According to the liquid discharge method, compared with the conventional subtractive method, the processing cost can be reduced and the environmental problem of waste liquid treatment can be solved. Further, it has various advantages such as high-speed recording, low running cost, easy space saving of the apparatus, and low noise. Therefore, although it is a liquid ejection method that originated as a recording device, circuit pattern formation of a circuit board, pixel formation of a color filter, formation of a light emitting layer of an organic EL element and an electron emission element of an electron source, micro lens production, It is considered promising for use in various industrial fields.

  According to Patent Document 1, a method of forming a drawing based on a conductive pattern and an insulating pattern on a substrate surface by discharging a conductive pattern solution and an insulating pattern solution from a liquid discharge head, and using this as a circuit pattern Is disclosed.

  However, when adopting the liquid ejection method, a new problem peculiar to it is also raised. In the liquid discharge method, a circuit pattern solution is recorded by discharging a solution for a circuit pattern from a discharge port provided corresponding to a recording element (such as a heating element or a piezoelectric element). However, at the ejection port corresponding to the recording element that does not perform ejection for a while, the solution to be ejected may evaporate and the remaining components may be fixed in the vicinity of the ejection port.

  FIG. 1 is a schematic view showing a state of the discharge port where the above-mentioned sticking has occurred. Here, FIG. 1A shows a state in which the fixed liquid blocks one of the discharge ports and is clogged. FIG. 2B shows a state in which a fixed object has adhered to the outside of the discharge port.

  FIG. 2 is a schematic diagram for explaining the adverse effects that occur in the circuit pattern when recording is performed using the ejection head to which the fixed matter is attached as shown in FIG. FIG. 2A shows a linear pattern in a state where recording is normally performed without causing clogging or adhesion as described in FIG. 1 at a plurality of ejection openings provided in the ejection head. On the other hand, FIG. 2B shows a linear pattern similar to that in FIG. 2A, in which one of the discharge ports discharges in a state where clogging occurs as shown in FIG. Since the solution cannot be discharged from the discharge port where clogging has occurred, a portion to which no solution is applied has occurred in the middle of the linear pattern. As a result, the circuit pattern is disconnected. Hereinafter, the state in which the solution cannot be discharged is referred to as non-discharge.

  FIG. 2C shows a linear pattern recorded with foreign matter adhering to the edge of the ejection port as shown in FIG. When discharging is performed with an attached substance in the vicinity of the discharge port, a twist occurs in the discharge direction, and a droplet is landed with a deviation from a desired position on the substrate. As a result, when the circuit pattern is disconnected or when the liquid droplets that have landed out of contact with another pattern, a short circuit occurs. Hereinafter, a state in which the solution is landed at a shifted position is referred to as landing shift. In FIGS. 1B and 2C, the description has been made in the state where the fixed substance is attached in the vicinity of the discharge port, but the state in which a part of the discharged solution is attached in the vicinity of the discharge port. Even so, the solution discharged from the discharge port is affected by the discharge direction, and landing deviation may occur. In this way, when ejection failure or landing deviation occurs in the ejection head and part of the circuit pattern is disconnected or a short circuit occurs between adjacent circuit patterns, a fatal defect is generated in the formed circuit pattern. It will be.

  Patent document 2 is mentioned as a countermeasure for suppressing such a harmful effect as much as possible. According to Patent Document 2, a method is disclosed in which a line pattern as described in FIG. 2 is recorded as a test pattern by all the ejection openings of an ejection head, and the presence or absence of an intermittent portion of the line pattern is detected optically or electrically. Has been. And when it is detected that there is intermittent, the content of performing a recovery operation on the ejection head in which non-ejection has occurred is disclosed.

JP 11-163499 A Japanese Patent Laid-Open No. 6-24008

  In recent circuit formation technology, the demand for lighter, thinner and smaller circuit boards is increasing. Also in the circuit formation technology using the liquid ejection method, technological development for forming a higher definition pattern is being promoted. If the liquid ejection method is applied, it is possible to draw a circuit pattern with a line width of about 10 to several tens of microns. In addition, today, research reports have been made to the extent that submicron pattern drawing is possible.

However, on the other hand, as the degree of integration of circuit patterns increases, it becomes difficult to maintain a higher recording accuracy. The specific factors are listed below.
(1) Thinning of the pattern is required to form a high-definition circuit pattern, and the amount of liquid droplets discharged from each discharge port is reduced. As a result, the individual discharge ports are also reduced, and the discharge ports are easily clogged.
(2) When the solution is discharged from the discharge port, fine droplets (hereinafter referred to as mist) are generated separately from the main droplet, but the influence of mist increases as the discharge amount decreases. A part of the mist adheres in the vicinity of the discharge port, resulting in landing deviation.
(3) Even if no foreign matter adheres to the discharge head, due to manufacturing errors between the plurality of discharge ports, bubbles or sticking matter adhering to a part of the inner wall of the discharge port due to the configuration of the discharge head. Thus, a slight landing deviation is easily included between the plurality of discharge ports. Along with the thinning of the line, the impact of such landing deviation is not negligible.

  That is, in the case where a high-definition circuit that has been demanded in recent years is formed by using a liquid discharge method, the conventional problems as in (1) and (2) are not only further deteriorated, but also in (3) Such new problems are also raised.

  With respect to the above-described problems, the method disclosed in Patent Document 2 can detect the presence / absence of an interrupted portion in one line pattern, but erroneous conduction (short) in which adjacent patterns come into contact with each other by twisting. Cannot be detected.

  The present invention has been made to solve the above problems, and an object of the present invention is to form a high-definition circuit pattern using a liquid ejection method with high reliability.

  To this end, the present invention allows a discharge head having a discharge port array in which a plurality of discharge ports are arranged, and a base material to be scanned relatively in a direction intersecting the discharge port row, so that the conductive property is discharged from the discharge port. A pattern forming method for forming a test pattern and a circuit pattern made of a conductive pattern by discharging a solution of the above to the base material, the pattern forming method corresponding to one row of the discharge port row in the direction of the discharge port row A test pattern forming step of forming a plurality of lines along the scanning direction at a predetermined interval, and confirming a defect by detecting each line of the test pattern and electrical continuity between the lines. A confirmation pattern and a circuit pattern formation process for forming the circuit pattern on a base material, and the interval between the plurality of lines in the test pattern is the line width of the line and the line Characterized in that it is set in accordance with the minimum space width of the road pattern.

  Further, a discharge head having a discharge port array formed by arranging a plurality of discharge ports and a base material are relatively scanned in a direction intersecting the discharge port array, and the conductive solution is discharged from the discharge ports. A pattern forming apparatus that forms a test pattern and a circuit pattern made of a conductive pattern by discharging to a base material, and corresponds to one row of the discharge port rows along a line along the discharge port row direction. A plurality of test pattern forming means for forming a plurality of predetermined intervals in the scanning direction, a means for confirming a defect by detecting each line of the test pattern and electrical continuity between the lines, The circuit pattern forming means for forming the circuit pattern on the substrate and the interval between the plurality of lines in the test pattern are the width of the line and the minimum space of the circuit pattern. Characterized by comprising a confirmation means for setting in accordance with the width.

  According to the present invention, it is possible to determine in advance whether or not the ejection state of the ejection head is sufficiently stable to form a desired circuit pattern. Therefore, a high-definition circuit pattern can be formed with high reliability.

Hereinafter, a circuit board forming apparatus to which the present invention can be applied will be described.
FIG. 4 is a perspective view of an apparatus (substrate forming apparatus) for forming a pattern employing a liquid ejection method, which can be commonly applied to a plurality of embodiments described below. In FIG. 4, a discharge head 2 and a tank 3 can be mounted on the carriage 1. The carriage 1 can move in the main scanning direction indicated by an arrow A in FIG. 4 while being guided by a CR linear motor stage 7 provided on the portal base 6.

  FIG. 5 is a perspective view of the ejection head 2 applicable to the present invention. The plurality of discharge ports 31 are arranged in the sub-scanning direction indicated by the arrow B in FIGS. 4 and 5 and discharge the solution supplied from the tank 3. The sub-scanning direction B is in a direction intersecting with the main scanning direction A, and is preferably in a vertical relationship. A pattern for one scan is formed on the substrate 4 by discharging the solution from the discharge port of the discharge head 2 while the carriage 1 moves and scans in the main scanning direction A of FIG.

  It is extremely preferable that the solution applicable to the present invention is conductive. In this case, a metal colloid, a dispersant, water, a water-soluble organic solvent, a viscosity adjuster, a pH adjuster, a preservative, a surfactant, an antioxidant and the like are included as necessary. Examples of the metal colloid include Ag, Pt, SnO 2, Al, Cr, Zn, and Fe. From the viewpoint of conductivity, it is desirable to apply Ag, SnO 2, and Al. In general, the diameter of colloidal particles is several hundred nm or less. However, for application to the present invention, a metal colloid having a particle diameter in the range of several tens to several hundreds of nm is preferable from the viewpoint of uniformity and stability of a circuit pattern. is there. Within this range, the colloidal metal is prevented from settling in the solution, and the storage stability of the solution can be effectively prevented from being lowered. In the following examples, an ionic solution is used to form a conductive solution. The composition is 6.8% by weight of methylhexahydrophthalic anhydride as an acid anhydride per 100% by weight of silver fine particles, and thermosetting. The resin is 5% by weight of a resol type phenol resin. However, the present invention is not limited to this, and may be a conductive solution having other components if applicable. Even if the solution itself does not have appropriate conductivity, it can be used as the discharge solution of the present invention as long as the conductivity can be increased by performing a heating step or a baking step later.

  The substrate 4 generally has a planar shape such as a film, sheet, or plate. However, a curved surface may be used as long as the circuit pattern can be formed by the liquid ejection method. In the examples shown below, the circuit pattern is completed by evaporating volatile components contained in each solution and fixing conductive components on the substrate. Examples of the material for the substrate on which the pattern is formed include thermoplastic resin films such as polyester films, aromatic polyamide films, and polyimide films. Furthermore, a sheet made by impregnating and curing a thermoplastic resin or epoxy resin on a woven fabric or nonwoven fabric made of glass fiber, polyester fiber and aromatic polyamide fiber, and a plate such as a glass epoxy laminate used for a normal circuit board The thing of the shape is mentioned.

  Other examples include porous ceramics obtained by sintering alumina, silica, aluminum nitride, barium titanate, zirconia, and the like, porous resin films mainly made of polyolefin and inorganic filler, glass fibers, and the like. Thus, it is also effective to apply a material that can withstand the heating process and the baking process as the base material. In this case, if the substrate after recording the circuit pattern is baked using a baking apparatus, the metal colloid contained in the solution dissolves to realize metal bonding, and the conductivity of the circuit pattern can be further improved. I can do it.

  A portal base 6 is fixed at a predetermined position on the surface plate 5 of the circuit board forming apparatus. The CR (carriage) linear motor stage 7 is a stage for moving the carriage 1 by driving a linear motor, and is supported by a portal base 6 having high rigidity. Therefore, the ejection head 2 can move and scan in the main scanning direction without changing with respect to the surface plate 5. On the other hand, the LF (line feed) linear motor stage 8 is a stage that moves the substrate 4 in the sub-scanning direction by driving the linear motor. Since the LF linear motor stage 8 is also mounted on the surface plate 5, the surface of the base material does not fluctuate with respect to the ejection head with the conveyance. In other words, recording (pattern formation) can be performed in a state where a predetermined distance is maintained between the surface of the ejection head 2 on which the solution is ejected and the circuit pattern formation surface.

  Although not shown in the figure, the two linear motor stages 7 and 8 incorporate a linear encoder and an origin sensor for detecting the relative positions of the carriage 1 and the portal base 6, and drive the linear motor. Used as servo control input.

  In the following embodiments, a linear encoder having a resolution of about 0.5 microns is applied in accordance with the accuracy of a circuit pattern to be formed. Thereby, a high-definition circuit pattern having a line width of 10 to several tens of microns can be formed. The signal of the linear encoder provided in the CR linear motor stage 7 is also used for controlling the timing at which the ejection head 2 ejects the solution.

  When pattern data is input from a host device (not shown) to the circuit forming apparatus having the above-described configuration, the carriage 1 starts moving scanning in the main scanning direction, and at the same time, the above pattern is output from each discharge port of the discharge head 2. Dispensing according to the data is executed. After the main scanning (pattern formation) accompanied by such an ejection operation, the substrate 4 is conveyed in the sub-scanning direction by an amount corresponding to the recording width by the main scanning. A circuit pattern is gradually formed on the substrate 4 by intermittently repeating the main scanning and the sub-scanning as described above.

  A suction cap 10 shown in FIG. 4 is for performing maintenance processing of the ejection head 2. The suction cap 10 is formed of an elastic material such as rubber. The suction cap 10 is pressed against the discharge port surface of the discharge head to forcibly suck the solution inside the discharge port, thereby clogging or adhering matter in the vicinity of the discharge port. Remove. By appropriately performing such suction operation, the discharge state of the discharge head 2 can be maintained normally. The suction cap 10 also plays a role of protecting the ejection head 2 during non-recording. Further, although not shown in the drawing, as a mechanism for executing the maintenance process of the ejection head 2, in addition to the suction cap 10, it is possible to directly remove foreign matters attached to the ejection port surface of the ejection head 2. A wiper member or the like may be provided.

  The conductive probe 9 shown in FIG. 4 is for detecting a test pattern unique to the present invention. Details of the conductive probe 9 will be described later.

  The process of actually forming a multilayer circuit using the multilayer circuit board forming apparatus having the above-described configuration will be described in detail in the embodiments.

  In general, a circuit pattern is formed by combining linear patterns in two orthogonal directions. Here, FIG. 3 shows a schematic diagram for explaining landing deviation of the circuit pattern recorded on the substrate. FIG. 3A shows an ejection head having an ejection port array composed of 20 ejection ports arranged in a row. The circuit pattern is recorded by discharging the solution from each discharge port while the discharge head moves in the scanning direction indicated by the arrow.

  FIG. 3B shows a linear pattern having a line width W1 formed in the scanning direction of the ejection head. FIG. 3C shows a straight line pattern having a line width W2 formed in the arrangement direction of the discharge ports. The pattern in FIG. 3B is formed by droplets ejected continuously from one ejection port on the ejection head. Therefore, this line does not include variations among the plurality of ejection openings. On the other hand, the pattern of FIG. 5C is formed by droplets ejected one by one from all 20 ejection ports while moving the ejection head in the main scanning direction. Therefore, in this line, characteristics of a plurality of ejection openings, that is, variations in ejection timing and ejection amount, etc. appear in the landing state of individual dots. The line width W2 of a line including a large amount of variation is larger than the line width W1 of a line including no variation. In recent general circuit forming apparatuses, empirically, W2 is about 1.5 to 2.5 times W1.

  As the circuit becomes finer and the lines become thinner, it is assumed that a plurality of thin lines are formed in parallel at close positions. However, as shown in FIG. 3C, if the actual line width becomes thicker than the actual design value due to landing deviation, the approaching lines may come into contact with each other and a short circuit may occur.

  Therefore, in the present invention, the pattern as shown in FIG. 3C, which includes various errors between the discharge ports and easily disturbs the line shape as compared with the ideal state, is used as a test pattern, thereby providing high reliability. Enables recording of circuit patterns. In other words, the test pattern in the present invention is composed of lines along the discharge port array formed by discharging the solution from all the discharge ports related to the recording of the discharge head. A plurality of such lines are arranged at regular intervals in the main scanning direction. That is, in the test pattern of the present invention, it is possible to confirm not only the continuity of each line but also the independence between adjacent lines.

  By using such a test pattern, it is possible to determine whether or not the ejection state of the ejection head is stable when forming a desired circuit pattern, and a high-definition circuit pattern with high reliability. Can be formed.

  FIG. 6 is a flowchart for explaining the steps for forming a circuit pattern in this embodiment.

  When a circuit pattern input command is received from a host device or the like, the circuit forming device first records a test pattern (step S1). Specifically, the ejection head 2 is moved out of the circuit pattern area by the CR linear motor stage 7, and a predetermined test pattern is recorded here.

  FIG. 7 is a diagram showing test patterns recorded in this embodiment. The test pattern applied in the present embodiment has a line shape along the ejection port array of the ejection head as shown in FIG. In this case, two lines formed by discharging a solution at a predetermined timing from all discharge ports related to recording are arranged at a predetermined interval in the main scanning direction. Here, FIG. 7B shows an ideal line in design. On the other hand, FIG. 7C shows a line actually formed by the ejection head applied in this embodiment. As already described with reference to FIG. 3, the line that is recorded extending in the sub-scanning direction (the line along the discharge port array) includes various errors between the discharge ports, which is an ideal state. Compared to the line, the line has been lost.

  In FIG. 7, an interval between two lines as a test pattern formed on a substrate, that is, a space width is S. Here, S1 shows the space width on the design value of two lines, and S2 shows the space width actually obtained. S2 defined by two lines whose linearity is impaired is smaller (narrower) than S1. However, no matter how small this measured value is, if the two lines are formed independently without being interrupted, the function as a circuit is normally realized.

  Since the test pattern consisting of two lines is for determining whether or not the actual circuit pattern is normally recorded, the space width S is the minimum space width of the pattern actually formed as a circuit. The following is preferable. Therefore, in the present embodiment, the line interval (space width S1) of the test pattern is set as the value of the minimum space width of the pattern actually formed as a circuit on the substrate. After recording such a test pattern, it is determined whether or not it is worth recording an actual circuit pattern by checking whether or not the two lines are functioning normally. In the above, the interval between the two lines is the minimum space width of the pattern that is actually formed as a circuit on the base material. However, if the value is further narrower than this, the circuit is formed with higher accuracy. be able to.

  It is desirable to set the design space width S1 between lines in such a test pattern after sufficiently grasping the actual measurement value W2 of the line width along the discharge port array. Since the line width W2 of the line along the discharge port array varies greatly depending on the discharge amount from the discharge port and other error factors, the possibility of contact between the two parallel lines is greatly affected by this. It is. In this embodiment, the line width W1 of each line is designed to be 20 μm, and the space width S1 between the two lines is designed to be 30 μm.

Returning again to FIG. When the test pattern recording in step S1 is completed, the process proceeds to step S2, and it is confirmed whether or not the two lines are functioning normally in the recorded test pattern. In this embodiment, the conductive probe 9 is used for this confirmation.
FIGS. 8A to 8D are enlarged views for explaining the configuration and operation of the conductive probe 9 applied in this embodiment. The conductive probe 9 of the present embodiment includes four probe cores 13, and these can be brought into contact with or retracted from the substrate. FIG. 8A shows a state in which the probe core 13 is retracted from the base material, and FIG. 8B shows a state in which the probe core 13 is in contact with the base material. The probe core 13 is controlled to contact and retract to the base material by a motor 11 and a gear 12 provided in the conductive probe 9.

  In this embodiment, as shown in FIG. 8C, the four probe cores 13 are arranged so that the tips thereof are in contact with the ends of the two lines recorded in step S1. When the probe cores 13 are in contact with the substrate, the four probe cores 13 are controlled so as to simultaneously contact the two test patterns.

  FIG. 8D is a cross-sectional view for explaining the detailed configuration of the probe core 13. The probe needle 13 comes into contact with a conductive test pattern formed on the substrate by the movable needle 18 provided at the tip thereof. Information on energization or non-energization due to this contact is transmitted to the fixed needle 16 disposed further upward. The upper portion of the fixed needle 16 is solder-connected to the flexible cable 14 and is fixed by the connection portion 15. A pressure contact spring 17 is provided around the fixed needle 16, and the movable needle 18 can move up and down with respect to the fixed core by this action. The flexible cable 14 is connected to a conductivity check circuit (not shown).

  Since the recorded test pattern has electrical conductivity, the presence or absence of disconnection or short-circuit of each line can be detected by performing a continuity check between the four probe cores.

  FIG. 9 is a circuit diagram for explaining a terminal selection state when checking a test pattern disconnection or short-circuit state. When checking the disconnection of individual lines, the two terminal units are switched so as to be connected to the probe cores that are in contact with each other on the same line. On the other hand, when a short circuit between two lines is checked, the two terminal units are switched so as to be connected to probe cores that are in contact with different lines.

  FIGS. 10A to 10C show cases where various adverse effects occur in the test pattern. FIG. 10A shows a state where non-ejection has occurred in one of the ejection openings. FIG. 10B shows a state where landing deviation has occurred in one of the discharge ports. Even in this case, disconnection is confirmed in each of the two lines. Further, FIG. 10C shows a case where contact between lines has occurred due to landing deviation. In the case of FIG. 10C, disconnection in each line is not confirmed, but conduction between the lines, that is, short circuit is confirmed.

  FIG. 6 will be referred to again. After confirming the continuity as described above in step S2, the process proceeds to step S3, and it is determined whether a disconnection or a short circuit is confirmed in step S2. When the disconnection or the short circuit is confirmed, the process proceeds to step S4 and the recovery process for the ejection head is executed. That is, the discharge state of the discharge head is adjusted by pressing the cap 10 against the discharge port surface of the discharge head to forcibly perform a suction operation or perform preliminary discharge. Thereafter, the process returns to step S1, and a test pattern is recorded again by the recovered ejection head. The recording position at this time is outside the circuit pattern recording area and is different from the previously recorded position.

  On the other hand, if disconnection or a short circuit is not confirmed in step S3, the process proceeds to step S5 and an actual circuit pattern is recorded. This process is complete | finished above.

  In the above description, the maintenance process is performed every time a disconnection or a short circuit is confirmed. However, when the ejection head is defective, the maintenance process is inadvertently repeated. Therefore, if the recording state is not improved even after several maintenance processes, replace the ejection head or increase the circuit pattern line interval beyond the test pattern interval. It is preferable to employ a solution.

  As described above, in the present embodiment, prior to recording a circuit pattern, two lines are recorded as test patterns from the discharge ports applied to the circuit pattern recording. Thereafter, the disconnection and short circuit of the two lines are checked to determine whether or not the state of the applied ejection head is appropriate for recording the circuit pattern. As a result, a high-definition circuit pattern can be formed with high reliability. In this embodiment, two lines are used as test patterns, but a plurality of lines may be used.

  Example 2 of the present invention will be described below. One of the merits of using the liquid discharge method for forming a circuit pattern is that it is easy to deal with high-mix low-volume production. If the host device has a lot of circuit pattern data, circuit boards having different circuit patterns can be formed continuously.

  In this case, it is assumed that the degree of integration varies among the plurality of circuit patterns, and the line spacing S to be ensured so as not to cause a short circuit is not uniform. When forming a circuit board on which the degree of integration is low and circuit pattern intervals are recorded relatively widely, it is too strict as a check to measure the test pattern line interval S closer than necessary. It is not preferable from the viewpoint of circuit formation yield to determine whether or not to apply the ejection head under conditions that are more severe than necessary.

  Therefore, the circuit forming apparatus of this embodiment is characterized in that the two line intervals S of the test pattern are adjusted according to the circuit pattern to be recorded. Furthermore, it is set as the structure provided with the conductive probe which can adjust arrangement | positioning of a probe core according to the said line space | interval S. FIG. The description of the same parts as those in the first embodiment will be omitted.

  FIG. 11 is a diagram showing a state of two probe cores for adjusting the interval between the conductive probes applied in this embodiment. In FIG. 11, reference numeral 19 denotes a microactuator unique to this embodiment, which is a drive mechanism capable of feed scanning on the order of a micrometer. A movable base 20 on which one probe needle 13 a is mounted is fixed to the tip of the microactuator 19. Accordingly, by driving the microactuator 19 in the main scanning direction (the arrow direction in FIG. 11), the probe needle 13a can be moved in the same direction, whereby the distance L between the probe cores 13a and 13b is changed to the test pattern. The line spacing S can be adjusted. In the conductive probe 9 of the present embodiment, a similar microactuator 19 is provided for another set of probe cores for measuring the reverse short part of the test pattern line. The microactuator 19 and the other probe needle 13b are fixed to the same base 21 of the conductive probe, and this base 21 further supports another set of probe cores. As described above, the two pairs of probe cores have a configuration in which the distance is adjusted while keeping parallel to each other.

  Also in this embodiment, each step when forming a circuit pattern can be described with reference to the flowchart of FIG.

  First, in step S1, the test pattern of the present embodiment is recorded after the line interval S is adjusted according to the circuit pattern to be formed thereafter. In the subsequent step S2, the position of the probe core 13a is adjusted by the microactuator 19, the distance L between the probe cores 13a and 13b is set to a predetermined line interval S, and then the probe core 13 is brought into contact with the test pattern recording surface of the substrate. Let In this state, the same conductivity check as in the first embodiment is performed. Subsequent steps are the same as those in the first embodiment.

  As described above, according to this embodiment, prior to recording a circuit pattern, two lines are recorded as a test pattern at an interval S corresponding to the content of the circuit pattern to be recorded. Thereafter, the disconnection and short circuit of the two lines are checked to determine whether or not the state of the applied ejection head is appropriate for the circuit pattern to be recorded next. Thereby, it is possible to check the test pattern suitable for the integration density of the circuit pattern.

  In the above-described embodiment, a volatile conductive solution that does not require a separate process such as a heat treatment is used so that the ejection head check process and the circuit pattern formation process are performed more efficiently and in a short time. ing. The test pattern is recorded on the same substrate as the circuit pattern, but the present invention is not limited to such content. If a solution that exhibits conductivity by applying heat treatment or baking treatment is applied, heating or baking is performed after the test pattern is formed, and a circuit pattern is recorded after the test pattern is inspected for continuity. Good. In this case, the circuit pattern and the test pattern do not necessarily have to be recorded on the same substrate, and the object of the present invention can be achieved as long as the test pattern can be formed in the same state as the actual circuit pattern formation. .

  In the above-described embodiment, the test pattern is recorded and inspected before the circuit pattern is recorded. However, the test pattern may be checked in a timely manner during the circuit pattern recording. For example, if the number of discharges exceeds a predetermined number of times, deposits such as mist increase in the vicinity of the discharge port, and problems such as twisting may occur. Check it. Alternatively, in the circuit pattern recording process, when there is an ejection port that is not used for a predetermined time, the test pattern may be recorded and checked after the predetermined time has elapsed.

  In the above-described embodiment, the circuit board forming apparatus is described as having the conductive probe for checking the test pattern. However, the present invention is not limited to the apparatus having such a configuration. Prior to recording the circuit pattern, after recording a plurality of lines that can be checked for disconnection or short circuit as a test pattern, if a means that can check the disconnection and short circuit of the test pattern by any means is prepared, This is within the scope of the present invention.

(A) And (b) is the schematic diagram which showed the mode of the discharge outlet in which sticking generate | occur | produced. (A)-(c) is a schematic diagram for demonstrating the bad effect which arises in a circuit pattern. (A)-(c) is a schematic diagram for demonstrating the landing deviation which arises between several discharge outlets. 1 is a perspective view of a multilayer circuit board forming apparatus adopting a liquid discharge method applicable to an embodiment of the present invention. It is a perspective view of the discharge head applicable to the Example of this invention. It is a flowchart for demonstrating the process at the time of forming the circuit pattern applicable to the Example of this invention. (A)-(c) is a schematic diagram of the test pattern applicable to the Example of this invention. (A)-(d) is an enlarged view for demonstrating the structure and operation | movement of a conductive probe applicable to the Example of this invention. It is a circuit diagram which shows the terminal selection state at the time of checking the state of the test pattern applicable to the Example of this invention. (A)-(c) is a schematic diagram for demonstrating the disconnection and short circuit which generate | occur | produce in a test pattern. It is a schematic diagram for demonstrating the structure of a probe core which can adjust the space | interval of the conductive probe applicable to Example 2 of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Carriage 2 Discharge head 3 Tank 4 Base material 6 Gate type base 7 CR linear motor stage 8 LF linear motor stage 9 Conductive probe 10 Suction cap 11 Motor 12 Gear 13 Probe core 14 Flexible cable 15 Solder connection 16 Fixed needle 17 Pressure contact spring 18 Movable needle 19 Microactuator 20 Movable base 21 Base 31 Discharge port

Claims (8)

A discharge head having a discharge port array formed by arranging a plurality of discharge ports and a base material are relatively scanned in a direction intersecting the discharge port array, and a conductive solution is discharged from the discharge port to the base material. A pattern forming method for forming a test pattern and a circuit pattern made of a conductive pattern by
A test pattern forming step of forming a plurality of lines along the discharge port array direction corresponding to one of the discharge port arrays at regular intervals in the scanning direction;
A confirmation step of confirming the defect by detecting the electrical continuity between each line and the lines of the test pattern;
A circuit pattern forming step of forming the circuit pattern on a substrate;
An interval between the plurality of lines in the test pattern is set according to a line width of the lines and a minimum space width of the circuit pattern. A step of performing a recovery process of the ejection head;
When a defect in the test pattern is confirmed in the confirmation step, the recovery process step, the test pattern formation step and the confirmation step are performed,
The pattern forming method according to claim 1, wherein when the defect in the test pattern is not confirmed in the confirmation step, the circuit pattern formation step is performed.   3. The pattern forming method according to claim 2, wherein, even if the recovery process is executed a predetermined number of times, if a defect in the ejection head is confirmed in the confirmation step, the space width of the circuit pattern is widened.   The pattern formation method according to claim 1, wherein the test pattern formation step and the confirmation step are performed before the circuit pattern formation step and in the middle of the circuit pattern formation step.   5. The pattern forming method according to claim 1, wherein the test pattern forming step and the confirmation step are performed after a predetermined number of ejections by the ejection head or after a predetermined time has elapsed. A discharge head having a discharge port array formed by arranging a plurality of discharge ports and a base material are relatively scanned in a direction intersecting the discharge port array, and a conductive solution is discharged from the discharge port to the base material. A pattern forming apparatus for forming a test pattern and a circuit pattern made of a conductive pattern by
A test pattern forming unit that forms a plurality of lines along the discharge port array direction corresponding to one of the discharge port arrays at regular intervals in the scanning direction;
Confirming means for confirming the malfunction by detecting each line of the test pattern and the electrical continuity between the lines,
Circuit pattern forming means for forming the circuit pattern on a substrate; and means for setting intervals between the plurality of lines in the test pattern according to a line width of the lines and a minimum space width of the circuit pattern. A pattern forming apparatus.   The pattern forming apparatus according to claim 6, further comprising a unit that performs recovery processing of the ejection head when a defect in the test pattern is confirmed by the confirmation unit.   8. The apparatus according to claim 7, further comprising a unit that widens a space width of the circuit pattern when the failure of the ejection head is confirmed by the confirmation unit even after the recovery process is performed a predetermined number of times. Pattern forming device.

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