JP4282638B2 - Substrate bonding member and three-dimensional connection structure using the same - Google Patents

Description

  The present invention relates to a substrate bonding member for connecting a plurality of substrates on which electronic components such as semiconductor elements (hereinafter referred to as IC chips) are mounted, and a three-dimensional connection structure bonded using the substrate bonding member.

  Conventionally, as a substrate bonding member for connecting between substrates such as module substrates mounted with electronic components such as IC chips and chip components, a multi-pole connection type connector consisting of a plug side and a socket side, or a plurality of resin spacers A pin connector with a fixed connection pin is used.

  FIG. 11 is a cross-sectional view showing a configuration in which module substrates 110 and 120 are connected by a pin connector 100 which is a conventional method. The pin connector 100 includes a resin spacer 102 and a plurality of metal connection pins 104 penetratingly fixed to the resin spacer 102. The module substrate 110 has a circuit pattern 114 formed on one surface of the wiring substrate 112, and an electronic component 116 made of a chip component or a semiconductor chip is mounted on a predetermined portion of the circuit pattern 114. Further, similarly, the module substrate 120 has a circuit pattern 124 formed on one surface of the wiring substrate 122, and an electronic component 126 made of a chip component or a semiconductor chip is mounted on a predetermined portion of the circuit pattern 124. Yes.

  Connection between the module substrates 110 and 120 using the pin connector 100 is performed as follows. First, the metal connection pins 104 of the pin connector 100 and the circuit patterns 114 and 124 of the module substrates 110 and 120 are aligned. Next, the upper end portion and the lower end portion of the metal connection pin 104 are passed through the respective circuit patterns 114 and 124. Thereafter, the circuit pattern 114 and the lower end portion of the connection pin 104 and the circuit pattern 124 and the upper end portion of the connection pin 104 are soldered by the soldering portion 128, respectively. As described above, the module substrates 110 and 120 using the pin connector 100 can be connected.

  By the way, the number of connection terminals between module substrates tends to increase as the size and weight of mobile devices and the like increase in functionality. For this reason, the connector as a board | substrate joining member needs to make the area per one connection terminal small. For this reason, efforts are made to reduce the connection terminal pitch of the pin connector.

  However, in such a connection method, the joint portion of the pin connector is likely to receive a large force when receiving a difference in dimensional variation when the temperature changes between members constituting the joint portion or an impact force from the outside. For this reason, the examination of the structure for relieving such an external force is performed.

  For example, by using a pin connector 130 as shown in FIG. 12 and connecting the module substrates 110 and 120 as shown in FIG. 13, a connection structure that reduces the influence of stress due to thermal expansion of the resin spacer 132 and the like is shown. (For example, Patent Document 1). FIG. 12A is a plan view, and FIG. 12B is a cross-sectional view along the longitudinal direction. FIG. 13 is a cross-sectional view showing a configuration in which the module substrates 110 and 120 are connected to each other using the pin connector 130. A plurality of metal connection pins 134 penetrating vertically are insert-molded and fixed to the resin spacer 132 of the pin connector 130. Further, as shown in FIG. 12 (b), flexible elastic pieces 136 are provided to project diagonally downward from the left and right ends of the lower surface of the pin connector 130.

  As shown in FIG. 13, two module boards 110 and 120 are connected using this pin connector 130. Specifically, after the upper end portion and the lower end portion of the metal connection pin 134 are passed through the respective circuit patterns 114 and 124, the upper end portion of the connection pin 134, the circuit pattern 124, the lower end portion of the connection pin 134, and the circuit. The pattern 114 is connected by soldering with the soldering part 128. At this time, the lower module substrate 110 is fixed so as to contact the flexible elastic piece 136 on the lower surface of the resin spacer 132.

Accordingly, when the resin spacer 132 of the pin connector 130 is thermally expanded due to heat generation of the electronic components 116 and 126 mounted on the module substrates 110 and 120 and changes in the ambient temperature, the resulting stress can be absorbed by the flexible elastic piece 136. As a result, even if heat is generated, no stress is generated in the soldered portion, and a stable soldered state is maintained. The flexible elastic piece 136 may be provided not only on the lower surface of the resin spacer 132 but also on the upper surface.
JP-A-6-310195

  However, in recent years, mobile devices have become highly functional, and the number of connection terminals of connectors has increased, and devices that are more resistant to dropping impact have been required. On the other hand, in the connection structure using the pin connector as shown in the above example, a through hole is provided in the module substrate, the connection pin is passed through the through hole and connected to the circuit pattern, and the flexible elastic piece is used. Absorbs thermal stress.

  In the pin connector 100 and the like in FIG. 11, position shift of the plurality of metal connection pins 104 occurs due to the molding pressure at the time of resin molding of the resin spacer 102, which becomes a serious problem particularly in the case of fine pitch connection. .

Further, in the conventional structure, both sides of the module substrate cannot be used effectively, and there is a problem that it is difficult to form a high-density circuit pattern because the through holes are provided.
An object of this invention is to provide the board | substrate joining member of the stable structure in which a fine pitch connection is possible.

  And it aims at providing the board | substrate joining member with high reliability of a connection part, and a three-dimensional connection structure using the same, even if stress, such as a drop impact, is added.

A board bonding member according to claim 1 of the present invention is a board bonding member that is interposed between a first circuit board and a second circuit board and relays an electrical connection, and an insulating housing; A plurality of lead terminals connected by the housing, wherein the lead terminal has a base end portion embedded in the housing and extended from one of the base end portions to the outside of the housing to be exposed. An end portion extends from the other of the base end portion to the outside of the housing, the first joint portion serving as a joint portion between the first circuit board and one of the second circuit boards. And a second joint portion to be a joint portion with the other circuit board, the housing has a polygonal frame shape, and a shield member is provided on the outer periphery or the inner periphery of the housing .

  The substrate bonding member according to claim 2 of the present invention is the substrate bonding member according to claim 1, wherein the first bonding portion of the lead terminal is the other end of the exposed portion extended in the length direction of the housing from one of the base end portions. The second joint portion of the lead terminal extends from the other of the base end portions to the outside of the side of the housing, and is bent in the direction intersecting the length direction of the housing. And extending in a direction opposite to the side surface of the housing in a direction opposite to the exposed portion and bent in a direction intersecting the length direction of the housing without contacting the end surface of the housing. .

  According to a third aspect of the present invention, there is provided the substrate joining member according to the first aspect, wherein the first joint portion of the lead terminal is the other end of the exposed portion extended in the length direction of the housing from one of the base end portions. The second joint portion of the lead terminal extends from the other end of the base end to the opposite side of the exposed portion in the length direction of the housing. It is provided and is formed by being bent in a direction intersecting with the length direction of the housing in a state of extending to the end surface of the housing opposite to the first joint portion and in contact with the end surface of the housing. To do.

According to a fourth aspect of the present invention, there is provided the substrate bonding member according to any one of the first to third aspects, wherein the shield member is formed by integrally forming a bent metal thin plate with the housing, or the shield member is a surface of the housing. It is characterized in that it is configured by coating a conductive material.

The three-dimensional connection structure according to claim 5 of the present invention is
The first circuit board and the second circuit board are stacked and electrically connected by the board bonding member according to any one of claims 1 to 3 .

  The substrate bonding member of the present invention has a structure in which the lead terminal is exposed from the side surface of the housing, thereby suppressing the blurring of the lead terminal due to the molding pressure during resin molding, and a more stable structure can be obtained.

  Further, even when a large impact force such as a drop impact is applied to the three-dimensional connection structure joined by the substrate joining member, the impact force can be absorbed at the tip portion to greatly improve the impact resistance. As a result, there is a great effect that a three-dimensional connection structure excellent in impact resistance can be realized while being connected at a fine pitch.

Embodiments of the present invention will be described below with reference to FIGS.
(Embodiment 1)
1 and 2 show (Embodiment 1) of the present invention.

FIG. 1 shows a three-dimensional connection structure in which an upper module substrate 72a and a lower module substrate 72b are connected using the substrate bonding member 10 shown in FIG.
The upper module substrate 72a has a configuration in which electronic components 70 and 71 such as IC chips and chip components are mounted on a multilayer wiring substrate 65 having wiring layers formed on both sides. The multilayer wiring board 65 includes circuit patterns 67 and 68 formed on both surfaces of a resin base material 66 and through conductors 69 connecting them. The basic structure of the lower module substrate 72b is the same as that of the upper module substrate 72a, and has a configuration in which electronic components 62 and 63 such as IC chips and chip components are mounted.

  The substrate bonding member 10 includes a frame-shaped housing 12 having a square shape with chamfered corners, and lead terminals 14 provided on the housing 12 at a predetermined pitch. The housing 12 is made of a resin such as liquid crystal polymer, polyphenylene sulfide, or polybutylene terephthalate, and a part of the lead terminal 14 made of a thin metal plate having excellent spring elasticity is embedded and held in the housing 12.

  More specifically, as can be seen from FIG. 1, the lead terminal 14 includes a base end portion 15 embedded in the housing 12, a first joint portion 16 provided on the lower end surface 12A side of the housing 12, The front end portion 17 rises from the vicinity of the central portion of the inner wall 12C of the housing 12 along the inner wall 12C and is bent along the upper end surface 12B of the housing 12. Note that a region of the distal end portion 17 that is bent along the upper end surface 12B of the housing 12 is a second joint portion 17A. The base end portion 15 has a substantially crank shape and is embedded in the housing 12. One end portion of the base end portion 15 is exposed from the lower end surface 12A of the housing 12, is bent toward the width direction (arrow K direction) of the lower end surface 12A, and is formed in close contact with the lower end surface 12A. This portion constitutes the first joint portion 16. The first joint 16 protrudes from the outer wall side of the housing 12. A part of the lead terminal 14 is exposed from the inner wall 12 </ b> C of the housing 12, and this is an exposed portion 13.

The distal end portion 17 is held in a state of being separated from the inner wall 12C and the upper end surface 12B of the housing 12, and can be easily elastically deformed when receiving an external force.
The substrate bonding member 10 according to the present embodiment has the above-described configuration, and the second bonding portions 17A and the first bonding portions 16 of the plurality of lead terminals 14 are on substantially parallel planes. Electrical and mechanical connection with the circuit pattern of each substrate is performed. Specifically, of the circuit pattern formed on the lower module substrate 72b and the circuit pattern 68 formed on the upper module substrate 72a, the second bonding portion 17A of the lead terminal 14 of the substrate bonding member 10 is used. And the location which opposes the 1st junction part 16, and the 2nd junction part 17A and the 1st junction part 16 are joined by soldering 18.

  As the material of the lead terminal 14, it is desirable to use phosphor bronze, brass, white, beryllium copper, nickel alloy, stainless steel, spring steel, etc., which are excellent in spring elasticity, but also use copper, nickel, etc. Can do. Further, the shape of the lead terminal 14 may be not only a flat plate shape as shown in FIG. 1 but also a circular cross section. Further, while the overall shape is flat, the width of the tip 17 excluding the second joint 17A is made smaller than the width of the second joint 17A, and elastic deformation at the tip 17 is more likely to occur. It may be made to become. Further, the width, thickness, etc. of the lead terminals are appropriately set according to the material to be used and the arrangement pitch.

By this joining, a three-dimensional connection structure in which the upper module substrate 72a and the lower module substrate 72b are electrically and mechanically connected is obtained.
According to this configuration, even if a large impact force such as a drop impact is applied to the three-dimensional connection structure, the impact force can be absorbed by the tip portion 17 of the lead terminal 14 being elastically deformed. Further, it is possible to prevent the breakage of the lead terminal 14 and the occurrence of a defect in the joint between the circuit pattern 68 of the lower module substrate 72b or the circuit pattern 68 of the upper module substrate 72a and the lead terminal 14.

  The first joint 16 of the lead terminal 14 does not necessarily have to protrude from the lower end surface 12A of the housing 12 in the width direction. In FIG. 1, the second joint 17A is formed shorter than the width of the upper end surface 12B of the housing 12, but may be formed so as to protrude in the width direction of the upper end surface 12B.

  Further, by adopting a structure in which the exposed portion 13 is provided, the exposed portion 13 is pressed against the mold by molding pressure at the time of resin molding, so that lead shake or the like can be suppressed and a more stable structure can be obtained.

  Furthermore, when the connection with the circuit pattern of each substrate is performed by soldering, solderability such as solder plating or gold plating on at least the surface of the second joint 17A and the first joint 16 of the lead terminal 14 is performed. It is desirable to perform processing to improve The connection with the circuit pattern may be performed using a conductive adhesive, but in this case, it is preferable to treat the surface with gold plating or the like because the connection resistance can be reduced.

(Embodiment 2)
3 and 4 show (Embodiment 2) of the present invention.
FIG. 3 shows a substrate bonding member 10 according to (Embodiment 2) of the present invention, and the substrate bonding member shown in FIG. 10 is different.

FIG. 4 is a cross-sectional view of a three-dimensional connection structure using the substrate bonding member 10 of the present embodiment, and is a cross-sectional view cut along the line AA shown in FIG. 3 with the substrate bonding member 10 as a reference. .
The shield member 52 covers the outer wall 12D of the housing 12 and is also formed on the upper end surface 12B. A metal foil such as a copper foil is used for the shield member 52 and is integrally formed with the housing 12. That is, the shield member 52 has a shape bent from the outer wall 12 </ b> D of the housing 12 so as to integrally cover the upper end surface 12 </ b> B, and is formed integrally with the housing 12. Thereby, the shield member 52 and the housing 12 are integrally joined, and the electromagnetic shielding function can be improved.

  The shield member 52 is electrically connected to the ground lead terminal 55 formed at both ends of the region where the lead terminal 14 is provided on the lower end surface 12A of the housing 12. Two earth lead terminals 55 are provided on the lower end surface 12A of the housing 12, but it is not necessary to electrically connect all the earth lead terminals 55 and the shield member 52. Among the circuit patterns, at least one of the ground connection terminal and the ground lead terminal 55 connected to the shield member 52 is joined by soldering.

  Since it comprised in this way, the electromagnetic shielding function in the area | region part enclosed by 12 C of inner walls of the board | substrate joining member 10 is also acquired by the shielding member 52 provided in 12D of outer walls 12D of the board | substrate joining member 10, and the upper end surface 12B. Since most of the lead terminals 14 are also covered with the shield member 52, the lead terminals 14 also have an electromagnetic shielding function for the lead terminals 14.

  Therefore, if electronic components that are easily affected by external noise are selected and mounted on the inner wall 12C side region of the substrate bonding member 10 on the respective surfaces of the upper module substrate 72a and the lower module substrate 72b, resistance to damage will be increased. A three-dimensional connection structure having excellent noise characteristics can also be realized.

  The shield member 52 of the substrate bonding member 10 is provided with the ground lead terminals 55 at both ends of the region where the lead terminals 14 are provided and connected to the ground lead terminals 55, but the present invention is not limited to this. One of the lead terminals 14 may be a ground lead terminal, and the shield member 52 may be extended to the lower end surface 12A of the housing 12 and connected to the ground lead terminal.

  Although the module substrates 72a and 72b are multilayer wiring substrates, the present invention is not limited to this. That is, both may be double-sided wiring boards, one may be a double-sided wiring board, and the other may be a multilayer wiring board. One module substrate may be a flexible wiring substrate. Furthermore, although the module board formed the circuit pattern on the resin base material, this invention is not limited to the resin base material. For example, a metal substrate on which a hollow substrate or an insulating film is formed may be used.

(Embodiment 3)
5 to 8 show (Embodiment 3) of the present invention.
First, FIG. 5 will be described.

  In FIG. 5, unlike the case of FIG. 1, the board joining member 10A that connects the upper module board 72a and the lower module board 72b to form a three-dimensional connection structure is different from the case of FIG. In a state where the joint portion 17A is also buried in the housing 12, the lead terminal 14 is integrally formed at the time of molding. The tip is further bent so as to be along the outside of the housing 12. Others are the same as FIG.

  The first joint portion 16 is formed by bending the other end of the exposed portion 13 extending in the length direction of the housing from one of the base end portions 15 in a direction intersecting the length direction of the housing.

  17 A of 2nd junction parts are extended from the other side of the base end part 15 in the length direction (arrow J direction) of a housing on the opposite side to the exposed part 13, and are the housings on the opposite side to the 1st junction part 16 It extends to the end face of 12 and is formed by being bent in a direction intersecting with the length direction of the housing while being in contact with the end face of the housing 12.

  Next, in FIG. 6, when the shield part 52 is provided in the configuration of FIG. 5, the shield part 52 is press-fitted into the housing 12. However, the manufacturing method is not limited to this. The shield part 52 can also be formed by being integrally formed in the housing 12.

Further, FIG. 7 is a modification of FIG. 5 and FIG. 8 is a modification of FIG. 6, and shows a case where the exposed portion 13 is closer to the module substrate 72a.
(Embodiment 4)
9 and 10 show (Embodiment 4) of the present invention.

  In the board joining member 10B used in the three-dimensional connection structure shown in FIG. 9, the lead terminal 14 is press-fitted into the housing 12 in which the shield portion 52 is formed by integral molding at the time of molding. The shield electrode 52 may not be provided.

As described above, the lead terminal 14A is press-fitted so that the lead electrode is fixed and the impact in a drop test or the like can be reduced.
In FIG. 10, both the lead electrode 14 </ b> A and the shield portion 52 are press-fitted after the housing 12 is molded. The shield electrode 52 may not be provided.

  In each of the above embodiments, the shape of the housing of the substrate bonding members 10, 10A, 10B is a substantially rectangular frame shape, but the present invention is not limited to this. For example, the lead terminals may be arranged in a ring shape at a predetermined pitch in the ring portion. Alternatively, a pentagonal or rectangular frame shape may be used, or a structure in which lead terminals are arranged in a straight line as a cuboid housing may be used.

In addition, although the lead pattern of the board bonding member and the circuit pattern of the module board are connected by soldering, the present invention can be similarly implemented even when they are connected by a conductive adhesive.
Moreover, although the 1st junction part 16 was closely_contact | adhered and formed in the lower end surface of the housing 12, it does not need to contact | adhere.

  Further, the housing 12 may be provided with a partition wall on the wall surface between the tip portions of the plurality of lead terminals. Alternatively, the housing 12 may be provided with a recess, and the tip may be disposed in the recess. By providing the partition walls or the recesses in this way, even if a large impact force is applied in the arrangement direction of the lead terminals, the tip portion is restricted from being deformed by the partition walls or the recesses. Therefore, a short circuit due to contact between the lead terminals can be prevented.

  Moreover, it is good also as a structure by which the surface of the shield member is covered with the insulating film. Thereby, even if an electronic component or the like contacts the shield member by mistake, the electrical characteristics do not change.

  The shield member may be formed by integrally forming a bent metal thin plate with the housing. Alternatively, the shield member may have a configuration in which a conductive material is coated on the surface of the housing. With such a configuration, the shield member can be easily formed.

  The substrate bonding member and the three-dimensional connection structure using the substrate bonding member of the present invention can connect the substrates on which electronic components are mounted with a fine pitch, and can greatly improve the impact resistance. In addition, a shielding function can be added to the substrate bonding member, and an electronic component that is easily affected by electromagnetic noise can be electromagnetically shielded, which is particularly useful in the field of portable electronic devices such as mobile devices.

Sectional drawing of the three-dimensional connection structure produced using the board | substrate joining member concerning (Embodiment 1) of this invention The perspective view of the board | substrate joining member concerning the embodiment The perspective view of the board | substrate joining member concerning (Embodiment 2) of this invention. Sectional drawing of the three-dimensional connection structure produced using the board | substrate joining member concerning the embodiment Sectional drawing of the three-dimensional connection structure produced using the board | substrate joining member concerning (Embodiment 3) of this invention Sectional drawing of the three-dimensional connection structure produced using the board | substrate joining member of another example of the embodiment Sectional drawing of the three-dimensional connection structure produced using the board | substrate joining member of another example of the embodiment Sectional drawing of the three-dimensional connection structure produced using the board | substrate joining member of another example of the embodiment Sectional drawing of the three-dimensional connection structure produced using the board | substrate joining member concerning (Embodiment 4) of this invention. Sectional drawing of the three-dimensional connection structure produced using the board | substrate joining member of another example of the embodiment Sectional view of a conventional three-dimensional connection structure Plan view and sectional view along the longitudinal direction of another conventional pin connector Sectional drawing of the three-dimensional connection structure using the pin connector shown in FIG.

Explanation of symbols

10, 10A, 10B Substrate bonding member 12 Housing 12A Lower end surface 12B of housing 12 Upper end surface 12C of housing 12 Inner wall 13 of housing 12 Exposed portion 14, 14A Lead electrode 15 Base end portion 16 First joint portion 17 Front end portion 17A First 2 joints 18 Soldering 52 Shield member 55 Ground lead terminals 72a and 72b Module substrate

Claims (6)

A board bonding member that is interposed between the first circuit board and the second circuit board and relays the electrical connection,
An insulating housing;
A plurality of lead terminals connected by the housing;
The lead terminal
A base end portion is embedded in the housing, extends from one of the base end portions to the outside of the housing, is exposed, and the end portion is one circuit of the first circuit board and the second circuit board. A first joint portion to be a joint portion with the substrate;
A second joint that extends from the other of the base ends to the outside of the housing and serves as a joint with the other circuit board;
A substrate bonding member , wherein the housing has a polygonal frame shape and has a shield member on the outer periphery or inner periphery of the housing . The first joint portion of the lead terminal is formed by bending the other end of the exposed portion extending in the length direction of the housing from one of the base end portions in a direction intersecting the length direction of the housing,
The second joint portion of the lead terminal extends from the other of the base end portions to the outside of the side of the housing and does not contact the side surface of the housing on the opposite side of the exposed portion in the length direction of the housing. 2. The board bonding member according to claim 1, wherein the board bonding member is formed by being bent in a direction intersecting with a length direction of the housing without extending in contact with an end face of the housing. The first joint portion of the lead terminal is formed by bending the other end of the exposed portion extending in the length direction of the housing from one of the base end portions in a direction intersecting the length direction of the housing,
The second joint portion of the lead terminal extends from the other end of the base end portion to the opposite side of the exposed portion in the length direction of the housing, and the second joint portion of the housing is opposite to the first joint portion. The board bonding member according to claim 1, wherein the board bonding member is formed by bending in a direction intersecting with a length direction of the housing in a state of extending to an end face and contacting with an end face of the housing. The shield member is formed by integrally forming a bent metal thin plate with the housing, or the shield member is formed by coating the surface of the housing with a conductive material.
The board | substrate joining member of any one of Claims 1-3 . Three-dimensional connection structure electrically connects stacked a first circuit board and the second circuit board by board joint member according to any one of claims 1 to 3. First between the circuit board and the second circuit board of claim 1 to claim 3 of any one electric circuit board by the three-dimensional connection structure connected by interposed substrate bonding member according to Section Is a portable electronic device.

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