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JP4293466B2 - Outline processing method - Google Patents
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JP4293466B2 - Outline processing method - Google Patents

Outline processing method Download PDF

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JP4293466B2
JP4293466B2 JP2006264361A JP2006264361A JP4293466B2 JP 4293466 B2 JP4293466 B2 JP 4293466B2 JP 2006264361 A JP2006264361 A JP 2006264361A JP 2006264361 A JP2006264361 A JP 2006264361A JP 4293466 B2 JP4293466 B2 JP 4293466B2
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peripheral surface
workpiece
outer peripheral
hole
processing
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JP2008080457A (en
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進太郎 高橋
裕 河崎
勝典 時永
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Via Mechanics Ltd
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Hitachi Via Mechanics Ltd
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Priority to JP2006264361A priority Critical patent/JP4293466B2/en
Priority to TW096125364A priority patent/TWI401126B/en
Priority to KR1020070076756A priority patent/KR101400247B1/en
Priority to CN2007101452720A priority patent/CN101152674B/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P13/00—Making metal objects by operations essentially involving machining but not covered by a single other subclass
    • B23P13/02—Making metal objects by operations essentially involving machining but not covered by a single other subclass in which only the machining operations are important
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P17/00—Metal-working operations, not covered by a single other subclass or another group in this subclass
    • B23P17/02—Single metal-working processes; Machines or apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B2270/00—Details of turning, boring or drilling machines, processes or tools not otherwise provided for
    • B23B2270/54—Methods of turning, boring or drilling not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23B—TURNING; BORING
    • B23B41/00—Boring or drilling machines or devices specially adapted for particular work; Accessories specially adapted therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C2270/00—Details of milling machines, milling processes or milling tools not otherwise provided for
    • B23C2270/20—Milling external areas of components

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Milling Processes (AREA)
  • Drilling And Boring (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

本発明は、回転工具を用いてワーク（例えば、プリント基板）の外形を形成する外形加工方法に関する。   The present invention relates to an outer shape processing method for forming an outer shape of a workpiece (for example, a printed circuit board) using a rotary tool.

プリント基板を加工する場合、製品となるプリント基板（以下、「製品基板」という。）が複数含まれる大きいプリント基板（以下、「母基板」という。）の状態で穴明け加工および穴明け後のメッキ加工を行なった後、母基板から製品基板を切り出す（外形加工）ようにしている。このようにすると、穴明け加工工程および穴明け加工後のめっき工程における段取り時間を短縮することができる。   When processing a printed circuit board, drilling is performed in a state of a large printed circuit board (hereinafter referred to as a “mother board”) including a plurality of printed circuit boards (hereinafter referred to as “product substrates”) as products. After plating, the product substrate is cut out from the mother substrate (outer shape processing). If it does in this way, the setup time in the punching process and the plating process after drilling can be shortened.

製品基板の信頼性を向上させるため、穴明け加工時および外形加工時に発生する切粉は工具の周辺に配置された集塵装置により加工部周辺から除去される（特許文献１）。   In order to improve the reliability of the product substrate, chips generated at the time of drilling and outer shape processing are removed from the periphery of the processing portion by a dust collector disposed around the tool (Patent Document 1).

多層プリント基板において絶縁物の上下に配置されたパターン層を電気的に接続する場合、スルーホール（貫通穴）を形成し、めっき処理をすることによりスルーホールの内部にめっき層を形成して電気的に接続する。   When electrically connecting pattern layers placed on top and bottom of an insulator on a multilayer printed circuit board, a through hole is formed and a plating layer is formed inside the through hole by plating to electrically Connect.

図２は、従来の外形加工時における製品基板の平面図であり、図中の矢印Ｔは回転工具の回転方向を、矢印Ｃは切削方向（回転工具の移動方向）を示している。   FIG. 2 is a plan view of a product substrate at the time of conventional outer shape processing, in which the arrow T indicates the rotation direction of the rotary tool, and the arrow C indicates the cutting direction (movement direction of the rotary tool).

母基板３から切り出される製品基板２の外周（外形）には、外周に開口するスルーホール１（図示の場合半円形状）が配置されている。めっき層４が形成されたスルーホール１を外形加工用の回転工具（直径１〜２ｍｍのものが多用されている。以下、「ルータビット５」という。）で切削すると、めっき層４の一部がはがれることが多い（以下、はがれためっき層を「バリ６」という）。バリ６とスルーホール１端部のめっき層４との接続は強固なものではない。したがって、バリ６の多くは加工の際に集塵装置により吸引されるが、一部は加工後もめっき層４に接続されたままになる。バリ６は導電性であるため、バリ６が何らかの原因で製品基板２から離れると、離れたバリ６が製品基板２の端子間を短絡させてしまう場合がある。バリ６は、ルータビット５が基板側からスルーホール１に進入する側（抜ける側）の交差部に発生し、スルーホール１から基板側に進入する側の交差部には発生しない。そこで、従来は、いわゆる反転加工を行っていた。   On the outer periphery (outer shape) of the product substrate 2 cut out from the mother substrate 3, a through hole 1 (in the illustrated case, a semicircular shape) is disposed. When the through-hole 1 in which the plating layer 4 is formed is cut with a rotary tool for outer shape processing (one having a diameter of 1 to 2 mm, which is hereinafter referred to as “router bit 5”), a part of the plating layer 4 is cut. In many cases, the peeled plating layer is referred to as “burr 6”. The connection between the burr 6 and the plating layer 4 at the end of the through hole 1 is not strong. Therefore, most of the burrs 6 are sucked by the dust collector during processing, but some remain connected to the plating layer 4 after processing. Since the burr 6 is conductive, if the burr 6 is separated from the product substrate 2 for some reason, the separated burr 6 may short-circuit between the terminals of the product substrate 2. The burrs 6 are generated at the crossing portion on the side where the router bit 5 enters the through hole 1 from the substrate side (exit side), and are not generated at the crossing portion on the side entering the substrate side from the through hole 1. Therefore, conventionally, so-called reversal processing has been performed.

図３は、反転加工の加工手順を示す図である。   FIG. 3 is a diagram illustrating a processing procedure of reversal processing.

同図（ａ）に示すように、先ず、製品基板２の外形（図中１点鎖線で示す紙面と垂直な面。以下、「仕上げ面Ｓ」という。）に対してオフセットがｇである面（以下、「一次加工面Ｆ」という。）を加工する。なお、一次加工面Ｆを加工する場合は、製品基板２の一部を母基板３に接続させておき、母基板３を表裏反転させる際に製品基板２が母基板３から外れないようにしておく。   As shown in FIG. 2A, first, a surface whose offset is g with respect to the outer shape of the product substrate 2 (a surface perpendicular to the paper surface indicated by a one-dot chain line in the drawing, hereinafter referred to as “finished surface S”). (Hereinafter referred to as “primary processing surface F”). When processing the primary processing surface F, a part of the product substrate 2 is connected to the mother substrate 3 so that the product substrate 2 does not come off the mother substrate 3 when the mother substrate 3 is turned upside down. deep.

次に、同図（ｂ）に示すように、母基板３を表裏反転させ、ルータビット５の移動方向を同じにして仕上げ面Ｓを加工する。一次加工面Ｆが形成された母基板３を表裏反転すると、一次加工で発生したバリ６はルータビット５がスルーホール１から基板側に進入する側に配置されるので、同図（ｃ）に示すように、仕上げ面Ｓを形成する際に製品基板２から除去される。仕上げ加工の場合も、ルータビット５が製品基板２側からスルーホール１に進入側にはバリ６が発生する場合があるが、オフセットｇを小さく（例えば、０．０５ｍｍ）しておけば、発生するバリ６の大きさは微小である。したがって、発生したバリ６が製品基板２から外れたとしても製品基板２の製品としての信頼性を低下させることはほとんどない。   Next, as shown in FIG. 4B, the mother board 3 is turned upside down, and the finished surface S is processed with the same moving direction of the router bit 5. When the mother board 3 on which the primary processing surface F is formed is turned upside down, the burrs 6 generated by the primary processing are arranged on the side where the router bit 5 enters the substrate side from the through hole 1. As shown, when the finished surface S is formed, it is removed from the product substrate 2. Also in the finishing process, the burr 6 may be generated on the entry side of the router bit 5 from the product substrate 2 side to the through hole 1, but if the offset g is made small (for example, 0.05 mm), it is generated. The size of the burr 6 is very small. Therefore, even if the generated burr 6 is detached from the product substrate 2, the reliability of the product substrate 2 as a product is hardly lowered.

なお、ここではルータビット５が右回転（正回転）用である場合について説明したが、ルータビット５が左回転（逆回転）用であっても、バリ６が発生する位置はルータビット５が母基板３からスルーホール１に抜ける側である。   Here, the case where the router bit 5 is for right rotation (forward rotation) has been described. However, even if the router bit 5 is for left rotation (reverse rotation), the position where the burr 6 is generated is determined by the router bit 5. This is the side from the mother board 3 to the through hole 1.

特開平３−１７８７０７号公報JP-A-3-178707

しかし、反転加工を行う場合、加工テーブルから母基板を取り外す工程、母基板を反転させる工程、反転させた母基板を加工テーブル取り付ける工程が必要になるので、段取り時間が長くなる。また、母基板の取り付けミスにより加工不良が発生するおそれがある。   However, when performing reversal processing, a step of removing the mother substrate from the processing table, a step of reversing the mother substrate, and a step of attaching the reversed mother substrate to the processing table are required, so that the setup time becomes long. Moreover, there is a possibility that processing defects may occur due to a mistake in attaching the mother board.

本発明の目的は、製品基板の製品としての信頼性を低下させることなく、加工能率を向上させることができる、外形加工方法を提供するにある。   An object of the present invention is to provide an outer shape processing method capable of improving the processing efficiency without reducing the reliability of a product substrate as a product.

上記課題を解決するため、本発明は（例えば図１参照）、回転工具（５）による切削加工によりワーク（２）の外周面（Ｓ）を形成する外形加工方法において、形成される前記ワークの外周面（Ｓ）に交差する空洞部（１）が存在する場合は、前記回転工具（５）が前記ワークに対して移動して前記ワークの外周面を形成する際における前記空洞部（１）の前記回転工具の移動方向（Ｃ）上流側の交差部（Ｄ）に、前記形成されるワークの外周面（Ｓ）に干渉するように穴明け手段（７）により逃げ穴（８）を加工し、
その後、前記回転工具（５）の刃の回転方向（Ｔ）を前記形成されるワークの外周面（Ｓ）に対して該回転工具の移動方向（Ｃ）に順ずるようにした状態で、該回転工具（５）を前記逃げ穴（８）から前記空洞部（１）に向かって進入するように移動して、前記ワークの外周面を形成することを特徴とする。 In order to solve the above-mentioned problems, the present invention (see, for example, FIG. 1) is an outer shape processing method for forming the outer peripheral surface (S) of the workpiece (2) by cutting with a rotary tool (5). When there is a cavity (1) that intersects the outer circumferential surface (S), the cavity (1) when the rotary tool (5) moves relative to the workpiece to form the outer circumferential surface of the workpiece. The clearance hole (8) is machined by the drilling means (7) at the intersection (D) upstream of the rotating tool in the moving direction (C) so as to interfere with the outer peripheral surface (S) of the work to be formed. And
Thereafter, in a state in which the rotational direction (T) of the blade of the rotary tool (5) follows the moving direction (C) of the rotary tool with respect to the outer peripheral surface (S) of the formed workpiece, The rotary tool (5) is moved so as to enter the cavity (1) from the escape hole (8) to form an outer peripheral surface of the workpiece.

前記回転工具（５）が前記ワーク（２）に対して移動して前記ワークの外周面を形成する際における前記空洞部（１）の交差部（Ｄ，Ｅ）のうち、刃の回転方向（Ｕ）が前記空洞部（１）側からワークの外周面（Ｓ）へ向かう方向になる前記交差部（Ｄ）にのみドリル（７）により逃げ穴（８）を加工する。前記逃げ穴（８）を加工する際の該ドリルの刃の回転方向（Ｕ）が前記回転工具（５）の刃の回転方向（Ｔ）と逆である。
これにより、前記回転工具（５）の刃は、前記空洞部（１）の移動方向上流側（Ｄ）では該空洞部と前記逃げ穴（８）との交差部に当たることなく移動すると共に、前記空洞部（１）の移動方向下流側（Ｅ）では該空洞部から前記外周面に向う方向に回転しつつ移動する。 Of the intersecting portions (D, E) of the cavity (1) when the rotary tool (5) moves relative to the workpiece (2) to form the outer peripheral surface of the workpiece, the rotational direction of the blade ( A relief hole (8) is machined by a drill (7) only in the intersection (D) where U) is directed from the cavity (1) side toward the outer peripheral surface (S) of the workpiece. The rotation direction (U) of the blade of the drill when machining the relief hole (8) is opposite to the rotation direction (T) of the blade of the rotary tool (5).
As a result, the blade of the rotary tool (5) moves on the upstream side (D) in the movement direction of the cavity (1) without hitting the intersection of the cavity and the escape hole (8), and On the downstream side (E) in the movement direction of the hollow portion (1), the hollow portion (1) moves while rotating in the direction from the hollow portion toward the outer peripheral surface.

なお、括弧内の符号等は、図面と対照するためのものであるが、これにより特許請求の範囲に何等影響を及ぼすものではない。   In addition, although the code | symbol etc. in a parenthesis is for contrast with drawing, it does not have any influence on a claim by this.

本発明によると、製品基板の製品としての信頼性を低下させることなく、加工能率を向上させることができる。   According to the present invention, the processing efficiency can be improved without reducing the reliability of the product substrate as a product.

以下、本発明について具体的に説明する。   Hereinafter, the present invention will be specifically described.

図１は、本発明の加工手順を示す説明図であり、（ａ）はドリルによる穴明け工程を、（ｂ）は外形加工工程を、それぞれ示している。   FIG. 1 is an explanatory view showing a processing procedure according to the present invention, wherein (a) shows a drilling step and (b) shows an outer shape processing step.

母基板３には、スルーホール１が加工されており、このスルーホール１の内周面にはめっき層４が形成されている。ドリルおよびルータビット５を回転させるプリント基板加工機のスピンドルは、正転および逆転が可能である。   A through hole 1 is processed in the mother board 3, and a plating layer 4 is formed on the inner peripheral surface of the through hole 1. The spindle of the printed circuit board processing machine that rotates the drill and the router bit 5 can be rotated forward and backward.

一般に、ドリルは右回転用のものが多いので、ここでは右回転用のドリル７と、左回転用のルータビット５が準備されている。なお、ルータビット５の場合、右回転用および左回転用のいずれもが容易に入手可能である。   Generally, since many drills are for right rotation, a drill 7 for right rotation and a router bit 5 for left rotation are prepared here. In the case of the router bit 5, both right rotation and left rotation are easily available.

工程１．ドリル７により逃げ穴８を加工する。
ドリル７が右回転用であるので、同図（ａ）に示すように、逃げ穴８が仕上げ面Ｓとスルーホール１の交差部Ｄに干渉するようにドリル７の軸線を位置決めし、母基板３に逃げ穴８を加工する。ドリル７は交差部Ｄ近傍においてスルーホール１側から母基板３に向けて切り込むのでバリ６は発生しない。なお、スルーホール１の直径が例えば０．８ｍｍである場合、ドリルの直径を０．８ｍｍ、逃げ穴８が仕上げ面Ｓに干渉する距離ｋを０．０２５ｍｍ程度とすればよい。すなわち、仕上げ面ＳをＸ方向、仕上げ面Ｓに垂直な方向をＹ方向とし、交差部Ｄ（ここでは、めっき４の厚さは無視する）を原点とすると、例えば、ドリル７の軸線Ｏを、（０，０．３７５）に定める。なお、この場合、ドリル７の軸線ＯのＸ座標は、−０．１〜０．１（好ましくは−０．０５〜０．０５）にしても実用上差し支えない。 Step 1. The clearance hole 8 is processed by the drill 7.
Since the drill 7 is for right rotation, the axis of the drill 7 is positioned so that the clearance hole 8 interferes with the intersection D of the finished surface S and the through hole 1 as shown in FIG. The clearance hole 8 is machined into 3. Since the drill 7 is cut from the through hole 1 side toward the mother board 3 in the vicinity of the intersection D, no burrs 6 are generated. If the diameter of the through hole 1 is, for example, 0.8 mm, the diameter of the drill may be 0.8 mm, and the distance k at which the escape hole 8 interferes with the finished surface S may be about 0.025 mm. That is, assuming that the finished surface S is the X direction, the direction perpendicular to the finished surface S is the Y direction, and the intersection D (where the thickness of the plating 4 is ignored) is the origin, for example, the axis O of the drill 7 is , (0, 0.375). In this case, the X coordinate of the axis O of the drill 7 may be practically set to −0.1 to 0.1 (preferably −0.05 to 0.05).

工程２．ルータビット５により仕上げ面Ｓ（外形）を加工する。
ルータビット５の回転方向Ｔを形成されるワーク２の仕上げ面Ｓに対して該ルータビット５の移動方向Ｃに順ずるように設定して、逃げ穴８が加工された交差部Ｄにおいてルータビット５がスルーホール１に進入するようにして加工する。すなわち、同図（ｂ）に示すように、左回転のルータビット５を右方向に移動させて仕上げ面Ｓを加工する。ルータビット５がスルーホール１に進入する際、この部分のめっき層４はすでに除去されているので、交差部Ｄにバリ６が発生することはない。また、交差部Ｅ近傍ではルータビット５の刃がスルーホール１側から母基板３に進入するので、バリ６は発生しない。 Step 2. The finished surface S (outer shape) is processed by the router bit 5.
The router bit 5 is set so as to follow the moving direction C of the router bit 5 with respect to the finished surface S of the work 2 on which the rotation direction T of the router bit 5 is formed. Processing is performed so that 5 enters the through hole 1. That is, as shown in FIG. 5B, the finished surface S is machined by moving the router bit 5 that rotates counterclockwise to the right. When the router bit 5 enters the through hole 1, since the plating layer 4 in this portion has already been removed, no burr 6 occurs at the intersection D. Further, in the vicinity of the intersection E, the blade of the router bit 5 enters the mother board 3 from the through hole 1 side, so that no burrs 6 are generated.

なお、この実施例では深さ方向にｋ＝０．０２５ｍｍ削除するようにしたが、この寸法についても、実用上問題のない範囲で大きくあるいは小さくすることができる。   In this embodiment, k = 0.025 mm is deleted in the depth direction, but this dimension can also be increased or decreased within a range that does not cause a practical problem.

また、ドリル７の直径あるいはルータビット５の直径も実用上問題のない範囲で変更することができる。   Further, the diameter of the drill 7 or the diameter of the router bit 5 can be changed within a range that does not cause a problem in practice.

また、左回転用のドリル７を使用する場合には、逃げ穴８を図１（ａ）における交差部Ｅ側に加工し、ルータビット５を右回転用とすると共に、ルータビット５の移動方向を右から左方向にすればよい。   When the counterclockwise drill 7 is used, the clearance hole 8 is machined on the intersection E side in FIG. 1A so that the router bit 5 is for right rotation and the moving direction of the router bit 5 is From right to left.

以上説明したように、本発明によれば、母基板３を反転する必要がないので、加工能率を向上させることができる。しかも、従来の反転加工と異なり、バリ６が全く発生しないので、製品基板２の信頼性をさらに向上させることができる。   As described above, according to the present invention, since it is not necessary to invert the mother board 3, the processing efficiency can be improved. In addition, unlike the conventional reversal processing, no burrs 6 are generated, so that the reliability of the product substrate 2 can be further improved.

本発明者は、母基板３が板厚０．５ｍｍのガラスエポキシ樹脂基板である場合、従来は重ね枚数として２枚が限度であったのに対し、本発明の場合は重ね枚数を４〜５枚としてもバリ６が発生せず、加工能率を大幅に向上できることを確認した。   When the mother substrate 3 is a glass epoxy resin substrate having a thickness of 0.5 mm, the present inventor has conventionally limited the number of stacked sheets to two, whereas in the present invention, the number of stacked sheets is 4-5. It was confirmed that the burr 6 was not generated as a sheet, and the machining efficiency could be greatly improved.

本発明の加工手順を示す説明図である。It is explanatory drawing which shows the process sequence of this invention. 従来の外形加工時における製品基板の平面図である。It is a top view of the product board | substrate at the time of the conventional external shape process. 従来の反転加工の加工手順を示す図である。It is a figure which shows the process sequence of the conventional inversion process.

符号の説明Explanation of symbols

１ スルーホール（空洞部）
５ ルータビット（回転工具）
７ ドリル（穴明け手段）
８ 逃げ穴
Ｄ 交差部
Ｓ 仕上げ面（外周面） 1 Through hole (cavity)
5 Router bit (rotary tool)
7 Drill (drilling means)
8 Relief hole D Intersection S Finished surface (outer peripheral surface)

Claims (1)

回転工具による切削加工によりワークの外周面を形成する外形加工方法において、
内周面にメッキが施されている空洞部が、前記ワークの外周面に交差するように存在する場合、
前記回転工具が前記ワークに対して移動して前記ワークの外周面を形成する際における前記空洞部の交差部のうち、刃の回転方向が前記空洞部側からワークの外周面へ向かう方向になる前記交差部にのみドリルにより逃げ穴を加工し、
その後、刃の回転方向が前記ドリルの刃の回転方向と逆である前記回転工具を、前記逃げ穴を加工した前記交差部が上流側になるように移動して、
前記回転工具の刃が、前記空洞部の移動方向上流側では該空洞部と前記逃げ穴との交差部に当たることなく前記逃げ穴から前記空洞部に向かって進入し、かつ前記空洞部の移動方向下流側では該空洞部から前記外周面に向う方向に回転しつつ移動して、前記ワークの外周面を形成する、
ことを特徴とする外形加工方法。 In the outer shape processing method for forming the outer peripheral surface of the workpiece by cutting with a rotary tool,
When a hollow portion plated on the inner peripheral surface exists so as to intersect the outer peripheral surface of the workpiece ,
Of the intersecting portions of the hollow portion when the rotary tool moves relative to the workpiece to form the outer peripheral surface of the workpiece , the rotation direction of the blade is the direction from the hollow portion side toward the outer peripheral surface of the workpiece. Processing a relief hole with a drill only at the intersection,
Then, the rotational tool whose rotational direction is opposite to the rotational direction of the blade of the drill is moved so that the intersection where the clearance hole is processed is on the upstream side,
The blade of the rotary tool enters the cavity part from the relief hole without hitting the intersection of the cavity part and the relief hole on the upstream side in the movement direction of the cavity part, and the movement direction of the cavity part On the downstream side, the outer peripheral surface of the workpiece is formed by moving while rotating in a direction from the hollow portion toward the outer peripheral surface.
An outline processing method characterized by the above.
JP2006264361A 2006-09-28 2006-09-28 Outline processing method Expired - Fee Related JP4293466B2 (en)

Priority Applications (4)

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JP2006264361A JP4293466B2 (en) 2006-09-28 2006-09-28 Outline processing method
TW096125364A TWI401126B (en) 2006-09-28 2007-07-12 Shape processing method
KR1020070076756A KR101400247B1 (en) 2006-09-28 2007-07-31 Profile machining method
CN2007101452720A CN101152674B (en) 2006-09-28 2007-08-17 Shape processing method

Applications Claiming Priority (1)

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JP2006264361A JP4293466B2 (en) 2006-09-28 2006-09-28 Outline processing method

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CN107175360B (en) * 2016-03-10 2019-07-26 无锡深南电路有限公司 Milling machine and milling machine spindle operation control system
CN111432559A (en) * 2020-03-20 2020-07-17 江苏苏杭电子有限公司 Method for processing semicircular copper sinking hole
CN111451716B (en) * 2020-03-30 2021-07-27 海宁弘德机械有限公司 Rough machining process of crossed arc holes
CN112512219A (en) * 2020-11-25 2021-03-16 益阳市明正宏电子有限公司 Copper-containing half groove machining method for PCB
CN116329881A (en) * 2022-12-30 2023-06-27 福莱盈电子股份有限公司 Semi-groove product fishing processing method
CN118695478A (en) * 2024-06-25 2024-09-24 福建福强精密印制线路板有限公司 One-step forming process for half-side hole of printed circuit board

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CN101152674B (en) 2011-10-05
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KR101400247B1 (en) 2014-05-26
TWI401126B (en) 2013-07-11

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