JP4294151B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention sequentially supplies electronic parts such as IC from the electronic component feeding device, which is sucked and held by the component suction unit, related to that electronic component mounting method mounting a specified position of the circuit board.
[0002]
[Prior art]
For example, as shown in FIG. 6, the conventional electronic component mounting machine 20 </ b> A includes a substrate transport device 24 that transports and stops the substrates 22 </ b> A and 22 </ b> B in one direction (X direction), and a transport line direction of the substrate transport device 24. 4 electronic component supply devices 26E to 26H which are arranged along the lines and sequentially supply the electronic components, and two heads each receiving the electronic components from the electronic component supply devices 26E to 26H and mounting them on the substrate 22 Portions 28E and 28F, and an X-axis portion 31 that slidably supports the head portions 28E and 28F in the X direction parallel to the transport direction of the substrate 22, and the X-axis portion 31 is orthogonal to the Y-axis. And an XY robot 32 that is driven in the direction.
[0003]
As shown in the enlarged view of FIG. 7, each of the head portions 28E and 28F includes three component suction units 34 (of which two are not shown) and one camera 36 by a mechanical interface member 8. It is a supported structure. The head portions 28E and 28F are supported by the X-direction guide 30 via the mechanical interface member 8, respectively.
[0004]
The component suction unit 34 includes a structural member 9 fixed to the surface of the mechanical interface member 8, a bracket 11 supported on the structural member 9 by a straight guide 10 in the vertical direction, and the structural member. A motor 13 that is attached to a rib provided at the upper end of 9 and drives the bracket 11 up and down via a ball screw / nut 12 and a vertical shaft 14 that is rotatably supported by the bracket 11. A suction nozzle 15 supported at the lower end of the shaft 14, and a motor 16 attached to the bracket 11 for positioning the suction nozzle 15 in the rotational direction by rotating the shaft 14 about its axis. , For detecting the position of the electronic component 17 attached to the lower end side of the structural member 9 and sucked by the suction nozzle 15 (6 not shown) near detector 18 and a like.
[0005]
Similarly, the camera 36 is also attached to the mechanical interface member 8 so as to confirm the mark recognition on the circuit board, the position when the electronic component 17 is sucked, and the position of the electronic component 17 mounted on the circuit board. Has been.
[0006]
The substrate transfer device 24 shown in FIG. 6 has a substrate carry-in area 24A, a second positioning area 24B, a first positioning area 24C, and a substrate carry-out area 24D sequentially in the substrate transfer direction. A conveyor capable of transporting and stopping the substrate 22 is provided.
[0007]
The first and second positioning regions 24C and 24B have a structure in which the substrates 22A and 22B are brought into and stopped and the substrates 22A and 22B are put on standby in a state where electronic components can be mounted from the two head portions 28E and 28F. .
[0008]
Reference numerals 44A and 44B in FIG. 6 denote motors for independently driving the head portions 28E and 28F along the X-direction guides 30 via the belts 46A and 46B, respectively.
[0009]
Both ends of the X-axis portion 31 in the axial direction are supported on the Y-axis portion 48 of the XY robot 32 so as to be slidable in the Y-direction together with the motors 44A and 44B, and are movable in the Y-direction by a motor (not shown). ing.
[0010]
Next, a process of mounting electronic components on the boards 22A and 22B by the electronic component mounting machine 20 will be described with reference to FIG.
[0011]
First, the substrates 22A and 22B are inserted from the substrate carry-in area 24A by the substrate transfer device 24.
[0012]
Next, positioning of the preceding substrate 22A is stopped in the first positioning region 24C, and positioning of the subsequent substrate 22B is stopped in the second positioning region 24B.
[0013]
Thereafter, the head portions 28E and 28F are moved onto the pick positions of the two electronic component supply devices 26E and 26G by the XY robot 32, and the electronic components are sucked and held by the respective component suction units 34. The component supply devices 26E and 26G are arranged so that the positions in the Y direction are the same, and the electronic components supplied by each of the component supply devices 26E and 26G can be simultaneously attracted by the head portions 28E and 28F. .
[0014]
The head portions 28E and 28F holding the electronic components are respectively moved to desired electronic component mounting positions by the XY robot 32, and thereafter the electronic components are simultaneously mounted on the boards 22A and 22B by the component suction unit 34.
[0015]
Different types of electronic components are sequentially supplied to the electronic component supply devices 26F and 26H. Therefore, the head portions 28E and 28F again mount different types of electronic components on the substrates 22A and 22B in the same manner as in the above process.
[0016]
[Problems to be solved by the invention]
As described above, when different types of electronic components are mounted, the head portions 28E and 28F must go through the same process twice, increasing the electronic component mounting cycle time and improving the productivity. . This is the same even when many electronic components of the same type are mounted.
[0017]
In such a case, if two head portions are further provided in the X-axis portion 31, and a total of four head portions simultaneously hold the electronic components supplied by the electronic component supply devices 26E to 26H and mount them on the substrate, Theoretically, the mounting cycle time of electronic parts is reduced and productivity is improved.
[0018]
However, simply increasing the number of heads in series does not improve productivity in proportion to the increased number, and at the same time, due to the difficulty of attracting and mounting a large number of electronic components, Rather, there is a problem that the degree of improvement in productivity is reduced.
[0019]
Furthermore, when a plurality of head portions are arranged in series, there is a problem that the distance in the transport line direction (X direction) of the electronic component mounting machine becomes long and the exclusive area of the entire apparatus is enlarged.
[0020]
On the other hand, there is a method for increasing the moving speed of the XY robot, but this has technical and mechanical limitations and is not a fundamental solution.
[0021]
The invention shall apply it has been made in consideration of the above conventional problems, and an object thereof is to provide a can der Ru electronic component mounting method to mount electronic components at high speed.
[0022]
[Means for Solving the Problems]
According to the present invention, as in claim 1, there is provided a substrate transport apparatus that has a carry-in area, at least one positioning area, and a carry-out area in the transport line direction, and transports and stops the board in this order, and a transport line in the positioning area At least one front-side electronic component supply device that is arranged on the front side that is one of the outer sides in the width direction and sequentially supplies electronic components, and at least one rear-side electronic component supply device that is arranged on the rear side that is the other An XY robot having an X-axis portion arranged in the X direction parallel to the transport line direction, and a Y-axis portion that supports the X-axis portion so as to be movable in the Y-direction orthogonal to the X-direction, and the X-axis portion At least one front-side head each having a component suction unit that is positioned on the front side and rear side of the X-axis and is supported by the X-axis portion so as to be movable in the X direction. A rear-side head portion, an electronic component mounting method according to the electronic component mounting apparatus comprising a,
An electronic component in which the X-axis portion is positioned in the Y direction, the substrate is stopped in the positioning region, positioned in the X direction, and the front-side head portion is sucked and held from the front-side component supply device Is positioned in the X direction with respect to the pick position of the rear-side component supply device, and the electronic component is mounted on the substrate by the front-side head portion. The electronic component in which the X-axis part is moved in the Y direction so that the rear-side head part reaches the pick position of the rear-side part supply device, and the rear-side head part is sucked and held from the rear-side part supply device The front side head unit is positioned in the X direction with respect to the pick position of the front side component supply device while the electronic unit is mounted by the rear side head unit. After but mounted on the substrate, by moving the X axis unit in the Y direction, the electronic component mounting method characterized in that to reach the front side head portion to the pick position of the front-side component supply device, the It achieves its purpose.
[0023]
According to a second aspect of the present invention, there is provided a substrate transfer device that has a carry-in area, a plurality of positioning areas, and a carry-out area in the transfer line direction, and transfers and stops the substrates in this order, and transfer in each of the positioning areas. A plurality of front side electronic component supply devices that are arranged on the front side that is one of the outer sides in the line width direction and sequentially supply electronic components, and a plurality of rear side electronic component supply devices that are arranged on the rear side that is the other, An XY robot including an X-axis portion arranged in the X direction parallel to the transport line direction, and a Y-axis portion that supports the X-axis portion so as to be movable in the Y-direction orthogonal to the X-direction; A plurality of front-side head units and rear-side head units, each of which is located on the front side and the rear side, and is supported by the X-axis portion so as to be movable in the X direction, and includes a component suction unit for sucking and mounting electronic components on a substrate. made have and, the An electronic component mounting method according to the child component mounting machine,
An electronic component in which the X-axis portion is positioned in the Y direction, the substrate is stopped in the positioning region, positioned in the X direction, and the front-side head portion is sucked and held from the front-side component supply device Is positioned in the X direction with respect to the pick position of the rear-side component supply device, and the electronic component is mounted on the substrate by the front-side head portion. The electronic component in which the X-axis part is moved in the Y direction so that the rear-side head part reaches the pick position of the rear-side part supply device, and the rear-side head part is sucked and held from the rear-side part supply device The front-side head portion is positioned in the X direction with respect to the pick position of the front-side component supply device while the electronic component is mounted on the rear-side head portion. After being mounted on the substrate, by moving the X axis unit in the Y direction, the electronic component mounting method characterized in that to reach the front side head portion to the pick position of the front-side component supply device, the object Is achieved.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described in detail below with reference to the drawings.
[0026]
As shown in FIG. 1, an electronic component mounting machine 20 according to an example of an embodiment of the present invention transports and stops substrates 22A and 22B in one direction (X direction), and the substrate transport device. A front-side electronic component supply device that is arranged on the front side (the front side in the electronic component mounting machine 20 shown in FIG. 1) that is one of both outer sides in the conveyance line width direction (Y direction) of the device 24 and sequentially supplies the electronic components 60. 26A, 26B, rear-side electronic component supply devices 26C, 26D arranged on the other rear side, an X-axis part 31 arranged in parallel with the substrate transport direction (X direction), and the X-axis part 31 An XY robot 32 having a Y-axis part 48 that supports the X-axis part movably in the Y-direction, and is positioned on the front side and the rear side of the X-axis part 31 and is supported by the X-axis part 31 so as to be movable in the X-direction. The electronic component supply devices 26A to 26D Receive Luo electronic component 60 is configured to have a front-side head portion 28A having a suction unit 34 to be mounted to a predetermined position of the substrate, 28B · rear side head portion 28C, and 28D, a.
[0027]
As shown in FIG. 1, the front-side electronic component supply devices 26A and 26B are arranged so that the Y-direction positions of the electronic component pickup positions are the same, and the rear-side electronic component supply devices 26C and 26D are arranged. The same is said.
[0028]
Each of the front-side head portions 28A and 28B and the rear-side head portions 28C and 28D includes three component suction units 34 and one camera 36. These structures are the same as those shown in FIG. Therefore, the description is omitted.
[0029]
The front-side head portions 28A and 28B are supported by the X-axis portion 31 via the X-direction rail 30 so as to be movable in the X-direction, and the motors 44A provided on the front side of both ends in the X-axis portion 31 axial direction. 44B enables independent movement via belts 46A and 46B.
[0030]
Similarly, the rear surface side head portions 28C and 28D are supported by the X axis portion 31 via the X direction rail 30 so as to be movable in the X direction, and are provided on the rear surface sides at both ends in the X axis portion 31 axial direction. The motors 44C and 44D can be moved independently via the belts 46C and 46D.
[0031]
Therefore, the side head portions 28A and 28B and the rear side head portions 28C and 28D are movable in the X direction independently of each other.
[0032]
As shown in an enlarged view in FIG. 2, the substrate transfer device 24 sequentially includes a substrate carry-in area 24A, a second positioning area 24B, a first positioning area 24C, and a substrate carry-out area 24D in the substrate transfer direction (X direction). have. Each region is provided with conveyors 25A to 25D that can transport and stop the substrate 22 independently.
[0033]
As shown in FIG. 3, in the substrate transport device 24, the first positioning region 24C is made independent by a U-shaped frame 38, and the frame 38 is arranged in the Y direction. It is also possible to use a structure that is supported by the rectilinear guide 40 so as to be horizontally movable in the Y direction. The first positioning region 24C can be moved and stopped in the Y direction by a Y motor 42 via a ball screw 42A. Further, the second positioning region may have the same structure. 2 and 3, illustration of the rear surface side electronic component supply devices 26C and 26D is omitted for convenience of explanation.
[0034]
Next, the process of mounting electronic components on the boards 22A and 22B by the electronic component mounting machine 20 will be described in detail with reference to FIG. Each of FIGS. 4A to 4C is a plan view of the electronic component mounting machine 20 conceptually shown with each part omitted for easy understanding of the process.
[0035]
First, as shown in FIG. 4A, the substrates 22A and 22B are positioned at predetermined positions by the substrate transfer device 24 (not shown). The front-side head portions 28A and 28B are moved to predetermined pick positions on the front-side electronic component supply devices 26A and 26B by an XY robot 32 (a part of the Y-axis portion and the X-axis portion are not shown). The component 100 is sucked and held.
[0036]
Next, as shown in FIG. 4B, the front-side head portions 28A and 28B are moved and positioned to predetermined electronic component mounting positions on the boards 22A and 22B by the XY robot 32, and the electronic component 100 is moved. Are mounted on the substrates 22A and 22B.
[0037]
4A to 4B, the rear-side head portions 28C and 28D are independently moved in the X direction on the X-axis portion by the XY robot 32, and the rear-side electrons Positioning in the X direction with respect to a predetermined pick position of the component supply devices 26C and 26D is performed.
[0038]
Therefore, as shown in FIG. 4C, after the mounting of the electronic component 100 is completed, the rear-side head portions 28C and 28D are only moved in the Y direction by the XY robot 32, and the predetermined picking is performed. The position is reached and the electronic component 200 is held by suction.
[0039]
Next, as shown in FIG. 4D, the rear-side head portions 28C and 28D are moved and positioned to predetermined electronic component mounting positions on the substrates 22A and 22B by the XY robot 32, and the electronic components 200 is mounted on the substrates 22A and 22B.
[0040]
4C to 4D, the front-side head portions 28A and 28B are independently moved in the X direction on the X-axis portion by the XY robot 32, and the front-side electrons Positioning in the X direction with respect to a predetermined pick position of the component supply devices 26A and 26B is performed.
[0041]
Therefore, as shown in FIG. 4A, after the electronic component 200 is completely mounted, the front-side head portions 28A and 28B are moved in the Y direction by the XY robot 32, so that the predetermined pick is performed. The electronic component 200 can be sucked and held by reaching the position. The substrates 22A and 22B on which the electronic components 100 and 200 are mounted are carried out by the substrate transfer device 24, and then new substrates 22A and 22B are loaded, and the above steps are repeated again.
[0042]
According to the above process using the electronic component mounting machine 20, the positioning of the head portion in the X direction with respect to the pick position of the component supply device is completed at an early stage, and the Y direction naturally approaches the pick position. Since the amount of movement is reduced, the cycle time for mounting a plurality of electronic components is reduced, and the productivity can be improved. Since the electronic components are supplied from both the front side and the rear side, the exclusive distance in the conveyance line direction of the electronic component mounting machine 20 can be shortened, and the electronic component mounting machine 20 can be made compact and eventually the electronic component mounting line. Can be shortened.
[0043]
Further, compared to the case where a large number of head portions are provided on one surface of the X-axis portion, there is no interference with the movement in the X direction between the front-side head portion and the rear-side head portion. This makes it possible to enrich variations when several types of parts are supplied and mounted by a plurality of parts supply devices.
[0044]
In addition, in the electronic component mounting process of the electronic component mounting machine 20, as shown in FIG. 5C, the pick position of the front side electronic component supply devices 26A and 26B and the rear surface side electronic component supply devices 26C and 26D from the rear surface. Y-direction distance 50 from the electronic component mounting position P supplied by the side head portions 28C, 28D, the pick position of the rear side electronic component supply devices 26C, 26D and the front side head from the front side electronic component supply devices 26A, 26B. The Y-direction distance 52 between the electronic component mounting positions Q supplied by the portions 28A and 28B and the Y-direction distance 54 between the suction pads of the front-side head portions 28A and 28B and the rear-side head portions 28C and 28D are the same. It is desirable to make it. In this way, as shown in FIGS. 5A to 5C, while one of the heads is mounted with the electronic component, the other head moves over the pick position of the electronic component supply device. By being positioned in the X direction and the Y direction, the electronic components can be sucked, and the productivity can be further improved.
[0045]
The component mounting machine 20 shown in FIG. 5 is the same as that shown in FIG.
[0046]
The Y-direction distances 50, 52, and 54 are preferably set so as to coincide with each other from the beginning. However, the electronic component supply devices 26A to 26D may be moved and positioned in the Y direction at any time, as shown in FIG. It is also possible to match the Y-direction distances 50, 52, and 54 by moving and positioning the substrate in the Y direction at any time using the substrate transfer device 24 shown in FIG.
[0047]
In this way, it can be said that the distances 50, 52, and 54 can be made to coincide with each other by considering and adjusting the suction position error when the electronic component is picked up.
[0048]
In the example of the above embodiment, two front head parts and two rear head parts are shown, but the electronic component mounting machine according to the present invention is limited to this. It is sufficient that at least one of them is not provided. Further, the numbers of the front side head part and the rear side head part may be different.
[0049]
In the example of the above embodiment, the two front head portions 28A and 28B (or the rear head portions 28C and 28D) can move along the X-axis portion 31 independently of each other. However, the electronic component mounting according to the present invention is not limited to this, and a plurality of front head portions may be integrally movable. Furthermore, the number of component suction units provided in the head portion is not limited to three, and it is sufficient that there is at least one.
[0050]
In the example of the above embodiment, two front side electronic component supply devices and two rear side electronic component supply devices are provided. However, the electronic component mounting machine according to the present invention is limited to this. There may be three or more of each, or at least one. The quantity on the front side and the rear side may be different.
[0051]
Furthermore, in the example of the above embodiment, the case where the front side head unit and the rear side head unit sequentially carry electronic components on one substrate and then carry out the substrate is shown, but the present invention is not limited thereto. It is assumed that any substrate transporting process such as sequentially unloading the substrate every time one of the front-side head portion and the rear-side head portion mounts the electronic component on the substrate is included.
[0052]
【The invention's effect】
Since this invention is comprised as mentioned above, it has the outstanding effect that a some electronic component can be mounted at high speed.
[Brief description of the drawings]
FIG. 1 is a perspective view showing an electronic component mounting machine according to an example of an embodiment of the present invention. FIG. 2 is an enlarged perspective view showing a board transfer device in the electronic component mounting machine. FIG. 4 is an enlarged perspective view showing another example of the substrate transfer device in the machine. FIG. 4 is a schematic plan view of the electronic component mounting machine sequentially illustrating the electronic component mounting process by the electronic component mounting machine. Fig. 6 is a schematic plan view of an electronic component mounting machine, sequentially illustrating other examples of the electronic component mounting process by the mounting machine. Fig. 6 is a perspective view of the conventional electronic component mounting machine. The perspective view which expands and shows a head part [Explanation of numerals]
DESCRIPTION OF SYMBOLS 20 ... Electronic component mounting machine 22A, 22B ... Board | substrate 24 ... Board | substrate conveyance apparatus 24A ... Carry-in area | region 24B ... 2nd positioning area | region 24C ... 1st positioning area | region 24D ... Board | substrate carrying-out area | region 26A, 26B ... Front side electronic component supply apparatus 26C, 26D ... rear side electronic component supply devices 28A and 28B ... front side head parts 28C and 28D ... rear side head part 31 ... X axis part 32 ... XY robot 48 ... Y axis parts 60, 100, 200 ... electronic parts

Claims (2)

A substrate transport apparatus having a carry-in area, at least one positioning area, and a carry-out area in the transport line direction, and transporting and stopping the substrate in this order, and a front side that is one of the outer sides in the transport line width direction in the positioning area At least one front-side electronic component supply device that is arranged and sequentially supplies electronic components, and at least one rear-side electronic component supply device that is arranged on the other rear surface side, and is arranged in the X direction parallel to the conveyance line direction. An XY robot having an X-axis part and a Y-axis part that movably supports the X-axis part in a Y-direction orthogonal to the X-direction, and located on the front side and the rear side of the X-axis part, X-direction movement is rotatably supported by the X-axis section, with a component suction unit for mounting the electronic components to the adsorption and the substrate, and each have at least one front-side head portion and rear side head portion, a That there is provided an electronic component mounting method according to the electronic component mounting machine,
An electronic component in which the X-axis portion is positioned in the Y direction, the substrate is stopped in the positioning region, positioned in the X direction, and the front-side head portion is sucked and held from the front-side component supply device Is positioned in the X direction with respect to the pick position of the rear-side component supply device, and the electronic component is mounted on the substrate by the front-side head portion. The electronic component in which the X-axis part is moved in the Y direction so that the rear-side head part reaches the pick position of the rear-side part supply device, and the rear-side head part is sucked and held from the rear-side part supply device The front side head unit is positioned in the X direction with respect to the pick position of the front side component supply device while the electronic unit is mounted by the rear side head unit. After but mounted on the substrate, by moving the X axis unit in the Y direction, the electronic component mounting method characterized in that to reach the front side head portion to the pick position of the front-side component supply unit. A substrate transport apparatus that has a carry-in area, a plurality of positioning areas, and a carry-out area in the transport line direction, and transports and stops the substrate in that order, and the front side that is one of the outer sides in the transport line width direction in each of the positioning areas A plurality of front-side electronic component supply devices that sequentially supply electronic components, a plurality of rear-side electronic component supply devices that are arranged on the other rear surface side, and an X direction parallel to the transport line direction. An XY robot having an X-axis part and a Y-axis part that movably supports the X-axis part in a Y-direction orthogonal to the X-direction; and the X-axis part located on the front side and the rear side of the X-axis part, is supported freely X-direction moving shaft portion, provided with a component suction unit for mounting the electronic components to the adsorption and the substrate, an electronic component mounting machine comprising each have a plurality of front-side head portion and rear side head portion, a By electronic components There is provided a method,
An electronic component in which the X-axis portion is positioned in the Y direction, the substrate is stopped in the positioning region, positioned in the X direction, and the front-side head portion is sucked and held from the front-side component supply device Is positioned in the X direction with respect to the pick position of the rear-side component supply device, and the electronic component is mounted on the substrate by the front-side head portion. The electronic component in which the X-axis part is moved in the Y direction so that the rear-side head part reaches the pick position of the rear-side part supply device, and the rear-side head part is sucked and held from the rear-side part supply device The front side head unit is positioned in the X direction with respect to the pick position of the front side component supply device while the electronic unit is mounted by the rear side head unit. After but mounted on the substrate, by moving the X axis unit in the Y direction, the electronic component mounting method characterized in that to reach the front side head portion to the pick position of the front-side component supply unit.

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