JP4297319B2 - Adhesive tape - Google Patents

Description

【００２３】
共重合体Ｂの合成
共重合体Ｂは、ブチルアクリレート、２−ヒドロキシエチルアクリレート、グリシジルメタクリレートを原料として、下記表２の配合比で重合を行い共重合体を得た。
この重合体に２−イソシアネートエチルメタクリレートを下記表２の配合比で付加反応させ、共重合体Ｂを得た。なお、Ｂ７は参考例である。
【００２４】
【表２】

【００２５】
粘接着テープの作成
共重合体Ａ及び共重合体Ｂの合成により得られた共重合体Ａ、Ｂと、硬化剤としてポリイソシアネート化合物（日本ポリウレタン社製、商品名コロネートＬ）、光開始剤としてα-ヒドロキシシクロヘキシルフェニルケトンを下記表Ｃの配合比で混合し、粘接着剤を得た。
各々乾燥後の粘接着剤厚さを３０μｍとし、高密度ポリエチレン樹脂フィルム（１００μm）に塗工し、粘着テープを作成した。
これにより共重合体ＡとＢとは加熱乾燥工程で共重合体Ａ、及びＢの有するヒドロキシル基と硬化剤のイソシアネート基官能基の反応により硬化反応を生じる他、共重合体Ａ及びＢの含有する炭素−炭素二重結合が光硬化反応可能である他、共重合体Ａの有するカルボキシル基と共重合体Ｂの有するエポキシ基が加熱により硬化反応を起こすことができる。
【００２６】
【表３】

【００２７】
【表４】

【００２８】
比較例１として、ビスフェノール系グリシジル型エポキシ樹脂（エピコート８２８、エピコート１００２、（いずれも商品名）ジャパンエポキシレジン社製）各々３００重量部、熱活性型潜在性エポキシ樹脂硬化剤（サンエイドＳＩ−１００Ｌ（商品名）三新化学工業社製）１８重量部配合した。
【００２９】
【表５】

【００３０】
【表６】

【００３１】
【発明の効果】
このように本発明によれば、ダイシングの際にはダイシングテープとして使用でき、マウントの際には接着剤として使用でき、また保存安定性のよい粘接着テープを提供することができる。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an adhesive tape in which a pressure-sensitive adhesive layer is provided on one side of a base film and a normal separator is provided on the pressure-sensitive adhesive layer side. More specifically, in manufacturing a semiconductor device such as a silicon wafer, the wafer is fixed, diced, and further used in an adhering process for overlapping with a lead frame or a semiconductor chip. It is about.
[0002]
[Prior art]
In an assembly process of a semiconductor device such as an IC, a process of cutting and separating (dicing) a semiconductor wafer after pattern formation, a process of mounting a chip on a lead frame, and a process of sealing with a resin or the like It is made up of.
The dicing process is a process in which the semiconductor wafer is bonded and fixed in advance to the adhesive tape, and then dicing along the chip shape. The mounting process is performed by peeling (picking up) the chip from the adhesive tape and sealing it with a resin or the like. In this step, the chip is fixed to a lead frame or the like with an adhesive for fixing the adhesive.
[0003]
There are two types of tapes used for the above purpose: normal pressure-sensitive adhesives and tapes that have the property of decreasing the adhesive strength when cured by radiation such as ultraviolet rays and electron beams. Therefore, it requires a sufficient adhesive strength and can be easily peeled off when picked up.
In the mounting process, a sufficient adhesive force is required between the chip and the lead frame.
[0004]
[Problems to be solved by the invention]
Various adhesive tapes have been proposed that have the function of an adhesive to the dicing pressure-sensitive adhesive tape and lead frame used in the above process, improve the workability of adhesive application, and simplify the process. (For example, JP-A-2-32181, JP-A-8-53655, etc.).
The pressure-sensitive adhesive tape disclosed in the above publication enables so-called direct die bonding after dicing, picking up with the pressure-sensitive adhesive layer attached to the back surface of the chip, mounting it on a lead frame, etc., and curing and bonding by heating, etc. The application process can be omitted.
However, the adhesive disclosed in JP-A-2-32181 generally uses a coating solution having a low viscosity when dried at high temperature and a surface energy of the tape substrate as low as 40 dyne / cm. Therefore, the wettability of the coating solution is low, the repelling is likely to occur even when applied to the substrate, and the yield is low. Furthermore, so-called transfer coating, in which the coating solution is applied to a release material treated with a silicone release agent, dried, and bonded to a tape substrate, is more difficult with the coating solution of the composition (Japanese Patent Laid-Open No. Hei 8). -53655 description). In addition, in JP-A-2-32181 and JP-A-8-53655, an adhesive containing an epoxy resin and a thermally activated latent epoxy resin curing agent is disclosed, but this curing agent is hygroscopic. There is a problem that the storage stability is poor because curing is accelerated by moisture and the pot life is reduced.
[0005]
[Means for Solving the Problems]
As a result of diligent studies to achieve the above-mentioned object, the adhesive composition used for the above-mentioned adhesive tape contains at least a radiation-curable carbon-carbon double bond as a bonding group in the main carbon chain. When an acrylic adhesive composition having a group, an epoxy group-containing group and a carboxyl group-containing group is used, the pressure-sensitive adhesive is cured by a crosslinking reaction by a carbon-carbon double bond at the time of radiation irradiation, and then heat is applied. It was found that the epoxy group and the carboxyl group can be further cured by causing a crosslinking reaction, and radiation curing and thermosetting without adding a thermosetting resin and a thermoactive latent epoxy resin curing agent. As a result, an adhesive tape having a long working life and excellent storage stability has been invented.
The present invention relates to an adhesive tape excellent in storage stability capable of exhibiting a two-stage curing reaction of radiation curing and thermosetting without adding a thermosetting resin and a thermoactive latent epoxy resin curing agent. Is. More specifically, the adhesive layer and the wafer and the base film have sufficient adhesive strength to prevent peeling when dicing, and when picking up, the chip back surface is brought into close contact with the adhesive layer by radiation curing and peeled off from the base film In the mounting process, it is suitable for enabling so-called direct die bonding in which a sufficient adhesive force can be obtained between the chip and the lead frame.
That is, the present invention
(1) In a semiconductor wafer dicing die bonding adhesive tape in which an adhesive layer is provided on at least one surface of a base film, the resin component of the adhesive is at least a radiation-curable carbon-carbon double bond-containing group. , An epoxy pressure-sensitive adhesive having an epoxy group-containing group and a carboxyl group-containing group, and having a gel fraction of 60% or more, dicing for semiconductor wafer-adhesive tape for die bonding ,
(2) The acrylic pressure-sensitive adhesive is obtained by copolymerizing an acrylic copolymer obtained by copolymerizing a (meth) acrylic acid ester, a carboxyl group-containing unsaturated compound, and a hydroxyl group-containing unsaturated compound. Copolymer A obtained by addition reaction of a compound having a functional group capable of undergoing addition reaction with respect to a group or a hydroxyl group and a carbon-carbon double bond, a (meth) acrylic acid ester, and an epoxy group Functional group and carbon-carbon capable of undergoing addition reaction with respect to epoxy group or hydroxyl group of this copolymer to acrylic copolymer obtained by copolymerization of unsaturated compound and hydroxyl group-containing unsaturated compound The semiconductor according to (1) obtained by mixing with a copolymer B obtained by addition reaction of a compound having a double bond Dicing for body wafers-adhesive tape for die bonding,
(3) The proportion of the constituent component having an epoxy group-containing group in all the constituent components in the acrylic copolymer is 1 to 30 mol%, the proportion of the constituent component having a carboxyl group-containing group is 1 to 30 mol%, (1) or (2) semiconductor wafer dicing-die bonding pressure-sensitive adhesive tape, wherein the proportion of the component having a heavy bond-containing group is 1 to 10 mol%,
(4) The peeling force between the silicon wafer and the adhesive tape after irradiation is 0.5 to 50 N / 25 mm, and the peeling force between the adhesive tape and the base film is 0.5 N / 25 mm or less. (1) to (3), wherein the peeling force between the adhesive tape and the adhesive tape is greater than the peeling force between the base film and the adhesive tape. Adhesive tape,
(5) The acrylic copolymer has a crosslinking agent of 0.01 to 5.0 parts by weight and / or a photopolymerization initiator for the acrylic copolymer 100 with respect to 100 parts by weight of the acrylic copolymer. (2) or (3) semiconductor wafer dicing-die bonding adhesive tape, characterized by being added in the range of 0.01 to 5 parts by weight with respect to parts by weight, and (6) As a base film, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene, ethylene-vinyl acetate copolymer, ethylene-acrylate copolymer, ionomer, polyethylene terephthalate, polycarbonate, polymethyl methacrylate, polyurethane, styrene -1 type, or 2 or more types selected from the group consisting of ethylene-butene copolymer and pentene copolymer Characterized by using (1) to (5) dicing the semiconductor wafer according to any one of - there is provided a pressure-sensitive adhesive tape for die bonding.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
The adhesive used in the present invention is an acrylic copolymer having a radiation-curable carbon-carbon double bond-containing group, an epoxy group-containing group, and a carboxyl group-containing group in at least a main chain composed of carbon-carbon bonds. It consists of a mixture or a mixture of acrylic copolymers or a cross-linked product thereof.
Such an acrylic copolymer includes (meth) acrylic acid ester, a hydroxyl group-containing unsaturated compound, a carboxyl group-containing unsaturated compound, an epoxy group-containing unsaturated compound, and the like (A). It can be obtained by addition reaction of a compound (B) having a functional group capable of undergoing addition reaction with respect to the functional group of the copolymer and a carbon-carbon double bond. The unsaturated compound in the present invention refers to a compound having at least one carbon-carbon double bond that can be radiation-cured.
[0007]
Examples of the (meth) acrylic acid ester include methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate and the like.
Examples of the hydroxyl group-containing unsaturated compound include 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, and the like.
Examples of the carboxyl group-containing unsaturated compound include acrylic acid and methacrylic acid.
Examples of the epoxy group-containing unsaturated compound include glycidyl acrylate, glycidyl methacrylate, and allyl glycidyl ether.
Examples of the compound (B) having a functional group capable of addition reaction and a carbon-carbon double bond can react with an isocyanate compound such as 2-isocyanatoethyl methacrylate capable of reacting with a hydroxyl group, and an epoxy group. Examples thereof include acrylic group-containing unsaturated compounds that can react with acrylic acid, methacrylic acid, and carboxyl groups having a carboxyl group.
[0008]
In addition to unsaturated groups having an epoxy group-containing group, a carboxyl group-containing group, and a hydroxyl group-containing group, the copolymer may be used alone or in combination of two or more from a (meth) acrylic ester. Can do.
In addition, as a synthesis method of the acrylic copolymer,
(1) Copolymer (A) composed of (meth) acrylic acid ester, hydroxyl group-containing unsaturated compound, carboxyl group-containing unsaturated compound, epoxy group-containing unsaturated compound, etc., to the functional groups of these copolymers A method of subjecting a compound (B) having a functional group capable of undergoing an addition reaction and a carbon-carbon double bond to the addition reaction,
(2) Epoxy group-containing unsaturated compound, hydroxyl group-containing unsaturated compound, copolymer (A-1) comprising (meth) acrylic acid ester, carboxyl group-containing unsaturated compound, hydroxyl group-containing unsaturated compound, ( Copolymer (A-2) made of (meth) acrylic acid ester is copolymerized separately, and the copolymer (A-1) and (A-2) have a carbon-carbon double bond and epoxy. The compound (B) having a functional group capable of reacting with any one of a group, a carboxyl group, and a hydroxyl group can be synthesized by a method such as a method of mixing the two after the addition reaction. The effect is obtained.
In addition, since the acrylic copolymer has a high concentration of an epoxy group or a carboxyl group, the epoxy group and the carboxyl group are likely to react during polymerization. For example, an epoxy group-containing unsaturated compound or a hydroxyl group-containing unsaturated compound A copolymer (A-1) composed of (meth) acrylic acid ester, a carboxyl group-containing unsaturated compound, a hydroxyl group-containing unsaturated compound, and a copolymer (A-2) composed of (meth) acrylic acid ester Are separately copolymerized, and compounds (B) each having a carbon-carbon double bond and a functional group capable of reacting with a hydroxyl group are added to the above copolymers (A-1) and (A-2), respectively. It is preferable to prepare by mixing both after making it react.
[0009]
The molecular weight of the acrylic copolymer used in the present invention is preferably 10,000 to 1,000,000, more preferably 50,000 to 500,000 in terms of weight average molecular weight.
The ratio of the component having a carbon-carbon double bond-containing group in all the components (repeating units) of the acrylic polymer of the present invention is preferably 1 to 20 mol%, more preferably 1 to 10 mol%. . If the ratio of the carbon-carbon double bond-containing group is too low, the degree of crosslinking at the time of radiation irradiation is insufficient, so that the adhesive layer and the base film layer cannot be easily peeled off in the pickup process. If the ratio is too high, the degree of crosslinking at the time of radiation irradiation becomes too high, and the subsequent heat curing may not proceed sufficiently.
[0010]
Moreover, the ratio of the component which has an epoxy-group containing group with respect to all the components of an acryl-type copolymer becomes like this. Preferably it is 1-30 mol%, and 5-20 mol% is more preferable. The proportion of the component having a carboxyl group-containing group is preferably 1 to 30 mol%, and more preferably 5 to 20 mol%. If the ratio between the epoxy group and the carboxyl group is too low, the degree of cross-linking during heating is insufficient, so that sufficient adhesion between the chip and the lead frame may not be obtained in the mounting process. Moreover, when both ratios are too high, sufficient adhesive force which fixes a wafer at the time of dicing cannot be obtained.
The acrylic copolymer thus obtained can be blended with a crosslinking agent such as a polyisocyanate compound, an alkyl etherified melamine compound or an alkyl etherified melamine compound, if necessary. The addition amount of the crosslinking agent is preferably 0.01 to 5.0 parts by weight with respect to 100 parts by weight of the acrylic copolymer.
[0011]
When the radiation-curable pressure-sensitive adhesive of the present invention is cured by ultraviolet irradiation, a photopolymerization initiator such as isopropyl benzoin ether, isobutyl benzoin ether, benzophenone, Michler's ketone, chlorothioxanthone, dodecylthioxanthone, dimethyl is used as necessary. Thioxanthone, diethylthioxanthone, benzyl dimethyl ketal, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenylpropane, and the like can be used. The blending amount of these photopolymerization initiators is preferably 0.01 to 5 parts by weight with respect to 100 parts by weight of the acrylic copolymer.
In this invention, the gel fraction of this adhesive is calculated | required as follows, for example. That is, about 0.05 g of the adhesive layer of the adhesive tape was weighed and immersed in 50 ml of xylene at 120 ° C. for 24 hours, and then filtered through a 200-mesh stainless steel wire mesh. For 120 minutes. Next, the weight of the dried insoluble matter is weighed, and the gel fraction is calculated by the following formula.
Gel fraction (%) = (weight of insoluble matter / weight of weighed adhesive layer) × 100
In the present invention, if a low molecular component is present in the pressure-sensitive adhesive, the low molecular component may migrate to the tape surface and damage the adhesive properties during long-term storage after tape production. A high gel fraction is desirable, and it is usually 60% or more, preferably 70% or more.
[0012]
Moreover, it is also possible to add to the said adhesive agent the metal fine powder and the material which is excellent in electroconductivity or thermal conductivity for the purpose of providing the electroconductivity after die-bonding, and heat conductivity.
Moreover, it is also possible to add fine powders, such as a metal oxide and glass, to the said adhesive agent for the purpose of heat stability improvement.
The thickness of the adhesive application layer is preferably 5 to 50 μm.
[0013]
As the base film used in the present invention, a known film can be used as long as it has radiolucency. For example, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene, ethylene-vinyl acetate copolymer can be used. Polymers, ethylene-acrylic acid ester copolymers, homopolymers or copolymers of α-olefins such as ionomers, engineering plastics such as polyethylene terephthalate, polycarbonate, polymethyl methacrylate, or polyurethane, styrene-ethylene-butene or Examples thereof include thermoplastic elastomers such as pentene copolymers. Alternatively, a mixture of two or more selected from these groups or a multilayered structure may be used.
The thickness of the film is preferably 50 to 200 μm. The adhesive tape of the present invention has a separator (release film) attached to the pressure-sensitive adhesive layer side for protection before use.
[0014]
The adhesive tape thus obtained has a sufficient adhesive strength that does not peel off the adhesive layer, the wafer and the substrate film during dicing, and the adhesive layer and the back surface of the chip are separated by radiation curing at the time of pickup. It can be peeled off from the base film in a close contact state, and can be bonded to a lead frame or the like by heating.
The peeling force (force required for peeling) between the silicon wafer and the adhesive tape during dicing is preferably 0.5 to 10 N / 25 mm, more preferably 1 to 5 N / 25 mm. The silicon wafer after radiation irradiation The peel strength of the adhesive tape is preferably 0.5 to 50 N / 25 mm, and the peel force between the base film and the adhesive layer of the adhesive tape is preferably 0.5 N / 25 mm or less. In this case, of course, the relationship between the peeling forces needs to be greater in the former than in the latter.
Next, in the mounting step, the adhesion between the IC chip and the lead frame or the IC chip and the IC chip is realized by heating to cure the epoxy group and the carboxyl group in the adhesive layer. The heating temperature in this case is not particularly limited, but is usually preferably 100 to 200 ° C., and the heating time is preferably 1 to 60 minutes.
[0015]
【Example】
Next, the present invention will be described in more detail based on examples. Each characteristic in the following implementation was tested as follows.
[0016]
1. Gel fraction: About 0.05 g of the pressure-sensitive adhesive layer was weighed, immersed in 50 ml of xylene at 120 ° C. for 24 hours, filtered through a 200 mesh stainless steel wire mesh, and the insoluble content on the wire mesh was 120 ° C. at 120 ° C. Dry for minutes. Next, the weight of the dried insoluble matter was weighed, and the gel fraction was calculated by the following formula.
Gel fraction (%) = (weight of insoluble matter / weight of weighed adhesive layer) × 100
[0017]
2. Storage stability The adhesive tapes prepared based on Examples and Comparative Examples were left in an environment of 60 ° C. and 85% RH for 1 week, left at room temperature for 1 hour, and then bonded to the adherend. The peel strength of the adhesive tape that was not heat-treated was bonded to the adherend was measured, and the storage stability was evaluated by confirming the rate of change of the peel force.
As a measuring method of peeling force, it measured according to JISZ0237. (The tape was cut to a width of 25 mm and a length of about 250 mm, and the surface of a SUS 304 steel plate polished with a No. 280 water-resistant abrasive paper was used as the adherend. (Measured by peeling method.)
Rate of change (%) = (difference in adhesive strength before and after heating / peeling strength before standing) × 100
age,
Change rate of peel force before and after standing is less than 30%: ○
The peel force change rate before and after being left is 30% or more: ×
Judged by.
[0018]
3. Dicing evaluation (confirmation of chip skipping)
The wafer was bonded to the adhesive tape prepared based on the examples and comparative examples under the following conditions, and it was confirmed whether or not the chips were scattered when diced.
No chip jumping: ○
Only incompletely shaped chips scattered on the outer periphery of the wafer: △
There is chip jumping: ×
Judged by.
[0019]
4). After bonding wafers to the adhesive tape prepared based on the shearing adhesive strength examples and comparative examples under the following conditions, dicing and irradiating with ultraviolet rays, peeling from the high-density polyethylene resin film layer, the silicon wafer After sticking and applying a load of 39.2 kPa and holding at 150 ° C. for 30 minutes to cure the adhesive layer, measure the shear adhesive strength at normal temperature (23 ° C.) and 200 ° C. using a push-pull gauge. did.
[0020]
3. And 4. The dicing conditions were as follows.
Dicing machine: DAD-340 manufactured by DISCO Corporation
Blade: NBC-ZH2050 27HEDD manufactured by Disco Corporation
Blade rotation speed: 40000 rpm
Cutting speed: 100 mm / sec
Uncut thickness: 50 μm
Dicing size: 5 mm square wafer: Si wafer Wafer size: 6 inch wafer thickness: 350 μm
Wafer backside grinding roughness: # 2000 polished surface
Synthesis of Copolymer A Copolymer A was polymerized using butyl acrylate, 2-hydroxyethyl acrylate, and acrylic acid as raw materials at a blending ratio shown in Table 1 below to obtain a copolymer.
2-isocyanatoethyl methacrylate was added to this polymer at a compounding ratio shown in Table 1 to obtain a copolymer A. A7 is a reference example.
[0022]
[Table 1]

[0023]
Synthesis of Copolymer B Copolymer B was polymerized using butyl acrylate, 2-hydroxyethyl acrylate, and glycidyl methacrylate as raw materials at a blending ratio shown in Table 2 below to obtain a copolymer.
2-isocyanatoethyl methacrylate was added to this polymer at a blending ratio shown in Table 2 below to obtain a copolymer B. B7 is a reference example.
[0024]
[Table 2]

[0025]
Preparation of adhesive tape Copolymers A and B obtained by synthesizing copolymer A and copolymer B, polyisocyanate compound (trade name Coronate L, manufactured by Nippon Polyurethane Co., Ltd.) as a curing agent, photoinitiator As a mixture, α-hydroxycyclohexyl phenyl ketone was mixed at a blending ratio shown in Table C below to obtain an adhesive.
The thickness of the adhesive after drying was set to 30 μm and applied to a high-density polyethylene resin film (100 μm) to prepare an adhesive tape.
As a result, the copolymers A and B cause a curing reaction by the reaction between the hydroxyl groups of the copolymers A and B and the isocyanate group functional group of the curing agent in the heat drying step, and the copolymers A and B are contained. In addition to being capable of photocuring the carbon-carbon double bond, the carboxyl group of copolymer A and the epoxy group of copolymer B can cause a curing reaction by heating.
[0026]
[Table 3]

[0027]
[Table 4]

[0028]
As Comparative Example 1, bisphenol-based glycidyl type epoxy resin (Epicoat 828, Epicoat 1002, (both trade names) manufactured by Japan Epoxy Resin Co., Ltd.) each 300 parts by weight, thermally activated latent epoxy resin curing agent (Sun Aid SI-100L ( (Product name) Sanshin Chemical Co., Ltd.) 18 parts by weight were blended.
[0029]
[Table 5]

[0030]
[Table 6]

[0031]
【The invention's effect】
Thus, according to the present invention, it is possible to provide an adhesive tape that can be used as a dicing tape during dicing, can be used as an adhesive during mounting, and has good storage stability.

Claims (6)

  In a semiconductor wafer dicing die bonding adhesive tape in which an adhesive layer is provided on at least one surface of a base film, the resin component of the adhesive is at least a radiation-curable carbon-carbon double bond-containing group, an epoxy group A dicing adhesive for semiconductor wafer-die bonding adhesive tape, which is an acrylic pressure-sensitive adhesive having a containing group and a group containing a carboxyl group, and has a gel fraction of 60% or more. The acrylic pressure-sensitive adhesive is obtained by copolymerizing a (meth) acrylic acid ester, a carboxyl group-containing unsaturated compound and a hydroxyl group-containing unsaturated compound, into a carboxyl group or hydroxyl group of the copolymer. Copolymer A obtained by addition reaction of a compound having a functional group capable of undergoing addition reaction to a group and a carbon-carbon double bond, (meth) acrylic acid ester, epoxy group-containing unsaturated compound And a functional group and a carbon-carbon double bond capable of undergoing an addition reaction with respect to an epoxy group or a hydroxyl group of the copolymer to an acrylic copolymer obtained by copolymerizing a hydroxyl group-containing unsaturated compound The semiconductor wafer according to claim 1, wherein the semiconductor wafer is obtained by mixing with a copolymer B obtained by addition reaction of a compound containing Dicing for wafers-Adhesive tape for die bonding.   The proportion of the component having an epoxy group-containing group in all the components in the acrylic copolymer is 1 to 30 mol%, the proportion of the component having a carboxyl group-containing group is 1 to 30 mol%, and contains a carbon-carbon double bond The ratio of the structural component which has group is 1-10 mol%, The dicing for semiconductor wafers of Claim 1 or 2-Adhesive tape for die bondings   The peeling force between the silicon wafer and the adhesive tape after radiation irradiation is 0.5 to 50 N / 25 mm, and the peeling force between the adhesive tape and the base film is 0.5 N / 25 mm or less. 4. The adhesive tape for semiconductor wafer dicing-die bonding according to any one of claims 1 to 3, wherein the peeling force of the adhesive tape is larger than the peeling force of the base film and the adhesive tape.   In the acrylic copolymer, the crosslinking agent is 0.01 to 5.0 parts by weight with respect to 100 parts by weight of the acrylic copolymer, and / or the photopolymerization initiator is 100 parts by weight of the acrylic copolymer. 4. The dicing adhesive for semiconductor wafers according to claim 2, wherein the adhesive tape is added in an amount of 0.01 to 5 parts by weight. As the base film, polyethylene, polypropylene, ethylene-propylene copolymer, polybutene, ethylene-vinyl acetate copolymer, ethylene-acrylic acid ester copolymer, ionomer, polyethylene terephthalate, polycarbonate, polymethyl methacrylate, polyurethane, The semiconductor wafer according to any one of claims 1 to 5, wherein one or more selected from the group consisting of a styrene-ethylene-butene copolymer and a pentene copolymer are used. Dicing-Adhesive tape for die bonding.