JP4301276B2 - Optical device and projector - Google Patents

Description

  The present invention relates to an optical device and a projector.

2. Description of the Related Art Conventionally, there has been known a projector including a light modulation device that modulates a light beam emitted from a light source according to image information, and a projection optical device that enlarges and projects the light beam modulated by the light modulation device.
As the light modulation device, for example, a light modulation element (liquid crystal panel) in which liquid crystal is hermetically sealed between a pair of substrates is generally employed. In general, an incident-side polarizing plate and an emitting-side polarizing plate that transmit a light beam having a predetermined polarization axis are disposed on the light beam incident side and the light beam emission side of the light modulation element, respectively.
In projectors equipped with optical elements such as the light modulation element, incident side polarizing plate, and emission side polarizing plate as described above, light modulation is performed by light absorption from the liquid crystal layer, black matrix, and various wirings by the light flux from the light source. The temperature of the element is likely to rise, and heat is also likely to be generated in the polarizing plate.
For this reason, in a projector having an optical element as described above, a technique for cooling the optical element using a heat pipe has been proposed (for example, see Patent Document 1).
In the technique described in Patent Document 1, a heat pipe is disposed at a position separated from an optical element such as a liquid crystal panel, and a cooling fin is brought into thermal contact with a heat absorbing portion (evaporating portion) of the heat pipe. And the heat of the air near optical elements, such as a liquid crystal panel, is transmitted to a cooling fin, the heat of a cooling fin is taken away by a heat pipe, and it is conveyed to the thermal radiation part (condensing part) of a heat pipe, and is radiated.

JP 2001-312002 A

  However, in the technique described in Patent Document 1, since the optical element is cooled via air, the thermal resistance of heat transfer between the air and the evaporation portion (cooling fin) of the heat pipe is large, and the temperature of the air is reduced. As a result, the optical element cannot be cooled effectively.

  The objective of this invention is related with the optical apparatus and projector which can cool an optical element effectively.

An optical device according to the present invention is formed into an optical element that optically converts an incident light beam and emits it, and is formed into a tubular shape having a capillary structure therein, and a refrigerant is accommodated inside the tube, and the refrigerant recirculates inside the tube. A heat pipe that cools the optical element by connecting to the optical element so that heat can be transferred to the optical element, and the heat pipe is formed by pressing so as to match the outer shape of the optical element. A concave portion that is bent and fitted with the optical element in a loosely fitted state is provided, and the concave portion and a light beam incident side end surface of the optical element are in surface contact .
Here, as an optical element, a configuration including an optical element body such as a light modulation element, an incident side polarizing plate, an emission side polarizing plate, and a holding frame for holding the optical element body, or a holding frame is omitted, and an optical element is omitted. A configuration with only the element body can be adopted.

Furthermore, various structures can be adopted as the capillary structure of the heat pipe, for example, an ultra fine wire wick composed of a plurality of thin copper wires or the like, a mesh-like metal mesh wick, and a plurality of grooves formed inside the tube. Examples include a groove type wick or a powdery sintered type wick.
Furthermore, as the optical element and the heat pipe, it is sufficient that each connecting portion (the optical element side connecting portion and the heat conducting member side connecting portion) connected to each other has a shape in surface contact. A structure in which the heat conducting member side connecting portion is formed so as to match the shape of the outer surface of the optical element as the outer surface of the element, and the optical element side so as to match the shape of the outer surface of the heat pipe with the heat conducting member side connecting portion as the outer surface of the heat pipe Examples include a configuration in which the connection portion is formed, or a configuration in which each connection portion is formed such that the optical element side connection portion and the heat conducting member side connection portion are in surface contact with each other.

In the present invention, the heat pipe is connected to the optical element so that heat can be transferred. As a result, compared to the conventional configuration, the heat pipe is directly connected to the optical element without passing air between the optical element and the heat transfer path of the optical element to the heat pipe . Thermal resistance can be reduced.
Further, the optical element and the heat pipe have a shape in which respective connecting portions (optical element side connecting portion and heat conducting member side connecting portion) connected to each other are in surface contact. Accordingly, the contact area between the optical element and the heat pipe can be increased, and the heat transfer characteristics from the optical element to the heat pipe can be improved.
Therefore, the optical element can be effectively cooled, the temperature rise of the optical element can be suppressed, and the thermal deterioration of the optical element can be effectively prevented.

In the present invention, the optical elements and the heat pipe are connected so that their outer surfaces can transfer heat. And the heat conducting member side connection part formed in the outer surface of the heat pipe is formed by press work so as to match the shape of the outer surface of the optical element. By this, for example, compared with a configuration in which the outer surface of the heat pipe is used as the heat conducting member side connecting portion and the optical element side connecting portion is formed so as to match the shape of the outer surface of the heat pipe, only the heat pipe is pressed. It is possible to realize a structure in which each connection portion (optical element side connection portion and heat conduction member side connection portion) of the optical element and the heat pipe is in surface contact, and with a simple configuration, the above-described optical element can be effectively cooled. The effect of suppressing the temperature rise and effectively preventing the thermal deterioration of the optical element can be suitably achieved.

Furthermore, according to the present invention, since the heat pipe is configured as described above, for example, as an optical element, a configuration of only an optical element body such as a light modulation element, an incident side polarizing plate, an emission side polarizing plate, and the like. In this case, the heat pipe itself can have a function as a holding frame for holding the optical element body. For this reason, for example, the optical element body can be directly held and fixed to the heat pipe, and a separate holding frame for holding the optical element body can be omitted, thereby simplifying the structure of the optical device and reducing the cost of the optical device. . In addition, since the holding frame can be omitted in the above-described configuration, the heat generated in the optical element body can be directly radiated to the heat pipe without passing through the holding frame, and heat transfer between the optical element body and the heat pipe can be performed. The characteristics can be improved, and the cooling efficiency of the optical element body can be improved.

In the optical device of the present invention, prior Symbol heat pipe is preferably formed in a generally U-shaped plan configuration.
In the present invention, the heat pipe is formed in a U-shape in plan view having a base end portion and a pair of extending portions, and the heat conducting member side connecting portions are formed in the pair of extending portions, respectively. The heat pipe is connected to each optical element side connecting portion formed at each side end portion of the optical element facing each other at each heat conducting member side connecting portion formed at the pair of extending portions, respectively. To do. That is, at least a part of the pair of extending portions functions as an evaporation portion that takes in heat, and a side (for example, a base end portion) separated from each evaporation portion functions as a condensing portion that radiates heat. It will be. Thus, in the heat pipe, the refrigerant recirculation path inside the pipe is divided into at least a part of each evaporating part of each extending part, and a condensing part (for example, a base end part) on the side away from each evaporating part. A plurality of paths (for example, two paths) between them, the amount of heat transfer inside the tube can be increased, the above-described optical element can be effectively cooled, and the temperature of the optical element can be increased. The effect that it can suppress and can effectively prevent the thermal degradation of the optical element can be achieved more suitably. Further, in order to effectively cool the optical element, for example, a configuration in which two heat pipes are connected to the respective side end portions facing each other in the optical element so as to be able to transfer heat can be considered. Since the optical element can be effectively cooled by one heat pipe, the structure of the optical device can be simplified and the cost of the optical device can be reduced.

In the optical device of the present invention, prior Symbol heat pipe, Tei Rukoto has a ring shape surrounding the outer peripheral end portion of the optical element is preferred.
In the present invention, the heat pipe has a ring shape that surrounds the outer peripheral end of the optical element, and the heat conducting member side connection portions are formed so as to face each other on the ring-shaped inner portion. The heat pipes respectively heat the respective optical element connection portions formed at the opposite side end portions of the optical element at the respective heat conducting member side connection portions formed so as to be opposed to each other in the ring-shaped inner portion. Connect to communicate. That is, the heat pipe functions as an evaporating part in which at least a part of each part where each heat conducting member side connecting part is formed absorbs heat, and between each heat conducting member side connecting part on the side separated from each evaporating part. Each site | part located will each function as a condensation part which thermally radiates heat. As a result, in the heat pipe, the refrigerant recirculation path inside the pipe is changed to at least a part of each part where each heat conduction member side connection part is formed, and each condensation part on the side away from each evaporation part. A plurality of paths (for example, four paths) between the pipes (each part located between the respective heat conducting member side connecting parts), the amount of heat transfer inside the pipe can be increased, and The optical element can be effectively cooled, and the effect of suppressing the temperature rise of the optical element and effectively preventing the thermal deterioration of the optical element can be achieved more suitably. Further, in order to effectively cool the optical element, for example, a configuration in which two heat pipes are connected to the respective side end portions facing each other in the optical element so as to be able to transfer heat can be considered. Since the optical element can be effectively cooled by one heat pipe and the temperature rise of the optical element can be suppressed, the structure of the optical device can be simplified and the cost of the optical device can be reduced.

In the optical device of the present invention, it is preferable that the capillary structure of the heat pipe is composed of a sintered wick.
By the way, when the capillary structure of the heat pipe is configured with a groove type wick, it is better to use gravity as the movement of the refrigerant (liquefied state) from the condensing part that radiates heat to the evaporating part that absorbs heat. Heat transfer in the heat pipe is performed quickly. For this reason, when the capillary structure of the heat pipe is constituted by a groove-type wick, it is preferable to dispose the condensing part above the evaporation part. However, when configured in this way, for example, in a projector on which an optical device is mounted, from a normal position (a state where the optical apparatus is placed on an installation surface such as a desk) to a ceiling position (a vertical position relative to the normal position) The condensing unit evaporates when the posture state is changed to a state suspended from the ceiling or the like so that the reverse is reversed) or when the posture state is changed to be inclined to adjust the position of the projected image. If it is located below the part, the heat transfer in the heat pipe will not be carried out well.

According to the present invention, since the capillary structure of the heat pipe is composed of a sintered wick, it is not necessary to use gravity for the movement of the refrigerant, and therefore the arrangement positions of the condensing unit and the evaporating unit are not limited. For this reason, for example, in a projector equipped with an optical device, it corresponds to any projector posture state such as a normal placement posture, a ceiling suspension posture, and a tilted state for adjusting the position of the projected image. The heat transfer is carried out satisfactorily, the above-described optical element can be effectively cooled, and the effect of suppressing the temperature rise of the optical element and effectively preventing the thermal deterioration of the optical element can be suitably achieved.
Moreover, since the capillary structure of the heat pipe is composed of sintered wicks, the evaporation part and the condensation part are compared with other wicks (extra fine wire wicks, metal mesh wicks, groove wicks, etc.). The heat resistance is sufficiently low, and the heat conductivity of the wick itself is good, so that heat can be transferred to the refrigerant better, heat transfer in the heat pipe is performed more quickly, and the cooling efficiency of the optical element Can be further improved.

A projector according to the present invention includes a light source device, a light modulation device that modulates a light beam emitted from the light source device according to image information, and a projection optical device that enlarges and projects the light beam modulated by the light modulation device. A projector provided with the above-described optical device.
According to the present invention, since the projector includes the optical device described above, the projector can enjoy the same operations and effects as the optical device described above.
In addition, since the projector includes an optical device that can effectively cool the optical element, thermal deterioration of the optical element can be suppressed, the projection image can be maintained well, and the life can be extended.

[First embodiment]
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, a first embodiment of the invention will be described with reference to the drawings.
[Schematic configuration of projector]
FIG. 1 is a diagram schematically showing a schematic configuration of the projector 1.
The projector 1 modulates a light beam emitted from a light source according to image information to form a color image (optical image), and enlarges and projects this color image on a screen (not shown). As shown in FIG. 1, the projector 1 includes a substantially rectangular parallelepiped outer casing 2, a projection lens 3 as a projection optical device, an optical unit 4, and the like.
Although not specifically shown in FIG. 1, a power supply unit that supplies power to each component in the projector 1 in a space other than the projection lens 3 and the optical unit 4 in the exterior housing 2, a projector It is assumed that a cooling unit including a cooling fan or the like that cools the inside of the projector 1 and a control device that controls each component in the projector 1 are disposed.
The projection lens 3 is configured as a combined lens in which a plurality of lenses are housed in a cylindrical lens barrel, and enlarges and projects a color image formed by the optical unit 4 on a screen.

[Detailed configuration of optical unit]
The optical unit 4 forms a color image (image light) in accordance with image information under the control of the control device, and as shown in FIG. 1, from the front side to the back side of the exterior housing 2. It has a substantially U-shape in plan view that extends and extends and the end portion in the extending direction bends and extends along the back surface and further bends and extends toward the front surface side. As shown in FIG. 1, the optical unit 4 includes a light source device 41, a uniform illumination optical device 42, a color separation optical device 43, a relay optical device 44, an optical device 45, and an optical component casing 46. Is provided.

The light source device 41 emits the light beam emitted from the light source lamp 411 in a certain direction and illuminates the optical device 45. As illustrated in FIG. 1, the light source device 41 includes a light source lamp 411 and a reflector 412.
As the light source lamp 411, a halogen lamp, a metal halide lamp, or a high-pressure mercury lamp is often used.
As the reflector 412, a parabolic reflector that reflects the light beam emitted from the light source lamp 411 by making it substantially parallel is used. As the reflector 412, in addition to the parabolic reflector, an ellipsoidal reflector that reflects the light beam emitted from the light source lamp 411 so as to converge at a predetermined position may be used in combination with a collimating lens.

The uniform illumination optical device 42 is an optical system that divides the light beam emitted from the light source device 41 into a plurality of partial light beams and uniformizes the in-plane illuminance of the illumination area. As shown in FIG. 1, the uniform illumination optical device 42 includes a first lens array 421, a second lens array 422, a polarization conversion element 423, a reflection mirror 424, and a superimposing lens 425.
The first lens array 421 has a function as a light beam splitting optical element that splits a light beam emitted from the light source device 41 into a plurality of partial light beams, and is arranged in a matrix in a plane orthogonal to the illumination optical axis A. It is configured with a plurality of small lenses.
The second lens array 422 is an optical element that condenses a plurality of partial light beams divided by the first lens array 421 described above, and is matrixed in a plane orthogonal to the illumination optical axis A, like the first lens array 421. It has the structure provided with the several small lens arranged in a shape.

The polarization conversion element 423 is a polarization conversion element that aligns the polarization direction of each of the partial light beams divided by the first lens array 421 with approximately one direction of linearly polarized light.
Although not shown, the polarization conversion element 423 has a configuration in which polarization separation films and reflection films that are inclined with respect to the illumination optical axis A are alternately arranged. The polarization separation film transmits one polarized light beam among the P-polarized light beam and S-polarized light beam included in each partial light beam, and reflects the other polarized light beam. The other polarized light beam reflected is bent by the reflection film and emitted in the emission direction of one polarized light beam, that is, the direction along the illumination optical axis A. Any of the emitted polarized light beams is polarized and converted by a phase difference plate provided on the light beam exit surface of the polarization conversion element 423, and the polarization directions of almost all the polarized light beams are aligned. By using such a polarization conversion element 423, it is possible to align the light beam emitted from the light source device 41 with a polarized light beam in substantially one direction, so that the utilization factor of the light source light used in the optical device 45 is improved. Can do.

  The superimposing lens 425 collects a plurality of partial light beams that have passed through the first lens array 421, the second lens array 422, the polarization conversion element 423, and the reflection mirror 424, and forms an image on three liquid crystal panels (to be described later) of the optical device 45. It is an optical element that is superimposed on a region.

As shown in FIG. 1, the color separation optical device 43 includes two dichroic mirrors 431 and 432 and a reflection mirror 433, and a plurality of partial light beams emitted from the uniform illumination optical device 42 by the dichroic mirrors 431 and 432. Is separated into three color lights of red (R), green (G), and blue (B).
The dichroic mirrors 431 and 432 are optical elements on which a wavelength selection film that reflects a light beam in a predetermined wavelength region and transmits a light beam in another wavelength region is formed on a substrate. The dichroic mirror 431 disposed in the front stage of the optical path is a mirror that reflects blue light and transmits other color light. Further, the dichroic mirror 432 arranged at the rear stage of the optical path is a mirror that reflects green light and transmits red light.

  As shown in FIG. 1, the relay optical device 44 includes an incident side lens 441, a relay lens 443, and reflection mirrors 442 and 444, and the red light transmitted through the dichroic mirrors 431 and 432 of the color separation optical device 43 is an optical device. It has a function of leading to 45. The reason why such a relay optical device 44 is provided in the optical path of red light is that the length of the optical path of red light is longer than the length of the optical path of other color light, and thus the use of light due to light divergence or the like. This is to prevent a decrease in efficiency. In this embodiment, the length of the optical path of red light is long, and thus such a configuration is adopted. However, a configuration in which the length of the optical path of blue light is increased and the relay optical device 44 is used for the optical path of blue light is also considered. It is done.

  The blue light separated by the dichroic mirror 431 described above is bent by the reflection mirror 433 and then supplied to the optical device 45 via the field lens 426. Further, the green light separated by the dichroic mirror 432 is supplied to the optical device 45 through the field lens 426 as it is. Further, the red light is condensed and bent by the lenses 441 and 443 and the reflection mirrors 442 and 444 constituting the relay optical device 44 and supplied to the optical device 45 via the field lens 426. In addition, the field lens 426 provided in the front stage of the optical path of each color light of the optical device 45 converts each partial light beam emitted from the second lens array 422 into a light beam parallel to the principal ray of each partial light beam. Is provided.

  The optical device 45 modulates an incident light beam according to image information to form a color image. As shown in FIG. 1, this optical device 45 has three light modulation devices 451 (red light side) as optical elements having a liquid crystal panel 4511 (see FIGS. 2 and 3) as a light modulation element (optical element body). 451R, the green light side light modulation device 451G, and the blue light side light modulation device 451B), and an incident side polarizing plate 452 disposed on the upstream side of each light modulation device 451, and , A viewing angle compensation plate 453 and an exit-side polarizing plate 454 disposed on the rear side of the optical path of each light modulation device 451, and a cross dichroic prism 455 as a color synthesizing optical device. Of these members 451 to 455, each light modulator 451, each viewing angle compensation plate 453, each exit-side polarizing plate 454, and cross dichroic prism 455 are integrated to form an optical device body 45A (FIG. 2). The detailed configuration of the optical device main body 45A will be described later. In addition, as the optical device main body 45A, a configuration in which each incident-side polarizing plate 452 is integrated in addition to these members 451, 453 to 455 may be adopted.

  The three incident-side polarizing plates 452 transmit only the polarized light having substantially the same polarization direction as the polarization direction aligned by the polarization conversion element 423 among the respective color lights separated by the color separation optical device 43, and other light beams. The polarizing film is affixed on the translucent substrate.

  Each of the liquid crystal panels 4511 constituting the three light modulation devices 451 has a configuration in which liquid crystal, which is an electro-optical material, is hermetically sealed between a pair of rectangular substrates 4511A and 4511B (see FIG. 10) made of glass or the like. is doing. Among these, the substrate 4511A is a driving substrate for driving the liquid crystal, a plurality of data lines arranged in parallel to each other, a plurality of scanning lines arranged in a direction orthogonal to the plurality of data lines, The pixel electrodes are arranged in a matrix corresponding to the intersections of the scanning lines and the data lines, switching elements such as TFTs (Thin Film Transistors), and drive units that drive the switching elements. The substrate 4511B is a counter substrate disposed to face the substrate 4511A at a predetermined interval, and has a common electrode to which a predetermined voltage Vcom is applied. In addition, these substrates 4511A and 4511B are electrically connected to the control device, and are FPCs as circuit substrates that output predetermined drive signals to the scanning lines, the data lines, the switching elements, the common electrodes, and the like. A cable 4511C is connected. By inputting a drive signal from the control device via the FPC cable 4511C, a voltage is applied between the predetermined pixel electrode and the common electrode, and the liquid crystal is interposed between the pixel electrode and the common electrode. The state is controlled, and the polarization direction of the polarized light beam emitted from the incident side polarizing plate 452 is modulated.

In the liquid crystal panel 4511, the outer shape of the drive substrate 4511A is set larger than the outer shape of the counter substrate 4511B (see FIG. 10). That is, the liquid crystal panel 4511 is formed in a stepped shape in which the outer shape becomes smaller toward the light beam incident side.
Further, a dust-proof glass 4511D (see FIG. 10) having an outer shape substantially the same as the outer shape of the driving substrate 4511A and having thermal conductivity is attached to the outer surface of the driving substrate 4511A. Similarly, a dust-proof glass 4511E (see FIG. 10) having the same outer shape as that of the counter substrate 4511B and having thermal conductivity is attached to the outer surface of the counter substrate 4511B. By attaching these dustproof glasses 4511D and 4511E, even if dust adheres to the outer surface of the liquid crystal panel 4511, the dust is shifted from the focus position, and the dust is displayed as a shadow on the projected image. Can be prevented.

The three viewing angle compensation plates 453 are respectively arranged on the rear side of the optical path of each light modulation device 451, and are arranged on a transparent substrate 4531 (see FIG. 3) having a rectangular shape in plan view (see FIG. 3). Is attached.
In this embodiment, the translucent substrate 4531 is made of a material having thermal conductivity, such as quartz or sapphire.
The optical compensation film 4532 compensates for the phase difference generated between the ordinary light and the extraordinary light due to the birefringence generated in the liquid crystal panel 4511, and improves the clear vision characteristics of the liquid crystal panel 4511. This optical compensation film 4532 is an optically anisotropic body having negative uniaxiality, and its optical axis is oriented in a predetermined direction within the film surface and oriented so as to be inclined by a predetermined angle from the film surface in the out-of-plane direction. is doing.
The optical compensation film 4532 can be constituted by, for example, a structure in which a discotic compound layer is formed on a transparent support such as triacetyl cellulose (TAC) through an alignment film, and a WV film (Fuji Photo Film) Can be used.

  The three exit-side polarizing plates 454 have substantially the same function as the incident-side polarizing plate 452, and transmit polarized light in a certain direction out of the light beams emitted through the liquid crystal panel 4511 and the viewing angle compensation plate 453. Absorbs other luminous flux. As shown in FIG. 1, these exit side polarizing plates 454 are two bodies, a first exit side polarizing plate 4541 disposed on the light beam incident side and a second exit side polarizing plate 4542 disposed on the light beam exit side. Composed. The first exit-side polarizing plate 4541 and the second exit-side polarizing plate 4542 are polarizing films 4542B on the transparent substrates 4541A and 4542A (see FIG. 3) having a rectangular shape in plan view, like the entrance-side polarizing plate 452. (Refer FIG. 3) is stuck and comprised. In FIG. 3, the first emission side polarizing plate 4541 is not shown because the polarizing film is attached to the light emission side end face of the translucent substrate 4541A. In the present embodiment, the translucent substrates 4541A and 4542A are made of a material having thermal conductivity, such as quartz or sapphire, as with the translucent substrate 4531 of the viewing angle compensation plate 453. .

The first emission side polarizing plate 4541 and the second emission side polarizing plate 4542 are configured so as to have different light absorption characteristics, and are arranged so that their polarization axes are parallel to each other. As described above, the two-side configuration of the exit-side polarizing plate 454 enables the heat absorbed by the exit-side polarizing plate 454 to be apportioned by two bodies, compared with the case where the exit-side polarizing plate 454 is configured as a single body. The thermal deterioration of the plate 454 can be prevented.
Note that the first exit-side polarizing plate 4541 and the second exit-side polarizing plate 4542 are disposed so that their polarization axes are parallel to each other, and are disposed so as to be substantially orthogonal to the polarization axis of the incident-side polarizing plate 452.

  The cross dichroic prism 455 synthesizes each color light modulated for each color light emitted from the emission side polarizing plate 454 to form a color image. The cross dichroic prism 455 has a substantially square shape in plan view in which four right-angle prisms are bonded together, and two dielectric multilayer films are formed on the interface where the right-angle prisms are bonded together. These dielectric multilayer films are emitted from the light modulation device 451G and transmit the color light via the viewing angle compensation plate 453 and the emission side polarizing plate 454, and are emitted from the light modulation devices 451R and 451B and are viewed on the viewing angle compensation plate 453 and the emission side. Each color light reflected through the polarizing plate 454 is reflected. In this way, the color lights are combined to form a color image. The color image formed by the cross dichroic prism 455 is enlarged and projected onto the screen by the projection lens 3 described above.

  The optical component casing 46 is a member that arranges the above-described optical components 41 to 45 at predetermined positions with respect to the illumination optical axis A set inside, and although not specifically illustrated, the optical components 41 to 45 are arranged. The container-shaped component storage part which accommodates and arrange | positions 45 inside is comprised, and the lid-like member which obstruct | occludes the opening part of the said component storage part.

[Detailed configuration of optical device body]
2 and 3 are diagrams showing a schematic configuration of the optical device main body 45A. Specifically, FIG. 2 is a perspective view of the optical device main body 45A viewed from the light modulation device 451G side. FIG. 3 is an exploded perspective view of the optical device main body 45A. In FIG. 3, only the light modulation device 451G side is disassembled in the optical device main body 45A, but the light modulation devices 451R and 451B have the same configuration as the light modulation device 451G side. To do.
The optical device main body 45A includes a support structure 456 as shown in FIG. 2 or FIG. 3 in addition to the light modulators 451, the viewing angle compensation plates 453, the exit-side polarizing plates 454, and the cross dichroic prism 455 described above. And three optical element holders 457 and three heat conducting members 458, and these members 451, 453 to 458 are integrated.
Here, in the three exit-side polarizing plates 454, each second exit-side polarizing plate 4542 includes each of the cross dichroic prisms 455 in a state where the polarizing film 4542B faces the light incident side, as shown in FIG. 2 or FIG. It is fixed to the end surface of the light beam incident side by an adhesive or the like.

In addition to the liquid crystal panel 4511 described above, the light modulation device 451 includes a holding frame 4512 that holds the liquid crystal panel 4511 as shown in FIG. 2 or FIG.
FIG. 4 is a diagram illustrating a schematic configuration of the light modulation device 451. Specifically, FIG. 4A is a perspective view of the light modulation device 451 viewed from the light incident side. FIG. 4B is a perspective view of the light modulation device 451 viewed from the light beam exit side. In FIG. 4, for convenience of explanation, the optical axis of the light beam emitted from the light modulation device 451 is the Z axis, and the two axes orthogonal to the Z axis are the X axis (horizontal axis) and the Y axis (vertical axis). To do.
The holding frame 4512 is a member that stores and holds the liquid crystal panel 4511. As shown in FIG. 4, the holding frame main body 4512A having a rectangular shape in plan view disposed on the light beam incident side and the plan view disposed on the light beam emission side are disposed. And a rectangular light shielding plate 4512B.

As shown in FIG. 4A, the holding frame main body 4512A has an opening 4512A1 corresponding to the image forming area of the liquid crystal panel 4511 at a substantially central portion in plan view.
Further, in the holding frame main body 4512A, a concave portion corresponding to the outer shape (stepped shape) of the liquid crystal panel 4511 is formed on the peripheral portion of the opening 4512A1, on the light beam exit side, although not specifically illustrated. The liquid crystal panel 4511 is stored and held in the recess.
Further, in the holding frame main body 4512A, as shown in FIG. 4, the four corner portions are fixed to penetrate the light beam incident side end surface and the light beam emission side end surface to fix the light modulation device 451 to the optical element holding body 457. Holes 4512A2 are formed respectively.
Further, in the holding frame main body 4512A, a portion between the two fixing holes 4512A2 on the lower side (−Y-axis direction side) is formed with a recessed portion 4512A3 having a concave U shape on the upper side (+ Y-axis direction side). ing.
Further, in the holding frame main body 4512A, a concave portion 4512A4 having a rectangular shape in a plan view is formed at a substantially central portion in the Y-axis direction at both end edges (left and right end edges) in the X-axis direction, as shown in FIG. Further, as shown in FIG. 4, a hook 4512A5 for connecting to the light shielding plate 4512B is formed on the bottom surface portion of the recess 4512A4.

As shown in FIG. 4B, the light shielding plate 4512B is formed of a rectangular plate having an opening 4512B1 corresponding to the image forming region of the liquid crystal panel 4511 at a substantially central portion in plan view. Fixed to the light beam exit side. In this light-shielding plate 4512B, the light transmitted through the liquid crystal panel 4511 is reflected by the viewing angle compensation plate 453, the exit side polarizing plate 454, the cross dichroic prism 455, etc., and the liquid crystal panel 4511 malfunctions due to the drive unit of the liquid crystal panel 4511. To prevent that.
As shown in FIG. 4, the light shielding plate 4512B has substantially the same planar shape as the concave portion 4512A4 of the holding frame main body 4512A and is formed in the concave portion 4512A4 at the substantially central portion in the Y-axis direction at both ends of the X-axis direction. A hook engaging portion 4512B2 that engages with the hook 4512A5 is formed. The light shielding plate 4512B is fixed to the holding frame main body 4512A by engaging the hook engaging portion 4512B2 with the hook 4512A5.

As described above, in a state where the light shielding plate 4512B is fixed to the holding frame main body 4512A, both end surfaces in the X-axis direction (end surfaces excluding the recess 4512A4) of the holding frame main body 4512A and the outer surface of the hook engaging portion 4512B2 of the light shielding plate 4512B. Are substantially flush with each other, and both end surfaces 4512C and 4512D in the X-axis direction of the holding frame 4512 are in a flat shape parallel to the YZ plane. The X-axis direction both end faces 4512C and 4512D serve as optical element side connection portions to which the heat conducting member 458 is connected.
The holding frame 4512 described above is made of a material having thermal conductivity.
Examples of the material having thermal conductivity include invar and nickel-iron alloys such as 42Ni-Fe, magnesium alloys, aluminum alloys, carbon steel, stainless steel, and carbon fillers such as carbon fibers and carbon nanotubes. Examples include mixed resins (polycarbonate, polyphenylene sulfide, liquid crystal resin, and the like). As the holding frame 4512, the holding frame main body 4512A and the light shielding plate 4512B may be made of the same material or different materials. By configuring the holding frame 4512 with a material having thermal conductivity in this way, heat generated in the liquid crystal panel 4511 due to light beam irradiation can be efficiently radiated to the holding frame 4512.

As shown in FIG. 2 or FIG. 3, the support structure 456 is a member that has a substantially rectangular parallelepiped shape, places the cross dichroic prism 455 at a predetermined position on the upper surface, and supports the entire optical device main body 45A.
As shown in FIG. 2 or FIG. 3, the support structure 456 is formed with arm portions 4561 that extend outward from the four corner portions and connect to the component storage portion of the optical component casing 46. Yes. Then, by connecting the arm portion 4561 to the component storage portion of the optical component casing 46, the entire optical device main body 45A is fixed to the component storage portion.

The three optical element holders 457 are respectively disposed between the light modulation device 451 and the cross dichroic prism 455, and each of the first light modulation devices 451, each viewing angle compensation plate 453, and each first exit-side polarizing plate 454. These are members that respectively support the exit-side polarizing plates 4541 and fix them to the cross dichroic prism 455. As shown in FIG. 3, the optical element holder 457 includes a first support portion 4571 and a second support portion 4572.
As shown in FIG. 3, the first support portion 4571 is configured by a plate-like portion 4571A having a substantially rectangular shape in plan view, and a protruding portion 4571B that protrudes from both left and right edges of the plate-like portion 4571A toward the light beam incident side. The

As shown in FIG. 3, an opening 4571 </ b> A <b> 1 having a rectangular shape in plan view for transmitting a light beam is formed at a substantially central portion of the plate-like portion 4571 </ b> A.
As shown in FIG. 3, each protrusion 4571B is formed with three openings 4571B1 arranged in parallel along the vertical direction. As shown in FIG. 3, these openings 4571B1 have a rectangular shape in plan view extending along the protruding direction of each protruding portion 4571B.
And the 1st support part 4571 supports the 2nd support part 4572 in each protrusion part 4571B. In addition, the first support portion 4571 has a polarizing film 4542B inserted into the opening portion 4571A1 with respect to the second emission side polarizing plate 4542 fixed to the light beam incident side end surface of the cross dichroic prism 455, and the plate-like portion 4571A. The end surface on the light beam exit side is fixed to the end surface on the light beam entrance side of translucent substrate 4542A with an adhesive or the like.

The second support portion 4572 is a member that supports and fixes the light modulation device 451, the viewing angle compensation plate 453, and the first emission side polarization plate 4541 in the emission side polarization plate 454. As shown in FIG. 3, the second support portion 4572 includes a second support portion main body 4573 and a pair of urging members 4574.
As shown in FIG. 3, the second support portion main body 4573 is composed of a plate-like portion 4573A having a substantially rectangular shape in plan view, and a protruding portion 4573B that protrudes from both left and right edges of the plate-like portion 4573A toward the light beam emission side. And disposed between the protruding portions 4571B of the first support portion 4571.
As shown in FIG. 3, the plate-like portion 4573 </ b> A is formed with a notch 4573 </ b> A <b> 1 having a U-shape that is cut out from the lower edge toward the upper side in FIG. 3 and transmits a light beam. ing.
Further, in the plate-like portion 4573A, fixing holes 4573A2 for fixing the light modulation device 451 are respectively formed at the four corner portions as shown in FIG. Of the four fixing holes 4573A2, a pair of fixing holes 4573A2 are formed at diagonal positions, and the four fixing holes 4512A2 are formed at diagonal positions in the holding frame 4512 of the light modulation device 451. The light modulation device 451 is fixed to the second support portion main body 4573 by connecting the second support portion main body 4573 and the holding frame 4512 with each screw 459 (FIG. 3) through the pair of fixing holes 4512A2. Is done.

Further, in this plate-like portion 4573A, as shown in FIG. 3, the substantially central portion of the left and right edges protrudes toward the light beam exit side, and the tip portion in the protruding direction extends substantially parallel to the plate surface of the plate-like portion 4573A. Connection portions 4573A3 that are connected to the respective protrusions 4573B are formed at the tip portions.
Further, in this plate-like portion 4573A, each corner portion at the upper side end portion in FIG. 3 protrudes toward the light beam exit side, and the viewing angle compensator 453 is supported by the second support portion 4572, A first position restricting portion 4573A4 that abuts the upper end portion of the angle compensating plate 453 and restricts the position of the viewing angle compensating plate 453 in the vertical direction is formed.

As shown in FIG. 3, each protrusion 4573B is bent so that the tip end portion 4573B1 is substantially parallel to the plate-like portion 4573A, and extends in a direction close to each other.
Further, in each of the tip portions 4573B1, the first exit-side polarized light is projected at the lower end portion in FIG. 3 in the state where the first exit-side polarization plate 4541 is supported by the second support portion 4572 at the light incident side. A second position restricting portion 4573B3 that abuts the lower end portion of the plate 4541 and restricts the position of the first emission side polarizing plate 4541 in the vertical direction is formed.
Also, on the outer surface of the base end portion 4573B2 of each protrusion 4573B, there are three convex portions 4573B4 arranged in parallel in the vertical direction corresponding to the respective openings 4571B1 of the first support portion 4571 as shown in FIG. Is formed. And these convex part 4573B4 is fitted in each opening part 4571B1 in a loose-fit state, when the 2nd support part 4572 is arrange | positioned between each protrusion part 4571B of the 1st support part 4571. With such a configuration, each convex portion 4573B4 (second support portion 4572) can be slid with respect to each opening portion 4571B1 (first support portion 4571), that is, fixed to the second support portion 4572. Further, the light modulator 451 (liquid crystal panel 4511) is moved in the direction of approaching and separating from the cross dichroic prism 455 to enable focus adjustment.

  As shown in FIG. 3, the pair of urging members 4574 is configured by a leaf spring, and includes a base portion 4574A located at a substantially central portion, and a pair of extending portions 4574B extending from the base portion 4574A in a substantially C shape. Each is provided. The pair of urging members 4574 are disposed between the viewing angle compensation plate 453 and the first emission side polarizing plate 4541, and the base portion 4574A is in contact with the light beam emission side end surface of the viewing angle compensation plate 453, so that the pair of extension members The leading end portion of the exit portion 4574B comes into contact with the light beam incident side end surface of the first exit-side polarizing plate 4541, and biases the viewing angle compensation plate 453 and the first exit-side polarizing plate 4541 away from each other.

The second support portion 4572 described above supports and fixes the viewing angle compensation plate 453 and the first emission side polarizing plate 4541 as described below.
That is, in the space surrounded by the plate-like portion 4573A and the protrusions 4573B in the second support portion main body 4573, the viewing angle compensation plate 453 with the optical compensation film 4532 facing the light beam incident side, the pair of biasing members 4574, In addition, a first exit-side polarizing plate 4541 with the polarizing film facing the light beam exit side is disposed. In this state, the viewing angle compensation plate 453 is pressed toward the light beam incident side by the urging force of the pair of urging members 4574, and the light beam incident side end surface of the translucent substrate 4531 in the viewing angle compensation plate 453 is the second support portion 4572. Is in contact with the end surface of the light emission side of the plate-like portion 4573A. Further, the first emission side polarizing plate 4541 is pressed to the light emission side by the urging force of the pair of urging members 4574, and the light emission side end surface of the light transmitting substrate 4541A in the first emission side polarizing plate 4541 is the second support. It abuts on each tip portion 4573B1 of each protrusion 4573B in the portion 4572. As described above, the viewing angle compensation plate 453 and the first exit-side polarizing plate 4541 are supported and fixed to the second support portion 4572 by the urging force of the pair of urging members 4574.

As shown in FIG. 2 or FIG. 3, the three heat conducting members 458 are members that are connected to the three light modulation devices 451 so as to be able to transfer heat, and dissipate heat generated in the light modulation device 451 by irradiation of light beams. . The heat conducting member 458 is formed in a tubular shape having a capillary structure (wick) inside, and a refrigerant is accommodated inside the tube, and the refrigerant recirculates inside the tube, whereby heat transfer in the heat conducting member 458 is performed. It is comprised with what is called a heat pipe.
Here, although not specifically shown, the capillary structure of the heat conducting member 458 is configured by a powdery sintered wick. Moreover, water is adopted as the refrigerant. The capillary structure is not limited to a sintered wick, but other wicks, for example, an ultra-fine wire wick composed of a plurality of thin copper wires, a mesh-like metal mesh wick, or a plurality of wicks inside a tube. It may be configured as a groove type wick in which a groove is formed. Further, the refrigerant is not limited to water, and other refrigerants such as alcohol may be employed.

FIG. 5 is a perspective view showing a connection structure of the heat conducting member 458 to the light modulation device 451. In FIG. 5, for convenience of explanation, the optical axis of the light beam emitted from the light modulation device 451 is the Z axis, and two axes orthogonal to the Z axis are the X axis (horizontal axis) and the Y axis (vertical axis). To do.
As shown in FIG. 5, the heat conducting member 458 is subjected to press working, and corresponds to the outer shape of the light modulation device 451 along the −Y-axis direction side end surface of the light modulation device 451 in the X-axis direction. And a pair of extending portions 458B and 458C extending in the Y-axis direction along both end surfaces in the X-axis direction of the light modulation device 451 so as to have a U-shape in plan view. In addition to being bent, the U-shaped inner end surface is formed in a rectangular shape in cross section corresponding to the optical element side connection portions 4512C and 4512D of the light modulation device 451 so as to be flat parallel to the YZ plane. Further, as shown in FIG. 5, the heat conducting member 458 has a separation dimension (separation dimension in the X-axis direction) between the pair of extending portions 458B and 458C substantially the same as the outer dimension in the X-axis direction in the light modulation device 451. And the length of the pair of extending portions 458B and 458C in the extending direction (Y-axis direction) is longer than the outer dimension in the Y-axis direction of the light modulator 451. ing. In the heat conducting member 458, the opposing surfaces 4581B and 4581C of the pair of extending portions 458B and 458C that are opposed to each other serve as a heat conducting member side connecting portion that is connected to the light modulation device 451 so that heat can be transferred.

  Then, the light modulation device 451 is fitted into the U-shaped inner portion of the heat conducting member 458 (a state in which the end portion on the −Y-axis direction side of the light modulation device 451 is in contact with the base end portion 458A). The optical element side connection parts 4512C and 4512D of 451 and the heat conduction member side connection parts 4581B and 4581C of the heat conduction member 458 are in surface contact, and the light modulation device 451 and the heat conduction member 458 are connected to each other so that heat can be transferred. Here, as a connection structure of the heat conducting member 458 and the light modulation device 451, for example, a configuration in which the optical element side connecting portions 4512C and 4512D and the heat conducting member side connecting portions 4581B and 4581C are connected by soldering or the like. You may employ | adopt the structure etc. which adhere and fix by the structure or the adhesive agent which has heat conductivity. By adopting such a configuration, it is possible to connect the micro-level non-contact portions caused by the surface roughness between the optical element side connection portions 4512C and 4512D and the heat conducting member side connection portions 4581B and 4581C so that heat can be transferred.

Next, a heat radiating structure for heat generated in the liquid crystal panel 4511 due to light beam irradiation will be described.
As described above, in a state where the heat conducting member 458 and the light modulation device 451 are connected so as to be able to transfer heat, heat generated in the liquid crystal panel 4511 by irradiation of the light flux is radiated as described below.
For example, the heat generated in the liquid crystal panel 4511 moves in the X-axis direction toward the optical element side connection portions 4512C and 4512D that are connected to the heat conducting member 458 so as to be able to transfer heat, as indicated by an arrow R1 in FIG. It is transmitted to the holding frame 4512.
As shown by an arrow R1 in FIG. 5, the heat transmitted to the holding frame 4512 is connected to the holding frame 4512 of the heat conducting member 458 through the heat conducting member side connection portions 4581B and 4581C so as to be able to conduct heat. 458B and 458C are transmitted to a substantially central portion in the Y-axis direction.
Here, inside the substantially central portion in the Y-axis direction of the pair of extending portions 458B and 458C, the refrigerant is heated and evaporated by the transmitted heat to vaporize, and at this time, heat is taken in as latent heat (vaporization heat). . That is, the approximately center part in the Y-axis direction of the pair of extending portions 458B and 458C functions as the evaporation portions 4582A and 4582B in the heat conducting member 458.

The vaporized refrigerant becomes a vapor flow, and as shown by an arrow R1 in FIG. 5, a pair of extending portions 458B of the heat conducting member 458 on the low temperature side (side away from the respective evaporation portions 4582A and 4582B). It moves to each distal end portion of 458C and the proximal end portion 458A. Then, the refrigerant that has moved to the distal end portions of the pair of extending portions 458B and 458C and the base end portion 458A is cooled and liquefied to release heat (heat release by condensation latent heat). That is, each distal end portion and base end portion 458A of the pair of extending portions 458B and 458C function as condensing portions 4583A, 4583B, and 4584 in the heat conducting member 458. In addition, the refrigerant liquefied in the condensing units 4583A, 4583B, and 4584 returns to the evaporation units 4582A and 4582B again through the capillary structure (wick).
As described above, the heat generated in the liquid crystal panel 4511 follows the heat transfer path of the liquid crystal panel 45111 to the holding frame 4512 to the heat conducting member 458 as shown by an arrow R1 in FIG. Heat is transferred from the condensation units 4583A, 4583B, 4584 to the outside by heat transfer from the 4582B to the condensation units 4583A, 4583B, 4584.

The first embodiment described above has the following effects.
In the present embodiment, the heat conducting member 458 is formed of a heat pipe and is connected to the light modulation device 451 so that heat can be transferred. As a result, compared to the conventional configuration, the heat conducting member 458 is directly connected to the light modulating device 451 without passing air between it and the light modulating device 451. The thermal resistance in the heat transfer path of the member 458 can be reduced.
In addition, the light modulation device 451 and the heat conducting member 458 have shapes in which respective connecting portions (optical element side connecting portions 4512C and 4512D and heat conducting member side connecting portions 4581B and 4581C) connected to each other are in surface contact. Accordingly, the contact area between the light modulation device 451 and the heat conducting member 458 can be increased, and the heat transfer characteristics from the light modulation device 451 to the heat conducting member 458 can be improved.
Therefore, the light modulation device 451 can be effectively cooled, the temperature rise of the light modulation device 451 can be suppressed, and thermal deterioration of the light modulation device 451 (liquid crystal panel 4511) can be effectively prevented. That is, the projection image from the projector 1 can be maintained well and the life can be extended.

  In the present embodiment, the light modulation device 451 and the heat conducting member 458 are connected so that their outer surfaces can transfer heat. The heat conducting member side connection portions 4581B and 4581C formed on the outer surface of the heat conducting member 458 are formed by pressing so as to match the shape of the outer surface (optical element side connection portions 4512C and 4512D) of the light modulation device 451. Yes. As a result, for example, the outer surface of the heat conducting member (for example, a heat pipe having a circular cross-sectional view) is used as the heat conducting member side connecting portion, and the optical element side connecting portion is formed so as to match the shape of the outer surface of the heat pipe. Thus, by simply pressing the heat conducting member 458, a structure in which the connecting portions (the optical element side connecting portions 4512C and 4512D and the heat conducting member side connecting portions 4581B and 4581C) of the light modulation device 451 and the heat conducting member 458 are brought into surface contact is realized. In addition, with the simple configuration, it is possible to effectively cool the light modulation device 451 described above, and it is possible to suitably achieve the effect of suppressing the temperature rise of the light modulation device 451 and effectively preventing thermal degradation of the light modulation device 451. .

  Further, in the present embodiment, the heat conducting member 458 is formed in a U-shape in plan view having a base end portion 458A and a pair of extending portions 458B, 458C, and each heat conducting member side connection to the pair of extending portions 458B, 458C. Portions 4581B and 4581C are formed. The heat conducting member 458 is capable of transferring heat to the optical element side connecting portions 4512C and 4512D in the light modulation device 451 at the heat conducting member side connecting portions 4581B and 4581C formed in the pair of extending portions 458B and 458C, respectively. Connecting. Thereby, for example, in the heat conducting member 458, compared to a configuration in which the heat conducting member (heat pipe) is connected to only one side end of each side end of the light modulation device 451 so that heat can be transferred, The refrigerant recirculation path inside the pipe is formed by connecting a part of each of the evaporating parts 4582A and 4582B of the extending parts 458B and 458C and a condensing part 4583A, 4583B and 4584 on the side away from each of the evaporating parts 4582A and 4582B. A plurality of paths (four paths in the present embodiment) between them, the amount of heat transfer inside the tube can be increased, the above-described light modulation device 451 can be effectively cooled, and light modulation is performed. The effect of suppressing the temperature rise of the device 451 and effectively preventing the thermal deterioration of the light modulation device 451 can be achieved more suitably. Further, in order to effectively cool the light modulation device 451, for example, a configuration in which two heat conducting members (heat pipes) are connected to the optical element side connection portions 4512C and 4512D of the light modulation device 451 so as to be able to transfer heat, respectively. Though conceivable, since the light modulation device 451 can be effectively cooled by the single heat conducting member 458 in the configuration of the present embodiment, the structure of the optical device main body 45A can be simplified, and the cost of the optical device main body 45A can be reduced. As a result, the cost of the projector 1 can be reduced.

In the present embodiment, the capillary structure of the heat conducting member 458 is formed of a sintered wick. Accordingly, it is not necessary to use gravity for the movement of the refrigerant, and the arrangement positions of the condensing units 4583A, 4583B, 4584 and the evaporating units 4582A, 4582B are not limited. For this reason, for example, in the projector 1, the heat transfer in the heat conducting member 458 corresponds to all the posture states of the projector 1 such as a normal posture, a ceiling suspension posture, and a tilted state for adjusting the position of the projected image. The light modulation device 451 described above can be effectively cooled and effectively cooled, and the temperature rise of the light modulation device 451 can be suppressed to effectively suppress the thermal deterioration of the light modulation device 451.
Further, since the capillary structure of the heat conducting member 458 is composed of a sintered wick, the evaporation parts 4582A and 4582B are compared with other wicks (extra fine wire wick, metal mesh wick, groove wick, etc.) The heat resistance with the condensing units 4583A, 4583B, and 4584 is sufficiently low, and since the heat conductivity of the wick itself is good, the heat can be transferred to the refrigerant well, and the heat transfer in the heat conducting member 458 Can be performed more quickly, and the cooling efficiency of the light modulation device 451 can be further improved.

[Second Embodiment]
Next, 2nd Embodiment of this invention is described based on drawing.
In the following description, the same structure and the same members as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted or simplified.
FIG. 6 is a perspective view showing the structure of the heat conducting member 558 and the connection structure between the heat conducting member 558 and the light modulation device 451 in the second embodiment. In FIG. 6, for convenience of explanation, the optical axis of the light beam emitted from the light modulation device 451 is the Z axis, and two axes orthogonal to the Z axis are the X axis (horizontal axis) and the Y axis (vertical axis). To do.
This embodiment is different from the first embodiment only in the structure of the heat conducting member 558 as shown in FIG. Other configurations are the same as those in the first embodiment.

Similar to the heat conducting member 458 described in the first embodiment, the heat conducting member 558 is configured by a heat pipe. As shown in FIG. 6, a pair of extending members is formed with respect to the heat conducting member 458 shown in FIG. 5. The only difference is that the tips of the projecting portions 458B and 458C are connected to each other and have an annular shape.
As shown in FIG. 6, the heat conducting member 558 is subjected to press working, and has a rectangular shape in plan view surrounding the outer peripheral side end of the light modulation device 451 corresponding to the outer shape of the light modulation device 451. In addition to being bent so as to have a shape, the inner end face of the annular shape corresponding to the optical element side connection portions 4512C and 4512D of the light modulation device 451 is formed in a rectangular shape in a sectional view that is flat and parallel to the YZ plane. Yes. Further, as shown in FIG. 6, the heat conducting member 558 is formed so that the length dimension in the X-axis direction of the annular inner portion is substantially the same as the outer dimension in the X-axis direction in the light modulator 451, The length dimension in the Y-axis direction is formed to be longer than the outer dimension in the Y-axis direction of the light modulator 451. In the heat conducting member 558, the opposing surfaces 5581B and 5581C facing each other in the X-axis direction on the annular inner end surface serve as heat conducting member side connecting portions that are connected to the light modulation device 451 so that heat can be transferred.

  Then, the light modulation device 451 is fitted to the annular inner portion of the heat conducting member 558 (the −Y axial direction end of the light modulating device 451 is brought into contact with the −Y axial direction portion of the annular inner portion of the heat conducting member 558. State), the optical element side connection portions 4512C and 4512D of the light modulation device 451 and the heat conduction member side connection portions 5581B and 5581C of the heat conduction member 558 are in surface contact, and the light modulation device 451 and the heat conduction member 558 can transfer heat to each other. Connect to. Here, as the connection structure of the heat conducting member 558 and the light modulation device 451, for example, the optical element side connecting portions 4512C and 4512D and the heat conducting member side connecting portions 5581B and 5581C are connected by soldering or the like, as in the first embodiment. You may employ | adopt the structure connected, the structure connected by welding, or the structure which adheres and fixes with the adhesive agent which has heat conductivity.

Next, a heat radiating structure for heat generated in the liquid crystal panel 4511 due to light beam irradiation will be described.
The heat dissipation structure in the second embodiment is substantially the same as the heat dissipation structure described in the first embodiment, and the differences are as follows.
In the present embodiment, as described above, the heat conducting member 558 has a ring shape in which the tip portions of the pair of extending portions 458B and 458C are connected to the heat conducting member 458 described in the first embodiment. Therefore, as shown in FIG. 6, the Y-axis direction of the portions extending in the Y-axis direction in parallel with each other (the portions corresponding to the pair of extending portions 458B and 458C described in the first embodiment) The substantially central portion functions as the evaporation units 5582A and 5582B, and each part located between the evaporation units 5582A and 5582B on the low temperature side (side away from the evaporation units 5582A and 5582B) (described in the first embodiment). A portion corresponding to each distal end portion of the pair of extending portions 458B and 458C, a portion corresponding to the base end portion described in the first embodiment, and a portion extending along the X-axis direction on the + Y-axis direction side). Clump Section 5583A, 5583B, to function as 5584,5585.
Then, the heat generated in the liquid crystal panel 4511 follows the heat transfer path of the liquid crystal panel 4511 to the holding frame 4512 to the heat conducting member 558 and is condensed from the evaporation parts 5582A and 5582B in the heat conducting member 558 as indicated by an arrow R2 in FIG. Heat is transferred from the condensers 5583A, 5583B, 5584, and 5585 to the outside by heat transfer to the parts 5583A, 5583B, 5584, and 5585.

The second embodiment described above has the following effects in addition to the same effects as those of the first embodiment.
In the present embodiment, the heat conducting member 558 is formed in an annular shape that surrounds the outer peripheral end of the light modulation device 451. Thus, in the heat conducting member 558, the evaporation units 5582A, 5582B and the condensing units 5583A, 5583B, 5584 corresponding to the evaporation units 4582A, 4582B and the condensing units 4583A, 4583B, 4584 in the heat conducting member 458 described in the first embodiment. In addition, a condensing unit 5585 extending along the X-axis direction on the + Y-axis direction side can be provided. That is, in the heat conducting member 558, compared to the heat conducting member 458 described in the first embodiment, the area of the condensing part that dissipates heat is increased to increase the heat dissipating area, and between the evaporation part and the condensing part. The temperature difference can be set large, and the amount of heat transfer inside the tube can be increased. Therefore, the light modulation device 451 can be cooled more effectively.

[Third embodiment]
Next, 3rd Embodiment of this invention is described based on drawing.
In the following description, the same structure and the same members as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted or simplified.
FIG. 7 is a perspective view showing the structure of the heat conducting member 658 and the connection structure between the heat conducting member 658 and the light modulation device 451 in the third embodiment.
FIG. 8 is a cross-sectional view schematically showing the structure of the heat conducting member 658.
This embodiment is different from the first embodiment only in the structure of the heat conducting member 658 as shown in FIG. 7 or FIG. Other configurations are the same as those in the first embodiment.

As shown in FIG. 7 or 8, the heat conducting member 658 includes a heat pipe 6581 and an outer frame body 6582.
The heat pipe 6581 is a heat pipe having the same function as the heat conducting member 458 described in the first embodiment, and has a substantially circular cross section as shown in FIG. 7 or FIG. A base end portion extending along the −Y-axis direction side end surface of the light modulation device 451 and a pair of extension portions extending along both end surfaces in the X-axis direction of the light modulation device 451 corresponding to the outer shape. It is bent so as to have a U-shape in plan view. Further, the heat pipe 6581 is not specifically illustrated, but the separation dimension (separation dimension in the X-axis direction) of the pair of extending portions is longer than the outer dimension in the X-axis direction of the light modulator 451. And the length dimension in the extending direction (Y-axis direction) of the pair of extending portions is longer than the outer dimension in the Y-axis direction of the light modulator 451.

The outer frame body 6582 is made of a material having thermal conductivity, and as shown in FIG. 7 or FIG. 8, is connected to the outer peripheral surface so as to be able to transfer heat so as to cover the outer peripheral surface of the heat pipe 6581. Further, as shown in FIG. 7, the outer frame body 6582 has a base end portion 658A extending along the X-axis direction corresponding to the shape of the heat pipe 6581 and a pair of members extending along the Y-axis direction. It is formed so as to have a U-shape in plan view having the extending portions 658B and 658C. Note that the material of the outer frame body 6582 may be any material as long as it has thermal conductivity. For example, the same material as that of the holding frame 4512 of the light modulation device 451 can be adopted.
As shown in FIG. 8, the outer frame body 6582 includes a first outer frame body 6582A and a second outer frame body 6582B which are divided into two bodies, and the first outer frame body 6582A and the second outer frame body 6582A. The frame bodies 6582B are connected to each other so that heat can be transferred to the outer peripheral surface of the heat pipe 6581.

  More specifically, the first outer frame body 6582A is formed on the end surface on the −Y-axis direction side and on the both end surfaces in the X-axis direction of the light modulation device 451 by press working or injection molding or the like corresponding to the outer shape of the light modulation device 451. A cross-sectional view in which the U-shaped inner end surface is formed in a flat shape parallel to the YZ plane corresponding to the optical element side connection portions 4512C and 4512D of the light modulation device 451. It is formed in a substantially rectangular shape. Further, as shown in FIG. 8, a concave curved surface 6582A1 having a circular arc shape in section corresponding to the outer surface of the heat pipe 6581 is formed on the end surface in the + Z-axis direction of the first outer frame body 6582A. Further, in the first outer frame body 6582A, as shown in FIG. 7, the separation dimension (separation dimension in the X-axis direction) of the pair of extending portions 658B and 658C is substantially the same as the outer dimension in the X-axis direction in the light modulator 451. The lengths in the extending direction (Y-axis direction) of the pair of extending portions 658B and 658C are made longer than the outer dimensions in the Y-axis direction of the light modulator 451. Is formed. Further, the second outer frame body 6582B is also formed in the same manner as the first outer frame body 6582A, and corresponds to the outer surface of the heat pipe 6581 as shown in FIG. A concave curved surface 6582B1 having a circular arc shape in section is formed.

  Then, by combining the first outer frame body 6582A and the second outer frame body 6582B with each other, a cylindrical space is formed by the concave curved surfaces 6582A1, 6582B1, and the heat pipe 6581 can be disposed in the space. In a state where the first outer frame body 6582A and the second outer frame body 6582B are combined with each other so that the heat pipe 6581 is disposed in the space, the concave curved surfaces 6582A1, 6582B1 and the outer surface of the heat pipe 6581 are in surface contact. The heat pipe 6581 and the outer frame body 6582 are connected to each other so as to be able to transfer heat. Here, as a connection structure between the heat pipe 6581 and the outer frame body 6582, for example, a structure in which the outer surface of the heat pipe 6581 and each concave curved surface 6582A1, 6582B1 are connected by solder or the like, a structure in which welding is performed, or a heat You may employ | adopt the structure etc. which adhere and fix with the adhesive agent which has electroconductivity. By adopting such a configuration, it is possible to connect the non-contact portion at the micro level generated by the surface roughness between the outer surface of the heat pipe 6581 and the concave curved surfaces 6582A1 and 6582B1 so that heat can be transferred.

Further, as described above, when the first outer frame body 6582A and the second outer frame body 6582B are combined with each other, the U-shaped inner end face of the first outer frame body 6582A and the U-shaped inner side of the second outer frame body 6582B. The end face is substantially flush with the U-shaped inner end face of the outer frame body 6582 and has a flat shape parallel to the YZ plane. In the heat conducting member 658, the opposing surfaces 6582C1 and 6582C2 (FIG. 7) of the pair of extending portions 658B and 658C in the outer frame body 6582 are connected to the light modulation device 451 so as to be able to transfer heat to the light modulating device 451. It becomes.
Then, the light modulation device 451 is fitted into the U-shaped inner portion of the heat conducting member 658 (a state in which the end portion on the −Y-axis direction side of the light modulation device 451 is in contact with the base end portion 658A). The optical element side connection parts 4512C and 4512D of 451 and the heat conduction member side connection parts 6582C1 and 6582C2 of the heat conduction member 658 are in surface contact, and the light modulation device 451 and the heat conduction member 658 are connected to each other so as to be able to transfer heat. Here, as the connection structure of the heat conducting member 658 and the light modulation device 451, for example, the optical element side connecting portions 4512C and 4512D and the heat conducting member side connecting portions 6582C1 and 6582C2 are soldered or the like, as in the first embodiment. You may employ | adopt the structure which adheres and fixes, the structure connected by welding, or the structure which adheres and fixes with the adhesive agent which has heat conductivity.

Next, a heat radiating structure for heat generated in the liquid crystal panel 4511 due to light beam irradiation will be described.
The heat dissipation structure in the third embodiment is different from the heat dissipation structure described in the first embodiment in that an outer frame body 6582 is interposed in the heat transfer path of the holding frame 4512 to the heat pipe 6581. Only. That is, the heat generated in the liquid crystal panel 4511 follows the heat transfer path of the liquid crystal panel 4511 to the holding frame 4512 to the outer frame body 6582 to the heat pipe 6581 as indicated by an arrow R3 in FIG. The heat is transferred from the condensers 6584A, 6584B, 6585 to the outside by heat transfer from the evaporators 6583A, 6583B to the condensers 6584A, 6584B, 6585 in 6581).

The third embodiment described above has the following effects in addition to the same effects as those of the first embodiment.
In this embodiment, the heat conducting member 658 includes a heat pipe 6581 and an outer frame body 6582, and is in surface contact with the light modulation device 451 in a state where the outer frame body 6582 is disposed between the heat pipe 6581 and the light modulation device 451. To do. Accordingly, as compared with the heat conducting member 458 described in the first embodiment, the outer frame body 6582 is disposed between the light modulation device 451 and the heat pipe 6581, so that the heat pipe 6581 is pressed or the like. It is only necessary to process the heat conducting member side connection portions 6582C1 and 6582C2 on the outer surface of the outer frame body 6582 into a shape that matches the shape of the outer surface (optical element side connection portions 4512C and 4512D) of the light modulation device 451. The light modulation device 451 can be effectively cooled while maintaining the characteristics of the heat pipe 6581 well, and the temperature rise of the light modulation device 451 is suppressed and the thermal deterioration of the light modulation device 451 (liquid crystal panel 4511) is effectively performed. It is possible to suitably achieve the effect that it can be prevented.
In addition, since the outer frame body 6582 is divided into two bodies of a first outer frame body 6582A and a second outer frame body 6582B, attachment to the heat pipe 6581 can be easily performed.

[Fourth embodiment]
Next, 4th Embodiment of this invention is described based on drawing.
In the following description, the same structure and the same members as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted or simplified.
9 and 10 are diagrams showing the structure of the heat conducting member 758 and the connection structure between the heat conducting member 758 and the liquid crystal panel 4511 in the fourth embodiment. Specifically, FIG. 9A is a perspective view seen from the light beam incident side. FIG. 9B is a perspective view seen from the light beam exit side. FIG. 10A is a cross-sectional view seen from the side. FIG. 10B is a cross-sectional view as viewed from above. 9 and 10, for convenience of explanation, the optical axis of the light beam emitted from the liquid crystal panel 4511 is a Z axis, and two axes orthogonal to the Z axis are an X axis (horizontal axis) and a Y axis (vertical axis). ).
As shown in FIG. 9 or FIG. 10, the present embodiment differs from the first embodiment in the structure of the heat conducting member 758, the holding frame 4512 in the light modulation device 451 is omitted, and the heat conducting member 758 is optical. The only difference is that the liquid crystal panel 4511 as an element is held and fixed, and the liquid crystal panel 4511 can be disposed at a predetermined position. Other configurations are the same as those in the first embodiment.

The heat conducting member 758 is constituted by a heat pipe, similar to the heat conducting member 458 described in the first embodiment.
As shown in FIG. 9, the heat conducting member 758 is subjected to press working, and thus, a base end portion that extends along the + Y-axis direction side end surface of the liquid crystal panel 4511 corresponding to the outer shape of the liquid crystal panel 4511. 758A and a pair of extending portions 758B and 758C extending along both end faces in the X-axis direction of the liquid crystal panel 4511 are bent so as to have a U-shape in plan view.
Further, the heat conducting member 758 is subjected to press working, so that the outer surface on the −Z axis direction side (light beam incident side) is formed flat as shown in FIG. 9A. The flat outer surface 7581 functions as a support surface that supports an optical element (for example, the incident-side polarizing plate 452) disposed on the upstream side of the optical path.
Furthermore, as shown in FIG. 10, the heat conducting member 758 has a U-shaped peripheral portion corresponding to the outer shape of the liquid crystal panel 4511 as shown in FIG. A concave portion 7582 having a U-shape in a plan view that is recessed toward the Z-axis direction is formed. More specifically, as shown in FIG. 10, the recess 7582 has a shape corresponding to the outer shape of the counter substrate 4511B and the dustproof glass 4511E of the liquid crystal panel 4511, and the liquid crystal panel 4511 is opposed to the recess 7582. The substrate 4511B and the dust-proof glass 4511E are configured to be fitted in a loosely fitted state. Further, the bottom surface portion of the recess 7582 is formed flat as shown in FIG. In the heat conducting member 758, the bottom surface portion 7582A of the recess 7582 serves as a heat conducting member side connecting portion that is connected to the liquid crystal panel 4511 so that heat can be transferred.

Then, the light incident side end surface 4511E1 (optical element side connecting portion) of the dust-proof glass 4511E in the liquid crystal panel 4511 and the heat conducting member of the heat conducting member 758 are brought into contact with the concave portion 7582 of the heat conducting member 758. The side connection portion 7582A is in surface contact, and the liquid crystal panel 4511 and the heat conducting member 758 are connected to each other so that heat can be transferred. Here, the optical element side connection portion 4511E1 and the heat conducting member side connection portion 7582A are bonded and fixed with an adhesive having thermal conductivity. By bonding and fixing in this way, it is possible to connect a micro-level non-contact portion generated by the surface roughness between the optical element side connection portion 4511E1 and the heat conducting member side connection portion 7582A so that heat can be transferred.
That is, by making the heat conducting member 758 the structure described above, the liquid crystal panel 4511 is directly held and fixed, and for example, by fixing the heat conducting member 758 at a predetermined position with respect to the optical element holder 457, the liquid crystal panel 4511 is fixed at a predetermined position. Or by fixing the heat conducting member 758 inside the optical component casing 46, the liquid crystal panel 4511 can be disposed at a predetermined position.

Next, a heat radiating structure for heat generated in the liquid crystal panel 4511 due to light beam irradiation will be described.
The heat dissipation structure in the fourth embodiment is different from the heat dissipation structure described in the first embodiment only in that the holding frame 4512 is omitted in the heat transfer path of the liquid crystal panel 4511 to the heat conducting member 758. is there. That is, the heat generated in the liquid crystal panel 4511 follows the heat transfer path of the liquid crystal panel 45111 to the heat conducting member 758 as indicated by an arrow R4 in FIG. 9A, and is condensed from the evaporation parts 7583A and 7583B in the heat conducting member 758. By heat transfer to 7584A, 7584B, and 7585, heat is radiated to the outside from the condensing portions 7584A, 7584B, and 7585.

The fourth embodiment described above has the following effects in addition to the same effects as those of the first embodiment.
In the present embodiment, the heat conducting member 758 has a U-shape in plan view having a base end portion 758A and a pair of extending portions 758B and 758C, and a bottom surface portion (heat conducting portion) of the concave portion 7582 formed on the U-shaped inner peripheral edge. The liquid crystal panel 4511 is held and fixed by the member side connection portion 7582A), and the liquid crystal panel 4511 can be disposed at a predetermined position. That is, the holding frame 4512 can be omitted from the light modulation device 451 described in the first embodiment, and the heat conducting member 758 itself can have a function as a holding frame for holding the liquid crystal panel 4511. Therefore, the holding frame 4512 can be omitted, the structure of the optical device main body 45A can be simplified, the cost of the optical device main body 45A can be reduced, and consequently the cost of the projector 1 can be reduced.
Further, since the holding frame 4512 can be omitted, the heat generated in the liquid crystal panel 4511 can be directly radiated to the heat conducting member 758 without using the holding frame 4512, and the heat transfer characteristics between the liquid crystal panels 45111 to 758 are improved. The cooling efficiency of the liquid crystal panel 4511 can be improved.

It should be noted that the present invention is not limited to the above-described embodiments, and modifications, improvements, and the like within the scope that can achieve the object of the present invention are included in the present invention.
In each of the above embodiments, the configuration in which the light modulation device 451 and the liquid crystal panel 4511 are cooled using the heat conducting members 458, 558, 658, and 758 has been described. However, the present invention is not limited to this, and other optical elements such as polarization conversion are used. The element 423, the incident side polarizing plate 452, the emission side polarizing plate 454, and the like may be cooled.
In each of the above embodiments, the heat conducting members 458, 558, 658, and 758 are formed to have a U-shape or a ring shape in plan view, but the heat conducting members 458, 558, 658, and 758 face the holding frame 4512 and the liquid crystal panel 4511 of the light modulator 451. Any shape may be used as long as it is connected so that heat can be transferred in contact.
In each of the above embodiments, the optical element side connection portions 4512C and 4512D and the heat conducting member side connection portions 4581B, 4581C, 5581B, 5581C, 6582C1, 6582C2, and 7582A are formed in a flat shape. You may form in a shape, a curved surface shape, or uneven | corrugated shape.

  In each of the embodiments, the optical element side connection portion is the outer surface of the holding frame 4512 or the liquid crystal panel 4511 of the light modulation device 451, and the heat conducting member side connection portions 4581B, 4581C, 5581B, 5581C, 6582C1, and the outer surface are matched. 6582C2 and 7582A were formed, but the present invention is not limited to this. For example, the outer surface of the heat pipe having a circular shape in plan view is used as a heat conduction member side connection portion, and the light modulation device holding frame or the like is matched with the outer surface of the heat pipe. You may form an optical element side connection part in a liquid crystal panel. Further, the optical element side connecting portion and the heat conducting member side connecting portion that are in surface contact with each other may be formed on the holding frame of the light modulation device, the liquid crystal panel, and the heat conducting member.

FIG. 11 and FIG. 12 are diagrams showing a modification of the first embodiment.
In the first embodiment, the heat conducting member 458 is formed in a substantially rectangular shape in cross section by pressing, but the opposing surfaces 4581B and 4581C of the pair of extending portions 458B and 458C facing each other are planar. If formed, the cross-sectional shape is not particularly limited. For example, as shown in FIG. 11, the heat conducting member 458 may be formed in a substantially triangular shape in cross section by pressing, or the heat conducting member 458 may be formed in a semicircular shape in cross sectional view by pressing.
In the third embodiment, the outer frame body 6582 is formed in a rectangular shape in cross section, but the opposing surfaces 6582C1, 6582C2 of the pair of extending portions 658B, 658C facing each other are formed in a planar shape. In this case, the cross-sectional shape is not particularly limited, and may be formed to have a triangular shape in cross-sectional view or a semicircular shape in cross-sectional view as described above.

  In the fourth embodiment, the heat conducting member 758 is formed so as to have a U-shape in plan view. However, the heat conducting member 758 may have a shape along at least a part of the outer peripheral edge of the liquid crystal panel 4511. Similarly to the heat conducting member 558 described in the second embodiment, it may be formed to have an annular shape. In addition, the space between the side surfaces of the dust-proof glass 4511E and the counter substrate 4511B and the recess 7582 in the liquid crystal panel 4511 may be filled with an adhesive having thermal conductivity to increase the heat transferable area.

FIG. 13 is a diagram showing a modification of each of the embodiments.
In the present invention, any structure may be used as long as the heat conducting member and the holding frame of the light modulation device or the liquid crystal panel are connected so as to be able to transfer heat in a state of surface contact with each other. For example, the following structure may be adopted.
For example, as shown in FIG. 13A, a notch 4512A ′ corresponding to a heat conducting member (heat pipe) 458 ′ having a circular shape in cross section is formed at the side end of the holding frame 4512 ′ constituting the light modulation device 451 ′. Form it. Then, as shown by a broken line in FIG. 13A, the tip portion of the notch 4512A ′ is bent by heat caulking, and the inner wall surface of the notch 4512A ′ is brought into surface contact with the outer surface of the heat conducting member 458 ′ and connected.
Further, for example, as shown in FIG. 13B, a heat conducting member (heat pipe) 458 ″ having a circular shape in section is inserted into the side end portion side of the holding frame 4512 ″ constituting the light modulation device 451 ″. A possible insertion hole 4512A ″ is formed. Then, as shown by the broken line in FIG. 13B, the heat conducting member 458 ″ is heated while the heat conducting member 458 ″ is inserted into the insertion hole 4512A ″ at the time of manufacturing the heat conducting member 458 ″. Then, the inside of the pipe of the heat conducting member 458 ″ is pressurized and expanded, and the outer surface of the heat conducting member 458 ″ is brought into surface contact with the inner wall surface of the insertion hole 4512A ″ and connected. Then, each end of the heat conducting member 458 ″ is sealed.

In each of the embodiments described above, the light source device 41 is configured as a discharge light emission type light source device. However, the light source device 41 is not limited to this, and a laser diode, an LED (Light Emitting Diode), an organic EL (Electro Luminescence) element, a silicon light emitting element Various solid-state light emitting elements such as these may be adopted.
In each of the above embodiments, only one light source device 41 is used and the color separation optical device 43 separates it into three color lights. However, the color separation optical device 43 is omitted, and three color lights are respectively emitted. One of the solid light emitting elements may be configured as a light source device.

In each of the above embodiments, the projector 1 is configured as a three-plate projector including three liquid crystal panels 4511. However, the projector 1 is not limited thereto, and may be configured as a single-plate projector including one liquid crystal panel. . Moreover, you may comprise as a projector provided with two liquid crystal panels, or a projector provided with four or more liquid crystal panels.
In each of the above embodiments, a transmissive liquid crystal panel having a different light incident surface and light emitting surface is used. However, a reflective liquid crystal panel having the same light incident surface and light emitting surface may be used.
In each of the embodiments, the liquid crystal panel is used as the light modulation element. However, a light modulation element other than liquid crystal, such as a device using a micromirror, may be used. In this case, the incident-side polarizing plate 452 and the emitting-side polarizing plate 454 on the light beam incident side and the light beam emission side can be omitted.
In each of the above embodiments, only an example of a front type projector that projects from the direction of observing the screen has been described. However, the present invention also applies to a rear type projector that projects from the side opposite to the direction of observing the screen. Applicable.

Although the best configuration for carrying out the present invention has been disclosed in the above description, the present invention is not limited to this. That is, the invention has been illustrated and described primarily with respect to particular embodiments, but it is not intended to depart from the technical concept and scope of the invention. Various modifications can be made by those skilled in the art in terms of materials, quantity, and other detailed configurations.
Therefore, the description limited to the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of one part or all of such restrictions is included in this invention.

  Since the optical element can be effectively cooled, the present invention can be used as a projector used in presentations and home theaters.

FIG. 2 is a diagram schematically illustrating a schematic configuration of a projector according to the first embodiment. The figure which shows schematic structure of the optical apparatus main body in the said embodiment. The figure which shows schematic structure of the optical apparatus main body in the said embodiment. The figure which shows schematic structure of the light modulation apparatus in the said embodiment. The perspective view which shows the connection structure of the heat conducting member with respect to the light modulation apparatus in the said embodiment. The perspective view which shows the structure of the heat-conduction member in 2nd Embodiment, and the connection structure of a heat-conduction member and a light modulation apparatus. The perspective view which shows the structure of the heat-conduction member in 3rd Embodiment, and the connection structure of a heat-conduction member and a light modulation apparatus. Sectional drawing which shows the structure of the heat-conduction member in the said embodiment typically. The perspective view which shows the structure of the heat-conduction member in 4th Embodiment, and the connection structure of a heat-conduction member and a liquid crystal panel. The figure which shows the structure of the heat-conduction member in the said embodiment, and the connection structure of a heat-conduction member and a liquid crystal panel. The figure which shows the modification of the said 1st Embodiment. The figure which shows the modification of the said 1st Embodiment. The figure which shows the modification of each said embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Projector, 3 ... Projection lens (projection optical apparatus), 41 ... Light source device, 45 ... Optical apparatus, 451 ... Light modulation apparatus (optical element), 458, 558, 658, 758 ... Heat conducting member, 458A, 658A, 758A ... Base end, 458B, 458C, 658B, 658C, 758B, 758C ... Extension, 4511 ... Liquid crystal panel (optical element), 4512C, 4512D: Optical element side connecting portion, 4581B, 4581C, 5581B, 5581C, 6582C1, 6582C2, 7582A ... Heat conducting member side connecting portion, 6581 ... Heat pipe, 6582 ... Outer frame body.

Claims (5)

An optical element that optically converts and emits incident light flux;
It is formed in a tube having a capillary structure inside, and a refrigerant is accommodated inside the tube, and heat transfer is performed when the refrigerant recirculates inside the tube, and the optical element is connected to the optical element so that heat can be transferred. A heat pipe for cooling the
The heat pipe is formed by bending so as to match the outer shape of the optical element, and includes a recess for fitting the optical element in a loose fit state.
An optical apparatus, wherein the concave portion and a light beam incident side end surface of the optical element are in surface contact . The optical device according to claim 1.
Before SL heat pipe, optical apparatus characterized by being formed in generally U-shaped plan configuration. The optical device according to claim 1 or 2,
Before SL heat pipe, optical apparatus, wherein the Ru Tei has a ring shape surrounding the outer peripheral edge of the optical element. The optical device according to any one of claims 1 to 3,
The capillary structure of the heat pipe is composed of a sintered wick. A projector comprising: a light source device; a light modulation device that modulates a light beam emitted from the light source device according to image information; and a projection optical device that enlarges and projects the light beam modulated by the light modulation device. ,
A projector comprising the optical device according to any one of claims 1 to 4.

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