JP4309142B2 - Probe unit manufacturing method and probe unit - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a probe unit for inspecting electrical characteristics of an electronic device such as a semiconductor integrated circuit and a liquid crystal panel, and a method for manufacturing the probe unit.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, a probe unit including a probe having a curved portion that bends during a test is known.
Patent Document 1 discloses a method of forming a plurality of probes having curved portions on a masked flat surface. However, probes that are arranged on the flat surface of the support portion at a narrow pitch and whose curved portions are formed on the same plane as the flat surface are likely to come into contact with each other if they are deformed by overdrive while in contact with the electrodes. Specifically, when each probe is bent on the plane on which the probes are arranged, the direction in which each probe bends is parallel to the flat surface on which the probes are arranged, that is, the direction in which the probes are arranged. Therefore, adjacent probes can easily come into contact with each other. Therefore, with the manufacturing method disclosed in Patent Document 1, it is difficult to manufacture a probe unit in which probes having curved portions are arranged at a narrow pitch.
[0003]
Patent Documents 2 and 3 disclose a method in which a plurality of probes arranged in parallel with the surface of a support portion are formed by plating and deformed by bending. In the methods disclosed in Patent Documents 2 and 3, a probe bent on a plane perpendicular to the surface of the support part (the film 21 of Patent Document 2 and the film 2 of Patent Document 3) that supports a plurality of probes is removed from the support part. Protrusively formed. In the probe having such a shape, even if the probe is deformed by overdrive, adjacent probes are not easily brought into contact with each other.
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 11-326373 [Patent Document 2]
JP 2002-31651A [Patent Document 3]
Japanese Patent Laid-Open No. 10-319040
[Problems to be solved by the invention]
However, according to the manufacturing methods disclosed in Patent Documents 2 and 3, since the finely formed probe is deformed by bending, the probe may be damaged by the deformation, and the positional accuracy of the probe is incorrect due to the deformation. There is a problem that it is easy. In addition, there is a risk of variations in the electrical resistance of the probe due to uneven density due to deformation.
[0006]
A first object of the present invention is to provide a manufacturing method with a high yield of a probe unit including a probe that has a bent portion bent by overdrive and can be arranged at a narrow pitch.
A second object of the present invention is to provide a high-quality probe unit including a probe that has a bent portion bent by overdrive and can be arranged at a narrow pitch.
[0007]
[Means for Solving the Problems]
In order to achieve the first object, the present invention provides a method for manufacturing a probe unit comprising a support portion and a plurality of probes supported by the support portion, wherein at least a surface layer is formed on a surface of a substrate made of metal. A mask process for forming a mask having an opening corresponding to the above, a bending process for plastically deforming the substrate together with the mask at a site corresponding to the opening by bending, and forming a probe in the opening of the mask A probe forming step for removing the mask, a mask removing step for removing the mask, and a substrate removing step for removing the substrate from the plurality of probes connected by the support portion . Bending a plurality of probes having curved portions bent on a plane intersecting the surface of the support portion by forming the probe at the opening portion of the mask using a pre-bent substrate and mask. Can be formed at once without. Thereby, the probe unit provided with the probe which has the curved part bent by overdrive and was arranged with the narrow pitch can be manufactured. In addition, by forming a probe having a curved portion from the beginning without bending the probe, the yield of a probe unit including a probe having a curved portion bent by overdrive can be increased.
[0008]
Furthermore, in the present invention, the support portion is formed by filling a thermosetting resin or a thermosetting resin containing an inorganic filler between the plurality of probes and curing them. By directly joining the support portion to the probe, the manufacturing process can be simplified.
[0009]
Further, in the present invention, after the probe forming step, a mask removing step for removing the mask, and the probe is formed on one side of the substrate, and the probe is formed on the side having no substrate. And a substrate removing step of removing the substrate from the plurality of probes connected by the support portion. In a state where a plurality of probes are fixed to the substrate, a support portion for connecting the probes is formed on the non-substrate side of the probe (side where the probe substrate is not provided), so that the probe positioned on the substrate is Multiple probes can be accurately positioned on the support without disturbing the alignment.
[0010]
Furthermore, in the present invention, the substrate is a substrate having a resin film having a metal layer formed on a surface thereof as a base material . By using a resin film having a metal layer on the surface as a substrate, only the metal layer can be dissolved to separate the substrate from the probe. That is, the substrate can be separated from the probe in a short time.
[0011]
Further, in the present invention, the substrate is made of a single layer metal having a thickness of 100 μm or less. By using a metal having a thickness of 100 μm or less, desirably 50 μm or less as the substrate, the substrate can be dissolved and removed from the probe in a short time.
[0012]
In order to achieve the second object, a probe unit according to the present invention is a probe unit obtained by the probe unit manufacturing method according to claim 1 , wherein a plurality of support units are provided in a direction parallel to a surface of the support unit. A probe having a uniform density having curved portions that are arranged and protrude from the support portion and are supported by the support portion and bend on a plane that intersects the surface of the support portion, and the support portion includes a portion of the substrate. It is characterized by having been removed . By arranging a plurality of probes with curved parts that bend on a plane that intersects the surface of the support part in a direction parallel to the surface of the support part, the probe bends even if the probes are arranged at a narrow pitch. It can prevent that adjacent probes contact. Further, by making the probe density uniform, the electrical resistance can be made constant, and the quality of the probe can be improved.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a probe unit and a manufacturing method thereof according to embodiments of the present invention will be described with reference to the drawings.
(Configuration of probe unit)
FIG. 2 is a perspective view showing a probe unit 1 according to an embodiment of the present invention. The probe unit 1 includes a flat plate-like support portion 32 and a plurality of probes 24.
[0015]
The plurality of probes 24 are arranged in parallel to each other, and a base end portion (not shown) is fixed to the support portion 32 and a distal end portion projects from the support portion 32. The pitch of the plurality of probes 24 corresponds to the pitch of the electrodes of the semiconductor integrated circuit or liquid crystal panel to be inspected. The probe 24 has a curved portion 26. The curved portion 26 is formed in an arch shape on a plane intersecting the surface of the support portion 32 (more specifically, a plane including the axis of the linear base portion of the probe 24). In order to prevent adjacent probes from contacting each other, it is desirable that the curved portion 26 be formed on a plane perpendicular to the surface of the support portion 32. When a force in the direction of compressing the probe 24 in the axial direction is applied to the tip of the probe 24, the probe 24 bends so that the curvature of the curved portion 26 becomes small. The shape of the curved portion 26 may be a shape that bends at one place as shown in FIG. A shape that gently curves in one direction as shown in FIG. 3B or a bellows shape as shown in FIG. The material of the probe 24 is a metal such as copper, nickel, or a nickel alloy.
[0016]
The support part 32 includes a resin film 28 and a cured resin layer 30. The resin film 28 is a thin flat plate made of polyimide resin, for example. The cured resin layer 30 is, for example, a heat-cured adhesive, and a plurality of probes 24 are connected and fixed on the surface of the resin film 28. The material of the support portion 32 may be a metal such as copper, a semiconductor such as silicon, or glass.
[0017]
(Probe unit manufacturing method)
1 and 4 are cross-sectional views illustrating a method of manufacturing a probe unit according to an embodiment of the present invention.
First, as shown in FIGS. 1A1 and 1B1, a mask 10 having an opening 12 corresponding to the probe 24 is formed on the surface of the substrate 16. The material and thickness of the substrate 16 may be appropriately selected from those suitable for the subsequent bending step and substrate removing step. For example, the material of the substrate 16 is a flexible resin or a metal such as copper. When the base material of the substrate 16 is a resin, a metal layer 14 such as a copper thin film is formed on the surface of the substrate 16 by sputtering or the like. Thereby, the shape stability of the board | substrate 16 is ensured with the base material which consists of resin, and it can be made easy to isolate | separate the board | substrate 16 from the probe 24 with the metal layer 14 formed in the base-material surface. The thickness of the substrate 16 may be a thin film or may be a slightly thick plate. When the entire substrate 16 is formed of a single layer of metal, the thickness of the substrate 16 is preferably 100 μm or less, and more preferably 50 μm or less. This is because the substrate 16 can be dissolved in a short time in the subsequent substrate removing step. In addition, the base material layer and the surface layer of the substrate 16 may be made of different metals so that selective etching can be performed in a substrate removing process described later. The mask 10 having the opening 12 is formed, for example, by forming a resist on the surface of the substrate 16 and exposing the resist to develop it into a predetermined pattern. The mask 10 may be a dry film.
[0018]
Next, as shown in FIGS. 1A2 and 1B2, the portions corresponding to the openings 12 of the substrate 16 and the mask 10 are bent and plastically deformed to form the bent portions 18 in the substrate 16 and the mask 10. The substrate 16 and the mask 10 can be bent into a free shape by press working using, for example, the punch 20 and the die 22.
[0019]
Next, as shown in FIGS. 1A3 and 1B3, a probe 24 is formed in the opening 12 of the mask 10 by electrolytic plating or the like. Then, a probe 24 having a curved portion 26 is formed in a portion corresponding to the curved portion 18 of the substrate 16 and the mask 10. Copper, nickel, nickel alloy, etc. are adopted as the plating material. The probe 24 may be formed by other methods such as electroless plating, vapor deposition, and sputtering. The thickness of the probe 24 is, for example, several tens of μm. Thus, the density of the probe 24 in which the curved portion 26 is formed becomes uniform.
[0020]
Next, as shown in FIGS. 4A4 and 4B4, the mask 10 is removed using a stripping solution or the like.
[0021]
Next, as shown in FIGS. 4A5 and 4B5, a resin film 28 is bonded to the opposite substrate side of the base end portion of the probe 24. When the adhesive is cured, a plurality of probes 24 are connected by a support portion 32 composed of the cured resin layer 30 and the resin film 28 in which the adhesive is cured, and the probes 24 are positioned and fixed to the support portion 32. The
[0022]
Note that the support portion 32 may be formed by press-fitting an uncured thermosetting resin film so as to fill between the probes and heat-curing it. As a result, the probe 24 is embedded and fixed in the support portion 32. Moreover, you may use the thermosetting resin containing an inorganic filler. By directly joining the support portion to the probe, the manufacturing process can be simplified.
[0023]
Next, as shown in FIGS. 4A6 and 4B6, the metal of the substrate 16 is dissolved by etching, and the substrate 16 is removed from the probe 24 and the support portion 32. At this time, the metal layer 14 formed on the surface of the base material layer such as a resin may be dissolved to separate the substrate 16 from the probe 24, or the entire substrate 16 made of metal may be dissolved and the probe 24 to the substrate 16 may be removed. In the case where the base material layer and the surface layer of the substrate 16 are formed of different metals, only the surface layer can be selectively removed by etching. Further, when the base material layer and the metal surface layer of the substrate 16 are bonded, the substrate 16 may be mechanically peeled from the probe 24. At this time, the metal surface layer remaining on the probe 24 can be removed by etching.
[0024]
(Continuity test using probe unit)
FIG. 5 is a diagram showing a continuity test using the probe unit 1 according to an embodiment of the present invention. The jig 34 reciprocates in the vertical direction by a lifting mechanism (not shown). In the probe unit 1, a flat support portion 32 is fixed to the jig 34 in a posture parallel to the movement direction axis of the jig 34. A specimen 38 such as a semiconductor integrated circuit or a liquid crystal panel is tested while being fixed to a table (not shown) installed below the jig 34.
[0025]
First, after moving the jig 34 downward, the tip of the probe 24 is brought into contact with the electrode 36 of the specimen 38, and then the jig 34 is further moved downward in order to electrically connect the probe 24 and the electrode 36 securely. The probe 24 is brought into pressure contact with the electrode 36. That is, the probe unit 1 is overdriven. Then, the probe 24 bends so that the curvature of the curved portion 26 becomes small as shown by the solid line in FIG. At this time, since the interval between adjacent probes 24 does not substantially vary, the probes 24 do not come into contact with each other even if the probe unit 1 is overdriven.
[0026]
Next, an electrical signal is sent to the electrode 36 of the specimen 38 through the probe 24 in a state where the probe 24 is bent as shown by a solid line in FIG.
[0027]
Next, as shown by the broken line in FIG. 5, when the probe unit 1 is raised, the probe 24 is restored by the elastic force.
[0028]
Note that the continuity test using the probe unit according to the present invention is not limited to the above-described form, and may be performed as shown in FIG. 6A, for example. That is, the support portion 32 of the probe unit 1 may be supported in a horizontal posture by the jig 34 and the tip of the probe 24 inclined downward with respect to the horizontal may be brought into contact with the electrode 36 of the specimen 38. In such a continuity test, it is possible to inspect a specimen in which electrodes are arranged at the center of the chip, or a specimen in which a plurality of rows of electrodes are arranged from the edge toward the center.
[0029]
Further, a continuity test may be performed as shown in FIG. That is, the support portion 32 of the probe unit 1 may be supported in an upright posture by the jig 34, and the tip of the probe 24 inclined with respect to the vertical axis may be brought into contact with the electrode 36 of the specimen 38. In this type of continuity test, the electrode 36 can be reliably scrubbed with the tip of the probe 24 during overdrive, so that contact failure due to an oxide film or the like formed on the surface of the electrode 36 can be prevented.
[0030]
The probe unit of the above-described embodiment has a configuration in which adjacent probes 24 do not easily come into contact with each other when overdriven, so that the pitch of the probes 24 can be reduced. In addition, since the density of the probe 24 is uniform, the electrical resistance of the probe 24 is uniform, which enables an accurate continuity test. Furthermore, since the tip of the probe 24 is bent, it is possible to deal with various electrode arrangements using a simple-shaped jig. Specifically, for example, for a plurality of electrodes arranged in a small chip or a plurality of electrodes arranged in the center of the chip, the support 32 is fixed to a jig in a vertical or horizontal posture to perform a test. Can be implemented. As a result, it becomes easy to position the probe unit 1 with respect to the jig.
[0031]
Further, in the probe unit manufacturing method of the above-described embodiment, the probe 24 having a curved portion is formed from the beginning without bending the probe 24, so that the yield of the probe unit 1 can be increased. In addition, in a state where the plurality of probes 24 are fixed to the substrate 16, an array of the probes 24 positioned on the substrate 16 is used to fix the support portion 32 that connects the probes 24 to the opposite side of the probe 24. The plurality of probes 24 can be accurately positioned on the support portion 32 without disturbing. That is, a plurality of fine probes 24 can be formed with high accuracy.
[0032]
In the above-described embodiment, the example in which the entire substrate 16 is removed from the probe 24 and the probe 24 is supported by a member different from the substrate 16 has been described, but the probe 24 is removed by partially removing the substrate 16. The substrate 16 may protrude from the substrate 16 and the substrate 16 itself may be used as a support portion.
[0033]
In the above-described embodiment, the example in which the substrate 16 is bent together with the mask 10 in a state where the opening 12 corresponding to the probe 24 is formed in the mask 10 has been described, but before the opening 12 is formed in the mask 10, the mask 10 is formed. At the same time, the substrate 16 may be bent. Specifically, for example, when a photocurable resin is used as a mask, after the mask is formed on the surface of the substrate and exposed to light, bending may be performed before development and washing. For example, after forming a mask on the surface of a board | substrate and before exposing it, you may perform a bending process in the state in which the photocurable resin is the whole surface uncured. By performing the bending process with the entire surface of the substrate masked, it is possible to prevent the mask and the substrate from being damaged during the bending process.
[Brief description of the drawings]
1A and 1B are diagrams illustrating a method of manufacturing a probe unit according to an embodiment of the present invention, wherein (A1) to (A3) correspond to the cross-sectional view in the direction A of FIG. 2, and (B1) to (B3) Corresponds to a cross-sectional view in the B direction of FIG.
FIG. 2 is a perspective view showing a probe unit according to an embodiment of the present invention.
FIGS. 3A and 3B are side views showing a probe unit according to an embodiment of the present invention.
4A and 4B are diagrams illustrating a method of manufacturing a probe unit according to an embodiment of the present invention, wherein (A4) to (A6) correspond to the cross-sectional view in the direction of A in FIG. 2, and (B4) to (B6) Corresponds to a cross-sectional view in the B direction of FIG.
5A and 5B are diagrams showing a continuity test method using a probe unit according to an embodiment of the present invention, where FIG. 5A is a front view and FIG. 5B is a side view.
FIGS. 6A and 6B are side views showing a continuity test method using a probe unit according to an embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Probe unit 10 Mask 12 Opening part 14 Metal layer 16 Board | substrate 18 Curved part 24 Probe 26 Curved part 28 Resin film 30 Cured resin layer 32 Support part

Claims (7)

A method for manufacturing a probe unit comprising a support and a plurality of probes supported by the support,
A mask step of forming a mask having an opening corresponding to the probe on the surface of the substrate having at least a surface layer made of metal;
A bending step of plastically deforming the substrate together with the mask at a portion corresponding to the opening by bending;
A probe forming step of forming a probe in the opening of the mask;
A mask removal step of removing the mask;
A substrate removing step of removing the substrate from the plurality of probes connected by the support;
A method for manufacturing a probe unit comprising: The probe unit manufacturing method according to claim 1, wherein the support portion is made of a thermosetting resin or a thermosetting resin with an inorganic filler.
A method of manufacturing a probe unit, wherein the support portion is formed by filling a thermosetting resin or a thermosetting resin containing an inorganic filler between the plurality of probes and curing them. After the mask removing process ,
Before Symbol probe is intended to be formed on one side of the substrate, the side having no substrate of the probe, further comprising a higher support portion formed Engineering forming a support portion for connecting the plurality of probes A manufacturing method of the probe unit according to claim 1 or 2.   4. The probe unit manufacturing method according to claim 1, wherein the substrate is a substrate having a resin film having a metal layer formed on a surface thereof as a base material.   5. The probe unit manufacturing method according to claim 1, wherein the substrate is formed of a metal layer made of a metal having a base material and a surface different from each other.   The method for manufacturing a probe unit according to claim 1, 2 or 3, wherein the substrate is made of a single layer of metal having a thickness of 100 µm or less. A probe unit obtained by the probe unit manufacturing method according to claim 1,
A support part;
A plurality of probes arranged in a direction parallel to the surface of the support part, protruded from the support part, supported by the support part, and each having a curved portion bent on a plane intersecting the surface of the support part; With
The probe unit according to claim 1, wherein the support portion is obtained by partially removing the substrate.

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