JP4314576B2 - Manufacturing method of functional parts - Google Patents

Description

  The present invention relates to an electronic component in which a component element is mounted by using a wiring substrate in which a conductive circuit is formed by copper plating and partially dissimilar metal plating on the same flat substrate surface of the wiring substrate. The present invention relates to an electronic component having an operation function, a contact function, and a display function by mounting a component element in a mounting area of an integrated component of a wiring board having an original three-dimensional circuit.

Conventionally, when a conductive circuit is formed on a wiring board on which a component element is mounted, a flat conductive circuit is formed by designing the circuit conductor to have a uniform thickness on the same base material surface and changing the conductor width. Is.
In the multilayer wiring board, the thickness of the circuit conductors in each layer separated by the insulator may be changed, but the thickness of the circuit conductors in the same layer is not made a three-dimensional solid circuit.

As an example, there is a dimming operation terminal disclosed in Japanese Patent Laid-Open No. 7-15775.
This has a three-dimensional switch contact in the concave step portion provided on the three-dimensional circuit molded substrate, and in particular, as shown in FIG. 1, a fixed contact 61 attached to the concave step portion of the three-dimensional circuit molded substrate 60, and a fixed contact The movable contact 62 is attached to a position below 61, and the dome-shaped movable contact piece 63 (disc spring) is connected to the fixed contact 61.
Although not disclosed in detail, the step between the fixed contact 61 and the movable contact 62 is usually formed by a molded member, and the conductor thickness of the three-dimensional circuit is formed to be the same.
However, the three-dimensional circuit molded substrate 60 has a problem in that the molded member is made thin, double-sided, large, side terminals, refractive strength, and the like.
JP-A-7-15775.

Component elements and various functional parts are mounted on a wiring board, and functional parts having an operation function, a display function, a switch function, a contact function and the like are provided.
In other words, electronic parts formed by mounting component elements and various functional parts are diversified, and the demand for wiring boards having three-dimensional circuits with different three-dimensional conductor thickness has increased in the wiring board as a base. .
Using these three-dimensional circuits with different conductor thicknesses, contact functions such as on / off switch, multi-stage selector switch, and push switch, display functions such as LED and indicator lamp, and selection of operation functions for various settings and operation status Wiring board provided with a three-dimensional circuit used for selection

By the way, the same number of copper plating and etching as the number of step circuits are required, and there is no photosensitive dry film that can withstand the copper plating and etching (plating mask and etching mask), and it is difficult to ensure quality reliability. .
In addition, since circuit formation by copper plating and etching is repeatedly performed, the deviation of each step circuit, deformation, poor positional accuracy, conductor thickness variation, and work efficiency are poor.

The present invention relates to the following (1) to (3).
(1) A first thickness conductor composed of a first panel copper plating conductor and a first pattern dissimilar metal plating conductor is formed on a copper foil of a copper clad laminate, and a second thickness is formed on the first thickness conductor. A second thickness conductor composed of the panel copper plating conductor and the second pattern dissimilar metal plating conductor is formed, and the third panel copper plating conductor and the third pattern dissimilarity are formed on the first and second thickness conductors. By forming a third thickness conductor composed of a metal plating conductor, and etching the whole at once with the first, second and third pattern different metal plating conductors as an etching resist, in plan view Forming a wiring board by forming conductors having different thicknesses in the same pattern area in a stepwise manner, or forming first, second and third patterns of different metal plating conductors on the wiring board; Pair with movable contact on top Method of manufacturing a functional component and a step of placing.

In the method (1), a method of manufacturing a functional component in which conductors having different thicknesses are arranged concentrically or eccentrically in the step of manufacturing a wiring board.

In the above (1) or (2), a method for producing a functional component in which electrode terminals connected to the outside are arranged on the outer peripheral surface or corner portion of the wiring board.

The invention of claim 1, displacement of the wiring board each step circuits provided with Thickness conductor Do that different stepped into the narrow area for mounting a functional component at the same Ichiki material surface, deformation, positional inaccuracies, conductor thickness variations and the like This is a functional component manufacturing method capable of forming a three-dimensional three-dimensional circuit to be applied to a thin, small, high-density contact portion or operation portion with high quality and high reliability.

According to the invention of claim 2, in addition to the effect of claim 1, the optimum arrangement required for the switch function can be selected in a well-balanced manner, and the thickness and the number of stages of each conductor can be freely set to a plurality of stages.
In particular, concentric, eccentric, concave, or centered on a functional component that mounts a step portion with the first thickness conductor, the second thickness conductor, and the third thickness conductor in the same minute pattern area. By forming it in a convex shape, the contact function and the component connection function are improved.

  According to the invention of claim 3, in addition to the effect of claim 1, in order to electrically connect from the functional component to the outside, the outer peripheral surface of the wiring board (on the divided cutting line to be a side) or the corner (intersection of the divided cutting lines) ), The electrode terminals connected to the outside can be arranged, and a plurality of electrode terminals can be arranged close to the outside of the area where the functional parts are mounted. (Functional parts can be thin, small and high density)

  In the functional parts of the present invention, the combination of the functional parts that make the contact function and the operating function and the wiring board is an important condition. In addition, the performance of mounting parts (solder connectivity, wire bonding, bump connection, surface connection parts connection) Etc.) and electrical connection with the arrangement of electrode terminals for external connection is required.

This dissimilar metal plating other than copper performs partial pattern plating to form a desired thickness conductor, so that a metal containing any one of nickel, gold, silver, and rhodium is good, and the dissimilar metal plating is made into a predetermined pattern. A circuit forming method using the formed pattern plating as an etching resist can be applied.
Three-level (three types) or more thick conductors with different steps are formed only on one side of the wiring board so as to protrude from the three-dimensionally flat base material surface, and there is no step on the opposite surface (back surface) as with the normal wiring board. A planar circuit may be formed mainly of a signal circuit and a wiring circuit.

FIG. 1 is an enlarged cross-sectional view of a part of a wiring board having two-stage (two types) thick conductors of Example 1 used for a functional component of the present invention.
Through-conduction by forming panel first copper plating conductor (3b) by applying panel copper plating (plating thickness 15μm) to both sides of double-sided copper clad laminate 2 of substrate thickness 0.1mm and copper foil 3a (18μm) Hole 4 (plating through hole) is formed.

The outer layer conductors on both sides made of the first panel copper plating conductors (3b) on both sides of the wiring board are first hole plating conductors on the inner wall of the through-conduction hole 4 (plating through hole). The panel copper plating conductor (3b) and the first dissimilar metal plating conductor (5a), and the second panel copper plating conductor (3c) and the second dissimilar metal plating conductor (5b) are electrically connected. .
However, in the second panel copper plating step, the dry film is used as the second panel copper plating mask, and the through-conduction holes 4 (through-hole holes) and the back surface of the wiring board are covered with the dry film to form the first copper plating mask. 2 panel copper plating does not need to be formed.

  The wiring board 1 according to the first embodiment of the present invention includes a first thickness conductor 7 composed of [copper foil 3a + first copper plating conductor (3b) + first dissimilar metal plating conductor 5a], The second conductor composed of [copper foil 3a + first copper plating conductor (3b) + second copper plating conductor (3c) + second dissimilar metal plating conductor 5b] adjacent to or connected to the thick conductor 7 The wiring board 1 has a thickness conductor different from the thickness conductor 8 provided on the upper surface of the wiring board 1 in two steps.

Therefore, the printed wiring board 1 is formed by adjoining or connecting at least two steps of thickness conductors having different thickness steps, and the through-conduction holes 4 are arranged in the pattern area of the first thickness conductor 7. An example is given.
The second thickness conductor 8 is formed close to the first thickness conductor 7, and this portion is electrically connected by a combination request with a functional component for causing a contact function, an operation function, a display function, and the like. However, the second thickness conductor 8 may be partially overlapped with the first thickness conductor 7, or the first thickness conductor 7 and the second thickness conductor 8 may be concentric. It can also be arranged eccentrically.

FIG. 2 is a cross-sectional view of a wiring board having a three-stage thick conductor of Example 2 used for the functional component of the present invention.
First, as shown in FIG. 2, the through-conduction hole 4 is arranged and formed in the area of the first thickness conductor 7 of the first embodiment of the present invention shown in FIG. 1, and the second thickness conductor 8 has the first thickness. Thickness conductors formed in the vicinity of the conductor 7 and having different steps are formed in the vicinity of two steps.

  In addition, [copper foil 3a + first copper plating conductor (3b) + second copper plating conductor (3c) + third copper plating conductor (3d) + third dissimilar metal plating conductor 5c] A wiring board 1 in which a third thick conductor 9 is formed on a flat same base material surface (one surface in this example) by having thick conductors having different steps close to or connected in three steps.

The third thickness conductor 9 has a second thickness composed of [copper foil 3a + first copper plating conductor (3b) + second copper plating conductor (3c) + second dissimilar metal plating conductor 5b]. A panel copper plating is formed by overlapping the third copper plating conductor (3d) in addition to the upper surface of the conductor 8, and then the third dissimilar metal plating conductor 5c is partially overlapped with the above portion [ Copper foil 3a + first copper plating conductor (3b) + second copper plating conductor (3c) + second dissimilar metal plating conductor 5b + third copper plating conductor (3d) + third dissimilar metal plating conductor 5c] Are connected to each other, and the entire copper-clad laminate 2 is etched at a time so that the second thickness conductor 8 and the third thickness conductor 9 are partially formed in the same pattern area in plan view. A stepped portion 19 is formed in contact with each other without any insulation gap and connected in a staircase pattern. A three-dimensional structure having a rough step becomes possible.
A three-dimensional structure in which complicated steps having different conductor thicknesses are freely (randomly) arranged on the XY plane in the same pattern area in plan view is possible.

This dissimilar metal plating includes any one of nickel, gold, silver and rhodium as a partial pattern plating to form a desired thickness conductor, or if necessary, Ni plating-gold plating (Au), Ni plating- An additional plating process such as silver plating (Ag) can also be performed.
In addition to contact functions and operation functions, various steps and connection lands (surface lands, wires) can be selected according to the required performance of the mounted components (wire bonding, bump connection, surface connection, etc.). -Bonden ground, bump connection land, etc.) can also be provided.

With reference to FIG. 3, the formation of functional components in a matrix on a large-sized wiring board will be described in detail.
Each individual side of the wiring board 1 of the present invention is as small as 3 to 5 mm, as shown in FIG. 3 (a) in view of equipment in the manufacturing process, work efficiency, accuracy variation, and various problems in mounting components. As a large-sized wiring board 20 in which a plurality of wiring boards 1 are combined into a matrix of a plurality of rows and a plurality of stages, vertical and horizontal divided cutting lines (X , Y), components are often connected and arranged on a plurality of individual wiring boards 1 as shown in FIG.
That is, the through-conduction holes 4 or non-through-conduction holes are arranged at the sides and intersections of the vertical and horizontal cutting lines (X, Y) to be divided and cut of the large-sized wiring board 20, and the vertical and horizontal cutting lines ( X, Y) are divided and cut by licing cut, laser cut or the like to obtain individual functional parts shown in FIG.
The through-conduction hole 4 or the non-through-conduction hole is not limited to a round hole, but may be a long hole, a square hole, or a deformed hole.

The electrode terminals 12 for connecting the individual mounting components of the wiring board 1 of this example to the outside are arranged at the corners (corners) of the individual wiring boards 1 and the individual mounting components. A through conduction hole 4 or a non-through conduction hole is arranged on (X, Y), and licing cut is performed at the vertical and horizontal cutting lines (X, Y) at the center of the through conduction hole 4 or the non-through conduction hole. Thus, a large number of electrode terminals 12 are formed on the outer periphery of the individual wiring board 1 and the individual functional components. (No drawing display)
The electrode terminal 12 can also be used as a connection land (surfaced land, wire-bonden ground, bump connection land, etc.).

In the individual wiring board 1 shown in FIG. 3B, the first thickness conductor 7, the second thickness conductor 8, and the third thickness conductor 9 described above are formed, and the first thickness conductor 7 is formed. A through-conduction hole 4 that electrically connects circuit conductors on the front and back surfaces of the wiring board 1 is disposed in the central portion of the wiring board 1.
The through-conduction hole 4 is filled with an insulator or the inside of the through-conduction hole 4 is conductively filled when an adverse effect is caused on mounting of a mounting part that performs a contact function, a display function, an operation function, or the like. A non-through hole that is closed with an object (plated conductor, metal conductor, conductive paste, etc.).
In addition, the non-penetrating conduction hole in which one end surface of the through-conduction hole 4 is closed with a metal conductor may be closed at the upper end surface with a metal conductor, or the lower end surface of the through-conduction hole 4 may be closed with a metal conductor. A component element or a functional component can be mounted on the end face.
The second thickness conductor 8 and the third thickness conductor 9 are connected to individual electrode terminals 12 that connect the wiring board 1 and individual mounting components to the outside.

  A plurality of step circuits having different thicknesses of the wiring board of the present invention are formed in a small area where functional parts are mounted, and this area (area) is utilized for a contact function, a display function, an operation function, etc. It is to make.

  For example, a movable contact (plate spring, disc spring, conductive film, conductive rubber, spring, etc.) is mounted on the top of this step circuit (three-dimensional circuit) with different conductor thickness, and it can be turned on and off with a small gap. -It can be a switch. This switch function has a contact function such as a multistage changeover selection switch and a multistage on / off changeover selection switch by having a plurality of step circuits.

  Accordingly, in plan view, the second thickness conductor 8 and the third thickness conductor 9 are inclined in a stepwise manner in the vicinity of the first thickness conductor 7 in the same minute pattern area, or are adjacent or connected. The contact function and the component connection function are improved by forming the concentric, eccentric, and concave or convex shapes around the functional component on which the inclined step portion is mounted.

  A plurality of inclined step circuits having different thicknesses of the wiring board of the present invention are formed in a small area, for example, the second thickness conductor 8 and the third thickness conductor 9 shown in FIG. Furthermore, the same-thickness conductors (8 or 9) formed concentrically and eccentrically are divided into a plurality of independent circuits that are electrically separated into independent circuits arranged on the outer peripheral end face of the wiring board 1. By connecting to the electrode terminal 12, a plurality of independent circuits can be formed in a minute area.

A functional component having a switch function will be described with reference to a partially enlarged sectional view of FIG.
A second thickness slightly thicker than the first thickness conductor 7 on the outer periphery (outside) of the first thickness conductor 7 in the vicinity of the thinnest first thickness conductor 7 in the area where the functional components of the wiring board 1 are mounted. The conductor 8 is arranged, and a third thickness conductor 9 thicker than the second thickness conductor 8 is arranged on the outer periphery (outside) of the second thickness conductor 8 to form an inclined step portion.

An enlarged cross section showing the case where the inclined step portion of the wiring board 1 is concentric or eccentric, and the movable contact body 30 is mounted substantially flat (horizontal) on the upper portion of the concave or convex area. FIG.
The movable contact body 30 includes a leaf spring, conductive rubber, a flexible conductive film, and the like. For example, the wiring pattern in the area of the wiring board 1 before mounting the movable contact body 30 shown in FIG. The contact function will be described with reference to the plan view.

By weakly pushing (pressing) a part of the periphery of the movable contact body 30, one contact point of the second thickness conductor 8 and one contact point of the third thickness conductor 9 are connected via the conductor on the lower surface of the movable contact body 30. It becomes conductive and the switch is weakly turned on.
Next, by strongly pushing (pressing) the central portion of the movable contact body 30, the contact of the first thickness conductor 7 is conducted through the conductor on the lower surface of the movable contact body 30, and the switch is in a strong ON state. Selection is decided.
In other words, it is a contact function component having a switch function of three steps (weakly on / strongly on / off) that are opposed to each other.
Therefore, in the wiring pattern shown in FIG. 4B, a highly reliable functional component (push switch) having a large number of contact switching functions capable of on / off switching selection having a large number of selectivity can be formed.

  The movable contact body 30 is disposed opposite to the upper area of the three-stage thick conductor (7.8.9). The movable contact body 30 is mounted on the thickest third thickness conductor 9 while being fixed at several places with solder or the like. It is formed concentrically, eccentrically, and concavely or convexly around the contact function component to be mounted.

  In FIG. 5, the movable contact body 30 is arranged in a dome shape in the upper area of the three-stage thick conductor (7.8.9), and the contact point formed on the first thick conductor 7 and the second thick conductor. 8 is a contact functional part having a switch function that is disposed so as to be opposed to and separated from the contact formed in FIG.

This switch function can be switched between three steps of weak on / strong on / off, and a large number of divided contacts are arranged on the third thickness conductor 9, so that the second thickness conductor 8 and the first thickness are arranged. It is electrically connected to the conductor 7 via the conductor on the lower surface of the movable contact body 30.
By connecting the contacts of the large number of third thickness conductors 9 and a plurality of electrode terminals 12 formed at the outer periphery or corner of the functional component, it has a contact function capable of multi-stage switching selection.

It is sectional drawing of the wiring board which has a 2 step | paragraph thick conductor of Example 1 of this invention functional component. It is sectional drawing of the wiring board which has a 3 step | paragraph thick conductor of Example 2 of this invention functional component. It is explanatory drawing which forms a functional component in the matrix form on the large-sized wiring board. It is an enlarged view which shows the case where a movable contact body is horizontally attached to the upper part of the area which mounts the functional component of a wiring board. It is an expanded sectional view which shows the case where a movable contact body is attached to the area upper part which mounts the functional component of a wiring board in the shape of a dome.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Wiring board, 3 ... Copper plating conductor, 4 ... Through-conduction hole, 5 ... Dissimilar metal plating conductor, 7 ... 1st thickness conductor, 8 ... 2nd thickness conductor, 9 ... 3rd thickness conductor, 12 ... Electrode terminals, 20 ... large-sized wiring board, 30 ... movable contact body.

Claims (3)

A first panel copper-plated conductor and a first patterned dissimilar metal-plated conductor are formed on the copper foil of the copper clad laminate, and a second panel is formed on the first thick conductor. A second thickness conductor composed of a copper plating conductor and a second pattern different metal plating conductor is formed, and a third panel copper plating conductor and a third pattern different metal are formed on the first and second thickness conductors. By forming a third thickness conductor composed of a plating conductor, and etching the whole in one time using the first, second and third pattern different metal plating conductors as an etching resist, the same in a plan view Forming a wiring board by forming conductors having different thicknesses in a stepped manner in the pattern area in a stepwise manner, or forming a wiring board;
  And a step of disposing a movable contact member on top of the first, second, and third pattern dissimilar metal plating conductors of the wiring board. The method of manufacturing a functional component according to claim 1, wherein conductors having different thicknesses are arranged concentrically or eccentrically in the step of manufacturing the wiring board. 3. The method for manufacturing a functional component according to claim 1, wherein electrode terminals connected to the outside are arranged on the outer peripheral surface or corner portion of the wiring board.

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