Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JP4315542B2 - Veneer - Google Patents
[go: Go Back, main page]

JP4315542B2 - Veneer - Google Patents

Veneer Download PDF

Info

Publication number
JP4315542B2
JP4315542B2 JP27416299A JP27416299A JP4315542B2 JP 4315542 B2 JP4315542 B2 JP 4315542B2 JP 27416299 A JP27416299 A JP 27416299A JP 27416299 A JP27416299 A JP 27416299A JP 4315542 B2 JP4315542 B2 JP 4315542B2
Authority
JP
Japan
Prior art keywords
plate
board
substrate
divided
density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP27416299A
Other languages
Japanese (ja)
Other versions
JP2001096512A (en
Inventor
彰 伊東
隆司 芳ヶ迫
Original Assignee
朝日ウッドテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 朝日ウッドテック株式会社 filed Critical 朝日ウッドテック株式会社
Priority to JP27416299A priority Critical patent/JP4315542B2/en
Publication of JP2001096512A publication Critical patent/JP2001096512A/en
Application granted granted Critical
Publication of JP4315542B2 publication Critical patent/JP4315542B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Floor Finish (AREA)
  • Laminated Bodies (AREA)

Description

【0001】
【発明の属する技術分野】
この発明は、床仕上げ用の床材の他、壁仕上げ材等として用いられる化粧板に関する。
【0002】
【従来の技術】
住宅等の建築物における床仕上げ用の化粧板として、合板等の基材表面に化粧単板等の化粧層が積層された床材が周知であるが、このような床材は、合板基材の表面単板に生じる割れ(レースチェック)や、表面単板の凹凸等に起因して、化粧層に割れ(ヒワレ)等の不具合が生じることがある。更に合板基材は、表面硬度が低いため、床材表面に硬いものを落下させた場合に、床材表面に凹み傷が形成されることもある。
【0003】
そこで、図2に示すように、合板製の基材本体(2a)の表面に、中比重繊維板(MDF)等の木質繊維板からなる基材表層板(2b)が積層された複合板を基材(2)とし、この基材表面に化粧層(3)が設けられた床材(1)が使用されることがある。この床材(1)は、基材表層板(2b)を構成するMDFが、方向性がなく均質性に優れているため、ヒワレの発生を防止できるとともに、表面硬度も大きく、凹み傷の発生も防止することができる。
【0004】
【発明が解決しようとする課題】
上記のような床材(1)は、通常、外周端縁に本ざね等の接合用加工が施されており、周囲4辺のうち隣り合う2辺に雄ざね(1a)が形成されるとともに、残り2辺に雌ざね(1b)が形成されている。そして隣り合う床材間において、一方の床材(1)の雄ざね(1a)を他方の床材(1)の雌ざね(1b)に嵌合しつつ、複数の床材(1)を、図3に示すように根太組等の床下地(5)に、接着剤と釘との併用により施工するものであり、図2に示すように、隣り合う床材(1)(1)の側端面間、つまり床材接合部には、組付誤差等の影響により、部分的に隙間(S)が形成される。
【0005】
一方、床材(1)を新設した直後、あるいは床材施工後のメンテナンス時等においては、床面上にワックス処理がなされる。ワックス処理は、通常、多量のワックスを床面上に塗布した後、余剰のワックスを床面上から拭き取りながら、ワックスを床面全域に均一に塗布されるように拭き伸ばすものであるが、余剰のワックスを拭き取る前に、床材接合部に溜まったワックスがその接合部の隙間 (S)に浸透し、更にそのワックスが床材(1)の側端面から床材内部に浸透して、床材(1)の接合部周辺に厚さ方向の膨潤が生じて、図2の想像線に示すように、床材(1)の接合部周辺が上方へ膨れ上がって、いわゆるワックス膨れが発生し、美観が損なわれるという問題が発生する。
【0006】
この発明は、上記従来技術の問題を解消し、ヒワレや凹み傷の発生を防止しつつ、ワックス膨れの発生を防止できて、良好な美観を維持することができる床材等の化粧板を提供することを目的とする。
【0007】
【課題を解決するための手段】
上記目的を達成するため、本発明者は、まず始めに、化粧板として床材を用いて、ワックス膨れの発生原因を詳細に分析した。その分析により、合板等の木質板上に積層される木質繊維板は、合板に比べて吸放湿による伸縮量が非常に大きいため、木質繊維板に、少量でもワックスが浸透すると、その浸透部が大きく膨らんで、上記のワックス膨れを来すという知見を得た。従って、床材の基材表面における木質繊維板を薄くしたり、あるいは木質繊維板を取り除けば、ワックス膨れの発生を防止することができる。実際、木質繊維板の積層されない合板基材の床材においては、上記のワックス膨れが問題となるようなことはない。
【0008】
ところが、合板基材上の木質繊維板を薄くすると、上記従来例で述べたように凹み傷の発生を防止することが困難になってしまう。
【0009】
このような状況下において、更に本発明者は、綿密な研究を繰り返し行った結果、合板等の木質板上に木質繊維板が積層された基材を有する床材において、木質繊維板として、特有の構成のものを用いることにより、上記目的を達成可能な最適な構成を見出し、本発明をなすに至った。
【0010】
すなわち、本発明は、木質板からなる基材本体の表面に、基材表層板が積層された板状基材と、その板状基材の表面に設けられた化粧層とを有する化粧板であって、前記基材表層板が、厚さが0.2mm以上0.5mm未満に調整され、密度が0.7g/cm3 以上の木質繊維板をもって構成されてなるものを要旨としている。
【0011】
この発明の化粧板においては、基材表層板を構成する木質繊維板として、厚さが0.2mm以上、0.5mm未満の極薄のものを用いているため、化粧板端面から基材表層板内部にワックスが浸透しようとも、その浸透部が大きく膨れ上がることはなく、ワックス膨れを有効に防止することができる。
【0012】
更に基材表層板としての木質繊維板は、良好な均質性を備えているため、ヒワレの発生を確実に防止することができる。
【0013】
しかも基材表層板用の木質繊維板として、密度が0.7g/cm3 以上の高密度のものを用いているため、上記したように極薄であろうとも、十分な表面硬度を得ることができ、凹み傷の発生も確実に防止することができる。
【0014】
以下、本発明の化粧板の構成を図面を用いて更に詳細に説明する。
【0015】
(A)各部構成
図1に示すように、本発明の化粧板は、特に床仕上げ用の床材(10)に好適に採用することができる。この床材(10)は、複合板からなる板状の基材(20)と、その基材(20)の表面に設けられた化粧層(30)とを有している。
【0016】
基材(20)は、木質板からなる基材本体(21)上に、木質繊維板からなる基材表層板(22)が接着された複合板をもって構成されている。
【0017】
ここで、本発明において、基材本体(22)を構成する木質板としては、ラワン合板、針葉樹合板、ラワン材等の広葉樹材の単板と針葉樹材の単板が共に使用されている合板、パーティクルボード、ウエハボード、オリエンテッドストランドボード(OSB)、単板積層材(LVL)、ランバーコア合板、集成材等からなるもの、又はこれらを複数種組み合わせたものを好適に使用することができ る。
【0018】
また、基材表層板(22)を構成する木質繊維板としては、中質繊維板(MDF)、硬質繊維板(HDF)等を好適に使用することができる。ここで、木質繊維板は、方向性がなく、また合板用の単板と異なり、裏割れがなく、平滑性に優れて、良好な化粧性を有しており、例えば化粧層として木質単板を用いた場合、ヒワレの発生を防止することができる。
【0019】
基材表層板(22)は、厚さ(T)を、0.2mm以上、0.5mm未満に調整する必要があり、好ましくは、その下限値を0.24mm以上、上限値を0.49mm以下に調整するのが良い。すなわちこの厚さ(T)が厚過ぎる場合、床材施工後のワックス処理により、ワックスが浸透した際に、その浸透部が膨潤して膨れ上がって、ワックス膨れが生じる恐れがある。また厚さ(T)が過度に薄いものは、製造が困難になるばかりか、基材表層板(22)として十分な表面硬度を得ることが困難になり、凹み傷が発生する恐れがある。
【0020】
更に基材表層板(22)としての木質繊維板は、密度が0.7g/cm3 以上のものを使用する必要があり、好ましくは0.75g/cm3 、より好ましくは0.8g/cm3 以上のものを使用するのが良い。すなわちこの密度が小さ過ぎる場合には、基材表層板(22)として、十分な表面硬度を得ることが困難になり、凹み傷が発生する恐れがあるとともに、基材表層板(22)内部に、密度が0.7g/cm3 未満の低密度層が形成されて、その低密度層において、層間剥離が発生する恐れがある。
【0021】
基材本体(21)と、基材表層板(22)とを積層一体化する手段としては、接着剤を用いた熱圧や冷圧接着により一体化される。
【0022】
この接着剤としては、例えば、尿素樹脂系、メラミン樹脂系、尿素・メラミン樹脂系、フェノール樹脂系、水性ビニルウレタン樹脂系、アクリル樹脂系、エポキシ樹脂系、 尿素−酢ビ樹脂系、ウレタン樹脂系、ポリビニルアルコール・イ ソシアネート樹脂系等の公知の積層接着に用いられる接着剤を適宜採用することができる。
【0023】
本発明においては、基材表層板(22)が極薄で、優れた柔軟性を有しているため、基材本体(21)上に載置した際における馴染み性が良好であり、これらの貼り付け作業を容易に行うことができ、例えばプレスによる貼り合わせ時に、位置ずれが生じるのを防止することができる。
【0024】
本発明において、基材(20)上に設けられる化粧層(30)としては、例えば、木質単板、合成樹脂含浸処理木質単板、化粧模様印刷紙、樹脂含浸化粧シート、化粧模様樹脂シート(フィルム)、透明・半透明樹脂シート(フィルム)等の基材(20)上に接着される化粧シートの他に、基材(20)の上面に、ダイレクト印刷処理、着色処理、塗装処理等を行って形成されるものや、これらを適宜組み合わせたものを好適に用いることができる。
【0025】
なお、化粧シートを接着する場合には、化粧シートの種類に応じて、熱圧、冷圧のいずれで行っても良い。
【0026】
本発明の床材(10)は、表面に任意形状の溝付け、周側端面上端部に任意形状の面取り部を形成しても良い。なお、これらの溝部分や、面取り部分には、塗料等の樹脂が塗布される場合、水分やワックスが吸収されてしまうのを有効に防止することができる。
【0027】
一方、本発明においては、基材表層板(22)には、その表裏間を貫通する多数の微小孔(微細孔)を形成しておくのが好ましい。すなわち、この場合、基材表層板(22)の柔軟性が一段と増して、基材本体(21)への馴染み性を向上させることができ、基材本体(21)への付着性、密着性を、より一層向上させることができる。
【0028】
なお、基材表層板(22)は、その厚さが、化粧層として使用される木質単板と同様の厚さであり、この厚さは、木質単板のうち、ナラ材等の広葉樹単板に形成されている導管孔と同じ深さである。このナラ材単板を木質板に貼着した際、接着剤が導管孔に浸透して表面に染み出すのと同様に、極薄の基材表層板(2 2)の微小孔に木質板側の接着剤が浸透して微小孔に充填される。従って、その基材表層板(22)の表面に、化粧層用に化粧シートを積層接着しても、微小孔の存在が床材表面において視認されることはなく、良好な美観を維持することができる。
【0029】
ただし、接着剤が、基材表層板(22)の微小孔に十分充填されず、微小孔の上部が開口していると、美観を低下させる恐れがある。すなわち、極薄の基材表層板(22)の表面に、化粧単板を貼り付けたとしても、微小孔の上部が開口していると、その開口部が、化粧単板の表面側から黒色の点となって目視された り、化粧層(30)が化粧模様印刷紙の場合では、微小孔の開口部に凹部が形成されることがあり、美観を低下させてしまう。
【0030】
また、本発明においては、必要に応じて、基材(20)の裏面側に、基材表層板(22)と同様な構成の薄板を積層しても良く、この場合には、基材(20)の表裏間における張力のバランスを図ることができるので、基材(20)、ひいては化粧板において、有害な反りの発生等を有効に防止することができる。
【0031】
(B)基材表層板の製法
基材表層板(22)としての木質繊維板は、上記したように、厚さ(T)が 0.2mm以上、0.5mm未満と極薄のものであるが、通常市販されている木質繊維板は、薄いものでも、2.7mm程度の厚さであり、これよりも薄いものを入手することは困難である。そこで、本発明においては、所定の厚さを有する市販の木質繊維板を、厚さ方向の中間において板面方向に沿って複数枚に分割 し、更に分割面に、適宜、切削処理や研磨処理を行って得られる分割板を、基材表層板(22)として用いるのが好ましい。
【0032】
(B−1) MDF分割
本発明において、木質繊維板を分割して、基材表層板(22)を製作する場 合、以下の構成を採用するのが好ましい。
【0033】
すなわち、密度が0.7g/cm3 以上、好ましくは0.75g/cm3 以上の中質繊維板(MDF)を厚さ方向の中間において板面方向に沿って3枚以上に分割し、その3枚の分割板のうち、中間層の分割板を除く、表裏両面層の2枚の分割板を基材表層板(22)として使用するものである。
【0034】
ここで、MDFは、その厚さ方向の中間部は、密度が低く、表裏両面部は、密度が高くなっており、中間部においては、0.7g/cm3 以上の所望の密度を得ることが困難である。一方、仮に、密度が0.7g/cm3 程度のMDFを2分割して、その分割面側の層(低密度側の層)を切削することによっても、所望の密度の基材表層板(22)を得ることは可能であるが、そうすると、面倒な切削作業が多く必要となるので、基材表層板(22)の製造が非常に困難になってしまう。従って、上記したように、MDFを3分割して、低密度の中間部分を除去することにより、面倒な切削作業をほとんど行うことなく、本発明の基材表層板(22)を確実に得ることができる。
【0035】
もっとも、本発明においては、MDFを3分割した際に、中間部の分割板が、所望の密度を有する場合には、その中間部の分割板を、基材表層板(22)として使用することに、何ら問題はない。
【0036】
本発明において、MDFを3分割する場合には、そのMDFを1/3の厚さのものと、2/3の厚さのものとに不均等に2分割した後、2/3の厚さの分割板を均等に2分割することにより行われる。そして、上記したように表裏両面部の2枚の分割板を基材表層板(22)として使用する。このとき、分割板の分割面は、0.05〜0.2mm程度研磨、研削して、分割面に少なからず生じている凹凸の平滑化を行うのが良い。
【0037】
なお、分割面の研磨、研削は、0.2mmを超えて行っても何ら差し支えな い。更に研磨、研削は、分割面のみならず、必要に応じて、分割前の繊維板表面に対応する面を、研磨、研削するようにしても良い。また言うまでもなく、木質繊維板の分割位置は、研磨や研削する厚さを考慮して、適宜設定すれば良い。
【0038】
また、分割面を研削、研磨することにより、分割面の平滑化のみならず、分割により分割面は微細な傷が生じており、その傷が層間剥離の要因となる恐れがあるが、分割面の傷を研削、研磨により除去できるので、分割面の傷に起因する層間剥離を防止することができる。
【0039】
(B−2)HDF分割
本発明においては、密度が0.8g/cm3 以上、好ましくは0.85g/cm3 程度以上の硬質繊維板(HDF)を、厚さ方向の中間において板面方向に沿って3枚以上に分割し、それらの各分割板を、基材表層板(22)として使用するのが良い。
【0040】
すなわち、HDFのように、高密度の木質繊維板は、厚さ方向の中間部においても、0.7g/cm3 以上の所望の密度を有しているため、分割した全ての板を、基材表層板(22)として使用することができるので、基材表層板(22)を効率良く製造することができる。
【0041】
ここで、本発明において、HDFを3分割する場合には、上記のMDF分割と同様に行われる。
【0042】
また4分割する場合には、HDFを均等に2分割して1/2の厚さのものを2つ得、更にそれらを均等に2分割することにより行われるのが通例である。
【0043】
また5分割する場合には、HDFを、2/5厚のものと、3/5厚のものとに不均等に2分割した後、2/5厚のものを均等に2分割するとともに、3/5厚のものを、上記の3分割方法と同様に、3分割することにより行われる。
【0044】
なお、HDFを用いる場合においても、分割面等は、上記と同様に、研磨、研削すれば良い。更に研削等により、分割板の厚みを調整する場合には、分割板のうち、低密度側の面を研削して、高密度を維持するようにするのが良い。
【0045】
また言うまでもなく、HDFの分割位置は、上記と同様に研磨や研削する厚さを考慮して、適宜設定すれば良い。
【0046】
また本発明においては、1枚の硬質繊維板から、同厚の複数の基材表層板を作製しても良いし、また異厚の複数の基材表層板を製作しても良い。
【0047】
(B−3)木質繊維板の分割方法
本発明において、MDFやHDF等の木質繊維板を分割する方法としては、以下の方法を好適に用いることができる。
【0048】
すなわち、木質繊維板を少なくとも一対の送りローラーにより移動させなが ら、そのローラーの出口近傍に木質繊維板の移動方向と同様に水平に配置された分割刃物により分割する。
【0049】
上記送りローラーとしては、長さ0.25〜1.0mmの針状突刺体を全周に設けた突刺ローラーを用いても良く、この場合、突刺体が木質繊維板に突き刺さることにより、ローラーに対する滑りが防止され、分割処理を正確に行えるとともに、分割板、つまり基材表層板(22)に、上記した多数の微小孔を形成することができる。
【0050】
また上記したように木質繊維板を4分割する場合、1/2厚さに2分割する処理と、1/2厚さのものを更に2分割する処理との間で、分割刃物の位置を一回変更するだけで良いので、効率良く分割作業を行うことができる。
【0051】
なお、この方法で木質繊維板を分割する場合、木材フリッチを所定の厚さにスライサーにて突板を得るように、繊維板表面から順次スライスする方法を採用すると、厚い方の分割板の分割面に割れが生じ、その分割板が折れて破損する恐れがあるので、好ましくない。
【0052】
一方、上記以外の分割方法としては、木質繊維板を、木質板からなる基材本体(21)上に接着して、あらかじめ複合板を形成しておき、その複合板の木質繊維板を、上記と同様な装置により、分割する方法も採用することができる。すなわち、基材本体(21)上の木質繊維板を分割し、その分割により分割された木質繊維板のうち、基材本体(21)に接着された木質繊維板を、再び分割して所定の厚さに調整して、基材(20)として使用する。一方、分割により分離された木質繊維板は、基材本体(21)に接着されて、必要に応じて分割して、基材(20)として使用する。
【0053】
なお、上記の分割方法は、木質繊維板の中心位置で均等に2分割する処理の繰り返しであるが、分割位置は木質繊維板の中心位置に限られず、適宜設定すれば良い。ただし、1回目の分割において、基材本体(21)に貼着される側の木質繊維板が極薄になるよう分割するのは好ましくない。すなわち、分離される側の木質繊維板が、基材本体側の木質繊維板に比べて非常に厚くなるので、分割面に割れが生じて破損する恐れがあるからである。
【0054】
(B−4)分割前の処理
木質繊維板は、分割した際に、分割面に大きな凹凸が生じたり、特に不均等厚さに2分割した際には、分割面に割れが生じて破損する恐れがある。そこで、これらの不具合をなくして、この分割を容易に行えるように、以下に示すような前処理により、木質繊維板を軟化させておくのが好ましい。
【0055】
(B−4−1)加熱処理
木質繊維板を分割する直前に、平盤熱プレスや熱ロール等により加熱する。
【0056】
(B−4−2)含水処理
散水方式、ロールコーターやスポンジコーターによる水塗布方式により、木質繊維板に吸湿・吸水させた後、その水分が内部(内層、芯層部分)まで浸透するまで養生させる。
【0057】
(B−4−3)吸水・加熱処理
木質繊維板に吸湿・吸水させた後、上記の加熱処理を行う。この際、加熱処理は、吸湿・吸水処理の直後に行っても、吸湿・吸水処理して養生させた後に行っても良い。
【0058】
(C)微小孔の形成方法
基材表層板(22)に、微小孔を形成する方法としては、例えば、上記したように、木質繊維板(MDF、HDF)を分割する際に、その分割装置における繊維板送り用ローラーとして、長さ0.25〜1.0mmの針状の突刺体が全周に設けられたものを用いて、分割処理と同時に、微小孔を形成することができる。この場合、3分割以上行う場合には、分割面に複数回突刺体が差し込まれるの で、より多くの微小孔を形成することができる。
【0059】
なお、本発明においては、木質繊維板の分割工程とは別の工程において、上記突刺体付きローラーを用いて、微小孔を形成するようにしていも良い。また、微小孔があらかじめ形成されたMDF、HDF等の木質繊維板を分割して、微小孔付きの極薄木質繊維板を得るようにしても良い。
【0060】
(D)床材の製法
本発明においては、基材本体(21)用の木質板、基材表層板(22)、及び化粧層(30)用の化粧シートの3層を、順次積層した後、これらを同時に接着することが可能である。この場合、基材本体(21)の表面に接着剤を介して極薄の基材表層板(22)を貼り付けた際に、基材表層板(22)は、その優れた柔軟性により、基材本体(21)上面に無理なく馴染み、基材表層板(22)の端部や中央部が浮き上がることがないので、その状態で、その複合板(基材2 0)の表面に、化粧シート接着用の接着剤を、糊付機(スプレッダー)により確実に塗布することができる。従ってその接着剤塗布面に化粧シートを貼り付けた後、この積層体を圧締することにより、これらを同時に接着一体化することができる。
【0061】
また、本発明においては、基材表層板(22)が極薄であるため、各積層体 (21)(22)(30)を、上記のように熱圧にて圧締すると1〜2分程度で圧締処理(プレス処理)が終了するため、通常は熱圧が生産効率上有利である。もっとも、上記圧締処理は、熱圧、冷圧のいずれで行っても良く、また冷圧後、熱圧を行うようにしても良い。
【0062】
なお、基材表層板(22)として、木質繊維板を2分割しただけの分割板(2分割繊維板)を用いる場合には、上記したような3層同時接着を行うことは困難である。すなわち、2分割繊維板は、分割面側の層と表面側の層との間に、表面側の密度が大きくなるような密度差があり、通常は、分割面側を凸とする反りが生じる。このため、接着剤が塗布された基材本体用の木質板上に、2分割繊維板を貼り付けようとしても、2分割繊維板は、木質板上に馴染まず、部分的に浮き上がりが生じるので、その状態では、糊付機に挿通させることができず、接着剤を塗布することができず、上記の3層同時接着を行うことが困難である。また、2分割繊維板の表裏両面に接着剤を塗布しておいて、3層を重ね合わせて、熱圧を行う方法もあるが、この場合においても、2分割繊維板が基材本体から部分的に浮き上がるので、熱圧時に位置ずれが生じて、製品不良が発生する恐れがあるので、3層同時接着を行うことが困難である。
【0063】
(E) 他の構成及び作用効果
本発明の床材(10)は、外周端面に本ざね加工や相じゃくり実はぎ加工等の接合用加工が施される。図1に示すように、本ざね加工では、周囲4辺のうち隣り合う2辺に雄ざね(11)が形成されるとともに、残り2辺に雌ざね(12)が形成される。
【0064】
そして本発明においては、複数の床材(10)を、隣り合う床材間において、一方の床材(10)の雄ざね(11)を他方の床材(10)の雌ざね(12)に嵌合しつつ、図示しない根太組等の床下地上に接着剤と釘とを併用して施工するものである。
【0065】
以上のように、本発明における床材(10)は、基材表層板(22)が、厚さ0.2mm以上、0.5mm未満の極薄板により構成されているため、施工後 に、ワックス処理が施されて、隣り合う床材間に浸入した余剰のワックスが床材(10)の外周端面から、基材表層板(22)に浸透したとしても、その浸透部が大きく膨れることがなく、ワックス膨れを確実に防止できて、良好な美観を維持することができる。
【0066】
また、基材表層板(22)としての木質繊維板は、良好な均質性を備えているため、ヒワレの発生を確実に防止することができる。
【0067】
更にこの木質繊維板は、0.7g/cm3 以上の高密度を有するもので、十分な表面硬度を有しているため、凹み傷の発生も防止することができる。
【0068】
また、本発明の床材(10)は、基材表層板(22)としての木質繊維板の繊維層が接着剤により基材本体(21)と接着一体化しているので、層間剥離の発生を防止することができる。更に基材表層板(22)は、極薄であるため、厚さ方向における密度のばらつきは小さく、しかも、高密度であるため、基材表層板(22)内部での層間剥離も確実に防止することができる。
【0069】
また基材表層板(22)としての木質繊維板は、極薄であるため、十分な柔軟性を具備しており、基材本体(21)上に載置した際の馴染み性が良好で、基材本体(21)への貼り付け作業を容易に行うことができ、例えばプレスによる貼り合わせ時に、位置ずれを防止することができる。なお、基材表層板(22)としての極薄板に、多数の微小孔が形成される場合には、柔軟性が更に増すので、より一層貼り付け作業を容易に行うことができる。
【0070】
更に上記したように、基材本体用の木質板、基材表層板(22)、及び化粧層用の化粧シート等を3層同時に接着することができ、生産効率を向上させることができる。
【0071】
なお、本発明は、上記の床材に限られず、壁仕上げ材等、他の化粧板にも適用することができる。
【0072】
【実施例】
以下、本発明に関連した実施例、その効果を導出するための比較例及び参照例について説明する。
【0073】
【表1】

Figure 0004315542
【0074】
<実施例1>
上表1に示すように、密度0.75g/cm3 、厚さ2.7mm、幅943mm、長さ1836mmの中質繊維板(MDF)を、表面側から0.5mmの位置で厚さを分割し、2枚の0.5mm厚の分割板と、1枚の1.7mm厚の分割板とを得た。このとき、0.5mm厚の分割板は、密度が0.78g/cm3 であった。更にこの分割板を、その分割面側を0.2mm程度、切削、研磨して、分割面に少なからず生じている凹凸を除去して平滑化を図り、更にこの板を、幅方向に3分割することにより、密度0.83g/cm3 、厚さ0.3mmの基材表層板を得た。
【0075】
続いて、スチレン−ブタジエンゴム(SBR)混合ユリヤ−メラミン樹脂接着剤を表面に塗布した厚さ10.7mmの5プライ合板(幅及び長さは、上記基材表層板と同じ)からなる基材本体上に、上記基材表層板を、110℃で1分間熱圧接着し、基材としての複合板を得た。なお、この基材は、熱圧接着処理後、1日間放置して養生を行った。
【0076】
次に、上記基材の表面に、SBR混合ユリヤ−メラミン樹脂接着剤を用いて、0.3mm厚のナラ単板(化粧層)を110℃で1分間熱圧接着した後、表面 に、幅を3等分する態様に溝付けを行って、長さ方向の端面に面取り部を形成 し、更に周囲四側端面に本ざね加工を施し、その後、着色して塗装仕上げを行 い、実施例1の床材を得た。
【0077】
なお、この実施例において、木質繊維板は、分割直前に、表面温度が80〜90℃になるように前処理を行った。また木質繊維板の分割は、上記「課題を解決するための手段」の「B−3」の欄において述べた、突刺体付きローラーを用いて行った。
【0078】
<実施例2〜5>
上表1に示すように、密度0.90g/cm3 、厚さ2.7mm、幅943mm、長さ1836mmの硬質繊維板(HDF)を、厚さ方向の中央部でほぼ均等に2分割し(1回目の分割処理)、厚さ1.35mmの2枚の分割板を得た。
【0079】
続いて、一方の分割板を、分割前のHDFにおける表面側から厚さ方向に0.5mmの位置で分割し(2回目の分割)、厚さ0.5の分割板と、厚さ0.85mmの分割板とを得、更に各分割板の分割面を研削、研磨して、厚さ0.3mmの2枚の分割板(基材表層板)を得た。このとき、分割前のHDFにおける表面側の分割板(基材表層板)の密度は1.04g/cm3 、内部側の分割板(基材表層板)の密度は0.86g/cm3 であった。
【0080】
次に、上記1回目の分割処理において分割された他方の分割板を、分割前のHDFにおける表面側から厚さ方向に0.58mmの位置で分割し、厚さ0.58mmの分割板と、厚さ0.77mmの分割板とを得、更に各分割板の分割面を切削、研磨して、厚さ0.47mmの2枚の分割板(基材表層板)を得た。このとき、分割前のHDFにおける表面側の分割板(基材表層板)の密度は0.95g/cm3 、内部側の分割板(基材表層板)の密度は0.85g/cm3 であっ た。
【0081】
そして、厚さ0.3mm、密度1.04g/cm3 の上記基材表層板を用い て、上記実施例1と同様に、床材を得、実施例2とした。
【0082】
更に、厚さ0.3mm、密度0.86g/cm3 の上記基材表層板を用いて、上記実施例1と同様に、床材を得、実施例3とした。
【0083】
また、厚さ0.47mm、密度0.95g/cm3 の上記基材表層板を、表面にSBR混合ユリヤ−メラミン樹脂接着剤を塗布した厚さ10.7mmの5プライ合板(基材本体)に貼り付けて積層体(基材)を得た後、その積層体の表面 に、スプレッダーにより、SBR混合ユリヤ−メラミン樹脂接着剤を塗布して、ナラ単板(化粧層)を貼り付けて、115℃で90秒間熱圧接着した。その他 は、上記実施例1と同様にして、床材を得、実施例4とした。
【0084】
また、厚さ0.47mm、密度0.85g/cm3 の上記基材表層板を用い て、上記実施例1と同様に、床材を得、実施例5とした。
【0085】
<比較例1>
厚さ2.7mm、密度0.70g/cm3 のMDFを、厚さ方向の中間位置で2分割し、厚さ1.35mmの2枚の分割板を得た。そして、一方の分割板をその分割面を接着面として、厚さ10.5mmの5プライ合板(基材本体)に、熱圧接着し、それ以外は、上記実施例1と同様にして、比較例1としての床材を得た。
【0086】
<比較例2>
厚さ2.7mm、密度0.75g/cm3 のHDFを表面側から厚さ方向に 1.1mmの位置で分割し、厚さ1.1mmの分割板と、厚さ1.6mmの分割板とを得た。続いて、厚さ1.1mmの上記分割板を、その分割面を0.1mm研削、研磨して、分割面に少なからず生じている凹凸を除去して平滑化を行い、厚さ1.0mm、密度0.95の木質繊維板(基材表層板)を作製した。それ以外は、上記実施例1と同様にして、比較例2としての床材を得た。
【0087】
<参照例>
木質繊維板を用いずに床材を作製した。すなわち、厚さ11.7mmの5プライ合板に、SBR混合ユリヤ−メラミン樹脂接着剤にて、厚さ0.3mmのナラ単板(化粧層)を110℃で1分間熱圧接着し、それ以外は、上記実施例1と同様にして、参照例としての床材を得た。
【0088】
<評価試験>
上記実施例及び比較例の床材に対し、下記のa〜dの評価試験を行った。
【0089】
a.ワックス試験
床材同士を0.1mmの隙間を設けてさね部を嵌合した状態に接合し、その接合部に水性エマルジョンタイプのワックスを10g滴下した。このとき、滴下されたワックスのほとんどが床材間の隙間(接合部)に浸入した。
【0090】
そしてワックスを滴下してから5分間放置した後、床材表面に残存する少量のワックスを拭き取り、更に1日間放置した後、床材の接合部周辺の厚さ膨れ(ワックス膨れ)を測定した。その結果を下表2に示す。
【0091】
【表2】
Figure 0004315542
【0092】
上表2から明らかなように、実施例1〜5の床材は、いずれも比較例1の床材に比べて、厚さ膨れが半分以下で非常に小さいものであり、更に比較例2の床材と比べても、厚さ膨れがかなり小さいものであり、各実施例の床材は、ワックス膨れが目立たず、良好な美観を維持するものであった。これに対し、比較例1、2の床材は、ワックス膨れが大きくて目立ち、美観に劣るものであった。
【0093】
b.デュポン試験
JISK5400による落球衝撃試験を行い、凹みの深さを測定した。その結果を上表2に示す。なお、実施例及び比較例に用いた合板(基材本体)のデュポン試験による凹み深さは、0.62〜0.68mmの範囲であり、平均が0.66mmであった。
【0094】
上表2から明らかなように、実施例1〜5の床材は、参照例の床材と比べて、凹み深さを大きく低減させることができた。なお、各実施例の床材は、比較例 1、2と比べると、若干、凹み深さは大きくなっているものの、参照例の床材に対する凹み深さの低減効果(参照例の床材との差)を基に判断した場合、各実施例の床材は、比較例1、2の床材と比べても、遜色はなく、凹み傷を十分に防止できるものであることを確認できた。
【0095】
c.表面引張強さ
特殊合板のJASに準じた方法であり、合板(基材本体)と基材表層板との接着層、木質繊維板(基材表面層)とナラ単板(化粧層)との接着層、基材表層板内部層のうち、いずれかの層で破壊が生じる形態で測定した。その結果を上表2に示す。
【0096】
上表2に示すように、各実施例の床材は、いずれも、合板(基材本体)と基材表層板との間の接着層において剥離が生じ、構造上安定しており、しかも、いずれの床材も、十分な引張強さを備えるものであった。
【0097】
これに対し、比較例1の床材は、実施例と同様に、合板(基材本体)と基材表層板との間の接着層において剥離が生じるものと、実施例と異なり、木質繊維板(基材表層板)内部において剥離が生じるものとがあり、構造上ばらつきを有しているのが判る。更に接着層で剥離が生じるものでは、実施例と同程度の引張強さを得ることができるものの、木質繊維板内部で剥離が生じるものは、3.6kg/cm2 と非常に低い引張強さしか得られず、引張強さの点でも、大きなばらつきを有しているのが判る。これは、比較例1の床材は、分割面に平滑処理を行わない木質繊維板の分割板を使用しているため、すなわち、2分割により層間強度の低下を生じた層をそのままにして使用しているため、ばらつきが大きくなったものと考えられる。
【0098】
d.寒熱繰り返しB試験
特殊合板のJASに準じて5サイクル実施した。その結果を上表2に示す。
【0099】
上表2から明らかなように、実施例及び比較例共に、床材表面にヒワレが生じることはなかった。しかし、比較例1の床材においては、2サイクル終了後に、基材表層板の側端面(木口面)に、床材表面から約0.6〜0.4mmの範囲において、斜め方向に、長さ4mm、5mm、6mmの3本のヘアーラインクラックが生じるものがあった。この結果と、上記表面引張強さ試験の結果とを合わせて判断すると、比較例1の床材は、木質繊維板内部で層間剥離が生じる恐れがあることが判る。
【0100】
なお、上記比較例2において、ヘアーラインクラックは、密度分布が、0.75g/cm3 未満、とりわけ0.7g/cm3 未満の箇所で発生していた。
【0101】
【発明の効果】
以上のように、この発明の化粧板によれば、基材表層板を構成する木質繊維板として、厚さが0.2mm以上、0.5mm未満の極薄のものを用いているた め、化粧板端面から基材表層板にワックスが浸透しようとも、その浸透部が大きく膨れ上がることはなく、ワックス膨れを有効に防止することができる。また基材表層板としての木質繊維板は、良好な均質性を備えているため、ヒワレの発生を確実に防止することができる。更に基材表層板を構成する木質繊維板として、密度が0.7g/cm3 以上の高密度のものを用いているため、極薄であろうとも、十分な表面硬度を得ることができ、凹み傷の発生も防止することができるという効果がある。
【0102】
本発明において、基材表層板は、木質繊維板を厚さ方向の中間において板面方向に沿って複数枚に分割して得られる分割板をもって構成することができる。
【0103】
また本発明において、基材表層板が、密度が0.7g/cm3 以上の中質繊維板からなる木質繊維板を厚さ方向の中間において板面方向に沿って3枚に分割 し、その表裏両側の2枚の分割板のいずれかをもって構成されてなるものを採用する場合、面倒な切削作業をほとんど行うことなく、基材表層板を簡単に製作することができるという利点がある。
【0104】
更に本発明において、基材表層板が、密度が0.8g/cm3 以上の硬質繊維板からなる木質繊維板を、厚さ方向の中間において板面方向に沿って3枚以上に分割して得られる分割板をもって構成されてなるものを採用する場合、分割した全ての板を、基材表層板として使用することができるので、基材表層板を効率良く製造することができるという利点がある。
【0105】
また本発明において、基材表層板が、密度が0.8g/cm3 以上の硬質繊維板からなる木質繊維板を、厚さ方向の中間において板面方向に沿って4枚に分割して得られる分割板をもって構成されてなるものを採用する場合、木質繊維板を1/2厚さに2分割する処理と、1/2厚さのものを更に2分割する処理との間で、分割刃物の位置を一回変更するだけで良いので、効率良く分割作業を行うことができるという利点がある。
【0106】
更に本発明においては、基材表層板に、その表裏面間を貫通する微小孔が多数設けられてなる構成を採用する場合、基材表層板の柔軟性が一段と増して、基材本体への馴染み性を向上させることができ、基材本体への付着性や密着性を、より一層向上させることができるという利点がある。
【図面の簡単な説明】
【図1】この発明に関連した施工状態の床材における接合部を示す断面図である。
【図2】従来の床材における接合部を示す断面図である。
【図3】従来の床材を施工した状態で示す平面図である。
【符号の説明】
10…床材
20…基材
21…基材本体
22…基材表層板
30…化粧層
T…厚さ[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a decorative board used as a wall finishing material in addition to a floor finishing material.
[0002]
[Prior art]
As a decorative board for floor finishing in a building such as a house, a floor material in which a decorative layer such as a decorative veneer is laminated on the surface of a base material such as plywood is well known. Due to cracks (lace check) generated on the surface single plate, unevenness of the surface single plate, etc., defects such as cracks (flipping) may occur in the decorative layer. Furthermore, since the surface hardness of the plywood substrate is low, when a hard material is dropped on the floor material surface, a dent and scratch may be formed on the floor material surface.
[0003]
Therefore, as shown in FIG. 2, a composite board in which a base material surface layer board (2b) made of a wood fiber board such as a medium specific gravity fiber board (MDF) is laminated on the surface of a base material body (2a) made of plywood. A flooring (1) having a base layer (2) and a decorative layer (3) provided on the surface of the base material may be used. In this flooring (1), the MDF constituting the base material surface layer plate (2b) has no directionality and excellent homogeneity, so that it is possible to prevent the occurrence of cracks, the surface hardness is large, and the occurrence of dents and scratches. Can also be prevented.
[0004]
[Problems to be solved by the invention]
The floor material (1) as described above is usually subjected to bonding processing such as main ridges on the outer peripheral edge, and male ridges (1a) are formed on two adjacent sides of the four surrounding sides. The female ridge (1b) is formed on the remaining two sides. And between the adjacent floor materials, while fitting the male ridge (1a) of one floor material (1) to the female ridge (1b) of the other floor material (1), a plurality of floor materials (1), As shown in FIG. 3, the floor base (5) such as a joist is constructed by using an adhesive and a nail in combination, and as shown in FIG. 2, the side of the adjacent flooring (1) (1) A gap (S) is partially formed between the end faces, that is, the floor material joint due to the influence of the assembly error and the like.
[0005]
On the other hand, immediately after the floor material (1) is newly installed or at the time of maintenance after the floor material construction, wax treatment is performed on the floor surface. In the wax treatment, a large amount of wax is usually applied on the floor surface, and then the excess wax is wiped off from the floor surface while wiping out the wax so that it is uniformly applied to the entire floor surface. Before wiping off the wax, the wax accumulated in the floor joint penetrates into the gap (S) of the joint, and the wax penetrates into the floor from the side end surface of the floor (1). The swelling in the thickness direction occurs around the joint of the material (1), and as shown by the imaginary line in FIG. 2, the periphery of the joint of the floor material (1) swells upward, so-called wax swelling occurs. A problem arises that the aesthetics are impaired.
[0006]
The present invention provides a decorative board such as a flooring that can solve the problems of the prior art and can prevent the occurrence of swelling and dents, and also prevent the occurrence of wax swelling and maintain a good aesthetic appearance. The purpose is to do.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the present inventor first analyzed in detail the cause of the occurrence of wax swelling using a flooring material as a decorative board. As a result of the analysis, the amount of expansion and contraction due to moisture absorption and release is much greater in the wood fiber board laminated on the wood board such as plywood, so if a small amount of wax penetrates into the wood fiber board, its penetration part It was found that the swelled greatly and caused the above-mentioned wax swell. Therefore, if the wood fiber board on the base material surface of the flooring material is made thin or the wood fiber board is removed, the occurrence of wax swelling can be prevented. In fact, in the flooring of the plywood base material on which the wood fiber board is not laminated, the above-mentioned wax swelling does not become a problem.
[0008]
However, when the wood fiber board on the plywood substrate is thinned, it becomes difficult to prevent the occurrence of the dents as described in the conventional example.
[0009]
Under such circumstances, the inventor has further conducted thorough research, and as a result, in the flooring having a base material in which wood fiberboard is laminated on a woodboard such as plywood, as a wood fiberboard, By using the configuration described above, an optimum configuration capable of achieving the above object was found, and the present invention was achieved.
[0010]
That is, the present invention is a decorative board having a plate-like substrate in which a substrate surface layer plate is laminated on the surface of a substrate body made of a wooden board, and a decorative layer provided on the surface of the plate-like substrate. The substrate surface layer plate is adjusted to have a thickness of 0.2 mm or more and less than 0.5 mm, and a density of 0.7 g / cm. Three The gist of the above-described wood fiber board is used.
[0011]
In the decorative board of the present invention, the wood fiber board constituting the base material surface layer board uses an extremely thin one having a thickness of 0.2 mm or more and less than 0.5 mm. Even if the wax penetrates into the inside of the plate, the permeation portion does not swell greatly, and the swelling of the wax can be effectively prevented.
[0012]
Furthermore, since the wood fiber board as a base material surface board is provided with favorable homogeneity, generation | occurrence | production of a crack can be prevented reliably.
[0013]
Moreover, the density is 0.7 g / cm as a wood fiber board for the base material board. Three Since the above-described high-density one is used, even if it is extremely thin as described above, a sufficient surface hardness can be obtained, and the occurrence of dents can be reliably prevented.
[0014]
Hereinafter, the structure of the decorative board of the present invention will be described in more detail with reference to the drawings.
[0015]
(A) Configuration of each part
As shown in FIG. 1, the decorative board of the present invention can be suitably used particularly for a flooring (10) for floor finishing. This flooring (10) has a plate-like base material (20) made of a composite plate and a decorative layer (30) provided on the surface of the base material (20).
[0016]
The base material (20) is composed of a composite plate in which a base material surface plate (22) made of a wood fiber board is bonded to a base material body (21) made of a wood board.
[0017]
Here, in the present invention, as the wood board constituting the base body (22), Lauan plywood, softwood plywood, plywood in which a single board of hardwood material such as Lauan material and a single board of softwood material are used, A particle board, a wafer board, an oriented strand board (OSB), a single plate laminated material (LVL), a lumbar core plywood, a laminated material, or a combination of these can be suitably used.
[0018]
Moreover, as a wood fiber board which comprises a base-material surface board (22), a medium fiber board (MDF), a hard fiber board (HDF), etc. can be used conveniently. Here, the wood fiber board has no directionality, and unlike a single board for plywood, there is no back crack, excellent smoothness, and good cosmetic properties. The use of can prevent the occurrence of cracks.
[0019]
The substrate surface layer plate (22) needs to be adjusted to have a thickness (T) of 0.2 mm or more and less than 0.5 mm. Preferably, the lower limit value is 0.24 mm or more and the upper limit value is 0.49 mm. The following adjustments are recommended. That is, when this thickness (T) is too thick, when the wax permeates through the wax treatment after the flooring construction, the permeation portion swells and swells up, and there is a risk that the wax bulges. In addition, when the thickness (T) is excessively thin, it becomes difficult to produce, and it becomes difficult to obtain a sufficient surface hardness as the substrate surface layer plate (22), which may cause dents.
[0020]
Furthermore, the wood fiber board as the base material surface board (22) has a density of 0.7 g / cm. Three It is necessary to use the above, preferably 0.75 g / cm Three , More preferably 0.8 g / cm Three It is good to use the above. That is, when this density is too small, it becomes difficult to obtain a sufficient surface hardness as the substrate surface layer plate (22), and there is a possibility that dents may be generated, and the inside of the substrate surface layer plate (22). The density is 0.7 g / cm Three Less low density layer is formed, and delamination may occur in the low density layer.
[0021]
As a means for laminating and integrating the substrate body (21) and the substrate surface layer plate (22), they are integrated by hot pressure or cold pressure bonding using an adhesive.
[0022]
Examples of the adhesive include urea resin, melamine resin, urea / melamine resin, phenol resin, aqueous vinyl urethane resin, acrylic resin, epoxy resin, urea-vinyl acetate resin, and urethane resin. Adhesives used for known laminate adhesion such as polyvinyl alcohol / isocyanate resin can be appropriately employed.
[0023]
In the present invention, since the substrate surface layer plate (22) is extremely thin and has excellent flexibility, the familiarity when placed on the substrate body (21) is good. It is possible to easily perform the pasting operation, and for example, it is possible to prevent the occurrence of positional deviation at the time of pasting with a press.
[0024]
In the present invention, examples of the decorative layer (30) provided on the substrate (20) include a wood veneer, a synthetic resin-impregnated wood veneer, a decorative pattern printing paper, a resin-impregnated decorative sheet, and a decorative pattern resin sheet ( In addition to the decorative sheet to be bonded on the base material (20) such as a film) or a transparent / translucent resin sheet (film), the top surface of the base material (20) is subjected to direct printing treatment, coloring treatment, coating treatment, etc. What is formed by performing and what combined these suitably can be used suitably.
[0025]
In addition, when adhering a decorative sheet, depending on the type of decorative sheet, either hot pressure or cold pressure may be used.
[0026]
The flooring (10) of the present invention may have an arbitrarily shaped groove on the surface and an arbitrarily shaped chamfered portion at the upper end of the circumferential end surface. In addition, when resin, such as a coating material, is applied to these groove portions and chamfered portions, it is possible to effectively prevent moisture and wax from being absorbed.
[0027]
On the other hand, in the present invention, it is preferable to form a large number of micropores (micropores) penetrating between the front and back surfaces of the substrate surface layer plate (22). That is, in this case, the flexibility of the substrate surface layer plate (22) is further increased, and the conformability to the substrate body (21) can be improved, and the adhesion and adhesion to the substrate body (21) can be improved. Can be further improved.
[0028]
The base material surface board (22) has a thickness similar to that of a wood veneer used as a decorative layer. It is the same depth as the conduit hole formed in the plate. When this oak veneer is attached to a wooden board, the adhesive penetrates into the conduit holes and oozes out to the surface. The adhesive penetrates and fills the micropores. Therefore, even if a decorative sheet for a decorative layer is laminated and bonded to the surface of the substrate surface layer plate (22), the presence of micropores is not visually recognized on the floor material surface, and a good aesthetic appearance is maintained. Can do.
[0029]
However, if the adhesive is not sufficiently filled in the micropores of the substrate surface layer plate (22) and the upper portions of the micropores are open, the appearance may be deteriorated. That is, even if the decorative veneer is attached to the surface of the ultrathin base material surface plate (22), if the upper part of the micropore is open, the opening is black from the surface side of the decorative veneer. When the decorative layer (30) is made of decorative pattern printing paper, a concave portion may be formed in the opening of the minute hole, which deteriorates the aesthetic appearance.
[0030]
Moreover, in this invention, you may laminate | stack the thin plate of the structure similar to a base-material surface layer board (22) on the back surface side of a base material (20) as needed. Since the balance of the tension between the front and back surfaces of 20) can be achieved, it is possible to effectively prevent the occurrence of harmful warping and the like in the base material (20) and, consequently, the decorative board.
[0031]
(B) Manufacturing method of substrate surface board
As described above, the wood fiber board as the substrate surface layer board (22) has an extremely thin thickness (T) of 0.2 mm or more and less than 0.5 mm. Even if the board is thin, it is about 2.7 mm thick, and it is difficult to obtain a board thinner than this. Therefore, in the present invention, a commercially available wood fiberboard having a predetermined thickness is divided into a plurality of pieces along the plate surface direction in the middle of the thickness direction, and further, cutting treatment or polishing treatment is appropriately performed on the division surface. It is preferable to use the dividing plate obtained by performing as the base material surface layer plate (22).
[0032]
(B-1) MDF division
In the present invention, when the base fiber board (22) is manufactured by dividing the wood fiber board, it is preferable to adopt the following configuration.
[0033]
That is, the density is 0.7 g / cm Three Or more, preferably 0.75 g / cm Three The above-described medium fiberboard (MDF) is divided into three or more along the plate surface direction in the middle of the thickness direction, and the front and back double-sided layers of the three divided plates excluding the divided plate of the intermediate layer Two divided plates are used as the substrate surface layer plate (22).
[0034]
Here, the MDF has a low density in the middle part in the thickness direction, and a high density in the front and back double-sided parts, and 0.7 g / cm in the middle part. Three It is difficult to obtain the above desired density. On the other hand, if the density is 0.7 g / cm Three It is possible to obtain a base material surface plate (22) having a desired density by dividing the MDF of the degree into two and cutting the layer on the divided surface side (the layer on the low density side). Since a lot of troublesome cutting work is required, it becomes very difficult to manufacture the substrate surface layer plate (22). Therefore, as described above, by dividing the MDF into three parts and removing the low-density intermediate part, the base material surface layer plate (22) of the present invention can be reliably obtained with little troublesome cutting work. Can do.
[0035]
However, in the present invention, when the MDF is divided into three and the intermediate divided plate has a desired density, the intermediate divided plate is used as the substrate surface layer plate (22). There is no problem.
[0036]
In the present invention, when the MDF is divided into three, the MDF is divided into two unequal parts having a thickness of 1/3 and a thickness of 2/3, and then a thickness of 2/3. This is done by equally dividing the divided plate into two. Then, as described above, the two divided plates of the front and back double-sided portions are used as the substrate surface layer plate (22). At this time, the dividing surface of the dividing plate is preferably polished and ground by about 0.05 to 0.2 mm to smooth the unevenness generated in the dividing surface.
[0037]
It should be noted that polishing and grinding of the divided surface can be performed beyond 0.2 mm. Further, in the polishing and grinding, not only the divided surface but also the surface corresponding to the fiberboard surface before the division may be polished and ground as necessary. Needless to say, the division position of the wood fiber board may be appropriately set in consideration of the thickness to be polished or ground.
[0038]
Also, by grinding and polishing the dividing surface, not only the dividing surface is smoothed, but also the dividing surface has fine scratches due to the dividing, and the scratches may cause delamination. Since the scratches can be removed by grinding and polishing, delamination due to the scratches on the divided surface can be prevented.
[0039]
(B-2) HDF division
In the present invention, the density is 0.8 g / cm. Three Or more, preferably 0.85 g / cm Three It is good to divide a hard fiber board (HDF) of about a grade or more into three or more along the plate surface direction in the middle of the thickness direction, and use each of these divided boards as the substrate surface layer board (22). .
[0040]
That is, like HDF, the high-density wood fiberboard is 0.7 g / cm even in the middle part in the thickness direction. Three Since it has the above desired density, all the divided | segmented board | plates can be used as a base-material surface board (22), Therefore A base-material surface board (22) can be manufactured efficiently.
[0041]
Here, in the present invention, when the HDF is divided into three, it is performed in the same manner as the above MDF division.
[0042]
In the case of dividing into four parts, it is a common practice to divide the HDF equally into two parts to obtain two halved thicknesses and further divide them into two equally.
[0043]
When dividing into 5 parts, the HDF is divided into 2/5 thickness and 3/5 thickness non-uniformly, and then 2/5 thickness is equally divided into 2 and 3 Similar to the above-described three-division method, the / 5-thickness is divided into three.
[0044]
Even in the case of using HDF, the dividing surface and the like may be polished and ground in the same manner as described above. Furthermore, when adjusting the thickness of a division board by grinding etc., it is good to maintain the high density by grinding the surface of the low density side among division boards.
[0045]
Needless to say, the division position of the HDF may be appropriately set in consideration of the thickness to be polished or ground in the same manner as described above.
[0046]
In the present invention, a plurality of substrate surface plates with the same thickness may be produced from one hard fiber plate, or a plurality of substrate surface plates with different thicknesses may be produced.
[0047]
(B-3) Wood fiber board dividing method
In the present invention, the following method can be suitably used as a method for dividing a wood fiber board such as MDF or HDF.
[0048]
That is, while the wood fiber board is moved by at least a pair of feed rollers, the wood fiber board is divided by the divided blades arranged horizontally near the exit of the rollers in the same manner as the moving direction of the wood fiber board.
[0049]
As the feed roller, a piercing roller provided with a needle-like piercing body having a length of 0.25 to 1.0 mm on the entire circumference may be used. In this case, the piercing body pierces the wood fiber board, so that Slipping is prevented, the division process can be performed accurately, and the above-described many micropores can be formed in the divided plate, that is, the base material surface plate (22).
[0050]
Further, as described above, when the wood fiberboard is divided into four parts, the position of the divided blade is fixed between the process of dividing the half-thickness into two and the process of further dividing the half-thick one into two. Since it only needs to be changed once, division work can be performed efficiently.
[0051]
In addition, when dividing a wood fiber board by this method, if a method of sequentially slicing the wood flitch from the fiber board surface so as to obtain a protruding board with a slicer to a predetermined thickness, the dividing surface of the thicker divided board is used. This is not preferable because the split plate may be broken and the split plate may be broken and damaged.
[0052]
On the other hand, as a dividing method other than the above, the wood fiber board is bonded to the base material body (21) made of wood board to form a composite board in advance. It is also possible to adopt a method of dividing by the same apparatus as in FIG. That is, the wood fiber board on the base body (21) is divided, and among the wood fiber boards divided by the division, the wood fiber board bonded to the base body (21) is divided again to obtain a predetermined It adjusts to thickness and uses it as a base material (20). On the other hand, the wood fiber board separated by the division is bonded to the base body (21), and is divided as necessary to be used as the base (20).
[0053]
In addition, although said dividing method is the repetition of the process equally divided into two at the center position of a wood fiber board, a division position is not restricted to the center position of a wood fiber board, What is necessary is just to set it suitably. However, in the first division, it is not preferable to divide the wood fiber board to be attached to the base body (21) so as to be extremely thin. That is, the separated wooden fiberboard is much thicker than the base material main body wooden fiberboard, so that there is a risk that the split surface will be cracked and damaged.
[0054]
(B-4) Processing before division
When the wood fiber board is divided, large unevenness is generated on the dividing surface, or particularly when the wood fiber board is divided into two parts with non-uniform thickness, there is a possibility that the dividing surface is cracked and damaged. Therefore, it is preferable to soften the wood fiber board by a pretreatment as described below so that these problems can be eliminated and the division can be easily performed.
[0055]
(B-4-1) Heat treatment
Immediately before dividing the wood fiber board, it is heated by a flat plate heat press or a hot roll.
[0056]
(B-4-2) Moisture treatment
After water absorption and water absorption by the water spray system and roll coater or sponge coater, the wood fiber board is cured until the moisture penetrates into the inside (inner layer and core layer part).
[0057]
(B-4-3) Water absorption / heat treatment
After the wood fiber board absorbs moisture and absorbs water, the above heat treatment is performed. At this time, the heat treatment may be performed immediately after the moisture absorption / water absorption treatment or after the moisture absorption / water absorption treatment is cured.
[0058]
(C) Micropore formation method
As a method for forming micropores in the substrate surface layer plate (22), for example, as described above, when dividing a wood fiberboard (MDF, HDF), as a fiberboard feeding roller in the dividing device, By using a needle-like piercing body having a length of 0.25 to 1.0 mm provided on the entire circumference, micropores can be formed simultaneously with the dividing process. In this case, when three or more divisions are performed, the piercing body is inserted into the dividing surface a plurality of times, so that more micropores can be formed.
[0059]
In the present invention, the microhole may be formed using the roller with the piercing body in a process different from the process of dividing the wood fiber board. Further, an ultrathin wood fiber board with micro holes may be obtained by dividing a wood fiber board such as MDF or HDF in which micro holes are formed in advance.
[0060]
(D) Manufacturing method of flooring
In the present invention, three layers of a wood board for the substrate body (21), a substrate surface layer board (22), and a decorative sheet for the decorative layer (30) are sequentially laminated, and then these are bonded simultaneously. Is possible. In this case, when the ultra-thin base material surface plate (22) is attached to the surface of the base material main body (21) via an adhesive, the base material surface layer plate (22) The base material body (21) fits comfortably on the top surface, and the end and center parts of the base material surface layer plate (22) do not float up. In that state, the surface of the composite plate (base material 20) is covered with makeup. The adhesive for sheet bonding can be reliably applied by a gluing machine (spreader). Therefore, after a decorative sheet is affixed to the adhesive application surface, the laminate can be pressed to be bonded and integrated simultaneously.
[0061]
Moreover, in this invention, since a base-material surface board (22) is very thin, if each laminated body (21) (22) (30) is clamped with a hot pressure as mentioned above, it will be 1 to 2 minutes. Since the press-clamping process (press process) is completed to the extent, normally, hot pressing is advantageous in terms of production efficiency. However, the pressing process may be performed with either a hot pressure or a cold pressure, and may be performed after the cold pressure.
[0062]
In addition, when using the division board (2 division | segmentation fiber board) which only divided the wood fiber board into 2 as a base-material surface board (22), it is difficult to perform the above 3 layer simultaneous adhesion | attachment. In other words, the bipartite fiberboard has a density difference that increases the density on the surface side between the layer on the dividing surface side and the layer on the surface side, and usually warps with the dividing surface side convex. . For this reason, even if an attempt is made to affix a bipartite fiber board on a wood board for a base material body to which an adhesive is applied, the bipartite fiber board does not fit on the wood board and partially lifts up. In that state, it cannot be passed through the gluing machine, the adhesive cannot be applied, and it is difficult to perform the above three-layer simultaneous bonding. In addition, there is a method in which an adhesive is applied to both the front and back surfaces of a two-part fiberboard, and three layers are overlapped to perform hot pressing. Therefore, it is difficult to perform the simultaneous bonding of the three layers because there is a possibility that a position shift occurs at the time of hot pressing and a product defect may occur.
[0063]
(E) Other configurations and effects
The flooring material (10) of the present invention is subjected to joining processing such as main slicing processing and phase stacking and real peeling processing on the outer peripheral end face. As shown in FIG. 1, in this ridge processing, male ridges (11) are formed on two adjacent sides among the four sides, and female ridges (12) are formed on the remaining two sides.
[0064]
In the present invention, a plurality of flooring materials (10) are placed between adjacent flooring materials, and the male ridge (11) of one flooring material (10) is replaced with the female ridges (12) of the other flooring material (10). While fitting, it is constructed using both an adhesive and a nail on a floor foundation such as a joist group (not shown).
[0065]
As described above, in the flooring (10) according to the present invention, the base material surface plate (22) is composed of an extremely thin plate having a thickness of 0.2 mm or more and less than 0.5 mm. Even if the surplus wax that has entered the space between the adjacent floor materials has permeated into the base material surface plate (22) from the outer peripheral end surface of the floor material (10), the permeation portion does not swell greatly. It is possible to reliably prevent wax bulging and maintain a good aesthetic appearance.
[0066]
Moreover, since the wood fiber board as a base-material surface board (22) is equipped with favorable homogeneity, generation | occurrence | production of a crack can be prevented reliably.
[0067]
Furthermore, this wood fiber board is 0.7 g / cm. Three Since it has the above high density and has a sufficient surface hardness, the occurrence of dents can be prevented.
[0068]
Moreover, since the fiber layer of the wood fiber board as the base material surface layer board (22) is bonded and integrated with the base material body (21) by the adhesive, the flooring (10) of the present invention does not cause delamination. Can be prevented. Furthermore, since the substrate surface layer plate (22) is extremely thin, the variation in density in the thickness direction is small, and since it is high in density, delamination inside the substrate surface layer plate (22) is reliably prevented. can do.
[0069]
Moreover, since the wood fiber board as a base-material surface board (22) is very thin, it has sufficient flexibility, and the familiarity at the time of mounting on a base-material main body (21) is favorable, Affixing work to the substrate body (21) can be easily performed, and for example, misalignment can be prevented at the time of bonding by a press. In addition, since a softness | flexibility increases further when many micropores are formed in the ultra-thin board as a base-material surface layer board (22), a sticking operation | work can be performed further easily.
[0070]
Further, as described above, three layers of the wood board for the substrate body, the substrate surface layer board (22), the decorative sheet for the decorative layer, and the like can be bonded simultaneously, and the production efficiency can be improved.
[0071]
In addition, this invention is not restricted to said flooring, It can apply also to other decorative boards, such as wall finishing material.
[0072]
【Example】
Hereinafter, examples related to the present invention, comparative examples for deriving the effects, and reference examples will be described.
[0073]
[Table 1]
Figure 0004315542
[0074]
<Example 1>
As shown in Table 1 above, the density is 0.75 g / cm. Three 2.7 mm thick, 943 mm wide, 1836 mm long medium fiberboard (MDF), the thickness is divided at a position of 0.5 mm from the surface side, and two 0.5 mm thick divided plates, A single 1.7 mm thick dividing plate was obtained. At this time, the 0.5 mm thick divided plate has a density of 0.78 g / cm. Three Met. Further, this dividing plate is cut and polished on the dividing surface side by about 0.2 mm to remove the unevenness generated on the dividing surface and smooth, and further, this plate is divided into three in the width direction. By doing so, the density 0.83 g / cm Three A base material surface plate having a thickness of 0.3 mm was obtained.
[0075]
Subsequently, a base material comprising a 5-ply plywood having a thickness of 10.7 mm (the width and length are the same as those of the base material surface layer board) coated with a styrene-butadiene rubber (SBR) mixed urea-melamine resin adhesive on the surface. On the main body, the base material surface layer plate was bonded with heat and pressure at 110 ° C. for 1 minute to obtain a composite plate as a base material. The base material was cured by being left for one day after the hot-pressure bonding treatment.
[0076]
Next, a 0.3 mm thick oak veneer (decorative layer) was hot-pressure bonded to the surface of the base material at 110 ° C. for 1 minute using an SBR mixed urea-melamine resin adhesive, The groove is cut into three equal parts, a chamfered part is formed on the end face in the length direction, and the main four-side end face is further processed, followed by coloring to finish painting. 1 flooring was obtained.
[0077]
In this example, the wood fiber board was pretreated immediately before the division so that the surface temperature was 80 to 90 ° C. Further, the wood fiberboard was divided using the roller with a piercing body described in the section “B-3” in the “Means for Solving the Problems” above.
[0078]
<Examples 2 to 5>
As shown in Table 1 above, the density is 0.90 g / cm. Three A hard fiber board (HDF) having a thickness of 2.7 mm, a width of 943 mm, and a length of 1836 mm is divided into two almost evenly at the central portion in the thickness direction (first division process). A sheet of divided plates was obtained.
[0079]
Subsequently, one of the divided plates is divided at a position of 0.5 mm in the thickness direction from the surface side of the HDF before division (second division), and a divided plate having a thickness of 0.5 and a thickness of 0. An 85 mm divided plate was obtained, and the divided surfaces of each divided plate were ground and polished to obtain two divided plates (base material surface plate) having a thickness of 0.3 mm. At this time, the density of the surface side divided plate (base material surface plate) in the HDF before division is 1.04 g / cm. Three The density of the inner divided plate (base material surface plate) is 0.86 g / cm. Three Met.
[0080]
Next, the other divided plate divided in the first division process is divided at a position of 0.58 mm in the thickness direction from the surface side in the HDF before division, and a divided plate having a thickness of 0.58 mm; A split plate having a thickness of 0.77 mm was obtained, and the split surface of each split plate was cut and polished to obtain two split plates (base material surface plate) having a thickness of 0.47 mm. At this time, the density of the surface side divided plate (substrate surface layer plate) in the HDF before division is 0.95 g / cm. Three The density of the inner divided plate (base material surface plate) is 0.85 g / cm. Three Met.
[0081]
And thickness 0.3mm, density 1.04g / cm Three A flooring material was obtained in the same manner as in Example 1 using the above-mentioned base material surface plate, and Example 2 was obtained.
[0082]
Furthermore, thickness 0.3mm, density 0.86g / cm Three A flooring was obtained in the same manner as in Example 1 using the above-mentioned base material surface plate, and Example 3 was obtained.
[0083]
Also, thickness 0.47mm, density 0.95g / cm Three After the above-mentioned base material surface plate was affixed to a 5-ply plywood (base material main body) having a thickness of 10.7 mm coated with an SBR mixed urea-melamine resin adhesive on the surface, a laminate (base material) was obtained. On the surface of the laminate, an SBR mixed urea-melamine resin adhesive was applied with a spreader, and a single veneer (decorative layer) was attached, followed by hot-pressure bonding at 115 ° C. for 90 seconds. Others were obtained in the same manner as in Example 1 above, and Example 4 was obtained.
[0084]
Also, thickness 0.47mm, density 0.85g / cm Three A flooring was obtained in the same manner as in Example 1 using the above-mentioned base material surface plate, and Example 5 was obtained.
[0085]
<Comparative Example 1>
Thickness 2.7mm, density 0.70g / cm Three The MDF was divided into two at an intermediate position in the thickness direction to obtain two divided plates having a thickness of 1.35 mm. Then, one of the divided plates was bonded by heat and pressure to a 5-ply plywood (base material body) having a thickness of 10.5 mm using the divided surface as an adhesive surface. Otherwise, the comparison was performed in the same manner as in Example 1 above. A flooring as Example 1 was obtained.
[0086]
<Comparative example 2>
Thickness 2.7mm, density 0.75g / cm Three The HDF was divided at a position of 1.1 mm from the surface side in the thickness direction to obtain a 1.1 mm thick divided plate and a 1.6 mm thick divided plate. Subsequently, the divided plate having a thickness of 1.1 mm is ground and polished by dividing the divided surface by 0.1 mm, and the unevenness generated on the divided surface is removed to smooth the divided plate. A wood fiber board (base material board) having a density of 0.95 was produced. Other than that was carried out similarly to the said Example 1, and obtained the flooring as the comparative example 2. FIG.
[0087]
<Reference example>
Floor material was produced without using wood fiberboard. In other words, a 0.3 mm thick oak veneer (decorative layer) was hot-pressure bonded to a 11.7 mm thick 5-ply plywood with an SBR mixed urea-melamine resin adhesive at 110 ° C. for 1 minute, and the others Obtained the flooring material as a reference example in the same manner as in Example 1 above.
[0088]
<Evaluation test>
The following evaluation tests a to d were performed on the flooring materials of the above examples and comparative examples.
[0089]
a. Wax test
The flooring materials were joined to each other with a gap of 0.1 mm fitted to the tongue portion, and 10 g of an aqueous emulsion type wax was dropped onto the joined portion. At this time, most of the dripped wax entered the gaps (joined portions) between the flooring materials.
[0090]
And after dropping the wax for 5 minutes, a small amount of wax remaining on the surface of the flooring material was wiped off, and after standing for another day, the thickness swelling (wax swelling) around the joint portion of the flooring material was measured. The results are shown in Table 2 below.
[0091]
[Table 2]
Figure 0004315542
[0092]
As is clear from Table 2 above, the flooring materials of Examples 1 to 5 are all less than half the thickness swelling compared to the flooring material of Comparative Example 1, Even when compared with the flooring material, the thickness bulge was considerably small, and the flooring material of each example did not stand out, and maintained a good aesthetic appearance. On the other hand, the flooring materials of Comparative Examples 1 and 2 were conspicuous due to large wax swelling and inferior in beauty.
[0093]
b. DuPont test
A falling ball impact test according to JISK5400 was performed, and the depth of the dent was measured. The results are shown in Table 2 above. In addition, the dent depth by the DuPont test of the plywood (base material main body) used for the Example and the comparative example was the range of 0.62-0.68 mm, and the average was 0.66 mm.
[0094]
As is clear from Table 2 above, the floor materials of Examples 1 to 5 were able to greatly reduce the depth of the dent compared to the floor material of the reference example. In addition, although the floor material of each Example is slightly larger than the comparative examples 1 and 2, the depth of the dent depth with respect to the floor material of the reference example (with the floor material of the reference example) It was confirmed that the flooring material of each example was not inferior to the flooring materials of Comparative Examples 1 and 2 and could sufficiently prevent dents. .
[0095]
c. Surface tensile strength
It is a method according to JAS of special plywood, adhesive layer between plywood (base material body) and base material surface layer plate, adhesive layer between wood fiber board (base material surface layer) and oak veneer (decorative layer), base It measured in the form which a fracture | rupture produces in any layer among the material surface board internal layers. The results are shown in Table 2 above.
[0096]
As shown in Table 2 above, each of the flooring materials of each Example is peeled off in the adhesive layer between the plywood (base material main body) and the base material surface layer plate, is structurally stable, All flooring materials had sufficient tensile strength.
[0097]
On the other hand, the flooring material of Comparative Example 1 is different from the example in that the peeling occurs in the adhesive layer between the plywood (base material main body) and the base material surface layer board as in the example, and the wood fiber board. (Substrate surface layer plate) There is a thing in which peeling occurs inside, and it can be seen that there is variation in structure. Further, in the case where peeling occurs in the adhesive layer, the same tensile strength as in the examples can be obtained, but in the case where peeling occurs inside the wood fiber board, 3.6 kg / cm. 2 It can be seen that only a very low tensile strength is obtained, and that there is a large variation in the tensile strength. This is because the flooring material of Comparative Example 1 uses a wood fiberboard split plate that does not perform a smoothing process on the split surface, that is, uses a layer that has undergone a decrease in interlayer strength due to splitting as it is. Therefore, the variation is considered to have increased.
[0098]
d. Cold heat repetition B test
Five cycles were carried out according to JAS for special plywood. The results are shown in Table 2 above.
[0099]
As is apparent from Table 2 above, no cracking occurred on the flooring surface in both the example and the comparative example. However, in the flooring material of Comparative Example 1, after the end of two cycles, the side surface (base end surface) of the base material surface plate is long in an oblique direction within a range of about 0.6 to 0.4 mm from the flooring surface. Some hairline cracks were 4 mm, 5 mm, and 6 mm long. If this result is combined with the result of the surface tensile strength test, it can be seen that the flooring of Comparative Example 1 may cause delamination inside the wood fiberboard.
[0100]
In Comparative Example 2, the hair line crack has a density distribution of 0.75 g / cm. Three Less than, especially 0.7 g / cm Three It occurred in less than.
[0101]
【The invention's effect】
As described above, according to the decorative board of the present invention, as the wood fiber board constituting the substrate surface board, an extremely thin one having a thickness of 0.2 mm or more and less than 0.5 mm is used. Even if the wax permeates from the end face of the decorative board into the base material surface layer board, the permeation portion does not greatly swell, and the swelling of the wax can be effectively prevented. Moreover, since the wood fiber board as a base-material surface board is equipped with favorable homogeneity, generation | occurrence | production of a crack can be prevented reliably. Furthermore, as a wood fiber board constituting the substrate surface board, the density is 0.7 g / cm. Three Since the above high-density one is used, there is an effect that a sufficient surface hardness can be obtained even if it is extremely thin, and the occurrence of dents can be prevented.
[0102]
In this invention, a base-material surface board can be comprised with the division board obtained by dividing | segmenting a wood fiber board into several sheets along the board surface direction in the middle of thickness direction.
[0103]
In the present invention, the substrate surface layer plate has a density of 0.7 g / cm. Three A wood fiberboard composed of the above-mentioned medium fiberboards is divided into three along the plate surface direction in the middle of the thickness direction, and it is composed of either one of the two divided plates on the front and back sides. In this case, there is an advantage that the base material surface layer plate can be easily manufactured with little troublesome cutting work.
[0104]
Furthermore, in the present invention, the substrate surface layer plate has a density of 0.8 g / cm. Three When adopting a wood fiberboard composed of the above hard fiberboard, which is composed of divided plates obtained by dividing the wood fiberboard into three or more along the plate surface direction in the middle of the thickness direction, Since a board can be used as a base material surface layer board, there exists an advantage that a base material surface layer board can be manufactured efficiently.
[0105]
In the present invention, the substrate surface layer plate has a density of 0.8 g / cm. Three In the case of adopting a wood fiber board composed of the above hard fiber boards, which is composed of divided boards obtained by dividing the wood fiber board into four pieces along the plate surface direction in the middle of the thickness direction, the wood fiber board is 1 / 2 The process of dividing into two thicknesses and the process of further dividing one half of the thickness into two parts need only be changed once, so the dividing work can be performed efficiently. There is an advantage that can be.
[0106]
Furthermore, in the present invention, when adopting a structure in which a large number of micropores penetrating between the front and back surfaces are provided in the base material surface plate, the flexibility of the base material surface plate is further increased, There is an advantage that familiarity can be improved, and adhesion and adhesion to the substrate body can be further improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a joint portion in a floor material in a construction state related to the present invention.
FIG. 2 is a cross-sectional view showing a joint portion in a conventional flooring material.
FIG. 3 is a plan view showing a state in which a conventional flooring is applied.
[Explanation of symbols]
10 ... flooring
20 ... Base material
21 ... Base material body
22 ... Base material surface plate
30 ... Makeup layer
T ... Thickness

Claims (6)

木質板からなる基材本体の表面に、基材表層板が積層された板状基材と、その板状基材の表面に設けられた化粧層とを有する化粧板であって、
前記基材表層板が、厚さが0.2mm以上0.5mm未満に調整され、密度が0.7g/cm3 以上の木質繊維板をもって構成され
前記基材表層板が、密度が0.7g/cm 3 以上の中質繊維板からなる木質繊維板を厚さ方向の中間において板面方向に沿って3枚に分割し、その表裏両側の2枚の分割板のいずれかをもって構成されてなることを特徴とする化粧板。
A decorative board having a plate-like substrate in which a substrate surface layer plate is laminated on the surface of a substrate body made of a wooden board, and a decorative layer provided on the surface of the plate-like substrate,
The substrate surface layer plate is adjusted to have a thickness of 0.2 mm or more and less than 0.5 mm, and a density of 0.7 g / cm 3 or more of a wood fiber board ,
The substrate surface layer board is a wood fiber board having a density of 0.7 g / cm 3 or more and divided into 3 pieces along the plate surface direction in the middle of the thickness direction, and 2 on both sides of the front and back sides. A decorative board comprising one of the divided plates.
前記基材表層板に、その表裏面間を貫通する微小孔が多数設けられてなる請求項記載の化粧板。Wherein the substrate surface plate, veneer micropores are thus provided multiple claim 1, wherein the penetrating between the front and back surfaces. 木質板からなる基材本体の表面に、基材表層板が積層された板状基材と、その板状基材の表面に設けられた化粧層とを有する化粧板であって、
前記基材表層板が、厚さが0.2mm以上0.5mm未満に調整され、密度が0.7g/cm3 以上の木質繊維板をもって構成され
前記基材表層板が、密度が0.8g/cm 3 以上の硬質繊維板からなる木質繊維板を、厚さ方向の中間において板面方向に沿って3枚以上に分割して得られる分割板をもって構成されてなることを特徴とする化粧板。
A decorative board having a plate-like substrate in which a substrate surface layer plate is laminated on the surface of a substrate body made of a wooden board, and a decorative layer provided on the surface of the plate-like substrate,
The substrate surface layer plate is adjusted to have a thickness of 0.2 mm or more and less than 0.5 mm, and a density of 0.7 g / cm 3 or more of a wood fiber board ,
Divided plate obtained by dividing the base fiber board into three or more wood fiber boards made of hard fiber boards having a density of 0.8 g / cm 3 or more along the plate surface direction in the middle of the thickness direction. A decorative board, characterized in that it is made up of .
前記基材表層板に、その表裏面間を貫通する微小孔が多数設けられてなる請求項記載の化粧板。The decorative board according to claim 3 , wherein the substrate surface layer board is provided with a large number of minute holes penetrating between the front and back surfaces. 木質板からなる基材本体の表面に、基材表層板が積層された板状基材と、その板状基材の表面に設けられた化粧層とを有する化粧板であって、
前記基材表層板が、厚さが0.2mm以上0.5mm未満に調整され、密度が0.7g/cm3 以上の木質繊維板をもって構成され
前記基材表層板が、密度が0.8g/cm 3 以上の硬質繊維板からなる木質繊維板を、厚さ方向の中間において板面方向に沿って4枚に分割して得られる分割板をもって構成されてなることを特徴とする化粧板。
A decorative board having a plate-like substrate in which a substrate surface layer plate is laminated on the surface of a substrate body made of a wooden board, and a decorative layer provided on the surface of the plate-like substrate,
The substrate surface layer plate is adjusted to have a thickness of 0.2 mm or more and less than 0.5 mm, and a density of 0.7 g / cm 3 or more of a wood fiber board ,
The substrate surface layer plate has a divided plate obtained by dividing a wood fiber plate made of hard fiber plates having a density of 0.8 g / cm 3 or more into four along the plate surface direction in the middle of the thickness direction. decorative laminate characterized by comprising configured.
前記基材表層板に、その表裏面間を貫通する微小孔が多数設けられてなる請求項記載の化粧板。The decorative board according to claim 5 , wherein the substrate surface layer board is provided with a large number of fine holes penetrating between the front and back surfaces.
JP27416299A 1999-09-28 1999-09-28 Veneer Expired - Lifetime JP4315542B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27416299A JP4315542B2 (en) 1999-09-28 1999-09-28 Veneer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27416299A JP4315542B2 (en) 1999-09-28 1999-09-28 Veneer

Publications (2)

Publication Number Publication Date
JP2001096512A JP2001096512A (en) 2001-04-10
JP4315542B2 true JP4315542B2 (en) 2009-08-19

Family

ID=17537909

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27416299A Expired - Lifetime JP4315542B2 (en) 1999-09-28 1999-09-28 Veneer

Country Status (1)

Country Link
JP (1) JP4315542B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11945193B2 (en) 2021-03-11 2024-04-02 Ahf, Llc Dimensionally stable composite wood panel flooring and methods of preparing same

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4511853B2 (en) * 2004-03-17 2010-07-28 株式会社マキタ Cutting machine riving knife
JP2007247300A (en) * 2006-03-17 2007-09-27 Pal Co Ltd Flooring
JP4616310B2 (en) * 2007-07-04 2011-01-19 朝日ウッドテック株式会社 Floor material, manufacturing method thereof and floor structure
JP4894681B2 (en) * 2007-08-22 2012-03-14 パナソニック電工株式会社 Real bonded structure of composite flooring
JP2009196188A (en) * 2008-02-20 2009-09-03 Eidai Co Ltd Manufacturing method of woody compound substrate and woody decorative plate
JP2011016288A (en) * 2009-07-09 2011-01-27 Marutama Sangyo Kk Scarf joining method of plywood
JP5770418B2 (en) * 2009-07-31 2015-08-26 株式会社ノダ Veneer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11945193B2 (en) 2021-03-11 2024-04-02 Ahf, Llc Dimensionally stable composite wood panel flooring and methods of preparing same

Also Published As

Publication number Publication date
JP2001096512A (en) 2001-04-10

Similar Documents

Publication Publication Date Title
US20200139682A1 (en) Method of manufacturing a timber composite, the timber composite obtained and decorative panels comprising such timber composite
US12337576B2 (en) Decorative panels comprising a timber composite
JPH11291203A (en) Method of manufacturing wooden veneer
KR20180001573A (en) Method for finishing a wood board
JP4315542B2 (en) Veneer
JPH11156807A (en) Wood decorative board and method for producing the same
JPH07102535B2 (en) Manufacturing method of grooved decorative board
DE102009055282B4 (en) Made veneer sheet
JP4156048B2 (en) Decorative plate and method for producing the same
JPH07102533B2 (en) Manufacturing method of grooved decorative board
JP3768300B2 (en) Decorative plate manufacturing method
EP2062727A1 (en) Method for engraving boards and board obtained by said method
JP2010048057A (en) Waterproofing method for decorative plate
JP2000006108A (en) Woody flooring material with excellent dent-flaw resistance and dry-crack resistance and its manufacture
JP2763188B2 (en) Method of manufacturing thick veneer decorative board
JP4638003B2 (en) Veneer
WO2022190070A1 (en) A ready to use decorative wood panels and method of preparing thereof
JPH11129211A (en) Coated composite plywood for form and manufacture thereof
JPWO2010038261A1 (en) Natural wood thin paper and its manufacturing method
CN112677273A (en) Manufacturing method of pure three-layer solid wood composite floor
JP3768299B2 (en) Decorative plate manufacturing method
JP3969231B2 (en) Building board and manufacturing method of building board
WO2025094524A1 (en) Method for manufacturing multi-stacked wood plate
JP6425211B2 (en) Method of manufacturing plate-like building materials
JP2025025536A (en) Wood veneer and its manufacturing method

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060901

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20081107

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081118

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090114

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20090428

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20090519

R150 Certificate of patent or registration of utility model

Ref document number: 4315542

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120529

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120529

Year of fee payment: 3

RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: R3D02

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120529

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130529

Year of fee payment: 4

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term