JP4333368B2 - Manufacturing method of electronic parts - Google Patents

Description

  The present invention relates to a method for manufacturing an electronic component, and in particular, an electronic device including a step of forming a terminal electrode by applying a conductive paste with a predetermined width on a part of a side surface of a component body provided in the electronic component. The present invention relates to a part manufacturing method.

  FIG. 8 is a perspective view showing the appearance of the electronic component 1 that is of interest to the present invention. For example, multilayer ceramic capacitors with multiple terminals to form a capacitor array, multilayer ceramic capacitors with multiple terminals for low ESL (equivalent series inductance), and other multi-terminal electronic components Some have the appearance as shown in FIG.

  The electronic component 1 includes, for example, a rectangular parallelepiped component main body 2. The electronic component 1 also includes terminal electrodes 5 and 6 formed to extend with a predetermined width on a part of each of the side surfaces 3 and 4 facing each other of the component body 2. In the electronic component 1 shown in FIG. 8, four terminal electrodes 5 and 6 are formed on the side surfaces 3 and 4, respectively. Although not shown, terminal electrodes may also be formed on the opposing end surfaces 7 and 8 of the component body 2.

  Terminal electrodes 5 and 6 are formed not only on side surfaces 3 and 4 but also on two main surfaces adjacent to side surfaces 3 and 4, that is, on a part of each of adjacent surfaces 9 and 10.

  More specifically, the terminal electrode 5 has a central portion 11 formed on the side surface 3 and adjacent surface extensions 12 and 13 formed on the adjacent surfaces 9 and 10, respectively. On the other hand, the terminal electrode 6 has a central portion 14 formed on the side surface 4 and adjacent surface extensions 15 and 16 formed on the adjacent surfaces 9 and 10, respectively.

  The adjacent surface extensions 12, 13, 15 and 16 function so as to realize a good soldering state with the wiring board (not shown) when the electronic component 1 is mounted.

  The terminal electrodes 5 and 6 as described above are usually formed by applying a conductive paste and baking it. Various methods have been proposed for applying such a conductive paste. Of particular interest to the present invention is a method of applying the conductive paste directly onto the component body 2 using a dispenser. (For example, refer to Patent Document 1).

  In Patent Document 1, as shown in FIG. 9, a plurality of component main bodies 2 are arranged with a spacer 17 sandwiched between them. At this time, the same side surfaces of the component main bodies 2, for example, the side surfaces 3 are aligned while being directed in the same direction.

  In the above-described state, the conductive paste 18 is applied from above to the side surface 3 using a dispenser (not shown). The conductive paste 18 is in a state extending with a predetermined width in the arrangement direction of the plurality of component bodies 2 so as to form the terminal electrodes 5 (see FIG. 8). Further, the spacer 17 is selected to have a size that allows application of the conductive paste 18 for forming the adjacent surface extensions 12 and 13 in the terminal electrode 5, and therefore the conductive paste 18 is arranged. The plurality of component bodies 2 are provided so as to extend not only on the aligned side surface 3 of each of the component bodies 2 but also on each of the adjacent surfaces 9 and 10.

After the conductive paste 18 applied in this way is dried, the same process is performed on the other side surface 4, whereby the conductive property for the other terminal electrode 6 (see FIG. 8) is obtained. Paste 18 is applied. Then, terminal electrodes 5 and 6 are formed by baking these conductive pastes 18.
JP-A-8-124812

  However, the application method of the conductive paste 18 described with reference to FIG. 9 has the following problems to be solved.

  First, when a paste having a relatively high viscosity is used as the conductive paste 18, the bridge portion 19 of the conductive paste 18 is easily formed as shown by a broken line in the right end portion of FIG. If the bridge portion 19 is thus formed, the adjacent surface extensions 12 and 13 to be formed on the terminal electrode 5 or the adjacent surface extensions 15 and 16 to be formed on the terminal electrode 6 have an appropriate shape. It may not be formed.

  On the other hand, if the viscosity of the conductive paste 18 is lowered in order to prevent the bridge portion 19 from being formed, the conductive paste 18 excessively spreads on the adjacent surfaces 9 and 10, or the component body 2 and the spacer 17 During this time, the conductive paste 18 permeates, and the shape of each of the adjacent surface extensions 12 and 13 or 15 and 16 cannot be stabilized.

  Further, since the conductive paste 18 also adheres to the spacer 17, when the spacer 17 is reused, it must be cleaned. This cleaning requires a reasonable cost.

  Accordingly, an object of the present invention is to provide a method for manufacturing an electronic component, more specifically, a method for applying a conductive paste, which can solve the above-described problems.

  According to the present invention, a step of preparing a component body and a terminal electrode extending with a predetermined width on a part of a side surface of the component body and extending from the side surface to each of two adjacent surfaces adjacent thereto are formed. Therefore, the present invention is directed to a method for manufacturing an electronic component including a step of applying a conductive paste to a component body and a step of baking a conductive paste. In order to solve the above technical problem, It is characterized by having a simple structure.

  That is, in the conductive paste applying step described above, a plurality of component main bodies are arranged in contact with each other so that the side surfaces are aligned while being directed in the same direction, A side application step of applying a conductive paste using a dispenser so as to extend with a predetermined width in the arrangement direction of the plurality of component bodies on each aligned side surface of each of the component bodies; A displacement step of displacing a particular component body such that a step occurs between each side of the component body, thereby leading the conductive paste applied on the side surface to a portion of the adjacent surface; After this displacement step, a specific component body is displaced in the opposite direction so that the side surfaces of the two adjacent component bodies are aligned again, and then the plurality of component bodies are separated from each other. It is characterized in that the separation step is performed.

  In this invention, it is preferable that the displacement step and the reverse displacement step described above are repeated a plurality of times.

  Further, preferably, fine vibration is applied to the component main body at each stage after finishing the displacement process and after finishing the reverse displacement process.

  With respect to the embodiment of the displacement step, in the first preferred embodiment, the component bodies located every other one of the plurality of arranged component bodies are displaced, whereby the side surfaces of each of the two adjacent component bodies are displaced. In the second preferred embodiment, a plurality of arranged component bodies are guided along the concave surface, so that between the side surfaces of each of the two adjacent component bodies. A step is created.

  In carrying out the conductive paste application step, the plurality of arranged component main bodies are preferably handled in a state where they are held on the adhesive elastic body by the adhesive force.

  As described above, when an adhesive elastic body is used, with respect to the embodiment of the separation step described above, in the first preferred embodiment, the plurality of component bodies are separated from each other by stretching the adhesive elastic body. . In a second preferred embodiment, the plurality of component bodies are separated from each other by curving the adhesive elastic body with the surface holding the component bodies facing outward.

  In the present invention, since the plurality of arranged component bodies are in contact with each other without using a spacer, the bridge portion as described above is not formed in the conductive paste. Therefore, it is not necessary to reduce the viscosity of the conductive paste.

  Moreover, in order to form the adjacent surface extension part of a terminal electrode, a specific component main body is displaced so that a level | step difference may arise between each side surface of two adjacent component main bodies, and, thereby, it was provided on the side surface Displacement process for guiding the conductive paste onto a part of the adjacent surface, and after this displacement process, the specific component body is displaced in the opposite direction so that the side surfaces of each of the two adjacent component bodies are aligned again The reverse displacement process is performed.

  From these things, according to this invention, the adjacent surface extension part of a terminal electrode can be stably formed in a suitable form. Moreover, the cost which may arise by using a spacer can be reduced.

  In this invention, when the displacement process and the reverse displacement process are repeated a plurality of times, or after applying the slight vibration to the component body at each stage after finishing the displacement process and after completing the reverse displacement process, The reliability of forming the adjacent surface extension with the proper form and sufficient dimensions is further increased.

  In this invention, when the conductive paste applying step is performed in a state where the plurality of arranged component main bodies are held on the adhesive elastic body by the adhesive force, the property of the adhesive elastic body is utilized. Each process of realizing a state in which a plurality of component bodies are arranged, displacing a specific component body, and separating the plurality of component bodies from each other can be easily performed.

  Hereinafter, an embodiment of the present invention will be described with respect to a method of manufacturing the electronic component 1 shown in FIG.

  1 to 5 are for explaining a first embodiment of the present invention. Here, FIGS. 1 to 5 show typical steps performed for applying the conductive paste 18 to the component body 2.

  First, referring to FIG. 1, a plurality of component main bodies 2 are prepared, and in order to handle these component main bodies 2, a plate-like adhesive elastic body 21 is prepared. At least one main surface of the adhesive elastic body 21 has adhesiveness and can be elastically deformed in the thickness direction. Further, the adhesive elastic body 21 can be stretched in the direction of the main surface and can be bent so as to curve the main surface.

  A plurality of component main bodies 2 are held on the adhesive elastic body 21 by the adhesive force that it has. The plurality of component bodies 2 are arranged in contact with each other so that the side surfaces 3 are aligned while being directed in the same direction.

  The adhesive elastic body 21 is fixed to a stage (not shown) movable in the X and Y directions, for example, and a dispenser needle 22 provided in a dispenser for applying the conductive paste 18 is attached above the stage. The dispenser syringe 23 is disposed.

  Next, when the above-described stage is driven, the dispenser is operated while the adhesive elastic body 21 is moved in the direction indicated by the arrow 24, and the conductive paste 18 is ejected from the dispenser needle 22. Thereby, the conductive paste 18 is applied on the aligned side surfaces 3 of the plurality of component bodies 2 arranged so as to extend with a predetermined width in the arrangement direction of the plurality of component bodies 2. A process is performed.

  The above situation is well illustrated in FIG. FIG. 2 is a diagram showing the state in which the process shown in FIG. 1 is performed from above.

  As shown in FIG. 8, since the four terminal electrodes 5 are formed on the side surface 3, the conductive paste 18 is applied along the four belt-like regions as shown in FIG.

  Further, in order to stabilize the injection amount of the conductive paste 18 from the dispenser needle 22, it is preferable to supply the conductive paste 18 from one dispenser syringe 23 to only one dispenser needle 22 instead of a plurality. preferable.

  In the above-described case, adjacent dispenser syringes 23 may interfere with each other when the interval between the band-like regions to which the conductive paste 18 is to be applied is narrow. In order to avoid this interference, the four dispenser needles 22 may be sequentially shifted in the direction of the arrow 24. This staggered arrangement is well illustrated in FIG. That is, in FIG. 2, the cross section of the conductive paste 18 to be injected from the dispenser needle 22 is indicated by a hatched circle.

  In carrying out the side surface application step of the conductive paste 18 as described above, the adhesive elastic body 21 was moved in the direction of the arrow 24, but this movement is relative, and therefore the dispenser needle 22 and the dispenser syringe 23 may be moved.

  When the electronic component 1 shown in FIG. 8 is a ceramic electronic component, the component main body 2 is made of ceramic. Thus, the component main body 2 configured with ceramic is usually chamfered at the ridge line portion. Therefore, as well shown in FIG. 1, a V-groove 25 caused by chamfering is formed between adjacent component bodies 2. A predetermined amount of the conductive paste 18 accumulates in the V groove portion 25. The conductive paste 8 accumulated in the V-groove 25 enables a sufficient supply of the conductive paste 18 for forming the adjacent surface extensions 12 and 13 of the terminal electrode 5 in a process described later.

  Next, as shown in FIG. 3, the specific component main body 2 is displaced so that a step is generated between the side surfaces 3 of the two adjacent component main bodies 2, thereby being applied on the side surface 3. A displacement process is performed in which the conductive paste 18 is guided onto a part of each of the adjacent surfaces 9 and 10.

  In FIG. 3, the symbols “A” and “B” are written in order to distinguish the plurality of arranged component main bodies 2 from one another and the other ones. In this embodiment, in order to cause the step as described above, the component main bodies 2 (A) positioned every other one of the plurality of arranged component main bodies 2 are adhered as shown by an arrow 26. Is pushed toward the elastic elastic body 21, and thereby the component main body 2 (A) is displaced. As a result, a step is generated between the side surfaces 3 of the adjacent component body 2 (A) and component body 2 (B).

  It is desirable not to touch the conductive paste 18 when the component body 2 (A) is pushed in. For this reason, a pressing member (not shown) for pressing is brought into contact with the region between the strip-like regions where the conductive paste 18 is formed in FIG.

  At the stage where the process shown in FIG. 3 is completed, in the component main body 2 (B), the conductive paste 18 forms the adjacent surface extensions 12 and 13 having sufficient dimensions, but in the component main body 2 (A), the conductive paste 18 The adhesive paste 18 does not substantially form the adjacent surface extensions 12 and 13 or only the adjacent surface extensions 12 and 13 of insufficient dimensions.

  Therefore, next, as shown in FIG. 4, a reverse displacement step is performed in which the component main body 2 (A) is displaced in the reverse direction so that the side surfaces 3 of the two adjacent component main bodies 2 are aligned again. The Thereby, even in the component main body 2 (A), the conductive paste 18 can be guided so that the adjacent surface extensions 12 and 13 having sufficient dimensions can be formed as in the component main body 2 (B).

  Further, by repeating the displacement step shown in FIG. 3 and the reverse displacement step shown in FIG. 4 a plurality of times, the conductive paste 18 for the adjacent surface extensions 12 and 13 can be supplied more sufficiently, Moreover, stabilization of each dimension and form of the adjacent surface extension parts 12 and 13 can be achieved.

  Further, if the vibration is applied to the component main body 2 at each stage after the displacement process shown in FIG. 3 and after the reverse displacement process shown in FIG. It becomes possible to supply the conductive paste 18 for and 13 more sufficiently and stably. Here, as a means for giving a fine vibration, any means capable of giving a mechanical vibration to the stage may be used. For example, a means for giving a fine vibration to the stage by an ultrasonic method, a ball screw type or a linear type Is used.

  Next, as shown in FIG. 5, a separation step of separating the plurality of component bodies 2 from each other is performed. In this embodiment, the adhesive elastic body 21 is stretched by applying a tensile force as indicated by arrows 27 and 28 to the adhesive elastic body 21. When the adhesive elastic body 21 is stretched, the plurality of component bodies 2 held thereon are separated from each other.

  Note that how to set the interval between the component bodies 2 separated from each other depends on the amount of the conductive paste 18 introduced or applied on the adjacent surfaces 9 and 10.

  Next, while the state where the component main bodies 2 are separated from each other is maintained, the applied conductive paste 18 is dried. And the same conductive paste provision process is implemented also about the other side surface 4. FIG. Thereafter, the applied conductive paste 18 is baked, whereby the electronic component 1 including the component body 2 on which the terminal electrodes 5 and 6 as shown in FIG. 8 are formed is obtained.

  In accordance with the first embodiment as described above, the terminal electrodes 5 and 6 were formed under the following conditions.

  First, as the conductive paste 18, a paste having a viscosity of 45 Pa · s at a viscosity meter of 5 rpm was used. Further, as the dispenser needle 22, one having an inner diameter of 0.2 mm was used. The distance between the dispenser needle 22 and the component main body 2 was 0.4 mm, the injection pressure of the conductive paste 18 from the dispenser needle 22 was 0.2 MPa, and the moving speed in the direction of the arrow 24 was 80 mm / second.

  Further, the pushing amount in the displacement step shown in FIG. 3 was set to 0.25 mm, and the displacement step shown in FIG. 3 and the reverse displacement step shown in FIG. 4 were repeated three times.

  As a result, it was possible to form terminal electrodes 5 and 6 having a width of 0.20 mm and the adjacent surface extensions 12, 13, 15 and 16 having dimensions of 0.20 to 0.27 mm.

  Further, in the above experimental example, after finishing the displacement process shown in FIG. 3 and after completing the reverse displacement process shown in FIG. 4, 40 kHz ultrasonic vibration is applied to the component body 2 for 1 second. In addition, each of the adjacent surface extensions 12, 13, 15 and 16 has a maximum dimension of 0.30 mm.

  FIG. 6 is for explaining the second embodiment of the present invention, and shows a modification of the separation step shown in FIG. In FIG. 6, elements corresponding to the elements shown in FIG.

  With reference to FIG. 6, a curved member 32, such as a roller, for providing a curved surface 31 is prepared, and the adhesive elastic body 21 is curved so that the surface holding the component main body 2 faces outward. The curved member 32 is bent along the curved surface 31. As a result, as shown in FIG. 6, the plurality of component bodies 2 are separated from each other.

  FIG. 7 is for explaining a third embodiment of the present invention, and shows a modification of the displacement process and the reverse displacement process shown in FIGS. 3 and 4 respectively. In FIG. 7, elements corresponding to those shown in FIGS. 3 and 4 are denoted by the same reference numerals, and redundant description is omitted.

  In this embodiment, a long belt-like member is used as the adhesive elastic body 21. In FIG. 7, the conductive paste is not shown. As in the case of the conductive paste 18 shown in FIGS. 1 and 2, the conductive paste is arranged in the arrangement direction of the plurality of component bodies 2 on the aligned side surfaces 3 of the plurality of arranged component bodies 2. It is given to extend with a predetermined width.

  As shown in FIG. 7, the plurality of arranged component main bodies 2 are guided along the concave surface 41. At this stage, a displacement process is performed. That is, at this stage, a step is generated between the side surfaces 3 of the two adjacent component bodies 2.

  In this embodiment, a belt-like adhesive elastic body 21 holding a plurality of component bodies 2 is guided as indicated by an arrow 44 through two rollers 42 and 43. As a result, the adhesive elastic body 21 is provided with an S-shaped path, and the concave surface 41 described above is provided by a part of the S-shaped path.

  In this embodiment, the adhesive elastic body 21 after passing through the roller 43 is in a state of extending on a plane. This step corresponds to a step of performing a reverse displacement process in which a specific component body 2 is displaced in the reverse direction so that the side surfaces 3 of the two adjacent component bodies 2 are aligned again.

  In accordance with the third embodiment described above, the terminal electrodes 5 and 6 were formed under the following conditions.

  First, application of the conductive paste using a dispenser was the same as in the experimental example performed according to the first embodiment described above.

  In the experiment according to the third embodiment, when the radius of each of the rollers 42 and 43 is set to 20 mm, the width is 0.20 mm, and the dimensions of the adjacent surface extensions 12, 13, 15 and 16 are each set to 0.2 mm. The terminal electrodes 5 and 6 which are 15-0.25 mm were able to be formed.

It is a front view which shows the state which is implementing the side surface provision process after finishing the arrangement | sequence process in the electrically conductive paste provision process with which the manufacturing method of the electronic component by 1st Embodiment of this invention is equipped. It is a figure which shows the state which is implementing the side surface provision process shown in FIG. 1 from upper direction. It is a front view which shows the state which is implemented after the side surface provision process shown in FIG. 1, and is implementing the displacement process. It is a front view which shows the state after the reverse displacement process implemented after the displacement process shown in FIG. It is a front view which shows the state which is implementing after the reverse displacement process shown in FIG. 4, and performing the isolation | separation process. It is for demonstrating 2nd Embodiment of this invention, and is a front view which shows the modification of a isolation | separation process. It is for demonstrating 3rd Embodiment of this invention, and is a front view which shows the modification of a displacement process and a reverse displacement process. It is a perspective view which shows the external appearance of the electronic component 1 which is interesting for this invention. It is a front view which shows the state after providing the electrically conductive paste 18 in the conventional method interesting for this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Component main body 3,4 Side surface 5,6 Terminal electrode 9,10 Adjacent surface 12,13,15,16 Adjacent surface extension part 18 Conductive paste 21 Adhesive elastic body 22 Dispenser needle 31 Curved surface 41 Concave surface

Claims (8)

Preparing a component body, and forming a terminal electrode extending with a predetermined width on a part of the side surface of the component body and extending from the side surface to each of two adjacent surfaces adjacent to the side surface; A method for producing an electronic component, comprising: applying a conductive paste to the component body; and baking the conductive paste.
The conductive paste application step includes
Arranging the plurality of component bodies in contact with each other such that the side surfaces are aligned while being oriented in the same direction;
A side surface for applying the conductive paste using a dispenser so as to extend with a predetermined width in the arrangement direction of the plurality of component bodies on the aligned side surfaces of each of the plurality of the component bodies arranged. Granting process;
The specific component body is displaced so that a step is generated between the side surfaces of each of the two adjacent component bodies, whereby the conductive paste applied on the side surface is placed on one of the adjacent surfaces. Displacement process that leads to the part,
A reverse displacement step of displacing a specific component body in a reverse direction so that the side surfaces of each of the two adjacent component bodies are aligned again after the displacement step;
Then, the manufacturing method of an electronic component provided with the isolation | separation process of isolate | separating the said some component main body mutually.   The method of manufacturing an electronic component according to claim 1, wherein the displacement step and the reverse displacement step are repeated a plurality of times.   3. The method of manufacturing an electronic component according to claim 1, further comprising a step of applying a slight vibration to the component main body at each stage after finishing the displacement step and after finishing the reverse displacement step.   In the displacing step, the component main body located at every other one of the plurality of component main bodies arranged is displaced, thereby generating a step between the side surfaces of each of the two adjacent component main bodies. The method of manufacturing an electronic component according to claim 1, wherein the electronic component is manufactured as described above.   The plurality of arranged component bodies are guided along a concave surface in the displacement step, whereby a step is generated between the side surfaces of each of the two adjacent component bodies. The manufacturing method of the electronic component in any one of 1-3.   The electronic component manufacturing method according to any one of claims 1 to 5, wherein the conductive paste applying step is performed in a state in which the plurality of arranged component main bodies are held on an adhesive elastic body by an adhesive force. Method.   The method of manufacturing an electronic component according to claim 6, wherein in the separating step, the plurality of component bodies are separated from each other by stretching the adhesive elastic body.   The electronic component according to claim 6, wherein, in the separating step, the plurality of component bodies are separated from each other by curving the adhesive elastic body with a surface holding the component body facing outward. Manufacturing method.

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