JP4337249B2 - Electroformed thin blade whetstone and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electroformed thin blade whetstone used for cutting or grooving a work material such as silicon or ferrite and a method for manufacturing the same.
[0002]
[Prior art]
As a tool such as a thin blade used for cutting or grooving a work material such as silicon, GaAs, and ferrite with high accuracy, there is an electroformed thin blade grindstone. An example of such an electroformed thin blade grindstone is shown in FIG. 7, and this electroformed thin blade grindstone 1 is a superabrasive such as diamond or cBN in a metal plating phase made of Ni, Co, or an alloy thereof. The ring shape is formed by being distributed. The electroformed thin blade 1 has a plate shape with a thickness of several tens of μm to several hundreds of μm.
The electroformed thin-blade grindstone 1 is fastened to the grindstone shaft 2 by a nut 5 while being sandwiched between a pair of mounting flanges 4 and 4 that are fitted and inserted into the small-diameter shaft portion 3 of the grindstone shaft 2 that rotates about the axis. It is locked in and fixed. By rotating the grindstone shaft 2 around the axis, a work material such as silicon is cut by the outer peripheral edge 1a of the electroformed thin blade grindstone 1.
[0003]
By the way, such an electroformed thin blade whetstone 1 has its mechanical strength because the hardness of the metal plating phase by Ni or Ni alloy increases to Hv = 500 to 750 due to the influence of sulfur contained in a small amount in Ni plating or the like. It has high rigidity and can be used for cutting processing even if it is thin.
However, in such an electroformed thin-blade grindstone 1, the hardness of the metal plating phase is high, and therefore the wear rate of the metal plating phase is slow and the superabrasive grains easily fall off even if the wear of the superabrasive grains progresses during the cutting process. Therefore, there is a drawback that the self-generated blade action cannot be sufficiently exhibited, the sharpness is lowered, and the cutting accuracy is lowered.
Therefore, the outer peripheral surface of the blade edge of the electroformed thin blade 1 is heat-treated at a temperature of 200 ° C. or higher by electric discharge machining or the like, thereby recrystallizing the structure of the blade edge portion involved in grinding of the metal plating phase made of Ni plating or the like. Techniques have been proposed for softening and embrittlement of the plating phase. This facilitates the removal of wear of the metal plating phase during the cutting process of the work material, and in accordance with the wear of the superabrasive grains, it falls off together with the metal plating phase and exposes new superabrasive grains, so that the sharpness can be maintained high. .
[0004]
[Problems to be solved by the invention]
However, when the cutting edge of the metal plating phase is heated over the entire circumference by an electric discharge machine or the like, it is difficult to control the amount of heat input, and the heat treatment area is a predetermined width of the area involved in grinding from the outer edge of the cutting edge. If it does not satisfy the above, there is a problem that the cutting performance is liable to be reduced when the cutting process proceeds, and that the strength of the electroformed thin-blade grindstone 1 itself is liable to decrease when heated beyond a predetermined width of the region involved in grinding.
In addition, the heated part of the metal plating phase is easily deformed by heat treatment, and the cutting edge is distorted over the entire circumference, which increases the cutting allowance of the work material during cutting. There is also a problem that accurate cutting or the like cannot be performed.
[0005]
In view of such circumstances, an object of the present invention is to provide an electroformed thin blade whetstone capable of precisely heat-treating a cutting edge portion over a predetermined width and a method for manufacturing the same.
Another object of the present invention is to provide an electroformed thin blade whetstone capable of suppressing thermal deformation during the heat treatment of the cutting edge and a method for manufacturing the same.
[0006]
[Means for Solving the Problems]
The electroformed thin blade grindstone according to the present invention is an electrocast thin blade grindstone in which superabrasive grains are dispersedly arranged in a metal binder phase, and a recrystallized structure is formed on one surface of both surfaces of the blade edge portion at a predetermined interval. By forming a recrystallized part and forming a second recrystallized part constituting a recrystallized structure between the first recrystallized part on the other surface, the first and second recrystallized parts are formed on both circumferential surfaces of the blade edge part. The crystal parts are arranged alternately.
Since the first or second recrystallized portion is alternately formed on both sides in the thickness direction of the blade edge portion by sequentially irradiating the both surfaces of the blade edge portion, for example, with laser light, the thermal distortion on both surfaces of the blade edge portion is made identical and alternately arranged. As a result, the internal stress of the blade edge portion can be balanced, and warpage due to thermal deformation of the electroformed thin blade grindstone can be suppressed.
The present invention is also a method for producing an electroformed thin blade grindstone for producing the above-mentioned electroformed thin blade grindstone, wherein the first re-irradiation is performed by irradiating the one surface of the blade edge portion with a predetermined interval. After forming the crystal part, the second recrystallized part is formed by irradiating a laser beam between the first recrystallized part from the other surface.
By heating a metal plating phase made of Ni, Co, or an alloy thereof to 200 ° C. or more, the metal plating phase becomes soft and Ni—S metal compound is formed at the crystal grain boundary and becomes brittle. In addition, the wear of the metal plating phase is accelerated according to the wear of the superabrasive grains during grinding, and the self-generated blade action is improved. In particular it can be precisely set to a predetermined width to a heat treatment range of the cutting edge portion to perform a point irradiated by irradiating laser over light cutting edge, high only region involved in grinding over the entire circumference of the electroformed thin blade grindstone It can be recrystallized with high accuracy.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of an electroformed thin blade grindstone according to the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a plan view of an electroformed thin blade grindstone according to an embodiment, and FIG. 2 is a configuration diagram showing a state in which the electroformed thin blade grindstone is irradiated with laser light.
In the electroformed thin blade grinding wheel 10 according to the present embodiment, superabrasive grains such as diamond and cBN are dispersedly arranged in a metal plating phase, and the metal plating phase is made of Ni, Co, or an alloy thereof. Moreover, 0.01 to 0.3% by weight of sulfur is contained with respect to the total weight including superabrasive grains. The electroformed thin-blade grindstone 10 is formed in a plate shape having an annular shape in plan view, and the thickness thereof is, for example, in the range of several tens μm to several hundred μm.
In addition, the cutting edge portion 11 forms a recrystallized structure of the metal plating phase over a range of, for example, 2 mm or less radially inward from the outer peripheral edge 11 a, thereby constituting the grinding region 12. A plurality of slits 14 are formed at predetermined intervals along the circular outer peripheral edge 11a from the outer peripheral edge 11a of the blade edge portion 11 toward the radially inner side. The slit 14 is preferably formed so as to extend radially inward from the grinding region 12. The blade edge portion 11 partitioned by the adjacent slits 14 and 14 constitutes a blade edge piece 16.
[0013]
The number of the slits 14 depends on the length of the outer peripheral edge 11a of the electroformed thin blade grindstone 10, but is, for example, 8 or more, preferably 16 or more. If the number of slits 14 increases, thermal deformation during heat treatment can be suppressed, but there is a disadvantage that the rigidity of the blade edge portion 11 decreases. Conversely, if the number of slits 14 is small, the thermal deformation of the blade edge portion 11 becomes longer and larger. Will come down.
Note that the length of the slit 14 may be equal to or less than the width of the grinding region 12. Even in this case, if the inner edge of the slit 14 is close to the proximal edge of the grinding region 12, there is little adverse effect of thermal distortion due to heat treatment.
[0014]
Next, the manufacturing method of the electroformed thin blade whetstone 10 by embodiment is demonstrated.
First, masking is performed on a stainless steel substrate, which has been subjected to a releasable treatment for the metal to be plated, while leaving a portion that forms the original shape of the grindstone, and a cleaning process such as degreasing is performed. Next, this board | substrate is immersed in the plating solution in a plating bath. The plating solution is an electrolytic plating solution containing an organic brightener containing Ni group or Co group and sulfur in which superabrasive grains such as diamond are dispersed, and an anode plate is disposed in the plating solution so as to face the substrate. Connect the substrate to the cathode.
When the cathode and anode are energized in this state, a Ni alloy, Co alloy or Ni—Co alloy plating phase is deposited on the substrate, and an abrasive layer in which superabrasive grains are uniformly dispersed is formed in the plating phase. . The plating is finished in a state where the thickness of the abrasive layer is several tens μm to several hundreds μm.
Next, the substrate on which the abrasive layer is formed is taken out of the plating solution and subjected to a water washing process including brushing, and then the abrasive layer is peeled off from the substrate. Then, the obtained abrasive grain layer is formed into a circular grindstone shape by punching or the like and further processed into a perfect circle to obtain an electroformed thin blade grindstone 10.
[0015]
Next, slits 14 are formed at predetermined intervals on the inner side in the radial direction from the outer peripheral edge 11a of the blade edge portion 11 of the electroformed thin blade whetstone 10 using a cutting laser device or the like.
Then, the electroformed thin blade whetstone 10 is sandwiched between a pair of, for example, circular cup-shaped flanges 17 and 17 provided on a turntable connected to a motor as shown in FIG. It is exposed in a ring shape with a width of 4 to 5 mm, for example. At that time, the electroformed thin blade whetstone 10 is fixed so as to be concentric with the flanges 17 and 17. And the laser apparatus 18 is arrange | positioned so that a laser beam can be irradiated to the outer periphery 11a vicinity of the blade edge | tip part 11 of the electroformed thin blade grindstone 10. FIG. The laser device 18 may be a laser device for brazing, soldering, or the like.
In this state, a laser beam is irradiated from the laser device 18 while rotating the electroformed thin blade grindstone 10 around the center axis of the turntable, and a range of 2 mm or less in the radial direction from the outer peripheral edge 11a of the rotating blade tip 11 is obtained. Heat sequentially. The heating temperature by laser irradiation is in the range of 200 ° C. to 500 ° C., for example, about 250 ° C.
[0016]
As a result, the cutting edge portion 11 can be heat-treated in a spot manner, and the heated region is recrystallized to form a recrystallized structure. Moreover, since the rotating electroformed thin blade whetstone 10 is heated in a spot manner, the blade tip 11 heated for a short time is immediately removed from the laser beam irradiation point and cooled, so that the temperature is rapidly lowered and recrystallized to the peripheral region. Can be prevented. At the same time, since the slits 14 are formed in the blade edge portion 11 at predetermined intervals, heat is radiated also in the slits 14 and 14 before and after the rotation direction of each blade edge piece 16 even when laser irradiation is performed. Due to these factors, the cutting edge portion 11 is effectively cooled after heating, and thermal deformation of the cutting edge portion 11 can be suppressed.
Moreover, a large thermal strain does not occur in the circumferential direction because of the slit 14, and only a small thermal strain can occur in the unit of the cutting edge piece 16.
Therefore, a precise grinding region 12 made of a recrystallized structure can be manufactured by heat-treating the entire circumference with high precision over a predetermined range within a width of 2 mm, and the grinding region 12 is reliably warped by heat distortion. Can be prevented.
[0017]
When a work material such as silicon is cut using the electroformed thin blade whetstone 10 thus obtained, the work is performed while rotating the electroformed thin blade whetstone 10 on the grindstone shaft 2 at a predetermined rotational speed. The material is cut in the grinding region 12 of the cutting edge 11.
At this time, since the grinding region 12 has a recrystallized structure, it becomes softer and more embrittled than the structure of the other metal plating phase, and the metal plating phase of the recrystallized structure is formed faster than the superabrasive grains are worn by grinding. Since it is removed by abrasion and new superabrasive grains are exposed, good sharpness can be continuously secured. Therefore, the self-generated blade action can be promoted for the grinding region 12, a good sharpness can be maintained, and excellent grinding performance can be exhibited. Moreover, since the high rigidity is maintained in a region not involved in grinding, the holding strength of the electroformed thin blade grindstone is high.
[0018]
As described above, according to the present embodiment, it is possible to promote the self-generated blade action of the grinding region 12 of the cutting edge portion 11 to maintain a good sharpness and to exhibit excellent grinding performance. Further, when the electroformed thin blade whetstone 10 is manufactured, the slits 14 are provided when the cutting edge portion 11 for heating the recrystallized structure is heated, and the electroformed thin blade whetstone 10 is rotated. A highly accurate recrystallized structure with a small amount of distortion and a small distortion can be produced, and there is no risk of lowering the strength of the peripheral region.
[0019]
Although the modification of this invention is demonstrated based on FIGS. 3-6, it demonstrates using the same code | symbol about the part which is the same as that of the electroformed thin blade grindstone 10 by embodiment, or a component.
FIG. 3 is a partial explanatory view showing an electroformed thin blade grindstone 20 showing a first modification. This electroformed thin blade grindstone 20 has the same basic configuration as the electroformed thin blade grindstone 10 according to the embodiment, and is circular. The grinding region 22 of the blade edge portion 11 forms a recrystallized structure of the metal plating phase in a substantially ring shape radially inward from the outer peripheral edge 11a. Note that the blade edge portion 11 is not provided with the slit 11.
In the grinding region 22, first recrystallized portions 22a and second recrystallized portions 22b each having a recrystallized structure are alternately provided in the circumferential direction. The first and second recrystallized portions 22a and 22b constitute the same recrystallized structure, but the directions of warpage are reversed because the heating directions are different from each other.
That is, as shown in FIG. 3, one surface 11A on both sides of the blade edge portion 11 is irradiated with laser light at a predetermined interval to form first recrystallized portions 22a, and then the first recrystallized portion from the other surface 11B. The non-recrystallized portion not irradiated with the laser beam between 22a and 22a is recrystallized by irradiating the laser beam, thereby constituting the second recrystallized portion 22b alternately with the first recrystallized portion 22a over the entire circumference. To do.
[0020]
By adopting the above-described configuration, the internal stress of the blade edge portion 11 can be balanced by alternately forming thermal strains on both the upper and lower sides 11A and 11B in the thickness direction of the blade edge portion 11. Warpage due to thermal deformation of the grindstone 20 can be suppressed.
In the electroformed thin blade grindstone 20, the slits 14 may be sequentially formed between the adjacent first recrystallized portion 22a and the second recrystallized portion 22b. If such a configuration is adopted, laser heating is performed. Since the heat dissipation at the time is improved, the thermal distortion can be further reduced to improve the balance and flatness of the blade edge portion 11.
[0021]
Next, FIG. 4 is a partial plan view of an electroformed thin blade grindstone showing a second modification. In this electroformed thin-blade grindstone 30, one (or both) surfaces 11A of the blade edge portion 11 are irradiated with laser light in spots at predetermined intervals, and the blade edge portion 11 is recrystallized with a recrystallized structure 31 and non-recrystallized. The parts 32 are configured to alternately exist in the circumferential direction. The recrystallized group part 31 is recrystallized and becomes relatively soft, and the non-recrystallized part 32 is a metal plating phase by electrodeposition, so that the hardness is relatively high.
By adopting such a configuration, it is possible to control the wear resistance of the electroformed thin blade grindstone 30 by controlling the circumferential length of each recrystallized portion 31. For example, by increasing the circumferential length of the recrystallized portion 31, the wear resistance of the metal plating phase of the grindstone 30 can be reduced, and the self-sharpening property can be enhanced.
Also in the case of this modification, the slits 14 may be sequentially provided on both sides in the circumferential direction of the spot-like recrystallized portion 31, that is, between the recrystallized portion 31 and the non-recrystallized portion 32.
[0022]
FIG. 5 is a partial vertical cross-sectional view of the cutting edge portion of an electroformed thin blade whetstone that is a third modified example. In the drawing, the condensing diameter of laser light at the irradiation point irradiated to the cutting edge portion 11 of the electroformed thin blade whetstone 40 The condensing diameter may be set to 2 to 10 times the thickness of the electroformed thin blade grindstone 40.
By setting such a condensing diameter of the laser beam, it is possible to reduce the thermal distortion of the recrystallized portion 41 composed of the recrystallized structure by the laser irradiation of the blade edge portion 11 and the vicinity thereof, and to suppress the deformation of the electroformed thin blade grindstone 40. . Here, if the condensed diameter exceeds 1000 μm, the amount of heat input to the blade edge portion 11 becomes too large, and it is difficult to control the amount of heat including the effects of the heat treatment portion and the periphery. If it is smaller than 100 μm, the difference in the heat treatment state between the heat treatment surface 11A of the blade edge 11 and the surface 11B on the opposite side is large, and the electroformed thin blade grindstone 40 is likely to be deformed. Therefore, the condensing diameter of the laser beam suitable for the electroformed thin blade grindstone 40 is 2 to 10 times.
[0023]
FIG. 6A is a partial plan view of the cutting edge portion of an electroformed thin blade whetstone that is a fourth modified example. In the drawing, in the electroformed thin blade whetstone 50, the outermost outer periphery of one surface 11A of the cutting edge portion 11 is shown. You may make it form the recrystallized part 51 which consists of a recrystallized structure by irradiating a laser in spiral shape (or concentric form) over the formation width of the blade edge | tip part 11 sequentially toward the inner peripheral side from the peripheral edge 11a.
When the laser heat treatment is started from the outer peripheral edge 11a and sequentially performed toward the inner periphery in a spiral shape (or concentric circle shape), heat can be radiated from the outer peripheral edge 11a at the start point 51a, and the deformation of the electroformed thin blade grindstone 50 is small.
In this regard, as shown in FIG. 4B, when laser heat treatment is performed from the inner periphery to the outer periphery of the blade edge portion 11, it is difficult to control the amount of heat input at the start point 51a 'and a large thermal expansion occurs at the laser irradiation portion and its periphery. A difference is easily generated, and a large bend is likely to occur. Further, the laser irradiation is sequentially performed at the bends on the outer peripheral side, so that the curve is accelerated. When the heat treatment is started with the outer peripheral edge 11a as the start point 51a, even if thermal distortion occurs, the distance to the outer peripheral edge 11a is short, so the heat dissipation is good and the bending moment is small. Since it is preheated, the thermal strain mitigating action of the heat-affected zone adjacent to the recrystallized structure 51 by subsequent laser heat treatment works to reduce deformation.
In the third and fourth modified examples, the slits 14 may be formed in the blade edge portion 11 at a predetermined interval. When the slit 14 is formed in the blade edge portion 11 in the first to fourth modifications, it is preferable to perform heat treatment with a laser after the slit 14 is formed.
[0024]
【The invention's effect】
As described above, the electroformed thin blade grindstone according to the present invention forms the first recrystallized portion constituting the recrystallized structure at a predetermined interval on one surface of both surfaces of the blade edge portion, and the first surface on the other surface. By forming the second recrystallized portion constituting the recrystallized structure between the recrystallized portions, the first and second recrystallized portions are alternately arranged on both circumferential surfaces of the blade edge portion. By arranging the thermal strains on both sides in the thickness direction to be the same and arranging them alternately, the internal stress of the cutting edge can be balanced, and warpage due to thermal deformation of the electroformed thin blade grindstone can be suppressed.
Further, in the method for producing an electroformed thin blade grindstone according to the present invention, after forming the first recrystallized portion by irradiating the one surface of the blade edge portion with a laser beam at a predetermined interval, from the other surface, Since the second recrystallized part is formed by irradiating laser light between the first recrystallized part, the heat treatment range of the blade part can be set to a predetermined width in order to perform point irradiation by irradiating the blade part with laser light. Therefore, it is possible to precisely recrystallize only the region involved in grinding over the entire circumference of the electroformed thin-blade grindstone.
[0025]
Moreover, the electroformed thin blade grindstone according to the present invention forms slits at predetermined intervals along the extending direction of the cutting edge, and then heats and heat-treats the cutting edge to form a recrystallized structure having a predetermined width on the outer peripheral side of the cutting edge. Because it is formed, the heat at the blade edge is efficiently radiated by the slit during heating, and even if thermal distortion occurs, a large strain that continues in the outer circumferential direction occurs only by generating a small distortion in the blade edge unit divided by the slit Without this, the thermal deformation of the region partitioned by the slit of the blade edge portion can be suppressed and heat processing with high accuracy can be performed.
[0026]
Moreover, the electroformed thin blade grindstone according to the present invention forms a first recrystallized portion constituting a recrystallized structure at a predetermined interval on one surface of both surfaces of the blade edge portion, and between the first recrystallized portion on the other surface. By forming the second recrystallized portion constituting the recrystallized structure, the first and second recrystallized portions are alternately arranged on both sides in the circumferential direction of the blade edge portion. By arranging them alternately and arranging them alternately, it is possible to balance the internal stress of the cutting edge and to suppress warpage due to thermal deformation of the electroformed thin blade grindstone.
In addition, the electroformed thin blade whetstone of the present invention has a soft recrystallized portion and a non-recrystallized portion made of a recrystallized structure alternately in the blade tip portion, so that the circumferential length of the recrystallized portion is controlled. Thus, the wear resistance of the grindstone can be controlled, and by increasing the circumferential length of the recrystallized portion, the wear resistance of the metal bonded phase of the grindstone can be reduced and the self-sharpening property can be enhanced.
[0027]
In addition, the method for producing an electroformed thin blade grindstone according to the present invention recrystallizes a predetermined width on the outer peripheral side by irradiating a laser beam to the blade edge portion while rotating the electroformed thin blade grindstone at a predetermined speed. The irradiated part is removed from the optical path and is cooled sequentially after heating, and can be recrystallized by suppressing the thermal distortion of the cutting edge part, and the amount of heat input to the cutting edge part can be adjusted by controlling the rotation speed of the electroformed thin blade grinding wheel. A recrystallized structure can be formed.
Further, since slits are formed at predetermined intervals on the outer peripheral side of the electroformed thin blade grindstone prior to laser light irradiation, heat dissipation during laser light irradiation proceeds further through the slits, and thermal distortion of the blade edge portion can be further suppressed.
[0028]
Moreover, since the condensing diameter of the laser beam is 100 to 1000 μm and 2 to 10 times the grindstone thickness, the recrystallized portion due to laser irradiation of the blade edge portion and the thermal strain in the vicinity thereof can be reduced, and deformation of the grindstone can be suppressed.
In addition, since heat treatment is performed concentrically or spirally from the outermost periphery of the blade edge portion toward the inner periphery side, electroforming when laser heat treatment is started from the outermost periphery and laser treatment is sequentially performed toward the inner periphery. There is little deformation of thin blade grindstone. Starting from the outermost circumference, even if thermal distortion occurs, there is no length, so the bending moment is small, and the inner circumference side is preheated in advance by preheating after the initial laser heat treatment. The relaxation action works and there is little deformation.
[Brief description of the drawings]
FIG. 1 is a plan view of an electroformed thin blade grindstone according to an embodiment of the present invention.
FIG. 2 is a main part explanatory view showing a state in which the electrocast thin blade grindstone according to the embodiment is mounted on a turntable and irradiated with laser light while being rotated.
FIG. 3 is a partial explanatory diagram of an electroformed thin blade grindstone according to a first modification of the embodiment.
FIG. 4 is a partial plan view of an electroformed thin blade grindstone according to a second modification.
FIG. 5 is a longitudinal sectional view of a cutting edge portion of an electroformed thin blade grindstone according to a third modification.
6A is a partial plan view of an electroformed thin-blade grindstone according to a fourth modification, and FIG. 6B is a partial vertical cross-sectional view of the electroformed thin-blade grindstone when the inner peripheral start point is heated.
FIG. 7 is a longitudinal sectional view showing a state in which a conventional electroformed thin blade grindstone is mounted on a grindstone shaft.
[Explanation of symbols]
10, 20, 30, 40, 50 Electroformed thin blade whetstone 11 Cutting edge 11a Outer peripheral edge 12 Grinding area 14 Slit 16 Cutting edges 22, 31, 41, 51 Recrystallized structure

Claims (2)

  In an electroformed thin blade grindstone in which superabrasive grains are dispersedly arranged in a metal binder phase, a first recrystallized portion constituting a recrystallized structure is formed on one surface of both surfaces of a blade edge portion at a predetermined interval, and the other surface By forming the second recrystallized part constituting the recrystallized structure between the first recrystallized parts, the first and second recrystallized parts are alternately arranged on both circumferential surfaces of the blade edge part. An electroformed thin blade whetstone. A method for producing an electroformed thin blade grindstone for producing the electrocast thin blade grindstone according to claim 1,
  After forming the first recrystallized portion by irradiating the one surface of the blade edge portion with a laser beam at a predetermined interval,
  A method for producing an electroformed thin blade grindstone, wherein the second recrystallized portion is formed by irradiating a laser beam between the first recrystallized portion from the other surface.

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