JP4338892B2 - Coupling structure for electromagnetic coupling for magnetic resonator, method for manufacturing the same, YIG resonance device, and barium ferrite resonance device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a coupling structure for electromagnetic coupling for a magnetic resonator and a method for manufacturing a YIG resonance device. In particular, the present invention relates to a method for manufacturing a coupling structure for electromagnetic coupling, in which a minimal coupling coil that electromagnetically couples with a magnetic resonator is formed in a predetermined constant shape.
[0002]
[Prior art]
First, as a specific example of the magnetic resonator, there is a resonant element using YIG (Yttrium Iron Garnet). This is an element having a very high Q value and capable of changing the resonance frequency almost in proportion to the strength of the magnetic field received by the Q value. A YIG tuning oscillator and a YIG tuning filter are realized using this characteristic.
Japanese Patent Application No. 8-76588 (resonator and YIG device using the same) is a reference material showing a structural example of a YIG resonant element and a peripheral device. According to this structure, the coupling coil is arranged in the magnetic field space between the gaps sandwiched between the crucible magnetic core and the plate-like magnetic core. This coupling coil is a coupling structure for performing electromagnetic coupling with the YIG resonant element. The frequency band to be applied is used from the microwave band to the millimeter wave band.
[0003]
Thus, a coupling structure that performs electromagnetic coupling between the YIG resonance element (magnetic resonator) and the external transfer circuit is required. However, the YIG resonant element is extremely small, for example, a sphere as small as 0.4 mmφ. A coupling coil for coupling disposed adjacent to the sphere so as to be electromagnetically coupled to a predetermined size is also small, for example, 0.7 mmφ. Both are required to be arranged in a predetermined positional relationship with respect to the central axis of the sphere to achieve appropriate electromagnetic coupling.
[0004]
Next, formation of a coupling coil important in the coupling structure applied to the above will be described with reference to the formation process of FIG. The coupling coil of FIG. 1 (c) shows the final structure formed. In this case, in order to enable electromagnetic coupling in the microwave band, the coupling coil has about 1/2 turn and needs to be formed in a coil shape having a constant size, shape, and arrangement relationship.
[0005]
As shown in the front view and the top view showing the coil formation completion state in FIG. 1C, the main components of the coupling structure are the substrate 80, the first electrode 11, the second electrode 12, and the like. And a structural element with the coupling coil 50.
The substrate 80 shows the coil peripheral part of the coupling structure according to the present application, and supports and fixes the coupling coil 50 to transmit / receive signals to / from the outside. (Not shown). As the base material, an alumina material or sapphire material having good characteristics in the microwave band is used.
The coupling coil 50 shown in FIG. 1C is a small coil having an inner diameter of about 0.7 mmφ and about 1/2 turn, and both ends of the finally formed coil are connected to the first electrode 11 and the second coil. The coil itself needs to be supported and fixed in a self-supporting state at a predetermined position on the substrate by being electrically connected to the electrode 12.
[0006]
Next, a procedure for forming the coupling coil 50 will be described.
FIG. 1A is a front view and a top view showing a state in which one end of the wire ribbon is connected to a predetermined position on the substrate. In this formation process, one end of the wire ribbon 40 that is the source of the coupling coil is the first one. A state is shown in which the forming rod 70 is arranged and fixed at the center position where the coil is wound after bonding connection (welding) to one electrode 11 by a dedicated ultrasonic wire bonder device or the like (not shown). The wire ribbon 40 is used in the state of a wide plate-like continuous long gold wire advantageous for high-frequency characteristics. As this thickness, a wide plate-like member having a thickness of about several tens of μm and a width of several hundreds of μm that can stand by itself is used. A round-shaped gold wire may be used.
[0007]
Next, FIG. 1B is a front view and a top view showing a state in which the other end is connected after the wire ribbon is bent. In this forming step, the wire ribbon 40 is moved along the forming rod 70 to the second electrode. 12 shows a state in which unnecessary leads are cut after being bent to 12 and then bonded by a dedicated ultrasonic wire bonder (not shown). At this time, the tension of the wire ribbon 40 may vary depending on the operator, and the size and shape of the formed loop may vary depending on the positioning relationship between the wire bonder device and the substrate 80, the bonding conditions of the wire bonder device, and the like. It is not uniformly formed, resulting in manufacturing variations. As a result, as shown in FIG. 2, there is a difficulty in causing variations in the loop shape that cannot be practically used. In addition, it is necessary to make the tension so that the forming rod 70 can be removed in a later process.
[0008]
Next, FIG. 2 shows a variation example by the above forming method. FIG. 2A shows a properly formed shape, the loop height (see FIG. 2A) is set to the target 0.7 mm, and the loop coil width (see FIG. 2B) is the target 0. This is the case of bonding at 7mm. On the other hand, as a form of formation variation, as shown in FIG. 2B, there is a defect example in which the loop height protrudes (see FIG. 2C) as a result of the looseness of the wire. As shown in FIG. 2 (c), there is a defect example in which the coil width of the loop is widely deformed (see FIG. 2D) as a result of bonding position failure. Furthermore, there is a case where it is not fixed at a fixed position due to the positional deviation of bonding. Thus, in the conventional formation form, there exists a big difficulty accompanied by the dispersion | variation in manufacturing quality. As a result, individual differences occur with respect to the electromagnetic coupling characteristics with the YIG resonant element. For example, if the electromagnetic coupling is too strong, spurious is likely to occur, or a phenomenon in which the resonance frequency proportional to the strength of the magnetic field applied to the YIG resonant element from the outside partially hops (jumps) occurs. Various critical conditions are likely to occur such that the electromagnetic coupling is too weak to easily stop oscillation, and a stable circuit function may not be obtained. This reduces the tolerance as an element and reduces the practical reliability of the element. From these viewpoints, it is not preferable that variations in the formation of the coupling coil occur.
[0009]
Next, FIG. 1 (c) is a front view and a top view showing the coil formation completion state. In this process, the fixed self-bonding rod 70 is slowly and carefully removed so that the final self-supporting connection is achieved. The coil 50 is completed. When the formed rod 70 is removed, if the coil is formed tightly, the coil shape may be deformed by applying stress to the completed coupling coil 50, or the bonding part may be disconnected or deformed. Rarely occurs. In this respect also, there is a practical difficulty in forming the coupling coil.
[0010]
[Problems to be solved by the invention]
As described above, in the prior art, a small coupling coil having a desired constant size and shape is formed by winding a wire ribbon around a forming rod. However, as described above, the formation variation of the coupling coil tends to occur with the manufacturing variation. As a result, when the resonant circuit is incorporated into the YIG resonant element, the design electromagnetic coupling conditions are not satisfied, and as a result, there are various unfavorable problems as described above.
Therefore, the problem to be solved by the present invention is to provide a coupling structure for electromagnetic coupling for a magnetic resonator that can greatly reduce manufacturing variations in the formation of a coupling coil that is electromagnetically coupled to the magnetic resonator . It is to provide a manufacturing method .
[0011]
[Means for Solving the Problems]
A first solution will be described.
In order to solve the above problems, a coupling structure for electromagnetic coupling for a magnetic resonator applied from a microwave band to a millimeter wave band, comprising a metal coil, a base substrate, and a mold material,
The metal coil (for example, the coupling coil 96) is a very small coil that is formed in a predetermined coil shape and performs predetermined electromagnetic coupling with the magnetic resonator.
The base substrate (for example, substrate 80) electrically connects both terminal portions (for example, connection electrode 97) of the metal coil to corresponding electrodes (for example, the first electrode 11 and the second electrode 12) on the base substrate side. A metal coil is self-supported to form a coupling structure for electromagnetic coupling.
The mold material (for example, the sacrificial layer 90) can be dissolved by a predetermined solvent, can maintain the coil shape of the extremely small metal coil, and the base substrate corresponding to the metal coil held in the mold material A structure that can hold a predetermined shape without deformation of the coil shape of the metal coil against the pressure when electrically connecting to the side electrode with an ultrasonic wire bonder device or the like, and after the electrical connection, the mold material Is dissolved by a predetermined solvent and disappears to cause the metal coil to appear,
A coupling structure for electromagnetic coupling for a magnetic resonator characterized by comprising the above.
According to the above invention, it is possible to realize an electromagnetic coupling coupling structure for a magnetic resonator that can greatly reduce manufacturing variations in forming a coupling coil that is electromagnetically coupled to the magnetic resonator.
[0012]
Next, a second solving means will be shown. FIG. 3 shows the solution means according to the present invention.
As one aspect of the metal coil, a concave portion having a predetermined shape which is a coil shape of the metal coil is formed in a predetermined portion of the mold material, and the metal coil having a predetermined thickness film is generated by gold plating on the concave portion. There is an electromagnetic coupling coupling structure for the above-described magnetic resonator.
[0013]
Next, a third solving means will be shown. FIG. 5 shows the solving means according to the present invention.
As one aspect of the above-described metal coil, two metal coils arranged in parallel by gold plating are formed so as to be two coils formed in parallel, and the electromagnetic coupling for the magnetic resonator described above, There is a coupling structure.
As a result, it is possible to form a metal coil that has two coils (for example, Helmholtz coil type) formed in parallel with a uniform structure and uniform shape that can greatly reduce manufacturing variations.
[0014]
Next, a fourth solving means will be shown. FIG. 4 shows the solving means according to the present invention.
As one aspect of the metal coil, the base substrate is notched, the mold material is accommodated in the notch portion, and both terminal portions of the metal coil are electrically connected to the corresponding electrodes on the base substrate side, There is provided a coupling structure for electromagnetic coupling for the above-described magnetic resonator, characterized in that it has a mounting structure for accommodating the metal coil in the notch of the base substrate.
[0015]
Next, a fifth solving means will be shown.
As one aspect of the magnetic resonator, there is a coupling structure for electromagnetic coupling for the magnetic resonator described above, which is a magnetic resonator made of a YIG (Yttrium Iron Garnet) single crystal.
[0016]
Next, sixth solving means will be described.
A magnetic resonator using a YIG sphere is provided,
Magnetic field applying means (for example, an exciting coil) for applying a constant magnetic field or a variable magnetic field to the magnetic resonator,
Comprising the above-described electromagnetic coupling coupling structure that electromagnetically couples the metal coil in a predetermined positional relationship with the magnetic resonator;
There exists a YIG resonance apparatus characterized by comprising the above.
Thereby, a stable YIG tuning oscillator or YIG tuning filter with little manufacturing variation and characteristic variation can be realized.
[0017]
Next, a seventh solving means will be shown.
As an aspect of the above-described magnetic resonator, there is an electromagnetic coupling coupling structure for the above-described magnetic resonator, which is a magnetic resonator made of a barium ferrite single crystal.
[0018]
Next, an eighth solving means will be shown.
It has a magnetic resonator that uses barium ferrite spheres,
Magnetic field applying means (for example, an exciting coil) for applying a constant magnetic field or a variable magnetic field to the magnetic resonator,
Comprising the above-described electromagnetic coupling coupling structure that electromagnetically couples the metal coil in a predetermined positional relationship with the magnetic resonator;
There is a barium ferrite resonance device characterized by comprising the above.
As a result, a stable barium ferrite tuned oscillator or barium ferrite tuned filter with less manufacturing variation and characteristic variation can be realized.
[0019]
Next, ninth solving means will be described. FIG. 3 shows the solution means according to the present invention.
A method of manufacturing a coupling structure for electromagnetic coupling for a magnetic resonator applied from a microwave band to a millimeter wave band, comprising a metal coil, a base substrate, and a mold material,
The metal coil (for example, the coupling coil 96) is a very small coil that is formed in a predetermined coil shape and performs predetermined electromagnetic coupling with the magnetic resonator.
The base substrate (for example, the substrate 80) electrically connects both terminal portions of the metal coil to corresponding electrodes (for example, the first electrode 11 and the second electrode 12) on the base substrate side to fix the metal coil in a self-supporting manner. Coupling structure for electromagnetic coupling,
The mold material (for example, the sacrificial layer 90) includes a step of forming a U-shaped groove 92 having a shape of the metal coil by cutting or molding,
The formed U-shaped groove 92 includes a step of applying a conductive resist 94 to a predetermined coil shape and a contour to be a connection electrode 97 at both ends of the coil.
A step of growing a thick gold plating having a predetermined thickness on the conductive resist by electrolytic plating on the mold material to form a metal coil having a predetermined shape;
In the state where the connection electrodes 97 at both ends of the coil are positioned and pressed against the corresponding electrodes on the base substrate side, ultrasonic vibration is applied through the mold material to electrically weld and connect the two. And
A step of dissolving and removing the mold material by immersing the mold material together with the base substrate in a predetermined solvent (for example, hydrochloric acid);
There is a method of manufacturing an electromagnetically coupled coupling structure for a magnetic resonator, characterized in that a metal coil having a predetermined shape is formed.
[0020]
In addition, the invention means of the present application may be combined with each element means in the above-described solution means as appropriate to form other practical means that can be used as desired. Moreover, although the code | symbol provided to each said element respond | corresponds to the code | symbol shown by embodiment etc. of this invention, it is not limited to this, The structural means to which the other equivalent which is practical is applied It is also good.
[0021]
DETAILED DESCRIPTION OF THE INVENTION
An example of an embodiment to which the present invention is applied will be described below with reference to the drawings. Further, the scope of the claims is not limited by the description of the following embodiment, and further, the elements and connection relationships described in the embodiment are not necessarily essential to the solution means. Furthermore, the features / forms of the elements and connection relationships described in the embodiments are merely examples, and are not limited only to the features / forms.
[0022]
The present invention will be described below with reference to a forming process according to the coupling coil of the coupling structure shown in FIG. In addition, the element corresponding to a conventional structure attaches | subjects the same code | symbol, and description of the overlapping part is abbreviate | omitted.
[0023]
The sacrificial layer 90 in FIG. 3A is a rectangular parallelepiped resin material that can be dissolved by a solvent, and for example, delrin resin is used. Then, a U-shaped U-shaped groove 92 that determines the size and shape of the coupling coil is formed by cutting or the like. In cutting, for example, a very small U-shaped groove of 0.7 mm is easy and can be cut with high accuracy. The thickness of the sacrificial layer 90 is the same as the width of the coupling coil 96 of about several hundred μm, or larger than the thickness as shown in FIG. The U-shaped groove 92 may be formed by a molding method instead of cutting.
[0024]
In the process of FIG. 3B, a conductive resist 94 is applied. That is, the conductive resist 94 is applied in a coil shape having a width of about several hundred μm of the finally formed coupling coil 96 and having a connection electrode at both ends of the coil. FIG. 3D shows the state of the applied conductive resist 94 when the sacrificial layer 90 is viewed from the bottom side.
[0025]
In the process of FIG. 3C, a thick gold plating is formed. That is, gold plating is formed on the conductive surface of the conductive resist 94 applied and formed by electrolytic plating to form the coupling coil 96 and the connection electrodes 97 at both ends of the coil. As the thickness of the plating at this time, a plating process having a thickness that allows the gold plating itself to stand by itself is performed. For example, the plating process is performed so that the film thickness is 10 μm or more. FIG. 3D shows the state of the coupling coil formed by gold plating when viewed from the bottom side.
[0026]
3E, the sacrificial layer 90 with the coupling coil 96 formed as described above is disposed on the corresponding first electrode 11 and second electrode 12 in a predetermined positional relationship, and then welded. . That is, in a state where the sacrificial layer 90 is positioned with respect to the substrate 80, the connection electrodes 97 at both ends of the coupling coil 96 are ultrasonically vibrated from above via the sacrificial layer 90 by the ultrasonic vibration device 150. The electrode 97 is welded and connected. At this time, since the coil widths at both ends of the coupling coil 96 (see FIG. 3C) are fixed by the sacrificial layer 90, there is an advantage that they are connected with a constant coil width. Further, since the coupling coil 96 is attached to the sacrificial layer 90, there is an advantage that welding can be performed without deformation of the coil shape even when pressed from above.
[0027]
In the step of FIG. 3F, the sacrificial layer 90 is dissolved and removed. That is, the entire substrate 80 is infiltrated with a solvent in which the sacrificial layer 90 can be dissolved, for example, hydrochloric acid solution, and the sacrificial layer 90 and the conductive resist 94 are dissolved and removed. Also at this time, since no external force is applied, the shape of the minimum coil remains. As a result, the self-standing coupling coil 96 is finally completed. Moreover, the loop height (see FIG. 3A) and loop coil width (see FIG. 3B) of the formed coupling coil 96 are always constant, and a uniform coil with almost no manufacturing variation can be connected to a predetermined position. There are significant advantages. According to the coil forming method of the above-described invention, the coil shape is formed and disposed under the electromagnetic coupling conditions in the initial design. As a result, when the resonant circuit is incorporated in the YIG resonant element, there is a great advantage that the electromagnetic coupling variation accompanying the variation in shape and various undesired malfunctions associated with the variation as shown in the prior art can be solved. Will be.
[0028]
The technical idea of the present invention is not limited to the specific configuration example and connection mode example of the above-described embodiment. Furthermore, based on the technical idea of the present invention, the above-described embodiment may be modified as appropriate and applied widely.
For example, in the above-described embodiment, the coupling coil 96 is a specific example attached to the upper part of the substrate 80, but there are other arrangement forms as shown in FIG. In this case, a part of the substrate 80 is cut away, and an opening 82 having a size that can accommodate the sacrificial layer 90 is provided. Then, as shown in FIG. 4A, the sacrificial layer 90 is accommodated in the opening 82, and in this state, the first electrode 11 and the second electrode 12 corresponding to the connection electrodes 97 at both ends of the coil are bonded to the bonding wires. 98 to connect each. After that, when the unnecessary sacrificial layer 90 is dissolved and removed, the coupling coil 50 is disposed so as to be accommodated in the opening 82 as shown in FIG.
According to this, the height of the substrate can be suppressed and the gap (Gap) of the magnetic circuit can be narrowed. As a result, as shown in JP-A-10-163716 (YIG resonator), miniaturization and power saving can be achieved. An excellent advantage is that it can be measured.
Moreover, the difficulty that the coupling coil 96 contacts the periphery and deforms carelessly when the substrate 80 is mounted on the apparatus can be solved.
[0029]
In the above-described embodiment, the coupling coil 96 is a specific example in which one U-shaped coil is attached to the substrate 80, but other arrangements in which two parallel U-shaped coils are attached to the substrate 80 in FIG. The configuration is shown. The two coils arranged in parallel have an advantage that it is easy to realize a resonator in which parasitic resonance is suppressed as a result of improved uniformity of the high-frequency magnetic field generated by the coupling coil. FIG. 5A shows a state seen from the bottom surface side of the sacrificial layer 90. Based on the formation method described above, two coupled coils 96a and 96b in which coils are arranged in parallel on the sacrificial layer 90 can be similarly formed. . FIG. 5B shows a state in which the substrate is finally connected to the substrate 80. FIG. 5C shows a connection state viewed from the upper surface side of the substrate.
This provides a great advantage that the two coils can be formed with a precisely constant physical positional relationship. Of course, the coil shape can be formed under the electromagnetic coupling conditions in the design. Therefore, it is possible to obtain a great advantage that a coupled coil having two coils formed in parallel with a minimum in quality can be stably formed.
[0030]
In the above-described embodiment, the coupling coil 96 is shown as a specific example of means formed by electrolytic plating. However, the coupling coil 96 may be formed by applying other forming means.
[0031]
In the above-described embodiment, the coupling coil 96 is shown as a specific example in which a predetermined coil shape is formed in the U-shaped concave U-shaped groove 92 of the sacrificial layer 90. A convex shape may be formed, and a predetermined coil shape may be formed on the convex shape. In this case, it can be electrically connected to the substrate by the connection method shown in FIG.
[0032]
In the above embodiment, the specific coil shape is formed on the U-shaped U-shaped groove 92 of the sacrificial layer 90 by the electrolytic plating method. However, the wire ribbon 40 is pressed into the U-shaped groove 92 by a press machine. Thus, a coil shape is formed, and both ends are cut to form a coupling coil 96. And it fixes so that this shape may be maintained. For example, the sacrificial layer 90 and the coupling coil 96 are fused and integrated with an ultrasonic vibration device or the like. The tip of the ultrasonic vibration device may be processed into a U shape so that it can be used for both press machines. As a result, the coupling coil 96 having a predetermined shape is adhered and held to the sacrificial layer 90, and thereafter is electrically connected to the substrate 80 in the same manner as described above.
In this case, although the dimensional accuracy of the coil shape is slightly inferior to that of the above-described electrolytic plating method, a time-consuming electrolytic plating operation can be eliminated if it can be formed with practical dimensional accuracy.
[0033]
【The invention's effect】
The present invention has the following effects in view of the above description.
As described above, according to the present invention, a thick gold plating having a predetermined width is formed on a sacrificial layer having a U-shaped U-groove that determines the shape of a very small coupling coil applied in the microwave band. By using the forming means for connecting to the substrate as a coil, variations in the coil shape can be eliminated, a uniform coil can be realized, and the coil shape can be formed under the electromagnetic coupling conditions originally designed.
As a result, when the coil is incorporated into the YIG resonant element to form a resonant circuit, the electromagnetic coupling condition with the YIG resonant element is realized as originally designed. For example, the electromagnetic coupling is too strong and unnecessary spurious is generated. Oscillation is likely to occur, and the phenomenon of partial hopping (jumping) occurs without the resonance frequency being proportional to the strength of the magnetic field applied to the YIG resonance element from the outside, and the electromagnetic coupling becomes weak and oscillation occurs. Various critical conditions that make it easier to stop are greatly reduced by the uniform coil formation of the present invention. As a result, it is possible to obtain a great advantage that a resonant circuit having a stable coupling characteristic can be realized. Furthermore, this provides a margin as a resonance circuit and an advantage that the reliability as the resonance circuit is further improved.
Also, according to the arrangement shown in FIG. 4, the height of the substrate can be suppressed and the gap of the magnetic circuit can be narrowed. As a result, as shown in Japanese Patent Laid-Open No. 10-163716 (YIG resonator), miniaturization is achieved. An excellent advantage of saving power can be obtained.
Therefore, the technical effect of the present invention is great, and the industrial economic effect is also great.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating a conventional process of forming a coupling structure.
FIG. 2 is a diagram for explaining a variation in loop shape due to the formation of a conventional coupling coil;
FIG. 3 is a diagram showing a process of forming a coupling structure according to the present invention.
FIG. 4 is a diagram showing a state in which a coupling coil according to the present invention is disposed in a substrate.
FIG. 5 is a diagram showing a state of forming a coupling coil as two coils formed in parallel according to the present invention.
[Explanation of symbols]
11 First electrode 12 Second electrode 40 Wire ribbon 50, 96, 96a, 96b Coupling coil 70 Forming rod 80 Substrate 82 Opening 90 Sacrificial layer 92 U-shaped groove 94 Conductive resist 97 Connection electrode 98 Bonding wire 150 Ultrasonic excitation apparatus

Claims (6)

A manufacturing method of a coupling structure for electromagnetic coupling for a magnetic resonator , which includes a metal coil, a base substrate, and a mold, and is applied from a microwave band to a millimeter wave band,
The metal coil is a very small coil that is formed in a predetermined coil shape and performs predetermined electromagnetic coupling with the magnetic resonator,
The base substrate is an electromagnetic coupling coupling structure by electrically connecting both terminal portions of the metal coil to corresponding base substrate side electrodes and fixing the metal coil.
Forming an opening having a size capable of accommodating the mold material in the base substrate;
In the mold member, a step of forming by cutting or molding a U-shaped groove of substantially equal shape to the shape of the metal coil,
In formed the U-shaped groove, a step of applying conductive resist contour a predetermined coil shape and a coil both ends of the connection electrodes,
Against the mold member, by electrolytic plating, forming a metal coil having a predetermined shape gold plating of thick film becomes a predetermined thickness on the conductive resist on growing formed,
Storing the mold material in which the metal coil is formed in the opening;
Connecting each of the connection electrodes at both ends of the metal coil to any of a plurality of electrodes provided on the base substrate;
A step of dissolving and removing said mold member soak the mold member to a predetermined solvent together with the base substrate,
And a coupling structure for electromagnetic coupling for a magnetic resonator that forms a metal coil having a predetermined shape. The coupling structure for electromagnetic coupling according to claim 1, wherein in the connecting step, each of the connection electrodes is connected to one of a plurality of electrodes provided on the base substrate with a bonding wire. Body manufacturing method. The depth of the opening is substantially equal to the thickness of the mold material.
The manufacturing method of the coupling structure for electromagnetic coupling for magnetic substance resonators of Claim 1 or Claim 2 . The depth of the opening is equal to or greater than the depth of the bottom of the U-shaped groove formed in the mold material with respect to the surface of the mold material.
The manufacturing method of the coupling structure for electromagnetic coupling for magnetic substance resonators in any one of Claim 1 thru | or 3 . The magnetic resonator is a YIG (Yttrium Iron Garnet) single crystal magnetic resonator,
The manufacturing method of the coupling structure for electromagnetic coupling for magnetic substance resonators in any one of Claim 1 thru | or 4. The magnetic resonator is a magnetic resonator made of a barium ferrite single crystal.
The manufacturing method of the coupling structure for electromagnetic coupling for magnetic substance resonators in any one of Claim 1 thru | or 4.

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