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JP4342270B2 - Resistance pattern for electric circuit - Google Patents
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JP4342270B2 - Resistance pattern for electric circuit - Google Patents

Resistance pattern for electric circuit Download PDF

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JP4342270B2
JP4342270B2 JP2003366541A JP2003366541A JP4342270B2 JP 4342270 B2 JP4342270 B2 JP 4342270B2 JP 2003366541 A JP2003366541 A JP 2003366541A JP 2003366541 A JP2003366541 A JP 2003366541A JP 4342270 B2 JP4342270 B2 JP 4342270B2
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resistance pattern
electric circuit
resistance
paste
thermoplastic resin
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JP2005129466A (en
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義積 大井
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帝国通信工業株式会社
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Description

本発明は、金属製の摺動子が摺動する電気回路用抵抗パターンに関するものである。 The present invention relates to a resistance pattern for an electric circuit on which a metal slider slides .

従来、回路基板上への抵抗パターンの形成は、カーボン粉と有機バインダーと溶剤とを混練してなる電気回路用抵抗ペーストを、スクリーン印刷等によって回路基板上に印刷し、この回路基板を焼成することによって行っていた。   Conventionally, a resistance pattern is formed on a circuit board by printing a resistance paste for an electric circuit formed by kneading carbon powder, an organic binder and a solvent on the circuit board by screen printing or the like, and firing the circuit board. Was going by.

ところで抵抗パターンの内、可変抵抗器用の抵抗パターンは、その上を金属製の摺動子が摺動するので、摺動子の摺動が滑らかに行えるように、その表面に潤滑性を有していることが必要である。このため従来例えば特許文献1に示すように、電気回路用抵抗ペースト中にフッ素樹脂の粉末を混合したもの等がある。   By the way, among the resistance patterns, the resistance pattern for the variable resistor has a lubricity on its surface so that the sliding movement of the sliding element can be performed smoothly because the metal sliding element slides on the resistance pattern. It is necessary to be. For this reason, as shown in Patent Document 1, for example, there is conventionally a mixture of fluororesin powder in a resistance paste for electric circuits.

また従来、表面に潤滑性のある可変抵抗器用の抵抗パターンのカーボン粉として、黒鉛の粉末が使用されている。黒鉛の潤滑性は、水蒸気分子を吸着したきわめて薄い吸着層が原因であるという表面すべり説と、黒鉛分子の層間にある水蒸気(吸着ガス)による結合力の変化による内部すべり説の2つの説がある。何れにしても黒鉛においては、水蒸気と摩擦力は密接な関係にあり、水蒸気量は温度(気圧)に依存するので、抵抗ペーストの摩擦係数は温度によって変化することがわかっている。   Conventionally, graphite powder has been used as a carbon powder of a resistance pattern for a variable resistor having lubricity on the surface. There are two theories, namely, the surface slip theory that the lubricity of graphite is caused by an extremely thin adsorbed layer that adsorbs water vapor molecules, and the internal slip theory due to the change in bonding force due to water vapor (adsorbed gas) between the graphite molecules. is there. In any case, in graphite, the water vapor and the frictional force are closely related, and the amount of water vapor depends on the temperature (atmospheric pressure). Therefore, it is known that the coefficient of friction of the resistance paste changes depending on the temperature.

ここで図1(a)の二本の点線で示す折線グラフは、上記従来の抵抗パターンの温度に対する摩擦係数の変化の状態を示している。その実験方法を説明すると、図1(b)に示すように、ヒータ100の上に基板上に前記抵抗ペースト(黒鉛粉末からなるカーボン粉末と、フェノール樹脂製の有機バインダーと、エチレングリコールモノブチルエーテル製の溶剤と、少量の添加剤(消泡剤等)を混練したもの)を印刷して焼成して抵抗パターンを形成した試料110を固定し、試料110の抵抗パターン上に弾性金属板(ベリリウム銅板)製の摺動子120の摺動接点121を所定の圧力(30gF)で押し付け、この状態でヒータ100及びこれに固定した試料110を水平方向(矢印A方向)に移動し、その際に摺動子120に加わる水平方向の力をロードセルによって検出することで、その摩擦係数を測定する。測定は、雰囲気温度が23℃、41℃、59℃、78℃、98℃、115℃のときであって、且つヒータ100及び試料110の一往復目と五往復目とについて行った。なおこの抵抗パターンは、比抵抗400(Ω/□)〔長さ×幅=(1cm×1cm)、厚み=10μmで、その抵抗値が400Ωのもの〕となるように、有機バインダーとカーボン粉末とを混練したものを用いた。   Here, the line graph shown by two dotted lines in FIG. 1A shows the state of change of the friction coefficient with respect to the temperature of the conventional resistance pattern. Explaining the experimental method, as shown in FIG. 1 (b), the resistor paste (carbon powder made of graphite powder, organic binder made of phenol resin, ethylene glycol monobutyl ether made on the substrate on the heater 100, as shown in FIG. Sample 110 and a small amount of additive (antifoaming agent etc. kneaded) are printed and fired to fix sample 110 on which a resistance pattern is formed, and an elastic metal plate (beryllium copper plate) on the resistance pattern of sample 110 ) The sliding contact 121 of the manufactured slider 120 is pressed at a predetermined pressure (30 gF), and in this state, the heater 100 and the sample 110 fixed thereto are moved in the horizontal direction (arrow A direction). By detecting the horizontal force applied to the moving element 120 by the load cell, the friction coefficient is measured. The measurement was performed when the ambient temperature was 23 ° C., 41 ° C., 59 ° C., 78 ° C., 98 ° C., and 115 ° C., and for the first and fifth reciprocations of the heater 100 and the sample 110. The resistance pattern has a specific resistance of 400 (Ω / □) [length × width = (1 cm × 1 cm), thickness = 10 μm, resistance value is 400Ω], and organic binder and carbon powder. A kneaded mixture was used.

図1(a)に点線で示すように、摩擦係数は、温度が高くなればなるほど大きくなることが確認された。つまり温度が高くなればなるほど摺動子を摺動させる際の抵抗が大きくなって滑らかな摺動ができなくなってしまう。   As indicated by the dotted line in FIG. 1A, it was confirmed that the friction coefficient increases as the temperature increases. In other words, the higher the temperature, the greater the resistance when sliding the slider and the smoother sliding becomes.

一方抵抗パターン上を摺動する摺動子の摩擦抵抗を低くする方法として、従来、印刷形成した抵抗パターン上にグリースをオーバーコートする方法がある。図1(a)の一点鎖線は、グリースをオーバーコートした抵抗パターンの温度に対する摩擦係数の変化の状態を示している。実験方法は上記の場合と同様である。図1(a)に一点鎖線で示すように、グリースを塗布した抵抗パターンの場合、室温では摩擦係数が小さくなる。   On the other hand, as a method of reducing the frictional resistance of the slider sliding on the resistance pattern, there is a conventional method of overcoating grease on the printed resistance pattern. The one-dot chain line in FIG. 1A shows the state of change in the friction coefficient with respect to the temperature of the resistance pattern overcoated with grease. The experimental method is the same as that described above. As shown by the alternate long and short dash line in FIG. 1A, in the case of a resistance pattern coated with grease, the coefficient of friction becomes small at room temperature.

しかしながらグリースをオーバーコートした抵抗パターンの場合、抵抗パターンを形成した後に、改めてグリースを塗布し、さらに余剰のグリースをふき取るという作業が必要で、製造工程が煩雑化するという問題があった。また前述のように摩擦抵抗は低くなるが、温度が上昇するにつれて摩擦係数が上昇していくということ自体は前記グリースを塗布しない抵抗パターンの場合と同様であり、高温の環境下では摺動子の摺動感覚が悪くなってしまう。
特開平2−263877号公報
However, in the case of a resistance pattern overcoated with grease, after forming the resistance pattern, it is necessary to apply grease again and then wipe off excess grease, resulting in a problem that the manufacturing process becomes complicated. As described above, the frictional resistance decreases, but the coefficient of friction increases as the temperature rises. This is the same as in the case of the resistance pattern in which the grease is not applied. The feeling of sliding becomes worse.
JP-A-2-263877

本発明は上述の点に鑑みてなされたものでありその目的は、低温から高温にわたって抵抗パターンの摩擦抵抗を小さく維持でき、同時に抵抗パターンの形成が容易に行える電気回路用抵抗パターンを提供することにある。 The present invention has been made in view of the above points, and an object of the present invention is to provide a resistance pattern for an electric circuit that can keep the frictional resistance of the resistance pattern small from a low temperature to a high temperature and at the same time easily form the resistance pattern. It is in.

本願の請求項1に記載の発明は、カーボン粉末と、有機バインダーと、溶剤とを混練してなる電気回路用抵抗ペーストを基板上に塗布したものを加熱・焼成することで形成されその上を金属製の摺動子が摺動する電気回路用抵抗パターンにおいて、前記電気回路用抵抗ペーストにはさらに、前記電気回路用抵抗ペーストの焼成温度以下の温度で溶けるポリエチレン樹脂を、前記有機バインダーとポリエチレン樹脂全体に対して2重量%以下の混合割合で混合したことを特徴とする電気回路用抵抗パターンである。カーボン粉末としては、例えば黒鉛粉末のみでも良いし、黒鉛粉末とカーボンブラック粉末とを混合した粉末でも良いし、カーボンブラック粉末のみでも良い。 The invention according to claim 1 of the present application is formed by heating and baking a material obtained by applying a resistive paste for an electric circuit formed by kneading carbon powder, an organic binder, and a solvent on a substrate. In the electric circuit resistance pattern in which the metal slider slides, the electric circuit resistance paste further includes a polyethylene resin that melts at a temperature lower than the firing temperature of the electric circuit resistance paste, and the organic binder and polyethylene. It is an electric circuit resistance pattern characterized by being mixed at a mixing ratio of 2% by weight or less with respect to the entire resin. The carbon powder may be, for example, only graphite powder, a mixed powder of graphite powder and carbon black powder, or only carbon black powder.

請求項1に記載の発明によれば、ポリエチレン樹脂は、電気回路用抵抗ペースト中では粒子状として分散していても、焼成によって電気回路用抵抗パターンを形成する際に液状化し対流によりその表面付近に浮き出てきて、電気回路用抵抗パターンの表面を薄く覆い、これによってその上を摺動する摺動子の摺動に潤滑性を持たせることができ、摺動子の摺動時の摩擦抵抗を小さくすることができる。そして雰囲気温度が上昇しても摩擦抵抗は上昇せず、低温から高温にわたって電気回路用抵抗パターンの摩擦抵抗を小さく維持できる。 According to the first aspect of the present invention, even if the polyethylene resin is dispersed in the form of particles in the electric circuit resistance paste, it is liquefied when the electric circuit resistance pattern is formed by baking, and is near the surface by convection. The surface of the resistance pattern for the electric circuit is thinly covered so that the sliding motion of the slider sliding on the surface can be given lubricity. Can be reduced. Even if the ambient temperature rises, the frictional resistance does not rise, and the frictional resistance of the electrical circuit resistance pattern can be kept small from a low temperature to a high temperature.

また電気回路用抵抗ペーストを基板に印刷・焼成するという、従来の電気回路用抵抗パターンの形成方法と同一の方法を用いるだけで、グリースを塗布するなどの追加作業を必要とせず、摩擦抵抗の低い抵抗パターンを形成することができる。   In addition, using the same method as the conventional method of forming a resistance pattern for electric circuits, that is, printing and baking a resistance paste for electric circuits on a substrate, no additional work such as application of grease is required, and friction resistance is reduced. A low resistance pattern can be formed.

特にポリエチレン樹脂の混合割合を、有機バインダーとポリエチレン樹脂全体に対して2重量%以下にしたので、この電気回路用抵抗ペーストを用いて形成される電気回路用抵抗パターンの抵抗値をほとんど上昇させることなく、その摩擦抵抗を小さく維持するのに好適である。 In particular, the mixing ratio of the polyethylene resin is set to 2% by weight or less based on the total amount of the organic binder and the polyethylene resin, so that the resistance value of the electrical circuit resistance pattern formed using this electrical circuit resistance paste is almost increased It is suitable for keeping the frictional resistance small.

以下、本発明の実施形態を詳細に説明する。
即ち本発明の電気回路用抵抗ペーストは、カーボン粉末と、有機バインダーと、溶剤とを混練してなる電気回路用抵抗ペーストであって、この電気回路用抵抗ペーストにこの電気回路用抵抗ペーストの焼成温度以下の温度で溶ける材質の熱可塑性樹脂を混合して構成されている。
Hereinafter, embodiments of the present invention will be described in detail.
That is, the electrical circuit resistive paste of the present invention is an electrical circuit resistive paste obtained by kneading carbon powder, an organic binder, and a solvent, and the electrical circuit resistive paste is fired into the electrical circuit resistive paste. It is configured by mixing a thermoplastic resin that melts at a temperature lower than the temperature.

ここでカーボン粉末は、黒鉛粉末のみでも良いし、黒鉛粉末とカーボンブラック粉末とを混合した粉末でも良いし、カーボンブラック粉末のみでも良い。またこれら以外のカーボン粉末を用いても良い。   Here, the carbon powder may be only graphite powder, may be powder obtained by mixing graphite powder and carbon black powder, or may be only carbon black powder. Carbon powders other than these may be used.

有機バインダーは熱硬化性樹脂を用いる。熱硬化性樹脂の具体例としては、例えばフェノール樹脂、エポキシ樹脂がある。   A thermosetting resin is used as the organic binder. Specific examples of the thermosetting resin include a phenol resin and an epoxy resin.

溶剤は、例えばエチレングリコールモノブチルエーテル、ジエチレングリコールモノエチルエーテルアセテート等を用いる。   As the solvent, for example, ethylene glycol monobutyl ether, diethylene glycol monoethyl ether acetate or the like is used.

熱可塑性樹脂は、例えばこの電気回路用抵抗ペーストの焼成温度が165℃であるとすると、それよりも低い温度で溶ける材質の熱可塑性樹脂、例えばポリオレフィン系樹脂であるポリエチレン樹脂を使用する。ポリエチレン樹脂の溶融温度(融点)は90〜130℃である。 Thermoplastic resin, for example, the firing temperature of the electric circuit resistor paste is to be 165 ° C., using the material of the thermoplastic resin that melts at a temperature lower than that, the polyethylene resins, for example, polyolefin-based resin. The melting temperature (melting point) of the polyethylene resin is 90 to 130 ° C.

また熱可塑性樹脂の有機バインダーに対する混合割合は、有機バインダーと熱可塑性樹脂の全重量に対して熱可塑性樹脂の割合が2重量%以下となるようにする。熱可塑性樹脂の配合割合が高くなると、下記するように比抵抗が必要以上に大きくなるからである。   The mixing ratio of the thermoplastic resin to the organic binder is such that the ratio of the thermoplastic resin is 2% by weight or less with respect to the total weight of the organic binder and the thermoplastic resin. This is because as the blending ratio of the thermoplastic resin increases, the specific resistance increases more than necessary as described below.

そして本発明にかかる電気回路用抵抗ペーストを用いて電気回路用抵抗パターンを形成するには、この電気回路用抵抗ペーストを基板(フレキシブル基板、硬質基板を問わない)上に所定のパターン形状にスクリーン印刷等によって塗布し、次にこの基板を加熱・焼成して溶剤を揮発させると同時に有機バインダーを硬化させることによって行う。   In order to form an electric circuit resistance pattern using the electric circuit resistance paste according to the present invention, the electric circuit resistance paste is screened in a predetermined pattern shape on a substrate (whether a flexible substrate or a hard substrate). It is applied by printing or the like, and then the substrate is heated and baked to volatilize the solvent and simultaneously cure the organic binder.

以上のようにして形成された電気回路用抵抗パターン上に摺動子を摺動させると、その摩擦抵抗が小さく、スムーズな摺動ができる。その理由は以下のように考えられる。即ち本発明にかかる電気回路用抵抗ペーストは、その焼成温度よりも低い温度で溶ける熱可塑性樹脂を含有しているので、図2(a)に示すように、基板30上に印刷した電気回路用抵抗パターン40の焼成時にこの熱可塑性樹脂が液状化し、電気回路用抵抗パターン40の表面に対流によって浮き出てきて電気回路用抵抗パターン40の表面を薄く覆う(熱可塑性樹脂層45)。そして図2(b)に示すようにその上に摺動子50の摺動接点51を所定の圧力で押し付けて摺動すると、熱可塑性樹脂層45表面の摺動接点51が押し付けられている圧接部分aが摺動接点51の圧力と摩擦熱とによって溶融して液状になり、電気回路用抵抗パターン40と摺動接点51との間に潤滑油のような状態で存在し、このため両者間の摩擦係数を下げることができる。そして摺動接点51が通り過ぎると熱可塑性樹脂層45は再結晶して電気回路用抵抗パターン40の表面を覆う。   When the slider is slid on the electric circuit resistance pattern formed as described above, the frictional resistance is small and smooth sliding is possible. The reason is considered as follows. That is, the electrical circuit resistive paste according to the present invention contains a thermoplastic resin that melts at a temperature lower than its firing temperature, so that the electrical circuit resistive paste printed on the substrate 30 as shown in FIG. When the resistance pattern 40 is baked, the thermoplastic resin is liquefied and floats on the surface of the electrical circuit resistance pattern 40 by convection to thinly cover the surface of the electrical circuit resistance pattern 40 (thermoplastic resin layer 45). Then, as shown in FIG. 2B, when the sliding contact 51 of the slider 50 is pressed and slid at a predetermined pressure thereon, the sliding contact 51 on the surface of the thermoplastic resin layer 45 is pressed. The portion a melts by the pressure of the sliding contact 51 and frictional heat and becomes liquid, and exists between the electric circuit resistance pattern 40 and the sliding contact 51 as a lubricating oil. The friction coefficient can be reduced. When the sliding contact 51 passes, the thermoplastic resin layer 45 recrystallizes and covers the surface of the electric circuit resistance pattern 40.

ところで同様に摺動子の摺動を滑らかにする手段として、電気回路用抵抗ペースト中にフッ素樹脂粉末を添加する方法が考えられる。フッ素樹脂を添加した電気回路用抵抗ペーストを基板上に印刷・焼成して電気回路用抵抗パターンを形成すると、フッ素樹脂には融点がなく300℃以上で熱分解するため、図3(a)に示すように、焼成後の電気回路用抵抗パターン40の表面にフッ素樹脂粉末60が点々と露出することとなる。そして図3(b)に示すように、この電気回路用抵抗パターン40の上を摺動子50の摺動接点51が摺動すると、摺動接点51によって表面に露出したフッ素樹脂粉末60が伸び、これによって潤滑性が得られるものと考えられる。しかしながらこの場合、不導体であるフッ素樹脂粉末60が電気回路用抵抗パターン40の表面を覆うことになるので摺動子50と電気回路用抵抗パターン40との接触信頼性が得られない。   By the way, as a means for smoothing the sliding of the slider, a method of adding fluororesin powder into the electric circuit resistance paste is conceivable. When the electric circuit resistance paste to which a fluororesin is added is printed and baked on a substrate to form an electric circuit resistance pattern, the fluororesin has no melting point and is thermally decomposed at 300 ° C. or higher. As shown, the fluororesin powder 60 is exposed on the surface of the electric circuit resistance pattern 40 after firing. As shown in FIG. 3B, when the sliding contact 51 of the slider 50 slides on the electric circuit resistance pattern 40, the fluororesin powder 60 exposed on the surface is extended by the sliding contact 51. Thus, it is considered that lubricity can be obtained. However, in this case, since the fluororesin powder 60 which is a non-conductor covers the surface of the electric circuit resistance pattern 40, contact reliability between the slider 50 and the electric circuit resistance pattern 40 cannot be obtained.

これに対して上記本発明にかかる電気回路用抵抗ペーストを用いた電気回路用抵抗パターンの場合、上述のように、表面を覆う絶縁性の熱可塑性樹脂層45が一度液状化して直接摺動接点51が熱可塑性樹脂層45の下側の電気回路用抵抗パターン40に接触するため、接触信頼性が得られる。また本発明は熱可塑性樹脂層45が電気回路用抵抗パターン40表面に薄く均一に形成されれば良いので熱可塑性樹脂の投入量は少なくて良いが、これに比べてフッ素樹脂粉末60は粉末のままなのでその投入量は多くなってしまう。   On the other hand, in the case of the electric circuit resistance pattern using the electric circuit resistance paste according to the present invention, as described above, the insulating thermoplastic resin layer 45 covering the surface is once liquefied to directly slide the contact. Since 51 contacts the electric circuit resistance pattern 40 on the lower side of the thermoplastic resin layer 45, contact reliability is obtained. In the present invention, since the thermoplastic resin layer 45 only needs to be thinly and uniformly formed on the surface of the electric circuit resistance pattern 40, the amount of the thermoplastic resin charged may be small. As it remains, the amount of input will increase.

次に前記電気回路用抵抗ペーストとして、黒鉛粉末からなるカーボン粉末と、フェノール樹脂製の有機バインダーと、前記有機バインダーと熱可塑性樹脂全体に対して1重量%のポリエチレン樹脂製の熱可塑性樹脂と、エチレングリコールモノブチルエーテル製の溶剤と、少量の添加剤(消泡剤等)を混練したものを作製し、作製した抵抗ペーストを用いて形成した抵抗パターンの温度に対する摩擦係数の変化の状態を測定し、その測定結果を図1(a)の実線で示した。なおその実験方法は、上記従来例の実験方法と同様に、図1(b)に示すヒータ100の上に基板上に前記抵抗ペーストを印刷して焼成して抵抗パターンを形成した試料110を固定し、試料110の抵抗パターン上に弾性金属板(ベリリウム銅板)製の摺動子120の摺動接点121を所定の圧力(30gF)で押し付け、この状態でヒータ100及びこれに固定した試料110を水平方向(矢印A方向)に移動し、その際に摺動子120に加わる水平方向の力をロードセルによって検出することで、その摩擦係数を測定した。測定は、雰囲気温度が23℃、41℃、59℃、78℃、98℃、115℃のときであって、且つヒータ100及び試料110の一往復目と五往復目とについて行った。なおこの抵抗パターンは、比抵抗400(Ω/□)〔長さ×幅=(1cm×1cm)、厚み=10μmで、その抵抗値が400Ωのもの〕となるように、有機バインダーとカーボン粉末とを混練したものを用いた。   Next, as the electric circuit resistance paste, carbon powder made of graphite powder, an organic binder made of phenol resin, a thermoplastic resin made of polyethylene resin of 1% by weight with respect to the organic binder and the entire thermoplastic resin, Prepare a kneaded solvent made of ethylene glycol monobutyl ether and a small amount of additives (such as antifoaming agent), and measure the change in friction coefficient with temperature of the resistance pattern formed using the prepared resistance paste. The measurement result is shown by the solid line in FIG. The experimental method is the same as the experimental method of the above-described conventional example, and the sample 110 on which the resistance pattern is formed by printing the resistance paste on the substrate and baking it on the heater 100 shown in FIG. 1B is fixed. Then, the sliding contact 121 of the slider 120 made of an elastic metal plate (beryllium copper plate) is pressed onto the resistance pattern of the sample 110 with a predetermined pressure (30 gF), and in this state, the heater 100 and the sample 110 fixed to the heater 100 are fixed. The friction coefficient was measured by moving in the horizontal direction (arrow A direction) and detecting the horizontal force applied to the slider 120 at that time by the load cell. The measurement was performed when the ambient temperature was 23 ° C., 41 ° C., 59 ° C., 78 ° C., 98 ° C., and 115 ° C., and for the first and fifth reciprocations of the heater 100 and the sample 110. The resistance pattern has a specific resistance of 400 (Ω / □) [length × width = (1 cm × 1 cm), thickness = 10 μm, resistance value is 400Ω], and organic binder and carbon powder. A kneaded mixture was used.

図1(a)に実線で示すように、本発明を用いて形成した抵抗パターンは、図1(a)に点線で示す従来の抵抗パターンに比べてその摩擦抵抗値が小さくなり、また摩擦係数は、雰囲気温度が高くなっても上昇せず、むしろ徐々に下降していくことが確認された。以上のことから本発明にかかる電気回路用抵抗ペーストを用いて形成された電気回路用抵抗パターンは、低温から高温にわたって抵抗パターンの摩擦抵抗を常に小さく維持することができ、たとえ高温の環境下であっても、摺動子の摺動感覚は良好な状態を維持することがわかった。   As shown by the solid line in FIG. 1A, the resistance pattern formed using the present invention has a smaller frictional resistance value than the conventional resistance pattern shown by the dotted line in FIG. It was confirmed that the temperature did not increase even when the ambient temperature increased, but rather gradually decreased. From the above, the resistance pattern for an electric circuit formed using the resistance paste for an electric circuit according to the present invention can always keep the frictional resistance of the resistance pattern small from a low temperature to a high temperature, even in a high temperature environment. Even if it exists, it turned out that the sliding feeling of a slider maintains a favorable state.

図4は熱可塑性樹脂の含有量を変化させたときの比抵抗の変化を測定した測定結果を示す図である。測定方法は、電気回路用抵抗パターンを形成するための電気回路用抵抗ペーストとして、黒鉛粉末からなるカーボン粉末と、フェノール樹脂製の有機バインダーと、ポリエチレン樹脂製の熱可塑性樹脂と、エチレングリコールモノブチルエーテル製の溶剤と、少量の添加剤(消泡剤等)とを混練したものであって、有機バインダとカーボン粉末の配合割合〔有機バインダーの重量:カーボン粉末の重量〕が〔2:1〕のもの(丸の点でプロット)と、〔4:1〕のもの(四角の点でプロット)について、前記熱可塑性樹脂の配合割合を、有機バインダーと熱可塑性樹脂全体に対して0.0重量%〜5.0重量%の間で変化させたものを用い、これら各種電気回路用抵抗ペーストを用いて形成した電気回路用抵抗パターンの比抵抗(Ω/□)をそれぞれ測定した。なお比抵抗を測定した電気回路用抵抗パターンは、長さと幅が何れも1cmで厚み10μmのものである。   FIG. 4 is a diagram showing a measurement result obtained by measuring a change in specific resistance when the content of the thermoplastic resin is changed. The measurement method is as follows. As a resistance paste for an electric circuit for forming a resistance pattern for an electric circuit, carbon powder made of graphite powder, an organic binder made of phenol resin, a thermoplastic resin made of polyethylene resin, and ethylene glycol monobutyl ether And kneading a small amount of additives (such as antifoaming agent), wherein the blending ratio of organic binder and carbon powder [weight of organic binder: weight of carbon powder] is [2: 1]. The blending ratio of the thermoplastic resin is 0.0% by weight with respect to the organic binder and the whole thermoplastic resin, for the one (plotted by a round dot) and the one of [4: 1] (plotted by a square dot). The specific resistance (Ω / □) of the resistance pattern for an electric circuit formed using these various electric circuit resistance pastes was varied between ˜5.0% by weight. Respectively were measured. The electrical circuit resistance pattern for which the specific resistance was measured has a length and width of 1 cm and a thickness of 10 μm.

同図に示すように、有機バインダー中の熱可塑性樹脂の含有量が増加すると、電気回路用抵抗パターンの比抵抗は急激に増大していくことがわかる。即ち前記含有量が2.0重量%を越えると、全く熱可塑性樹脂を含んでいない電気回路用抵抗パターンに比べて、その抵抗値はかなり(1.5倍以上)上昇してしまう。従って抵抗値の上昇率を1.5倍以内の小さいものとするためには、有機バインダー中の熱可塑性樹脂の含有量は、2.0重量%以下であることが望ましい。   As shown in the figure, it can be seen that as the content of the thermoplastic resin in the organic binder increases, the specific resistance of the electric circuit resistance pattern increases rapidly. That is, when the content exceeds 2.0% by weight, the resistance value increases considerably (1.5 times or more) as compared with a resistance pattern for an electric circuit that does not contain any thermoplastic resin. Therefore, in order to make the rate of increase in resistance value as small as 1.5 times or less, the content of the thermoplastic resin in the organic binder is desirably 2.0% by weight or less.

図1(a)は本発明にかかる電気回路用抵抗ペーストを用いて形成した電気回路用抵抗パターンと、従来の電気回路用抵抗パターンの、温度−摩擦係数特性を示す図、図1(b)は摩擦係数の測定方法を示す図である。FIG. 1A is a diagram showing temperature-friction coefficient characteristics of an electrical circuit resistance pattern formed using the electrical circuit resistance paste according to the present invention and a conventional electrical circuit resistance pattern, and FIG. These are figures which show the measuring method of a friction coefficient. 図2(a)は、本発明にかかる電気回路用抵抗ペーストを用いて形成した電気回路用抵抗パターンの要部概略拡大断面図、図2(b)はその電気回路用抵抗パターン上を摺動子50が摺動する際の状態を示す要部概略拡大断面図である。FIG. 2A is a schematic enlarged cross-sectional view of an essential part of an electric circuit resistance pattern formed by using the electric circuit resistance paste according to the present invention, and FIG. 2B is a slide on the electric circuit resistance pattern. It is a principal part general | schematic expanded sectional view which shows the state at the time of the child | child 50 sliding. 図3(a)は、フッ素樹脂粉末を混練してなる電気回路用抵抗ペーストを用いて形成した電気回路用抵抗パターンの要部概略拡大断面図、図2(b)はその電気回路用抵抗パターン上を摺動子50が摺動する際の状態を示す要部概略拡大断面図である。FIG. 3A is a schematic enlarged cross-sectional view of a main part of a resistance pattern for an electric circuit formed using a resistance paste for electric circuit formed by kneading fluororesin powder, and FIG. 2B is a resistance pattern for the electric circuit. It is a principal part general | schematic expanded sectional view which shows the state at the time of the slider 50 sliding on the top. 本発明にかかる電気回路用抵抗ペーストを用いて形成した電気回路用抵抗パターンにおける熱可塑性樹脂の含有率と比抵抗の関係を示す図である。It is a figure which shows the relationship between the content rate of the thermoplastic resin, and specific resistance in the resistance pattern for electrical circuits formed using the resistance paste for electrical circuits concerning this invention.

符号の説明Explanation of symbols

30 基板
40 電気回路用抵抗パターン
45 熱可塑性樹脂層
50 摺動子
51 摺動接点
a 圧接部分
100 ヒータ
110 試料
120 摺動子
121 摺動接点
30 Substrate 40 Resistance pattern 45 for electric circuit Thermoplastic resin layer 50 Slider 51 Sliding contact a Pressure contact portion 100 Heater 110 Sample 120 Slider 121 Sliding contact

Claims (1)

カーボン粉末と、有機バインダーと、溶剤とを混練してなる電気回路用抵抗ペーストを基板上に塗布したものを加熱・焼成することで形成されその上を金属製の摺動子が摺動する電気回路用抵抗パターンにおいて、
前記電気回路用抵抗ペーストにはさらに、前記電気回路用抵抗ペーストの焼成温度以下の温度で溶けるポリエチレン樹脂を、前記有機バインダーとポリエチレン樹脂全体に対して2重量%以下の混合割合で混合したことを特徴とする電気回路用抵抗パターン。
Electricity in which a metal slider slides on a substrate formed by heating and firing a resistor paste for an electric circuit formed by kneading carbon powder, an organic binder, and a solvent on a substrate. In the resistance pattern for circuits,
The electrical circuit resistor paste further includes a polyethylene resin that is melted at a temperature lower than the firing temperature of the electrical circuit resistor paste at a mixing ratio of 2% by weight or less with respect to the total of the organic binder and the polyethylene resin. A characteristic resistance pattern for an electric circuit.
JP2003366541A 2003-10-27 2003-10-27 Resistance pattern for electric circuit Expired - Fee Related JP4342270B2 (en)

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