JP4354472B2 - Electronic component module - Google Patents

Description

  The present invention relates to an electronic component module, and more particularly to an electronic component module in which a passive component is mounted on an IC-embedded substrate.

  In recent years, small electronic devices such as mobile phones are composed of various passive components including passive elements such as inductors and capacitors. There is no limit to the high integration of electronic devices such as mobile phones, and there is a demand for further reduction in height and density in mounting forms of passive elements on a substrate. For example, Patent Document 1 describes a technique in which a semiconductor chip and a thin film magnetic induction element are fixed by ultrasonic bonding via a stud bump.

Patent Document 2 discloses a chip converter-like microinductor and a semiconductor integrated circuit on which a control circuit or the like is formed. In a microconverter that converts and stabilizes a power supply voltage, a stud terminal is provided on a module substrate. A technology for reducing the size of electronic equipment such as a mobile phone by arranging and mounting the microinductor on the stud terminal in a mounted manner, and arranging the microinductor and the semiconductor integrated circuit one above the other. Is described.
JP 2005-93774 A Japanese Patent Laid-Open No. 2004-63676

  However, in the technique of Patent Document 1, since the semiconductor chip and the thin film magnetic induction element are fixed by ultrasonic bonding only through the stud bump without passing through the substrate, the sizes of the semiconductor chip and the thin film magnetic induction element are strictly matched. It is necessary, lacks versatility and expandability, and lacks design freedom.

  Further, in the technique of Patent Document 2, since a stud terminal is arranged on a module substrate and an inductor is mounted in a mounting form, a high degree of arrangement of the stud terminal is required, and the overall height of the module is reduced. I can't. On the other hand, if the terminal electrode on the side of the inductor is soldered directly on the module board without using the stud terminal, the solder spreads in a fillet shape around the inductor, which is larger than the area of the inductor itself. A mounting area is substantially required, and it cannot be mounted on the substrate at a high density.

  The present invention has been made in view of such circumstances, and an object thereof is to provide an electronic component module that satisfies both low profile and high density while ensuring versatility and expandability. is there.

The present invention includes a passive component having a passive element and a mounting surface on a substrate, having a recess in the mounting surface and including a terminal electrode in the recess, and an IC-embedded substrate in which an IC is embedded in the substrate. The passive component is mounted on the IC-embedded substrate, and the IC-embedded substrate is provided on the substrate surface at a position where the lead electrode to the IC substrate surface corresponds to the concave portion of the passive component, This is an electronic component module in which terminal electrodes of passive components are directly connected .

According to this configuration, since the mounting surface has a recess and the terminal electrode is included in the recess, even when there is a terminal protruding on the substrate, it can be mounted on the substrate surface at a low level. In addition, since the terminal electrode is included in the recess, it is possible to prevent the solder from spreading in a fillet shape around the passive component, and to reduce the mounting area of the passive component. Furthermore, since passive components are mounted on an IC-embedded substrate in which an IC is embedded in the substrate, the height can be reduced, and the degree of freedom for mounting passive components is increased, so that versatility and expandability can be improved. As a result, it is possible to satisfy both low profile and high density of the passive component while ensuring versatility and expandability. In addition, since the extraction electrode to the IC substrate surface is provided on the substrate surface at a position corresponding to the recess of the passive component, and the extraction electrode of the IC built-in substrate and the terminal electrode of the passive component are directly connected, the passive component And the IC-embedded substrate can be bonded more firmly, and the strength of the electronic component module can be improved. Further, since the wiring is shortened, noise can be reduced and power supply efficiency can be improved.

  In addition, it is preferable that a portion other than the concave portion on the mounting surface of the passive component is in contact with at least a part of the substrate surface of the IC-embedded substrate.

  According to this configuration, since the part other than the recess on the mounting surface of the passive component and the substrate surface of the IC built-in substrate are in contact with each other at least partially, the electronic component module can be further reduced in height. In addition, since heat generated in the IC of the IC-embedded substrate can be released to the passive component, heat dissipation is improved.

  In this case, it is preferable that the IC-embedded substrate includes a heat-dissipating resin layer on the outermost layer portion on the substrate surface.

  According to this configuration, since the heat-dissipating resin layer is provided on the outermost layer portion of the substrate surface, the heat dissipation is further improved. Further, since the resin layer comes into contact with the passive component, the stress is relaxed and the load on the electrode is reduced.

  According to the electronic component module of the present invention, both low profile and high density can be satisfied while ensuring versatility and expandability.

  Hereinafter, an electronic component module according to an embodiment of the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a longitudinal sectional view showing the electronic component module of the first embodiment. As shown in FIG. 1, an electronic component module 100a according to the present embodiment is configured by mounting a passive component 10a described later on an IC-embedded substrate 50. For example, the electronic component module 100a has a function such as a DC-DC converter in a power supply circuit of a mobile phone. Fulfill. In this case, one terminal electrode 18a of the passive component 10a functions as a SW terminal to which a switching voltage is applied, and the other terminal electrode 18a functions as a _Vout terminal that is an output terminal.

  In the IC-embedded substrate 50, an IC 53 that functions as a switching circuit or the like is embedded in a support substrate 52. A resin layer 54 and a resist 56 are sequentially stacked on the front and back surfaces of the support substrate 52. Further, on the surface of the IC-embedded substrate 50, Cu posts 58a protruding from the substrate surface are formed as lead electrodes of the IC 53 at positions corresponding to the recesses 16a of the passive component 10a. The IC 53 is located inside the pair of terminal electrodes 18a of the passive component 10a. It is preferable from the viewpoint of noise reduction that only one IC 53 is disposed inside the pair of terminal electrodes 18a of the passive component 10a. Note that the recess 16a of the passive component 10a and the Cu post 58a do not necessarily have to be provided so as to be closely fitted to each other, and by setting a predetermined play amount with each other, mounting becomes easy. The stress at the time of joining is relieved.

Vias 64 are formed in each part of the IC built-in substrate 50 including directly under the Cu post 58a so as to penetrate the front and back surfaces of the substrate, and the passive component 10a and the IC 53 are electrically connected via the IC bumps 62 of the IC 53. Connected. In this way, the IC 53 and the passive component 10a are directly connected from the lead electrode of the IC 53 without going through the inner region of the IC 53. The via 64 includes a V _in (voltage input terminal) bump 66, an EN (enable terminal) bump 68, an FB (voltage feedback terminal) bump 70, and a GND (ground terminal) on the back surface of the IC-embedded substrate 50. ) It is electrically connected to the bump 72.

  In addition, the heat-dissipating resin layer 60 (underfill) is formed on the outermost layer portion of the IC-embedded substrate 50, and the portion where the recess 16a is not formed in the center of the mounting surface 14 of the passive component 10a is the heat-dissipating resin layer. The IC built-in substrate 50 is in contact with the surface via 60.

  FIG. 2 is a perspective view showing the passive component according to the first embodiment from the plane side, and FIG. 3 is a perspective view showing the passive component according to the first embodiment from the bottom side. As shown in FIGS. 2 and 3, the passive component 10a as a whole is a flat element having a length of 1.5 to 3.5 mm, a width of 1.0 to 3.0 mm, and a height of 1.0 mm or less, and is a passive element. The mounting surface 14 to the inductor 12a and the IC built-in substrate 50 is provided. As the overall shape of the passive component 10a, a columnar shape, a polygonal columnar shape, or the like can be applied in addition to the flat plate shape, but the mounting surface is as much as possible from the viewpoint of reducing the height when mounting on the IC built-in substrate 50. It is preferable to reduce the height from 14. Concave portions 16a are respectively provided at two opposing sides in the mounting surface 14 having a rectangular shape, and terminal electrodes 18a are provided at the bottoms of the respective concave portions 16a. In addition, the recessed part 16a containing the terminal electrode 18a may each be provided in the corner | angular part which opposes in the mounting surface 14 which makes a rectangular shape, ie, a diagonal line.

  That is, as shown in FIGS. 2 and 3, the terminal electrode 18 a of the passive component 1 is inwardly at a dimension in at least two of the three axial dimensions of the inductor 12 a that are orthogonal to each other in the vertical, horizontal, and height directions. In order to ensure the maximum space for the inductor 12a, it is provided at the end of the inductor 12a.

  FIG. 4 is an exploded perspective view showing the internal structure of the passive component according to the first embodiment. As shown in FIG. 4, the passive component 10a before forming the recess 16a and the terminal electrode 18a includes an upper ferrite core 20, an upper winding 22, a printed circuit board 24, a lower winding 26, and a lower ferrite core 28 that are laminated. It is constituted by. The upper winding 22 and the lower winding 26 are respectively formed on the front and back surfaces of the printed circuit board 24 and are electrically connected with the printed circuit board 24 interposed therebetween. By sandwiching the upper winding 22, the printed circuit board 24, and the lower winding 26 between the upper ferrite core 20 and the lower ferrite core 28, a larger current can be flowed compared to the multilayer inductor, and the winding type The height can be reduced compared to the inductor.

  FIG. 5 is a longitudinal sectional view showing the passive component according to the first embodiment. As will be described later, since the terminal electrode 18a is actually mounted after the concave portion 16a is provided after the upper ferrite core 20 or the like is laminated, the mounting surface including the concave portion 16a of the passive component 1 as shown in FIG. Both the 14 side portion and the other portions are occupied by the upper winding 22 and the lower winding 26 of the inductor 12a, and the inductor 12a has a minimum dimension with respect to the capacitance. Be able to.

  In this embodiment, the ferrite core is used. However, the magnetic material is not particularly limited to the ferrite core, and various metal magnetic materials and oxide magnetic materials can be used. There is no particular problem with the printed board as long as it is an insulating material, and a wide variety of resin boards, insulating ceramic boards, and the like can be used.

  6 (a) to 6 (e) are diagrams showing a manufacturing process of a passive component. At the time of manufacturing the passive component 10a of the present embodiment, as shown in FIG. 6A, the upper ferrite core 20, the printed circuit board 24 on which the windings are formed on the front and back surfaces, and the lower ferrite core 28 are laminated. A plate-like body is formed.

  As shown in FIG. 6B, the dicing is not performed to the depth at which the plate-like bodies are completely separated from each other, but the half dicing is performed by the wide dicer H so as to reach the printed board 24. By this half dicing, a half dicing portion 30 is formed in the plate-like body, and a concave portion is formed in the passive element, thereby exposing the conductive metal inside.

  As shown in FIG. 6C, full dicing is performed on the half dicing section 30 to a depth at which the plate-like body is completely separated by the dicer F having a narrow width. By this full dicing, as shown in FIG. 6 (d), the plate-like body is separated into the sizes of the individual passive components, and the recesses 16a are formed.

  As shown in FIG. 6E, the passive component 10a can be manufactured by forming the terminal electrode 18a in the recess 16a. Note that the full dicing shown in FIG. 6C and the formation of the terminal electrode 18a shown in FIG.

  When the passive component 10a is mounted on the IC-embedded substrate 50, as shown in FIG. 7, the passive component 10a is placed on the surface of the IC-embedded substrate 50 provided with Cu posts 58a corresponding to the recesses 16a of the passive component 10a. Install. Next, each terminal electrode 18a and the Cu post 58a are welded with solder or the like. Finally, the space between the mounting surface 14 of the passive component 10a and the IC-embedded substrate 50 is filled with a heat radiating resin to form a heat radiating resin layer 60 as shown in FIG.

  According to the present embodiment, the mounting surface 14 has the recess 16a, and the recess 16a includes the terminal electrode 18a. Therefore, even when there is a terminal protruding on the IC-embedded substrate 50, the mounting surface 14 is mounted on the substrate surface low. be able to. Further, since the recess 16a includes the terminal electrode 18a, the solder can be prevented from spreading in a fillet shape around the inductor, and the mounting area of the passive component 10a can be reduced. Furthermore, since the passive component 10a is mounted on the IC-embedded substrate 50 in which the IC 53 is embedded in the substrate, the height can be reduced and the degree of freedom of mounting the passive component is increased, so that versatility and expandability can be improved. it can. As a result, it is possible to satisfy both low profile and high density of the passive component while ensuring versatility and expandability.

  That is, according to the present embodiment, the terminal electrode 18a of the passive component 1 enters the inside in the dimension in at least two axial directions out of the three axial dimensions of the inductor 12a perpendicular to each other in the vertical, horizontal, and height directions. In order to ensure the maximum space for the inductor 12a, it is provided at the end of the inductor 12a.

  Furthermore, according to the present embodiment, since the recesses 16a are provided in the shape of grooves on the two opposing sides of the mounting surface 14 having a rectangular shape, the manufacture as shown in FIGS. In the process, it is easy to form the recesses 16a of many passive components 10a by one dicing, and the production efficiency is improved.

  In addition, according to the present embodiment, the Cu post 58a that is an extraction electrode to the substrate surface of the IC 53 is provided to protrude from the surface of the IC-embedded substrate 50 at a position corresponding to the recess 16a of the passive component 10a. Since the post 58a and the terminal electrode 18a of the passive component 10a are directly connected, the passive component 10a and the IC-embedded substrate 50 can be bonded more firmly, and the strength of the electronic component module 100a can be improved. In addition, as described above, the Cu post and the terminal electrode of the passive component are electrically connected directly without any other passive component, and the lead electrode and the terminal electrode are electrically connected on the normal line of the substrate surface as shown in the figure. By connecting them electrically, the distance between wirings can be shortened, thereby reducing noise and improving power supply efficiency.

  Furthermore, according to the present embodiment, the portion other than the recess 16a on the mounting surface 14 of the passive component 10a and the substrate surface of the IC-embedded substrate 50 are at least partially in contact with each other. Since the height can be further increased and the heat generated in the IC 53 of the IC-embedded substrate 50 can be released to the passive component 10a, the heat dissipation is improved. More preferably, heat dissipation is further improved by contacting the entire surface of the mounting surface 14 other than the recess 16a.

  In particular, according to the present embodiment, since the heat-dissipating resin layer 60 is provided on the outermost layer portion of the substrate surface of the IC-embedded substrate 50, the heat dissipation is further improved. Further, since the heat-dissipating resin layer 60 comes into contact with the passive component 10a, the stress is relaxed, and the load on the terminal electrode 18a and the Cu post 58a is reduced.

  In addition, according to the present embodiment, since the terminal electrode 18a is provided at the end of the passive component 10a, crosstalk due to a magnetic field generated from the inductor 12a can be reduced. In particular, since only one IC 53 is disposed inside the pair of terminal electrodes 18a of the passive component 10a, and preferably disposed inside the pair of terminal electrodes 18a of the passive component 10a, noise is further reduced. Is done. Further, the IC 53 and the passive component 10a are directly connected from the extraction electrode of the IC 53 without passing through the inner region of the passive component 10a, thereby shortening the wiring and further reducing noise.

  FIG. 8 is a longitudinal sectional view showing the electronic component module of the second embodiment. In the electronic component module 100 b of this embodiment, the terminal electrode 18 a is joined to the via 64 of the IC built-in substrate 50 only by the solder 74. According to this embodiment, since it is not necessary to provide the Cu post 58a, the mounting becomes easier. On the other hand, the solder 74 stays in the recess 16a and is prevented from spreading in a fillet shape by the action of the resist 56. Therefore, mounting can be performed more easily while ensuring a low profile and a high density.

  As described above, the connection between the terminal electrode 18a and the lead electrode of the IC-embedded substrate 50 is not particularly limited, and can be adjusted as appropriate according to the groove size of 16a, and a method of connecting with solder via a post such as the Cu post 58a, And a method of connecting by ultrasonic welding through a post such as the Cu post 58a, a method of directly soldering using a solder ball or solder paste, and the like.

FIG. 9 is a longitudinal sectional view showing the electronic component module of the third embodiment. In the electronic component module 100c of this embodiment, in place of the _{V in} the bumps 66, EN bumps 68, FB bumps 70, GND bumps 72 provided on the rear surface of the IC-embedded substrate 50 in the second _{embodiment, V in} the plate 76 EN plate 78, FB plate 80, and GND plate 82 are attached. According to the present embodiment, the overall height of the electronic component module 100c can be further reduced by replacing the spherical bumps with a thin plate.

  FIG. 10 is a perspective view showing the passive component according to the fourth embodiment from the plane side, and FIG. 11 is a perspective view showing the passive component according to the fourth embodiment from the bottom side. As shown in FIGS. 10 and 11, in the passive component 10b of the present embodiment, the recess 16b including the terminal electrode 18b is cut into four opposing corners in the rectangular mounting surface 14, that is, diagonal lines. It is provided in a notch shape. When the passive component 10b is mounted on the IC-embedded substrate 50, as shown in FIG. 12, Cu surface is formed on the surface of the IC-embedded substrate 50 so as to correspond to the four recesses 16b in the mounting surface 14 of the passive component 10a. After providing the post 58b, each Cu post 58b and the terminal electrode 18b are joined. In the present embodiment, the concave portion 16b including the terminal electrode 18b is provided at the opposite corner of the mounting surface 14, and the Cu post 58b corresponding to the concave portion 16b is provided on the substrate surface of the IC-embedded substrate 50 for mounting. Strength and stability can be further improved. In addition, positioning during mounting is facilitated.

  FIG. 13 is a plan view showing the internal structure of the passive component according to the fifth embodiment. As shown in FIG. 13, the passive component 10e of the present embodiment includes a winding type inductor as the inductor 12b. In the present embodiment, the solenoid winding 32 is wound around a ferrite core whose longitudinal direction is parallel to the mounting surface 14. In the present embodiment, the characteristics as an inductor can be improved.

  FIG. 14 is a longitudinal sectional view showing a passive component according to the fifth embodiment. As shown in FIG. 14, both the portion on the mounting surface 14 side including the concave portion 16a of the passive component 10e and the other portion are occupied by the solenoid winding 32 of the inductor 12b. 12b can be set to the minimum dimension with respect to the capacity.

  FIG. 15 is a perspective view showing the internal structure of the passive component according to the sixth embodiment. As shown in FIG. 15, the passive component 10 f of this embodiment includes a capacitor 13 as a passive element, and a plurality of capacitor electrodes 36 are arranged in parallel in the capacitor 13. The capacitor electrodes 36 are arranged perpendicular to the mounting surface 14, and each capacitor electrode 36 can be electrically connected on the mounting surface 14 side, so that the connection is easy.

  FIG. 16 is a longitudinal sectional view showing a passive component according to the sixth embodiment. As shown in FIG. 16, since the capacitor electrode 36 has a shape corresponding to the concave portion 16a, any portion of the passive component 10f on the mounting surface 14 side including the concave portion 16a and the other portion of the capacitor 13 The capacitor 13 is occupied by the capacitor electrode 36, so that the capacitor 13 can be set to a minimum dimension with respect to the capacitance.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications can be made. For example, in the above embodiment, the description has focused on an example in which a passive component including an inductor as a passive element is mounted on an IC-embedded substrate. However, a passive component including a capacitor or a resistive element as a passive element is included in the scope of the present invention. The one mounted on the built-in board is also included.

It is a longitudinal cross-sectional view which shows the electronic component module of 1st Embodiment. It is a perspective view which shows the passive component which concerns on 1st Embodiment from the plane side. It is a perspective view which shows the passive component which concerns on 1st Embodiment from the bottom face side. It is a disassembled perspective view which shows the internal structure of the passive component which concerns on 1st Embodiment. It is a longitudinal cross-sectional view which shows the passive component which concerns on 1st Embodiment. (A)-(e) is a figure which shows the manufacturing process of a passive component. It is a figure which shows a mode that a passive component is mounted in an IC built-in board | substrate in 1st Embodiment. It is a longitudinal cross-sectional view which shows the electronic component module of 2nd Embodiment. It is a longitudinal cross-sectional view which shows the electronic component module of 3rd Embodiment. It is a perspective view which shows the passive component which concerns on 4th Embodiment from the plane side. It is a perspective view which shows the passive component which concerns on 4th Embodiment from the bottom face side. It is a figure which shows a mode that a passive component is mounted in an IC built-in board | substrate in 4th Embodiment. It is a top view which shows the internal structure of the passive component which concerns on 5th Embodiment. It is a longitudinal cross-sectional view which shows the passive component which concerns on 5th Embodiment. It is a see-through | perspective perspective view which shows the internal structure of the passive component which concerns on 6th Embodiment. It is a longitudinal cross-sectional view which shows the passive component which concerns on 6th Embodiment.

Explanation of symbols

10a, 10b, 10e, 10f ... passive components, 12a, 12b ... inductor, 13 ... capacitor, 14 ... mounting surface, 16a, 16b ... recess, 18a, 18b ... terminal electrode, 20 ... upper ferrite core, 22 ... upper winding , 24 ... Printed circuit board, 26 ... Lower winding, 28 ... Lower ferrite core, 30 ... Half dicing part, 32 ... Solenoid winding, 34 ... Ferrite core, 36 ... Capacitor electrode, 50 ... IC built-in board, 52 ... Support board , 53 ... IC, 54 ... resin layer, 56 ... resist, 58a, 58b ... Cu posts 60 ... radiator resin layer, 62 ... IC bumps, 64 ... via, 66 ... _{V in} bump, 68 ... EN bumps, 70 ... FB ... bumps 72 ... GND bumps 74 ... solder, 76 ... _{V in} plates, 78 ... EN plate, 80 ... FB plate, 82 ... GN Plate, 100a, 100b, 100c ... electronic component module.

Claims (3)

A passive component and a mounting surface on a substrate, having a recess in the mounting surface, and a passive component including a terminal electrode in the recess;
An IC-embedded substrate in which an IC is embedded in the substrate;
Consists of
Mounting the passive component on the IC-embedded substrate ;
The IC-embedded substrate is provided on the substrate surface at a position where an extraction electrode to the substrate surface of the IC corresponds to the recess of the passive component,
The electronic component module , wherein the lead electrode of the IC-embedded substrate and the terminal electrode of the passive component are directly connected . 2. The electronic component module according to claim 1 , wherein a portion of the passive component other than the concave portion on the mounting surface is in contact with at least a part of the substrate surface of the IC-embedded substrate. The electronic component module according to claim 2 , wherein the IC-embedded substrate includes a heat-dissipating resin layer on an outermost layer portion of the substrate surface.

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