JP4356828B2 - Polycarbonate resin material for semiconductor related parts transport case - Google Patents
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Description
本発明は、半導体関連部品搬送ケース用として用いられるポリカーボネート樹脂材料および導電性カーボンブラックを含有する導電性ポリカーボネート樹脂材料に関する。更に、詳しくは総発生ガス量が抑制されたポリカーボネート樹脂または導電性ポリカーボネート樹脂組成物からなることを特徴とする半導体関連部品搬送ケース用ポリカーボネート樹脂材料を提供するものである。
近年、コンピュータ等の電子機器の普及・発展には著しいものがある。コンピュータ等には半導体ウェハー・ディスクやハードディスク等の記憶ディスクの半導体関連部品が使用されている。コンピュータ等の組立てにおいてはこの半導体関連部品を組立てラインに供するためこれを運搬、移送する必要があり、従来ポリカーボネート樹脂、ポリプロピレン等の熱可塑性樹脂製の搬送ケースがこの目的のため用いられてきた。搬送ケースの形状としては、例えば特開平７−３００１３８号公報に示される様なディスク用パッケージが挙げられる。とりわけ、ポリカーボネート樹脂は透明性、耐衝撃性等に優れることから半導体関連部品搬送ケース用材料として注目されてきた。
ここで半導体関連部品とは、シリコンウェハー、ハードディスク、ディスク基板、ＩＣチップ、光磁気ディスク、ＬＣＤ用高機能基板ガラス、ＬＣＤカラーフィルター、ハードディスクの磁気抵抗ヘッド等のことをいう。
しかしながら、コンピュータの記憶容量を増大させるために半導体関連部品がより高度に集積化されるに伴い、上記の搬送用ケースに収納された半導体関連部品に性能上の不具合が発生する頻度が増加するという問題が生じた。具体的には、記憶ディスクに有機物が付着したり、ゴミや埃が付着することからくる記憶ディスクの動作不良等の不具合があげられる。
本発明者らは、上記の問題を解決するために鋭意研究した結果、半導体関連部品の搬送用ケース材料から発生する炭化水素等の微量ガスが半導体関連部品に作用し沈着することから上記の不具合を発生させること、ならびにこのガス量を特定の値以下に抑制することにより搬送用ケースに収納された半導体関連部品の不具合の発生を著しく低下させることを見出し、本発明を完成するに至った。
このような技術として、特開２０００−６８３６３には、密閉容器にポリカーボネート樹脂のペレットを置き、１５０℃で１時間加熱した場合の発生ガス量がトルエン重量換算して１．５ｐｐｍ以下の芳香族ポリカーボネートを原料とした容器を用いることによりシリコンウエハ等の汚染を少なくすることが出来る旨が開示されている。しかし、本発明者らは、ガス量の測定方法について検討を重ね、より簡便な方法により、半導体関連部品に作用し沈着するガス成分を適切に検出する方法を見出した。即ち、ポリカーボネート樹脂のペレットを不活性ガス気流中で８０℃の雰囲気中に３０分間おき、熱離脱した有機物を吸着剤に捕集して低沸点から高沸点の発生有機物ガスを測定する方が半導体関連部品の不具合の発生の程度をみるには相応しいことを見出した。この方法によりより高沸点のガス成分をより適切に検出することが出来るものと考えられる。このような条件で熱離脱するガス成分の少ないポリカーボネート樹脂は、半導体関連部品の搬送用ケース材料として用いられた場合に、そのケース内の半導体関連部品を汚染することが無いことが分った。
すなわち、本発明は、８０℃にて３０分放置した時に熱脱離する総発生ガス量が３６５０ｐｐｂ以下であることを特徴とする半導体関連部品搬送ケース用ポリカーボネート樹脂材料を提供するものである。
更に、本発明者らは、搬送ケースに納められた半導体関連部品へのゴミや埃等の付着を防止するために当該搬送ケースを構成するポリカーボネート樹脂材料に導電性を付与し、かつ総ガス発生量を特定の値以下に抑制することにより、半導体関連部品の不具合の発生を著しく低下させることができることをも見出した。かかる場合、本発明の別の態様は、総ガス発生量を特定の値以下にしたポリカーボネート樹脂に導電性カーボンブラックを２０重量％まで含有させた導電性ポリカーボネート樹脂組成物からなる半導体関連部品搬送ケース用導電性ポリカーボネート樹脂材料を提供するものである。
以下に、本発明の半導体関連部品搬送ケース用ポリカーボネート樹脂材料および導電性ポリカーボネート樹脂材料につき、詳細に説明する。
本発明にて使用されるポリカーボネート樹脂とは、種々のジヒドロキシジアリール化合物とホスゲンとを反応させるホスゲン法、またはジヒドロキシジアリール化合物とジフェニルカーボネートなどの炭酸エステルとを反応させるエステル交換法によって得られる重合体であり、代表的なものとしては、２，２−ビス（４−ヒドロキシフェニル）プロパン（ビスフェノールＡ）から製造されたポリカーボネート樹脂が挙げられる。
上記ジヒドロキシジアリール化合物としては、ビスフェノールＡの他に、ビス（４−ヒドロキシフェニル）メタン、１，１−ビス（４−ヒドロキシフェニル）エタン、２，２−ビス（４−ヒドロキシフェニル）ブタン、２，２−ビス（４−ヒドロキシフェニル）オクタン、ビス（４−ヒドロキシフェニル）フェニルメタン、２，２−ビス（４−ヒドロキシフェニル−３−メチルフェニル）プロパン、１，１−ビス（４−ヒドロキシ−３−第三ブチルフェニル）プロパン、２，２−ビス（４−ヒドロキシ−３−ブロモフェニル）プロパン、２，２−ビス（４−ヒドロキシ−３、５−ジブロモフェニル）プロパン、２，２−ビス（４−ヒドロキシ−３，５−ジクロロフェニル）プロパンのようなビス（ヒドロキシアリール）アルカン類、１，１−ビス（４−ヒドロキシフェニル）シクロペンタン、１，１−ビス（４−ヒドロキシフェニル）シクロヘキサンのようなビス（ヒドロキシアリール）シクロアルカン類、４，４′−ジヒドロキシジフェニルエーテル、４，４′−ジヒドロキシ−３，３′−ジメチルジフェニルエーテルのようなジヒドロキシジアリールエーテル類、４，４′−ジヒドロキシジフェニルスルフィドのようなジヒドロキシジアリールスルフィド類、４，４′−ジヒドロキシジフェニルスルホキシド、４，４′−ジヒドロキシ−３，３′−ジメチルジフェニルスルホキシドのようなジヒドロキシジアリールスルホキシド類、４，４′−ジヒドロキシジフェニルスルホン、４，４′−ジヒドロキシ−３，３′−ジメチルジフェニルスルホンのようなジヒドロキシジアリールスルホン類等が挙げられる。
これらは単独または２種類以上混合して使用されるが、これらの他に、ピペラジン、ジピペリジルハイドロキノン、レゾルシン、４，４′−ジヒドロキシジフェニル等を混合して使用してもよい。
さらに、上記のジヒドロキシアリール化合物と以下に示すような３価以上のフェノール化合物を混合使用してもよい。
３価以上のフェノールとしてはフロログルシン、４，６−ジメチル−２，４，６−トリ−（４−ヒドロキシフェニル）−ヘプテン、２，４，６−ジメチル−２，４，６−トリ−（４−ヒドロキシフェニル）−ヘプタン、１，３，５−トリ−（４−ヒドロキシフェニル）−ベンゾール、１，１，１−トリ−（４−ヒドロキシフェニル）−エタンおよび２，２−ビス−［４，４−（４，４′−ジヒドロキシジフェニル）−シクロヘキシル］−プロパンなどが挙げられる。
ポリカーボネート樹脂の粘度平均分子量は通常１００００〜１０００００、好ましくは１５０００〜３００００である。かかるポリカーボネート樹脂を製造するに際し、分子量調節剤、触媒等を必要に応じて使用することができる。
本発明の総発生ガス量の分析方法は、次のとおりである。ポリカーボネート樹脂のペレット１ｇを不活性ガス気流中で８０℃の雰囲気中に３０分間おき、熱脱離した有機物を、吸着剤を充填したカラムで一度捕集した後、捕集した有機物を、冷却トラップを備えた注入装置を用い吸着剤から再度、熱脱離と濃縮を行いＧＣ−ＭＳに注入する。熱脱離した種々の有機物はＧＣ−ＭＳにて分離・化学構造を解析し熱脱離有機物の定量を行った。そして熱脱離有機物の総和を総発生ガス量とした。これらの分析により熱脱離する有機物は脂肪族炭化水素類、フタル酸エステル類、リン酸エステル類、シロキサン化合物等が検出される。
上記の総発生ガス量が３６５０ｐｐｂ、好ましくは１０００ｐｐｂ以下、より好ましくは８００ｐｐｂを超えると半導体関連部品への炭化水素等の有機物の沈着が多くなり動作不良が発生するので好ましくない。
総発生ガス量の低減の方法については、特に制限はないが、ポリカーボネート樹脂を製造するにあたり有機不純物を含まない原料・副原料を選定、使用する事、又は製造ラインからの有機不純物の混入を防ぐ事を目的に樹脂製配管等の設備使用を避ける等の方法が挙げられる。
特に、ポリカーボネート樹脂の製造ロット毎に上記発生ガス量を調べて、上記規格を満たす製造ロットを選択して、本発明の半導体関連部品搬送ケースの成形に使用することが好ましい。
本発明にて使用される導電性カーボンの原料および製造方法については、特に制限はないが、そのＤＢＰ吸油量が１００ｍｌ／１００ｇ以上、好ましくは３００ｍｌ／１００ｇ以上で、かつその比表面積が５０ｍ２／ｇ以上、好ましくは５００ｍ２／ｇ以上であるカーボンブラックが好適に使用できる。ＤＢＰ吸油量とは、ジブチルフタレートアプソープトメーターにて測定された値であり、カーボンブラック１００ｇあたりに包含される油（ジブチルフタレート）のｍｌ数で、カーボンブラックのストラクチャーの程度を示す。また、比表面積は液体窒素吸着法に従って求めた値であり、カーボンブラック単位重量あたりの表面積を示す。
導電性カーボンブラックは、ポリカーボネート樹脂を基準にして２０重量％まで含有してもよい。導電性カーボンブラックの含有量が２０重量％を超えると衝撃強度および流動性が低下するので好ましくない。
導電性カーボンブラックの混合方法には、特に制限はなく、公知の混合機、例えばタンブラー、リボンブレンダー等による混合や押出機等による溶融混練が挙げられる。
また、本発明の効果を損なわない範囲で、ポリカーボネート樹脂に各種の添加剤、例えば、酸化防止剤、帯電防止剤、滑剤、光安定剤、紫外線吸収剤、染顔料、強化材等を必要に応じて配合しても良い。
以下に本発明を実施例により具体的に説明するが、本発明はそれら実施例に制限されるものではない。尚、「ｐｐｂ」、「部」、「％」は重量基準に基づく。
実施例１〜３および比較例１
表１に示す総発生ガス量の異なるポリカーボネート樹脂（ビスフェノールＡとホスゲンから合成された粘度平均分子量２００００のポリカーボネート樹脂）の各種ペレットをそれぞれ１２５℃で４時間乾燥した後に、射出成形機（東芝製ＩＳ５５０ＦＸ）を用いて設定樹脂温度３００℃、射出圧力１７００Ｋｇ／ｃｍ２にてハードディスク（ＩＣＭ製ＮＸ−３４０使用品）がそれぞれ接触することなく２５枚収納できる搬送用ケースを成形した。
総発生ガス量の分析方法は、以下のとおりである。
ポリカーボネート樹脂のペレット１ｇを、窒素ガス気流中で８０℃の雰囲気中に３０分間おき、熱脱離した有機物を吸着剤（シグマアルドリッチジャパン製Ｎ５０２０）を充填したカラムで一度捕集した後、捕集した有機物を、冷却トラップを備えた注入装置を用い吸着剤から再度、熱脱離と濃縮を行いＧＣ−ＭＳ（島津製作所製ＧＣＭＳ−ＱＰ１０００ＥＸ（カラム：島津製作所製ＤＢ−１，０．５３ｍｍ×３０ｍ、膜厚０．１μｍ））に注入する。熱脱離した種々の有機物はＧＣ−ＭＳにて分離・化学構造を解析し熱脱離有機物の定量を行った。ＧＣ−ＭＳにおいて、ＤＯＰが検出されるまで、即ちＤＯＰのリテンションタイムまで、測定を行う。検出される成分は脂肪族炭化水素類、芳香族炭化水素類、フタル酸エステル類である。ＤＯＰ及びＤＢＰ等のフタル酸エステル類はＤＢＰ重量換算し、その他の成分はトルエン重量換算して、熱脱離有機物の総和を総発生ガス量とした。
搬送用ケースを成形してから２４時間後に、該ケースにハードディスク（ＩＣＭ製ＮＸ−３４０使用品）を２５枚収納した。アルミ箔フィルム（厚み０．１ｍｍ）を用いて、アルミ箔側を内面にして、該ケースを包装し、窒素ガスを充填し、５０℃、９０％ＲＨの雰囲気下にて８時間、放置した。その後、収納したハードディスクをケースから取り出し、ハードディスクドライブ（ＩＣＭ製ＮＸ−３４０）に組み込み、これを日本電気（株）製９８ｎｏｔｅ ＳＸ／Ｅを用いて、ケース毎に２５枚のハードディスクの作動確認を行った。作動確認の結果、有機物の堆積が原因と考えられるヘッドが飛ぶ等のハードディスクドライブ作動が不良となったハードディスクの枚数をカウントし、２５枚中の不良率を求め、不良率が１０％以下のものを合格とした。結果を表１に示す。
総発生ガス量が２０２０ｐｐｂのポリカーボネート樹脂（ビスフェノールＡとホスゲンから合成された粘度平均分子量２００００のポリカーボネート樹脂）のペレットおよび導電性カーボンブラック（ケッチェンブラックインターナショナル株式会社製ケッチェンブラックＥＣ、ＤＢＰ吸油量３６０ｍｌ／１００ｇ、比表面積８００ｍ２／ｇ）を表２に示す配合比率に基づき二軸押出機（神戸製鋼所製ＫＴＸ−３７）を用いて、シリンダー温度２８０℃で溶融混練し、各種の導電性ポリカーボネート樹脂ペレットを得た。
得られたペレットを用いて、前述の実施例と同様の操作を行い、搬送用ケースを成形し、ハードディスクの作動確認を行った。結果を表２に示した。
一方、得られた導電性ポリカーボネート樹脂の導電性、流動性、衝撃強度を測定した。それぞれの試験方法は、以下のとおり。
導電性：
得られたペレットを用いて、それぞれ１２５℃で４時間乾燥した後に、射出成形機（日本製鋼所製Ｊ１００Ｅ−Ｃ５）を用いて設定樹脂温度３００℃、射出圧力１６００Ｋｇ／ｃｍ２にて平板（４０×６０×３ｍｍ）を作成した。成形してから２４時間後に、ＡＳＴＭ Ｄ−２５７に準拠して導電性を測定した。
流動性：
得られたペレットを用いて、それぞれ１２５℃で４時間乾燥した後に、ＡＳＴＭ Ｄ−１２３８に準拠して流動性を測定した。
衝撃強度：
得られたペレットを用いて、それぞれ１２５℃で４時間乾燥した後に、射出成形機（日本製鋼所製Ｊ１００Ｅ−Ｃ５）を用いて設定樹脂温度３００℃、射出圧力１６００Ｋｇ／ｃｍ２にて衝撃試験片（１２．７×６３×３．２ｍｍ）を作成した。成形してから２４時間後に、ＡＳＴＭ Ｄ−２５６に準拠して衝撃強度を測定した。
In recent years, there has been a remarkable spread and development of electronic devices such as computers. Computer-related components use semiconductor-related components such as semiconductor wafer disks and hard disks. In assembling a computer or the like, it is necessary to transport and transport the semiconductor-related parts for use in an assembly line. Conventionally, a transport case made of a thermoplastic resin such as polycarbonate resin or polypropylene has been used for this purpose. An example of the shape of the transport case is a disk package as disclosed in Japanese Patent Application Laid-Open No. 7-300318. In particular, polycarbonate resin has been attracting attention as a material for transport cases of semiconductor-related parts because of its excellent transparency and impact resistance.
Here, the semiconductor-related components refer to silicon wafers, hard disks, disk substrates, IC chips, magneto-optical disks, high-performance substrate glass for LCDs, LCD color filters, hard disk magnetoresistive heads, and the like.
However, as semiconductor related parts are more highly integrated in order to increase the storage capacity of the computer, the frequency of occurrence of malfunctions in the semiconductor related parts housed in the transport case increases. There was a problem. Specifically, there are problems such as malfunction of the storage disk caused by organic substances adhering to the storage disk or dust and dirt.
As a result of diligent research to solve the above problems, the present inventors have found that the above-mentioned problems occur because trace gases such as hydrocarbons generated from a case material for transporting semiconductor-related parts act on and deposit on semiconductor-related parts. It has been found that the occurrence of defects in the semiconductor-related components housed in the transfer case is significantly reduced by suppressing the amount of gas to a specific value or less, and the present invention has been completed.
As such a technique, Japanese Patent Application Laid-Open No. 2000-68363 discloses an aromatic polycarbonate in which the amount of gas generated when polycarbonate resin pellets are placed in a sealed container and heated at 150 ° C. for 1 hour is 1.5 ppm or less in terms of toluene weight. It has been disclosed that contamination of silicon wafers and the like can be reduced by using a container made from a raw material. However, the present inventors have repeatedly studied a method for measuring a gas amount, and have found a method for appropriately detecting a gas component that acts on and deposits on a semiconductor-related component by a simpler method. In other words, it is better to measure the generated organic gas from low to high boiling point by placing the polycarbonate resin pellets in an inert gas stream in an atmosphere of 80 ° C. for 30 minutes, collecting the heat-released organic substance in the adsorbent. We found that it was appropriate to see the degree of occurrence of defects in related parts. It is considered that a gas component having a higher boiling point can be detected more appropriately by this method. It has been found that the polycarbonate resin having a small gas component that is thermally desorbed under such conditions does not contaminate the semiconductor-related components in the case when used as a case material for transporting semiconductor-related components.
That is, the present invention provides a polycarbonate resin material for a semiconductor-related component carrying case, wherein the total amount of gas generated by thermal desorption when left at 80 ° C. for 30 minutes is 3650 ppb or less.
Furthermore, the present inventors give conductivity to the polycarbonate resin material constituting the transfer case and prevent generation of total gas in order to prevent adhesion of dust and dirt to the semiconductor-related components housed in the transfer case. It has also been found that the occurrence of defects in semiconductor-related parts can be significantly reduced by suppressing the amount below a specific value. In such a case, another aspect of the present invention provides a semiconductor-related component transport case made of a conductive polycarbonate resin composition containing up to 20% by weight of conductive carbon black in a polycarbonate resin having a total gas generation amount of a specific value or less. An electrically conductive polycarbonate resin material is provided.
Below, it demonstrates in detail about the polycarbonate resin material and conductive polycarbonate resin material for semiconductor related component conveyance cases of this invention.
The polycarbonate resin used in the present invention is a polymer obtained by a phosgene method in which various dihydroxydiaryl compounds and phosgene are reacted, or a transesterification method in which a dihydroxydiaryl compound and a carbonate such as diphenyl carbonate are reacted. A typical example is a polycarbonate resin produced from 2,2-bis (4-hydroxyphenyl) propane (bisphenol A).
Examples of the dihydroxydiaryl compound include bisphenol 4-, bis (4-hydroxyphenyl) methane, 1,1-bis (4-hydroxyphenyl) ethane, 2,2-bis (4-hydroxyphenyl) butane, 2, 2-bis (4-hydroxyphenyl) octane, bis (4-hydroxyphenyl) phenylmethane, 2,2-bis (4-hydroxyphenyl-3-methylphenyl) propane, 1,1-bis (4-hydroxy-3) -Tert-butylphenyl) propane, 2,2-bis (4-hydroxy-3-bromophenyl) propane, 2,2-bis (4-hydroxy-3,5-dibromophenyl) propane, 2,2-bis ( Bis (hydroxyaryl) alkanes such as 4-hydroxy-3,5-dichlorophenyl) propane, 1,1- (4-hydroxyphenyl) cyclopentane, bis (hydroxyaryl) cycloalkanes such as 1,1-bis (4-hydroxyphenyl) cyclohexane, 4,4'-dihydroxydiphenyl ether, 4,4'-dihydroxy-3 Dihydroxy diaryl ethers such as 3,3'-dimethyldiphenyl ether, dihydroxy diaryl sulfides such as 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl sulfoxide, 4,4'-dihydroxy-3,3 ' Dihydroxy diaryl sulfoxides such as dimethyldiphenyl sulfoxide, dihydroxy diary such as 4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydroxy-3,3'-dimethyldiphenyl sulfone Sulfone, and the like.
These may be used alone or in combination of two or more. In addition to these, piperazine, dipiperidyl hydroquinone, resorcin, 4,4′-dihydroxydiphenyl, and the like may be used in combination.
Furthermore, the above dihydroxyaryl compound and a trivalent or higher phenol compound as shown below may be used in combination.
Trihydric or higher phenols include phloroglucin, 4,6-dimethyl-2,4,6-tri- (4-hydroxyphenyl) -heptene, 2,4,6-dimethyl-2,4,6-tri- (4 -Hydroxyphenyl) -heptane, 1,3,5-tri- (4-hydroxyphenyl) -benzol, 1,1,1-tri- (4-hydroxyphenyl) -ethane and 2,2-bis- [4 4- (4,4'-dihydroxydiphenyl) -cyclohexyl] -propane and the like.
The viscosity average molecular weight of the polycarbonate resin is usually 10,000 to 100,000, preferably 15,000 to 30,000. In producing such a polycarbonate resin, a molecular weight regulator, a catalyst and the like can be used as necessary.
The method for analyzing the total amount of gas generated according to the present invention is as follows. 1 g of polycarbonate resin pellets is placed in an inert gas stream at 80 ° C. for 30 minutes, and the thermally desorbed organic matter is collected once in a column filled with an adsorbent, and then the collected organic matter is cooled in a trap. The adsorbent is used to perform thermal desorption and concentration again from the adsorbent and inject into the GC-MS. Various organic substances thermally desorbed were separated and analyzed by GC-MS, and the thermally desorbed organic substances were quantified. The total amount of thermally desorbed organic substances was taken as the total amount of gas generated. As a result of these analyses, aliphatic hydrocarbons, phthalates, phosphates, siloxane compounds, and the like are detected as organic substances that are thermally desorbed.
If the total amount of gas generated is 3650 ppb, preferably 1000 ppb or less, more preferably more than 800 ppb, the deposition of organic substances such as hydrocarbons on semiconductor-related parts increases, which is not preferable.
There are no particular restrictions on the method for reducing the total amount of gas generated. However, when manufacturing polycarbonate resin, select and use raw materials and auxiliary materials that do not contain organic impurities, or prevent organic impurities from entering the production line. For this purpose, there is a method such as avoiding the use of equipment such as resin piping.
In particular, it is preferable to check the amount of generated gas for each production lot of polycarbonate resin, select a production lot that satisfies the above-mentioned standard, and use it for molding a semiconductor-related component carrying case of the present invention.
The raw material and production method of the conductive carbon used in the present invention are not particularly limited, but its DBP oil absorption is 100 ml / 100 g or more, preferably 300 ml / 100 g or more, and its specific surface area is 50 m 2 / Carbon black having g or more, preferably 500 m 2 / g or more can be suitably used. The DBP oil absorption is a value measured with a dibutyl phthalate apoptometer, and indicates the degree of carbon black structure in terms of ml of oil (dibutyl phthalate) included per 100 g of carbon black. The specific surface area is a value determined according to the liquid nitrogen adsorption method, and indicates the surface area per unit weight of carbon black.
The conductive carbon black may be contained up to 20% by weight based on the polycarbonate resin. When the content of the conductive carbon black exceeds 20% by weight, the impact strength and fluidity are lowered, which is not preferable.
The method for mixing the conductive carbon black is not particularly limited, and examples thereof include mixing with a known mixer such as a tumbler or ribbon blender or melt kneading with an extruder.
In addition, various additives such as an antioxidant, an antistatic agent, a lubricant, a light stabilizer, an ultraviolet absorber, a dye, a reinforcing material and the like are added to the polycarbonate resin within a range not impairing the effects of the present invention. May be added.
EXAMPLES The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. Note that “ppb”, “part”, and “%” are based on weight.
Examples 1 to 3 and Comparative Example 1
After drying various pellets of polycarbonate resin (polycarbonate resin having a viscosity average molecular weight of 20000 synthesized from bisphenol A and phosgene) shown in Table 1 for 4 hours at 125 ° C., an injection molding machine (Toshiba IS550FX). ) Was used to form a transport case that could accommodate 25 hard disks (ICM NX-340 products) without contacting each other at a set resin temperature of 300 ° C. and an injection pressure of 1700 kg / cm 2 .
The analysis method of the total generated gas amount is as follows.
1 g of polycarbonate resin pellets was placed in an atmosphere of nitrogen gas at 80 ° C. for 30 minutes, and the thermally desorbed organic matter was collected once with a column packed with an adsorbent (Sigma 50) manufactured by Sigma-Aldrich Japan. The organic material thus obtained was again thermally desorbed and concentrated from the adsorbent using an injection device equipped with a cooling trap, and GC-MS (GCMS-QP1000EX manufactured by Shimadzu Corporation (column: DB-1, manufactured by Shimadzu Corporation, 0.53 mm × 30 m) And a film thickness of 0.1 μm). Various organic substances thermally desorbed were separated and analyzed by GC-MS, and the thermally desorbed organic substances were quantified. In the GC-MS, measurement is performed until DOP is detected, that is, until the DOP retention time. Components detected are aliphatic hydrocarbons, aromatic hydrocarbons, and phthalates. Phthalate esters such as DOP and DBP were converted to DBP weight, and other components were converted to toluene weight, and the total amount of thermally desorbed organic substances was defined as the total amount of gas generated.
Twenty-four hours after forming the transfer case, 25 hard disks (product using ICM NX-340) were stored in the case. The case was packaged using an aluminum foil film (thickness 0.1 mm) with the aluminum foil side as the inner surface, filled with nitrogen gas, and allowed to stand in an atmosphere of 50 ° C. and 90% RH for 8 hours. After that, the stored hard disk is taken out from the case, incorporated into a hard disk drive (ICM NX-340), and this is used to check the operation of 25 hard disks for each case using 98note SX / E manufactured by NEC Corporation. It was. As a result of the operation check, the number of hard disk drives that have failed in the hard disk drive operation, such as a head flying due to the accumulation of organic matter, is counted, the defect rate in 25 is determined, and the defect rate is 10% or less Was passed. The results are shown in Table 1.
Pellets of polycarbonate resin (polycarbonate resin having a viscosity average molecular weight of 20000 synthesized from bisphenol A and phosgene) with a total gas generation amount of 2020 ppb and conductive carbon black (Ketjen Black EC, Ketjen Black International Co., Ltd., DBP oil absorption 360 ml / 100 g, specific surface area 800 m 2 / g) based on the blending ratio shown in Table 2, using a twin screw extruder (KTX-37 manufactured by Kobe Steel), melt kneading at a cylinder temperature of 280 ° C., and various conductive polycarbonates Resin pellets were obtained.
Using the obtained pellets, the same operation as in the previous example was performed to form a transport case, and the operation of the hard disk was confirmed. The results are shown in Table 2.
On the other hand, the conductivity, fluidity, and impact strength of the obtained conductive polycarbonate resin were measured. Each test method is as follows.
Conductivity:
The pellets obtained were each dried at 125 ° C. for 4 hours and then flattened at a set resin temperature of 300 ° C. and an injection pressure of 1600 kg / cm 2 using an injection molding machine (J100E-C5 manufactured by Nippon Steel). × 60 × 3 mm). 24 hours after molding, the conductivity was measured according to ASTM D-257.
Liquidity:
The obtained pellets were each dried at 125 ° C. for 4 hours, and then the fluidity was measured according to ASTM D-1238.
Impact strength:
Each of the obtained pellets was dried at 125 ° C. for 4 hours, and then subjected to an impact test piece using an injection molding machine (Japan Steel Works J100E-C5) at a set resin temperature of 300 ° C. and an injection pressure of 1600 Kg / cm 2 . (12.7 × 63 × 3.2 mm) was created. 24 hours after molding, the impact strength was measured according to ASTM D-256.
Claims (6)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20370999 | 1999-07-16 | ||
| JP11-203709 | 1999-07-16 | ||
| PCT/JP2000/004633 WO2001005868A1 (en) | 1999-07-16 | 2000-07-11 | Polycarbonate resin material for case for carrying parts associated with semiconductor |
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| JPWO2001005868A1 JPWO2001005868A1 (en) | 2003-02-12 |
| JP4356828B2 true JP4356828B2 (en) | 2009-11-04 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10066055B2 (en) | 2013-10-01 | 2018-09-04 | Lotte Advanced Materials Co., Ltd. | Container for precision member and method for preparing the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2003040997A (en) * | 2001-07-26 | 2003-02-13 | Mitsubishi Engineering Plastics Corp | Polycarbonate resin for manufacturing parts for transporting electrical and electronic parts and parts for transporting electrical and electronic parts |
| JP4889460B2 (en) * | 2006-12-05 | 2012-03-07 | 信越ポリマー株式会社 | Conductive resin composition for semiconductor transport container parts, semiconductor transport container parts using the same, and semiconductor transport container |
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| JP2574076B2 (en) * | 1991-05-21 | 1997-01-22 | 帝人化成株式会社 | Conductive thermoplastic resin composition |
| AU750817B2 (en) * | 1997-04-11 | 2002-07-25 | General Electric Company | Reducing ionic impurities content in aromatic polycarbonate resins |
| JPH11163115A (en) * | 1997-11-28 | 1999-06-18 | Shin Etsu Polymer Co Ltd | Wafer-retaining member and wafer housing container incorporated in the same |
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| US10066055B2 (en) | 2013-10-01 | 2018-09-04 | Lotte Advanced Materials Co., Ltd. | Container for precision member and method for preparing the same |
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