JP4359370B2 - Polishing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a polishing method , and in particular, a polishing object held on a carrier by revolving and rotating the carrier between both surface plates while supplying a slurry-like abrasive between the upper surface plate and the lower surface plate. The present invention relates to a polishing method in a polishing apparatus for polishing a surface.
[0002]
[Prior art and its problems]
This type of polishing apparatus comprises a lower surface plate that is rotatably provided, an upper surface plate that is rotatably and vertically movable above the lower surface plate, a sun gear that is rotatably provided at the center of the lower surface plate, An internal gear rotatably provided on the outer peripheral portion of the lower surface plate and a carrier capable of holding a disc-shaped workpiece while being meshed between the sun gear and the internal gear.
[0003]
Then, the object to be polished is held on the carrier, the upper surface plate is lowered, the lower surface side of the upper surface plate is brought into contact with the object to be polished, and the object to be polished is pressed between the upper surface plate and the lower surface plate, While supplying slurry-like abrasive between the upper and lower surface plates, the upper surface plate, the lower surface plate, the sun gear, and the internal gear are rotated to rotate the carrier between the upper surface plate and the lower surface plate. By rotating, the surface of the object to be polished can be polished to a predetermined surface roughness.
[0004]
In this case, the polishing process for polishing the surface of the object to be polished to a predetermined surface roughness consists of a plurality of processing steps with different set rotational speeds. Starting from 0, after confirming that there is no trouble such as breakage in the object to be polished, it is increased to the set rotational speed (see FIG. 4).
[0005]
However, since the maximum speed of the speed adjustment volume is 100%, the resolution is very small in the initial machining step where the set speed is very low, and the usable range of the speed adjustment volume is very small. The rotation speed fluctuates during the process of increasing the rotation speed, and a sudden load is applied to the object to be polished, causing problems such as damage or damage to the object to be polished, resulting in a decrease in yield. Resulting in. Also, in the machining steps after the initial machining step, it is necessary to manually operate the speed adjustment volume to adjust the rotation speed to the set rotation speed, which requires time and effort and lowers work efficiency. There was also.
[0006]
The present invention solves the problems of the prior art as described above, and the resolution of the speed adjustment volume is large. When the rotational speed is increased to the set rotational speed in the initial machining step, the rotational speed is made smooth. As a result, there is no problem that the object to be polished is damaged or broken during the process of increasing the rotation speed, and the yield can be greatly increased and the initial An object of the present invention is to provide a polishing method that does not require manual operation of the speed adjustment volume in the processing steps after the processing step, and that can greatly increase the work efficiency.
[0007]
[Means for solving problems]
In order to solve the above-mentioned problems, the present invention is capable of rotating on a lower surface plate that can be rotated, an upper surface plate that can be rotated and moved up and down above the lower surface plate, and can be rotated at the center of the lower surface plate. The lower surface plate includes: a sun gear provided; an internal gear rotatably provided on an outer peripheral portion of the lower surface plate; and a carrier meshed between the sun gear and the internal gear and capable of holding an object to be polished. And a polishing method in a polishing apparatus for rotating the upper surface plate, the sun gear, and the internal gear to revolve and rotate the carrier between the lower surface plate and the upper surface plate, thereby polishing the surface of the object to be polished. manual Te, polishing step, the lower surface plate, the upper platen, the sun gear, and a plurality of processing steps performed by changing the rotational speed of the internal gear, the initial processing steps, a speed adjustment volume Operate by increasing the rotation of the driving source to the set rotational speed from 0, subsequent processing steps it is automatically executed by each rotational speed that is pre-programmed, and, machining said speed adjustment volume of the initial A means for setting the set rotational speed used in the step to 100% is used.
[0008]
[Action]
By adopting the above-mentioned means, the present invention sets the rotational speed by manually operating the speed adjustment volume with the set rotational speed as 100% in the initial machining step among the plurality of machining steps. The rotation speed can be set. Therefore, the rotation speed can be set to the set rotation speed using the entire range of the speed adjustment volume.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention shown in the drawings will be described.
In FIG. 1, the invention is shown form of to use the polishing apparatus, the polishing apparatus includes a lower surface plate 1, which is rotatable, a driver 3 which is provided rotatably in the center of the lower surface plate 1 An upper surface plate 11 that is rotatable and vertically movable above the lower surface plate 1, a polishing pad 15 that is adhered to the lower surface side of the upper surface plate 11, and a rotation surface that is provided on the outer peripheral side of the driver 3. A sun gear 6, an internal gear 7 that is rotatably provided on the outer peripheral side of the lower surface plate 1, and a carrier 8 that is meshed between the sun gear 6 and the internal gear 7 and that can hold the workpiece 10. It has.
[0010]
The lower surface plate 1 is formed in a disk shape, and a hole 2 penetrating in the vertical direction is provided at the center, and a driver 3 is inserted through the hole 2. The lower surface plate 1 is connected to a drive source (not shown) located below the lower surface plate 1, and is rotated in the horizontal direction when the drive source is operated.
[0011]
The driver 3 is formed in a columnar shape, and is connected to a drive source (not shown) located below the lower surface plate 1 via the shaft 5 so as to rotate in the horizontal direction when the drive source is operated. It has become. The driver 3 is inserted through the hole 2 at the center of the lower surface plate 1 and has an upper end protruding upward from the lower surface plate 1, and the protruding portion is free to enter a hole 12 at the center of the upper surface plate 11 described later. It comes to fit. An engagement groove 4 extending in the vertical direction is provided on the outer peripheral surface of the driver 3, and an engagement piece 14 provided at a peripheral edge portion of a hole 12 of the upper surface plate 11 described later is engaged in the engagement groove 4. It has become.
[0012]
The sun gear 6 has an annular shape provided between the hole 2 of the lower surface plate 1 and the shaft 5 of the driver 3, and a predetermined gear is provided on the outer peripheral surface. The sun gear 6 is connected to a drive source (not shown) located below the lower surface plate 1 and rotates in the horizontal direction when the drive source is operated.
[0013]
The internal gear 7 has an annular shape provided on the outer peripheral side of the lower surface plate 1, and a predetermined gear is provided on the inner peripheral surface. The internal gear 7 is connected to a drive source (not shown) and rotates in the horizontal direction when the drive source is activated.
[0014]
The carrier 8 is formed in a disk shape, and is provided with holes 9 penetrating in a vertical direction at a plurality of locations, and a disk-shaped object 10 such as a silicon wafer is loaded in each hole 9. It has become so. A predetermined gear is provided on the outer peripheral surface of the carrier 8, and the gear 8 and the gear of the sun gear 6 and the gear of the internal gear 7 are engaged with each other, whereby the carrier 8 is rotated when the sun gear 6 and the internal gear 7 are rotated. Can revolve and rotate. Note that at least one carrier 8 may be provided between the sun gear 6 and the internal gear 7.
[0015]
Above the driver 3, a vertical movement cylinder (not shown) is provided with the axes aligned, and a suspension shaft 17 is connected to the rod (not shown) of the vertical movement cylinder with the axes aligned. In addition, a disk-shaped suspension plate 18 is horizontally connected to the suspension shaft 17, and the upper surface plate 11 is connected to the suspension plate 18 via a plurality of support shafts 19.
[0016]
The upper surface plate 11 is formed in a disk shape, and a hole 12 penetrating in the vertical direction is provided at the center, and the driver 3 is loosely fitted in the hole 12. An engagement piece 14 that protrudes inward in the radial direction is attached to the peripheral portion of the hole 12 of the upper surface plate 11, and the engagement piece 14 is engaged in the engagement groove 4 of the driver 3, thereby The relative displacement in the rotation direction between the board 11 and the driver 3 is eliminated, and the upper surface plate 11 rotates integrally with the driver 3 when the driver 3 rotates. Supply holes 13 penetrating between the upper and lower surfaces are provided at a plurality of locations on the upper surface plate 11.
[0017]
A polishing pad 15 is attached to the lower surface side of the upper surface plate 11, and a through hole 16 that penetrates the polishing pad 15 in the vertical direction is provided in a portion corresponding to each supply hole 13 of the upper surface plate 11 of the polishing pad 15. Are provided so that the slurry-like abrasive is supplied between the upper surface plate 11 and the lower surface plate 1 from a slurry supply source (not shown) through the through holes 16 and the supply holes 13. It has become.
[0018]
Then, the drive source of the lower surface plate 1, the driver 3 (upper surface plate 11), the sun gear 6 and the internal gear 7 is operated to revolve and rotate the carrier 8 between the lower surface plate 1 and the upper surface plate 11. Thus, the surface of the workpiece 10 held on the carrier 8 can be polished to a predetermined surface roughness.
[0019]
In this case, the polishing process for polishing the surface of the object to be polished 10 includes a plurality of processing steps having different set rotational speeds, and the surface of the object to be polished 10 is polished to a predetermined surface roughness by executing the plurality of processing steps. (See FIG. 2).
[0020]
The drive sources of the lower surface plate 1, the driver 3 (upper surface plate 11), the sun gear 6 and the internal gear 7 are controlled to rotate by a control circuit. The control circuit includes an automatic operation circuit and a manual operation circuit. The automatic operation circuit automatically controls the rotation of each drive source in all of the plurality of machining steps, and specifies one of the plurality of machining steps. And a semi-automatic circuit for automatically controlling the rotation of each drive source in the other machining steps, and by operating an operation switch, A semi-automatic circuit can be selected. When the semi-automatic circuit is selected, the rotation of each drive source can be manually controlled by operating the speed adjustment volume in a specific processing step (see FIG. 3). In the case of a manual operation circuit, the rotation of each drive source can be controlled by manually operating the speed adjustment volume in all machining steps.
[0021]
The speed volume is set so that the set rotation speed of a specific machining step among a plurality of machining steps is 100%, the resolution is large, and the speed is set when the rotation speed is set to the set rotation speed in the specific machining step. The entire usable range of the volume can be used.
[0022]
Next, the operation of the above will be described.
First, an object to be polished 10 is loaded into the hole 9 of the carrier 8, the vertical movement cylinder is operated to lower the upper surface plate 11, and the polishing pad 15 is brought into contact with the upper surface side of the object 10 to be fixed. The workpiece 10 is pressed between the board 11 and the lower surface plate 1.
[0023]
Next, a slurry supply source (not shown) is actuated so that the abrasive is passed between the upper surface plate 11 and the lower surface plate 1 through the supply holes 13 of the upper surface plate 11 and the through holes 16 of the polishing pad 15. To supply.
[0024]
Then, the control circuit (operation circuit) is turned on, the automatic circuit is selected, and the program No. No. of the machining step that uses the speed volume is selected. Is specified and program machining operation is started.
[0025]
For example, the processing step No. that uses the speed adjustment volume. Is set as the initial machining step, the speed adjustment volume is manually operated at the start of the polishing process to increase the rotation of each drive source from 0 and increase it to the set rotation speed of the initial machining step. In this case, since the speed adjustment volume has a set rotation speed of 100% in the initial machining step, the resolution is large and the rotation speed is smoothly increased to the set rotation speed using the entire usable range of the speed adjustment volume. Will be able to.
[0026]
When the rotational speed reaches the set rotational speed in the initial processing step, the set time timer is turned on, the set rotational speed is maintained for a predetermined time, and the surface of the workpiece 10 is polished. Then, when the set time timer is turned off after a predetermined time has elapsed, the control circuit receives the signal and the subsequent processing steps are executed at the respective set rotation speeds. Then, the surface of the object to be polished 10 is polished to a predetermined surface roughness by performing up to the final processing step in this way.
[0027]
On the other hand, the automatic circuit is selected and the program No. If you choose not to use the speed adjustment volume after selecting, the rotation speed of each drive source is raised from 0 using the automatic slope time in the initial machining step and increases to the set speed, and the set time The set rotational speed is maintained for a predetermined time by turning on the timer, the surface of the object to be polished 10 is polished, and after the predetermined time has elapsed, the set time timer is turned off, and the control circuit receives the signal thereafter. The processing steps are executed at the respective set rotational speeds, and the surface of the workpiece 10 is polished to a predetermined surface roughness by executing the processing steps up to the final processing step in this way.
[0028]
In addition, when a manual operation circuit is selected, in all machining steps, the speed adjustment volume is manually operated to set the rotation speed of each drive source to the set rotation speed and execute each machining step. The surface of the workpiece 10 can be polished to a predetermined surface roughness.
[0029]
In the polishing method according to this embodiment configured as described above, the speed adjustment volume is manually operated in the initial processing step to increase the rotational speed of each drive source from 0 to increase it to the set rotational speed. In this case, since the rotation speed is increased by using the speed adjustment volume whose setting rotation speed is 100%, the resolution is large, and the entire usable range of the speed adjustment volume is used for each drive source. The rotational speed can be increased to the set rotational speed.
[0030]
Therefore, since the rotational speed can be increased smoothly, the rotational speed does not fluctuate in the course of increasing the rotational speed, and a sudden load is not applied to the workpiece 10. The workpiece 10 is not damaged or damaged by the fluctuation of the rotation speed, and the yield can be greatly improved.
[0031]
In addition, after the initial machining step is completed, the subsequent machining steps are set and executed at respective set rotation speeds by an automatic circuit, so the speed adjustment volume is set in the machining steps after the initial machining step. An operation that is manually operated to match the set rotational speed is not required, and the work efficiency can be greatly increased.
[0033]
【The invention's effect】
Since the present invention is configured as in claim 1, the initial machining step of the plurality of machining steps is performed by manually operating a speed adjustment volume whose setting rotation speed is 100%. Will be set to. Therefore, since the resolution can be increased, the entire range of the speed adjustment volume can be used to set the set rotation speed, the rotation speed can be smoothly increased to the set rotation speed, and the rotation speed can be increased. During this process, the number of rotations does not fluctuate and the surface of the object to be polished is damaged or the object to be polished is not damaged, and the yield can be greatly increased. In addition, since machining steps other than the initial machining step are automatically set to the set rotation speed and executed, the speed adjustment volume is manually operated in the machining step other than the initial machining step to set the rotation speed. The setting work is not necessary, and the working efficiency can be greatly increased.
[Brief description of the drawings]
FIG. 1 is a schematic cross-sectional view showing an embodiment of a polishing apparatus according to the present invention.
2 is an explanatory diagram showing the relationship between the number of rotations of a drive source and time in the polishing process of the polishing apparatus shown in FIG. 1; FIG.
FIG. 3 is a flowchart of a control circuit of the polishing apparatus shown in FIG.
FIG. 4 is an explanatory diagram showing the relationship between the rotational speed of a driving source and time in a polishing process of a conventional polishing apparatus.
[Explanation of symbols]
1 ... Lower surface plate 2, 9, 12 ... Hole 3 ... Driver 4 ... Engagement groove 5 ... Shaft 6 ... Sun gear 7 ... Internal gear 8 ... Carrier 10 ... Object to be polished 11 ... Upper plate 13 ... Supply hole 14 ... Engagement piece 15 ... Polishing pad 16 ... Through hole 17 ... Suspension shaft 18 ... Suspension plate 19 ... Support shaft

Claims (1)

A lower surface plate provided rotatably, an upper surface plate provided so as to be rotatable and vertically movable above the lower surface plate, a sun gear provided rotatably at the center of the lower surface plate, and rotated on the outer peripheral portion of the lower surface plate The lower surface plate, the upper surface plate, the sun gear, and the internal gear are provided with an internal gear that can be provided and a carrier that is meshed between the sun gear and the internal gear and that can hold an object to be polished. A polishing method in a polishing apparatus for polishing the surface of the object to be polished by revolving and rotating between the lower surface plate and the upper surface plate,
The polishing process comprises a plurality of processing steps performed by changing the rotational speeds of the lower surface plate, the upper surface plate, the sun gear, and the internal gear, and the initial processing step is performed by manually operating the speed adjustment volume for each drive source. And the subsequent machining step is automatically executed at each pre-programmed rotation speed, and the speed adjustment volume is used in the initial machining step. A polishing method characterized in that the set rotational speed is 100% .

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