JP4360111B2 - Surface conductive composite plastic sheet and electronic component transport container - Google Patents
Surface conductive composite plastic sheet and electronic component transport container Download PDFInfo
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- JP4360111B2 JP4360111B2 JP2003090082A JP2003090082A JP4360111B2 JP 4360111 B2 JP4360111 B2 JP 4360111B2 JP 2003090082 A JP2003090082 A JP 2003090082A JP 2003090082 A JP2003090082 A JP 2003090082A JP 4360111 B2 JP4360111 B2 JP 4360111B2
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- 239000002131 composite material Substances 0.000 title claims description 12
- 239000002985 plastic film Substances 0.000 title claims description 12
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 29
- 239000011342 resin composition Substances 0.000 claims description 25
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 claims description 10
- 229920007962 Styrene Methyl Methacrylate Polymers 0.000 claims description 6
- ADFPJHOAARPYLP-UHFFFAOYSA-N methyl 2-methylprop-2-enoate;styrene Chemical compound COC(=O)C(C)=C.C=CC1=CC=CC=C1 ADFPJHOAARPYLP-UHFFFAOYSA-N 0.000 claims description 6
- 229920005990 polystyrene resin Polymers 0.000 claims description 4
- 229920001400 block copolymer Polymers 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 229920003244 diene elastomer Polymers 0.000 claims description 3
- 229920005672 polyolefin resin Polymers 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 17
- 239000002344 surface layer Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 9
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- 229920006026 co-polymeric resin Polymers 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 229920005669 high impact polystyrene Polymers 0.000 description 2
- 239000004797 high-impact polystyrene Substances 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 239000006230 acetylene black Substances 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 239000003273 ketjen black Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Packages (AREA)
- Packaging Frangible Articles (AREA)
- Laminated Bodies (AREA)
Description
【０００１】
【発明の属する技術分野】
本発明は、表面導電性複合プラスチックシートに関するものである。
【０００２】
【従来の技術】
表面導電性複合プラスチックシートの製造法としては、代表的なものでフィードブロック共押出法がある。しかしながら、この押出方法を用いてＡＢＳ系樹脂組成物層(基材層)と、スチレン系樹脂をベースとする導電性樹脂組成物層(表面層)を隣り合う層よりなる積層シートを作製する場合、スチレン系樹脂をベースとする導電性樹脂組成物の配合によっては、表面層が幅方向に均一に広がらないといった問題が起こっている。また、幅方向に表面層が均一に広がらないことにより層比率のバラツキが大きくなり安定した物性を有するシートが得られない問題も起こっている。従来は特許文献１に示されているようにこれらの問題の対処法として、シーティング設備を改良する方法が取られて来たが、設備改良には多大な費用が必要であった。
【０００３】
【特許文献１】
特開平07-178787号公報
【０００４】
【発明が解決しようとする課題】
本発明は、かかる問題を解決したものであり、スチレン−メチルメタクリレート共重合体をスチレン系樹脂をベースとする導電性樹脂組成物（表面層）又はＡＢＳ系樹脂組成物（基材層）に少量添加することにより、表面層であるスチレン系樹脂をベースとする導電性樹脂組成物の広がりが良くなり、層比率が幅方向に均一な表面導電性複合プラスチックシートを提供するものである。
【０００５】
【課題を解決するための手段】
本発明は、
（１） スチレン系樹脂をベースとする導電性樹脂組成物（Ａ）がポリスチレン系樹脂（ａ）５０〜９４．５ｗｔ％、スチレンとジエン系エラストマーのブロック共重合体樹脂（ｂ）０．５〜１０ｗｔ％、カーボンブラック（ｃ）５〜３０ｗｔ％及びオレフィン系樹脂（ｄ）０〜１０ｗｔ％からなる樹脂組成物であり、その樹脂組成物層と、アクリロニトリル−ブタジエン−スチレン三元共重合体をベースとするＡＢＳ系樹脂組成物（Ｂ）からなる樹脂組成物層とが隣り合って構成される積層シートにおいて、（Ａ）又は（Ｂ）に、スチレン−メチルメタクリレート共重合体（Ｃ）を添加した表面導電性複合プラスチックシート、
（２） 積層シートのうち表面抵抗値が１×１０3Ω／□以上、１×１０10Ω／□未満である（１）記載の表面導電性複合プラスチックシート、
（３）（１）又は（２）記載の表面導電性複合プラスチックシートよりなる電子部品搬送用器、
である。
【０００６】
【発明の実施の形態】
以下、本発明を更に詳細に説明する。本発明において用いられるスチレン系樹脂をベースとする導電性樹脂組成物（Ａ）に使用されるポリスチレン系樹脂（ａ）は、一般ポリスチレン（ＧＰＰＳ）や耐衝撃性ポリスチレン（ＨＩＰＳ）等であり、その添加量は５０〜９４．５ｗｔ％である。下限値未満では十分な機械的強度が得られず、上限値を超えると他の樹脂の混練量が少なくなり十分な特性が得られない。スチレンとジエン系エラストマーのブロック共重合体樹脂（ｂ）は、例えば、スチレンとブタジエンの共重合体又はスチレンとイソプレンの共重合体等であり、その添加量は０．５〜１０ｗｔ％である。下限値未満では、十分な耐衝撃強度が得られないためシートにした場合割れやすくなる。また、上限値を超えると機械的強度の低下を引き起こす。導電性カーボンブラック（ｃ）は、比表面積が大きく、樹脂への少量の添加で高度の導電性が得られるものであり、アセチレンブラック、ファーネブラック、ケッチェンブラック等が好ましく用いられる。また、添加量は５〜３０ｗｔ％、好ましくは８〜２５ｗｔ％である。下限値未満では十分な導電効果が得られず表面抵抗値が上昇してしまい、また、上限値を超えると樹脂との均一性、成形性、流動性、機械的強度等が著しく低下するため好ましくない。オレフィン系樹脂（ｄ）は、例えば、エチレン及びプロピレンのホモポリマー、エチレン又はプロピレンを主成分とする共重合体、これらのブレンド物等であり、その添加量は０〜１０ｗｔ％である。オレフィン系樹脂（ｄ）は、樹脂の混練性向上、カーボンブラックの脱落防止、キャリアテープの蓋材であるカバーテープとのシール性の向上等の効果があるため、添加したほうが好ましい。上限値を超えると、樹脂中に均一に分散させることが困難になり、また、機械的強度の低下を引き起こす。
【０００７】
また、ＡＢＳ系樹脂組成物（Ｂ）とは、アクリルロトリル-ブタジエン-スチレンの三成分を主体とした共重合体を主成分とするものである。
【０００８】
スチレン−メチルメタクリレート共重合体（Ｃ）の添加量は、（Ａ）又は（Ｂ）１０重量部に対し（Ｃ）１重量部以上が好ましいが、入れすぎると物性等のバランスが崩れる恐れがあるため目的に応じて量を調整する必要がある。
【０００９】
ＩＣやＩＣを用いた電子部品の包装材として上述の表面導電性複合プラスチックシートを使用する場合、その表面抵抗値は１×１０3Ω／□以上、１×１０10Ω／□未満であることが望ましい。表面抵抗値が１×１０10Ω／□を超えると十分な帯電防止効果が得られず、１×１０3Ω／□未満では導電性が良すぎて外部で発生した静電気に対して通電してしまい内容物であるＩＣ等を破壊する恐れがあるため好ましくない。
【００１０】
【実施例】
以下実施例により、本発明を説明するが、これは単なる例示であり、本発明はこれにより限定されるものではない。
＜実施例１＞
スチレン系樹脂をベースとする導電性樹脂組成物（Ａ）としては、耐衝撃性ポリスチレン樹脂（Ａ＆Ｍスチレン(株)製、ＨＴ５１６）９０ｗｔ％、スチレンとブタジエンの共重合体樹脂（旭化成工業(株)製、タフプレン１２５）８ｗｔ％、エチレンと酢酸ビニルの共重合体樹脂（三井デュポン(株)製、エバフレックスＶ４０６）２ｗｔ％の合計１００重量部に対して導電性カーボンブラック（電気化学工業(株)製、デンカブラック(粒状)）２２重量部をバンバリーにて混練し、押出機にてストランドカットでペレット化したものを使用した。導電性樹脂組成物（Ａ）を表面層として、ＡＢＳ系樹脂組成物（Ｂ）（日本エイアンドエル(株)製、サンタックＧＴ−１０）を基材層として使用した。スチレン−メチルメタクリレート共重合体樹脂（Ｃ）（日本エイアンドエル(株)製、アトレーテＭＭ−２０）を基材層である（Ｂ）に重量比で（Ｂ）：（Ｃ）＝２：１で添加した。（Ａ）又は（Ｂ）と（Ｃ）の混合樹脂の積層は、２０ｍｍφの押出機２台を用いた２種３層のフィードブロック方式のシーティング設備にて共押出にて行い、幅１２０ｍｍ、厚み０．３ｍｍのシートを得た。
＜実施例２＞
重量比で（Ｂ）：（Ｃ）＝１０：１に混合した以外、実施例１と同様にシートを得た。
＜実施例３＞
重量比で（Ａ）：（Ｃ）＝２：１に混合した樹脂を表面層として、ＡＢＳ系樹脂組成物（Ｂ）（日本エイアンドエル(株)製、サンタックＧＴ−１０）のみをを基材層として用いた以外、実施例１と同様にシートを得た。
＜比較例１＞
（Ｃ）を使用しなかった以外、実施例１と同様にシートを得た。
＜比較例２＞
重量比で（Ｂ）：（Ｃ）＝２０：１に混合した以外、実施例１と同様にシートを得た。
【００１１】
表面層幅とは、実施例及び比較例で得られた複合プラスチックシートの表面層の幅方向の広がりを測定したものであり、９０〜１２０の範囲のものが良好なシートである。層比率（基材層／表面層）とは、実施例及び比較例で得られた複合プラスチックシートの断面をカットしそれを顕微鏡で観察することにより測定した、基材層の厚みを表面層の厚みで割った値であり、３〜５の範囲のものが良好なシートである。表面層厚み比率（中央/端）とは、シート中央部の表面層の厚みをシート端部の表面層の厚みで割ったものであり、その範囲が０．８〜１．２のものが良好なシートである。
【００１２】
【表１】
【発明の効果】
本発明により、表面層であるスチレン系樹脂をベースとする導電性樹脂組成物又は基材層であるＡＢＳ系樹脂組成物に、スチレン−メチルメタクリレート共重合体を少量添加することにより、スチレン系樹脂をベースとする導電性樹脂組成物の表面層の幅方向の広がりが良好で、厚み方向の層比率が均一である表面導電性複合プラスチックシートを提供できるようになった。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a surface conductive composite plastic sheet.
[0002]
[Prior art]
A typical method for producing a surface conductive composite plastic sheet is a feed block coextrusion method. However, when this extrusion method is used to produce a laminated sheet comprising an ABS resin composition layer (base material layer) and a conductive resin composition layer (surface layer) based on a styrene resin adjacent to each other. Depending on the composition of the conductive resin composition based on styrene resin, there is a problem that the surface layer does not spread uniformly in the width direction. Further, since the surface layer does not spread uniformly in the width direction, there is a problem that the variation in the layer ratio becomes large and a sheet having stable physical properties cannot be obtained. Conventionally, as shown in Patent Document 1, a method for improving the sheeting equipment has been taken as a countermeasure for these problems. However, the equipment improvement requires a large amount of cost.
[0003]
[Patent Document 1]
JP 07-178787 A [0004]
[Problems to be solved by the invention]
The present invention solves such a problem, and a small amount of a styrene-methyl methacrylate copolymer is added to a conductive resin composition (surface layer) or ABS resin composition (base material layer) based on a styrene resin. By adding, the spread of the conductive resin composition based on the styrene resin as the surface layer is improved, and a surface conductive composite plastic sheet having a uniform layer ratio in the width direction is provided.
[0005]
[Means for Solving the Problems]
The present invention
(1) Conductive resin composition (A) based on styrene resin is polystyrene resin (a) 50-94.5 wt%, block copolymer resin of styrene and diene elastomer (b) 0.5- 10 wt%, carbon black (c) 5 to 30 wt% and olefin resin (d) 0 to 10 wt% resin composition, based on the resin composition layer and acrylonitrile-butadiene-styrene terpolymer In the laminated sheet constituted by adjoining the resin composition layer made of the ABS resin composition (B), the styrene-methyl methacrylate copolymer (C) was added to (A) or (B). Surface conductive composite plastic sheet,
(2) The surface conductive composite plastic sheet according to (1) having a surface resistance value of 1 × 10 3 Ω / □ or more and less than 1 × 10 10 Ω / □ among the laminated sheets,
(3) An electronic component transport device comprising the surface conductive composite plastic sheet according to (1) or (2),
It is.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in more detail. The polystyrene resin (a) used in the conductive resin composition (A) based on the styrene resin used in the present invention is general polystyrene (GPPS), high impact polystyrene (HIPS), and the like. The addition amount is 50 to 94.5 wt%. If it is less than the lower limit, sufficient mechanical strength cannot be obtained, and if it exceeds the upper limit, the amount of kneading of other resins is reduced and sufficient characteristics cannot be obtained. The block copolymer resin (b) of styrene and diene elastomer is, for example, a copolymer of styrene and butadiene or a copolymer of styrene and isoprene, and the addition amount thereof is 0.5 to 10 wt%. If it is less than the lower limit, sufficient impact resistance strength cannot be obtained, and therefore, when it is made into a sheet, it is easily broken. Moreover, when the upper limit is exceeded, the mechanical strength is reduced. The conductive carbon black (c) has a large specific surface area, and can obtain a high degree of conductivity when added in a small amount to the resin. Acetylene black, furnace black, ketjen black and the like are preferably used. Moreover, the addition amount is 5 to 30 wt%, preferably 8 to 25 wt%. If it is less than the lower limit value, a sufficient conductive effect cannot be obtained and the surface resistance value is increased, and if it exceeds the upper limit value, uniformity with the resin, moldability, fluidity, mechanical strength, etc. are remarkably reduced. Absent. The olefin resin (d) is, for example, a homopolymer of ethylene and propylene, a copolymer containing ethylene or propylene as a main component, a blend thereof or the like, and the addition amount thereof is 0 to 10 wt%. The olefin-based resin (d) is preferably added because it has effects such as improvement of resin kneading properties, prevention of carbon black falling off, and improvement of sealing properties with a cover tape that is a cover material for a carrier tape. When the upper limit is exceeded, it becomes difficult to uniformly disperse in the resin, and the mechanical strength is lowered.
[0007]
The ABS resin composition (B) is mainly composed of a copolymer mainly composed of three components of acrylotolyl-butadiene-styrene.
[0008]
The addition amount of the styrene-methyl methacrylate copolymer (C) is preferably 1 part by weight or more with respect to 10 parts by weight of (A) or (B), but if it is added too much, the balance of physical properties and the like may be lost. Therefore, it is necessary to adjust the amount according to the purpose.
[0009]
When using the above-mentioned surface conductive composite plastic sheet as a packaging material for ICs and electronic parts using ICs, the surface resistance value should be 1 × 10 3 Ω / □ or more and less than 1 × 10 10 Ω / □ Is desirable. If the surface resistance exceeds 1 × 10 10 Ω / □, sufficient antistatic effect cannot be obtained. If the surface resistance is less than 1 × 10 3 Ω / □, the electrical conductivity is too good and the external static electricity is energized. This is not preferable because there is a risk of damaging the IC or the like as the contents.
[0010]
【Example】
EXAMPLES The present invention will be described below with reference to examples, but this is merely an example, and the present invention is not limited thereby.
<Example 1>
As the conductive resin composition (A) based on styrene resin, impact-resistant polystyrene resin (manufactured by A & M Styrene Co., Ltd., HT516) 90 wt%, copolymer resin of styrene and butadiene (Asahi Chemical Industry Co., Ltd.) Manufactured by Tefprene 125) 8wt%, ethylene and vinyl acetate copolymer resin (Mitsui DuPont Co., Ltd., Evaflex V406) 2wt% total 100 parts by weight of conductive carbon black (Electrochemical Co., Ltd.) Manufactured, Denka Black (granular) 22 parts by weight was kneaded in a banbury and pelletized by strand cutting with an extruder. The conductive resin composition (A) was used as the surface layer, and the ABS resin composition (B) (Nihon A & L Co., Ltd., Santac GT-10) was used as the base material layer. Styrene-methyl methacrylate copolymer resin (C) (manufactured by Nippon A & L Co., Ltd., Atrete MM-20) was added to base material layer (B) at a weight ratio of (B) :( C) = 2: 1. did. Lamination of the mixed resin (A) or (B) and (C) is performed by coextrusion using a two-type three-layer feed block type sheeting equipment using two 20 mmφ extruders, and has a width of 120 mm and a thickness of A 0.3 mm sheet was obtained.
<Example 2>
A sheet was obtained in the same manner as in Example 1 except that (B) :( C) was mixed at a weight ratio of 10: 1.
<Example 3>
Using a resin mixed in a weight ratio of (A) :( C) = 2: 1 as a surface layer, only the ABS resin composition (B) (Santac GT-10, manufactured by Nippon A & L Co., Ltd.) is used as a base material layer. A sheet was obtained in the same manner as in Example 1 except that the above was used.
<Comparative Example 1>
A sheet was obtained in the same manner as in Example 1 except that (C) was not used.
<Comparative example 2>
A sheet was obtained in the same manner as in Example 1 except that the weight ratio was (B) :( C) = 20: 1.
[0011]
The surface layer width is obtained by measuring the spread in the width direction of the surface layer of the composite plastic sheet obtained in Examples and Comparative Examples, and a sheet in the range of 90 to 120 is a good sheet. The layer ratio (base material layer / surface layer) is the thickness of the base material layer measured by cutting the cross section of the composite plastic sheet obtained in Examples and Comparative Examples and observing it with a microscope. It is the value divided by the thickness, and those in the range of 3-5 are good sheets. The surface layer thickness ratio (center / edge) is the thickness of the surface layer at the center of the sheet divided by the thickness of the surface layer at the edge of the sheet, and the range is 0.8 to 1.2. It is a sheet.
[0012]
[Table 1]
【The invention's effect】
According to the present invention, a small amount of a styrene-methyl methacrylate copolymer is added to a conductive resin composition based on a styrene resin that is a surface layer or an ABS resin composition that is a base material layer. It is now possible to provide a surface conductive composite plastic sheet in which the surface layer of the conductive resin composition based on the surface layer has a good spread in the width direction and the layer ratio in the thickness direction is uniform.
Claims (1)
スチレンとジエン系エラストマーとのブロック共重合体樹脂（ｂ）０．５〜１０ｗｔ％、
カーボンブラック（ｃ）５〜３０ｗｔ％、
およびオレフィン系樹脂（ｄ）０〜１０ｗｔ％とからなる導電性樹脂組成物（Ａ）からなる樹脂組成物層と、
アクリロニトリル−ブタジエン−スチレン三元共重合体をベースとするＡＢＳ系樹脂組成物（Ｂ）からなる樹脂組成物層とが隣り合って構成される積層シートにおいて、
前記樹脂組成物（Ａ）又は（Ｂ）１００重量部に対して、スチレン−メチルメタクリレート共重合体（Ｃ）１０〜５０重量部を添加した表面導電性複合プラスチックシート。Polystyrene resin (a) 50-94.5 wt%,
Block copolymer resin (b) of styrene and diene elastomer (b) 0.5 to 10 wt%,
Carbon black (c) 5-30 wt%,
And a resin composition layer comprising a conductive resin composition (A) composed of 0 to 10 wt% of an olefin resin (d),
In a laminated sheet constituted by adjoining a resin composition layer composed of an ABS resin composition (B) based on an acrylonitrile-butadiene-styrene terpolymer,
A surface conductive composite plastic sheet obtained by adding 10 to 50 parts by weight of a styrene-methyl methacrylate copolymer (C) to 100 parts by weight of the resin composition (A) or (B).
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| Application Number | Priority Date | Filing Date | Title |
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| JP2003090082A JP4360111B2 (en) | 2003-03-28 | 2003-03-28 | Surface conductive composite plastic sheet and electronic component transport container |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2003090082A JP4360111B2 (en) | 2003-03-28 | 2003-03-28 | Surface conductive composite plastic sheet and electronic component transport container |
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| JP2004291557A JP2004291557A (en) | 2004-10-21 |
| JP4360111B2 true JP4360111B2 (en) | 2009-11-11 |
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| JP2003090082A Expired - Fee Related JP4360111B2 (en) | 2003-03-28 | 2003-03-28 | Surface conductive composite plastic sheet and electronic component transport container |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2006030871A1 (en) * | 2004-09-16 | 2006-03-23 | Denki Kagaku Kogyo Kabushiki Kaisha | Composite sheet |
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| JP2004291557A (en) | 2004-10-21 |
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