JP4361652B2 - Liquid crystalline polyester resin for extrusion molding with excellent heat resistance, extrusion molding material and extrusion molding - Google Patents
Liquid crystalline polyester resin for extrusion molding with excellent heat resistance, extrusion molding material and extrusion molding Download PDFInfo
- Publication number
- JP4361652B2 JP4361652B2 JP31975699A JP31975699A JP4361652B2 JP 4361652 B2 JP4361652 B2 JP 4361652B2 JP 31975699 A JP31975699 A JP 31975699A JP 31975699 A JP31975699 A JP 31975699A JP 4361652 B2 JP4361652 B2 JP 4361652B2
- Authority
- JP
- Japan
- Prior art keywords
- formula
- structural unit
- unit represented
- extrusion molding
- viscosity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyesters Or Polycarbonates (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、耐熱性が高く優れた押出し成形性を有する、押出し成形用液晶性ポリエステル樹脂を押出し成形した押出し成形物に関する。
【0002】
【従来の技術】
液晶性ポリエステル樹脂(以下単に液晶ポリマーと呼ぶことがある)は耐熱性が優れ、溶融時の流動性が優れるなどの特徴から精密成形可能な射出成形材料として電子材料分野を中心に幅広く使われるようになっている。一口に液晶ポリマーと言ってもその耐熱性の程度から一般にI型、II型、III型に分類されており(たとえば“成形設計のための液晶ポリマー”シグマ出版(1995))、この中でI型と呼ばれるものは特定の全芳香族成分からなり、熱変形温度が250℃以上と液晶ポリマーの中でもとりわけ耐熱性が高い材料である。
液晶ポリマーの持つ優れた耐熱性に加えて優れたガスバリヤー性、低誘電性、耐薬品性などの特徴を生かしてフィルム、容器などの押出し成形分野への検討も精力的に行われている。
しかしながら、一般に液晶ポリマーは溶融時の粘度が低く、異方性が大きいなどの理由で、押出し成形分野には不向きな材料と言われている。
そのため材料面から種々の検討が加えられている。たとえば、特開平2−3430号公報には繰り返し単位として、(1)オキシ安息香酸、(2)2,6−ナフトエ酸からなる芳香族ポリマーのフィルム化が開示されている。また、特開平5−186614号公報には上記オキシ安息香酸、2,6−ナフトエ酸に加えてエチレングリコール等の成分を加えた半芳香族系のフィルム化が開示されている。また押出し成形性向上の目的で他の樹脂との複合化も検討されている。たとえば、特開昭61−78862号公報には液晶ポリマーとポリエチレンテレフタレートからなる組成物、特開昭63−270760号公報には液晶ポリエステルと芳香族ポリカーボネートからなる組成物のフィルム化が開示されている。しかしながら、これらはいずれも、液晶ポリマーがII型やIII型であって、耐熱性が低いものであったり、加工性を上げるためにI型液晶ポリマーを含む液晶ポリマーに他の耐熱性の低い材料を複合化したものであって、液晶ポリマー本来の持つ十分な耐熱性が得られていないのが実状である。
【0003】
【発明が解決しようとする課題】
本発明の目的は、高い耐熱性と、適度な流動性、加工性を有し、外観の優れた押出し成形品を与える押出し成形用液晶性ポリエステル樹脂を押出し成形した押出し成形物を提供することである。
【0004】
【課題を解決するための手段】
本発明者らは、耐熱性の観点から液晶性ポリエステル樹脂のみからなる樹脂を用いてのフィルム化、ブロー化の検討を行った結果、ポリマー物性、溶融流動性が一定の条件を満たすことによりI型ポリマーと同程度の耐熱性を示す液晶性ポリエステル樹脂においても実質上単独で良好な押出し成形が可能なことを見出し、本発明に至った。
すなわち、本発明によれば、ハンダ耐熱温度が250℃以上であり、
以下の式(1)〜(4)で示される構成単位のうちの2種以上を含み、これら組み合わせの 構成単位の合計が全体の97mol%以上であり、
流動開始温度下での剪断速度1000sec -1 における溶融粘度(粘度1b)と、それより20℃高い温度の同剪断速度下で測定した溶融粘度(粘度2b)との比率((粘度2b)/(粘度1b))が0.10〜0.70であり、固有粘度[η]は、5.5以上である液晶性ポリエステル樹脂を押出し成形して得られたことを特徴とする押出し成形物が提供される。
【化2】
【0005】
【発明の実施の形態】
以下本発明について詳細に説明する。
本発明に用いる押出し成形用液晶性ポリエステル樹脂(以下、「本発明の樹脂」と言うことがある)は、その耐熱性の点でハンダ耐熱温度が250℃以上であって、特定の溶融流動性を示す押出し成形用の樹脂である。
ここでハンダ耐熱温度とは、厚みが1.2mmのJIS1(1/2)号ダンベルを成形したものを試験片とし、該試験片を錫60%、鉛40%からなる240℃のハンダ浴に浸漬し、同温度に60秒間保持した後取出し、外観を観察する。その後、該ハンダ浴を10℃ずつ昇温させては同様の実験を行い、同試験片が発泡または変形しない最高温度を言う。ハンダ耐熱温度が250℃未満の場合、ハンダリフロー炉での使用などに制限が多く加わり、本発明の目的の主眼とするところから外れる。
上記特定の溶融流動性は、流動開始温度下での剪断速度1000sec -1 における溶融粘度(粘度1b)と、それより20℃高い温度の同剪断速度下で測定した溶融粘度(粘度2b)との比率((粘度2b)/(粘度1b))が0.10〜0.70、好ましくは0.10〜0.70、特に好ましくは0.12〜0.50である溶融流動性である。
ここで、本発明における流動開始温度とは、異方性溶融相を形成し始める温度であって、4℃/minの昇温速度で加熱された樹脂を荷重100Kgf/cm2のもとで、内径1mm、長さ10mmのノズルから押出したときに、溶融粘度が48000ポイズを示す温度を言う。
溶融粘度比が上記範囲外である場合、押出し成形加工が困難であったり、得られる成形物の異方性が強く、実用に耐えない恐れがある。
【0006】
本発明の樹脂は、流動開始温度より30℃高い温度で測定したときの溶融張力が10g以上であることが好ましい。
ここで溶融張力とは、樹脂の流動開始温度より30℃高い温度に設定された長さ8.0mm×2.1mmφのダイス中で樹脂を溶融させ、ピストン速度2mm/minでこれを押出し、テンションプーリーを通した後引き取りローラーでモノフィラメント状に引き取り、引き取り速度を上げていったときに糸が破断する時のテンションプーリーにかかる力を表したものである。溶融張力が10g未満の場合、押出し成形による成膜時の伸びが不十分となり、特にフィルム成形、ブロー成形行う場合の加工が困難となる恐れがあるので好ましくない。また、該溶融張力は、加工性の観点から40g以下とするのが好ましい。
【0007】
本発明の樹脂は、芳香族ヒドロキシカルボン酸単位、芳香族ジカルボン酸単位、芳香族ジヒドロキシ単位の2種以上の組み合わせを含むことが好ましい。
芳香族ヒドロキシカルボン酸単位としては、下記構造等が例示できる。
【0008】
【化3】
【0009】
芳香族ジヒドロキシ単位としては、下記構造等が例示できる。
【0010】
【化4】
【0011】
芳香族ジカルボン酸単位としては、下記構造等が例示できる。
【0012】
【化5】
【0013】
上記各構成単位の組み合わせとその組成比は随意であるが、本発明の目的とする高い耐熱性と、適度な流動性を有するために、下記式(1)〜(4)で示される構成単位のうちの2種以上を含み、これら組み合わせの構成単位の合計が全体の97mol%以上である液晶性ポリエステル樹脂とする。
【0014】
【化6】
【0015】
本発明の樹脂として更に好ましくは、下記(a)〜(c)の全ての条件を満たす、特定の構成単位を特定条件において有する液晶性ポリエステル樹脂が挙げられる。なお、条件中の式(1)〜(4)は、上記式(1)〜(4)で示される構成単位である。
(a):式(1)で表される構成単位の割合が全体の40〜70mol%であること、
(b):式(2)で表される構成単位及び式(3)で表される構成単位の合計の割合が全体の15〜30molであり、かつ式(2)で表される構成単位の割合が、式(2)で表される構成単位及び式(3)で表される構成単位の合計に対して0〜95mol%であり、かつ式(2)で表される構成単位のうちの80〜100mol%が主鎖結合位置がパラ位である構成単位であること、
(c):式(4)で表される構成単位の割合が、式(2)で表される構成単位及び式(3)で表される構成単位の合計の割合と実質的に同量であり、かつ式(4)で表される構成単位のうちの50mol%以上が主鎖結合位置がパラ位である構成単位であること。
【0016】
本発明の樹脂の固有粘度[η]は、5.5以上である。[η]が5.5未満の場合、上述の溶融粘度特性、溶融張力を得ることが困難となる。
【0017】
本発明の樹脂を製造する方法は特に制限はなく、公知の方法を用いることができる。たとえば、上記芳香族ヒドロキシカルボン酸単位、芳香族ジカルボン酸単位、芳香族ジヒドロキシ単位を有するモノマー化合物の2種以上の組み合わせからなる混合物を重合槽中で重縮合反応させる方法等により得られる。芳香族ヒドロキシカルボン酸単位を有するモノマー化合物としては、ヒドロキシ安息香酸、p−アセトキシ安息香酸等が挙げられ、芳香族ジカルボン酸単位を有するモノマー化合物としては、テレフタル酸、イソフタル酸等が挙げられ、芳香族ジヒドロキシ単位を有するモノマー化合物としては、4,4'−ジヒドロキシジフェニル、4,4'−ジアセトキシジフェニル、ハイドロキノン、レゾルシン等が挙げられる。これら化合物の仕込みは一括方式でも、分割方式でもよい。反応は不活性気体、たとえば窒素雰囲気下に常圧、減圧またはそれらの組み合わせで行うことができる。プロセスは回分式、連続式、またはそれらの組み合わせが採用できる。
なお、上記モノマー化合物をより重合し易い化合物に変える反応(たとえば、エステル化反応)を重縮合反応に先立って行った後、引き続き重縮合反応を行うこともできる。
上記重縮合反応の温度は、通常、270〜380℃が好ましい。温度が270℃未満の場合、重合反応の進行が遅く、380℃を超えると分解等の副反応が起こり易いので好ましくない。多段階の反応温度を採用しても構わないし、場合により昇温途中で、あるいは最高温度に達したらすぐに反応生成物であるポリマーを溶融状態で抜出し、回収することもできる。また取出したポリマーの分子量をさらに上げるため、不活性ガス雰囲気下、加温により固相重合等の後処理を施すこともできる。
【0018】
本発明において、上述のように得られた液晶性ポリエステル樹脂を押出し成形用材料として、パウダー状のまま押出し成形機にかけることもできるが、いったん造粒機でペレット形状とし、これを、押出し成形機に投入する方が取扱いの点で好ましい。
押出し成形用材料には、目的を阻害しない範囲において少量の無機充填剤、有機充填剤、酸化防止剤、熱安定剤、光安定剤、難燃剤、滑剤、帯電防止剤、防錆剤、蛍光剤、表面平滑剤、表面改良剤、離型剤の各種添加剤を添加することができる。
【0019】
本発明の押出し成形物は、上記押出し成形用材料を押出し成形したものである。押出し成形物の形態は特に限定されないが、フィルムが好ましい。フィルムの厚さは用途に応じて適宜選択することができるが、通常、10〜500μm程度である。
本発明の押出し成形物は、上記押出し成形用材料を、通常の押出し成形により、所望の形態に賦形して調製することができる。具体的には、フィルム成形の場合、溶融した樹脂をTダイと呼ばれるスリット状の加工機から所定の幅、厚さに押出し、冷却してそのままフィルムとするキャスト法、また押出し後、製膜方向、およびその直角方向に逐次延伸する延伸法、環状ダイから円筒状に樹脂を押出し、ガスによって巻き取り方向とそれに直角方向に同時に延伸させるインフレ−ション法等が挙げられるが、液晶ポリマーの場合、異方性のコントロールのし易さの点でインフレーション法が好ましく用いられる。
またブロー成形の場合は、環状ダイから樹脂を押出し、パリソンと呼ばれる円筒状半溶融樹脂を金型で挟んだ後ガス圧によって膨らませ賦形することにより成形できる。この方法も異方性のコントロールのし易さという点で液晶ポリマーには好適な方法である。
これらの押出し成形において、本発明の液晶性ポリエステル樹脂を含む押出し成形用材料を供する場合、通常の押出し成形機に特段の工夫を施さずに供することができる。
【0020】
【実施例】
以下、実施例により本発明をさらに詳しく説明するが、本発明はこれらによって限定されるものではない。尚、例中における各測定は以下の方法に従って行った。
(1)物性の測定法
(a)流動開始温度:島津製作所製の高化式フローテスターCFT−500型で測定した。すなわち、4℃/minの昇温速度で加熱された樹脂を荷重100Kgf/cm2のもとで、内径1mm、長さ10mmのノズルから押出したときに、溶融粘度が48000ポイズを示す温度を測定しこれを流動開始温度とした。
(b)溶融粘度:東洋精機社製のキャピログラフ1Bで、所定温度下、ダイス径0.5mm、剪断速度100sec-1、1000sec-1で測定を行った。
(c)溶融張力:東洋精機社製のキャピログラフ1Bを用い、各樹脂の流動開始温度より30℃高い所定温度に設定された長さ8.0mm×2.1mmφのダイス中で樹脂を溶融させ、ピストン速度2mm/minでこれを押出し、テンションプーリーを通した後巻き取る装置において、巻き取りスピードを上げていきながら引き取り、糸が破断する時のテンションプーリーにかかる力をグラム単位で求めた。
(d)固有粘度[η]:液晶性ポリエステル樹脂を3,5−ビストリフロロメチルフェノールに溶解させ、ウベローデ粘度計を用いて60℃で測定した。
(e)熱変形温度(DTUL):DTUL試験片(127mm長×12.7mm幅×6.4mm厚)を成形し、ASTM D648に準じて荷重18.6Kgで測定した。
(f)ハンダ耐熱温度:厚さが1.2mmのJIS1(1/2)号ダンベルを試験片として成形し、錫60%、鉛40%からなる230℃のハンダ浴に浸漬し、同温度に60秒間保持した後取出し、外観を観察する。その後、該ハンダ浴を10℃ずつ昇温させ同様の実験を行い、同試験片が発泡または変形しない最高温度を求めた。
(2)フィルム加工
樹脂ペレットを、東洋精機社製の円筒ダイを備えた20mmの2軸混練押出機を用い、シリンダー設定温度290〜370℃、回転数80rpmで溶融混練し、直径30mm、リップ間隔1.5mm、ダイ設定温度290〜370℃の円筒ダイから上方へ溶融樹脂を押し出し、この筒状フィルムの中空部へ乾燥空気を圧入して筒状フィルムを膨張させ、次に冷却させた後、ニップロールに通して引き取り速度8〜15m/minで引き取り、10〜30μm厚の液晶ポリマーフィルムを得た。得られたフィルムを肉眼で観察し、以下の基準で評価した。
○:フィルム製膜可能で、外観も良好である。
△:フィルム製膜可能であるが、色むらが認められる。
×:フィルム製膜できない。
(3)フィルム耐熱性
上記のようにして得られた約30μm厚のフィルムを10cm角に切断し、両端をクリップで固定して280℃に設定した熱風循環オーブン中へ5分間放置した後のフィルム状態を観察し、以下の基準で評価した。
○:フィルム形状に変化は見られない。
×:フィルムが変形もしくは融解する。
【0021】
実施例1
p-アセトキシ安息香酸10.8Kg(60モル)、テレフタル酸2.49Kg(15モル)、イソフタル酸0.83Kg(5モル)、および、4,4'−ジアセトキシジフェニル5.45Kg(20.2モル)を櫛形攪拌翼を持つ重合槽に仕込み、窒素ガス雰囲気下で攪拌しながら昇温し、330℃で1時間重合させた。この間に副生する酢酸を除去しながら、強力な攪拌下で重合させた。その後、系を徐々に冷却し、200℃で得られたポリマーを系外に取出した。この得られたポリマーを細川ミクロン(株)製のハンマーミルで粉砕し、2.5mm以下の粒子とした。
これをさらにロータリーキルン中で窒素雰囲気下に290℃、3時間処理することにより、流動開始温度が341℃であり、粒子状の下記単位からなる全芳香族液晶性ポリエステル樹脂を得た。
【0022】
【化7】
この液晶性ポリエステル樹脂を、池貝鉄工社製PCM−30型造粒機を用いて350℃で造粒し、ペレット状とした。この時のペレットから求めた流動開始温度は332℃、固有粘度[η]は6.8であった。この樹脂の溶融粘度、溶融粘度比、溶融張力、ハンダ耐熱性、インフレ製膜時のフィルム形状及び耐熱性を表1並びに表2に示す。
【0023】
比較例1
実施例1と同様に2.5mm以下の粒子を得た後、ロータリーキルン中で窒素雰囲気下280℃、3時間処理することにより、流動開始温度が331℃の全芳香族液晶性ポリエステル樹脂を得た。この液晶性ポリエステル樹脂を池貝鉄工社製PCM−30型造粒機を用いて340℃で造粒し、ペレット状とした。この時のペレットから求めた流動開始温度は324℃、固有粘度[η]は4.8であった。この樹脂の溶融粘度、溶融粘度比、溶融張力、ハンダ耐熱性、インフレ製膜時のフィルム形状及び耐熱性を表1並びに表2に示す。
【0024】
比較例2
p−ヒドロキシ安息香酸16.6Kg(12.1モル)と6−ヒドロキシ−2−ナフトエ酸8.4Kg(4.5モル)および無水酢酸18.6Kg(18.2モル)を櫛形攪拌翼付きの重合槽に仕込み、窒素ガス雰囲気下で攪拌しながら昇温し、常圧320℃で1時間、さらに2.0Torrの減圧下で320℃1時間重合させた。この間に副生する酢酸を系外へ留出し続けた。その後、系を徐々に冷却し、180℃で得られたポリマーを実施例1と同様に粉砕した後、ロータリーキルン中で窒素ガス雰囲気下に240℃、5時間処理することによって流動開始温度が270℃の粒子状の下記繰り返し単位からなる全芳香族液晶性ポリエステルを得た。
【0025】
【化8】
この液晶性ポリエステル樹脂を池貝鉄工社製PCM−30型造粒機を用いて280℃で造粒し、ペレット状とした。この時のペレットから求めた流動開始温度は268℃であった。この樹脂の溶融粘度、溶融粘度比、溶融張力、ハンダ耐熱性、インフレ製膜時のフィルム形状及び耐熱性を表1並びに表2に示す。
【0026】
【表1】
【0027】
【表2】
【0028】
【発明の効果】
本発明は、高い耐熱性と、適度な流動性を有する液晶性ポリエステル樹脂を、押出し成形したものなので、良好な耐熱性を有し、外観の優れた押出し成形物、特にフィルムを得ることができ、広範におよぶ分野への利用が期待できる。[0001]
BACKGROUND OF THE INVENTION
The present invention has a high excellent extrusion moldability and heat resistance, relates extrudate was extruded liquid crystalline polyester resins for extrusion.
[0002]
[Prior art]
Liquid crystalline polyester resin (hereinafter sometimes referred to simply as “liquid crystal polymer”) is widely used mainly in the field of electronic materials as an injection molding material that can be precisely molded because of its excellent heat resistance and excellent fluidity when melted. It has become. Liquid crystal polymers are generally classified into type I, type II and type III (for example, “Liquid Crystal Polymer for Molding Design” Sigma Publishing (1995)). What is called a mold is made of a specific wholly aromatic component, and has a heat distortion temperature of 250 ° C. or higher, and is a material having particularly high heat resistance among liquid crystal polymers.
In addition to the excellent heat resistance of liquid crystal polymers, the gas barrier properties, low dielectric properties, chemical resistance, and other characteristics have been extensively studied in the field of extrusion molding of films and containers.
However, in general, liquid crystal polymers are said to be unsuitable for the extrusion molding field because of their low viscosity when melted and large anisotropy.
For this reason, various studies have been made in terms of materials. For example, JP-A-2-3430 discloses film formation of an aromatic polymer comprising (1) oxybenzoic acid and (2) 2,6-naphthoic acid as repeating units. Japanese Patent Application Laid-Open No. 5-186614 discloses a semi-aromatic film in which components such as ethylene glycol are added in addition to the above oxybenzoic acid and 2,6-naphthoic acid. In addition, for the purpose of improving the extrusion moldability, compounding with other resins has been studied. For example, JP-A-61-78862 discloses film formation of a composition comprising a liquid crystal polymer and polyethylene terephthalate, and JP-A-63-270760 discloses a composition comprising a liquid crystal polyester and an aromatic polycarbonate. . However, all of these are liquid crystal polymers of type II or type III and have low heat resistance or other low heat resistance materials for liquid crystal polymers including type I liquid crystal polymers to improve processability. The actual condition is that sufficient heat resistance inherent to the liquid crystal polymer is not obtained.
[0003]
[Problems to be solved by the invention]
An object of the present invention is to provide an extruded product obtained by extruding a liquid crystalline polyester resin for extrusion molding which has high heat resistance, moderate fluidity and workability and gives an extruded product having an excellent appearance. is there.
[0004]
[Means for Solving the Problems]
As a result of studying film formation and blowing using a resin composed only of a liquid crystalline polyester resin from the viewpoint of heat resistance, the present inventors have found that polymer physical properties and melt fluidity satisfy certain conditions. It has been found that even a liquid crystalline polyester resin exhibiting the same level of heat resistance as that of a mold polymer can be substantially excellently extruded by itself, leading to the present invention.
That is, according to the present invention, the solder heat resistance temperature is 250 ° C. or higher ,
Including two or more of the structural units represented by the following formulas (1) to (4), the total of the structural units of these combinations is 97 mol% or more of the total,
The ratio of the melt viscosity at a shear rate of 1,000 sec -1 under flow temperature (viscosity 1b), therewith than 20 ° C. higher temperature melt viscosity measured under the same shear rate (viscosity 2b) ((viscosity 2b) / ( An extruded product obtained by extrusion molding a liquid crystalline polyester resin having a viscosity 1b)) of 0.10 to 0.70 and an intrinsic viscosity [η] of 5.5 or more is provided. Is done.
[Chemical formula 2]
[0005]
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described in detail below.
The liquid crystalline polyester resin for extrusion molding used in the present invention (hereinafter sometimes referred to as “the resin of the present invention”) has a solder heat resistance of 250 ° C. or higher in terms of its heat resistance, and has a specific melt fluidity. It is resin for extrusion molding which shows.
Here, the solder heat-resistant temperature is obtained by molding a JIS1 (1/2) dumbbell having a thickness of 1.2 mm as a test piece, and placing the test piece into a 240 ° C. solder bath composed of 60% tin and 40% lead. Immerse and hold at the same temperature for 60 seconds, then take out and observe the appearance. Thereafter, the temperature of the solder bath is increased by 10 ° C., and the same experiment is performed. The maximum temperature at which the test piece does not foam or deform is stated. When the solder heat-resistant temperature is less than 250 ° C., there are many restrictions on the use in a solder reflow furnace and the like, which is not the main purpose of the present invention.
The specific melt fluidity, a melt viscosity definitive shear rate of 1,000 sec -1 under flow temperature (viscosity 1b), melt viscosity measured under the same shear rate of it than 20 ° C. higher temperature (viscosity 2b) The ratio ((viscosity 2b) / (viscosity 1b )) is 0.10 to 0.70, preferably 0.10 to 0.70, particularly preferably 0.12 to 0.50.
Here, the flow start temperature in the present invention is a temperature at which an anisotropic melt phase starts to be formed, and a resin heated at a temperature rising rate of 4 ° C./min is loaded under a load of 100 kgf / cm 2 . The temperature at which the melt viscosity shows 48000 poise when extruded from a nozzle having an inner diameter of 1 mm and a length of 10 mm.
If the melt viscosity ratio is outside the above range, extrusion molding may be difficult, or the resulting molded product may have strong anisotropy and may not be practically usable.
[0006]
The resin of the present invention preferably has a melt tension of 10 g or more when measured at a temperature 30 ° C. higher than the flow start temperature.
Here, the melt tension means that the resin is melted in a die having a length of 8.0 mm × 2.1 mmφ set at a temperature 30 ° C. higher than the resin flow start temperature, and is extruded at a piston speed of 2 mm / min. It shows the force applied to the tension pulley when the yarn breaks when the take-up roller picks up the monofilament after passing through the pulley and the take-up speed is increased. When the melt tension is less than 10 g, the elongation at the time of film formation by extrusion molding becomes insufficient, and the processing at the time of film molding or blow molding may be difficult, which is not preferable. The melt tension is preferably 40 g or less from the viewpoint of workability.
[0007]
The resin of the present invention preferably contains a combination of two or more of an aromatic hydroxycarboxylic acid unit, an aromatic dicarboxylic acid unit, and an aromatic dihydroxy unit.
Examples of the aromatic hydroxycarboxylic acid unit include the following structures.
[0008]
[Chemical 3]
[0009]
Examples of the aromatic dihydroxy unit include the following structures.
[0010]
[Formula 4]
[0011]
Examples of the aromatic dicarboxylic acid unit include the following structures.
[0012]
[Chemical formula 5]
[0013]
The combination of the above structural units and the composition ratio thereof are optional, but the structural units represented by the following formulas (1) to (4) in order to have the high heat resistance and appropriate fluidity that are the object of the present invention. It is set as the liquid crystalline polyester resin which contains 2 or more types of these, and the sum total of the structural unit of these combinations is 97 mol% or more of the whole .
[0014]
[Chemical 6]
[0015]
More preferable examples of the resin of the present invention include liquid crystalline polyester resins having specific structural units under specific conditions that satisfy all of the following conditions (a) to (c). In addition, Formula (1)-(4) in conditions is a structural unit shown by the said Formula (1)-(4).
(a): The proportion of the structural unit represented by the formula (1) is 40 to 70 mol% of the whole,
(b): The total proportion of the structural unit represented by the formula (2) and the structural unit represented by the formula (3) is 15 to 30 mol in total, and the structural unit represented by the formula (2) The proportion is 0 to 95 mol% with respect to the total of the structural unit represented by the formula (2) and the structural unit represented by the formula (3), and among the structural units represented by the formula (2) 80 to 100 mol% is a structural unit whose main chain bond position is para-position,
(c): The proportion of the structural unit represented by formula (4) is substantially the same as the total proportion of the structural unit represented by formula (2) and the structural unit represented by formula (3). And 50% by mole or more of the structural unit represented by the formula (4) is a structural unit in which the main chain bond position is in the para position.
[0016]
The intrinsic viscosity [η] of the resin of the present invention is 5.5 or more . When [η] is less than 5.5, it is difficult to obtain the above-described melt viscosity characteristics and melt tension.
[0017]
The method for producing the resin of the present invention is not particularly limited, and a known method can be used. For example, it can be obtained by a method of subjecting a mixture comprising two or more kinds of monomer compounds having the aromatic hydroxycarboxylic acid unit, aromatic dicarboxylic acid unit and aromatic dihydroxy unit to a polycondensation reaction in a polymerization tank. Examples of the monomer compound having an aromatic hydroxycarboxylic acid unit include hydroxybenzoic acid and p-acetoxybenzoic acid. Examples of the monomer compound having an aromatic dicarboxylic acid unit include terephthalic acid and isophthalic acid. Examples of the monomer compound having a group dihydroxy unit include 4,4′-dihydroxydiphenyl, 4,4′-diacetoxydiphenyl, hydroquinone, and resorcin. The charging of these compounds may be a batch method or a division method. The reaction can be carried out under an inert gas such as nitrogen atmosphere at normal pressure, reduced pressure or a combination thereof. The process can be batch, continuous, or a combination thereof.
In addition, after performing the reaction (for example, esterification reaction) which changes the said monomer compound into the compound which is easier to superpose | polymerize prior to a polycondensation reaction, a polycondensation reaction can also be performed continuously.
The temperature of the polycondensation reaction is usually preferably 270 to 380 ° C. When the temperature is less than 270 ° C., the polymerization reaction proceeds slowly, and when it exceeds 380 ° C., side reactions such as decomposition tend to occur, such being undesirable. A multi-stage reaction temperature may be employed. In some cases, the polymer as a reaction product can be withdrawn in a molten state and recovered during the temperature increase or as soon as the maximum temperature is reached. Further, in order to further increase the molecular weight of the extracted polymer, post-treatment such as solid phase polymerization can be performed by heating in an inert gas atmosphere.
[0018]
In the present invention, as an extrusion molding material a liquid crystalline polyester resin obtained as described above, can also be subjected to powdery remains extrusion forming shape machine, the pellet once with granulator, this extrusion It is preferable in terms of handling that it is charged into a molding machine.
The extrusion shi molding material, a small amount of inorganic filler within a range not impair the object, organic fillers, antioxidants, heat stabilizers, light stabilizers, flame retardants, lubricants, antistatic agents, rust inhibitors, fluorescent Various additives such as an agent, a surface smoothing agent, a surface improver and a release agent can be added.
[0019]
The extruded product of the present invention is obtained by extruding the material for extrusion molding. The form of the extruded product is not particularly limited, but a film is preferable. Although the thickness of a film can be suitably selected according to a use, it is about 10-500 micrometers normally.
The extruded product of the present invention can be prepared by shaping the above-mentioned material for extrusion molding into a desired form by ordinary extrusion molding. Specifically, in the case of film forming, a molten resin is extruded to a predetermined width and thickness from a slit-shaped processing machine called a T-die, and cooled to form a film as it is. And a stretching method that sequentially stretches in the perpendicular direction, an inflation method in which a resin is extruded from a circular die into a cylindrical shape, and is simultaneously stretched in a winding direction and a direction perpendicular thereto by a gas. The inflation method is preferably used from the viewpoint of easy control of anisotropy.
In the case of blow molding, molding can be performed by extruding a resin from an annular die, sandwiching a cylindrical semi-molten resin called a parison between molds, and then inflating and shaping by a gas pressure. This method is also suitable for the liquid crystal polymer in terms of easy control of anisotropy.
In these extrusion moldings, when the extrusion molding material containing the liquid crystalline polyester resin of the present invention is provided, it can be provided without special measures to an ordinary extrusion molding machine.
[0020]
【Example】
EXAMPLES Hereinafter, although an Example demonstrates this invention further in detail, this invention is not limited by these. In addition, each measurement in an example was performed in accordance with the following method.
(1) Physical property measurement method
(a) Flow start temperature: Measured with Koka type flow tester CFT-500 manufactured by Shimadzu Corporation. That is, when a resin heated at a heating rate of 4 ° C./min is extruded from a nozzle having an inner diameter of 1 mm and a length of 10 mm under a load of 100 kgf / cm 2 , the temperature at which the melt viscosity shows 48000 poise is measured. This was taken as the flow start temperature.
(b) Melt viscosity: In Capirograph 1B manufactured by Toyo Seiki Co., was carried out under a predetermined temperature, die diameter 0.5 mm, shear rate 100 sec -1, measured at of 1,000 sec -1.
(c) Melt tension: Using a Capillograph 1B manufactured by Toyo Seiki Co., Ltd., the resin was melted in a die having a length of 8.0 mm × 2.1 mmφ set at a predetermined temperature 30 ° C. higher than the flow start temperature of each resin. This was extruded at a piston speed of 2 mm / min, and was taken up while increasing the take-up speed in a device for taking up after passing through the tension pulley, and the force applied to the tension pulley when the yarn broke was determined in grams.
(d) Intrinsic viscosity [η]: The liquid crystalline polyester resin was dissolved in 3,5-bistrifluoromethylphenol and measured at 60 ° C. using an Ubbelohde viscometer.
(e) Thermal deformation temperature (DTUL): A DTUL test piece (127 mm long × 12.7 mm wide × 6.4 mm thick) was molded and measured under a load of 18.6 kg according to ASTM D648.
(f) Solder heat resistance temperature: A JIS1 (1/2) dumbbell having a thickness of 1.2 mm was molded as a test piece and immersed in a 230 ° C. solder bath composed of 60% tin and 40% lead. Take out after holding for 60 seconds and observe the appearance. Thereafter, the temperature of the solder bath was increased by 10 ° C., and a similar experiment was performed to determine the maximum temperature at which the test piece did not foam or deform.
(2) Film processing resin pellets were melt-kneaded at a cylinder setting temperature of 290 to 370 ° C. and a rotation speed of 80 rpm using a 20 mm twin-screw kneading extruder equipped with a cylindrical die manufactured by Toyo Seiki Co., Ltd., diameter 30 mm, lip interval After extruding the molten resin upward from a cylindrical die of 1.5 mm and a die set temperature of 290 to 370 ° C., pressurizing dry air into the hollow portion of this tubular film to expand the tubular film, and then cooling it, The film was drawn through a nip roll at a take-up speed of 8 to 15 m / min to obtain a liquid crystal polymer film having a thickness of 10 to 30 μm. The obtained film was observed with the naked eye and evaluated according to the following criteria.
○: A film can be formed and the appearance is also good.
Δ: Film can be formed, but uneven color is observed.
X: Film cannot be formed.
(3) Film heat resistance Film obtained by cutting the approximately 30 μm-thick film obtained as described above into 10 cm square, fixing both ends with clips and leaving it in a hot air circulating oven set at 280 ° C. for 5 minutes. The state was observed and evaluated according to the following criteria.
○: No change is observed in the film shape.
X: The film is deformed or melted.
[0021]
Example 1
p-acetoxybenzoic acid 10.8 kg (60 mol), terephthalic acid 2.49 kg (15 mol), isophthalic acid 0.83 kg (5 mol) and 4,4'-diacetoxydiphenyl 5.45 kg (20.2 kg) Mol) was charged into a polymerization tank having a comb-shaped stirring blade, heated while stirring in a nitrogen gas atmosphere, and polymerized at 330 ° C. for 1 hour. During this time, the polymerization was carried out under vigorous stirring while removing by-product acetic acid. Thereafter, the system was gradually cooled, and the polymer obtained at 200 ° C. was taken out of the system. The obtained polymer was pulverized with a hammer mill manufactured by Hosokawa Micron Co., Ltd. to obtain particles of 2.5 mm or less.
This was further treated in a rotary kiln under a nitrogen atmosphere at 290 ° C. for 3 hours to obtain a wholly aromatic liquid crystalline polyester resin having a flow start temperature of 341 ° C. and comprising the following units in the form of particles.
[0022]
[Chemical 7]
This liquid crystalline polyester resin was granulated at 350 ° C. using a PCM-30 type granulator manufactured by Ikekai Tekko Co., Ltd. to obtain a pellet. The flow starting temperature determined from the pellets at this time was 332 ° C., and the intrinsic viscosity [η] was 6.8. Tables 1 and 2 show the melt viscosity, melt viscosity ratio, melt tension, solder heat resistance, film shape and heat resistance during inflation film formation of this resin.
[0023]
Comparative Example 1
After obtaining particles of 2.5 mm or less in the same manner as in Example 1, a fully aromatic liquid crystalline polyester resin having a flow start temperature of 331 ° C. was obtained by treating in a rotary kiln under a nitrogen atmosphere at 280 ° C. for 3 hours. . This liquid crystalline polyester resin was granulated at 340 ° C. using a PCM-30 type granulator manufactured by Ikekai Tekko Co., Ltd. to obtain a pellet. The flow starting temperature determined from the pellets at this time was 324 ° C., and the intrinsic viscosity [η] was 4.8. Tables 1 and 2 show the melt viscosity, melt viscosity ratio, melt tension, solder heat resistance, film shape and heat resistance during inflation film formation of this resin.
[0024]
Comparative Example 2
16.6 kg (12.1 mol) of p-hydroxybenzoic acid, 8.4 kg (4.5 mol) of 6-hydroxy-2-naphthoic acid and 18.6 kg (18.2 mol) of acetic anhydride were equipped with a comb-shaped stirring blade. The mixture was charged into a polymerization tank and heated with stirring in a nitrogen gas atmosphere, and polymerized at 320 ° C. for 1 hour at 320 ° C. under normal pressure and further for 1 hour at 320 ° C. under a reduced pressure of 2.0 Torr. During this time, acetic acid produced as a by-product continued to be distilled out of the system. Thereafter, the system was gradually cooled, and the polymer obtained at 180 ° C. was pulverized in the same manner as in Example 1 and then treated at 240 ° C. in a nitrogen gas atmosphere for 5 hours in a rotary kiln, whereby the flow start temperature was 270 ° C. A wholly aromatic liquid crystalline polyester comprising the following repeating units in the form of:
[0025]
[Chemical 8]
This liquid crystalline polyester resin was granulated at 280 ° C. using a PCM-30 type granulator manufactured by Ikekai Tekko Co., Ltd. to obtain a pellet. The flow starting temperature determined from the pellets at this time was 268 ° C. Tables 1 and 2 show the melt viscosity, melt viscosity ratio, melt tension, solder heat resistance, film shape and heat resistance during inflation film formation of this resin.
[0026]
[Table 1]
[0027]
[Table 2]
[0028]
【The invention's effect】
The present invention has heat resistance high, the liquid crystalline polyester resin having an appropriate fluidity, so that extruded, has good heat resistance, excellent extrudate appearance, in particular obtain a film Can be used in a wide range of fields.
Claims (3)
以下の式(1)〜(4)で示される構成単位のうちの2種以上を含み、これら組み合わせの 構成単位の合計が全体の97mol%以上であり、
流動開始温度下での剪断速度1000sec -1 における溶融粘度(粘度1b)と、それより20℃高い温度の同剪断速度下で測定した溶融粘度(粘度2b)との比率((粘度2b)/(粘度1b))が0.10〜0.70であり、固有粘度[η]は、5.5以上である液晶性ポリエステル樹脂を押出し成形して得られたことを特徴とする押出し成形物。
Including two or more of the structural units represented by the following formulas (1) to (4), the total of the structural units of these combinations is 97 mol% or more of the total,
The ratio of the melt viscosity at a shear rate of 1,000 sec -1 under flow temperature (viscosity 1b), therewith than 20 ° C. higher temperature melt viscosity measured under the same shear rate (viscosity 2b) ((viscosity 2b) / ( An extruded product obtained by extruding a liquid crystalline polyester resin having a viscosity 1b)) of 0.10 to 0.70 and an intrinsic viscosity [η] of 5.5 or more .
(a):式(1)で表される構成単位の割合が全体の40〜70mol%であること、
(b):式(2)で表される構成単位及び式(3)で表される構成単位の合計の割合が全体の15〜30molであり、かつ式(2)で表される構成単位の割合が、式(2)で表される構成単位及び式(3)で表される構成単位の合計に対して0〜95mol%であり、かつ式(2)で表される構成単位のうちの80〜100mol%が主鎖結合位置がパラ位である構成単位であること、
(c):式(4)で表される構成単位の割合が、式(2)で表される構成単位及び式(3)で表される構成単位の合計の割合と実質的に同量であり、かつ式(4)で表される構成単位のうちの50mol%以上が主鎖結合位置がパラ位である構成単位であること。 The extruded product according to claim 1 , wherein all of the following conditions (a) to (c) are satisfied.
(a): The proportion of the structural unit represented by the formula (1) is 40 to 70 mol% of the whole,
(b): The total proportion of the structural unit represented by the formula (2) and the structural unit represented by the formula (3) is 15 to 30 mol in total, and the structural unit represented by the formula (2) The proportion is 0 to 95 mol% with respect to the total of the structural unit represented by the formula (2) and the structural unit represented by the formula (3), and among the structural units represented by the formula (2) 80 to 100 mol% is a structural unit whose main chain bond position is para-position,
(c): The proportion of the structural unit represented by formula (4) is substantially the same as the total proportion of the structural unit represented by formula (2) and the structural unit represented by formula (3). And 50% by mole or more of the structural unit represented by the formula (4) is a structural unit in which the main chain bond position is in the para position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31975699A JP4361652B2 (en) | 1998-11-12 | 1999-11-10 | Liquid crystalline polyester resin for extrusion molding with excellent heat resistance, extrusion molding material and extrusion molding |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32162098 | 1998-11-12 | ||
| JP10-321620 | 1998-11-12 | ||
| JP1537999 | 1999-01-25 | ||
| JP11-15379 | 1999-01-25 | ||
| JP31975699A JP4361652B2 (en) | 1998-11-12 | 1999-11-10 | Liquid crystalline polyester resin for extrusion molding with excellent heat resistance, extrusion molding material and extrusion molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000281881A JP2000281881A (en) | 2000-10-10 |
| JP4361652B2 true JP4361652B2 (en) | 2009-11-11 |
Family
ID=27280986
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31975699A Expired - Fee Related JP4361652B2 (en) | 1998-11-12 | 1999-11-10 | Liquid crystalline polyester resin for extrusion molding with excellent heat resistance, extrusion molding material and extrusion molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4361652B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022220204A1 (en) * | 2021-04-14 | 2022-10-20 | 大倉工業株式会社 | Liquid-crystalline polyester-based resin composition, liquid-crystalline polyester-based film using said composition, metal laminated film using said film, and circuit board |
-
1999
- 1999-11-10 JP JP31975699A patent/JP4361652B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2000281881A (en) | 2000-10-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6140455A (en) | Liquid crystalline polyester resin for extrusion molding | |
| US6656578B2 (en) | Process for producing aromatic liquid crystalline polyester and film thereof | |
| JP4269675B2 (en) | Aromatic liquid crystal polyester and film thereof | |
| CN100540603C (en) | Modifier for polyester resin and process for producing molded article using the same | |
| JP4576644B2 (en) | Aromatic liquid crystalline polyester and method for producing the same | |
| JP4361652B2 (en) | Liquid crystalline polyester resin for extrusion molding with excellent heat resistance, extrusion molding material and extrusion molding | |
| JP2766397B2 (en) | Polyester resin for molding with high melting heat stability and molded article thereof | |
| KR950009483B1 (en) | Molding polyalkylene terephthalate resin having high thermal stability during melting and molded article thereof | |
| JP6634823B2 (en) | Method for producing terminal-modified polyethylene terephthalate resin | |
| JP2000080254A (en) | Liquid crystal polyester resin composition, liquid crystal polyester resin composition film and method for producing the same | |
| JP2001342243A (en) | Aromatic liquid crystalline polyester film and method for producing the same | |
| EP1555279B1 (en) | Noncrystalline, wholly aromatic polyesteramide | |
| JP4821952B2 (en) | POLYESTER RESIN MODIFICATOR AND METHOD FOR PRODUCING MOLDED ARTICLE USING THE SAME | |
| JPH09300429A (en) | Method for producing polyester film | |
| CN103130994A (en) | Material for fiber manufacturing and fiber | |
| JP5492569B2 (en) | Polyester resin, process for producing the same, and biaxially oriented polyester film using the same | |
| JP5093872B2 (en) | Biaxially stretched film made of resin mainly composed of polyglycolic acid and method for producing the same | |
| JP4665540B2 (en) | Polylactic acid component segment-containing polyester and method for producing the same | |
| JPH01292057A (en) | Polymer composition | |
| JP7364838B2 (en) | Inorganic reinforced thermoplastic polyester resin composition and method for producing the same | |
| JP7542704B1 (en) | Liquid crystal polymer resin and molded article made of liquid crystal polymer resin | |
| JP5274761B2 (en) | Totally aromatic polyester | |
| JP2009292852A (en) | Fully aromatic polyester | |
| JPH02263849A (en) | Polyolefin molded product | |
| JP4694094B2 (en) | Method for improving the properties of poly (trimethylene terephthalate) films |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060703 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20081224 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090120 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090316 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090407 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090721 |
|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090813 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 4361652 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120821 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120821 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130821 Year of fee payment: 4 |
|
| LAPS | Cancellation because of no payment of annual fees |