JP4363756B2 - Chip mounting method and substrate cleaning apparatus used therefor - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a chip mounting method for mounting a chip on a substrate, and more particularly to a chip mounting method for mounting a chip on a substrate after cleaning dust and dirt attached to the substrate and a substrate cleaning apparatus used therefor.
[0002]
[Prior art]
Conventionally, in the process of manufacturing a substrate (for example, a glass substrate for LCD), there is a step of mounting a chip (for example, a semiconductor chip) on the substrate. As a method for mounting a chip on a substrate, a method is well known in which an adhesive is attached to the substrate and then the chip is bonded to the substrate to which the adhesive is attached.
[0003]
That is, in a chip mounting apparatus for mounting a chip,
(1) An adhesive (for example, ACF (Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste), NCF (Non Conductive Film), NCP (Non Conductive Paste), etc.) is transferred or applied to the substrate.
(2) The chip and the substrate are aligned using the recognition means, and the chip is mounted on the substrate with low heating and low pressure (hereinafter referred to as “temporary pressure bonding”).
(3) The adhesive between the chip and the substrate is cured by high heating and high pressure to fix the chip and the substrate (hereinafter referred to as “main pressure bonding”).
The chip is mounted on the substrate by the steps (1) to (3).
[0004]
[Problems to be solved by the invention]
However, such a chip mounting method has the following problems. That is, dust and dirt such as glass powder, glass dust, organic film, and oxide film may adhere to the substrate during mounting.
[0005]
When chip mounting is performed using a substrate with dust or dirt attached, dust and dirt are interposed between the chip and the substrate, so that the chip and the substrate cannot be completely tightly bonded, and electrical good connection cannot be made. Problems occur such as the position of the chip and the substrate being displaced, and the chip and the substrate being scratched.
[0006]
The present invention has been made in view of such circumstances, and provides a chip mounting method capable of efficiently removing dirt on a substrate and mounting a chip with high quality, and a substrate cleaning apparatus used therefor. The task is to do.
[0007]
[Means for Solving the Problems]
  In order to achieve the above object, the present invention has the following configuration. The invention according to claim 1 is a chip mounting method comprising: an adhesive attaching step for attaching an adhesive to the substrate; and a chip joining step for joining the chip to the substrate to which the adhesive is attached.
  Before the adhesive application process,Vibrated with ultrasonic wavesAir blowByAn air blow cleaning process for cleaning,
  A substrate cleaning process in which a plasma cleaning process for performing plasma cleaning on a substrate is arranged in that order;
  By carrying and moving the substrate through the air blow cleaning process and the plasma cleaning process, air blow cleaning and plasma cleaning are continuously performed on the substrate.
[0008]
The invention according to claim 2 is a chip mounting method comprising: an adhesive attaching step for attaching an adhesive to a substrate; and a chip joining step for joining a chip to the substrate to which the adhesive is attached. Before the step, a wiping cleaning process for wiping and cleaning the substrate and a plasma cleaning process for performing plasma cleaning on the substrate are arranged in that order, the wiping cleaning process and the plasma cleaning process, The substrate is transported and moved over the substrate, and wiping cleaning and plasma cleaning are continuously performed on the substrate.
[0009]
  The invention according to claim 3 is a chip mounting method comprising: an adhesive attaching step for attaching an adhesive to the substrate; and a chip joining step for joining the chip to the substrate to which the adhesive is attached.
  Before the adhesive application process,Vibrated with ultrasonic wavesAir blowByAn air blow cleaning process for cleaning,
  A wiping cleaning process for wiping and cleaning the substrate and a plasma cleaning process for performing plasma cleaning on the substrate in that order are provided.
  By carrying and moving the substrate through the air blow cleaning process, the wiping cleaning process and the plasma cleaning process, air blow cleaning, wiping cleaning and plasma cleaning are continuously performed on the substrate.
.
[0010]
According to a fourth aspect of the present invention, in the chip mounting method according to any one of the first to third aspects, in the substrate cleaning step, the respective cleaning steps are arranged adjacently along the substrate transfer path, and are transferred. Each cleaning process is sequentially performed on the substrate passing through the path at a constant speed.
[0011]
According to a fifth aspect of the present invention, in the chip mounting method according to the first or third aspect, in the air blow cleaning step, the oscillated air is blown toward the substrate and the blown air is sucked and discharged. To clean the substrate.
[0012]
According to a sixth aspect of the present invention, in the chip mounting method according to the second or third aspect, in the wiping cleaning step, the non-woven fabric impregnated with the cleaning liquid is wound on the substrate while the non-woven fabric is allowed to act on the substrate. To clean the substrate.
[0013]
A seventh aspect of the present invention is the chip mounting method according to the sixth aspect, wherein in the wiping and cleaning step, the substrate is cleaned by applying a nonwoven fabric to both the front and back surfaces of the substrate.
[0014]
According to an eighth aspect of the present invention, in the chip mounting method according to the seventh aspect, in the wiping and cleaning step, the substrate is cleaned by causing individual nonwoven fabrics to act on both the front and back surfaces of the substrate.
[0015]
A ninth aspect of the present invention is the chip mounting method according to any of the sixth to eighth aspects, wherein in the wiping and cleaning step, the nonwoven fabric is wound in a direction opposite to the traveling direction of the substrate.
[0016]
According to a tenth aspect of the present invention, in the chip mounting method according to any one of the first to ninth aspects, in the plasma cleaning step, the substrate is cleaned by generating plasma under atmospheric pressure.
[0018]
Claim 11The invention described inClaims 1 to 10In the chip mounting method according to any one of the above, the substrate is a glass substrate.
[0019]
Claim 12According to the invention described in Item 4, in the chip mounting method according to Item 4, the passing speed of the substrate passing through the transport path is 10 to 100 mm / second.
[0020]
  Invention of Claim 13 is a board | substrate washing | cleaning apparatus used for the chip mounting method of Claim 1,
  For the substrate before the adhesive is appliedVibrated with ultrasonic wavesAir blowByAir blow cleaning means for cleaning,
  Plasma cleaning means for performing plasma cleaning on the air blown substrate;
  A substrate transfer means for transferring and moving the substrate across the air blow cleaning means and the plasma cleaning means is provided.
[0021]
Claim 14The invention according to claim 2 is a substrate cleaning apparatus used in the chip mounting method according to claim 2, wherein the substrate is cleaned by wiping and cleaning the substrate before the adhesive is attached, A plasma cleaning unit that performs plasma cleaning, and a substrate transfer unit that transfers and moves the substrate across the wiping cleaning unit and the plasma cleaning unit are provided.
[0022]
  Invention of Claim 15 is a board | substrate washing | cleaning apparatus used for the chip | tip mounting method of Claim 3, Comprising:
  For the substrate before the adhesive is appliedVibrated with ultrasonic wavesAir blowByAir blow cleaning means for cleaning,
  Wiping and cleaning means for wiping and cleaning the air blown substrate,
  Plasma cleaning means for performing plasma cleaning on the wiped substrate;
  It is characterized by comprising a substrate transfer means for transferring and moving the substrate over the air blow cleaning means, the wiping cleaning means and the plasma cleaning means.
[0023]
Claim 16The invention described inClaim 14 or Claim 15In the substrate cleaning apparatus described above, the wiping / cleaning means is provided separately for wiping / cleaning the substrate surface and for wiping / cleaning the back surface of the substrate.
[0024]
Claim 17The invention described inClaims 14 to 16In the substrate cleaning apparatus according to any one of the above, the wiping cleaning means cleans the substrate by causing the nonwoven fabric to act on the substrate while winding the nonwoven fabric in the direction opposite to the traveling direction of the substrate.
[0025]
Claim 18The invention described inClaims 13 to 17In the substrate cleaning apparatus according to any one of the above, the substrate transport unit transports the substrate at a constant speed, and the cleaning units are arranged adjacent to each other along the substrate transport path.
[0026]
Claim 19The invention described inClaim 18In the substrate cleaning apparatus, the substrate transport unit transports the substrate at a speed of 10 to 100 mm / second.
[0027]
[Action]
The operation of the present invention is as follows.
That is, according to the first aspect of the present invention, dirt such as dust and dirt adhering to the substrate is removed by performing air blow cleaning on the substrate before adhering the adhesive to the substrate. The Thereafter, by performing a plasma cleaning process, dirt such as an organic film or an oxide film that could not be removed in the air blow cleaning process is decomposed and removed. Therefore, dust and dirt adhering to the substrate at the time of mounting are removed, and the chip is mounted on the substrate with high quality.
[0028]
According to the second aspect of the present invention, the dirt such as dust and dust adhering to the substrate is removed by wiping and cleaning the substrate before attaching the adhesive to the substrate. Thereafter, by performing a plasma cleaning process, dirt such as an organic film or an oxide film that could not be removed in the wiping cleaning process is decomposed and removed. Therefore, dust and dirt adhering to the substrate at the time of mounting are removed, and the chip is mounted on the substrate with high quality.
[0029]
According to the third aspect of the present invention, the dust blown or dust attached to the substrate is performed by performing air blow cleaning on the substrate and then wiping and cleaning before adhering the adhesive to the substrate. Dirt is removed. Thereafter, by performing a plasma cleaning process, dirt such as an organic film or an oxide film that could not be removed in the air blow cleaning process and the wiping cleaning process is decomposed and removed. Therefore, dust and dirt adhering to the substrate at the time of mounting are effectively removed, and the chip is mounted on the substrate with higher quality.
[0030]
According to the invention described in claim 4, in the substrate cleaning process, each cleaning process is arranged adjacently along the transport path of the substrate, and the cleaning process is sequentially performed on the substrate passing through the transport path at a constant speed. As a result, the substrate is efficiently cleaned.
[0031]
According to the fifth aspect of the present invention, dust and dirt attached to the substrate are peeled off by blowing out the vibrated air, and the dust and dirt etc. removed by air are sucked out by sucking the blown-out air. At the same time, suck out.
[0032]
According to the invention described in claim 6, since the nonwoven fabric is allowed to act on the substrate while winding the strip-shaped nonwoven fabric impregnated with the cleaning liquid, the wiping and removing of dust powder and dust dust adhering to the substrate can be performed. It is done efficiently. Also, dust powder captured by the nonwoven fabric does not reattach to the substrate.
[0033]
According to the seventh aspect of the invention, since the nonwoven fabric is applied to both the front and back surfaces of the substrate, both the front and back surfaces of the substrate are efficiently cleaned.
[0034]
According to the invention described in claim 8, since the individual nonwoven fabrics are respectively applied to the front and back surfaces of the substrate, dust powder and dirt on the back surface of the substrate are not attached to the substrate surface, and the reverse phenomenon does not occur.
[0035]
According to the ninth aspect of the present invention, since the nonwoven fabric is acted on the substrate while washing the nonwoven fabric in the direction opposite to the traveling direction of the substrate, the substrate is always cleaned with a clean nonwoven fabric that is not soiled. Is done.
[0036]
According to the tenth aspect of the present invention, since plasma is generated under atmospheric pressure, it is easier to perform plasma cleaning while transporting the substrate than in the case of generating plasma in a vacuum.Further, preferably, in the plasma cleaning step, the substrate is cleaned by generating a plasma by applying a voltage in the gas passage tube under atmospheric pressure. With this configuration, since plasma is generated by applying a voltage in the gas passage tube under atmospheric pressure, the substrate is cleaned by applying only the plasma to the substrate without applying a charge voltage to the substrate. .
[0038]
Claim 11According to the invention described in (1), the glass substrate is effectively cleaned before the adhesive is attached, and the chip is mounted on the glass substrate with high quality.
[0039]
Claim 12According to the invention described in, since the cleaning process is performed while the substrate is transported at a speed of 10 to 100 mm / second, the substrate is effectively and efficiently cleaned.
[0040]
Claim 13According to the invention described in the above, air blow cleaning and plasma cleaning are performed in that order on the substrate before adhesion of the adhesive by the substrate cleaning apparatus provided with the air blow cleaning means and the plasma cleaning means.
[0041]
Claim 14According to the above-described invention, the substrate cleaning apparatus including the wiping cleaning unit and the plasma cleaning unit performs the wiping cleaning and the plasma cleaning on the substrate before the adhesive is adhered in that order.
[0042]
Claim 15According to the invention described in (1), the substrate cleaning apparatus provided with the air blow cleaning means, the wiping cleaning means, and the plasma cleaning means can perform the air blow cleaning, the wiping cleaning, and the plasma cleaning on the substrate before the adhesion of the adhesive. It is done in order.
[0043]
Claim 16According to the invention described in (1), the front and back surfaces of the substrate are individually cleaned using two wiping cleaning means for wiping and cleaning the substrate surface and for wiping and cleaning the substrate back surface.
[0044]
Claim 17According to the invention described in (2), the substrate is cleaned by causing the nonwoven fabric to act on the substrate while winding the nonwoven fabric in the direction opposite to the traveling direction of the substrate.
[0045]
Claim 18According to the invention described in (1), each cleaning means arranged adjacently along the transport path sequentially performs each cleaning process on the substrate being transported at a constant speed by the substrate transport means.
[0046]
Claim 19According to the invention described in, since the cleaning process is performed while the substrate is transported at a speed of 10 to 100 mm / second, the substrate is effectively and efficiently cleaned.
[0047]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
FIG. 1 is a process diagram showing an embodiment of a chip mounting method according to the present invention.
The chip mounting method according to the present embodiment is roughly divided into a substrate cleaning step S1 for cleaning the substrate, an adhesive attaching step S2 for attaching an adhesive to the cleaned substrate, and a chip on the substrate to which the adhesive is attached. It consists of chip joining process S3 to join.
[0048]
The substrate cleaning step S1 includes an air blow cleaning step S11 for performing air blow cleaning on the substrate, a wiping cleaning step S12 for performing wiping cleaning on the substrate subjected to air blow cleaning, and a plasma for the substrate subjected to wiping cleaning. It is composed of a plasma cleaning step S13 for performing cleaning, and the substrate is transported and moved through the air blow cleaning step S11, the wiping cleaning step S12, and the plasma cleaning step 13, thereby performing air blow cleaning, wiping cleaning and plasma cleaning on the substrate. Are to be performed continuously.
[0049]
In the air blow cleaning step S11, a method is preferred in which air is blown to the substrate from the air blowing part to blow off the dust, and air and dust are sucked from the suction part. Thereby, it is possible to prevent the dust that has been blown off from reattaching to the substrate. Further, if the air blowing part is provided with means for vibrating the air (for example, ultrasonic wave generating means), dust can be more efficiently removed by blowing the air oscillated from the air blowing part onto the substrate.
[0050]
In the wiping / cleaning step S12, for example, dust adhered to the substrate is wiped off with a cloth or a cloth impregnated with a cleaning liquid. At this time, it is preferable to wipe off the dust while winding the belt-shaped cloth because the dust captured by the cloth does not reattach to the substrate. Further, it is preferable to wipe and clean the front and back surfaces of the substrate using individual cloths, because dust and dirt on the back surface of the substrate do not adhere to the substrate surface and vice versa.
[0051]
In the plasma cleaning step S13, plasma cleaning performed under atmospheric pressure is preferable in order to perform plasma processing while transporting the substrate. As a plasma cleaning process performed under atmospheric pressure, for example, there is a method of generating plasma by applying a voltage in a gas passage tube under atmospheric pressure. According to this method, by passing air or gas through the passage tube, only plasma is supplied to the substrate without applying a charge voltage to the substrate, thereby removing dirt (for example, organic film, oxide film, etc.) adhering to the substrate. can do.
[0052]
In the air blow cleaning step S11 described above, relatively large dust (for example, dust powder) is removed, and in the wiping cleaning step S12, dust smaller than the dust removed in the air blow cleaning step S11 (for example, fine particles such as glass dust). Remove dust). If the cleaning process is performed in the order of the wiping cleaning process S12 and the air blow cleaning process S11, relatively large dust such as dust is not yet removed at the stage of the wiping cleaning process S12. There is a risk of scratching the substrate. Therefore, the cleaning process is performed in the order of the air blow cleaning step S11 and the wiping cleaning step S12.
[0053]
Further, in the plasma cleaning step S13, dirt such as an organic film or an oxide film is removed by plasma by carbon decomposition or oxygen decomposition. Therefore, after removing dust in the air blow cleaning step S11 or the wiping cleaning step S12, the plasma cleaning step S13 is performed. Is arranged.
[0054]
In the adhesive attaching step S2, an adhesive (for example, ACF (Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste), NCF (Non Conductive Film), NCP (Non Conductive Paste), etc.) is transferred or applied to the substrate.
[0055]
In the chip bonding step S3, the chip and the substrate are aligned using the recognition means, and the temporary pressure bonding step S31 for mounting the chip on the substrate with low heating and low pressure, and the bonding between the chip and the substrate with high heating and high pressure. It consists of this press-bonding process S32 which hardens an agent and fixes a chip | tip and a board | substrate.
[0056]
The “chip” in the present invention refers to, for example, a film chip, a film tape carrier package, an IC chip, a semiconductor chip, an optical element, a surface mount component, a chip, a wafer, etc. All forms of the side are shown.
[0057]
In addition, the “substrate” in the present invention refers to all forms on the side to be bonded to the chip regardless of the type and size, such as a resin substrate, a glass substrate, a film substrate, a chip, and a wafer.
[0058]
Furthermore, “bonding” in the present invention means a wide concept such as a mount for mounting a chip on a substrate, bonding having a heating and pressing process, and the like.
[0059]
Hereinafter, a substrate cleaning apparatus used in a substrate cleaning process which is a main part of the present invention will be described.
FIG. 2 is an overall perspective view showing a schematic configuration of the substrate cleaning apparatus according to the embodiment in which the respective cleaning means are integrated.
[0060]
As shown in FIG. 2, the substrate transport means 7 includes an arm 2 that can be controlled to translate in the X direction, a lifting table 3 that can be controlled to move up and down, a rotary table 4 that can be controlled to rotate, and a translation that can be controlled to translate in the Y direction. The table 5 (hereinafter, the symbols 3, 4, and 5 are collectively referred to as “movable table 6”) and the substrate holder 1 are configured.
[0061]
The substrate holding portion 1 is fixed to the tip of the arm 2 and has a suction hole on the substrate holding surface side. Further, the suction holes are connected to a vacuum pump via a pressure hose (both not shown), and are arranged in a form in which the substrate 8 can be sucked and removed by vacuum suction.
[0062]
A plurality of substrates 8 are set in each of the substrate supply units 9a and 9b, and after the movable table 6 moves so that the substrate holding unit 1 comes to the front position of the substrate supply unit 9a, the arm 2 It is comprised so that it may extend in the board | substrate supply unit 9a direction.
[0063]
After the substrate holding unit 1 reaches the lower surface portion of the substrate 8 set inside the substrate supply units 9a and 9b, the arm 2 stops, and the substrate 8 is sucked and held by the substrate holding unit 1 having the suction holes. In the state, the arm 2 moves in the contracting direction to take out the substrate 8 from the substrate supply unit 9a.
[0064]
An air blow cleaning means 13, a wiping cleaning means 22, and a plasma cleaning means 25 are adjacently arranged in that order along the transport path of the substrate 8. The substrate 8 taken out from the substrate supply unit 9a is held in an adsorbed state by the substrate transport unit 7 in parallel with the air blow cleaning unit 13 so that the cleaning processes are performed in the order of the cleaning units 13, 22, and 25. Moved. At the time of parallel movement, the substrate 8 is moved and fixed so that each cleaning process is appropriately performed on the chip mounting position portion of the substrate 8 (see reference numeral 28a in FIG. 6).
[0065]
The ultrasonic air blowing port surface of the ultrasonic air blowing unit 10 in the air blow cleaning unit 13, the press guides 18 and 19 in the wiping cleaning unit 22, and the plasma blowing port surface of the plasma cleaning unit 23 in the plasma cleaning unit 25 have the same height. When the substrate 8 held by the substrate transport means 7 passes through the cleaning means 13, 22, 25 while moving in parallel, the substrate is kept in the same height position. Can be made. Therefore, when the size of the substrate 8 is large so as to straddle the adjacent cleaning means, cleaning by the cleaning means 13, 22 and 25 can be performed simultaneously.
[0066]
FIG. 3 shows the configuration of the air blow cleaning means 13. The air blow cleaning means 13 is arranged in a form in which the ultrasonic air blow unit 10 is fixed by the support member 12. Further, the inside of the ultrasonic air blow unit 10 is divided into an ultrasonic air blowing port 33 and a dust suction port 34, the tip of the pressure hose 11a is the ultrasonic air blowing port 33, and the other end of the hose 11a is the blowing air. Connected to the pump. The tip of the pressure hose 11b is connected to the dust suction port 34, and the other end of the hose 11b is connected to the suction air pump.
[0067]
When the substrate 8 held by the substrate transport means 7 moves in parallel and reaches the ultrasonic air blow unit 10, the air is blown by the pressure hose 11a and the air vibration means 29 (for example, an ultrasonic generation unit), and the air is vibrated. Vibration air (for example, ultrasonic air) is blown from the vibrating air outlet 33, and at the same time, air is sucked by the pressure hose 11b.
[0068]
Since the substrate 8 passes through the lower surface of the ultrasonic air blow unit 10 while continuing to move in parallel at a constant speed, the dust powder 30 attached to the chip mounting position of the substrate 8 by blowing the ultrasonic air 31 from the blowout port 33. Then, the dust powder 30 that has been peeled off is sucked together with the air 32 through the suction port 34. Accordingly, the dust powder 30 is removed without scattering to the surroundings, and the substrate 8 continues to move in the direction of the wiping / cleaning means 22.
[0069]
FIG. 4 shows the configuration of the wiping / cleaning means 22. For example, a wiping tape 21 such as a strip nonwoven fabric tape is held by the supply roller 14. The tape 21 includes a presser guide 18 that can be lifted and lowered, a roller 17 that can be controlled to move in parallel, a presser guide 19 that can be lifted and lowered, a controllable drive roller 16 for feeding the tape 21, and a winding for winding the tape 21. They are set in order of the path of the take-up roller 15.
[0070]
The holes provided in the presser guides 18 and 19 are connected to a cleaning liquid supply hose 20, respectively, and the cleaning liquid is supplied to each fixed amount by a cleaning liquid device (not shown) connected to the other end of the hose 20. At this time, the cleaning liquid is not always supplied, and the supply / supply stop control of the cleaning liquid is performed based on, for example, one substrate or the passage time of the substrate. Then, the cleaning liquid supplied by the hose 20 penetrates the tape 21 through the holes of the press guides 18 and 19.
[0071]
After completion of the cleaning by the air blow cleaning means 13, when the substrate 8 reaches the wiping cleaning means 22, the state between the presser guides 18 and 19 is opened so that the thickness of the substrate 8 can pass (the guide 18 is raised, the guide 19 is in a lowered state), the guide 18 is lowered, and the guide 19 is raised to lightly remove the part on which the chip of the substrate 8 is mounted (the part to be wiped off dust like symbol 28a in FIG. 6). Pinch. At this time, the roller 17 is adjusted and fixed at a position where the edge of the substrate 8 does not contact.
[0072]
The substrate 8 held by the substrate transfer means 7 continues to move at a constant speed while being lightly sandwiched between the guides 18 and 19. That is, the wiping tape 21 is sandwiched between the front surface of the guide 18 and the substrate 8 and between the back surface of the guide 19 and the substrate 8, and the peripheral portion of the sandwiched tape 21 is supplied with the cleaning liquid. Since the supply of the cleaning liquid is controlled by the hose 20 for each fixed amount, the substrate 8 continues to move in parallel with the fixed amount of the cleaning liquid infiltrated. Accordingly, the dust 21 (for example, fine dust such as glass dust) that could not be cleaned by the air blow cleaning means 13 is wiped off with the tape 21 soaked with the cleaning liquid.
[0073]
When the substrate 8 finishes passing between the guides 18 and 19, the dust wiping operation is completed. As a preparation for wiping the next substrate, the guide 18 is raised and the guide 19 is lowered so that the thickness of the next substrate can pass. Winding to the winding roller 15 side. At this time, the feed amount of the tape 21 is fed by an amount such that the dirty portion of the tape 21 does not contact the next substrate. The substrate 8 that has been cleaned by the wiping cleaning unit 22 continues to move in the direction of the plasma cleaning unit 25 by the substrate transfer unit 7.
[0074]
FIG. 5 shows the configuration of the plasma cleaning means 25. The plasma cleaning means 25 is disposed in a form in which a plasma cleaning unit 23 that is a gas passage tube is fixed by a support member 24. Further, the nozzle 47 is provided on the lower surface of the plasma cleaning unit 23, and the plasma blowing port 38 is used to clean the dirt on the organic film or the like on the part of the substrate 8 where the chip is mounted (reference numeral 28a in FIG. 6). The portion is adjusted and fixed at a position where plasma is emitted.
[0075]
When the substrate 8 held by the substrate transport means 7 moves in parallel and reaches the plasma cleaning unit 23, gas or air is supplied from the gas supply hose 48 to the plasma cleaning unit 23. Plasma is generated inside the plasma cleaning unit 23 by the high frequency power supply 49 and the ground 50 provided in the plasma cleaning unit 23. The generated plasma is emitted from the plasma outlet 38 of the nozzle 47 toward the substrate. Since the substrate 8 moves in parallel at a constant speed, the dirt 36 such as an organic film or an oxide film is sequentially removed. At this time, since the high frequency power supply 49 and the ground 50 are provided in the plasma cleaning unit 23, only the plasma is discharged to the substrate, and the charge voltage is not applied to the substrate.
[0076]
Further, when the dirt attached to the substrate is an organic film, the dirt is removed (carbon is decomposed) by supplying a gas such as nitrogen, helium, argon, oxygen from the gas supply hose 48, and the dirt is an oxide film. In this case, the gas supply hose 48 removes dirt (decomposes oxygen) by supplying a gas such as nitrogen, helium, argon, or hydrogen. At this time, the gas to be supplied may be arbitrarily selected according to the conditions of the substrate, or both may be selected, or a gas other than those described above that removes dirt adhering to the substrate may be selected.
[0077]
When the substrate 8 finishes passing through the plasma cleaning unit, the plasma cleaning operation is completed and the emission of the plasma 37 is stopped. The substrate 8 that has been cleaned by the plasma cleaning unit 25 continues to move in the direction of the movable table 26 by the substrate transfer unit 7.
[0078]
When the substrate 8 held by the substrate transport means 7 completes the parallel movement to the end of the parallel movement table 5 (before the movable table 26), the rotary table 4 controls the rotation table 90 to the movable table 26 side, and then the lifting table 3 is moved. The substrate 8 controlled and held by the substrate holder 1 is mounted on the movable table 26.
[0079]
At this time, as shown in FIG. 6, if only one side of the chip mounting position 28 a on the substrate 8 is only one side, the cleaning process in the substrate cleaning device 27 is completed, and the substrate transport means 7 is moved by the movable table 6 to the substrate supply unit 9 a. After moving to the front position (after returning), the arm 2 extends in the direction of the substrate supply unit 9a, takes out the next substrate, and repeats the cleaning operation. Further, the cleaning process completed substrate remaining on the movable table 26 is adhered to the substrate by a transfer arm (not shown). Non Conductive Paste) etc.) is transferred to the work line after the adhesive attaching process for transferring or applying.
[0080]
In addition, as shown in FIG. 7, when there are a plurality of chip mounting positions on the substrate 8, for example, when the chips must be mounted on all sides of the substrate, such as 28b, 28c, 28d, etc. in addition to the chip mounting position 28a, Since the same cleaning process must be performed on a portion where the cleaning process is not performed, the movable table 26 on which the substrate 8 is mounted rotates. For example, as shown in FIG. 7, when a cleaning process is required on all sides of the substrate, the substrate is rotated 90 degrees to change the orientation of the substrate. After that, it is again held by suction by the substrate holder 1 of the substrate transport means 7.
[0081]
After the substrate 8 held by the substrate transfer means 7 is moved to the air blow cleaning means 13 by the movable table 6 (after returning), the air blow cleaning means 13, the wiping cleaning means 22, and the plasma cleaning, which are the same cleaning steps, are performed. A cleaning process is performed by the means 25, and the cleaning process completion substrate is mounted on the movable table 26. Then, after the direction of the substrate is changed by the rotation control of the movable table 26, the substrate is again held by the substrate transfer means 7, and moved to the air blow cleaning means 13 to perform the cleaning process.
[0082]
That is, the cleaning process is completed after the cleaning process is repeated by the number of the plurality of sides that require the cleaning process on the substrate 8. Then, the cleaning process completed substrate mounted on the movable table 26 is adhered to the substrate by a transfer arm (not shown), such as an adhesive (for example, ACF (Anisotropic Conductive Film), ACP (Anisotropic Conductive Paste), NCF (Non Conductive Film), (Non Conductive Paste) etc.) is transferred to the work line after the adhesive attaching process for transferring or applying.
[0083]
As described above, an adhesive such as ACF or ACP is applied or applied to the substrate, and then the chip and the substrate are aligned, and then temporary bonding and main bonding are performed.
[0084]
The substrate transfer means 7 holding the substrate 8 passes through the air blow cleaning means 13, the wiping cleaning means 22 and the plasma cleaning means 25 at a constant speed. The moving speed at this time is arbitrarily determined depending on the substrate conditions and the like. Although selected, generally, a mode in which the substrate is moved at a speed of 10 to 100 mm / second is preferable.
[0085]
The present invention is not limited to the above-described embodiments, and can be modified as follows.
(1) The substrate cleaning process in the chip mounting method according to the present invention is not limited to the air blow cleaning process S11, the wiping cleaning process S12, and the plasma cleaning process S13 arranged in that order as in the embodiment described above. Such a substrate cleaning process may be used.
[0086]
For example, as a substrate cleaning step before the adhesive attaching step, an air blow cleaning step S11 for performing air blow cleaning on the substrate and a plasma cleaning step S13 for performing plasma cleaning on the substrate are arranged in this order, You may make it perform air blow cleaning and plasma cleaning with respect to a board | substrate continuously by conveying and moving a board | substrate over blow cleaning process S11 and plasma cleaning process S13.
[0087]
Alternatively, as a substrate cleaning step before the adhesive attaching step, a wiping cleaning step S12 for performing wiping cleaning on the substrate and a plasma cleaning step S13 for performing plasma cleaning on the substrate are arranged in that order, and the wiping cleaning step. The substrate may be transferred and moved over S12 and the plasma cleaning step S13, so that the substrate is continuously wiped and plasma cleaned.
[0088]
(2) Similarly, the substrate cleaning apparatus according to the present invention is not limited to the one provided with the air blow cleaning means 13, the wiping cleaning means 22, and the plasma cleaning means 25 as in the above-described embodiment apparatus. A simple substrate cleaning apparatus may be used.
[0089]
For example, air blow cleaning means 13 for performing air blow cleaning on the substrate before the adhesive is attached, plasma cleaning means 25 for performing plasma cleaning on the air blow cleaned substrate, air blow cleaning means 13 and plasma cleaning means. 25 may be a substrate cleaning apparatus provided with substrate transport means 7 for transporting and moving the substrate.
[0090]
Alternatively, the wiping cleaning means 22 for wiping and cleaning the substrate before the adhesive is attached, the plasma cleaning means 25 for performing plasma cleaning on the wiping cleaned substrate, the wiping cleaning means 22 and the plasma cleaning means 25 over the substrate. It may be a substrate cleaning apparatus provided with a substrate transfer means 7 for transferring and moving the substrate.
[0091]
(3) The substrate holding unit 1 in the substrate transfer means 7 holds the chip by not only the suction holding means by the suction holes but also the electrostatic holding means by static electricity, the magnetic holding means by magnets or magnetism, or a plurality or a single movable claw. Alternatively, any holding means such as a mechanical means for holding down may be used.
[0092]
(4) In the case of a substrate on which a chip is mounted at a position such as the central portion of the substrate, the substrate is held by devising the shape of the substrate holder 1 to be a U-shaped substrate holder 39 as shown in FIGS. The central portion may be in a form that can be cleaned, or may be in another form. As shown in FIGS. 8 to 14, the substrate holding means includes an adsorption holding means (see FIG. 8) using an adsorption hole 40, an electrostatic holding means using static electricity, etc., and a magnetic holding means using a magnet (magnetism) 41 (see FIG. 9). ), Mechanical means for sandwiching the substrate 8 by a plurality of movable claws 42 (see FIG. 10), mechanical means for pressing the substrate 8 by a single movable claw 42 (see FIG. 11), mechanical means by claws, clips 43, etc. 12), adhesive holding means (see FIG. 13) using a peelable adhesive tape, adhesive 44, etc., mechanical means (see FIG. 14) sandwiched by a plurality of U-shaped substrate holders 39, etc. It may be provided in the form.
[0093]
(5) Further, the air blow cleaning means 13 may be provided with ultrasonic air blow units 10 for the front surface and the back surface so that both front and back surfaces of the substrate 8 can be cleaned as shown in FIG. Good.
[0094]
(6) As shown in FIG. 16, the plasma cleaning means 25 may have a form in which the front and back plasma cleaning portions 23 are provided so that both front and back surfaces of the substrate 8 can be cleaned.
[0095]
(7) The wiping / cleaning means 22 is not only provided in a single body type in which the front and back surfaces of the substrate are wiped by the guides 18 and 19, but also in two types, such as for the substrate surface and for the substrate back surface as shown in FIG. You may comprise in forms other than one body type like the form which isolate | separated. Such a configuration is preferable because dust and dirt adhering to the back surface of the substrate do not adhere to the substrate surface and vice versa. Further, during wiping, the tape 21 may be passed through the substrate in a fixed state. However, it is preferable that the tape 21 is driven in the direction opposite to the traveling direction of the substrate, and the portion of the tape is always wiped off.
[0096]
(8) The wiping tape 21 used for the wiping / cleaning means 22 is preferably in a form in which a belt-shaped non-woven fabric is impregnated with a cleaning liquid, but may be in a form in which the cleaning liquid is not impregnated. If it is, tapes other than a nonwoven fabric may be sufficient.
[0097]
(9) The unit of the wiping and cleaning means 22 is fixed to the substrate cleaning device 27. However, the entire unit may be arranged in any operation mode such as parallel movement control, rotation control, and elevation control. The substrate holding part 1 is not only fixed to the arm 2 but also in any form such as being provided in a form that can be rotated and controlled by a rotary table 46 or the like as shown in FIG. It may be provided. Further, the form of the air blow cleaning means 13 is not limited to the form in which the ultrasonic air blow unit 10 is fixed to the support member 12, and the air blow cleaning means 13 as a whole is controlled in parallel movement, rotation control, elevation control, etc. You may arrange | position in such an operation | movement form. The form of the plasma cleaning means 25 is the same as that of the ultrasonic cleaning means 13.
[0098]
(10) Although the ultrasonic air blowing port 33 is disposed in the central portion of the ultrasonic air blow unit 10 and the dust suction port 34 is disposed on both sides thereof, the ultrasonic air is blown out from both sides and from the central portion. Any form may be used as long as the dust powder 30 can be cleaned without being scattered around, such as a form for sucking dust.
[0099]
(11) An adhesive for mounting the chip on the substrate is an anisotropic conductive film such as ACF or ACP (the anisotropic conductive film is conductive in the thickness direction of the film and insulative in the surface direction). The conductive film is not limited to a normal conductive film (isotropic conductive film) or an insulating adhesive. In the case of an insulating adhesive, it may be necessary to mechanically connect the chip and the substrate electrically when the chip is mounted on the substrate. In addition to transferring or applying the adhesive to the substrate, the method of attaching the adhesive to the substrate, such as dropping the adhesive on the substrate, is not particularly limited.
[0100]
(12) The chip is bonded to the substrate by temporary pressure bonding and main pressure bonding, but the chip may be bonded to the substrate only by main pressure bonding without performing temporary pressure bonding. If the chip can be bonded to the substrate, pressure bonding is performed. It is not limited to.
[0101]
【The invention's effect】
As described in detail above, according to the chip mounting method of the first aspect of the present invention, the air blow cleaning and the plasma cleaning are sequentially performed on the substrate before the adhesive is adhered to the substrate, and the substrate is adhered to the substrate. Since dirt such as dust particles, dust particles, organic films and oxide films has been removed, the chip can be mounted on the substrate with high quality. In other words, it is possible to eliminate defects such as poor adhesion between the chip and the substrate and poor electrical connection due to dirt adhering to the substrate, misalignment between the chip and the substrate, and scratches on the chip and the substrate. it can. In addition, since the substrate is transported and moved over the air blow cleaning process and the plasma cleaning process, air blow cleaning and plasma cleaning are continuously performed on the substrate, so that the contamination of the substrate can be efficiently removed. it can.
[0102]
According to the chip mounting method of the second aspect of the present invention, before the adhesive is attached to the substrate, the substrate is cleaned by wiping and plasma cleaning in that order, so that the contamination of the substrate is removed. Similar to the invention, the chip can be mounted on the substrate with high quality. Moreover, the contamination of the substrate can be efficiently removed.
[0103]
According to the chip mounting method of the third aspect of the present invention, before the adhesive is attached to the substrate, the substrate is subjected to air blow cleaning, wiping cleaning, and plasma cleaning in that order to remove the dirt on the substrate. Therefore, the chip can be mounted on the substrate with higher quality than in the case of the first and second aspects. Moreover, the contamination of the substrate can be efficiently removed.
[0104]
According to the chip mounting method of the invention of claim 4, each cleaning step is arranged adjacently along the substrate transfer path, and the cleaning process is sequentially performed on the substrate passing through the transfer path at a constant speed. The substrate can be efficiently cleaned.
[0105]
According to the chip mounting method of the invention of claim 5, dust and dirt attached to the substrate are peeled off by blowing out the vibrated air, and the dust and dirt removed by sucking the air are removed. Since it is sucked and discharged together with air, dust and dirt can be removed without scattering to other parts.
[0106]
According to the chip mounting method of the invention described in claim 6, since the nonwoven fabric is allowed to act on the substrate while winding the strip-shaped nonwoven fabric impregnated with the cleaning liquid, dust dust and dirt adhering to the substrate Can be efficiently removed. Moreover, dust particles captured by the nonwoven fabric do not reattach to the substrate.
[0107]
According to the chip mounting method according to the seventh aspect of the invention, since the nonwoven fabric is applied to both the front and back surfaces of the substrate, the front and back surfaces of the substrate can be efficiently cleaned.
[0108]
According to the invention described in claim 8, since individual nonwoven fabrics are made to act on the front and back surfaces of the substrate, dust powder and dirt on the back surface of the substrate adhere to the substrate surface, and the reverse phenomenon is suppressed. The substrate can be cleaned well.
[0109]
According to the ninth aspect of the invention, since the nonwoven fabric is applied to the substrate and cleaned while winding the nonwoven fabric in the direction opposite to the traveling direction of the substrate, the substrate can be cleaned satisfactorily.
[0110]
According to the chip mounting method of the tenth aspect of the present invention, since plasma is generated under atmospheric pressure, plasma cleaning can be easily performed as compared with the case where cleaning is performed by generating plasma in a vacuum. it can.Further, preferably, in the plasma cleaning step, the substrate is cleaned by generating a plasma by applying a voltage in the gas passage tube under atmospheric pressure. With this configuration, since a plasma is generated by applying a voltage in the gas passage tube under atmospheric pressure, it is not necessary to apply a charge voltage to the substrate, and as a result, the substrate is destroyed by the charge voltage. (For example, peeling or destruction of a circuit pattern or the like on the substrate) can be prevented.
[0112]
Claim 11According to the chip mounting method of the invention, the chip can be mounted on the glass substrate with high quality.
[0113]
Claim 12According to the chip mounting method according to the invention, since the cleaning process is performed while the substrate is conveyed at a speed of 10 to 100 mm / sec, the substrate can be effectively and efficiently cleaned.
[0114]
Claim 13According to the substrate cleaning apparatus of the invention, since the substrate is transported and cleaned across the air blow cleaning means and the plasma cleaning means, the substrate cleaning process can be performed efficiently without manual intervention.
[0115]
Claim 14According to the substrate cleaning apparatus of the invention, since the substrate is transported and cleaned across the wiping cleaning means and the plasma cleaning means, the substrate cleaning process can be efficiently performed without human intervention.
[0116]
Claim 15According to the substrate cleaning apparatus of the invention, since the substrate is transported and cleaned across the air blow cleaning means, the wiping cleaning means, and the plasma cleaning means, the substrate cleaning process can be efficiently performed without human intervention. Can do.
[0117]
Claim 16According to the substrate cleaning apparatus of the present invention, the front and back surfaces of the substrate are individually cleaned using the two wiping cleaning means for wiping and cleaning the substrate surface and for wiping and cleaning the back surface of the substrate. Dirt adheres to the substrate surface and the reverse phenomenon is suppressed, and the substrate can be cleaned well.
[0118]
Claim 17According to the substrate cleaning apparatus of this invention, the nonwoven fabric is allowed to act on the substrate while winding the nonwoven fabric in the direction opposite to the traveling direction of the substrate, so that the substrate can be cleaned satisfactorily.
[0119]
Claim 18According to the substrate cleaning apparatus of this invention, since each cleaning means is arranged adjacently along the transport path, the substrate cleaning process can be efficiently performed with a compact apparatus.
[0120]
Claim 19Since the cleaning process is performed while the substrate is transported at a speed of 10 to 100 mm / sec, the substrate can be cleaned effectively and efficiently.
[Brief description of the drawings]
FIG. 1 is a process diagram of a chip mounting method according to an embodiment.
FIG. 2 is an overall perspective view illustrating a schematic configuration of a substrate cleaning apparatus according to an embodiment.
FIG. 3 is a perspective view showing a configuration of an air blow cleaning means according to the present embodiment.
FIG. 4 is a perspective view illustrating a configuration of a wiping cleaning unit according to the present embodiment.
FIG. 5 is a perspective view showing the configuration of the plasma cleaning means according to the present embodiment.
FIG. 6 is a diagram showing a holding state of the substrate when the chip mounting position is a single side.
FIG. 7 is a diagram showing a holding state of the substrate when the chip mounting position is a plurality of sides.
FIG. 8 is a diagram illustrating a configuration of a substrate holding unit according to a modified example.
FIG. 9 is a diagram illustrating a configuration of a substrate holding unit according to another modification.
FIG. 10 is a diagram illustrating a configuration of a substrate holding unit according to another modification.
FIG. 11 is a diagram illustrating a configuration of a substrate holding unit according to another modification.
FIG. 12 is a diagram illustrating a configuration of a substrate holding unit according to another modification.
FIG. 13 is a diagram illustrating a configuration of a substrate holding unit according to another modification.
FIG. 14 is a diagram illustrating a configuration of a substrate holding unit according to another modification.
FIG. 15 is a diagram showing a configuration of air blow cleaning means according to a modification.
FIG. 16 is a diagram showing a configuration of plasma cleaning means according to a modification.
FIG. 17 is a diagram illustrating a configuration of a wiping / cleaning unit according to a modification.
FIG. 18 is a diagram illustrating a configuration of a substrate holding unit when configured to be capable of rotation control.
[Explanation of symbols]
7 ... Substrate transfer means
8… Board
13 ... Air blow cleaning means
21… Wiping tape
22 ... Wiping and cleaning means
25 ... Plasma cleaning means
26 ... Movable table
27 ... Substrate cleaning device

Claims (19)

In a chip mounting method comprising an adhesive attaching step for attaching an adhesive to a substrate, and a chip joining step for joining the chip to the substrate to which the adhesive is attached.
Before the adhesive attaching process, an air blow cleaning process for cleaning by air blow oscillated with ultrasonic waves on the substrate,
A substrate cleaning process in which a plasma cleaning process for performing plasma cleaning on a substrate is arranged in that order;
A chip mounting method characterized in that air blow cleaning and plasma cleaning are continuously performed on a substrate by transporting and moving the substrate through an air blow cleaning step and a plasma cleaning step. In a chip mounting method comprising an adhesive attaching step for attaching an adhesive to a substrate, and a chip joining step for joining the chip to the substrate to which the adhesive is attached.
Before the adhesive attaching step, a substrate cleaning step is provided in which a wiping cleaning step for wiping and cleaning the substrate and a plasma cleaning step for plasma cleaning the substrate are arranged in that order.
A chip mounting method characterized by continuously performing wiping cleaning and plasma cleaning on a substrate by transporting and moving the substrate over a wiping cleaning step and a plasma cleaning step. In a chip mounting method comprising an adhesive attaching step for attaching an adhesive to a substrate, and a chip joining step for joining the chip to the substrate to which the adhesive is attached.
Before the adhesive attaching process, an air blow cleaning process for cleaning by air blow oscillated with ultrasonic waves on the substrate,
A wiping cleaning process for wiping and cleaning the substrate and a plasma cleaning process for performing plasma cleaning on the substrate in that order are provided.
A chip mounting method characterized in that air blow cleaning, wiping cleaning and plasma cleaning are successively performed on a substrate by transporting and moving the substrate through an air blow cleaning step, a wiping cleaning step and a plasma cleaning step. In the chip mounting method according to any one of claims 1 to 3,
In the substrate cleaning process, a chip mounting method in which each cleaning process is arranged adjacently along a substrate transfer path, and each cleaning process is sequentially performed on a substrate passing through the transfer path at a constant speed. In the chip mounting method according to claim 1 or 3,
In the air blow cleaning step, a chip mounting method of cleaning the substrate by blowing out the oscillated air toward the substrate and sucking and discharging the blown air. In the chip mounting method according to claim 2 or 3,
In the wiping and cleaning step, a chip mounting method of cleaning the substrate by causing the nonwoven fabric to act on the substrate while winding the strip-shaped nonwoven fabric impregnated with the cleaning liquid. The chip mounting method according to claim 6,
In the wiping cleaning step, a chip mounting method in which a nonwoven fabric is allowed to act on both front and back surfaces of the substrate to clean the substrate. The chip mounting method according to claim 7,
In the wiping and cleaning step, a chip mounting method in which an individual nonwoven fabric is applied to both the front and back surfaces of the substrate to clean the substrate. In the chip mounting method according to any one of claims 6 to 8,
In the wiping cleaning step, a chip mounting method in which the non-woven fabric is wound in the opposite direction to the traveling direction of the substrate In the chip mounting method according to any one of claims 1 to 9,
In the plasma cleaning step, a chip mounting method for cleaning a substrate by generating plasma under atmospheric pressure. In the chip mounting method according to any one of claims 1 to 10,
The chip mounting method, wherein the substrate is a glass substrate. The chip mounting method according to claim 4,
A chip mounting method in which a passing speed of a substrate passing through the transport path is 10 to 100 mm / second. A substrate cleaning apparatus used in the chip mounting method according to claim 1,
Air blow cleaning means for cleaning by air blow oscillated by ultrasonic waves on the substrate before the adhesive is attached;
Plasma cleaning means for performing plasma cleaning on the air blown substrate;
A substrate cleaning apparatus comprising a substrate transfer means for transferring and moving a substrate across an air blow cleaning means and a plasma cleaning means. A substrate cleaning apparatus used in the chip mounting method according to claim 2,
Wiping and cleaning means for wiping and cleaning the substrate before the adhesive is applied;
Plasma cleaning means for performing plasma cleaning on the wiped substrate;
A substrate cleaning apparatus comprising a substrate transfer means for transferring and moving a substrate across a wiping cleaning means and a plasma cleaning means. A substrate cleaning apparatus used in the chip mounting method according to claim 3,
Air blow cleaning means for cleaning by air blow oscillated by ultrasonic waves on the substrate before the adhesive is attached;
Wiping and cleaning means for wiping and cleaning the air blown substrate,
Plasma cleaning means for performing plasma cleaning on the wiped substrate;
A substrate cleaning apparatus comprising a substrate transfer means for transferring and moving a substrate across an air blow cleaning means, a wiping cleaning means, and a plasma cleaning means. The substrate cleaning apparatus according to claim 14 or 15,
The wiping / cleaning means is a substrate cleaning apparatus in which two types of wiping cleaning for the substrate surface and wiping cleaning for the back surface of the substrate are individually provided. The substrate cleaning apparatus according to any one of claims 14 to 16,
The wiping cleaning means is a substrate cleaning apparatus that cleans a substrate by causing the nonwoven fabric to act on the substrate while winding the nonwoven fabric in a direction opposite to the traveling direction of the substrate. The substrate cleaning apparatus according to any one of claims 13 to 17,
The substrate transport means transports the substrate at a constant speed,
And each said washing | cleaning means is a board | substrate cleaning apparatus arrange | positioned adjacently along the conveyance path | route of a board | substrate. The substrate cleaning apparatus according to claim 18,
The substrate transport means is a substrate cleaning apparatus that transports a substrate at a speed of 10 to 100 mm / second.

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