JP4364039B2 - Electronic component mounting device and component supply unit setup change method - Google Patents

Description

  The present invention uses a suction nozzle provided on a mounting head that moves between a component suction position and a component mounting position to suck and take out an electronic component from a component supply unit at the component suction position, and on the printed circuit board at the component mounting position. Further, the present invention relates to an electronic component mounting apparatus for mounting the electronic component and a method for replacing a component supply unit in the electronic component mounting apparatus.

There has been proposed a production system management method for automatically generating an operation program from the result of component placement on a manufacturing apparatus that shortens the setup time in multi-product small-volume production and improving the productivity of the mounting line (for example, Patent Documents) 1).
JP 2000-141174 A

  According to this patent document, based on production plan data, part configuration data, and device data, the arrangement position of parts to the part supply unit is divided into fixed parts that are not set up and general-purpose parts that are set up. The operation program is generated based on the position data of the fixed parts and the general-purpose parts. However, it is necessary to determine the production order of a plurality of types of printed circuit boards within a predetermined period of production before dividing into parts to be set up or not set up.

  Therefore, the present invention calculates the similarity of the component types for each of the plurality of printed circuit board types produced within a predetermined period, determines the printed circuit board to be produced first, and other printed circuit boards excluding the determined printed circuit board Determine the order of production in descending order of similarity based on this first printed circuit board among the seeds, and if necessary according to the determined order, the operator must change the parts supply unit. Thus, it is an object of the present invention to shorten the time required for changing the parts supply unit.

  Therefore, according to the first aspect of the present invention, the electronic component is adsorbed and taken out from the component supply unit at the component adsorbing position by the adsorbing nozzle provided on the mounting head that moves between the component adsorbing position and the component mounting position. In the electronic component mounting apparatus for mounting the electronic component on the printed circuit board, calculation means for calculating the similarity of the component types for each printed circuit board type from mounting data for each of the plurality of printed circuit board types produced within a predetermined period; Determining means for determining the order of production in descending order of similarity based on the first printed circuit board type out of the other printed circuit board types excluding the first printed circuit board type; It is characterized by.

  According to a second aspect of the present invention, an electronic component is picked up from a component supply unit by a suction nozzle provided in a mounting head that moves between a component suction position and a component mounting position, and printed at the component mounting position. In an electronic component mounting apparatus for mounting the electronic component on a board, a calculation means for calculating the similarity of the component types for each printed circuit board type from the mounting data for each of the plurality of printed circuit board types produced within a predetermined period, and production Among the other printed circuit board types, except for the printed circuit board type for which the order to be determined is determined, the next printed circuit board type having a high degree of similarity based on the last printed circuit board type for which the order is determined is produced. Determining means for determining the type of printed circuit board to be provided.

According to a third aspect of the present invention, an electronic component is picked up from a component supply unit by a suction nozzle provided in a mounting head that moves between a component suction position and a component mounting position, and printed at the component mounting position. In the setup change method of the component supply unit in the electronic component mounting apparatus for mounting the electronic component on the substrate,
Calculate the component type similarity for each PCB type from the mounting data for each PCB type produced within a given period,
Determine the type of printed circuit board to be produced first,
Among the other printed circuit board types excluding the determined printed circuit board type, determine the order of production in descending order of similarity based on the first produced printed circuit board type,
If necessary, the component supply unit is replaced in accordance with the determined order.

According to a fourth aspect of the present invention, an electronic component is picked up from a component supply unit by a suction nozzle provided in a mounting head that moves between a component suction position and a component mounting position, and printed at the component mounting position. In the setup change method of the component supply unit in the electronic component mounting apparatus for mounting the electronic component on the substrate,
The calculating means calculates the similarity of the component types for each printed circuit board type from the mounting data for each of the plurality of printed circuit board types produced within a predetermined period,
Determine the type of printed circuit board that the worker will produce first,
The determining means determines the order of production in descending order of similarity based on the printed board type to be produced first among other printed board types excluding the determined printed board type,
When necessary according to the order determined by the determining means, the operator performs setup change of the component supply unit.

  The present invention calculates the similarity of component types for each of a plurality of printed circuit board types produced within a predetermined period, determines a printed circuit board type to be produced first, and prints other than the determined printed circuit board type The order of production is determined in descending order of the degree of similarity based on the first printed circuit board type among the board types, and if necessary according to the determined order, the operator can change the parts supply unit. By doing so, it is possible to shorten the time required for changing the parts supply unit.

  Embodiments of the present invention will be described below with reference to the drawings. First, in the plan view of the electronic component mounting apparatus 5 in FIG. 1, reference numeral 11 denotes a Y table that moves in the Y direction by driving a Y axis drive motor 12, and 13 denotes a Y table 11 driven by an X axis drive motor 14. The XY table moves in the XY direction as a result of moving in the X direction, and the printed circuit board 9 on which the chip-like electronic component 8 is mounted is fixed and mounted on a fixing means (not shown).

  Reference numeral 17 denotes a component supply table, in which a large number of component supply units 18 as component supply devices for supplying the electronic components 8 are arranged. Reference numeral 19 denotes a supply table driving motor. When the ball screw 20 is rotated, the supply table 17 is guided to the linear guide 22 via the nut 21 fitted to the ball screw 20 and fixed to the supply table 17. Move in the direction. Reference numeral 23 denotes an intermittently rotating rotary table, and mounting heads 25 having a plurality of suction nozzles 24 as take-out nozzles are arranged at equal intervals according to the intermittent pitch on the outer edge of the table 23.

  The stop position due to the intermittent rotation of the rotary table 23 of the mounting head 25 where the suction nozzle 24 sucks and takes out the electronic component 8 from the supply unit 18 is the suction station A, and the mounting head 25 descends at the suction station A. Thus, the suction nozzle 24 sucks and takes out the electronic component 8.

  The position B is a recognition station in which the mounting head 25 that sucks the electronic component 8 stops due to the intermittent rotation of the rotary table 23, and an image of the component 8 is picked up by the component recognition camera 15, and the positional deviation of the component 8 with respect to the suction nozzle 24 occurs. Recognition processing is performed by the recognition processing device 33.

  The position C is a mounting station where the mounting head 25 stops in order to mount the electronic component 8 held by the suction nozzle 24 on the printed circuit board 9, and the XY table 13 moves as the mounting head 25 moves down to a predetermined position. The component 8 is mounted on the printed circuit board 9 stopped at the position.

  Further, as shown in FIG. 2, the mounting head 25 is attached to a linear guide 32 via a head block 31 and is movable up and down with respect to the rotary table 23.

  Reference numeral 26 denotes an elevating lever that moves up and down to oscillate the oscillating lever 27 of the component supply unit 18, and an unillustrated storage wound around the tape supply reel 28 by oscillating the elevating lever 27 at the suction station A The storage tape as a member is fed, and the electronic component 8 stored in the storage tape is supplied to the suction position of the nozzle 24.

  Next, the control block diagram of FIG. 3 will be described. Each electronic component mounting device 5 includes a CPU 40 as a control unit that performs overall control of the mounting device 5 and a RAM connected to the CPU 40 via a bus line. (Random Access Memory) 41 and ROM (Read Only Memory) 42 are provided. Then, based on the data stored in the RAM 41, the CPU 40 follows the program stored in the ROM 42, and the operation relating to the removal and mounting of the electronic component of the electronic component mounting apparatus is performed via the interface 44 and the drive circuit 48. Oversee and control.

  The RAM 41 stores mounting data for each type of printed circuit board 9 related to component mounting. For each mounting order (for each step number), the X direction (indicated by X) in the printed circuit board 9, Y Information of direction (indicated by Y) and angle (indicated by Z), arrangement number information of each component supply unit 18 and the like are stored. The RAM 41 stores information on the types (component IDs) of electronic components corresponding to the component supply unit arrangement numbers (lane numbers) of the component supply units 18 for each type of the printed circuit boards 9, that is, component arrangement information. Further, component library data relating to the size of the electronic component is stored for each component ID.

  A recognition processing device 43 is connected to the CPU 40 via the interface 44. The recognition processing device 43 performs recognition processing of an image captured by the component recognition camera 15, and the processing result is sent to the CPU 40. Is sent out. That is, the CPU 40 outputs an instruction to the recognition processing device 43 so as to perform recognition processing (calculation of the amount of misalignment) of the image captured by the component recognition camera 15 and receives the recognition processing result from the recognition processing device 43. It is.

  That is, when the amount of positional deviation is grasped by the recognition processing of the recognition processing device 43, the result is sent to the CPU 40, and the CPU 40 drives the XY by the Y-axis drive motor 12 and the X-axis drive motor 14 of the previous XY table 13. By moving the printed circuit board 9 in the direction, the suction nozzle 24 used by the pulse motor 47 is rotated by θ, and the rotational angular position around the X and Y directions and the vertical axis is corrected.

  The recognition processing device 43 captures an image captured by the component recognition camera 15, and the captured image is displayed on the CRT 45. The CRT 45 is provided with various touch panel switches 46 as input means for data setting, and various settings can be performed by an operator operating the touch panel switch 46. A keyboard may be used as the input means.

  Here, the setup change operation of the component supply unit 18 will be described with reference to FIGS. First, when the operator operates the touch panel switch 46 and selects the type of the plurality of printed circuit boards 9 to be produced within a predetermined period in the production plan, for example, in the next month, the CPU 40 displays the data on the CRT 45 from the mounting data stored in the RAM 41. Let

  Then, the CPU 40 as the calculation means prints each print from the mounting data for each of a plurality of types of printed circuit boards (seven types from “KB1” to “KB7”) that are produced within the predetermined period stored in the RAM 41. The similarity of the component type for each board type is calculated and displayed on the CRT 45, and the data is stored in the RAM 41.

  In this case, FIG. 5 shows the types of electronic components for each printed circuit board type, excluding the mounting order from the respective mounting data for each printed circuit board type. For example, the board type “KB1” has 10 electronic component types. The electronic component types are “COMP1”, “COMP3”, “COMP4”, “COMP6”, “COMP14”, “COMP15”, “COMP16”, “COMP17”, “COMP18”, “COMP19”, FIG. 6 shows the similarity of the component types for each printed board type calculated from the mounting data for the seven types of printed board types and displayed on the CRT 45. That is, according to FIG. 6, when the board type “KB1” is used as a reference, the similarity of the part type to “KB2” is 60%, “KB3” is 30%, and “KB4” is 40%. "KB5" means 20%, "KB6" means 30%, and "KB7" means 20%.

  Next, the type of printed circuit board to be produced first, that is, the type of printed circuit board to be produced first is determined based on the delivery date (first delivery date). Note that the method of determining the type of printed circuit board to be produced first is not limited to this method, and may be determined automatically. Then, when the determined printed circuit board type is the board type “KB4”, when the operator selects and designates the type (“KB4”) of the printed circuit board 9 using the touch panel switch 46, the first production is performed. The CPU 40 determines the order of production in descending order of similarity based on the first printed circuit board type to be produced among other printed circuit board types excluding the printed circuit board type. That is, the next highest printed board type is produced on the basis of the printed board type whose rank is determined among the board types that are not determined (not determined). The type of substrate to be determined.

  Therefore, next to the substrate type “KB4”, the substrate type “KB3” having the highest similarity of 70% based on this substrate type is determined as the substrate type to be produced. Includes a board type with the highest similarity of 70% based on the board type “KB3” whose rank is determined among the board types excluding the board types “KB4” and “KB3” whose rank is determined. “KB2” is determined. Thereafter, the ranking is similarly determined for the substrate types for which the ranking is not determined, and the production order from the left shown in FIG. 7 is obtained. That is, next to the board type “KB4” is “KB3”, and the order of “KB2”, “KB1”, “KB6”, “KB5”, “KB7” is sequentially determined, and the data is stored in the RAM 41.

  This production order is determined by the CPU 40 provided in the electronic component mounting apparatus, but may be performed by a CPU provided in a computer other than the electronic component mounting apparatus.

  Therefore, when necessary in accordance with the order determined by the CPU 40 in this way, the operator changes the parts supply unit 18. That is, the component supply unit 18 is mounted on the component supply base 17 corresponding to the board type “KB4” to be produced first, but for convenience of explanation, only 18 component supply units 18 are mounted on the component supply base 17. This will be described below.

  When the operator uses the touch panel switch 46 to instruct the change of the setup, the CPU 40 displays the screen shown in FIG. According to this screen, since a maximum of 15 component supply units 18 are mounted on the component supply stand 17, it corresponds to the board type “KB4” (first shown from the left in FIG. 8) to be produced first. The electronic component type “COMP11” corresponding to the ten component supply units 18 from the electronic component types “COMP1” to “COMP10” and the second board type “KB3” (shown second from the left in FIG. 8). ”To“ COMP13 ”and the electronic component types“ COMP14 ”and“ COMP15 ”corresponding to the third board type“ KB2 ”(shown third from the left in FIG. 8). CPU 40 so that the operator can understand that a total of 15 component supply units 18 including the two component supply units 18 are mounted on the component supply base 17. To display in the CRT45.

  Accordingly, the operator sees the screen shown in FIG. 8 and first supplies the 10 component supply units 18 from the electronic component types “COMP1” to “COMP15” (indicated by vertical lines in FIG. 8) to the component supply. Mount on the base 17.

  As described above, when the automatic operation is started after the component supply unit 18 that can supply the electronic component of the component type corresponding to the board type “KB4” to be produced first is mounted on the component supply table 17, The electronic component 8 is mounted on the printed board 9.

  That is, first, the printed board 9 of the board type “KB4” is supplied from the upstream apparatus, is fixed and mounted on the XY table 13 by the fixing means, moves to the mounting position, and the mounting head 25 is the index mechanism of the rotary table 23. When the suction station A is stopped by intermittent rotation via the supply table 17, the supply table 17 is moved by driving the supply table drive motor 19, and the component supply for storing the electronic component 8 to be supplied according to the mounting data stored in the RAM 41. The unit 18 is stopped at the suction position of the suction nozzle 24 of the mounting head 25 of the suction station A, and the electronic component 8 is taken out when the suction nozzle 24 is lowered.

  Next, the rotary table 23 rotates intermittently via the index mechanism, and the mounting head 25 holding the electronic component 8 moves to the next station and stops, and further rotates to the recognition station B. Moving. Then, the electronic component 8 picked up by the suction nozzle 24 is picked up by the component recognition camera 15, and the image is recognized by the recognition processing device 33, and the positional deviation of the electronic component 8 relative to the suction nozzle 24 is recognized.

  Next, when the recognition process is completed, the CPU 40 of the electronic component mounting apparatus 5 calculates the amount to be corrected based on the recognition result in addition to the XY coordinates and mounting angle of the mounting data stored in the RAM 41. At this time, the CPU 40 drives the Y-axis drive motor 12 and the X-axis drive motor 14 by using a pulse motor (not shown) that rotates the suction nozzle 24 and adding the correction amount to the position indicated by the mounting data in the plane direction. By doing.

  Then, the rotary table 23 rotates intermittently to reach the mounting station C, and the electronic component 8 that has finished the angular positioning taking the correction amount into consideration is moved to the XY table 13 to finish the positioning in the plane direction. Install on top.

  In this manner, the electronic components 8 are sequentially picked up and taken out from the various component supply units 18, and the electronic components 8 are mounted on the printed circuit board 9. Then, the printed circuit board 9 on which all the electronic components 8 are mounted is delivered to the downstream device, and the electronic components 8 are mounted on the same type of printed circuit board 9 in the same manner.

  Here, when the production of the printed board 9 of the board type “KB4” is finished, the operator gives an instruction to change the setup using the touch panel switch 46, and the CPU 40 displays the screen shown in FIG. Is displayed. However, as described above, the three component supply units 18 from the electronic component types “COMP11” to “COMP13” corresponding to the board type “KB3” to be produced second are already mounted on the component supply base 17. For this reason, it is not necessary to replace the board type “KB3” here.

  Therefore, when the automatic operation for the board type “KB3” is started, the electronic component 8 is mounted on the printed board 9 as described above. When the production of the printed board 9 of the board type “KB3” is finished, when the operator gives an instruction to change the setup using the touch panel switch 46, the CPU 40 displays the screen shown in FIG.

  That is, for the two component supply units 18 of the electronic component types “COMP16” and “COMP17” corresponding to the third produced board type “KB2” (shown third from the left in FIG. 8), the component supply stand Since they are not mounted on the CPU 17, the CPU 40 displays them on the CRT 45 so that the operator can understand that they are mounted on the component supply base 17. At this time, among the electronic component types “COMP1”, “COMP6”, “COMP8”, “COMP9”, and “COMP13” that are not used for the production of the third board type “KB2”, the fourth product is produced. The component supply unit 18 of the electronic component types “COMP8” and “COMP9” (shown almost black in FIG. 9) not used in the board type “KB1” is removed from the component supply base 17, and instead the electronic component types “COMP16”, “ The CPU 40 displays on the CRT 45 so that the operator can understand that the component supply unit 18 of “COMP 17” (indicated by the vertical line in FIG. 9) is attached.

  Accordingly, the operator sees the screen shown in FIG. 9 and removes the component supply units 18 of the electronic component types “COMP8” and “COMP9” from the component supply base 17, and instead of the electronic component types “COMP16” and “COMP17”. The component supply unit 18 is installed.

  After the above-described setup change operation for the third board type “KB2” is completed, the automatic operation for the board type “KB2” is started. When the electronic component 8 is mounted and the production of the printed circuit board 9 of the third board type “KB2” is finished, the operator instructs the change of the setup using the touch panel switch 46, and the CPU 40 displays the figure on the CRT 45. 10 is displayed.

  That is, for the two component supply units 18 of the electronic component types “COMP18” and “COMP19” corresponding to the substrate type “KB1” to be produced fourth (shown fourth from the left in FIG. 10), the component supply unit Since they are not mounted on the CPU 17, the CPU 40 displays them on the CRT 45 so that the operator can understand that they are mounted on the component supply base 17. At this time, among the electronic component types “COMP2”, “COMP5”, “COMP7” to “COMP13” that are not used for the production of the fourth type of substrate “KB1”, the type of board “ The parts supply unit 18 of electronic component types “COMP2” and “COMP10” (shown almost black in FIG. 10) not used in “KB6”, “KB5”, and “KB7” is removed from the component supply stand 17 and replaced with an electronic component type. The CPU 40 displays on the CRT 45 so that the operator can understand that the component supply units 18 of “COMP18” and “COMP19” (shown by vertical lines in FIG. 10) are attached.

  Accordingly, the operator sees the screen shown in FIG. 10 and removes the component supply units 18 of the electronic component types “COMP2” and “COMP10” from the component supply base 17, and instead of the electronic component types “COMP18” and “COMP19”. The component supply unit 18 is installed.

  After finishing the above-mentioned setup change work for the fourth board type “KB1” to be produced, the production for the board type “KB1” is started. 11 is displayed on the CRT 45 by the CPU 40.

  That is, for the eight component supply units 18 of the electronic component types “COMP20” to “COMP27” corresponding to the substrate type “KB6” produced fifth (shown fifth from the left in FIG. 11), the component supply stand Since they are not mounted on the CPU 17, the CPU 40 displays them on the CRT 45 so that the operator can understand that they are mounted on the component supply base 17. At this time, among the electronic component types “COMP1”, “COMP2”, “COMP5” to “COMP14”, and “COMP16” to “COMP19” which are not used for the production of the fifth board type “KB6”, 6 Electronic component types “COMP1”, “COMP11”, “COMP12”, “COMP13”, “COMP14”, “COMP16”, “COMP17”, “COMP18” which are not used in the board types “KB5” and “KB7” produced after the first time ”(Shown substantially black in FIG. 11) are removed from the component supply base 17, and instead of electronic component types“ COMP 20 ”to“ COMP 7 ”(indicated by vertical lines in FIG. 11) The CPU 40 displays on the CRT 45 so that the operator can understand that the individual component supply units 18 are to be installed. To.

  Accordingly, the operator looks at the screen shown in FIG. 11 and changes the electronic component types “COMP1”, “COMP11”, “COMP12”, “COMP13”, “COMP14”, “COMP16”, “COMP17”, and “COMP18”. Eight component supply units 18 are removed from the component supply stand 17, and instead, eight component supply units 18 of electronic component types "COMP20" to "COMP7" are attached.

  After finishing the above-mentioned setup change work for the fifth board type “KB6”, the production for the board type “KB6” is started. When an instruction for changeover is issued using 46, the CPU 40 displays the screen shown in FIG. 12 on the CRT 45.

  That is, for the three component supply units 18 of the electronic component types “COMP8”, “COMP9”, and “COMP28” corresponding to the substrate type “KB5” produced sixth (shown second from the right in FIG. 12), The CPU 40 displays on the CRT 45 so that the operator can understand that these components are not mounted on the component supply table 17. At this time, among the electronic component types “COMP5”, “COMP6”, “COMP15”, “COMP19”, and “COMP23” that are not used for the production of the sixth board type “KB5”, the seventh product is produced. Three component supply units 18 of electronic component types “COMP6”, “COMP15”, and “COMP19” (shown almost black in FIG. 12) that are not used in the substrate type “KB7” are removed from the component supply stand 17 and replaced with electronic components. The CPU 40 displays on the CRT 45 so that the operator can understand that the three component supply units 18 of the component types “COMP8”, “COMP9”, and “COMP28” (shown by vertical lines in FIG. 12) are attached.

  Accordingly, the operator sees the screen shown in FIG. 12 and removes the three component supply units 18 of the electronic component types “COMP6”, “COMP15”, and “COMP19” from the component supply base 17, and instead of the electronic component types. Three component supply units 18 of “COMP8”, “COMP9”, and “COMP28” are attached.

  After completing the above-described setup change operation for the sixth board type “KB5”, the production for the board type “KB5” is started. When an instruction for changeover is issued using 46, the CPU 40 displays the screen shown in FIG. 13 on the CRT 45.

  That is, for the two component supply units 18 of the electronic component types “COMP29” and “COMP30” corresponding to the seventh board type “KB7” (shown at the rightmost in FIG. 13), the component supply stand 17 Since it is not mounted on the CPU 40, the CPU 40 displays it on the CRT 45 so that the operator can understand that these are mounted on the component supply base 17. At this time, among the electronic component types “COMP7” to “COMP9”, “COMP20” to “COMP22”, “COMP27”, and “COMP28” that are not used for the production of the seventh board type “KB7” Two component supply units 18 of component types “COMP7” and “COMP20” (shown in black in FIG. 13) are removed from the component supply base 17, and instead of electronic component types “COMP29” and “COMP30” (in FIG. 13). The CPU 40 displays on the CRT 45 so that the operator can understand that the two component supply units 18 (shown by vertical lines) are attached.

  Accordingly, the operator looks at the screen shown in FIG. 13 and removes the two component supply units 18 of the electronic component types “COMP7” and “COMP20” from the component supply base 17, and instead of the electronic component types “COMP29”, Two component supply units 18 of “COMP30” are attached.

  After completing the above-described setup change operation for the seventh board type “KB7” to be produced, the production of the board type “KB7” is started. Accordingly, the above-described setup change operation is performed for a plurality of printed boards to be produced within the next predetermined period.

  As described above, after completing the setup change work for the fourth board type “KB1” to be produced, the production for the board type “KB1” is started. When a changeover instruction is given using the touch panel switch 46, the CPU 40 may cause the CRT 45 to display the screen shown in FIG.

  That is, for the eight component supply units 18 of the electronic component types “COMP20” to “COMP27” corresponding to the substrate type “KB6” to be produced fifth (shown third from the right in FIG. 14), the component supply stand 17 Three electronic parts types “COMP8”, “COMP9”, and “COMP28” corresponding to the board type “KB5” (shown second from the right in FIG. 14) that is not mounted on the top are also shown. Since the component supply unit 18 is not mounted on the component supply table 17, the CPU 40 displays it on the CRT 45 so that the operator can understand that these components are mounted on the component supply table 17.

  Therefore, the setup change work for the fifth and sixth board types “KB6” and “KB5” can be performed simultaneously.

  Furthermore, as described above, when the setup change work is performed at the same time, the production of the sixth board type “KB5” is finished, and the operator instructs the setup change using the touch panel switch 46. As shown in FIG. 15, the changeover work for the seventh board type “KB7” (shown at the rightmost in FIG. 15) is performed as electronic component types “COMP7”, “COMP8”, and “COMP9” ( The three component supply units 18 (shown almost black in FIG. 15) are removed from the component supply base 17, and the electronic component types “COMP5”, “COMP29” and “COMP30” (shown by vertical lines in FIG. 15) are removed. The CPU 40 is displayed on the CRT 45 so that the operator can understand that the three component supply units 18 are mounted on the component supply base 17.

  Note that the board type to be produced first may be the board type to be produced first based on the number of component types to be mounted on the board, that is, the board type having the largest number of component types.

  In addition, although what was called a rotary table type | mold high-speed chip mounter was taken as an example as an electronic component mounting apparatus of this embodiment, you may apply not only to this but to a multifunctional type chip mounter.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

It is a top view of an electronic component mounting apparatus. It is a side view of an electronic component mounting apparatus. It is a control block diagram. It is a flowchart figure. It is the figure which showed the kind of electronic component for every printed circuit board kind. It is the figure which computed the similarity of the component kind for every printed circuit board kind, and was displayed on CRT. It is the figure displayed on CRT which shows the order to produce in order with high similarity based on the printed circuit board produced first. It is a figure which shows the screen displayed on CRT when the instruction | indication of the setup change of the board | substrate kind "KB4" produced first using a touch panel switch was given. It is a figure which shows the screen displayed on CRT when the instruction | indication of the setup change of the board | substrate kind "KB2" produced 3rd using a touch-panel switch was instruct | indicated. It is a figure which shows the screen displayed on CRT, when the instruction | indication of the setup change of the board | substrate kind "KB1" produced 4th using a touch panel switch was instruct | indicated. It is a figure which shows the screen displayed on CRT, when the instruction | indication of the setup change of the board | substrate kind "KB6" produced 5th using a touch panel switch was given. It is a figure which shows the screen displayed on CRT, when the instruction | indication of the setup change of the board | substrate kind "KB5" produced 6th using a touch panel switch was given. It is a figure which shows the screen displayed on CRT when the instruction | indication of the setup change of the board | substrate kind "KB7" produced 7th using a touch panel switch was instruct | indicated. It is a figure which shows the screen displayed on CRT, when the instruction | indication of the setup change of the board | substrate types "KB6" and "KB5" produced 5th and 6th using a touch panel switch was carried out. It is a figure which shows the screen displayed on CRT when the instruction | indication of the setup change of the board | substrate kind "KB7" produced 7th using a touch panel switch was instruct | indicated.

Explanation of symbols

5 Component Mounting Device 17 Component Supply Stand 18 Component Supply Unit 40 CPU
41 RAM

Claims (4)

  The suction nozzle provided in the mounting head that moves between the component suction position and the component mounting position sucks and takes out the electronic component from the component supply unit at the component suction position, and the electronic component is placed on the printed circuit board at the component mounting position. In the electronic component mounting apparatus for mounting the electronic component mounting apparatus, the calculation means for calculating the similarity of the component type for each printed circuit board type from the mounting data for each of the plurality of printed circuit board types produced within a predetermined period, and the printed circuit board type to be produced first An electronic component mounting apparatus, comprising: a determining unit that determines an order of production in descending order of similarity based on the first printed board type to be produced among other printed board types except for .   The suction nozzle provided in the mounting head that moves between the component suction position and the component mounting position sucks and takes out the electronic component from the component supply unit at the component suction position, and the electronic component is placed on the printed circuit board at the component mounting position. In the electronic component mounting apparatus for mounting the electronic component mounting apparatus, the calculation means for calculating the similarity of the component types for each printed circuit board type from the mounting data for each of the plurality of printed circuit board types produced within a predetermined period, and the production order are determined. Among the other printed circuit board types excluding the printed circuit board type, the printed circuit board type having a high similarity based on the last printed circuit board type is determined as the next printed circuit board type to be produced. An electronic component mounting apparatus comprising: a determination unit that performs determination. The suction nozzle provided in the mounting head that moves between the component suction position and the component mounting position sucks and takes out the electronic component from the component supply unit at the component suction position, and the electronic component is placed on the printed circuit board at the component mounting position. In the method of changing the component supply unit in the electronic component mounting apparatus for mounting
Calculate the component type similarity for each PCB type from the mounting data for each PCB type produced within a given period,
Determine the type of printed circuit board to be produced first,
Among the other printed circuit board types excluding the determined printed circuit board type, determine the order of production in descending order of similarity based on the first produced printed circuit board type,
A component changeover method for a component supply unit, wherein the component supply unit is changed when necessary in accordance with the determined order. The suction nozzle provided in the mounting head that moves between the component suction position and the component mounting position sucks and takes out the electronic component from the component supply unit at the component suction position, and the electronic component is placed on the printed circuit board at the component mounting position. In the method of changing the component supply unit in the electronic component mounting apparatus for mounting
The calculating means calculates the similarity of the component types for each printed circuit board type from the mounting data for each of the plurality of printed circuit board types produced within a predetermined period,
Determine the type of printed circuit board that the worker will produce first,
The determining means determines the order of production in descending order of similarity based on the printed board type to be produced first among other printed board types excluding the determined printed board type,
A component supply unit setup change method, wherein an operator performs a setup change of a component supply unit when necessary in accordance with the order determined by the determining means.

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