JP4368090B2 - Electronic component mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus.
[0002]
[Prior art]
In order to automatically mount electronic components such as ICs, transistors, capacitors, resistors, etc. on a printed board or the like and to solder the board on which the components are mounted, a component mounting device, an automatic soldering device, or the like is used.
[0003]
The component mounting apparatus has a work head that can move in the X-axis, Y-axis, and Z-axis directions, and sucks the component with a nozzle at the tip of the work head.
When mounting a component on the board, the work head is moved above the component supply device, the component housed in the cartridge is sucked by the nozzle, and the work head is moved to a desired position on the board and sucked by the nozzle. Mount the component on the board.
[0004]
[Problems to be solved by the invention]
As described above, the conventional component mounting apparatus can move only one nozzle at a time in the Z-axis direction when, for example, a rotary work head has a plurality of nozzles on the circumference. In order to adsorb the components to be mounted on the board, it is necessary to repeat the work for the number of components.
[0005]
When picking up a component to the nozzle, the component may be picked up by the nozzle in a bent state, so the work piece is picked up with a camera and the orientation of the component is recognized from the captured image. It is necessary to correct the rotation angle.
In a rotary work head, the orientation of the nozzles is different when the parts are picked up, so if the viewing angle of the camera is limited, take all the parts in one shot. Is difficult. For this reason, it is necessary to move the work head and shoot the parts in several times, which is one of the causes that the work time for mounting the parts becomes longer.
[0006]
An object of the present invention is to shorten the work time when mounting components on a substrate.
[0007]
[Means for Solving the Problems]
The electronic component mounting apparatus of the present invention includes a plurality of work heads having nozzles arranged at the same arrangement pitch on the circumference and the arrangement pitch of the components housed in the component supply device, and the plurality of work heads are arranged on a substrate. A drive unit that moves the component mounting surface in a vertical direction; and at least two or more work heads are simultaneously moved in the vertical direction by controlling the drive unit, and the nozzles of the work heads are stored in the component supply device. Control means for simultaneously adsorbing two or more components.
[0008]
According to the present invention, since a plurality of components can be sucked simultaneously by a plurality of nozzles, the number of times of picking up the components from the component supply device can be reduced, and the work time for mounting the components on the board can be shortened. Can do.
In the above invention, the plurality of work heads have a structure that is parallel to the component mounting surface of the substrate, and is rotatable as a whole, and each work head can be rotated independently, and the control means includes: The rotation of the plurality of work heads is controlled so that the directions of at least two or more nozzles are parallel to the arrangement direction of the components of the component supply device.
[0009]
With this configuration, even when using a nozzle with polarity (direction), two or more work heads can be simultaneously moved in the vertical direction to suck two or more parts simultaneously. Further, for example, when photographing a component adsorbed on the nozzle by an imaging unit such as a camera with a limited viewing angle, the angle of the component adsorbed on the nozzle can be set to an appropriate angle. As a result, many parts are included in the viewing angle of the photographing means, so that the amount of movement of the working head when photographing the parts can be reduced, and the working time for mounting the parts on the board can be shortened.
[0010]
In the above invention, the plurality of work heads are composed of four or more work heads arranged on a circumference, and the control means is configured to rotate all of the plurality of work heads when all the work heads are rotated. The rotation angle of each work head is controlled so that the nozzle directions coincide with each other.
[0011]
In the above invention, it has an imaging means for imaging the parts adsorbed to the nozzles of the plurality of work heads, and the control means takes all the images when imaging the parts adsorbed to the nozzles by the imaging means. The rotation angle of each work head is controlled so that the nozzle directions of the work heads coincide.
[0012]
With this configuration, when shooting the parts adsorbed by the nozzles, the directions of the nozzles of all the work heads can be matched, so that more parts can be put in the viewing angle of the imaging means. Can do. As a result, the amount of movement of the work head when photographing the component adsorbed by the nozzle can be reduced, so that the work time for mounting the component on the substrate can be further shortened.
[0013]
Another aspect of the present invention includes a plurality of work heads each having a nozzle for sucking a component, the surface being parallel to the component mounting surface of the substrate, the entire work head being rotatable, and the individual work heads being independently rotatable. , The photographing means for photographing the parts adsorbed by the nozzles of the plurality of work heads and the direction of the nozzles of the working heads when the parts adsorbed by the nozzles by the photographing means are photographed. Control means for controlling the rotation angle of the working head.
[0014]
According to the present invention, since the directions of the nozzles of the plurality of work heads can be matched, it is possible to shoot with more parts in the viewing angle of the imaging means. Therefore, the amount of movement of the work head when photographing the part can be reduced, and the work time for mounting the part on the substrate can be shortened.
[0015]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram illustrating an internal structure of an electronic component mounting apparatus 11 according to the embodiment.
The electronic component mounting apparatus 11 is provided with transport rails 12 and 13 for transporting the board. When the board inserted from the left direction in FIG. 1 is transported to a predetermined position and the mounting of the components is completed. A transport mechanism for transporting the substrate in the right direction is provided.
[0016]
The board inserted from the left direction in FIG. 1 is transported to a predetermined position by a transport mechanism, fixed by a positioning unit (not shown), and the substrate is unfixed when the mounting of the components is completed. Is transferred to the next step.
The electronic component mounting apparatus 11 includes four work towers 14 to 17 that are movable in the X and Y directions. Each of the work towers 14 to 17 has six work heads, and the work heads are configured to be movable in the Z-axis direction (vertical direction in FIG. 1).
[0017]
1 is an enlarged view of the work tower 16. The six work heads 16a to 16f are rotary type work heads, and the whole work heads 16a to 16f are integrated so as to be rotatable on an XY plane (a horizontal plane parallel to the component mounting surface of the board). .
[0018]
The work heads 16a to 16f can be moved up and down in the Z-axis direction and can be rotated 360 ° on the XY plane. Nozzles (see FIG. 3) for adsorbing components are detachably attached to the front ends of the work heads 16a to 16f. The work heads of the other work towers 15 to 17 are similarly configured.
[0019]
The work towers 14 and 15 are movably attached to the Y-axis drive unit 18. Ball screws 18a and 18b are provided inside the Y-axis drive unit 18, and the ball screws 18a and 18b are driven by the Y-axis motor 31 (FIG. 2) to move the heads 14 and 15 in the Y-axis direction, respectively.
[0020]
The Y-axis drive unit 18 is fixed to two X-axis drive units 19 arranged in parallel, and the work towers 14 and 15 move in the X-axis direction by moving the X-axis drive unit 19 in the X-axis direction. To do.
Similarly to the work towers 14 and 15, the work towers 16 and 17 can be moved in the Y-axis and X-axis directions by the Y-axis drive unit 20 and the X-axis drive part 21.
[0021]
On the component supply stages 22 and 23, a component supply device including a cartridge or the like in which a reel-shaped tape storing components is stored is mounted.
The photographing unit 24 including a camera and a lighting device photographs the part adsorbed by the nozzle. Then, the control unit 35 described later recognizes the captured image, and corrects the orientation of the component by controlling the rotation angle of the work head based on the recognition result.
[0022]
Although not shown in FIG. 1, the electronic component mounting apparatus 11 is provided with a nozzle changer in which a nozzle for replacing the work head is set, and the work head is moved above the nozzle changer to form a substrate. Replace with a nozzle that matches the shape of the component to be mounted.
[0023]
FIG. 2 is a diagram illustrating a main part of a circuit of the electronic component mounting apparatus 11. The Y-axis motor 31 is a motor that moves the work towers 14 to 17 in the Y-axis direction, and a plurality of Y-axis motors 18 and 20 are provided.
The X-axis motor 32 is a motor that moves the work towers 14 to 17 in the X-axis direction, and a plurality of X-axis motors 32 are provided in the X-axis drive units 19 and 21.
[0024]
The Z-axis motor 33 is a motor for individually raising and lowering six work heads attached to the work towers 14 to 17 in the Z-axis direction, and one Z-axis motor 33 is provided for each work tower 14 to 17.
The rotation motor 34 includes two motors, that is, a motor that integrally rotates the six work heads of the work towers 14 to 17 on the XY plane and a motor that independently rotates the individual work heads on the XY plane. The rotation motor 34 controls the rotation angle of the entire plurality of work heads of the work towers 14 to 17 and further controls the rotation angles of the work heads individually to align the nozzle directions.
[0025]
The control unit 35 controls the positions of the work towers 14 to 17 and the work head by controlling the Y-axis motor 31, the X-axis motor 32, the Z-axis motor 33, and the rotation motor 34. In addition, the orientation of the component attracted to the nozzle is recognized from the image captured by the imaging unit 24 such as a camera, and the angle of the work head is corrected so as to face an appropriate direction when the component is mounted.
[0026]
3A is a side view of the working heads 16a to 16f according to the embodiment, and FIG. 3B is a view of the working heads 16a to 16f as viewed from below (the component mounting surface side of the board). is there.
Nozzles 41a to 41f are attached to the tips of the work heads 16a to 16f, respectively. The nozzle 41a is detachably held by the nozzle holding portions 42 and 43 of the work head 16a.
[0027]
The work heads 16a to 16f are arranged so that when the whole is rotated by a predetermined angle, for example, 120 °, a line connecting the central axes of two adjacent work heads is parallel to the component arrangement direction of the component supply device. Has been. And it arrange | positions so that the pitch of the nozzle of two adjacent work heads may correspond with the arrangement pitch of the components of a components supply apparatus.
[0028]
That is, as shown in FIG. 3B, the pitch of the central axes of the nozzles 41a and 41b, the pitch of the central axes of the nozzles 41c and 41d, and the pitch of the central axes of the nozzles 41e and 41f are the arrangement pitch of the components of the component supply device. Are arranged to match.
In the electronic component mounting apparatus 11 having the above-described configuration, an operation when a component that is wound on a tape or the like and stored in the component supply apparatus is adsorbed by the nozzles of the work heads 16a to 16f and mounted on the substrate will be described. .
[0029]
First, the working heads 16a to 16f are moved above the cartridge in which the parts are stored. At this time, the work heads 16a to 16f of the work heads 16a to 16f are arranged such that a line connecting the central axes of two adjacent work heads, for example, the work heads 16a and 16b, is parallel to the arrangement direction of the parts of the cartridge in which the parts are stored. Controls the overall rotation angle. The rotation angle is controlled by rotating the rotation motor 34 by a desired angle.
[0030]
If the work heads 16a to 16f are moved above the cartridge in which the target parts are stored, the two work heads 16a and 16b arranged in parallel with the arrangement direction of the parts are simultaneously lowered in the Z-axis direction. The two components are sucked by the nozzles 41a and 41b, and the work heads 16a and 16b are raised in the Z-axis direction.
[0031]
Next, the entire working heads 16a to 16f are rotated by a predetermined angle (in this case, since there are six working heads, 120 °). As a result, the line connecting the central axes of the next two work heads 16c and 16d can be parallel to the arrangement direction of the components housed in the cartridge. Then, the two work heads 16c and 16d are lowered in the Z-axis direction, and the two components are sucked by the nozzles 41c and 41d.
[0032]
Similarly, the other work heads 16e and 16f rotate the whole work heads 16a to 16f by a predetermined angle, simultaneously lower the work heads 16e and 16f in the Z-axis direction, and simultaneously adsorb two parts by the nozzles 41e and 41f. Thereafter, the work heads 16e and 16f are raised in the Z-axis direction. Thereby, two components can be simultaneously adsorbed to the nozzles of the work heads 16e and 16f.
[0033]
When rotating the entire work heads 16a to 16f, the control unit 35 controls the work heads 16a to 16f individually on the XY plane so that the directions of all the nozzles 41a to 41f are in the same direction. ing.
Thereby, since the direction of the components adsorbed by the nozzles 41a to 41f of the respective work heads 16a to 16f can be aligned, the status of the components adsorbed by moving the work heads 16a to 16f above the photographing unit 24 In the case of photographing, more parts can be photographed simultaneously even when the viewing angle of the photographing unit 24 is limited.
[0034]
Therefore, since many parts can be photographed simultaneously when photographing a part having a relatively large external dimension, the amount of movement of the work towers 14 to 17 for photographing can be reduced, and the work time for mounting the parts on the board can be reduced. Can be further shortened.
Next, the work heads 16a to 16f are moved to the position where the first component is mounted, and the work head that is sucking the component is lowered in the Z-axis direction to mount the corresponding component on the substrate. Then, the work heads 16a to 16f are moved to the position where the next component is mounted, and the work head that sucks the corresponding component is lowered in the Z-axis direction to mount the component on the substrate. In the same manner, components that are attracted to other work heads are mounted on the substrate.
[0035]
Here, for comparison, an operation in the case of picking up a component with one work head 16a will be described with reference to FIGS. 4 (A) and 4 (B).
First, the working heads 16a to 16f are moved above the cartridge in which the parts are stored. In this case, since the rotation of the entire work heads 16a to 16f is controlled so that only one nozzle 41a faces the parts housed in the parts supply device, the work head 16a is a cartridge in which the parts are housed. Move upwards.
[0036]
Next, the work head 16a is lowered in the Z-axis direction, the components are sucked by the nozzle 41a, and then the work head 16a is raised in the Z-axis direction. Thereby, one component can be held by the nozzle 41a.
When sucking the second part, the entire work heads 16a to 16f are rotated, and the next work head 16b is moved to a position facing the part of the part supply device. Then, by repeating the above-described operation, the component is sucked and mounted at a desired position on the board. In this case, since the components must be picked up one by one, the work time for mounting the components on the board is significantly longer than in the embodiment.
[0037]
According to the above-described embodiment, two or more components can be simultaneously sucked by the rotary type work head, so that the work time required for mounting the components on the substrate can be shortened.
The present invention is not limited to the embodiment described above, and may be configured as follows.
(1) The work head is not limited to a rotary work head, and may be a fixed work head.
(2) It is not limited to two work heads that pick up two parts at the same time, but three or more work heads may pick up three or more parts at the same time.
[0038]
【The invention's effect】
According to the present invention, it is possible to shorten the work time when mounting components on a substrate by simultaneously adsorbing a plurality of components. Further, by controlling the rotation angle of each work head so that the nozzles are oriented in the same direction, it is possible to shoot with more parts in the viewing angle of the imaging means. As a result, the amount of movement of the work head for photographing the part can be reduced to shorten the work time when mounting the part.
[Brief description of the drawings]
FIG. 1 is a diagram showing an internal structure of an electronic component mounting apparatus according to an embodiment.
FIG. 2 is a circuit diagram of the electronic component mounting apparatus.
FIGS. 3A and 3B are diagrams illustrating a structure of a working head according to the embodiment. FIGS.
FIGS. 4A and 4B are explanatory diagrams in the case of raising and lowering only one work head.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 11 Electronic component mounting apparatus 14-17 Work towers 16a-16f Work head 18, 20 Y-axis drive part 19, 21 X-axis drive part 24 Image | photographing part 31 Y-axis motor 32 X-axis motor 33 Z-axis motor 34 Rotation motor 35 Control part 41a-41f nozzle

Claims (1)

A plurality of work heads arranged on the circumference at the same arrangement pitch as the arrangement pitch of the parts housed in the parts supply device;
One nozzle attached to the tip of each of the plurality of working heads;
A work tower comprising the plurality of work heads and movable in the X and Y directions within the component mounting surface;
Drive means for moving the plurality of work heads in a direction perpendicular to the component mounting surface of the substrate;
Control means for controlling the driving means to move only two work heads simultaneously in the vertical direction, and simultaneously sucking only two parts housed in the parts supply device by the nozzles of the work heads,
The plurality of work heads have a structure in which the entire work head is rotatable in a plane parallel to the component mounting surface of the substrate, and each work head can be rotated independently.
The control means controls the overall rotation of the plurality of work heads so that the arrangement direction of the components of the component supply device is parallel to the direction connecting the centers of the two nozzles. Electronic component mounting device.

Images