JP4369764B2 - Mold cleaning device - Google Patents

Description

  The present invention relates to a laser cleaning apparatus suitable for cleaning a semiconductor manufacturing sealing mold for sealing and molding a semiconductor chip with a resin material.

  The base material of the sealing mold for sealing the LSI is made of an alloy called powder high-speed steel (SKH) or die steel (SKD), for example. On the upper layer, for example, chromium plating having a thickness of about 2 μm is applied. Abrasion resistance can be improved by plating chromium. Moreover, the releasability of the product can be improved. Chromium exhibits good adhesion to many materials and forms an oxide film that is resistant to corrosion on the surface, making it suitable as a coating film material.

  In the LSI sealing process using a semiconductor manufacturing sealing mold, the mold is filled with, for example, an epoxy resin and cured. Each time, the epoxy resin gradually adheres to the mold surface as a residue. When the thickness of the adhered residue increases, the pattern of the residue is transferred to the outer surface of the sealed LSI product. Therefore, the sealed LSI product may be judged as defective even if there is no problem in performance. . Further, the thickened residue makes it difficult for the product after sealing to peel from the mold. For this reason, it is necessary to periodically clean the mold for semiconductor manufacturing sealing.

  A mold cleaning method is known in which an epoxy resin is gradually adsorbed on a melanin resin by performing the same process as the sealing multiple times with a melanin resin instead of an epoxy resin. In this cleaning method, the sealing mold may be disassembled, the residual film of the epoxy resin may be peeled off, and then the mold may be reassembled. However, since the adhesion of the residual film to the mold is high, this cleaning method requires labor. Usually, it is often performed once a week with a cleaning time of about 5 hours per time. In recent years, with the specialization of the resin composition and additives used in the semiconductor sealing process, the number of cleanings tends to increase to about once every few days.

  A method of using a laser beam for cleaning a metal mold for semiconductor manufacturing sealing has also been proposed.

An invention of a process and system that preferably uses a KrF excimer laser and cleans mold surface contaminants used in semiconductor packaging tools in a fast, complete and relatively safe manner is disclosed. (For example, see Patent Document 1.)
The system has a mirror attached to the robot arm. The robot arm can accurately rotate the mirror to an arbitrary angle, and can accurately move the mirror to an arbitrary position in a plane parallel to the mold surface. The robot arm is attached to the XY table. The mirror receives a laser beam directed through another series of mirrors. The laser beam reflected by the mirror group is irradiated with an angle on the mold surface. The same position on the mold surface is irradiated with at least two pulses.

  In this process and system, when a fundamental wave (wavelength 1064 nm) and a second harmonic (wavelength 532 nm) of an Nd: YAG laser are used, an undesirable result is obtained.

Also disclosed is a method of cleaning the mold surface by irradiating a contaminant on the mold surface with a laser beam to carbonize the contaminant and then peeling it off. (For example, see Patent Document 2.)
Furthermore, recently, a laser processing method different from the conventional ablation processing has been invented and published by the present inventors. For example, one shot of a pulsed laser beam, for example, a fundamental wave (wavelength 1047 nm) of an Nd: YLF laser is incident on a resin coating layer laminated on a metal layer. The resin coating layer is formed of a resin material that is substantially transparent to the fundamental wave of the Nd: YLF laser, and the metal layer is formed of a metal material that reflects most of the fundamental wave of the Nd: YLF laser. Most of the laser beams are transmitted through the resin coating layer and reflected at the interface between the resin coating layer and the metal layer. Of the resin coating layer, the portion where the laser beam is incident peels from the metal layer, and a hole is opened in the resin coating layer.

The hole formed in the resin coating layer with a one-shot pulse laser beam by this laser processing method has a larger hole diameter than the conventional ablation processing and hardly damages the metal layer. Note that an Nd: YAG laser can be used instead of the Nd: YLF laser. (For example, see Patent Document 3.)
In the laser processing method described in Patent Document 3, peeling of the resin coating layer from the metal layer causes thermal decomposition of the resin at the interface between the resin coating layer and the metal layer. It is thought to have occurred as a result of inducing peeling. A phenomenon in which the interface between the resin coating layer and the metal layer is in a high pressure state and a part of the upper resin coating layer is peeled off by this pressure is referred to as a “lifting phenomenon”. In addition, processing using the “lifting phenomenon” is referred to as “lifting processing”.

Japanese translation of PCT publication No. 2002-508249 JP-A-1-12241 JP 2002-044970 A

  An object of the present invention is to provide a mold cleaning device suitable for removing resin residues adhering to a mold at high speed, simply, and hardly damaging the mold by utilizing a lifting phenomenon. Is to provide.

  Another object of the present invention is to provide a mold cleaning apparatus having a simple structure of an optical system for making a laser beam incident on the mold.

  Furthermore, another object of the present invention is to provide a mold cleaning apparatus having good handling properties.

  Another object of the present invention is to provide a mold cleaning device that discharges residues while preventing deterioration in cleaning performance due to residues peeled from the mold.

According to one aspect of the present invention, there is provided a laser light source that emits a pulse laser beam having a wavelength of 500 nm to 1.1 μm and a pulse width of 10 ns to 100 ns in a direction along a virtual plane, which has a property of causing a lifting phenomenon . A laser light source including a laser oscillator that emits a pulsed laser beam; and a beam size adjuster that adjusts a beam size of the pulsed laser beam emitted from the laser oscillator; and the laser light source is parallel to the virtual plane and pulsed A first moving device that moves in a first direction that intersects with an emission direction of the laser beam, and the laser light source is moved in a second direction that intersects with the virtual plane, or the emission direction of the pulse laser beam is A second moving device that changes a posture of the laser light source so as to swing in a second direction; A first surface and a second surface on which the pulsed laser beam is incident, and the pulsed laser beam is moved by moving the laser light source or performing posture control with the second moving device. The first laser beam can be selectively incident on either the first surface or the second surface, and the pulse laser beam incident on the first surface and the pulse laser beam incident on the second surface are A deflector arranged so as to be deflected opposite to each other with respect to a plane, and a third unit that moves the deflector in a direction parallel to the virtual plane and toward the laser light source and away from the laser light source. The beam size is adjusted so that the fluence on the surface of the cleaning object falls within a predetermined range according to the incident angle at which the pulse laser beam deflected by the moving device and the deflector enters the object to be cleaned. There is provided a laser cleaning device having a control device for controlling the adjustment device .

  This laser cleaning device can remove the resin residue adhering to the mold at high speed and easily and hardly damaging the mold by utilizing the lifting phenomenon.

According to another aspect of the present invention, there is provided a laser light source that emits a pulse laser beam having a wavelength of 500 nm to 1.1 μm and a pulse width of 10 ns to 100 ns having a property of causing a lifting phenomenon in a direction along a virtual plane. A laser light source including a laser oscillator that emits a pulse laser beam, a beam size adjuster that adjusts a beam size of the pulse laser beam emitted from the laser oscillator, and a pulse laser beam emitted from the laser light source. , A beam scanning device that can selectively enter and scan one of the two spaces divided by the virtual plane, a gas ejection means that blows gas to the beam scanning device, and a gas ejection means that is ejected from the gas ejection means After the gas flows in the space through which the pulse laser beam emitted from the laser light source passes, And gas discharge means for discharging the body to the outside of the space, depending on the angle of incidence pulsed laser beam emitted said beam scanning device is incident on the cleaning object, the fluence at the cleaning object surface falls within a predetermined range Thus, a laser cleaning device having a control device for controlling the beam size adjuster is provided.

  This cleaning device is a mold cleaning device capable of discharging a residue while preventing deterioration in cleaning performance due to the residue separated from the mold.

  According to the present invention, a mold cleaning apparatus suitable for removing a resin residue adhering to a mold at high speed, easily, and hardly damaging the mold by utilizing a lifting phenomenon. Can be provided.

  In addition, according to the present invention, it is possible to provide a mold cleaning device having a structure with a simple optical system for allowing a laser beam to enter the mold.

  Furthermore, according to the present invention, it is possible to provide a mold cleaning device having good handleability.

  In addition, according to the present invention, it is possible to provide a mold cleaning apparatus that discharges residues while preventing deterioration in cleaning performance due to the residues separated from the mold.

  In the previous proposal (Japanese Patent Application No. 2003-022970), the inventors of the present application disclosed a mold cleaning method and apparatus using a lifting phenomenon. In the present application, a mold cleaning apparatus using a lifting phenomenon, a mold cleaning apparatus having a simple structure of an optical system for making a laser beam incident on the mold, a mold cleaning apparatus having good handling properties, and a residue A mold cleaning device that discharges residue while preventing a cleaning function from being deteriorated by an object is proposed.

  Hereinafter, the sealing mold cleaning device will be described in two types: a built-in type device and a stand-alone type device. A built-in type device is a device in which a device part that performs semiconductor sealing work and a part of a device that performs mold cleaning are integrated, and a stand-alone type device is a device that performs mold cleaning. The laser cleaning device is separated from the stop device.

  FIGS. 1A and 1B are a plan view and a front view, respectively, showing an outline of a one-module laser cleaning built-in type apparatus according to the first embodiment. However, in FIG. 1A, for convenience of explanation, a configuration excluding the upper portion of the encapsulating press portion 100 is shown. In FIG. 1A, the right direction is defined as the X direction, the upward direction is defined as the Y direction, and the front side of the drawing is defined as the Z direction. The Z direction is a direction that is vertically upward when the apparatus is installed in a normal use state.

  Reference is made to FIG. The one-module laser cleaning built-in type encapsulating apparatus includes an encapsulating press unit 100 in which a semiconductor encapsulating operation and a semiconductor encapsulating mold cleaning operation are performed, a laser oscillator unit 71 that emits a pulse laser beam used for the cleaning operation, and an encapsulating press. The lead frame supply unit 63, the supply transport unit 64, the lead frame transport unit 65, the storage transport unit 66, the calbreak unit 67, and the lead frame storage unit 68 are arranged so as to surround the three sides of the unit 100. .

  The lead frame supply unit 63 includes a supply tray 69. The lead frame transport unit 65 is provided with a chuck 65a. Further, the lead frame storage unit 68 includes a storage tray 70. A deflection unit 50 including a deflector capable of deflecting a laser beam is disposed inside the enclosing press unit 100 so as to be movable. For example, a pulsed laser beam 72 emitted from the laser oscillator unit 71 in the Y direction is incident on the deflector in the deflecting unit 50, deflected, and irradiated onto the semiconductor sealing mold.

  Lead frames that are patterned copper plates, for example, are stacked on the supply tray 69 of the lead frame supply unit 63. The lead frame is conveyed from the lead frame supply unit 63 to the lead frame conveyance unit 65 via the supply conveyance unit 64. The lead frame is attracted to the chuck 65a of the lead frame transport unit 65 and carried to the encapsulating press unit 100, and the encapsulating press unit 100 performs a sealing operation using, for example, an epoxy resin. The sealed lead frame is again attracted to the chuck 65 a and returned to the lead frame transport unit 65, and is transported to the calbreak unit 67 through the storage transport unit 66. In the calbreak portion 67, unnecessary resin is removed from the sealed lead frame. After the processing in the calbreak unit 67 is completed, the sealed lead frame is stored in the storage tray 70 of the lead frame storage unit 68 again through the storage transport unit 66. The encapsulated mold lower mold 59 will be described in detail later.

  Reference is made to FIG. The lead frame is sealed by, for example, implanting epoxy resin and pressing the lead frame from above and below by the encapsulating mold upper mold 57 and the encapsulating mold lower mold 59.

  The cleaning is performed after the sealed lead frame is removed from the sealing press unit 100. For cleaning, the pulsed laser beam 72 emitted from the laser oscillator unit 71 is deflected in, for example, the positive direction of the Z axis or the negative direction of the Z axis by a deflector in the deflecting unit 50, and selectively sealed in the upper mold 57 or This is performed by irradiating the lower mold 59 of the enclosed mold. The laser oscillator unit 71 will be described in detail later.

  2A and 2B are a plan view and a front view, respectively, of the sealed press part 100 shown in FIG. However, in FIG. 2A as well, as in FIG. 1A, the structure excluding the upper part is shown for convenience of explanation. Incidentally, in correspondence with FIG. 1A, also in FIG. 2A, the right direction is defined as the X direction, the upward direction is defined as the Y direction, and the front side of the drawing is defined as the Z direction.

  Reference is made to FIG. The enclosing mold lower mold 59 is provided with an enclosing cavity portion 54 and a pot portion 55, which are provided for the convenience of sealing work. One sealing body is manufactured in one sealing cavity portion 54. The rotating brush 28 for brushing the encapsulating press unit 100 is moved in the Y-axis positive direction and the Y-axis negative direction (direction away from and toward the laser oscillator unit 71) along the rotating brush guide 51 by the Y-direction moving device 52. Can be moved.

  The control device 99 controls the Y-direction moving device 52 (the movement of the rotary brush 28). The control device 99 also controls an X-direction moving device and a Z-direction moving device described later. It is also possible to synchronize some of these mobile devices.

  A deflection unit 50 having a deflector, for example, a mirror inside, is attached to the hood of the rotary brush 28 so as not to impair the function of the rotary brush 28. The deflection unit 50 will be described in detail later.

  Reference is made to FIG. The encapsulated mold upper mold 57 is held by the upper cage 61, and the encapsulated mold lower mold 59 is held by the lower cage 62. Both cages are supported by each other by a press portion tie bar 58 provided therebetween. The press part tie bar 58 can move at least one of the upper holder 61 and the lower holder 62 in a direction in which the distance between them changes, and can hold the two so as to face each other in an isolated state. The press part tie bar 58 can be expanded and contracted in the Z direction, for example, and relatively moves the encapsulated mold upper mold 57 (upper retainer 61) and the encapsulated mold lower mold 59 (lower retainer 62), Adjust the distance between them.

  Since the deflection unit 50 is attached to the hood of the rotating brush 28, the rotating brush guide 51 together with the rotating brush 28 is moved between the encapsulating mold upper mold 57 and the encapsulating mold lower mold 59 by the Y-direction moving device 52. Can be moved in the positive Y-axis direction and the negative Y-axis direction.

  As described above, the pulse laser beam emitted from the laser oscillator unit 71 is incident on the deflection unit 50. The pulse laser beam incident on the deflection unit 50 is deflected and selectively incident on the upper mold 57 or the lower mold 59 of the mold.

  In the one-module laser cleaning built-in apparatus according to the first embodiment, a pulsed laser beam 72 emitted from the laser oscillator unit 71 is provided with a deflector inside from the viewpoint of using the rotary brush 28 and its moving mechanism. Is attached to the rotary brush 28 that is movable in the Y direction. The deflection unit 50 is deflected in the Y direction, but the deflection unit 50 is made to enter the mold (encapsulated mold upper mold 57 and encapsulated mold lower mold 59). You may provide the moving mechanism to move separately from this.

FIG. 3 is a perspective view showing an outline of the laser oscillator unit 71. The laser oscillator 10 can emit a pulse laser beam having a wavelength of about 500 nm to 1.1 μm with a pulse width of about 10 ns to 100 ns, or a wavelength converter is mounted inside or outside the laser oscillator. Is. As the laser oscillator, an Nd: YAG laser, an Nd: YLF laser, an Nd: YVO ₄ laser, or the like can be used. From the laser oscillator 10, the fundamental wave and the second harmonic of the laser are emitted. For example, the fundamental wave (wavelength 1064 nm) of an Nd: YAG laser is emitted. The laser beam of 500 nm to 1.1 μm emitted from the laser oscillator 10 is light having a wavelength that is difficult to be absorbed by the resin residue.

  The fundamental wave of the Nd: YAG laser emitted from the laser oscillator 10 is introduced into the optical fiber 12 using the coupler 11 and emitted from the emission port 13.

  Since the pulse laser beam emitted from the emission port 13 has a certain divergence angle, the beam diameter of the pulse laser beam gradually spreads as the beam advances unless optical processing is performed. A collimating lens 18 installed on the optical path of the laser beam immediately after the exit 13 makes the pulsed laser beam parallel light. Instead of the collimating lens 18, a plurality of lens groups having the same effect may be used. The pulsed laser beam converted into parallel light by the collimator lens 18 is incident on the variable beam expander 20 so as to have a fluence necessary for cleaning the mold (encapsulated mold upper mold 57 and encapsulated mold lower mold 59). In addition, the beam size of the emitted pulsed laser beam is adjusted. The control device 99 controls the variable beam expander 20 so that the beam size becomes appropriate according to the incident angle of the beam to the mold. This will be described later.

  The collimating lens 18 and the variable beam expander 20 may be replaced by a lens group designed to have both functions of the collimating lens 18 and the variable beam expander 20. Further, instead of using the collimating lens 18 or the variable beam expander 20, the cladding core near the exit port 13 is appropriately processed, and the pulse laser beam emitted from the exit port 13 is converted into a mold (encapsulated mold). The mold upper mold 57 and the enclosed mold lower mold 59) may be provided with a function of providing an appropriate beam profile and beam size on the surface. Further, when energy adjustment is possible in the laser oscillator 10, it is not necessary to use the beam expander 20. Further, in addition to the beam expander 20, an ND filter having a variable attenuation amount, or a quarter wavelength plate and a polarizing plate are arranged on the optical path immediately after the beam expander 20, and the ND filter or the quarter wavelength plate is adjusted. Thus, energy adjustment may be performed.

  The pulse laser beam emitted from the variable beam expander 20 is shaped by a mask 21 having a through hole. The shape of the through hole of the mask 21 is preferably a circular shape or a polygonal shape such as a rectangle, and is preferably a regular polygonal shape such as a square or a regular hexagon.

  The exit unit 22 including the exit port 13, the collimating lens 18, the variable beam expander 20, and the mask 21 is respectively moved in the X direction (pulse laser beam) by the X direction moving device 23 and the Z direction moving device 24. It is movable in a first direction that intersects the emission direction) and a Z direction (the emission direction of the pulse laser beam and the direction that intersects the first direction). Alternatively, the Z-direction moving device 24 may move the emission unit 22 so as to swing in the Z direction (change the attitude of the emission unit 22) so that the emission direction of the pulse laser beam swings in the Z direction.

  The control device 99 controls the X-direction moving device 23 and the Z-direction moving device 24 (the movement or posture change of the emission unit 22). As described above, the control device 99 can also control the Y-direction moving device 52 (see FIG. 2A) and control to synchronize some of these moving devices.

  Here, the reason why the through hole of the mask 21 is preferably circular or regular polygonal will be described. The laser cleaning performed using the laser cleaning apparatus according to the embodiment has a feature that the resin residue at the laser irradiation position can be removed with one pulse to irradiate the mold having the resin residue attached thereto. Moreover, it has the characteristic that it is hard to damage with respect to the chromium film etc. which have coat | covered the metal mold | die surface. Therefore, by using any one of the X-direction moving device 23, the Y-direction moving device 52, the Z-direction moving device 24, or a combination thereof, the beam irradiation area on the mold is partially overlapped by this pulse and the next pulse. It is appropriate to perform cleaning by making the beam enter the mold (the upper mold 57 or the lower mold 59) while changing the irradiation position. In order to reduce the overlapping portion of the beam irradiation region and increase the cleaning efficiency, the shape of the through hole of the mask 21 (the shape of the beam spot of the laser beam incident on the mold) can be a circular shape or a polygonal shape such as a rectangle. A regular polygonal shape such as a square or a regular hexagon is preferable.

  4A and 4B are a perspective view and a cross-sectional view showing an outline of the mirror 30 that constitutes the deflector installed inside the deflection unit 50, respectively. FIG. 5 is a perspective view of the deflection unit 50. FIG.

  Reference is made to FIG. The mirror 30 includes two reflecting surfaces 30a and 30b that intersect with each other, for example, orthogonal to each other. The two reflecting surfaces 30a and 30b are flat surfaces, for example. In the case of the illustrated mirror 30, the overall shape is a triangular prism.

  FIG. 4B is a cross-sectional view along a plane orthogonal to both of the two reflecting surfaces 30a and 30b in FIG. The cross section is, for example, a right isosceles triangle. The pulse laser beam 72 emitted from the laser oscillator unit 71 in the Y direction, for example, propagates in a direction parallel to the virtual plane 31 and enters one of the reflection surfaces 30a and 30b of the mirror 30, and the incident light is, for example, Z Reflected in the axial positive or negative direction. The pulse laser beam 72 reflected in the Z-axis positive direction by the reflecting surface 30a is irradiated to the encapsulating mold upper mold 57, and the pulse laser beam 72 reflected from the reflecting surface 30b in the Z-axis negative direction is irradiated to the enclosing mold lower mold 59. Is done.

  Here, as an example of the deflector, the mirror 30 including the reflecting surfaces 30a and 30b, which are two reflecting planes intersecting each other, is taken as an example. However, the pulse laser beam 72 is deflected to obtain a mold (on the enclosed mold). Any material can be used as long as it can irradiate the mold 57 and the lower mold 59). For example, the reflecting surfaces may be arranged only at the position where the laser beam is incident without intersecting the two reflecting surfaces 30a and 30b. Further, the reflecting surfaces 30a and 30b are not limited to flat surfaces. Further, a prism can be used instead of the mirror 30.

  The deflector includes two surfaces on which the pulsed laser beam 72 emitted from the laser oscillator unit 71 is incident. By performing movement or posture control of the emission unit 22 of the laser oscillator unit 71 by the Z-direction moving device 24, A deflector disposed so that the pulse laser beam 72 can be selectively incident on one of the two surfaces and the pulse laser beam incident on each surface is deflected to the opposite side with respect to the virtual plane 31. Can be used.

  4A and 4B, the mirror 30 has a distance from the virtual plane 31 to the deflection position of the pulsed laser beam 72 when the emission unit 22 of the laser oscillator unit 71 is moved in the X direction. It has a shape that does not change.

  Reference is made to FIG. The deflection unit 50 includes, for example, a rectangular parallelepiped container and a mirror 30 disposed therein. Although the mirror 30 can be used without being stored in a container, it is preferably stored in a container. This is because the temperature of the mold (encapsulated mold upper mold 57 and encapsulated mold lower mold 59) at the time of mold cleaning is about 180 ° C., and therefore the environmental temperature of the mirror 30 is much higher than room temperature. Furthermore, it is for preventing contamination of the mirror 30 by the resin residue removed from the mold and the resin component thermally decomposed and gasified.

  The container is provided with a laser beam incident port 50 c that transmits the pulse laser beam 72 emitted from the laser oscillator unit 71 and enters the mirror 30. The laser beam entrance 50 c is formed of a transparent material such as quartz or glass on which an antireflection coating for the pulse laser beam 72 is applied.

  The pulse laser beams 72 reflected by the reflecting surfaces 30a and 30b of the mirror 30 are emitted from the upper surface 50a and the lower surface 50b of the container, respectively, and enter the encapsulated mold upper mold 57 and the encapsulated mold lower mold 59. That is, during the cleaning operation, the upper surface 50a and the lower surface 50b are opposed to the encapsulated mold upper mold 57 and the encapsulated mold lower surface 59, respectively. The upper surface 50a and the lower surface 50b are also formed of a transparent material such as quartz or glass with an antireflection coating.

  The other part of the container (the part other than that formed of a transparent material) is made of a material that is opaque to heat with a wavelength of 500 nm to 1.1 μm and has heat resistance so that the pulse laser beam 72 does not leak. Is done.

  In addition, even if it does not form the whole surface of the upper surface 50a and the lower surface 50b with a transparent material, it is also possible to provide the window formed with the transparent material in some of them. In that case, the pulsed laser beam 72 reflected by the mirror 30 passes through the windows and is irradiated to the mold (encapsulated mold upper mold 57 and encapsulated mold lower mold 59).

  FIG. 5 is a schematic plan view showing an example of the scanning locus of the pulse laser beam 72 incident on the mold (lower mold 59).

  Changes in the emission position or emission direction of the pulse laser beam 72 in the X direction or Z direction by the X direction moving device 23 or the Z direction moving device 24, and the Y direction moving device 52 in the Y direction of the deflection device (deflection unit 50). Is controlled by the control device 99, the surface of the mold (encapsulated mold upper mold 57 and encapsulated mold lower mold 59) is scanned with the pulse laser beam 72, and is attached to the mold in the sealing process. Resin residues are removed from the mold and removed, and the mold is cleaned.

  What is indicated by an arrow in the figure is a scanning locus of the pulsed laser beam 72 incident on the lower mold 59 when the deflection unit 50 is moved in the negative Y-axis direction, for example. By moving the emission unit 22 in the X-axis positive direction while the deflection unit 50 is stationary, the pulse laser beam 72 is incident on the lower mold 59 of the enclosed mold while changing the incident position little by little in the X-axis positive direction. Along the line, the resin residue is removed from one end of the mold to the other end. Thereafter, the emission unit 22 is stopped and the deflection unit 50 is moved in the negative Y-axis direction, so that the pulse laser beam 72 is slightly moved in the negative Y-axis direction (with the overlapping beam irradiation regions on the mold). Move the incident position. Subsequently, the deflection unit 50 is stopped and the emission unit 22 is moved in the negative direction of the X axis, so that the incident position of the pulse laser beam 72 is incident on the lower mold 59 while moving in the negative direction of the X axis. To clean. The same scanning is repeated, and the resin mold residue is peeled off and removed from the mold by irradiating the lower mold 59 with the pulse laser beam 72 from one end along the direction parallel to the Y-axis direction to the other end. To do. Irradiation with the pulse laser beam 72 is performed evenly on the mold surface, for example.

  As described above, the scanning of the pulse laser beam 72 is performed by controlling each moving device so that the beam irradiation region on the mold partially overlaps with the current pulse and the next pulse.

  After the cleaning of the beam trajectory indicated by the arrow in the figure (cleaning of the lower mold 59 enclosed by moving the deflection unit 50 in the negative direction of the Y-axis) is completed, the Z-direction moving device 24 applies pulses. A laser beam 72 is incident on the upper surface 30 a of the mirror 30 to irradiate the upper mold 57 and clean the upper mold 57.

  The cleaning of the upper mold 57 is performed following the cleaning of the lower mold 59, for example, while moving the deflection unit 50 in the positive Y-axis direction. In this case, the scanning trajectory of the pulse laser beam on the mold follows, for example, an arrow in the direction opposite to the arrow shown in the figure.

  The above-described mold (encapsulated mold upper mold 57 and encapsulated mold lower mold 59) may be cleaned, for example, every time one lead frame is sealed, or several lead frames are sealed. You may do this once every time.

  Since the laser cleaning uses the lifting phenomenon, the resin residue adhering to the mold can be removed at high speed and easily and with little damage to the mold.

  The one-module laser cleaning built-in apparatus according to the first embodiment includes a mirror 30 inside the deflection unit 50. Since the optical system for allowing the laser beam to enter the mold has a simple structure, problems are unlikely to occur during manufacture and use.

  FIG. 6 is a plan view schematically showing a one-module laser cleaning built-in apparatus according to the second embodiment. FIG. 2 is a view corresponding to FIG. 1A according to the first embodiment, and shows a configuration excluding the upper portion of the encapsulating press portion 100 as in FIG. 1A. As in FIG. 1A, the right direction is defined as the X direction, the upward direction as the Y direction, and the front side of the drawing as the Z direction.

  The difference from the one-module laser cleaning built-in type device according to the first embodiment is that a galvano mirror is arranged in the deflection unit 50 instead of the mirror 30, and a moving device that moves the deflection unit 50 in the X-axis direction. An X-axis motor 56 and an X-axis ball screw 53 are provided, and an LM guide 60 is additionally provided. The laser oscillator unit 71 may not include the Z-direction moving device 24 that moves the emitting unit 22 in the Z-axis direction. This point is common to the cleaning apparatus using the galvanometer mirror also in the following embodiments.

  The X-axis ball screw 53 and the X-axis motor 56 are supported by the hood of the rotating brush 28, for example. Further, the deflection unit 50 is attached to the hood of the rotary brush 28 via the LM guide 60 so as to be able to translate. The deflection unit 50 can move (translate) in the X-axis direction along the LM guide 60 by rotating the X-axis ball screw 53 with the X-axis motor 56. The control device 99 controls the movement of the deflection unit 50 in the X-axis direction by the X-axis motor 56 and the X-axis ball screw 53.

  The control device 99 also controls the movement of the rotary brush 28 and the deflection unit 50 in the Y direction by the Y direction moving device 52 and the movement of the emission unit 22 in the X direction by the X direction moving device 23 in the laser oscillator unit 71. To do. Further, as will be described later, the optical system including the galvanometer mirror inside the deflection unit 50 is controlled to control the emission direction and emission position of the pulsed laser beam 72 that irradiates the mold.

  Similar to the one-module laser cleaning built-in type apparatus according to the first embodiment, the pulse laser beam 72 emitted from the laser oscillator unit 71 is incident on the deflection unit 50 and deflected, and the mold (encapsulated mold upper mold 57 and The resin residue attached to the mold by irradiating the lower mold 59) is peeled off from the mold.

  The emission unit 22 and the deflection unit 50 of the laser oscillator unit 71 are moved in the X direction synchronously so that the pulsed laser beam 72 emitted from the laser oscillator unit 71 enters the deflection unit 50.

  FIG. 7 is a perspective view of the deflection unit 50 in which an optical system including a galvanometer mirror is arranged.

  The deflection unit 50 includes a container and a galvanometer mirror disposed in the container. Similar to that shown in FIG. 4C, the container is provided with a laser beam incident port 50 c that transmits the pulse laser beam 72 emitted from the laser oscillator unit 71 and introduces it into the deflection unit 50. The laser beam entrance 50 c is formed of a transparent material such as quartz or glass on which an antireflection coating for the pulse laser beam 72 is applied.

  The pulse laser beam 72 incident from the laser incident port 50 c is reflected by the mirrors 14 a and 14 b and enters the galvano optical system 17. The galvano optical system 17 includes two swayable mirrors 16a and 16b. The mirrors 16a and 16b are swung by galvano motors 15a and 15b, respectively. As described above, the control device 99 controls the oscillation of the mirrors 16a and 16b by the galvano motors 15a and 15b, and controls the emission direction of the pulse laser beam 72.

  The pulse laser beam 72 emitted from the galvano optical system 17 is emitted from the upper surface 50a or the lower surface 50b of the deflection unit 50 and selectively enters the upper mold 57 or the lower mold 59 of the mold. Similar to the deflection unit 50 shown in FIG. 4C, the upper surface 50a and the lower surface 50b of the container are also made of a transparent material such as quartz or glass with an antireflection coating. It is also possible to provide a material that forms the other part of the container (a part other than that formed of a transparent material) and a window formed of a transparent material on part of the upper surface 50a and the lower surface 50b. The same as in the case of the deflection unit 50 shown in FIG.

  At the time of cleaning by scanning with the pulse laser beam 72, the operation of the deflection unit 50 is controlled so as to be performed along the arrow in FIG.

  The pulse laser beam 72 is deflected by using the galvano optical system 17 instead of the mirror 30 and is incident on a mold (encapsulated mold upper mold 57 and encapsulated mold lower mold 59), so that the pulse laser beam 72 is molded into the mold. It is possible to irradiate with an appropriate direction and incident angle.

  The incident angle of the pulse laser beam 72 incident on the mold will be supplemented.

  In the mold laser cleaning using the lifting phenomenon, there is an optimum fluence range for cleaning. The fluence is defined by unit area and irradiation energy per pulse. That is, the fluence can be maintained at an optimum value by adjusting the pulse energy and the irradiation area. In this cleaning method, where the resin residue on the mold is peeled off by laser beam irradiation, the fluence threshold (lower limit of the fluence that can remove the resin residue) even if the mold is irradiated with the beam from an angle. Even if it exceeds, the residue in the irradiated area is removed. In other words, the incident angle of the irradiated laser beam only affects the fluence as a change in the irradiation area, and even if the incident angle becomes larger and the irradiation area becomes wider, increasing the pulse energy increases the laser cleaning with the same effect. It can be carried out.

  Of the encapsulating cavity portion 54 of a general LSI mold, the larger one is 40 mm square, and the taper angle (the angle formed by the normal line on the upper surface of the mold and the normal line on the side surface of the encapsulating cavity portion 54) is approximately. 80 °. With such a large sealed cavity 54, it is possible to irradiate a laser beam perpendicular to the tapered surface. However, the size of the small enclosed cavity 54 is about 0.1 to 0.5 mm square and the depth is about 1 mm. If a laser beam is intended to enter the taper surface of such a small sealed cavity portion 54 perpendicularly, the laser beam will be blocked by the edge of the sealed cavity portion 54, so that the laser beam is irradiated perpendicularly to the tapered surface. It is difficult. In this case, it is necessary to irradiate the laser beam from an oblique direction and adjust the beam diameter and pulse energy so that the fluence on the mold surface falls within the optimum value range.

  For example, the beam diameter is adjusted by the variable beam expander 20, and a part of the laser beam is blocked by the mask 21 to change the energy passing through the through hole. If the beam magnification is reduced, the pulse energy of the passing laser beam is increased, and if the beam magnification is increased, the pulse energy of the passing laser beam is reduced. When the cleaning surface is irradiated obliquely, the irradiation area becomes large. Therefore, the pulse energy of the passing laser beam is increased by reducing the beam expansion rate so that the effective fluence falls within the optimum range. adjust.

  Note that the beam diameter may be adjusted by the variable beam expander 20 even when the tapered surface of the large-sized sealed cavity portion 54 is cleaned.

  For example, in the cleaning of the 40 mm square sealed cavity portion 54 described above, after irradiating the cavity surface from directly above, the four tapered surfaces are inclined by 80 ° with respect to the normal direction of the upper surface of the mold. In other words, the cleaning may be performed by irradiating the laser beam perpendicularly to the taper surface. For example, after adjusting the beam diameter with the variable beam expander 20, the normal line of the taper surface is obtained. Cleaning may be performed by irradiating a laser beam at an angle of 40 ° with respect to the direction. In this case, both the bottom surface of the cavity and the tapered surface are incident at 40 °, and there is no need to adjust the beam diameter with the variable beam expander 20 between the cavity bottom surface and the tapered surface.

  A three-dimensional shape of the mold (for example, a three-dimensional CAD diagram) can be stored in advance in a storage device, and a pulsed laser beam can be appropriately incident on the mold accordingly.

  8A and 8B are a plan view and a front view, respectively, showing an outline of a two-module laser cleaning built-in apparatus according to the third embodiment.

  In the two-module apparatus, unlike the one-module apparatus, there are two encapsulating press sections 100.

  The process in which the pulse laser beam 72 emitted from the laser oscillator unit 71 is deflected by the deflection unit 50 and is incident on the mold (encapsulated mold upper mold 57 and encapsulated mold lower mold 59) was performed in the second embodiment. It is the same as the description.

  When the cleaning of one encapsulating press unit 100 is completed and the other cleaning is performed, the emission position of the pulse laser beam 72 is changed by the movement of the laser oscillator unit 71 or the emission unit 22 of the laser oscillator unit 71.

  While one encapsulating press unit 100 is performing a sealing operation, the other encapsulating press unit 100 can be cleaned. For this reason, it is possible to improve work efficiency.

  Although FIGS. 8A and 8B show a two-module device, the device is not limited to two modules and may be a multi-module device.

  FIGS. 9A and 9B are a plan view and a front view, respectively, showing an outline of a part of a laser cleaning stand-alone apparatus according to the fourth embodiment coupled to a semiconductor sealing device. The laser cleaning stand-alone apparatus is a movable cleaning apparatus and is used in combination with a semiconductor sealing apparatus. In FIG. 9A, the structure excluding the upper portion of the semiconductor sealing device is shown for convenience of explanation.

  Reference is made to FIG. The stand-alone cleaning device includes a laser oscillator unit 71 and is coupled to the semiconductor sealing device by, for example, a coupling rod 6. The laser cleaning stand-alone apparatus according to the fourth embodiment is attached to, for example, a rotating brush guide 51 of a semiconductor sealing device by a connecting rod 6 (for example, the connecting rod 6 is configured to be fitted to the rotating brush guide 51). As a result, a reference plane (a plane parallel to the XY plane) parallel to the mold (encapsulated mold upper mold 57 and encapsulated mold lower mold 59) is defined. If the reference plane parallel to the mold is defined, the attachment target of the connecting rod 6 is not limited to the rotating brush guide 51.

  Reference is made to FIG. The laser cleaning apparatus according to the fourth embodiment includes a deflection unit 50 having a deflector, for example, a galvano optical system therein. At the time of cleaning, the deflection unit 50 is inserted between the upper and lower molds (encapsulated mold upper mold 57 and encapsulated mold lower mold 59). The pulse laser beam 72 emitted from the laser oscillator unit 71 is deflected by the deflection unit 50 and irradiated to the mold (encapsulated mold upper mold 57 and encapsulated mold lower mold 59) to clean the mold.

  FIGS. 10A and 10B are a plan view and a front view of the enclosing press unit 100 in a state where a part of the stand-alone laser cleaning device is inserted, respectively. However, in FIG. 10A as well, as in FIG. 9A, the structure excluding the upper part is shown for convenience of explanation.

  Reference is made to FIG. The deflection unit 50 includes a moving mechanism, and is arranged so as to be movable on a reference plane defined by mounting of the cleaning device by the connecting rod 6. The moving mechanism will be described later.

  Reference is made to FIG. Also in the laser cleaning stand-alone apparatus according to the fourth embodiment, the operation of the deflection unit 50 is performed, for example, along the arrow in FIG. Further, the pulse laser beam 72 is applied to the mold at an angle that can effectively remove and remove the resin residue adhering to the mold.

  FIG. 11 is a perspective view schematically showing a laser cleaning stand-alone apparatus provided with a deflection unit 50 and a moving mechanism for the deflection unit 50. The laser oscillator unit 71 is mainly shown. Compared with the laser oscillator unit 71 shown in FIG. 3, the emission unit 22 has a pair of parallel Y directions extending in the Y direction, for example, in addition to the emission port 13, the collimating lens 18, the variable beam expander 20, and the mask 21. It is characterized in that the guide 4 is provided. A pulse laser beam 72 emitted from the emission port 13 and passed through the collimating lens 18, the variable beam expander 20, and the mask 21 passes between the pair of Y direction guides 4 in a direction parallel to the Y direction guides 4 (Y direction). Each element is arranged so that it progresses toward). Similarly to that shown in FIG. 3, the emission unit 22 shown in FIG. 11 can also be moved in the X direction by the X-direction moving device 23 while the positional relationship of each component is kept constant. The movement in the X direction is performed along the X direction guide 5.

  A deflection unit 50 is attached to the Y direction guide 4 so as to be movable in the Y direction. The deflection unit 50 is moved in the Y direction by the Y direction moving device 52.

  The movement of the emission unit 22 in the X direction by the X direction moving device 23 and the movement of the deflection unit 50 in the Y direction by the Y direction moving device 52 are both controlled by the control device 99.

  The deflection unit 50 is the same as that shown in FIG. 7, for example. A pulsed laser beam 72 traveling in the Y direction between the Y direction guides 4 is introduced into the deflection unit 50 from the laser beam entrance 50c, scanned by the galvano optical system 17, and molds (encapsulated mold upper mold 57 and It selectively enters the lower mold 59). The swing of the galvanometer mirror in the deflection unit 50 is also controlled by the control device 99.

  The galvano optical system 17 in the deflection unit 50 shown in FIG. 7 includes two galvanometer mirrors. In the case of the emission unit 22 and the deflection unit 50 shown in FIG. 11, a rotation mechanism, for example, a rotation mechanism having a central axis as a center line of the two Y-direction guides 4 may be provided in the emission unit 22. By providing such a rotation mechanism, it becomes possible to control the incident angle in the tangential direction of the rotation circumference (incident angle of the beam to the mold) by the rotation mechanism. In this case, the galvano optical system 17 only needs to be swung only in a direction perpendicular to the tangential direction, and therefore it is sufficient to include one galvanometer mirror.

  FIG. 12 is a perspective view showing an outline of another example of the laser cleaning stand-alone apparatus provided with the deflection unit 50 and the moving mechanism of the deflection unit 50. As in FIG. 11, the laser oscillator unit 71 is mainly shown.

  11 is different from that shown in FIG. 11 in that a pair of parallel X direction guides 5 are provided in a direction parallel to the X axis. A deflection unit 50 is attached to the X-direction guide 5 so as to be movable in the mirror 33 and the X-axis direction. The deflection unit 50 includes an optical system including a galvanometer mirror inside. Movement of the deflection unit 50 in the X-axis direction is performed by the X-direction moving device 23. Further, the mirror 33 does not move relative to the X-direction guide 5.

  The mirror 33 and the deflection unit 50 attached to the X direction guide 5 can be moved in the Y direction together with the X direction guide 5 by the Y direction moving device 52. The movement in the Y direction is performed along the Y direction guide 4.

  The movement of the deflection unit 50 and the mirror 33 by the Y-direction moving device 52 is controlled by the control device 99.

  In addition, the laser oscillator unit 71 shown in FIG. 11 does not move the emission unit 22 including the emission port 13, the collimating lens 18, the variable beam expander 20, and the mask 21, and the beam emission position and emission direction are constant. It is different also in that it is.

  In the laser oscillator unit 71 shown in FIG. 12, the pulsed laser beam 72 emitted from the emission unit 22 is reflected by the mirror 33 and introduced into the deflection unit 50. The pulse laser beam 72 incident on the deflection unit 50 is deflected and selectively irradiated onto the mold (the upper mold 57 and the lower mold 59), and the resin residue adhering to the mold is removed from the mold. Remove.

  FIG. 13 is a perspective view schematically showing the mirror 33 and the deflection unit 50 shown in FIG.

  The deflection unit 50 is similar to that shown in FIG. 7, but a laser beam entrance 50 c that introduces a pulse laser beam 72 emitted from the laser oscillator unit 71 and reflected by the mirror 33 into the deflection unit 50. The difference is that the mirror 33 is provided on the surface facing the mirror 33 (the side surface with respect to the emission unit 22 of the laser oscillator unit 71). Another difference is that the mirrors 14 a and 14 b are not provided in the deflection unit 50.

  The pulsed laser beam 72 reflected by the mirror 33 and introduced into the deflection unit 50 from the laser incident port 50 c is incident on the galvano optical system 17. The subsequent control of the scanning of the pulse laser beam 72 and the materials forming the upper surface 50a, the lower surface 50b, the laser incident port 50c, and other parts of the container of the container are the same as those of the deflection unit 50 shown in FIG. It is the same. Further, the window formed of a transparent material may be provided on part of the upper surface 50a and the lower surface 50b.

  The galvano optical system 17 is used to deflect the pulse laser beam 72 and make it incident on a mold (encapsulated mold upper mold 57 and encapsulated mold lower mold 59). It is possible to irradiate so that it may become a direction and an incident angle. Further, when the mirror 33 and the deflection unit 50 shown in FIG. 13 are used, the position of the emission unit 22 of the laser oscillator unit 71 can be fixed as compared with the case where the deflection unit 50 shown in FIG. 7 is used. Therefore, it is easy to control the introduction of the beam into the deflection unit 50.

  FIG. 14 is a perspective view schematically showing a laser cleaning stand-alone apparatus according to the fifth embodiment.

  The illustrated stand-alone type apparatus is positioned and coupled to a sealing mold of a semiconductor sealing apparatus using a mold coupling block 45.

  The laser cleaning stand-alone apparatus according to the fifth embodiment introduces, for example, a laser oscillator 10 capable of emitting a fundamental wave (wavelength 1064 nm) of an Nd: YAG laser, and a pulse laser beam emitted from the laser oscillator 10 into the optical fiber 12. Coupler 11, optical fiber 12 that transmits the pulse laser beam introduced using coupler 11 to the vicinity of the mold, and the beam size and shape of the pulse laser beam transmitted by optical fiber 12 are adjusted to be collimated and emitted. A unit 22 is included. The emission unit 22 includes an emission port 13, a variable beam expander 20, a collimating lens 18, and a mask 21 having a through hole. These have the same functions and effects as those described in the previous embodiments.

  The X direction moving device 23 can move the emission unit 22 in the X axis direction. Further, the Z-direction moving device 24 can move the emission unit 22 in the Z-axis direction or control the attitude, and changes the emission direction of the pulse laser beam 72 emitted from the emission unit 22 along the Z-axis direction. It is possible to make it.

  A mirror 30 is provided, and similarly to the first embodiment, the beam emitted from the emission unit 22 is reflected by the mirror 30 and selectively enters the upper and lower molds.

  Although the figure shows a case where the mirror 30 is exposed, the mirror 30 may be installed inside the container as in the first embodiment (see FIG. 4C).

  The Y-direction moving device 52 can move the mirror 30 along the Y-direction guide 46.

  Movement of the output unit 22 in the X direction by the X direction moving device 23, movement or posture control of the output unit 22 in the Z direction by the Z direction moving device 24, and movement of the mirror 30 in the Y direction by the Y direction moving device 52 Is controlled by the control device 99.

  The operation of performing cleaning by the pulse laser beam 72 emitted from the emission unit 22 being reflected by the mirror 30 and entering the mold is the same as in the case of the one-module laser cleaning built-in type apparatus according to the first embodiment, for example. .

  Further, the laser cleaning stand-alone apparatus according to the fifth embodiment is characterized by including a mirror air blow 43, a dust collecting duct 42, and a dust collector 41.

  The mirror air blow 43 can be moved in the Y direction together with the mirror 30 along the Y direction guide 46 by the Y direction moving device 52, and gas can be blown onto the mirror 30.

  Resin residues separated from the mold by laser cleaning of the mold are scattered in the movable region of the mirror 30. When the resin residue adheres to the mirror 30, there may be a problem in reflection of the pulse laser beam 72. Therefore, the adhered resin residue is removed from the mirror 30 by blowing gas from the mirror air blow 43.

  The gas ejected from the mirror air blow 43 flows through the space through which the pulse laser beam 72 emitted from the laser oscillator unit 71 passes, and then is sucked from the dust collection duct 42 and collected in the dust collector 41. The mirror air blow 43 also functions as a gas inlet for removing the resin residue from the cleaning region.

  The resin residue peeled and removed from the mold exists in the form of a thin film. For this reason, it is effective to suck together with the rotating brush 28. Further, as shown in the figure, when the mirror 30 is disposed between the mirror air blow 43 and the dust collection duct 42, the mirror air is placed at a position facing the dust collection duct 42 in order to improve the dust collection effect. It is preferable to attach the blower 43 and the rotating brush 28.

  When the mirror 30 is housed inside the deflection unit 50, the gas blowing by the mirror air blow 43 is performed toward the upper surface 50a, the lower surface 50b, or the laser beam incident port 50c of the deflection unit 50. It is possible to remove the resin residue at the spraying position and prevent problems in laser beam transmission.

  Note that the blowing of gas from the mirror air blow 43 also has the effect of air cooling the mirror 30 or the deflection unit 50.

  The laser cleaning stand-alone apparatus according to the fifth embodiment can be said to be a mold cleaning apparatus that discharges residues while preventing deterioration in cleaning performance due to the residues separated from the mold.

  In the laser cleaning stand-alone apparatus according to the fifth embodiment, the movement of the emission unit 22 in the X direction by the X direction moving device 23 and the movement of the mirror 30 in the Y direction by the Y direction moving device 52 are independent. A portion that is inserted between the upper and lower molds and emits a laser beam toward the mold (including a movable region of the mirror 30; a portion to which the mirror 30 and the Y-direction moving device 52 are attached) is folded. It also has the feature that it is possible.

  By folding the foldable arm 44 holding the part during the cleaning operation, the part can be rotated and folded around a fold rotation shaft 47 parallel to the X axis. For this reason, the laser cleaning stand-alone apparatus according to the fifth embodiment has good storage and handling.

  The laser cleaning stand-alone apparatus according to the fifth embodiment, such as oscillation and stoppage of the laser beam, is manually performed using the operation panel 40.

  FIGS. 15A and 15B are a plan view and a front view, respectively, showing an outline of a two-module semiconductor sealing device combined with a laser cleaning stand-alone device.

  The laser cleaning stand-alone apparatus according to the embodiment can also be used for the two-module (multiple module) semiconductor sealing apparatus shown in FIGS. 15A and 15B.

  Although the present invention has been described with reference to the embodiments, the present invention is not limited thereto. It will be apparent to those skilled in the art that various modifications, improvements, combinations, and the like can be made.

  It can be used as a cleaning device for irradiating a cleaning object with a laser beam to separate and remove the deposit.

(A) And (B) is the top view and front view which respectively show the outline of the 1 module laser cleaning built-in type apparatus by 1st Example. (A) And (B) is the top view and front view of the enclosure press part 100 which were respectively shown in FIG. 2 is a perspective view showing an outline of a laser oscillator unit 71. FIG. (A) and (B) are a perspective view and a cross-sectional view showing an outline of a mirror 30 constituting a deflector installed inside the deflection unit 50, respectively. (C) is a deflection unit 50 in which the mirror 30 is arranged. FIG. FIG. 5 is a schematic plan view showing an example of a scanning locus of a pulse laser beam 72 incident on a mold (lower mold 59). It is a top view which shows the outline of the 1 module laser cleaning built-in type enclosure device by 2nd Example. It is a perspective view of the deflection | deviation unit 50 by which the optical system containing a galvanometer mirror is arrange | positioned. (A) And (B) is the top view and front view which show the outline of the 2 module laser cleaning built-in type apparatus by 3rd Example, respectively. (A) And (B) is the top view and front view which show the outline of a part of laser cleaning stand-alone type | mold apparatus by the 4th Example each couple | bonded with the semiconductor sealing device. (A) And (B) is the top view and front view of the enclosure press part 100 of the state which respectively inserted the stand-alone type laser cleaning apparatus. 2 is a perspective view showing an outline of a laser cleaning stand-alone apparatus including a deflection unit 50 and a moving mechanism of the deflection unit 50. FIG. It is a perspective view which shows the outline of the other example of the laser cleaning stand-alone apparatus provided with the moving mechanism of the deflection | deviation unit 50 and the deflection | deviation unit 50. FIG. It is a perspective view which shows the outline of the mirror 33 and the deflection | deviation unit 50 shown in FIG. It is a perspective view which shows the outline of the laser cleaning stand-alone type | mold apparatus by a 5th Example. (A) And (B) is the top view and front view which show the outline of the 2 module semiconductor sealing device with which the laser cleaning stand-alone type device was combined, respectively.

Explanation of symbols

4 Y-direction guide 5 X-direction guide 6 Coupling rod 10 Laser oscillator 11 Coupler 12 Optical fiber 13 Outlet 14a, 14b Mirror 15a, 15b Galvano motor 16a, 16b Galvano mirror 17 Galvano optical system 18 Collimator lens 20 Variable beam expander 21 Mask 22 Output unit 23 X direction moving device 24 Z direction moving device 28 Rotating brush 30 Mirrors 30a, 30b Reflecting surface 31 Virtual plane 33 Mirror 40 Operation panel 41 Dust collector 42 Dust collecting duct 43 Mirror air blow 44 Folding arm 45 Gold Mold coupling block 46 Y-direction guide 47 Folding rotation shaft 50 Deflection unit 50a Upper surface 50b Lower surface 50c Laser beam incident port 51 Rotating brush guide 52 Y-direction moving device 53 X-axis ball screw 54 Enclosed cavity portion 55 Pot portion 56 X-axis mode Data 57 Upper mold 58 Enclosed mold 58 Press tie bar 59 Lower mold 60 Encapsulated mold LM guide 61 Upper cage 62 Lower cage 63 Lead frame supply section 64 Supply conveyance section 65 Lead frame conveyance section 65a Chuck 66 Storage conveyance section 67 Cal break unit 68 Lead frame storage unit 69 Supply tray 70 Storage tray 71 Laser oscillator unit 72 Pulse laser beam 99 Control device 100 Enclosed press unit

Claims (12)

A laser light source that emits a pulse laser beam having a property of causing a lifting phenomenon and having a wavelength of 500 nm to 1.1 μm and a pulse width of 10 ns to 100 ns in a direction along a virtual plane, and a laser oscillator that emits the pulse laser beam A laser light source including a beam size adjuster for adjusting a beam size of the pulse laser beam emitted from the laser oscillator ;
A first moving device that moves the laser light source in a first direction that is parallel to the virtual plane and intersects the emission direction of the pulsed laser beam;
A second moving device that moves the laser light source in a second direction intersecting the virtual plane, or changes a posture of the laser light source so that an emission direction of the pulsed laser beam swings in the second direction; ,
By having a first surface and a second surface on which a pulsed laser beam emitted from the laser light source is incident, by moving the laser light source with the second moving device, or by performing attitude control, A pulse laser beam can be selectively incident on either the first surface or the second surface, and the pulse laser beam incident on the first surface and the pulse laser incident on the second surface A beam is a deflector arranged to be deflected opposite to each other with respect to the virtual plane;
A third moving device that moves the deflector in a direction parallel to the virtual plane and approaching the laser light source and moving away from the laser light source;
A control device for controlling the beam size adjuster so that a fluence on the surface of the cleaning object falls within a predetermined range in accordance with an incident angle at which the pulse laser beam deflected by the deflector is incident on the cleaning object; A laser cleaning device having: 2. The laser cleaning device according to claim 1, wherein the deflector has a shape such that a distance from the virtual plane to a deflection position of a laser beam does not change when the laser light source is moved in the first direction. The laser cleaning apparatus according to claim 1, wherein the second direction is orthogonal to the virtual plane. The laser cleaning apparatus according to claim 1, wherein the first direction and the second direction are orthogonal to each other. A main body to which the laser light source, the first moving device, and the second moving device are attached;
A folding part to which the deflector and the third moving device are attached;
5. The laser cleaning device according to claim 1, further comprising: a folding mechanism that holds the folding unit on the main body so as to be foldable about an axis parallel to the first direction. further,
Lower holding means for holding the lower mold of the mold, and upper holding means for holding the upper mold of the mold;
An elevating mechanism that moves at least one of the upper holding means and the lower holding means in a direction in which the distance between the upper holding means and the lower holding means is changed, and holds them so as to face each other across the virtual plane in a state where they are separated from each other; The laser cleaning device according to claim 1. further,
Gas jetting means for blowing gas to the deflector;
The gas ejecting means for ejecting the gas out of the space after the gas ejected from the gas ejecting means flows in the space through which the pulse laser beam emitted from the laser light source passes. The laser cleaning apparatus in any one of -6. A laser light source that emits a pulse laser beam having a property of causing a lifting phenomenon and having a wavelength of 500 nm to 1.1 μm and a pulse width of 10 ns to 100 ns in a direction along a virtual plane, and a laser oscillator that emits the pulse laser beam A laser light source including a beam size adjuster for adjusting a beam size of the pulse laser beam emitted from the laser oscillator ;
A beam scanning device capable of selectively entering and scanning a pulse laser beam emitted from the laser light source into one of two spaces divided by the virtual plane;
Gas jetting means for blowing gas onto the beam scanning device;
A gas ejecting means for ejecting the gas out of the space after the gas ejected from the gas ejecting means flows in the space through which the pulse laser beam emitted from the laser light source passes;
A control device for controlling the beam size adjuster so that a fluence on the surface of the cleaning object falls within a predetermined range in accordance with an incident angle at which the pulse laser beam emitted from the beam scanning device enters the cleaning object; A laser cleaning device having: further,
The laser cleaning apparatus according to claim 8, further comprising a deflector that deflects a pulse laser beam emitted from the laser light source and causes the laser beam to enter the beam scanning apparatus. further,
10. The laser cleaning apparatus according to claim 8, further comprising: a first moving device that moves the beam scanning device and the deflector in a first direction parallel to an emission direction of a pulsed laser beam. further,
The laser cleaning device according to claim 8, further comprising a second moving device that moves the beam scanning device in a second direction that is parallel to the virtual plane and intersects the first direction. . The laser cleaning apparatus according to claim 8, wherein the first direction and the second direction are perpendicular to each other.

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