JP4377641B2 - Wiring board manufacturing method - Google Patents

Description

  The present invention relates to a method for manufacturing an organic material-based wiring substrate, and more particularly to a method including a step of forming a through hole using a laser beam.

  Conventionally, as an organic material-based wiring board for mounting electronic components such as semiconductor elements, for example, a double-sided copper-clad plate in which copper foils are deposited on both upper and lower surfaces of an insulating layer made of a glass-epoxy plate is prepared. The through-hole penetrating up and down this double-sided copper-clad plate is drilled, and then a copper plating layer is deposited on the upper and lower copper foils and on the inner surface of the through-hole by electroless plating and electrolytic plating. And depositing plating layers on the upper and lower copper foils and forming through conductors made of plating layers on the inner surfaces of the through holes, and then applying the copper foils deposited on the upper and lower surfaces of the insulating layer; The plating layer deposited on the copper foil is manufactured by partially etching the plating layer using a photolithography technique to form a wiring conductor.

  Moreover, a buildup wiring board is manufactured by forming a buildup resin layer and a buildup wiring layer on both surfaces of the wiring board. In such a wiring board, the through hole to which the through conductor is attached is usually filled with a filling resin such as an epoxy resin.

By the way, in such an organic material-based wiring board, in order to increase the wiring density in response to the demand for reduction in size and thickness of the electronic device, for example, the insulating resin plate has a thickness of about 0.2 to 1 mm. Attempts have been made to make the hole diameter as small as 75 to 130 μm. Moreover, in order to form such a small through-hole with a diameter of about 75 to 130 μm, for example, a drilling method using a carbon dioxide gas laser is employed (see Patent Document 1).
JP 2000-91750 A

  However, when drilling with a carbon dioxide laser, a brittle carbonized layer of an organic material that forms an insulating layer is formed on the inner surface of the through hole, and a through conductor made of a copper plating layer is deposited on the inner wall of the through hole. There is a problem that the through conductor is peeled off from the carbonized layer on the wall surface of the hole, which causes a crack between the through conductor and the wiring conductor, resulting in poor conduction.

  In addition, peeling occurs between the through conductor and the hole-filling resin, and when a build-up wiring board is manufactured using this wiring board, the build-up wiring layer is broken due to cracks in the build-up resin layer. It also had the problem of end up.

  In addition, a general water washing process that has been performed in the past is to immerse in a water tank, or to spray the entire object with a shower having a water pressure of about 0.1 MPa, and remove foreign matter adhering to the surface of the substrate. The purpose was to remove. Therefore, the carbonized layer formed on the inner wall of the through hole by laser processing could not be removed.

  The present invention has been devised in view of such conventional problems, and an object of the present invention is to provide a method for manufacturing a wiring board capable of easily removing a carbonized layer from a through hole drilled using a laser beam. It is to provide.

The method of manufacturing a wiring board according to the present invention includes a step of laser processing an insulating resin plate in which a metal foil and an insulating layer containing a resin are laminated, and drilling a through hole penetrating the metal foil and the insulating layer. When, by comprising a step of removing the carbonized layer of the inner wall of the in the axial direction of the through hole at a pressure of 10~60MPa to flow the liquid in different directions alternately, the through holes that occurred when the laser processing It is characterized by.

In the wired board manufacturing method of the present invention, intermittent ones and to Rukoto flow at each orientation of the liquid it is desired.

In the wired board manufacturing method of the present invention, it is desirable to include bubbles in the liquid.

In the wired board manufacturing method of the present invention, it is desirable to flow the length al is ultrasonically vibrating the liquid.

Moreover, in the manufacturing method of the wiring board of this invention, it is desirable to make the said liquid contain the abrasive grain which consists of at least one of an inorganic filler and an organic filler .

In the wired board manufacturing method of the present invention, it is desirable that the liquid is mainly composed of water.

In the wired board manufacturing method of the present invention, Rukoto contain a rust inhibitor in the liquid is desired.

  By using such a method of manufacturing a wiring board, the carbonized layer formed in the through hole can be easily removed. Further, not only the carbonized layer but also dust attached to the through holes can be removed together.

  According to the method for manufacturing a wiring board of the present invention, by performing laser processing on the insulating resin plate, a through-hole penetrating the metal foil and the insulating resin plate can be provided, but the resin of the insulating resin plate is altered by heat. Thus, a carbonized layer is formed on the inner wall of the through hole. This carbonized layer is a heat-affected layer that accompanies laser processing of the insulating resin plate, and its mechanical strength is extremely weak compared to the resin part of the insulating resin plate, and is likely to be the starting point of cracks in the reliability test. Need to be removed.

In the present invention by to flow the liquid in the axial direction of the through hole, it is possible to remove the char layer formed on the inner wall of the penetrations holes.

Further, the liquid material pressure can reliably remove the carbide layer is a heat affected layer due to laser processing by the 10 ～60MPa of, also, such as a copper foil of the wiring board fluid pressure too strong peels off Thus, the yield is not reduced.

Further, by to flow the liquid to alternately different directions in the through hole, because a force is applied from a different direction to the carbide layer, to show the behavior as if carbide layer though vibrates at a lower hydraulic pressure It is possible to remove the carbonized layer. Further, in the case of the same hydraulic pressure, the processing time can be shortened.

Further, by to flow the liquid intermittently, the most since the impact strong liquid is repeated instantaneously striking the carbide layer, it becomes possible to remove the carbonized layer at a low hydraulic pressure. Further, when the hydraulic pressure is the same, the processing time can be shortened.

Further, the liquid is varied the pressure at which to flow into the through hole, it is also possible to shorten the processing time by giving the strength to pulsations.

Further, in Rukoto contain a bubble in the liquid, the bubbling effect popping bubbles when the bubbles hit the target, it is possible to increase the removing effect of the carbide layer.

Also, physical removal effect is further improved by flowing the liquid while ultrasonic vibration.

  Further, by adding abrasive grains to the liquid, the impact force and frictional force of the liquid are improved, so that the ability of removing the carbonized layer of the liquid can be increased, and the processing time can be shortened.

Moreover, the generally heavy specific gravity than the liquid in the liquid, by containing a hard inorganic filler, impact when the liquid containing the inorganic filler has collided with the target increases, it is possible to shorten the processing time .

  In addition, since the organic filler has flexibility, the impact when the organic filler collides with the target is relatively small, so that the effect of removing the carbonized layer can be improved and damage to the insulating resin plate can be reduced.

  Further, by adding both the inorganic filler and the organic filler to the liquid used for cleaning, it is possible to give a sufficient impact to the carbonized layer and reduce damage to the insulating resin plate.

  In addition, by using water as the main component of the liquid, unnecessary components do not remain on the insulating resin plate, which is advantageous in terms of raw material costs, and the price of the apparatus can be reduced.

Further, in Rukoto it contains a rust inhibitor to the liquid, after the flow of liquid into the through hole can prevent oxidation of the copper of the insulating resin sheet surface.

  The wiring board manufactured by the manufacturing method of the present invention is provided with through holes 3 in the insulating layer 1 as shown in FIG. 1, for example, and both sides of the insulating layer 1 are electrically connected to the through holes 3. A connecting through conductor 5 is provided. A space formed by surrounding the through conductor 5 is filled with an embedded resin 7. In addition, wiring conductors 13 made of a metal foil 9 and a plating layer 11 are formed on both surfaces of the insulating layer 1.

  The insulating layer 1 is, for example, a flat plate having a thickness of 0.2 to 0.8 mm in which glass cloth is impregnated with a resin such as an epoxy resin, a bismaleimide triazine resin, or a polyphenylene ether resin.

  The insulating layer 1 has a thickness of 0.2 mm or more, thereby forming a plurality of through holes 3 penetrating the insulating layer 1 and the metal foil 9, or wiring conductors 13 on both upper and lower surfaces of the insulating layer 1. Can be prevented from being warped or deformed due to the influence of heat or external force applied when forming the hole filling resin 7 or the like, and the flatness required for the wiring board Can be secured. Further, by setting the thickness of the insulating substrate 1 to 0.8 mm or less, when the through conductor 5 is formed inside the through hole 3, the plating solution can easily enter the inner wall of the through hole 3. It can be formed satisfactorily. Therefore, the thickness of the insulating layer 1 is preferably in the range of 0.2 to 0.8 mm.

  The insulating layer 1 is made of a resin material such as epoxy resin, bismaleimide triazine resin, polyphenylene ether resin or the like impregnated into a glass cloth. If it is contained so as to have substantially the same transmittance, the through-holes 3 are made substantially uniform when the through-holes 3 are drilled with a laser beam in an insulating resin plate that is a laminate of the insulating layer 1 and the metal foil 9. It is possible to form a favorable size. Therefore, in the resin such as epoxy resin, bismaleimide triazine resin, and polyphenylene ether resin impregnated into the glass cloth of the insulating layer 1, a filler made of silica, alumina, aramid resin, or the like is irradiated with laser light between the glass cloth portion and the resin portion. It is preferable to make it contain so that the transmittance | permeability may become substantially equivalent.

  Moreover, the insulating layer 1 which does not contain a glass cloth may be sufficient, and a thermal expansion coefficient can also be adjusted suitably using the insulating layer 1 which consists of a liquid crystal polymer. Alternatively, it is also possible to adjust characteristics such as a coefficient of thermal expansion and strength by using a plurality of types of these insulating layers 1.

  Further, the wiring conductor 13 deposited on the upper and lower surfaces of the insulating layer 1 is mounted on a wiring board, for example, by depositing a plating layer 11 such as copper plating on a copper foil 9 having a thickness of 3 to 18 μm. It functions as a part of a conductive path for electrically connecting an electrode of an electronic component (not shown) to a wiring conductor (not shown) of an external electric circuit board. An electronic component connection pad to which the electrode of the component is connected through a conductive bonding member such as solder and a wiring pattern drawn from the electronic component connection pad are formed. In addition, an external connection pad connected to the wiring conductor of the external electric circuit board via a conductive bonding member such as solder is formed.

  The copper foil 9 constituting the wiring conductor 13 has a thickness of 5 μm or more, so that the copper foil 9 is formed during microetching performed as a pretreatment for electroless copper plating after the through hole 3 is formed in the wiring conductor 13. Is not etched to cause pinholes in the copper foil 9 or defects in the copper foil 9, and sufficient adhesion and adhesion of the copper plating 11 to the copper foil 9 can be secured. On the other hand, the plating layer 11 such as copper plating can be satisfactorily formed on the copper foil 9 by setting the thickness to 20 μm or less. Therefore, the thickness of the copper foil 9 constituting the wiring conductor 13 is desirably in the range of 5 to 20 μm, and optimally in the range of 10 to 15 μm.

  In addition, when the total thickness of the copper foil 9 constituting the wiring conductor 13 and the plating layer 11 deposited thereon is less than 8 μm, the wiring conductor 13 has high electrical resistance, and on the other hand, exceeds 30 μm. It becomes difficult to form the wiring conductor 13 in a high-density wiring pattern. Therefore, the total thickness of the copper foil 9 constituting the wiring conductor 13 and the plating layer 11 deposited on the copper foil 9 is preferably in the range of 8 to 30 μm.

  Further, it is desirable that the through hole 3 having a diameter of 75 to 130 μm is formed through the insulating resin plate, and the through conductor 5 is formed by performing metal plating on the inner wall of the through hole 3. The through hole 3 is provided to provide a lead-out path for leading the through conductor 5 from the upper surface to the lower surface of the insulating layer 1 and is drilled by laser processing.

  The through-hole 3 has a diameter of 75 to 115 μm at the substantially central portion of the cross section of the insulating layer 1 and substantially the same size, and expands outward so as to be 90 to 130 μm at the opening of the insulating layer 1. It is preferable to keep the diameter.

  And when the hole diameter of the through-hole 3 is made as fine as 75 to 130 μm in this way, the size of the through-hole 3 becomes small, so that the through conductors 5 can be arranged at high density, and the extremely high density A wiring board having wiring can be obtained.

  Moreover, when the through-hole 3 forms the through-conductor 5 when depositing a plating metal inside the through-hole 3 and forming the through-conductor 5 due to the diameter expanding toward the outside, The plating solution enters the inside of the through hole 3 favorably, and as a result, the through conductor 5 can be satisfactorily deposited and formed in the through hole 3. In addition, when the diameter of the through hole 3 is 75 μm or more, when forming the through conductor 5 by filling the inside of the through hole 3 with a plating metal, a plating solution for forming the through conductor 5 is formed inside the through hole 3. The through conductor 5 can be satisfactorily formed by depositing the plated metal inside the through hole 3, and when the thickness is 130 μm or less, the through conductor 5 and the wiring conductor 13 are arranged at high density. It becomes possible. Therefore, the diameter of the through hole 3 is preferably in the range of 75 to 130 μm.

  Furthermore, when the diameter at the opening of the through hole 3 is 10 μm or more larger than the diameter at the substantially central portion in the thickness direction of the insulating layer 1, the through conductor 3 is formed by filling the inside of the through hole 3 with a plating metal. At this time, the plating solution for forming the through conductor 5 enters the inside of the through hole 3 favorably, so that the through conductor 5 can be satisfactorily deposited and formed in the through hole 3. When the diameter of the opening is larger than the diameter at the substantially central portion in the thickness direction of the insulating resin plate and the difference is 50 μm or less, the through-hole 3 having such a shape can be stably formed. It becomes. Therefore, it is preferable that the diameter at the opening of the through hole 3 is 10 to 50 μm larger than the diameter at the substantially central portion in the thickness direction of the insulating layer 1.

  Further, the through conductor 5 deposited and formed in the through hole 3 is made of a plating metal such as copper plating, and serves as a connection conductor for electrically connecting the wiring conductors 13 positioned above and below the insulating layer 1 with each other. Function. Since the through hole 3 has a shape that expands toward the outside as described above, the plated layer 5 is deposited and formed satisfactorily by depositing the plating layer 5 in the through hole 3.

  Next, a method for manufacturing the wiring board of the present invention for manufacturing the wiring board shown in FIG. 1 will be described in detail with reference to FIGS. 2 (a) to 5 (g). In this embodiment as well, an example is shown in which a thin wiring board having a diameter of 75 to 130 μm and a fine through hole 3 and a thickness of 0.2 to 0.8 mm is manufactured.

  First, as shown in FIG. 2 (a), for example, glass cloth is impregnated with an epoxy resin, a resin such as a bismaleimide triazine resin or a polyphenylene ether resin, on both surfaces of the insulating layer 1 having a thickness of 0.2 to 0.8 mm. An insulating resin plate 15 which is a double-sided copper-clad plate on which a copper foil 9 which is a metal foil 9 having a thickness of 5 to 20 μm is deposited is prepared.

  Note that the insulating layer 1 has a thickness of 0.2 mm or more, so that a plurality of through holes 3 are formed through the insulating layer 1 and the copper foil 9, and further, when the hole filling resin 7 is formed. The risk of warping or deformation of the wiring board due to the influence of heat or external force applied to the wiring board to prevent the flatness required of the wiring board from being ensured can be reduced, and the thickness can be reduced to 0. By setting the thickness to .8 mm or less, when the through conductor 5 is formed by depositing the plating on the inner wall of the through hole 3 as will be described later, it is difficult for the plating solution to enter the through hole 3 and the through conductor 5 is broken. Is not likely to occur. Therefore, it is preferable to use the insulating resin plate 15 having a thickness of 0.2 to 0.8 mm.

  Further, by setting the thickness of the copper foil 9 to 5 μm or more, the copper foil 9 is etched at the time of microetching performed as a pretreatment for plating after the formation of the through hole 3, thereby causing pinholes or defects in the copper foil 9. Therefore, it is possible to enhance the adhesion and adhesion of the plating on the copper foil 9.

  Moreover, when the thickness of the copper foil 9 is 20 μm or less, when the through hole 3 is drilled by laser processing, the through hole 3 having a diameter of 75 to 130 μm can be stably formed. Therefore, it is desirable to use a copper foil 9 having a thickness of 5 to 20 μm.

  For example, such a copper foil 9 is affixed to the upper and lower surfaces of the insulating layer 1 with a copper foil 9 having a thickness of about 8 to 40 μm, and the copper foil 9 is made of a copper etching solution such as sulfuric acid-hydrogen peroxide solution. It is formed by etching so that the film thickness becomes uniform and processing so that the thickness becomes 5 to 20 μm.

  Next, as shown in FIG. 2 (b), a through hole 3 having a diameter of 75 to 130 μm penetrating the insulating resin plate 15 and expanding toward the outside in the surface layer of the insulating layer 1 is drilled by laser processing.

  In this case, a carbonized layer 17 having a thickness of about several μm or less is formed on the inner wall of the through hole 3 along with the laser processing.

  Thus, when the diameter of the through hole 3 is as fine as 75 to 130 μm, the through conductor 5 and the wiring conductor 13 can be arranged with high density when the through conductor 5 and the wiring conductor 13 are formed. Thereby, a high-density wiring board can be obtained. Moreover, since the hole diameter of the through-hole 3 is expanding outward, when the through-conductor 5 is formed by filling the inside of the through-hole 3 with a plating metal, a plating solution for forming the through-conductor 5 is used. As a result, the through conductor 5 can be satisfactorily formed in the through hole 3.

  In addition, when the hole diameter of the through hole 3 is 75 μm or more, when forming the through conductor 5 by depositing a plating metal on the inner layer of the through hole 3, a plating solution for forming the through conductor 5 is used in the through hole 3. The inside of the through hole 3 can be satisfactorily formed, and the through conductor 5 can be satisfactorily formed inside the through hole 3. On the other hand, when the thickness is 130 μm or less, the through conductor 5 and the wiring conductor 13 can be arranged with high density. Therefore, the diameter of the through hole 3 is preferably in the range of 75 to 130 μm.

  Further, when the diameter of the opening of the through hole 3 is 10 μm or more larger than the diameter at the substantially central portion in the thickness direction of the insulating layer 1, a plated metal is deposited on the inner layer of the through hole 3 to form the through conductor 5. At the time of forming, the plating solution for forming the through conductor 5 can enter the inside of the through hole 3 well and form the through conductor 5 inside the through hole 3. When the diameter at the opening is larger than the diameter at the substantially central portion in the thickness direction of the insulating layer 1 in a range not exceeding 50 μm, the through hole 3 having such a shape can be stably formed. . Therefore, it is preferable that the diameter of the opening of the through hole 3 is about 10 to 50 μm larger than the diameter of the substantially central portion of the insulating layer 1.

  In order to form the through hole 3 in the insulating layer 1 and the copper foil 9, a laser processing sheet made of a resin having a black color or a color close to black, for example, which absorbs laser beam energy satisfactorily on the copper foil 9 is used. A method of attaching and irradiating the laser processing sheet with a carbon dioxide laser beam, or roughening the surface of the copper foil 9 with an arithmetic average roughness Ra in the range of 0.2 to 2 μm, and then the copper Either a method of performing a heat treatment for about 30 minutes at 150 ° C. in an oxidizing atmosphere on the foil 9 and irradiating the surface thereof with carbon dioxide laser light as a color having a black color or a color close to black that absorbs laser light energy well Is used to irradiate a predetermined position with a carbon dioxide laser beam with an output of 8 to 30 mJ at a pulse width of 40 to 240 [mu] sec to perforate the through-hole 3.

  At this time, by setting the output of the carbon dioxide laser beam to 8 mJ or more, the through hole 3 can be drilled to a sufficient size. Moreover, the hole diameter of the through-hole 3 in the insulating layer 1 can be accurately formed by setting it as 30 mJ or less. Therefore, it is preferable that the carbon dioxide laser beam to be irradiated has an output of 8 to 30 mJ and a pulse width of 40 to 240 μsec.

  In addition, in order to make the through-hole 3 have a shape that expands toward both the upper and lower surfaces, when drilling by laser processing, the energy per laser beam and the number of shots may be adjusted.

  For example, first, as shown in an enlarged cross-sectional view of the main part in FIG. 6A, the copper foil 9 and the insulating layer 1 are irradiated by irradiating several pulses of laser light having an output of 8 to 30 mJ and a pulse width of 40 to 500 μsec. The through-hole 3 having a shape that expands toward the upper and lower surfaces on the upper surface side of the insulating layer 1 is formed. At this time, since the energy of the laser beam is applied more on the upper surface side of the insulating layer 1 than on the lower surface side, the through hole 3 has a shape that expands outward on the upper surface side of the insulating layer 1. Further, since the copper foil 9 is less likely to be perforated than the insulating layer 1, the diameter of the through hole 3 is smaller than that of the insulating layer 1 at the portion of the copper foil 9, and the copper foil 9 protrudes inside the through hole 3. It becomes a shape.

  Next, as shown in the enlarged cross-sectional view of the main part in FIG. A part of the irradiated laser beam is reflected by the copper foil 9 protruding inside the through-hole 3 on the lower surface side of the insulating layer 1 and passes through the lower surface side of the insulating layer 1. It becomes a shape which expands in diameter toward the upper and lower both sides.

  Furthermore, by removing the copper foil 9 on the lower surface side of the insulating layer 1 with a laser, the diameter of the insulating resin plate 15 is increased toward the upper and lower surfaces on the upper and lower sides of the insulating layer 1 as shown in FIG. The through-hole 3 in which the upper and lower hole diameters are substantially the same can be formed.

  For example, when the through-hole 3 is formed using a carbon dioxide laser on the insulating resin plate 15 in which the copper foil 9 having a thickness of 10 μm is deposited on the upper and lower surfaces of the insulating layer 1 made of a glass-epoxy plate having a thickness of 0.4 mm. For this, the pulse width per pulse of the laser may be 40 to 240 μsec, the energy value may be 8 to 30 mJ, and the number of shots may be 3 to 10. At this time, if the number of shots of laser light irradiation is too small, the diameter of the lower surface side of the through-hole 3 cannot be increased well toward the outside, and if the number of shots is too large, the diameter of the lower surface side of the through-hole 3 is increased. It becomes too much.

  Moreover, by setting it as this laser condition, the protrusion width | variety of the metal foil 9 protruded to the through-hole 3 mentioned later can be suppressed within 30 micrometers.

  Further, by using a carbon dioxide laser, the laser processing conditions are a pulse width of 40 to 240 μs, an output of 8 to 30 mJ, and a shot number of 3 to 10 shots, so that the protruding width of the metal foil 9 protruding into the through hole 3 is within 30 μm. In addition, the through hole 3 can be stably formed in the insulating resin plate 15.

  That is, the copper foil 9 can be stably opened by setting the pulse width to 240 μs or less. Further, by setting the output to 8 mJ or more, it is possible to stably perforate up to the back surface of the insulating resin plate 15. Further, by setting the number of shots to 3 shots or more, since the laser light reaches the back surface of the insulating resin plate 15, it is possible to stably perforate the back surface of the insulating resin plate 15. Also, when the number of shots is 10 shots or less, the opening can be made similarly, and the energy is too large as in the case of exceeding 10 shots, and the through holes 3 formed in the insulating resin plate 15 become too large, thereby forming fine wiring. There is no such thing as impossible.

  In FIG. 6, the carbonized layer 17 is omitted.

  And as shown in FIG.3 (c), the copper foil 9 which protruded to the through-hole 3 of the insulating resin board 15 which provided the through-hole 3 produced as mentioned above was micro-etched, and it protruded inside it. By removing the part, the diameter of the through hole 3 can be increased and the copper foil 9 can be formed without protruding. In this microetching, a mixed solution of sulfuric acid and hydrogen peroxide solution, or an etching solution made of a cupric chloride aqueous solution or a ferric chloride aqueous solution is suitably used.

Then, by removing the carbonized layer 17 in the axial direction to the flow of liquid formed on the inner wall of the through-hole 3 of the through-hole 3, the insulating resin carbide layer 17 have been removed shown in FIG. 3 (d) A plate 15 is obtained.

As the to how the flow of liquid to the specifically through-hole 3, for example, as shown in FIG. 7 (a), an insulating resin sheet 15 so that the through-hole 3 of the insulating resin plate 15 is substantially perpendicular washed fixed to the apparatus 20, by supplying the liquid 19 above the insulating resin sheet 15, the liquid 19 flow can be illustrated to how the through-hole 3.

As another method, for example, as shown in FIG. 7B, a nozzle 23 a having a discharge port 21 for discharging the liquid 19 is disposed on the insulating resin plate 15 fixed in the cleaning device 20. ejecting liquid 19 toward the through-hole 3 of the insulating resin sheet 15, can be illustrated to a method flow of liquid 19 into the through-hole 3. In FIG. 7B, the liquid 19 is omitted.

  7 (a) and 7 (b), the supply pipe, the discharge pipe, and the circulation device for the liquid 19 are not shown, but it is natural that these may be used as appropriate. Further, it is desirable to dispose the filter in the circulation channel of the liquid 19, remove dust caused by the carbonized layer 17, and perform the treatment while purifying the liquid 19.

  In addition, it is desirable in terms of productivity and cost that the insulating resin plate 15 is not fixed and is continuously moved in the cleaning device 20. Alternatively, the nozzle 23 may be moved with respect to the insulating resin plate 15.

Also, when you flow the liquid 19 in the through-hole 3, it is important that a pressure of 10 ～60MPa, pressure in the range sufficient to remove the carbide layer 17 is a heat affected layer due to the laser processing Therefore, the insulating resin plate 15 is not destroyed because the copper pressure 9 of the insulating resin plate 15 is peeled off. Furthermore , a cleaning process can be performed in a short time by making a pressure into the range of 20-60 MPa.

  The fluid pressure at this time is measured using a fluid pressure meter (not shown) installed between a pump (not shown) and the nozzle 23. The pressure of the liquid 19 ejected from the nozzle 23 can be measured by measuring with a hydraulic pressure meter installed between the pump and the nozzle 23, and the set value of the pump is adjusted based on the measured value of the hydraulic pressure meter Adjust the hydraulic pressure with.

Further, and FIG. 7 (b) the liquid 19 on both surfaces of the insulating resin sheet 15 as shown can be supplied nozzle 23a, such as by placing 23b, alternately different directions to be flow of liquid 19 into the through-hole 3 Is important . By alternately circulating the liquid 19 in this way, the carbonized layer 17 can be uniformly removed with a small hydraulic pressure in a short time. Also, after the flow from a certain time in one direction for more than one minute as to specification flow alternately liquid 19 in the through hole 3, in addition to the flow to process than the opposite side, at a predetermined time, for example, 1 second a method of changing the flow to orientation in a short time interval of 10 seconds. The carbide layer 17 should have a shorter time of method of changing the flow to orientation in a short time interval 1 to 10 seconds in order to remove the heat-affected layer in which carbide layer 17 with the laser processing in the through-hole 3 It is preferable because it can be removed.

Further, by combining the method of changing the direction of flow of liquid 19, that the flow in each direction and intermittent ones Desirably, easily peeled removed carbide layer 17 rather than a continuous one. The intermittent flow to specifications of the liquid 19 in the through-hole 3, for example, after the flow a certain time the liquid 19 in 1 to 10 seconds, from to flow the liquid 19 in 2 seconds 0.1 seconds the time to stop provided to specifications then the flow a certain time the liquid 19 in 1 to 10 seconds can be exemplified.

Still when to flow the liquid 19 in the through-hole 3 may be it is desirable to vary the hydraulic pressure, over time changing the hydraulic pressure, increasing the peeling removal of the carbide layer 17 by attaching a strength . Certain time from 1 second to 10 seconds as a specification for changing the hydraulic pressure when to flow the liquid 19 in the through-hole 3, from 0.1 second liquid 19 after the flow at a pressure of 1~40MPa of 2 seconds the to method can be illustrated flow at a relatively low pressure between 0.05～0.1MPa. At this time, or shorter than the time to flow a time to flow a relatively weak hydraulic strong hydraulic pressure, it is forced to the value of the hydraulic pressure in the range of 20~40MPa or result more effective. The hydraulic pressure change at this time is set by programming the pump control system. Needless to say, the hydraulic pressure may be changed continuously. In addition, this hydraulic pressure may be rephrased as the flow rate of the liquid 19, and it goes without saying that the same effect can be obtained even when cleaning is performed by changing the flow rate of the liquid 19.

It is also desirable to incorporate bubbles into the liquid 19 in to the flow of liquid 19 into the through-hole 3. By including bubbles in the liquid 19, the removal effect of the carbonized layer 17 is further enhanced by a bubbling effect that bubbles are repelled when the bubbles in the liquid 19 come into contact with the carbonized layer 17 of the through-hole 3. The size of the bubbles contained in the liquid 19 is desirably 120 μm or less, and if it is 70 μm or less, it is effective.

Also, while the flow of liquid 19 into the through-hole 3, it is desirable to apply the ultrasonic vibration to the liquid 19 can further improve the effect of removing carbonized layer 17.

  In addition, it is desirable that the liquid 19 contains abrasive grains, and the inclusion of abrasive grains can improve the ability of the liquid 19 to remove the carbonized layer 17. When an inorganic filler is used as the abrasive grains, since the specific gravity is generally larger than that of the liquid 19 made of water or the like, a stronger impact can be applied, so that the cleaning time can be shortened. In particular, alumina and silica are more effective because of their high hardness.

  In addition, when an organic filler softer than an inorganic filler is used as abrasive grains, an impact when hitting a target is given, but the impact is absorbed by the organic filler itself, so that the insulating resin plate 15 The damage at the time of collision can be suppressed.

  Furthermore, by using a mixture of an inorganic filler and an organic filler as abrasive grains, it is possible to give a sufficient impact to the carbonized layer 17 and reduce damage to the insulating resin plate 15. Moreover, the liquid 19 according to the property of the target insulating resin plate 15 and the size of the through hole 3 can be prepared by appropriately adjusting the blending ratio.

  In order to maintain the fluidity of the liquid 19, the blending ratio of these abrasive grains is preferably 10% by volume or less. If desired, a surfactant or the like that improves the dispersibility of the abrasive grains may be used.

  Further, if the abrasive grains are too small, secondary agglomeration tends to occur. If the abrasive grains are too large, the impact may be too large or the through holes 3 may be blocked. It is desirable that it is ˜50 μm.

  Further, it is desirable that the liquid 19 is mainly composed of water that is inexpensive and easy to handle, and further, it is desirable to contain a rust preventive agent to prevent the metal of the insulating resin plate 15 from being oxidized. As this rust preventive agent, it is desirable to use a surface treatment agent using an imidazole compound.

  After the insulating resin plate 15 is cleaned by appropriately selecting and combining the methods described above, as shown in FIG. 4E, the electroless plated copper plating is formed inside the through hole 3 from which the carbonized layer 17 has been removed. 11a (not shown) and electrolytic copper plating 11b (not shown) are sequentially deposited to form the through conductor 5 in the through hole 3, and the electroless copper plating 11a having a thickness of 1 to 3 μm on the surface of the copper foil 9 And the electrolytic copper plating 11b whose thickness is 20-30 micrometers is deposited sequentially, and the plating layer 11 is formed. At this time, since the carbonized layer 17 is removed from the inner wall of the through hole 3, the through conductor 5 does not peel off from the carbonized layer 17 on the inner wall of the through hole 3, and the inner wall of the through hole 3 does not peel off. On the other hand, the through conductor 5 can be firmly attached.

  In order to deposit the electroless copper plating 11a, for example, a palladium active solution containing ammonium chloride-based palladium acetate is used to attach a palladium catalyst to the inner surface of the through-hole 3 and the surface of the copper foil 9, The electroless copper plating 11a may be deposited using a copper sulfate-based electroless copper plating solution. At this time, since the diameter of the through hole 3 is increased toward the outside at the opening of the insulating resin plate 15, the electroless copper plating solution satisfactorily enters the through hole 3, and as a result, the through hole 3. Electroless copper plating can be satisfactorily applied to the inner surface and the surface of the copper foil 9 to a substantially uniform thickness.

  Moreover, as an electrolytic copper plating solution for depositing the electrolytic copper plating 11b, for example, a copper sulfate-based electrolytic copper plating solution may be used. At this time, since the diameter of the through-hole 3 is increased toward the outside at the opening of the insulating resin plate 15, the electrolytic copper plating solution satisfactorily enters the through-hole 3, and as a result, the inside of the through-hole 3. Can be satisfactorily filled with electrolytic copper plating.

  Next, as shown in FIG. 4 (f), the filling resin 7 is buried in the inside of the through-hole 3 and cured, and then the surfaces of the copper foil 9 and the filling resin 7 are polished and flattened.

  Finally, as shown in FIG. 5G, the wiring conductor 13 is formed by a conventionally known subtracting method, semi-additive method, or the like. Thus, according to the method for manufacturing a wiring board of the present invention, the carbonized layer 17 in the through-hole 3 can be easily removed, so that extremely high-density wiring is possible without disconnection of the through-conductor 5. Can be obtained. Moreover, even if a buildup resin layer and a buildup wiring layer are laminated thereon to manufacture a buildup wiring board, a wiring board in which cracks from the through holes 3 do not occur in the buildup resin layer can be obtained. it can.

  Of course, the deposits and dust in the through-hole 3 can be removed as well.

  In the above-mentioned embodiment, the through-hole 3 has a diameter of 75 to 130 μm and a thickness of 0.2 to 0.8 mm as an example. However, the present invention is not limited to the above-described embodiment. Needless to say, various modifications can be made without departing from the scope of the present invention.

In order to evaluate the manufacturing method of wiring board, to prepare a sample was subjected to the following evaluation.

  The through-hole 3 was formed in the insulating resin board 15 which comprises the copper foil 9 with a thickness of 10 micrometers on the main surface, and whose thickness is 0.4 mm with the carbon dioxide laser. Carbon dioxide laser drilling conditions were such that the pulse width was 160 μs, the output was 20 mJ, and the number of shots was six.

  The diameter of the produced through hole 3 was 90 μm.

An insulating resin sheet 15 having a through-hole 3 fabricated in this manner was set in the cleaning device 20 shown in FIG. 5 (b), under the conditions shown in Table 1, the composition or the liquid 19, the fluid pressure, flow to Fare (Liquid discharge direction ) The presence or absence of bubbles was changed, and washing was performed for 5 minutes.

  And the external appearance confirmation after the liquid 19 distribution | circulation, the oxidation state of the copper foil 9 surface before plating, and the external appearance state after plating were confirmed.

  The fluid pressure described here is measured by a fluid pressure meter installed between a pump (not shown) and the nozzle 23. Thus, the pressure of the liquid 19 ejected from the nozzle can be measured by measuring the hydraulic pressure with the hydraulic pressure meter installed between the pump and the nozzle, and the set value of the pump based on the measured value of the hydraulic pressure meter. The hydraulic pressure can be adjusted by adjusting.

Table 1 shows the cleaning conditions and the evaluation results of the insulating resin plate 15 described above.

Using the cleaning method of the conventional insulating resin plate 15 spraying simultaneously liquid 19 from both sides of the insulation resin sheet 15 Sample No. In Nos. 1 and 2, the hydraulic pressure was changed to 0.1 and 1 MPa, but an abnormality in plating due to the remaining carbonized layer 17 was observed in the appearance after electroless plating regardless of the hydraulic pressure.

On the other hand, specimen No. In Nos. 3 to 37, although some copper particles were observed in the appearance inspection after plating in some of the samples, it was found that the level was practically no problem and the yield of the wiring board was remarkably improved.

Below, the sample produced with the manufacturing method of an Example is demonstrated in detail.

Mec Co. rust agent CA-5330A by changing the hydraulic pressure of the liquid 19 containing 0.1 wt% were flow from one sample No. 3 to 10, the hydraulic pressure is less than 5 MPa, and sample Nos. 1 and 3 MPa are used. In Nos. 3 and 4, copper particles having a size of 3 μm or less were confirmed in the through hole 3 after electroless plating, although there was no practical problem.

  In addition, sample No. having a hydraulic pressure of more than 60 MPa and 70 MPa. In No. 10, although there was no problem in practical use, some copper foil peeled off in some samples.

  On the other hand, sample Nos. With a hydraulic pressure in the range of 5 to 60 MPa. In 5-9, no abnormality was recognized in all items.

Further, the fluid pressure and 1 MPa, and the flow of liquid 19 from one direction only Sample No. In 3, whereas the copper particles is confirmed with a fine, well to the hydraulic and 1 MPa, changing the flow to orientation of the liquid 19 to alternately sample No. In 11, not observed at all abnormal in any of the items, the flow to orientation of the liquid 19 by changing alternately, it was found that the carbide layer 17 is removed the effect of the through-hole 3 is increased.

Further, the fluid pressure and 1 MPa, provided 5 seconds downtime, intermittently sample was flow of liquid 19 from only one direction No. Even 12 not observed at all abnormal in any of the items, by to flow the liquid 19 intermittently, it was found that the carbide layer 17 is removed the effect of the through-hole 3 is increased.

Further, the hydraulic pressure over time is changed from 1 to 40MPa for 5 seconds and further flow of the liquid 19 by repeating the cycle which varies over time to 1MPa from 40MPa Sample No. Even 13 not observed at all abnormal in any of the items, that to flow by varying the fluid pressure of the liquid 19, it was found that the carbide layer 17 is removed the effect of the through-hole 3 is increased.

The shape of the discharge port 21 as the bubble enters the introduced bubbles into the liquid 19, the sample is hydraulic and 1 MPa, and the flow of liquid 19 from only one direction No. Also in 14, not observed at all abnormal in any of the items, that to flow to the liquid 19 is introduced bubbles, it was found that the carbide layer 17 is removed the effect of the through-hole 3 is increased.

Further, an ultrasonic transducer mounted in the nozzle 23, while vibrating the ultrasonic transducer, the sample fluid pressure and 1 MPa, and the flow of liquid 19 from only one direction No. Also in 15, not observed at all abnormal in any of the items, that to flow while applying ultrasonic vibration to the liquid 19, it was found that the carbide layer 17 is removed the effect of the through-hole 3 is increased.

Sample No. In Nos. 16 to 22, the abrasive-containing liquid 19 produced by adding 10% by volume of Al ₂ O ₃ powder having an average particle diameter of 5 μm and a maximum particle diameter of 20 μm to the liquid 19 as an inorganic filler is changed to a through-hole. and flow from one direction to the 3.

  Sample No. with a hydraulic pressure of less than 5 MPa. Also in 16 and 17, the addition of the inorganic filler to the liquid 19 eliminated the occurrence of abnormal plating due to the remaining carbonized layer 17. Sample No. In addition to Samples 16 and 17, Sample No. In 18 and 19, no abnormality was observed in all evaluation items.

  However, in the liquid 19 containing an inorganic filler, while the cleaning effect was high, the sample No. Although it was a grade which has no influence on the quality of a product at 20-22, some copper foils peeled.

  In addition, a sample in which an organic filler obtained by processing an organic filler mainly composed of epoxy into spherical particles having an average particle diameter of 5 μm as abrasive grains is added to 10% by volume of the liquid 19 and the liquid pressure is changed to perform a cleaning process. No. In Nos. 23 to 29, a sample No. with a liquid pressure of 70 MPa was used. In 29, although some copper foil peeling was confirmed, there was no influence on a product. In addition, sample No. with a hydraulic pressure of 60 MPa or less. In Nos. 23 to 28, no abnormality was observed in all the evaluation items, and the range of the hydraulic pressure at which good results were obtained was wider than when no organic filler was added.

In addition, Sample No. 2 was prepared by adding 5% by volume of an organic filler mainly composed of Al ₂ O ₃ powder and epoxy to the liquid 19 and changing the liquid pressure. Even in 30 to 36, almost the same result as that obtained when the organic filler was used was obtained, and the range of the hydraulic pressure at which better results were obtained than when the abrasive grains were not used was widened.

  In the samples described above, water was used as the liquid, and evaluation was performed by adding a rust inhibitor. On the other hand, Sample No. which was washed without adding a rust inhibitor. In No. 37, it was found that the surface of the copper foil before plating was slightly oxidized. However, since it was a very thin film, the plating was formed normally.

It is sectional drawing of the wiring board manufactured by the manufacturing method of the wiring board of this invention. It is process drawing explaining the process of the manufacturing method of the wiring board of this invention. It is process drawing explaining the process of the manufacturing method of the wiring board of this invention. It is process drawing explaining the process of the manufacturing method of the wiring board of this invention. It is process drawing explaining the process of the manufacturing method of the wiring board of this invention. It is process drawing explaining the punching process which forms a through-hole among the manufacturing methods of the wiring board of this invention. It is the schematic explaining the washing | cleaning process of the wiring board which removes a carbonization layer among the manufacturing methods of the wiring board of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Insulating layer 3 ... Through-hole 5 ... Through-conductor 7 ... Embedded resin 9 ... Metal foil 11 ... Plating layer 15 ... Insulating resin board 13 ... Wiring conductor 17 ... Carbonized layer 19 ... Liquid

Claims (7)

Laser processing an insulating resin plate in which a metal foil and an insulating layer containing a resin are laminated, and drilling a through hole penetrating the metal foil and the insulating layer; and in the axial length direction of the through hole to flow the liquid into different directions alternately at a pressure of 10～60MPa, method of manufacturing a wiring substrate, characterized by comprising the step of removing the carbonized layer of the inner wall of the through hole that occurred when the laser processing. A method for manufacturing a wiring board according to claim 1, wherein the intermittent ones and to Rukoto flow in each direction of the liquid. A method for manufacturing a wiring board according to claim 1 or 2, characterized in that the inclusion of air bubbles in the liquid. A method for manufacturing a wiring board according to any one of claims 1 to 3, wherein the flow length al is ultrasonically vibrating the liquid. A method for manufacturing a wiring board according to any one of claims 1 to 4, characterized in that the inclusion of abrasive grains made of at least one of an inorganic filler and organic filler in the liquid. A method for manufacturing a wiring board according to any one of claims 1 to 5, characterized in that the liquid is water as a main component. A method for manufacturing a wiring board according to claim 6, characterized in Rukoto contain a rust inhibitor in the liquid.

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