JP4379092B2 - Manufacturing method of display device - Google Patents

Description

  The present invention relates to a method for manufacturing a display device having a display panel in which two panel substrates are bonded together.

  When an electric field exceeding a certain threshold is applied to the surface of a conductor such as metal or semiconductor placed in a vacuum, electrons pass through the barrier due to the tunnel effect, and electrons are emitted into the vacuum even at room temperature. This phenomenon is called field emission, and an element that emits electrons by this phenomenon is called a field emission device. In recent years, FED (Field Emission Display) using field emission type electron-emitting devices has attracted attention. The FED is a flat display device (planar display device) including a display panel in which a large number of electron-emitting devices are formed on a cathode substrate by using a semiconductor processing technique or the like. In this FED, electrons are emitted by the concentration of an electric field from an electron emission element that is electrically selected (addressed), and the electrons are collided with a phosphor on the anode substrate side, and an image is generated by excitation and emission of the phosphor. it's shown.

  An FED display panel has a structure in which a cathode substrate and an anode substrate are arranged to face each other with a minute gap therebetween, and a gap space portion therebetween is sealed in a vacuum state. Therefore, a spacer is interposed between the cathode substrate and the anode substrate so that they can withstand atmospheric pressure, and both substrates are supported by this spacer. The FED is roughly classified into a low voltage type and a high voltage type depending on the level of voltage (anode voltage) applied to the anode electrode for phosphor excitation. Since the spacer used in the high voltage type FED is formed in a long thin plate shape, for example, the height dimension is 1 to 2 mm and the thickness dimension is 0.05 to 0.1 mm. Becomes a high shape.

  Therefore, Patent Document 1 below describes that when a spacer is attached in the assembly process of the display panel, the spacer is fixed on the panel substrate using an adhesive, and Patent Document 2 below describes that the spacer is fixed on the panel substrate. It describes that a pair of supports is formed, and spacers are forcibly sandwiched and fixed by the supports.

JP 2000-57979 A JP 2000-156181 A

  However, in the method of fixing the spacer using an adhesive, the characteristics of the display device may deteriorate due to the effect of degassing from the adhesive. Further, in the method of sandwiching and fixing the spacer with the support, a process of forming the support on the panel substrate is required separately. Further, a protrusion is generated when the spacer is inserted between the pair of supports, and the protrusion may cause deterioration of the pressure resistance characteristics of the display panel. Further, when the support is formed of resin, the characteristics of the display device may be deteriorated due to the effect of degassing from the support.

  A method for manufacturing a display device according to the present invention is a method for manufacturing a display device having a display panel in which a first panel substrate and a second panel substrate are bonded to each other via a thin plate spacer. While the spacer is vertically supported by the spacer support on the panel substrate, the second panel substrate is superimposed on the first panel substrate and the two panel substrates are sandwiched from both sides by a pair of pressure members. After the pressure is applied and then the spacer support is retracted from the first panel substrate while maintaining the pressure applied by the pair of pressure members, the space between the first panel substrate and the second panel substrate is reduced. The space is sealed in a vacuum state, and then the pressure state by the pair of pressure members is released.

  In the method for manufacturing a display device according to the present invention, a spacer is vertically supported on a first panel substrate using a spacer support, and the first panel substrate and the second second panel are interposed via the spacer. By pressing the substrate with a pair of pressing members, the spacer is fixed between the panel substrates in a pressurized state. In addition, the spacer support is retracted from the first panel substrate while maintaining the pressure state by the pair of pressure members, and then the space between the first panel substrate and the second panel substrate is evacuated. After sealing in the state, by releasing the pressure state by the pair of pressure members, the member that supports the spacer does not remain inside the assembled display panel.

  According to the display device manufacturing method of the present invention, there is no remaining member for supporting the spacer in the assembled display panel, so that it is possible to avoid deterioration of the display device characteristics due to degassing in the display panel. . In addition, since it is not necessary to form a support on the first panel substrate and the spacer can be easily assembled using the spacer support, the manufacturing cost can be reduced. Furthermore, since there is no generation of projections due to the use of the support, the breakdown voltage characteristics of the display panel can be improved.

  Hereinafter, specific embodiments of the present invention will be described in detail with reference to the drawings.

    FIG. 1 is a cross-sectional view showing a configuration example of a display panel of a flat panel display (FED) to which the present invention is applied. In FIG. 1, a black matrix 2 and a phosphor 3 are formed on one surface of an anode substrate 1 having a flat plate shape. The anode substrate 1 serves as a front substrate of the display panel, and is composed of, for example, a transparent glass substrate. The line width of the black matrix 2 is set within a range of about 100 to 200 μm, although it depends on the screen size and display resolution of the display panel. The phosphors 3 are formed at a predetermined pitch on one surface of the anode substrate 1 so as to fill in the gaps (gaps) between the respective black matrices 2. The black matrix 2 and the phosphor 3 are formed on an anode electrode (not shown) laminated on one surface of the anode substrate 1. The anode electrode is composed of a transparent electrode such as ITO (Indium Tin Oxide). The anode substrate 1 described above corresponds to the first panel substrate in the present invention.

  On the other hand, an emitter 5 is formed on one surface of the cathode substrate 4 having a flat plate shape (that is, a surface facing the anode substrate 1). The cathode substrate 4 serves as a back substrate of the display panel, and is made of an insulating substrate such as glass. The emitters 5 are formed at a predetermined pitch on one surface of the cathode substrate 4 corresponding to the phosphor 3 on the anode substrate 1 side. The emitter 5 is a portion that emits electrons by field emission (a portion that becomes an electron emission source), and is formed on a cathode electrode (not shown) that is stacked on one surface of the cathode substrate 4. The emitter 5 is formed on one surface of the cathode substrate 4 at an intersection of a cathode electrode (not shown) and a gate electrode laminated on the cathode electrode via an insulating layer. The cathode substrate 4 described above corresponds to the second panel substrate in the present invention.

  The anode substrate 1 and the cathode substrate 4 are bonded together so as to face each other. A plurality (only two are shown in FIG. 1) of spacers 6 are interposed between the anode substrate 1 and the cathode substrate 4. By interposing the spacer 6, a predetermined gap (gap space) is secured between the anode substrate 1 and the cathode substrate 4. The spacer 6 is resistant to compressive stress so that it can withstand atmospheric pressure when the inside of the display panel is evacuated, and can be held in a uniform gap over the entire surface of the display panel, and an electron beam emitted from the emitter It is required that the trajectory is not affected, that there is little outgassing and that it is stable in a vacuum, and that it can withstand high temperature processing during frit sealing and baking. The spacer 6 is disposed on the black matrix 2 so as not to adversely affect the display image.

  On the other hand, the outer peripheral portion of the display panel including the anode substrate 1 and the cathode substrate 4 is sealed with a seal portion 7. The seal portion 7 is formed in a rectangular frame shape in plan view along the outer shape of the anode substrate 1 and the cathode substrate 4. By this seal portion 7, the gap space (inside the display panel) between the anode substrate 1 and the cathode substrate 4 is maintained in a vacuum state.

  FIG. 2 is a perspective view showing the appearance of the spacer 6 employed in the embodiment of the present invention. As shown in the drawing, the spacer 6 is formed in a long thin plate shape as a whole. Although the dimensions of the spacer 6 depend on the size of the display panel, in the high voltage type FED, for example, the height dimension is H = 2 mm, the thickness dimension is T = 100 μm, and the length dimension is L = 100 mm. . As a material of the spacer 6, for example, an insulating material such as ceramics or glass is used.

  Subsequently, as a method for manufacturing a display device (FED) according to an embodiment of the present invention, a method that is particularly applicable when the anode substrate 1 and the cathode substrate 4 are bonded together via the spacer 6 will be described.

  First, when the anode substrate 1 produced in the anode substrate production process, the cathode substrate 4 produced in the cathode substrate production process, and a plurality of spacers 6 interposed between these substrates are prepared, The anode substrate 1 is fixed and supported in a horizontal state so that the formation surface faces upward.

  Next, as shown in FIG. 3A, a spacer support 8 is disposed on the anode substrate 1 fixed in a horizontal state. The anode substrate 1 is provided with an alignment mark M1 for alignment. The spacer support 8 is formed in a plate shape using, for example, ceramics, metal, resin, or the like. The spacer support 8 generally includes a movable arm 9 and a comb-shaped support portion 10. The movable arm 9 is supported by an arm driving means (not shown) so as to be movable in the horizontal direction (X direction, Y direction). The support portion 10 is formed integrally with the distal end portion of the movable arm 9. A plurality of support grooves 11 having a groove width slightly larger (for example, about 10 μm) than the thickness dimension T (see FIG. 2) of the spacer 6 is formed in the support portion 10. Each support groove 11 is formed in a slit shape with a uniform groove width.

  The spacer supports 8 are arranged on the anode substrate 1 in pairs so as to support both ends of the spacer 6 in the longitudinal direction. At this time, each spacer support 8 is arranged in a slightly floating state so as not to contact the upper surface of the anode substrate 1 (the formation surface of the black matrix 2). Further, in the horizontal plane along the substrate surface of the anode substrate 1, the support groove 11 of each spacer support 8 is positioned and arranged on the black matrix 2 of the anode substrate 1. Further, in each spacer support 8, the support grooves 11 that support the same spacer 6 are arranged in an opposing state on the same black matrix 2 formation line.

  When the pair of spacer supports 8 are arranged on the anode substrate 1 in this way, the spacer 6 is held vertically (vertically) by a chucking mechanism (for example, a vacuum chuck) (not shown) and arranged above the anode substrate 1. Then, by vertically lowering the chucking mechanism, one end of the spacer 6 in the longitudinal direction is placed in the support groove 11 of one spacer support 8 and the other end is placed as shown in FIG. The other ends are simultaneously fitted in the support grooves 11 of the spacer support 8. As a result, the spacer 6 is vertically supported by the pair of spacer supports 8 on the anode substrate 1.

  Next, the chucking of the spacer 6 by the chucking mechanism is released (for example, the vacuuming is released), and the chucking mechanism is retracted from the anode substrate 1. At this time, even if the chucking is released, the spacer 6 is supported vertically by the pair of spacer supports 8, so that the spacer 6 does not fall on the anode substrate 1. The attaching operation of the spacer 6 by the chucking mechanism may be performed one by one or a plurality of sheets may be performed together.

  Thereafter, when the predetermined number of spacers 6 have been erected on the anode substrate 1, the cathode substrate 4 is overlaid on the anode substrate 1 at a predetermined distance as shown in FIG. The cathode substrate 4 is provided with alignment marks M2 for alignment and through holes H for exhaust. At this time, the cathode substrate 4 is held in a state of being separated from the spacer 6. In this state, the substrates are aligned using alignment marks M1 and M2 for alignment provided on both substrates. Then, when the alignment of the substrate is completed, the cathode substrate 4 is moved (lowered) toward the anode substrate 1, and the lower surface of the cathode substrate 4 (formation surface of the emitter 5) is brought into contact with the spacer 6 during the movement. At this time, the posture of the cathode substrate 4 is held in a horizontal state so as to be parallel to the anode substrate 1, and the spacer 6 supported by the pair of spacer supports 8 has almost no lateral (horizontal) force. Does not work. Therefore, the support state (standup state) of the spacer 6 by the pair of spacer supports 8 is maintained as it is.

Subsequently, as shown in FIG. 4B, the anode substrate 1 and the cathode substrate 4 that are moved toward and away by opening and closing drive are disposed between the pair of pressure members 12A and 12B, and in this state, the pressure drive unit As shown in FIG. 4C, the pair of pressure members 12A and 12B are moved in a direction approaching each other (arrow direction) by driving 13, so that the anode substrate 1 and the cathode substrate 4 are paired with each other. 12A and 12B are pressurized so as to be sandwiched from both sides (vertical direction). At this time, the pressure applied by the pair of pressure members 12 </ b> A and 12 </ b> B is also applied to the spacer 6 sandwiched between the anode substrate 1 and the cathode substrate 4. Under this pressurized state, the standing state of the spacer 6 is held by the clamping force (pressing force) between the anode substrate 1 and the cathode substrate 4. That is, the spacer 6 is fixed between the anode substrate 1 and the cathode substrate 4 in a pressurized state. Incidentally, although the atmospheric pressure (1 kg / cm ² ) is finally applied to the anode substrate 1 and the cathode substrate 4, the spacers 6 are kept upright even if each substrate is pressurized with a force smaller than the atmospheric pressure. It is possible to hold it in a (fixed state). In addition, the pressure applied to the anode substrate 1 and the cathode substrate 4 using the pair of pressure members 12A and 12B is desirably set to be equal to or lower than the atmospheric pressure in order to avoid unnecessary deformation of the substrate.

  Next, as shown in FIG. 5, the pair of spacer supports 8 are moved away from each other (in the direction of the arrow) and retracted from the anode substrate 1 under the above-described pressurized state, thereby The fitting state between the end portion and the support groove 11 is released. Thereafter, with the pressure applied by the pair of pressure members 12A and 12B maintained, as shown in FIG. 6A, the seal material 14 made of paste frit glass is dispensed along the outer periphery of the cathode substrate 4. The same sealing material 15 is applied to the exhaust through hole H, and the tip tube 16 is connected thereto. This state is represented by a cross section viewed from the longitudinal direction of the spacer 6 as shown in FIG. In FIGS. 6A and 6B, the pressure members 12A and 12B are not shown. Moreover, the sealing material 14 forms the sealing part 7 shown in the said FIG.

  Subsequently, in the same manner as described above, the anode substrate 1 and the cathode substrate 4 are fired in a state where they are pressed by the pair of pressing members 12A and 12B. As a result, the sealing materials 14 and 15 are completely cured. Next, the tip tube 16 is evacuated to make the gap space between the anode substrate 1 and the cathode substrate 4 in a vacuum state, and the tip tube 16 is sealed while maintaining this state. As a result, the space between the anode substrate 1 and the cathode substrate 4 (the space in which the spacer 6 is interposed) is sealed in a vacuum state. Thereafter, the pair of pressure members 12A and 12B are separated from the anode substrate 1 and the cathode substrate 4 to release the pressure state. At this time, even if the pressure state by the pair of pressure members 12A and 12B is released, the inside of the display panel is in a vacuum state, so that atmospheric pressure acts on the anode substrate 1 and the cathode substrate 4, respectively. The spacer 6 is held in an upright state (fixed state) by the applied pressure.

  As described above, in the manufacturing method of the present embodiment, a predetermined number of spacers 6 are vertically supported by the pair of spacer supports 8 on the anode substrate 1, and then the cathode substrate 4 is overlapped to sandwich the spacers 6. The spacer 6 is fixed in a pressurized state, the pair of spacer supports 8 are retracted from the anode substrate 1 while maintaining the pressurized state, and the inside of the panel is sealed in a vacuum state by frit seal and vacuum exhaust. Then, in order to release the pressure state, no member (adhesive, gripper, etc.) for supporting the spacer 6 remains in the assembled display panel. Therefore, it is possible to avoid deterioration of the display device characteristics due to degassing in the display panel. Moreover, since it is not necessary to form a support body on the anode substrate 1 and the spacer 6 can be easily assembled using the spacer support 8, the manufacturing cost can be reduced. Further, instead of forcing the spacers between the supports, the spacers 6 are vertically fitted by fitting the end portions of the spacers into the support grooves 11 of the spacer support 8 formed slightly wider than the spacer thickness. Since the supporting method is adopted, no protrusion is generated when the spacer 6 is attached. Therefore, the breakdown voltage characteristics of the display panel can be improved.

  In the above embodiment, the case where one spacer 6 is arranged on one horizontal line is exemplified, but when a plurality of spacers 6 are linearly arranged on one horizontal line, they are adjacent in the horizontal line direction. A spacer support 8 is inserted into the gap between the matching spacers 6 from the direction perpendicular to the longitudinal direction of the spacer, and is moved appropriately in the horizontal axis direction (X direction, Y direction). The spacer 6 can be supported by the pair of spacer supports 8 and the pair of spacer supports 8 can be retracted from the anode substrate 1 in a pressurized state.

It is sectional drawing which shows the structural example of the display panel of the display apparatus with which this invention is applied. It is a perspective view which shows the external appearance of the spacer employ | adopted by embodiment of this invention. FIG. 5 is a view (No. 1) showing the method for manufacturing the display device according to the embodiment of the invention. FIG. 5 is a diagram (No. 2) illustrating the method for manufacturing the display device according to the embodiment of the present invention. FIG. 7 is a diagram (No. 3) illustrating the method for manufacturing the display device according to the embodiment of the present invention. FIG. 6 is a view (No. 4) showing the method for manufacturing the display device according to the embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Anode substrate, 4 ... Cathode substrate, 6 ... Spacer, 8 ... Spacer support, 11 ... Support groove, 12A, 12B ... Pressure member

Claims (3)

A method for manufacturing a display device having a display panel in which a first panel substrate and a second panel substrate are bonded to each other via a thin plate-like spacer,
While the spacer is vertically supported by the spacer support on the first panel substrate, the second panel substrate is overlaid on the first panel substrate and the two panel substrates are paired with pressure. Pressurize so that it is sandwiched from both sides with a member,
Next, with the pressure applied by the pair of pressure members maintained, the spacer support is retracted from the first panel substrate, and then the first panel substrate and the second panel substrate The space between them is sealed in a vacuum state,
Then, the pressurization state by the pair of pressurizing members is released. The method for manufacturing a display device according to claim 1, wherein a pressure applied when pressurizing the first panel substrate and the second panel substrate is set to an atmospheric pressure or less. The spacer support has a support groove corresponding to the thickness dimension of the spacer, and the spacer is vertically supported by fitting the end of the spacer into the support groove on the first panel substrate. The method of manufacturing a display device according to claim 1.

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