JP4380341B2 - Resin coating device - Google Patents

Description

  The present invention relates to a resin coating apparatus that coats an underfill resin in a gap between a substrate and a semiconductor element mounted face-down.

  Conventionally, this type of resin coating apparatus generally has a configuration as shown in FIG.

  That is, in FIG. 4, a semiconductor bare chip (hereinafter referred to as a semiconductor chip) 1 is mounted face-down on a carrier substrate (hereinafter simply referred to as a substrate) 2 via bumps (not shown). Here, underfill resin (hereinafter simply referred to as resin) 4 is injected and applied between the semiconductor chip 1 and the substrate 2 in order to improve connection reliability.

  Here, as a method for injecting and applying the resin 4, the resin 4 is applied from the nozzle 3 along one side of the semiconductor chip 1, and then the resin 4 is wetted and spread over the entire back surface of the semiconductor chip 1 using a capillary phenomenon. It was a thing.

As prior art document information relating to the invention of this application, for example, there is Patent Document 1.
Japanese Patent No. 2737684

  However, the above-described conventional configuration has a problem that the resin 4 does not spread evenly over the entire back surface of the semiconductor chip 1 or takes a very long time to spread over the entire back surface.

  The present invention has been made to solve the above-described conventional problems, and an object of the present invention is to realize a resin coating apparatus that can apply a resin to the entire semiconductor chip uniformly and in a short time.

In order to solve the above problems, a coating apparatus of the present invention is a resin coating apparatus for applying an underfill resin between a substrate and a semiconductor element mounted face-down, and the semiconductor element is mounted face-down. A fixing base for fixing the substrate, a nozzle for injecting underfill resin between the semiconductor element and the substrate, and a nozzle moving means for moving the nozzle, the nozzle moving means, A means for moving the nozzle in the X-axis direction and / or the Y-axis direction along the vicinity of the boundary between the semiconductor element and the substrate, and after injecting an underfill resin between the substrate and the semiconductor element, together with the entire fixing base in conjunction with movement of the nozzle by the nozzle moving means is swung, the amplitude of the fixing base entire swing of at least a semiconductor element It is characterized in longer than the length of one side of the.

  With this configuration, the movement of the nozzle after the resin injection is triggered, and the capillary phenomenon can be further promoted, so that the resin can be applied to the entire semiconductor chip uniformly and in a short time. .

  The resin coating apparatus of the present invention is characterized in that a sheet-like workpiece composed of a plurality of pieces is fixed to a fixed base, and the resin is sequentially injected between a semiconductor chip and a substrate constituting each piece. With this configuration, the nozzle can move between the pieces, and the capillary phenomenon can be further promoted. Therefore, the resin can be uniformly applied to the entire semiconductor chip in a short time. In addition to being able to increase mass productivity.

  Further, the resin coating apparatus of the present invention is to swing the entire workpiece using the vibration when the nozzle moving means moves to the next piece, and with this configuration, the nozzle is not brought into contact with the chip, In addition, the resin can be uniformly applied to the entire semiconductor chip in a short time without providing a separate swing device.

  Further, the resin coating apparatus of the present invention is characterized in that the resin is injected while heating the substrate, and the viscosity of the resin can be lowered by this configuration, so that the capillary phenomenon can be further promoted. The resin can be uniformly applied to the entire semiconductor chip in a short time.

  Further, the resin coating apparatus of the present invention is characterized in that the resin is a thermosetting resin, and since it is a resin that tends to lower the viscosity when a temperature is applied, the capillary phenomenon can be further promoted. The resin can be uniformly applied to the entire semiconductor chip in a short time.

  In addition, the resin coating apparatus of the present invention is characterized in that the resin is an epoxy resin, and since it is a resin that tends to lower the viscosity when a temperature is applied, the capillary phenomenon can be further promoted, The resin can be applied uniformly over the entire semiconductor chip in a short time.

  In addition, the resin coating apparatus of the present invention is characterized in that the substrate is preheated in advance and is kept warm for a predetermined time after the resin is injected, and by preheating, the viscosity of the resin can be reduced and the injection is performed. Since the state where the viscosity is lowered can be maintained by heating and maintaining afterwards, a uniform resin fillet can be formed around the semiconductor chip.

  In addition, the resin coating apparatus of the present invention is characterized in that the substrate is swung even during heat insulation heating, and the state of reduced viscosity can be maintained by heat insulation heating after injection, A uniform resin fillet can be formed around the semiconductor chip.

  Further, the resin coating apparatus of the present invention is characterized in that the resin is injected while applying a predetermined pressure of air to the nozzle, and the air pressure in the middle is made larger than the air pressure at the start and end of the injection. With this configuration, the amount of resin injected can be applied almost evenly from one end to the other end of the semiconductor chip.

  The resin coating apparatus according to the present invention is characterized in that the oscillation of the entire fixed base is a low frequency of about 5 Hz or less. With this configuration, a load caused by the oscillation applied to the connecting portion between the semiconductor chip and the substrate is provided. Can be further reduced.

  Further, the resin coating apparatus of the present invention is characterized in that a buffer means is provided on the leg portion supporting the fixed base, and in order to use the swing accompanying the movement of the nozzle by this configuration, a separate swing device is provided. Without being provided, the resin can be applied uniformly over the entire semiconductor chip in a short time.

  As described above, according to the present invention, since the movement of the nozzle after the resin injection is triggered and the capillary phenomenon can be further promoted, the resin is uniformly applied to the entire semiconductor chip in a short time. It is something that can be done.

(Embodiment 1)
Embodiment 1 of the present invention will be described below with reference to the drawings.

  FIG. 1 is a schematic diagram showing a schematic configuration of a resin coating apparatus according to Embodiment 1 of the present invention, and FIG. 2 is a side view thereof.

  1 and 2, reference numeral 1 denotes a semiconductor bare chip (hereinafter referred to as a semiconductor chip), on which a plurality of bumps 6 are formed. Reference numeral 2 denotes a carrier substrate (hereinafter simply referred to as a substrate) on which a wiring pattern (not shown) is formed corresponding to the bumps 6. Reference numeral 3 denotes a nozzle that injects an underfill resin (hereinafter simply referred to as resin) 4 between the semiconductor chip 1 and the substrate 2 to enhance connection reliability. The resin 4 extends along one side of the semiconductor chip 1. It is configured to move while injecting. Reference numeral 7 denotes a fixing base for fixing the substrate 2 and is configured to swing in the 5-X direction or the 5-Y direction in conjunction with the movement of the nozzle 3 after the resin 4 is injected by the nozzle 3. ing.

  The resin 4 injected by this structure slowly wets and spreads from the injected side between the semiconductor chip 1 and the substrate 2 toward the opposite side by capillary action. In particular, when the fixed base 7 is shaken in the 5-X or 5-Y direction by the movement operation of the nozzle 3 after injection, for example, the movement operation of the nozzle 3 to the retreat position or the movement operation to the start position, The rocking action triggers the capillary action, and the injected resin 4 further wets and spreads toward the opposite side. Thereby, the resin 4 can be uniformly applied to the entire semiconductor chip 1 in a short time.

(Embodiment 2)
Hereinafter, Embodiment 2 of the present invention will be described with reference to FIG.

  FIG. 3 is a schematic diagram showing a schematic configuration of a resin coating apparatus according to Embodiment 2 of the present invention. In FIG. 3, reference numeral 8 denotes a workpiece-like substrate, which is configured so that the substrate 1 described in the first embodiment can be obtained by separating into individual pieces.

Here, the nozzle 3 is configured to inject the resin 4 while moving zigzag from each piece to each piece as indicated by an arrow . Here, the nozzle 3 moves zigzag from each piece to each piece, for example, after the resin 4 is injected, as the nozzle 3 moves from a to b, oscillation in the 5-X direction occurs. After the injection of the resin 4, the nozzle moves in the 5-Y direction as the nozzle 3 moves from b to c, so that the nozzle moves in the 5-X direction with respect to the movement from each piece to each piece. It indicates moving in the 5-Y direction . Similarly, after the injection of the resin 4, a swing in the 5-X direction occurs as the nozzle 3 moves from c to d, e to f, g to j, k to l, m to n, and o to p. At the same time, after the resin 4 is injected, the nozzle 3 swings in the 5-Y direction as it moves from d to e, from f to g, from j to k, from l to m, and from n to o.

  And since such a rocking | swiveling is repeatedly performed every time after injection | pouring of the resin 4, the resin 4 can be wet-spread more uniformly in a short time.

  Note that the movement pattern of the nozzle 3 is not limited to the zigzag movement as in the present embodiment, and can be arbitrarily selected, such as a spiral shape, and by repeating the movement a plurality of times instead of once. In addition, by selecting a different movement route for each number of times, the injection can be performed more uniformly and in a shorter time.

  Here, when the resin 4 is injected while heating the substrate 2 by a heating means (not shown) provided in the fixed base 7, the viscosity of the resin 4 decreases due to the heating, and the resin 4 tends to flow. 4 can be uniformly spread over the entire semiconductor chip 1 in a short time. If the substrate 2 is preheated before the resin 4 is injected, the effect can be further enhanced.

  Further, as the material of the resin 4, a thermosetting resin that easily lowers the viscosity when temperature is applied is effective, and among them, an epoxy resin is optimal.

  In addition, if the heat retaining heating is performed by the heating means even after the resin 4 is injected, the state in which the viscosity is lowered can be maintained, so that a uniform fillet of the resin 4 can be formed around the semiconductor chip 1.

  In addition, by injecting the resin 4 while applying air of a predetermined pressure to the nozzle 3, the resin 4 can be injected more reliably and accurately, and at that time, more than the air pressure at the start and end of injection. By increasing the air pressure in the middle, the injection amount of the resin 4 can be applied almost evenly from one end to the other end of the semiconductor chip.

  In addition, by causing the entire fixed base 7 to swing at a low frequency of about 5 Hz or less, the load applied to the connecting portion between the semiconductor chip 1 and the substrate 2 due to the swing can be reduced. The resin 4 can be injected without impairing the connection reliability of the connecting portion to the second.

  Further, by making the oscillation amplitude of the entire fixed base 7 longer than at least the length of one side of the semiconductor chip, the resin 4 can be uniformly applied to the entire semiconductor chip 1 in a short time.

  Further, by providing a buffer means (not shown), for example, a damper or the like, on a leg portion (not shown) that supports the fixed base 7, a swing device is separately provided in order to use the swing associated with the movement of the nozzle 3. The resin 4 can be applied to the entire semiconductor chip 1 uniformly and in a short time without any problems.

  As described above, the resin coating apparatus of the present invention is useful when applying an underfill resin between a semiconductor element mounted face-down and a substrate.

The schematic diagram which shows schematic structure of the resin coating apparatus in Embodiment 1 of this invention. Side view The schematic diagram which shows schematic structure of the resin coating apparatus in Embodiment 2 of this invention. Schematic diagram showing the schematic configuration of a conventional resin coating apparatus

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor chip 2 Board | substrate 3 Nozzle 4 Resin 6 Bump 7 Fixing stand

Claims (11)

A resin coating apparatus for applying an underfill resin between a substrate and a semiconductor element mounted face-down, a fixing base for fixing the substrate on which the semiconductor element is mounted face-down, and the semiconductor element A nozzle for injecting an underfill resin between the substrate and a nozzle moving means for moving the nozzle; and the nozzle moving means extends along the vicinity of the boundary between the semiconductor element and the substrate. A means for moving the nozzle in the X-axis direction and / or the Y-axis direction, and after the underfill resin is injected between the substrate and the semiconductor element, the fixing is performed in conjunction with the movement of the nozzle by the nozzle moving means. with whole is swung pedestal, a resin coating the amplitude of oscillation of the entire fixing base is characterized longer than the length of one side of the at least a semiconductor element Apparatus. 2. The resin coating apparatus according to claim 1, wherein a sheet-like workpiece composed of a plurality of pieces is fixed to a fixed base, and an underfill resin is sequentially injected between a semiconductor element constituting each piece and the substrate. . 3. The resin coating apparatus according to claim 2, wherein the entire workpiece is rocked by using vibration when the nozzle moving means moves to the next piece. 2. The resin coating apparatus according to claim 1, wherein the underfill resin is injected while heating the substrate. The resin coating apparatus according to claim 1, wherein the underfill resin is a thermosetting resin. 2. The resin coating apparatus according to claim 1, wherein the underfill resin is an epoxy resin. 7. The resin coating apparatus according to claim 6, wherein the substrate is preheated in advance and kept warm for a predetermined time after the underfill resin is injected. 8. The resin coating apparatus according to claim 7, wherein the substrate is also swung during the heat insulation heating. 2. The resin coating apparatus according to claim 1, wherein the underfill resin is injected while applying a predetermined pressure of air to the nozzle, and the air pressure in the middle of the injection is made larger than the air pressure at the start and end of the injection. . 2. The resin coating apparatus according to claim 1, wherein the entire fixed base swings at a low frequency of about 5 Hz or less. The resin coating apparatus according to claim 1, wherein a buffer means is provided on a leg portion that supports the fixed base.

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