JP4386616B2 - Connector, developing cartridge, and image forming apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a connector incorporating a memory IC substrate for reading / writing data such as toner consumption, a developing cartridge to which the connector is attached, and an image forming apparatus.
[0002]
[Prior art]
In an image forming apparatus such as a printer, a memory IC is attached to the developing cartridge and connected to the connector on the apparatus main body side, information on the remaining amount of toner of each color, information on whether or not the cartridge has been replaced, information on whether or not the cartridge has been mounted Installation information for informing the main body side, image forming conditions such as developing bias, recycling information on how many times the cartridge has been used for replacement, etc. are written, and history information can be recognized on the main body side when the developing cartridge is attached. I am doing so.
[0003]
In this case, in a cartridge such as an ink jet printer, a memory IC board on which history information is written is connected by caulking an electric wire to a connector, or the memory IC board is soldered to a connector terminal.
[0004]
[Problems to be solved by the invention]
In a memory IC attached to a conventional developing cartridge, since the mechanical force is directly applied by contacting the connector on the apparatus body side when reading / writing data, the contact life of the memory IC is short, and the developing roller is high. Since a voltage is applied, electric field noise due to the influence is easily picked up by the contact member side, malfunctions due to static electricity, toner contamination, etc. occur, and it is not always sufficient to protect the memory IC and ensure the stability of the contact.
[0005]
In addition, the method of connecting the terminals of the memory IC board with the connector by caulking the electric wires may cause contact defects such as caulking defects or wire breakage, and the method of soldering the memory IC board to the connector terminals may cause poor soldering. In addition, there is a problem such as a contact failure caused by the memory, and even if the memory IC is to be reused, it must be removed by applying heat, in which case the information written by the heat will be destroyed even if it is removed. There's a problem.
[0006]
In particular, the longer contact member becomes an antenna and tends to pick up electric field noise. Therefore, in the present embodiment, the ground terminal 43G is arranged at a position farthest from the developing roller. Of course, long terminals other than the ground terminal are preferably arranged outside.
[0007]
[Means for Solving the Problems]
It is an object of the present invention to make a memory IC substrate detachable and to secure a stable contact by using a spring property to improve reliability.
The present invention relates to a connector with a built-in memory IC provided with a connector board that functions as an impact receiving member when the main body apparatus side connector is fitted to and abuts on a guide member, and the main body apparatus side connector of the connector board The guide member is provided upright from the connector board at a portion near the outer edge of the contact side surface of the connector board, and the tip of the memory IC board made of an elastic resin is provided on the side opposite to the contact side of the connector board. A positioning attachment portion to be engaged; and a hook portion for engaging a rear end of the memory IC board. The tip of the memory IC board is inserted into the positioning attachment portion, and the rear end of the memory IC board is hooked using elasticity. A memory IC board mounting portion is provided on which the memory IC board is detachably mounted in parallel with the connector board by engaging with the connector board. A plurality of contacts extending through the through-holes and in contact with a plurality of terminals of the mounted memory IC substrate are provided in parallel with the guide member and upright in parallel with the connection terminals of the main unit side connector. A plurality of conductive members are attached to the connector board, and the terminal rows of the memory IC board are arranged in a plurality of rows so as to be positioned closer to the positioning attachment portion than the center part of the memory IC board when attached to the connector board. Each of the conductive members is bent on the memory IC substrate side through the through-holes to provide spring properties, and each bent spring fulcrum is closer to the hook portion than the center portion of the memory IC substrate. A high-spring load contact that is separated from the terminal of the memory IC board and has a short distance from the spring fulcrum to the contact with the terminal of the memory IC board A low spring load contact that is in contact with a terminal row close to the center side of the C substrate and has a long distance from the spring fulcrum to the contact with the terminal of the memory IC substrate contacts a terminal row far from the center of the memory IC substrate. It is characterized by that.
According to the present invention, the memory IC board is formed with a notch for positioning that is shifted from a center of a tip inserted into the positioning attachment portion.
In addition, the present invention is a developing cartridge in which the connector described above is fixed to an end portion.
In addition, the present invention is an image forming apparatus having the developing cartridge described above.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram illustrating an example of an image forming apparatus according to the present embodiment.
After the photoreceptor 1 is charged by a charging unit (not shown), an electrostatic latent image is formed by image exposure by the exposure unit 2. The electrostatic latent image is developed by sequentially supplying four colors of toner from the developing rollers of the developing cartridges 31 to 34 mounted on the rotary frame 30 of the rotary developing unit 3 one by one. A transfer belt 4 driven by a transfer belt driving roller 5 is opposed to the photoreceptor 1 at a primary transfer position, and toner images of respective colors are primarily transferred to the transfer belt 4 and superimposed on the belt.
[0009]
On the other hand, the four-color toner images on the transfer belt are collectively transferred at the secondary transfer position of the transfer roller 8 facing the transfer belt driving roller 5 through the paper path taken out of the paper feed cassette 6. At this time, the leading edge of the image on the transfer belt 4 is detected by the belt position detection sensor 9 and controlled so that the leading edge of the image and the leading edge of the paper are aligned. The second-transferred paper is fixed by the fixing unit 10, and in the case of double-sided printing, it returns to the conveyance path 7 again, and the image is transferred to the back side. The paper after transfer and fixing is discharged out of the apparatus.
[0010]
Each of the four color developing cartridges 31 to 34 of the rotary developing unit 3 is provided with a memory IC built-in connector 40 (details will be described later) so that data can be read / written from the connector 50 on the apparatus body side. . The device main body side connector 50 is driven by a drive unit 51 with a built-in motor to move forward / backward, and when the cartridge is replaced, it moves forward and is electrically connected to the connector 40 to read / write data in the memory IC. Retreating. Each developing cartridge can be removed and replaced at the position of the developing cartridge replacement opening 11 provided in the apparatus main body. Further, the image forming apparatus is provided with an exhaust duct 12 that sucks scattered toner and the like from the suction port 14 near the developing nip where the developing roller and the photosensitive member abut, and exhausts them through the filter 13. In this case, the position where the memory IC built-in connector 40 and the main unit side connector 50 are connected is arranged upstream of the developing nip portion in the rotation direction of the developing unit so that the connector connecting portion is not affected by the scattered toner. To do.
[0011]
FIG. 2 is a diagram for explaining the positions of the developing cartridge exchange, the reading / writing of data in the memory IC, and the development standby in the rotary developing unit. The home position of the rotary developing unit is detected by detecting the notch position of the position detection plate 37 with the position detection sensor 36.
[0012]
FIG. 2A is a diagram for explaining the developing device replacement position (position {circle around (1)}). As described above, the developing device exchange port 11 is provided on the apparatus main body side, and the developing rollers (1) to (4) of the rotary developing unit 3 can be exchanged at the position of the developing device exchange port 11. is there. In this position (1), the connector 40 of each developing cartridge does not face the main body side connector 50, and the photosensitive member 1 does not face the developing roller.
[0013]
FIG. 2B shows the position where the developing roller develops to face the photosensitive member, along with reading / writing to the memory IC (position (2)). When a read / write command is issued from the apparatus main body side, the apparatus main body side connector 50 operates in a positional relationship of position (2) and is connected to the connector 40 to read / write data.
[0014]
FIG. 2C shows a position (position {circle around (3)}) when the development by the rotary developer unit is switched from one color to another, and the photoconductor and the developing roller are not opposed to each other.
[0015]
FIG. 3 is a diagram for explaining when the connector is connected and when the connector is separated.
As shown in FIG. 3A, at the time of connection, the apparatus main body side connector 50 is advanced by motor drive, and is guided and fitted by a guide member on the memory IC built-in connector 40 side as will be described later, and the terminals slide. Thus, when the connectors are separated from each other, the connector 50 is retracted toward the apparatus main body and the two are separated. The connector 40 is fixed to the developing unit by a connector fixing screw 48, and the connector 50 is fixed to the apparatus main body by a connector fixing pin 53.
[0016]
FIG. 4 is a diagram for explaining the rotary developing unit.
The rotary developing unit 3 is attached to side plates 20 and 21 made of sheet metal, and a memory IC built-in connector 40 is fixed to the end of the developing cartridges 31 to 34 attached to the rotary frame 30. In this embodiment, the side plate 21 is a gear-driven side, the side plate 20 is a non-driving side, and a connector provided in a storage portion 22 formed by narrowing the side plate 20 on the non-driving side so as not to be affected by the heat of the driving portion. The memory IC built-in connector 40 is fixed to the cover 39. The housing portion 22 surrounds the connector 40 except for the surface where the apparatus main body side connector 50 is separated and abutted, and serves to shield it from being affected by the voltage applied to the developing roller. The memory IC built-in connector 40 itself is covered with a connector cover 39, and an IC protection member 38 made of a resin ring is provided on the inner surface of the storage portion so that static electricity does not affect the memory IC from the sheet metal forming the storage portion. Yes.
[0017]
5A and 5B are diagrams for explaining the memory IC built-in connector according to the present embodiment. FIG. 5A is a plan view, FIG. 5B is a front view, and FIG. 5C is an AA line in FIG. It is sectional drawing.
The memory IC built-in connector 40 is provided with two guide members 42 upright on both side portions near the outer edge of one surface (surface connected to the main unit side connector) of the substrate 41 which is a member that receives an impact at the time of connection, A contact protection member 45 containing the memory IC substrate 46 is provided on the other surface (back surface) of the substrate 41, and these are integrally formed as a housing 47. Further, contact members 43 and 44 are provided so as to be integral with the guide member 42 and on the inner side of the guide member 42 in parallel with the guide member 42. The reason why the guide member 42 is disposed outside the contact member is to stabilize the contact state of the contact point by enclosing the guide member so as to improve the insertion stability when the main body side connector is fitted.
[0018]
In this embodiment, four contact members 43 are provided in a two-row configuration on the front side (side far from the end of the developing roller) of the casing 47 and three contact members 44 are provided on the back side (side near the end of the developing roller). As a whole, the size is reduced. Of course, the contact members are not limited to two rows, and may be one row or three rows. As shown in FIG. 6, the four terminals on the front side are a data terminal, a mounting detection terminal, a ground (GND) terminal, and a data read / write terminal, and the three terminals on the back side are clock terminals. A terminal, a power supply terminal, and a chip select (CS) terminal.
[0019]
As shown in FIG. 5 (c), these contact members 43 and 44 constitute contact terminals 43a and 44a with which the main body side connector terminal slides and contacts when connected. The contact members 43 and 44 are provided with spring-like contact terminals 43 b and 44 b that extend through the through holes of the substrate 41 to the back side thereof and elastically contact the terminals of the memory IC substrate 46. When the memory IC board 46 is attached to the contact protection member 45, the spring contact terminals 43b and 44b elastically contact the terminals of the memory IC board 46, and the memory IC board 46 is connected to the contact terminals 43b and 44b. It is pressed against the attachment surface of the contact protection member 45 by a spring force and is held in a floating state separated from the substrate 41. Therefore, even if the main body side connector 50 moves forward and comes into contact with the connector 40 by driving the motor, the contact 43, 44 of the contact members 43 and 44 only slides and comes into contact with the main body side connector terminal. Is received by the substrate 41, and the memory IC substrate 46 is supported away from the substrate 41. Therefore, the impact is not directly transmitted to the contact portion between the terminal of the memory IC substrate 46 and the contacts 43b and 44b.
[0020]
Thus, the connector 40 has a sliding contact with the main body side connector on one surface of the substrate 41 which is an impact receiving member, and a fixed contact with the memory IC substrate supported by being floated from the substrate on the back side of the substrate 41. Therefore, the impact at the time of connection with the main body side connector is received by the substrate 41 and is not transmitted to the memory IC substrate side, and the contact with the memory IC substrate is stably formed.
Further, in order to protect the memory IC board attached to the connector from contact failure due to toner contamination, data destruction due to the influence of static electricity, etc., it is desirable to have a contact where it does not come out directly. In the present embodiment, the IC memory substrate is covered with the contact protection member 45, and the portion is supported by the spring contact.
[0021]
Of the seven contact members shown in FIG. 5, the four contact members provided in one row with the guide members 42 on both sides are located outside the developing roller as shown in FIG. The three contact members are arranged on the developing roller side. Of the four contact members on the front side, the ground terminal 43G is formed to be the longest and is the first to contact when connected to the main body side connector.
[0022]
By the way, at the timing of development, a voltage of 2 KVp-p is applied to the developing roller, and the electric field noise due to the influence is easily picked up by the contact member side. In particular, the longest contact member becomes an antenna and easily picks up electric field noise. Therefore, in the present embodiment, the ground terminal 43G is arranged at a position farthest from the developing roller. Of course, long terminals other than the ground terminal are preferably arranged outside.
[0023]
FIG. 7 is a diagram for explaining the mounting of the memory IC board to the connector main body.
FIG. 7A is a view showing a memory IC board mounted state as seen from the back side of the connector. The memory IC board 46 is provided with a notch 46a at a position shifted from the center thereof, and the front end of the board on both sides of the notch. The lengths are different. A positioning attachment portion 60 having a recess is formed on the connector body side so as to match the tip of the substrate, and the depth of the recess is different on both sides of the notch. For this reason, even if it is attempted to insert the front end of the substrate into the positioning attachment portion 60 with the left and right sides reversed, it is possible to prevent erroneous insertion. On the other hand, the rear end of the board is configured to be engaged with the hook 61 of the connector body.
[0024]
FIG. 7B is a cross-sectional view for explaining the mounting of the memory IC substrate. The memory IC substrate 46 of the present embodiment is made of a resin having elasticity (spring property), and the front end of the substrate is inserted into the positioning attachment portion 60 and pressed while rotating the rear end of the substrate toward the connector main body side. Is inserted by being warped, and locked to the hook 61. At this time, the terminals of the memory IC board are elastically contacted with the spring contact terminals 43b and 44b, and the memory IC board is pressed against the positioning attachment portion 60 and the hook 61 by the spring force of the contacts, so that the mounting is stable. At the same time, the contact state is stabilized.
[0025]
When reusing a memory IC board, if the memory IC board is fixed by soldering or the like as in the case of an ink jet printer, the IC itself is heated to remove it, and the memory The information inside may be destroyed. On the other hand, if an attempt is made to read the information in the memory with the memory IC attached, an electrophotographic apparatus having a larger apparatus than an ink jet printer or the like applies a terminal to the memory IC attached to a part of the larger apparatus, and the contents are read. Since it is read, the operation alone is extremely complicated.
[0026]
Therefore, the memory IC can be attached / detached by taking the contact of the terminal with the memory IC substrate with a spring-like contact member as in this embodiment, and even if the connector body itself is fixed, the memory IC can be removed by removing it. It can be easily removed and collected, and its contents can be read and used for reuse.
[0027]
FIG. 8 is a cross-sectional view of the main part of the connector to which the memory IC board is mounted.
The contact members 43 and 44 provided on both sides of the housing 47 of the connector 40 extend to the back side of the connector main body and bend to give spring properties to form the contacts 43b and 44b, respectively. As described above, the connector body is formed with the positioning attachment portion 60 and the hook 61, and the memory IC substrate 46 having a notch in the positioning attachment portion 60 enters the recess of the positioning attachment portion, and pushes the substrate down to the hook 61. It is structured to be locked and mounted by utilizing the spring property of the board. At this time, the terminals 63 and 64 of the memory IC board come into contact with the contacts 43b and 44b on the connector side to constitute fixed contacts.
[0028]
In the present embodiment, the terminals of the memory IC board are arranged in two rows 63 and 64 so that they are closer to the positioning mounting portion 60 side than the center, and the spring fulcrums P1 and P2 are on the hook 61 side so as to be as far away from the terminals 63 and 64 as possible. Try to be close. With such a configuration, when the memory IC board is mounted, the terminals 63 and 64 and the contacts 43b and 44b are softly brought into contact with each other by a spring force, and a stable contact force can be obtained.
[0029]
Further, since the positions of the spring fulcrums P1 and P2 are substantially the same, the length from the spring fulcrum to the contact 43b is longer than that from the spring fulcrum to the contact 44b, and since the same spring material is used, the contact force of the contact 43b Is smaller than the contact force of the contact 44b. As shown in the figure, the memory IC board is mounted by inserting the tip on the side close to the terminals 63 and 64 into the recess of the positioning attachment portion 60 to push down the board and pushing the other end into the hook member to be locked. The terminal to be contacted is easily mounted as a low spring load contact 43b with a small contact force, and the mounting is stabilized, and since the mounting can be performed with a weak force, the memory IC substrate is hardly damaged and can be reused. .
[0030]
Further, as described in FIG. 5, the contact member 43 is on the 4-contact side, and the contact member 44 is on the 3-contact side. As described above, in the case of the contacts in a plurality of rows (in this embodiment, two rows), when the number of contacts in each row is not the same, the multiple contacts (low spring load contacts 43b) are set as the positioning attachment portion side. As a result, it is possible to prevent an increase in force required for mounting, to facilitate mounting, to stabilize the mounting, and to mount with a weak force, so that the memory IC substrate is similarly unlikely to be damaged and contributes to reuse. it can.
[0031]
When the number of low spring load contacts and the number of high spring load contacts are not the same, the number of low spring load contacts is increased as described above. Since the spring load is low, there is no problem even if there are many contacts, and the force at the contact portion is determined by the spring pressure.
[0032]
Further, if the high-spring load contact 44b having a relatively large contact force is located on the center side of the memory IC board when the contact on the multiple side (low spring load contact 43b) is on the positioning attachment portion side, When the IC substrate is mounted, the spring contact pressure at the center can be increased. By mounting the spring contact pressure at the center, after mounting the memory IC board, the board is pushed up from the center, and pressure is evenly applied to both the positioning attachment part side and the hook part side, enabling stable attachment. .
The board mounting state is stabilized.
[0033]
【The invention's effect】
As described above, according to the present invention, since the terminals of the memory IC board are arranged on the side of the positioning attachment portion of the connector, the memory IC board can be attached and detached. The terminal of the board is softly brought into contact with the spring force, a stable contact force is obtained, and the reliability can be improved. Further, the contact of the connector and the terminals of the memory IC board can be configured in a plurality of rows to save space, and the contact force can be secured by stabilizing the contact force.
[Brief description of the drawings]
FIG. 1 is a diagram illustrating an image forming apparatus of the present invention.
FIGS. 2A and 2B are diagrams illustrating positions for replacement of a developing cartridge, reading / writing of data in a memory IC, and development standby. FIGS.
FIG. 3 is a diagram illustrating connector connection and separation from a memory IC.
FIG. 4 is a diagram illustrating a rotary developing unit.
FIG. 5 is a diagram illustrating a connector with a built-in memory IC.
FIG. 6 is a diagram illustrating a connector terminal.
FIG. 7 is a diagram illustrating mounting of a memory IC board to a connector body.
FIG. 8 is a cross-sectional view of a main part of a connector to which a memory IC board is attached.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Photosensitive body, 2 ... Exposure unit, 3 ... Rotary type developing unit, 4 ... Transfer belt, 5 ... Transfer belt drive roller, 6 ... Paper feed cassette, 7 ... Paper conveyance path, 8 ... Transfer roller, 9 ... Position detection Sensors, 10: Fixing unit, 11: Opening for developing cartridge replacement, 12 ... Exhaust duct, 13 ... Filter, 14 ... Suction port, 20, 21 ... Side plate, 30 ... Rotary frame, 31-34 ... Developing cartridge, 36 ... Position Detection sensor, 37 ... Position detection plate, 38 ... IC protection member, 39 ... Connector cover, 40, 50 ... Connector, 41 ... Substrate, 42 ... Guide member, 43, 44 ... Contact member, 45 ... Contact protection member, 46 ... Memory IC board, 46a ... notch, 60 ... positioning attachment, 61 ... hook, 63, 64 ... terminal.

Claims (4)

A connector with a built-in memory IC provided with a connector board that fits and comes into contact with the guide member on the main unit side and functions as an impact receiving member at the time of contact ,
The guide member is provided upright from the connector board at a portion near the outer edge of the contact side surface of the connector board with the main unit side connector, and a resin having elasticity on the side opposite to the contact side of the connector board. A positioning attachment portion that engages with the front end of the memory IC substrate and a hook portion that engages the rear end of the memory IC substrate, and the rear end of the memory IC substrate is inserted into the positioning attachment portion. A memory IC board mounting portion is provided on which the memory IC board is detachably mounted in parallel with the connector board by locking the end to the hook portion using elasticity,
A plurality of through-holes formed in the connector board, extending in parallel to the terminals of the mounted memory IC board and spring-contacting with each of the terminals ; A plurality of conductive members having connection terminals with the device-side connector are mounted on the connector board,
The terminal rows of the memory IC board are arranged in a plurality of rows so as to be positioned on the positioning attachment part side from the center part of the memory IC board when mounted on the connector board,
The plurality of conductive members pass through the through-holes and are bent on the memory IC substrate side to give spring properties, and the bent spring fulcrums are closer to the hook portion than the center portion of the memory IC substrate. A high-spring load contact that is separated from the terminal of the memory IC substrate and has a short distance from the spring fulcrum to the contact with the terminal of the memory IC substrate is in contact with the terminal row near the center of the memory IC substrate; A connector, characterized in that a low spring load contact having a long distance from a spring fulcrum to a contact with a terminal of a memory IC board is in contact with a terminal row far from the center of the memory IC board .   The connector according to claim 1, wherein the memory IC substrate is formed with a positioning cutout from a center of a tip inserted into the positioning attachment portion. 3. A developing cartridge, wherein the connector according to claim 1 is fixed to an end. An image forming apparatus comprising the developing cartridge according to claim 3 .

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