JP4387480B2 - Adhesive composition and method for producing the same - Google Patents
Adhesive composition and method for producing the same Download PDFInfo
- Publication number
- JP4387480B2 JP4387480B2 JP33565398A JP33565398A JP4387480B2 JP 4387480 B2 JP4387480 B2 JP 4387480B2 JP 33565398 A JP33565398 A JP 33565398A JP 33565398 A JP33565398 A JP 33565398A JP 4387480 B2 JP4387480 B2 JP 4387480B2
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- parts
- polyvinyl alcohol
- adhesive
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 title claims description 73
- 230000001070 adhesive effect Effects 0.000 title claims description 73
- 239000000203 mixture Substances 0.000 title claims description 68
- 238000004519 manufacturing process Methods 0.000 title claims description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 33
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 32
- 239000000839 emulsion Substances 0.000 claims description 31
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 30
- 229920002689 polyvinyl acetate Polymers 0.000 claims description 28
- 239000011118 polyvinyl acetate Substances 0.000 claims description 28
- 150000001875 compounds Chemical class 0.000 claims description 25
- 239000005056 polyisocyanate Substances 0.000 claims description 21
- 229920001228 polyisocyanate Polymers 0.000 claims description 21
- 235000019422 polyvinyl alcohol Nutrition 0.000 description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 24
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 21
- 239000002023 wood Substances 0.000 description 21
- 230000000052 comparative effect Effects 0.000 description 16
- 238000006116 polymerization reaction Methods 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- -1 vinyl compound Chemical class 0.000 description 12
- 239000000084 colloidal system Substances 0.000 description 10
- 239000000178 monomer Substances 0.000 description 10
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 9
- 230000001681 protective effect Effects 0.000 description 9
- 239000007787 solid Substances 0.000 description 9
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 6
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 6
- 239000012948 isocyanate Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007720 emulsion polymerization reaction Methods 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 229920002554 vinyl polymer Polymers 0.000 description 4
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910001870 ammonium persulfate Inorganic materials 0.000 description 3
- 238000005187 foaming Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007127 saponification reaction Methods 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 241000218657 Picea Species 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 241000218685 Tsuga Species 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 229920003180 amino resin Polymers 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 125000002091 cationic group Chemical group 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000003505 polymerization initiator Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000010971 suitability test Methods 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- BJELTSYBAHKXRW-UHFFFAOYSA-N 2,4,6-triallyloxy-1,3,5-triazine Chemical compound C=CCOC1=NC(OCC=C)=NC(OCC=C)=N1 BJELTSYBAHKXRW-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- JJRUAPNVLBABCN-UHFFFAOYSA-N 2-(ethenoxymethyl)oxirane Chemical compound C=COCC1CO1 JJRUAPNVLBABCN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- 239000004342 Benzoyl peroxide Substances 0.000 description 1
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 229920002134 Carboxymethyl cellulose Polymers 0.000 description 1
- 229920002261 Corn starch Polymers 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- RDOFJDLLWVCMRU-UHFFFAOYSA-N Diisobutyl adipate Chemical compound CC(C)COC(=O)CCCCC(=O)OCC(C)C RDOFJDLLWVCMRU-UHFFFAOYSA-N 0.000 description 1
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229920002472 Starch Polymers 0.000 description 1
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 241000209140 Triticum Species 0.000 description 1
- 235000021307 Triticum Nutrition 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- LXEKPEMOWBOYRF-UHFFFAOYSA-N [2-[(1-azaniumyl-1-imino-2-methylpropan-2-yl)diazenyl]-2-methylpropanimidoyl]azanium;dichloride Chemical compound Cl.Cl.NC(=N)C(C)(C)N=NC(C)(C)C(N)=N LXEKPEMOWBOYRF-UHFFFAOYSA-N 0.000 description 1
- 125000005396 acrylic acid ester group Chemical group 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 125000000129 anionic group Chemical group 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000007869 azo polymerization initiator Substances 0.000 description 1
- 235000019400 benzoyl peroxide Nutrition 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- JZQAAQZDDMEFGZ-UHFFFAOYSA-N bis(ethenyl) hexanedioate Chemical compound C=COC(=O)CCCCC(=O)OC=C JZQAAQZDDMEFGZ-UHFFFAOYSA-N 0.000 description 1
- ZPOLOEWJWXZUSP-AATRIKPKSA-N bis(prop-2-enyl) (e)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C\C(=O)OCC=C ZPOLOEWJWXZUSP-AATRIKPKSA-N 0.000 description 1
- YLTDNYQTDYMOBH-UHFFFAOYSA-N bis(prop-2-enyl) 2-hydroxybutanedioate Chemical compound C=CCOC(=O)C(O)CC(=O)OCC=C YLTDNYQTDYMOBH-UHFFFAOYSA-N 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001768 carboxy methyl cellulose Substances 0.000 description 1
- 235000010948 carboxy methyl cellulose Nutrition 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000008112 carboxymethyl-cellulose Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000012295 chemical reaction liquid Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000008120 corn starch Substances 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical class C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 229940031769 diisobutyl adipate Drugs 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- UIWXSTHGICQLQT-UHFFFAOYSA-N ethenyl propanoate Chemical compound CCC(=O)OC=C UIWXSTHGICQLQT-UHFFFAOYSA-N 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 125000000816 ethylene group Chemical class [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229920003063 hydroxymethyl cellulose Polymers 0.000 description 1
- 229940031574 hydroxymethyl cellulose Drugs 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 description 1
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 description 1
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N itaconic acid Chemical class OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000005397 methacrylic acid ester group Chemical group 0.000 description 1
- 229920000609 methyl cellulose Polymers 0.000 description 1
- 239000001923 methylcellulose Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- OMNKZBIFPJNNIO-UHFFFAOYSA-N n-(2-methyl-4-oxopentan-2-yl)prop-2-enamide Chemical compound CC(=O)CC(C)(C)NC(=O)C=C OMNKZBIFPJNNIO-UHFFFAOYSA-N 0.000 description 1
- DNTMQTKDNSEIFO-UHFFFAOYSA-N n-(hydroxymethyl)-2-methylprop-2-enamide Chemical compound CC(=C)C(=O)NCO DNTMQTKDNSEIFO-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- SCPYDCQAZCOKTP-UHFFFAOYSA-N silanol Chemical compound [SiH3]O SCPYDCQAZCOKTP-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- PLCFYBDYBCOLSP-UHFFFAOYSA-N tris(prop-2-enyl) 2-hydroxypropane-1,2,3-tricarboxylate Chemical compound C=CCOC(=O)CC(O)(CC(=O)OCC=C)C(=O)OCC=C PLCFYBDYBCOLSP-UHFFFAOYSA-N 0.000 description 1
- 229960000834 vinyl ether Drugs 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は、ポリ酢酸ビニル系エマルジョンを用いた接着剤組成物およびその製造方法に関する。本発明の接着剤組成物は、非ホルムアルデヒド系であって加熱接着適性が良いことから、木材などを高周波プレス、ホットプレスなどにより加熱接着するための接着剤として好適に用いられる。
【0002】
【従来の技術】
従来より、木材などを高周波プレス、ホットプレスなどにより加熱接着する場合には、ユリアやメラミンなどとホルムアルデヒドとを反応させて得られるアミノ樹脂系接着剤が多用されてきた。しかし、最近はこれらの接着剤から放出されれるホルムアルデヒドが問題視されるようになり、このため非ホルムアルデヒド系の接着剤組成物への置き換えが検討されている。
【0003】
【発明が解決しようとする課題】
非ホルムアルデヒド系の木材用接着剤としては、ポリビニルアルコールを保護コロイドとして用いたポリ酢酸ビニル系エマルジョンからなる接着剤組成物が汎用されている。この接着剤組成物は、木材に対する接着性が良好であり、また一液で使用可能であるため作業性に優れている。しかし、この接着剤組成物は一般に耐水性能が低いため、高い耐水性能が要求される用途には不向きである。また耐熱性能も低いため、木材などを高周波プレス、ホットプレスなどにより加熱接着する場合、プレスで加熱された木材の含水率変化に伴う収縮応力に耐えられず、解圧直後に剥離しやすいという問題がある。
【0004】
また、耐水性能および耐熱性能を向上させたポリ酢酸ビニル系エマルジョン型接着剤としては、特開昭60−54961号公報に開示されたビニル化合物の重合方法のような、アセトアセチル化ポリビニルアルコールを保護コロイドとする重合方法により得られた接着剤組成物が知られている。しかし、木材の種類やラミナの大きさによってはさらに高い耐熱性が必要とされる場合がある。
【0005】
一方、ポリビニルアルコールを含む酢酸ビニル系重合体の水性エマルジョンとイソシアネート系化合物(硬化剤)とを使用時に配合する二液型の水性接着剤組成物も知られており、例えば特公昭55−9437号公報に開示されている。この二液型接着剤組成物は、上述したポリ酢酸ビニル系エマルジョン型接着剤組成物に比べて高い耐熱性能および耐水性能を示す。しかし、この組成物は二液型であるため、硬化剤を混合する手間がかかり、また混合時および接着時の発泡や接着剤の経時増粘などが起こるため作業性が悪い。さらに、高周波プレスやホットプレスなどを用いて木材を加熱接着する用途においては、接着層からはみ出した接着剤が高周波プレス機の極盤やホットプレス機の熱盤に付着した場合、この接着剤は未反応のイソシアネート化合物を多く含むことから上記極盤や熱盤(通常は鉄板からなる)に対する接着力が強く、このため加熱接着後の木材がプレス機の盤面から剥がれなくなるなど作業性の点で問題がある。
【0006】
本発明の目的は、高度な耐熱性能および耐水性能を発揮する接着剤組成物であって、特に木材などを高周波プレスやホットプレスなどを用いて加熱接着する用途に好適な非ホルムアルデヒド系の水系接着剤組成物を提供することにある。
【0007】
【課題を解決するための手段】
本発明者らは、特定のポリ酢酸ビニル系エマルジョンとポリイソシアネート化合物とをあらかじめ反応させて得られた組成物であって、この組成物中の残存イソシアネート基の量が所定値以下である接着剤組成物によれば、上記課題が解決されることを見出して本発明を完成した。
【0008】
すなわち、本発明の請求項1記載の接着剤組成物は、ポリビニルアルコールを含有するポリ酢酸ビニル系エマルジョンの不揮発分100重量部に対し、一分子中に二個以上のイソシアネート基を有するポリイソシアネート化合物3〜50重量部を、残存イソシアネート基の量が上記ポリイソシアネート化合物に含まれるイソシアネート基の量に対して5モル%以下となるまで反応させて得られることを特徴とする。
【0009】
上記「ポリビニルアルコールを含有するポリ酢酸ビニル系エマルジョン」としては、▲1▼ポリビニルアルコールを保護コロイドとしたエマルジョン重合により得られたポリ酢酸ビニル系エマルジョン、▲2▼溶液重合により得られた酢酸ビニル系ポリマーにポリビニルアルコール及び水を添加した後、撹拌乳化して得られたポリ酢酸ビニル系エマルジョン、▲3▼他の保護コロイドまたは乳化剤を使用して得られたポリ酢酸ビニル系エマルジョンにポリビニルアルコールを後添加したもの、などが挙げられる。このうち本発明においては、上記▲1▼のポリ酢酸ビニル系エマルジョンを用いることが好ましい。また、上記▲1▼のポリ酢酸ビニル系エマルジョンに対してさらにポリビニルアルコールを後添加したものでもよい。
【0010】
なお、保護コロイドとしてのポリビニルアルコールは、ケン化度75〜99%、平均重合度100〜10,000のものが好ましく用いられる。また、上記▲1▼のポリ酢酸ビニル系エマルジョンを製造する際には、ポリビニルアルコールに加えて、ヒドロキシメチルセルロース、メチルセルロース、カルボキシメチルセルロースなどのセルロース誘導体や各種加工澱粉類、あるいはアニオン系、カチオン系、あるいはノニオン系の各種界面活性剤を併用してもよい。
【0011】
上記ポリビニルアルコールとしては、無変性のポリビニルアルコールの他に、カルボキシ変性、スルホン酸変性、チオール変性、シラノール変性、カチオン性基変性、ジアセトンアクリルアミド変性、アセトアセチル化変性などの各種変性ポリビニルアルコールを使用することができる。特に、請求項2記載のようにアセトアセチル化ポリビニルアルコールを使用した場合には、耐水性の高い接着剤組成物が得られるため好ましい。
【0012】
本発明に用いるポリ酢酸ビニル系エマルジョンを、アセトアセチル化ポリビニルアルコールを保護コロイドとしたエマルジョン重合により製造する場合、このアセトアセチル化ポリビニルアルコールのアセトアセチル化度は0.05〜20モル%、より好ましくは0.05〜15モル%の範囲が適当である。具体的な重合操作は、エマルジョン重合の開始前、重合中、重合終了後のいずれかの時点において反応器中にアセトアセチル化ポリビニルアルコールを添加する点以外は、一般的なエマルジョン重合方法にしたがって行えばよい。なお、アセトアセチル化ポリビニルアルコールの添加は、エマルジョン重合開始前または重合中に行うことが好ましい。アセトアセチル化ポリビニルアルコールの添加量は、重合後に得られるポリ酢酸ビニル系エマルジョンの固形分に対して0.1〜30重量%、好ましくは0.2〜20重量%が適当である。
【0013】
上記ポリ酢酸ビニル系エマルジョンの製造に使用されるモノマーとしては、酢酸ビニル、プロピオン酸ビニル等の酢酸ビニル系モノマーから選択される一種または二種以上が用いられ、さらに、これらの酢酸ビニル系モノマーと共重合可能な他のモノマーの一種または二種以上を、本発明の効果を阻害しない範囲で使用することができる。
【0014】
上記「他のモノマー」としては、アクリル酸エステル類、メタクリル酸エステル類、マレイン酸エステル類、クロトン酸エステル類、イタコン酸エステル類、塩化ビニル、塩化ビニリデン等のハロゲン化ビニル類、エチレン、プロピレン等のエチレン類、アクリロニトリル、メタクリロニトリル、スチレン、グリシジルアクリレート、グリシジルメタクリレート、グリシジルジビニルエーテル、グリシジルビニルエーテル等のグリシジル基含有化合物、N−メチロールアクリルアミド、N−メチロールメタクリルアミド等のメチロール基含有化合物及びそれらの誘導体、アクリルアミド、メタクリルアミド等のカルボン酸アミド、アクリル酸、メタクリル酸等のカルボキシル基含有モノマーおよびその無水物、ジビニルアジペート、ジビニルサクシネート、トリアリルシアヌレート、ジアリルフマレート、トリアリルシトレート、ジアリルマレート、ビニルバーサテート、そのほか水酸基含有モノマー、アミノ基含有モノマー、アミド基含有モノマー、スルホン基含有モノマー、多ビニル化合物等が挙げられる。
【0015】
上記ポリ酢酸ビニル系エマルジョンの製造に使用する重合開始剤としては、一般的に用いられているラジカル重合開始剤、例えば、過硫酸アンモニウム、過硫酸カリウムなどの過硫酸塩;過酸化水素、t−ブチルハイドロパーオキサイド、ベンゾイルパーオキサイド、ラウロイルパーオキサイドなどの過酸化物系重合開始剤;2,2’−アゾビスイソブチロニトリル、2,2’−アゾビス(2−メチルプロピオンアミジン)二塩酸塩、2,2’−アゾビス(2,4−ジメチルバレロニトリル)などのアゾ系重合開始剤などが挙げられる。
【0016】
本発明に使用されるポリイソシアネート化合物は、一分子中に二個以上のイソシアネート基を有するものであって、具体的にはトリレンジイソシアネート(以下、「TDI」という。)、TDIアダクト、ジフェニルメタン−4,4’−ジイソシアネート(以下、「MDI」という。)、ポリメリックMDI、ヘキサメチレンジイソシアネート(以下、「HDI」という。)などが例示される。このうち、液状で取り扱いやすいこと、揮発性が低いため安全性が高いことから、ポリメリックMDIや、カルボジイミド化等により液状化したMDIを使用することが好ましい。また、水分散性を改良したいわゆる自己乳化形ポリイソシアネート化合物を使用してもよく、特に自己乳化形ポリメリックMDIが好ましく使用される。
【0017】
上記ポリイソシアネート化合物の使用量は、上記ポリ酢酸ビニル樹脂系エマルジョンの不揮発分100重量部に対して3〜50重量部とする必要があり、10〜30重量部とすることが好ましい。ポリイソシアネート化合物の使用量が3重量部未満では、得られる接着剤組成物において耐水性および耐熱性の向上効果が十分に発揮されない。一方、ポリイソシアネート化合物の添加量が50重量部を超える場合には、得られる接着剤組成物の流動性が低下して塗布性が悪くなる。
【0018】
本発明の接着剤組成物は、上記ポリイソシアネート化合物を、残存するイソシアネート基のモル数が使用したポリイソシアネート化合物に含まれるイソシアネート基のモル数に対して5モル%以下(より好ましくは2モル%以下、さらに好ましくは1モル%以下)となるまで反応させて得られたものである。5モル%を超えるイソシアネート基が組成物中に残存する場合には、本発明の接着剤組成物の保存中にこのイソシアネート基が組成物中の水分などと反応して発泡するなど保存安定性が悪くなる。また、木材などを高周波プレスやホットプレスなどを用いて加熱接着する際に、被着材からはみ出した接着剤中の残存イソシアネート基の作用でプレス機の熱盤等に接着剤が強固に付着し、このため加熱接着後の木材がプレス機の盤面から剥がれなくなる等の問題が生じる。
【0019】
上記ポリ酢酸ビニル系エマルジョンと上記ポリイソシアネート化合物とを反応させる方法としては、請求項3に記載のように、ポリ酢酸ビニル系エマルジョンにポリイソシアネート化合物を添加して、攪拌しながら、温度20〜55℃(より好ましくは30〜50℃、さらに好ましくは35〜45℃)で反応させる方法が好ましい。反応温度が55℃を超える場合には反応液が激しく発泡し、反応制御が困難となる。一方、反応温度が20℃未満ではイソシアネート基の反応速度が遅く、残存イソシアネート基の量を5モル%未満とするまでに例えば24時間以上を要するため、接着剤組成物の生産性が低下する。なお、反応を攪拌下で行うことにより、反応に伴って発生する炭酸ガスを液外に逃して反応液の発泡を抑え、またゲル化を防止する効果が得られる。
【0020】
なお、接着剤組成物中に含まれる残存イソシアネート基の量を測定する方法としては、試料に過剰のジ−n−ブチルアミンを加えて常温で反応させた後、未反応のアミンを塩酸にて逆滴定する方法などが挙げられる。
【0021】
本発明の接着剤組成物には、柔軟性や接着性を改良するなどの目的で、各種可塑剤、有機溶剤などを配合することができる。可塑剤の例としては、フタル酸ジブチル、フタル酸ジオクチル等の芳香族二塩基酸ジアルキルエステル;コハク酸ジメチル、アジピン酸ジイソブチル等の脂肪族二塩基酸ジアルキルエステルなどが挙げられる。また、有機溶剤としては、トルエン、キシレンなどの芳香族系溶剤;エチレングリコールモノブチルエーテル、ジエチレングリコールモノブチルエーテル、ジエチレングリコールモノブチルエーテルアセテート、プロピレングリコールモノメチルエーテルなどのグリコールエーテル系溶剤;シクロヘキサノン、メチルイソブチルケトンなどのケトン系溶剤;酢酸ブチル、酢酸イソブチルなどの酢酸エステル系溶剤などを使用可能である。
【0022】
また、本発明の接着剤組成物には各種充填剤を配合することができる。この充填剤としては、小麦粉、コーンスターチ、炭酸カルシウム、シリカ、カオリンクレー、タルク、水酸化アルミニウム、酸化チタン、酸化亜鉛、シラスバルーンなどが挙げられる。このほか、必要に応じて消泡剤、防腐剤、香料、増粘剤、安定化剤などを本発明の接着剤組成物に配合してもよい。
【0023】
本発明の接着剤組成物は、一液型として使用した場合にも高い耐熱性能および耐水性能を発揮するが、必要に応じて使用時に各種架橋剤(硬化剤)を配合してもよい。この架橋剤としては、各種金属塩類、アミノ系樹脂類、グリオキザールなどのアルデヒド化合物、4,4’−ジフェニルメタンジイソシアネートなどのイソシアネート化合物、およびエポキシ化合物などが例示される。
【0024】
また、本発明の接着剤組成物は、不揮発分30〜70重量%であることが好ましく、使用時における粘度は1〜100Pa・s/30℃であることが好ましい。
【0025】
【発明の実施の形態】
以下、実施例及び比較例により本発明をさらに具体的に説明する。なお、以下において「部」は重量部を、特に記載のない「%」は重量%を示す。
【0026】
(実施例1)
ガラス製重合容器中に、水606重量部およびPVA217(株式会社クラレ製、平均重合度約1700、ケン化度約88%のポリビニルアルコールの商品名)58部を仕込み、加熱攪拌して溶解させた後、酒石酸0.65部および酢酸ビニル30部を添加し、3%過酸化水素水溶液5部を加えて80℃で初期重合を行った。続いて、酢酸ビニル320部および3%過酸化水素水溶液15部を、3時間30分かけて均一に連続滴下しながら重合させ、滴下終了から1時間熟成を行った。
次いで、系を40℃まで冷却し、この温度でミリオネートMR−200(日本ポリウレタン工業株式会社製、ポリメリックMDIの商品名)52部(ポリ酢酸ビニル系エマルジョンの固形分100部に対して12.7部)を添加し、16時間攪拌しながら反応させた。その後、フタル酸ジブチル(以下、「DBP」という。)42部を添加して、不揮発分43.1%、粘度6.6Pa・s/30℃、残存イソシアネート基0.3モル%の水系接着剤組成物を得た。
【0027】
(実施例2)
ミリオネートMR−200の添加量を104部(ポリ酢酸ビニル系エマルジョンの固形分100部に対して25.5部)とした点以外は実施例1と同様にして、不揮発分44.8%、粘度15.2Pa・s/30℃、残存イソシアネート基0.5モル%の水系接着剤組成物を得た。
【0028】
(実施例3)
ガラス製重合容器中に、水550重量部およびゴーセファイマーZ−210((日本合成化学工業株式会社製、平均重合度約1300、ケン化度約96%のアセトアセチル化ポリビニルアルコールの商品名)53部を仕込み、加熱攪拌して溶解させた後、酢酸ビニル30部を添加し、2%過硫酸アンモニウム水溶液12部を加えて80℃で初期重合を行った。続いて、酢酸ビニル377部および2%過硫酸アンモニウム水溶液28部を、3時間30分かけて均一に連続滴下しながら重合させ、滴下終了から1時間熟成を行った。
次いで、系を40℃まで冷却し、この温度でミリオネートMR−200を54部(ポリ酢酸ビニル系エマルジョンの固形分100部に対して11.7部)添加し、16時間攪拌しながら反応させた。その後、DBP32部を添加して、不揮発分46.3%、粘度5.3Pa・s/30℃、残存イソシアネート基0.3モル%の水系接着剤組成物を得た。
【0029】
(実施例4)
イソシアネート化合物として、ミリオネートMR−200に代えて同量のコロネート3053(日本ポリウレタン工業株式会社製、自己乳化形MDIの商品名)を使用した点以外は実施例3と同様にして、不揮発分46.5%、粘度5.5Pa・s/30℃、残存イソシアネート基0.2モル%の水系接着剤組成物を得た。
【0030】
(実施例5)
イソシアネート化合物として、ミリオネートMR−200に代えて同量のコロネートL(日本ポリウレタン工業株式会社製、TDIアダクト物の商品名)を使用した点以外は実施例3と同様にして、不揮発分45.5%、粘度5.4Pa・s/30℃、残存イソシアネート基0.4モル%の水系接着剤組成物を得た。
【0031】
(実施例6)
イソシアネート化合物として、ミリオネートMR−200に代えて同量のアクアネート110(日本ポリウレタン工業株式会社製、自己乳化形HDIの商品名)を使用した点以外は実施例3と同様にして、不揮発分46.0%、粘度6.3Pa・s/30℃、残存イソシアネート基0.3モル%の水系接着剤組成物を得た。
【0032】
(比較例1)
ミリオネートMR−200を添加しなかった点以外は実施例1と同様にして、不揮発分40.4%、粘度4.8Pa・s/30℃の水系接着剤組成物を得た。
【0033】
(比較例2)
ミリオネートMR−200の添加量を10部(ポリ酢酸ビニル系エマルジョンの固形分100部に対して2.5部)とした点以外は実施例1と同様にして、不揮発分40.9%、粘度5.2Pa・s/30℃、残存イソシアネート基0.1モル%の水系接着剤組成物を得た。
【0034】
(比較例3)
ミリオネートMR−200を添加しなかった点以外は実施例3と同様にして、不揮発分43.7%、粘度4.0Pa・s/30℃の水系接着剤組成物を得た。
【0035】
(比較例4)
ミリオネートMR−200の添加量を10部(ポリ酢酸ビニル系エマルジョンの固形分100部に対して2.2部)とした点以外は実施例1と同様にして、不揮発分44.2%、粘度4.5Pa・s/30℃、残存イソシアネート基0.1モル%の水系接着剤組成物を得た。
【0036】
(比較例5)
ミリオネートMR−200の添加量を250部(ポリ酢酸ビニル系エマルジョンの固形分100部に対して54部)とした点以外は実施例1と同様にして、不揮発分52.3%、粘度9.5Pa・s/30℃、残存イソシアネート基0.5モル%の水系接着剤組成物を得た。しかし、この組成物は流動性が低く、試験片に接着剤を均一に塗布することができなかったため、後述する接着性能試験は行わなかった。
【0037】
(比較例6)
後述する加熱接着適性試験の直前に、比較例3の水系接着剤組成物の不揮発分100部に対してミリオネートMR−200を11.7部添加混合して、不揮発分43.9%、粘度4.2Pa・s/30℃、残存イソシアネート基92モル%の水系接着剤組成物を調整した。
【0038】
得られた接着剤組成物につき、下記の接着性能試験を行った。
(1)圧縮剪断接着強さ試験(JIS K6852に準拠)
上記実施例1〜6および比較例1〜4の接着剤組成物を用いて、以下の接着条件で試験片を作成し、下記の試験方法により圧縮剪断接着強さ(N/mm2)を測定した。その結果を表1および表2に示す。
なお、表1および表2中の「PVA」はポリビニルアルコールを、「AA化PVA」はアセトアセチル化ポリビニルアルコールを表す。
[接着条件]
被着材:樺材×樺材
塗布量(有姿):200g/m2
圧締圧力:1MPa
圧締時間:24時間(23±2℃)
養生時間:48時間(23±2℃)
[試験方法]
常態試験:試験片作成後、そのままの条件で測定する。
耐熱試験:試験片を60±3℃の恒温器中に2時間放置した後で測定する。
耐水試験:試験片を30±1℃の水中に3時間放置した後、室温の水中に冷めるまで浸し、濡れたままの状態で測定する。
【0039】
【表1】
【0040】
【表2】
【0041】
表1および表2から判るように、実施例1〜6の接着剤組成物は常態、耐熱および耐水のいずれの試験においても高い圧縮剪断接着強さを示した。このうち、ポリ酢酸ビニル系エマルジョンをする際の保護コロイドとして無変性のポリビニルアルコールを用いた実施例1、2に比べて、アセトアセチル化ポリビニルアルコールを保護コロイドとした実施例3〜6はさらに接着強さが高く、特に実施例3および4の接着剤組成物は、高温時にもしばしば材料破壊を起こすほどの十分な接着強さを示した。
一方、ポリイソシアネート化合物を反応させなかった比較例1、3およびポリイソシアネート化合物の使用量が少ない比較例2、4では、対応する実施例1、3に比べて圧縮剪断接着強さが低かった。また、ポリイソシアネート化合物の使用量が多すぎる比較例5では、上述のように組成物を被着材に均一に塗布することができなかった。
【0042】
(2)加熱接着適性試験
上記実施例1〜6および比較例1〜4、6の接着剤組成物を用いて以下の接着条件でホットプレスを行い、下記項目につき評価した。その結果を表3におよび表4に示す。
[接着条件]
被着材:厚さ1mmのスプルース化粧単板×厚さ30mmのツガ集成材
塗布量(有姿):120g/m2(ツガ集成材側に塗布)
熱盤表面温度:110℃
圧締圧力:0.7MPa
圧締時間:90秒間
養生時間:48時間(23±2℃)
[試験方法]
解圧直後の接着状態:スプルース化粧単板の剥離の有無、および接着材の熱盤への付着の有無を目視評価する。
浸せき剥離試験:養生後の試験片を日本農林規格(JAS)の浸せき剥離試験により評価する。
【0043】
【表3】
【0044】
【表4】
【0045】
表3および表4に示すように、実施例1〜6の接着剤組成物は耐熱性が高いため、この組成物により接着された木材はホットプレスの解圧直後にも剥離を起こすことはなかった。また、これらの接着剤組成物により接着された木材はJASの浸せき剥離試験に合格するものであった。
一方、無変性のポリビニルアルコールを保護コロイドとし、ポリイソシアネート化合物を使用しないかあるいは使用量の少ない比較例1、2の接着剤組成物により接着された木材は耐熱性、耐水性ともに不良であり、アセトアセチル化ポリビニルアルコールを保護コロイドとした比較例3、4の接着剤組成物では耐水性は改善されたものの、耐熱性の点ではまだ性能が不十分であった。そして、ポリイソシアネート化合物を接着直前に配合した比較例6の接着剤組成物によると、プレス時に木材からはみ出した接着剤が熱盤に付着し、この接着剤のため、加熱接着後の木材が熱盤から剥がれなくなるという問題が生じた。
【0046】
なお、本発明においては、前記具体的実施例に示すものに限られず、目的、用途に応じて本発明の範囲内で種々変更した実施例とすることができる。
【0047】
【発明の効果】
本発明の接着剤組成物は、高度な耐熱性能および耐水性能を発揮するので、特に木材などを高周波プレスやホットプレスなどを用いて加熱接着する用途に好適である。この接着剤組成物は、残存イソシアネート基が所定量以下に抑えられているので、木材に対しては十分な接着性を示すとともに、高周波プレスの極盤やホットプレスの熱盤などに対して不必要に接着することがないので作業性が良い。そして、本発明の組成物は、非ホルムアルデヒド系の接着剤組成物であるため、建材製造用の接着剤などとして有用である。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an adhesive composition using a polyvinyl acetate emulsion and a method for producing the same. Since the adhesive composition of the present invention is non-formaldehyde and has good heat adhesion suitability, it is suitably used as an adhesive for heat bonding wood or the like by high frequency press, hot press or the like.
[0002]
[Prior art]
Conventionally, when heat-bonding wood or the like with a high-frequency press or hot press, amino resin adhesives obtained by reacting urea or melamine with formaldehyde have been frequently used. However, formaldehyde released from these adhesives has recently been regarded as a problem, and therefore, replacement with non-formaldehyde adhesive compositions is being considered.
[0003]
[Problems to be solved by the invention]
As a non-formaldehyde wood adhesive, an adhesive composition comprising a polyvinyl acetate emulsion using polyvinyl alcohol as a protective colloid is widely used. This adhesive composition has good workability because it has good adhesion to wood and can be used in a single solution. However, since this adhesive composition generally has low water resistance, it is not suitable for applications that require high water resistance. In addition, because heat resistance is low, when heat-bonding wood, etc., by high-frequency press, hot press, etc., it cannot withstand the shrinkage stress caused by the moisture content change of wood heated by the press, and it is easy to peel off immediately after decompression There is.
[0004]
Further, as a polyvinyl acetate emulsion type adhesive having improved water resistance and heat resistance, acetoacetylated polyvinyl alcohol is protected as in the vinyl compound polymerization method disclosed in JP-A-60-54961. Adhesive compositions obtained by a colloid polymerization method are known. However, higher heat resistance may be required depending on the type of wood and the size of the lamina.
[0005]
On the other hand, a two-pack type aqueous adhesive composition in which an aqueous emulsion of a vinyl acetate polymer containing polyvinyl alcohol and an isocyanate compound (curing agent) are blended at the time of use is also known, for example, Japanese Patent Publication No. 55-9437. It is disclosed in the publication. This two-component adhesive composition exhibits higher heat resistance and water resistance than the polyvinyl acetate emulsion adhesive composition described above. However, since this composition is a two-component type, it takes time and effort to mix the curing agent, and foaming at the time of mixing and adhesion, and thickening of the adhesive with time, etc. occur, resulting in poor workability. In addition, in applications where wood is heat-bonded using a high-frequency press or hot press, if the adhesive that protrudes from the adhesive layer adheres to the pole plate of a high-frequency press or the hot plate of a hot press, Since it contains a large amount of unreacted isocyanate compound, it has strong adhesion to the above-mentioned electrode board and hot plate (usually made of iron plate), so that the wood after heat bonding will not peel off from the surface of the press machine. There's a problem.
[0006]
An object of the present invention is an adhesive composition that exhibits high heat resistance and water resistance, and is particularly suitable for non-formaldehyde-based water-based bonding suitable for heat-bonding wood or the like using a high-frequency press or hot press. It is to provide an agent composition.
[0007]
[Means for Solving the Problems]
The present inventors are a composition obtained by reacting a specific polyvinyl acetate emulsion and a polyisocyanate compound in advance, wherein the amount of residual isocyanate groups in the composition is a predetermined value or less. According to the composition, the present invention has been completed by finding that the above-mentioned problems can be solved.
[0008]
That is, the adhesive composition according to claim 1 of the present invention is a polyisocyanate compound having two or more isocyanate groups in one molecule with respect to 100 parts by weight of the nonvolatile content of the polyvinyl acetate emulsion containing polyvinyl alcohol. It is obtained by reacting 3 to 50 parts by weight until the amount of residual isocyanate groups is 5 mol% or less with respect to the amount of isocyanate groups contained in the polyisocyanate compound.
[0009]
The “polyvinyl acetate emulsion containing polyvinyl alcohol” includes (1) a polyvinyl acetate emulsion obtained by emulsion polymerization using polyvinyl alcohol as a protective colloid, and (2) a vinyl acetate emulsion obtained by solution polymerization. After adding polyvinyl alcohol and water to the polymer, the polyvinyl acetate emulsion obtained by stirring and emulsification, and (3) the polyvinyl alcohol emulsion obtained using another protective colloid or emulsifier Added ones and the like. Among these, in the present invention, it is preferable to use the polyvinyl acetate emulsion (1). Further, polyvinyl alcohol may be added after the polyvinyl acetate emulsion (1).
[0010]
As the protective colloid, polyvinyl alcohol having a saponification degree of 75 to 99% and an average polymerization degree of 100 to 10,000 is preferably used. Further, when producing the polyvinyl acetate emulsion of the above (1), in addition to polyvinyl alcohol, cellulose derivatives such as hydroxymethylcellulose, methylcellulose, carboxymethylcellulose, various processed starches, or anionic, cationic, or Various nonionic surfactants may be used in combination.
[0011]
As the polyvinyl alcohol, in addition to unmodified polyvinyl alcohol, various modified polyvinyl alcohols such as carboxy modification, sulfonic acid modification, thiol modification, silanol modification, cationic group modification, diacetone acrylamide modification, and acetoacetylation modification are used. can do. In particular, the use of acetoacetylated polyvinyl alcohol as described in claim 2 is preferable because an adhesive composition having high water resistance can be obtained.
[0012]
When the polyvinyl acetate emulsion used in the present invention is produced by emulsion polymerization using acetoacetylated polyvinyl alcohol as a protective colloid, the degree of acetoacetylation of this acetoacetylated polyvinyl alcohol is more preferably 0.05 to 20 mol%. The range of 0.05 to 15 mol% is appropriate. The specific polymerization operation is performed according to a general emulsion polymerization method except that acetoacetylated polyvinyl alcohol is added to the reactor at any time before the start of emulsion polymerization, during polymerization, or after completion of polymerization. Just do it. The addition of acetoacetylated polyvinyl alcohol is preferably performed before the start of emulsion polymerization or during the polymerization. The addition amount of acetoacetylated polyvinyl alcohol is 0.1 to 30% by weight, preferably 0.2 to 20% by weight, based on the solid content of the polyvinyl acetate emulsion obtained after polymerization.
[0013]
As the monomer used in the production of the polyvinyl acetate emulsion, one or more selected from vinyl acetate monomers such as vinyl acetate and vinyl propionate are used. Further, these vinyl acetate monomers and One or more kinds of other copolymerizable monomers can be used as long as the effects of the present invention are not impaired.
[0014]
Examples of the “other monomers” include acrylic acid esters, methacrylic acid esters, maleic acid esters, crotonic acid esters, itaconic acid esters, vinyl halides such as vinyl chloride and vinylidene chloride, ethylene, propylene, etc. Glycidyl group-containing compounds such as ethylenes, acrylonitrile, methacrylonitrile, styrene, glycidyl acrylate, glycidyl methacrylate, glycidyl divinyl ether, glycidyl vinyl ether, methylol group-containing compounds such as N-methylol acrylamide, N-methylol methacrylamide and the like Derivatives, carboxylic acid amides such as acrylamide and methacrylamide, carboxyl group-containing monomers such as acrylic acid and methacrylic acid, and anhydrides thereof, divinyl adipate, divinyl Cuccinate, triallyl cyanurate, diallyl fumarate, triallyl citrate, diallyl malate, vinyl versatate, hydroxyl group-containing monomer, amino group-containing monomer, amide group-containing monomer, sulfone group-containing monomer, polyvinyl compound, etc. It is done.
[0015]
As the polymerization initiator used for the production of the polyvinyl acetate emulsion, generally used radical polymerization initiators, for example, persulfates such as ammonium persulfate and potassium persulfate; hydrogen peroxide, t-butyl Peroxide polymerization initiators such as hydroperoxide, benzoyl peroxide, lauroyl peroxide; 2,2′-azobisisobutyronitrile, 2,2′-azobis (2-methylpropionamidine) dihydrochloride, Examples include azo polymerization initiators such as 2,2′-azobis (2,4-dimethylvaleronitrile).
[0016]
The polyisocyanate compound used in the present invention has two or more isocyanate groups in one molecule, and specifically includes tolylene diisocyanate (hereinafter referred to as “TDI”), TDI adduct, diphenylmethane- Examples include 4,4′-diisocyanate (hereinafter referred to as “MDI”), polymeric MDI, hexamethylene diisocyanate (hereinafter referred to as “HDI”), and the like. Among these, it is preferable to use polymeric MDI or MDI liquefied by carbodiimidization because it is liquid and easy to handle and has high safety due to low volatility. Further, a so-called self-emulsifying polyisocyanate compound with improved water dispersibility may be used, and self-emulsifying polymeric MDI is particularly preferably used.
[0017]
The amount of the polyisocyanate compound used should be 3 to 50 parts by weight, preferably 10 to 30 parts by weight, based on 100 parts by weight of the nonvolatile content of the polyvinyl acetate resin emulsion. When the amount of the polyisocyanate compound used is less than 3 parts by weight, the resulting adhesive composition does not sufficiently exhibit the effect of improving water resistance and heat resistance. On the other hand, when the addition amount of the polyisocyanate compound exceeds 50 parts by weight, the fluidity of the obtained adhesive composition is lowered and the coating property is deteriorated.
[0018]
In the adhesive composition of the present invention, the polyisocyanate compound is 5 mol% or less (more preferably 2 mol%) based on the number of isocyanate groups contained in the polyisocyanate compound in which the number of remaining isocyanate groups is used. Hereinafter, it is obtained by further reacting until it becomes 1 mol% or less. When an isocyanate group exceeding 5 mol% remains in the composition, the storage stability such as foaming occurs when the isocyanate group reacts with moisture in the composition during storage of the adhesive composition of the present invention. Deteriorate. In addition, when heat-bonding wood, etc., using a high-frequency press or hot press, the adhesive adheres firmly to the hot platen of the press machine due to the action of residual isocyanate groups in the adhesive protruding from the adherend. For this reason, there arises a problem that the wood after heat bonding does not peel off from the surface of the press machine.
[0019]
As a method of reacting the polyvinyl acetate emulsion and the polyisocyanate compound, the polyisocyanate compound is added to the polyvinyl acetate emulsion and stirred at a temperature of 20 to 55 as described in claim 3. A method of reacting at a temperature of more preferably 30 to 50 ° C., more preferably 35 to 45 ° C. is preferable. When the reaction temperature exceeds 55 ° C., the reaction solution foams violently, making it difficult to control the reaction. On the other hand, when the reaction temperature is less than 20 ° C., the reaction rate of the isocyanate group is slow, and for example, it takes 24 hours or more until the amount of the remaining isocyanate group is less than 5 mol%, so the productivity of the adhesive composition is lowered. In addition, by performing reaction under stirring, the carbon dioxide gas which generate | occur | produces with reaction is escaped out of a liquid, the effect which suppresses foaming of a reaction liquid and prevents gelatinization is acquired.
[0020]
The method for measuring the amount of residual isocyanate groups contained in the adhesive composition is to add excess di-n-butylamine to the sample and react at room temperature, and then reverse the unreacted amine with hydrochloric acid. The method of titrating is mentioned.
[0021]
In the adhesive composition of the present invention, various plasticizers, organic solvents and the like can be blended for the purpose of improving flexibility and adhesiveness. Examples of plasticizers include aromatic dibasic acid dialkyl esters such as dibutyl phthalate and dioctyl phthalate; aliphatic dibasic acid dialkyl esters such as dimethyl succinate and diisobutyl adipate. Organic solvents include aromatic solvents such as toluene and xylene; glycol ether solvents such as ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, diethylene glycol monobutyl ether acetate, and propylene glycol monomethyl ether; ketones such as cyclohexanone and methyl isobutyl ketone Solvents such as acetate solvents such as butyl acetate and isobutyl acetate can be used.
[0022]
Moreover, various fillers can be mix | blended with the adhesive composition of this invention. Examples of the filler include wheat flour, corn starch, calcium carbonate, silica, kaolin clay, talc, aluminum hydroxide, titanium oxide, zinc oxide, and shirasu balloon. In addition, antifoaming agents, preservatives, fragrances, thickeners, stabilizers and the like may be added to the adhesive composition of the present invention as necessary.
[0023]
The adhesive composition of the present invention exhibits high heat resistance and water resistance even when used as a one-pack type, but various cross-linking agents (curing agents) may be blended at the time of use as necessary. Examples of the crosslinking agent include various metal salts, amino resins, aldehyde compounds such as glyoxal, isocyanate compounds such as 4,4′-diphenylmethane diisocyanate, and epoxy compounds.
[0024]
Moreover, it is preferable that the adhesive composition of this invention is 30-70 weight% of non volatile matters, and it is preferable that the viscosity at the time of use is 1-100 Pa.s / 30 degreeC.
[0025]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described more specifically with reference to examples and comparative examples. In the following description, “parts” means parts by weight, and “%” not specifically mentioned means% by weight.
[0026]
Example 1
In a glass polymerization container, 606 parts by weight of water and 58 parts of PVA217 (manufactured by Kuraray Co., Ltd., trade name of polyvinyl alcohol having an average polymerization degree of about 1700 and a saponification degree of about 88%) were charged and dissolved by heating and stirring. Thereafter, 0.65 part of tartaric acid and 30 parts of vinyl acetate were added, 5 parts of 3% hydrogen peroxide aqueous solution was added, and initial polymerization was carried out at 80 ° C. Subsequently, 320 parts of vinyl acetate and 15 parts of a 3% aqueous hydrogen peroxide solution were polymerized while continuously dropping uniformly over 3 hours and 30 minutes, followed by aging for 1 hour from the end of dropping.
Next, the system was cooled to 40 ° C., and at this temperature, 52 parts of Millionate MR-200 (trade name of Polymeric MDI, manufactured by Nippon Polyurethane Industry Co., Ltd.) (12.7 with respect to 100 parts of the solid content of the polyvinyl acetate emulsion). Part) was added and allowed to react with stirring for 16 hours. Thereafter, 42 parts of dibutyl phthalate (hereinafter referred to as “DBP”) was added, and an aqueous adhesive having a nonvolatile content of 43.1%, a viscosity of 6.6 Pa · s / 30 ° C., and a residual isocyanate group of 0.3 mol%. A composition was obtained.
[0027]
(Example 2)
The non-volatile content was 44.8% and the viscosity was the same as in Example 1 except that the amount of Millionate MR-200 was 104 parts (25.5 parts relative to 100 parts of the solid content of the polyvinyl acetate emulsion). A water-based adhesive composition having 15.2 Pa · s / 30 ° C. and a residual isocyanate group of 0.5 mol% was obtained.
[0028]
(Example 3)
In a glass polymerization vessel, 550 parts by weight of water and Goseifamer Z-210 (product name of acetoacetylated polyvinyl alcohol having an average polymerization degree of about 1300 and a saponification degree of about 96%, manufactured by Nippon Synthetic Chemical Industry Co., Ltd.) After charging 53 parts and dissolving by heating and stirring, 30 parts of vinyl acetate was added, 12 parts of a 2% aqueous ammonium persulfate solution was added, and initial polymerization was carried out at 80 ° C. Subsequently, 377 parts and 2 of vinyl acetate were added. 28 parts of an aqueous ammonium persulfate solution was polymerized while continuously dropping uniformly over 3 hours and 30 minutes, and aging was performed for 1 hour from the end of dropping.
Next, the system was cooled to 40 ° C., and 54 parts of Millionate MR-200 (11.7 parts with respect to 100 parts of the solid content of the polyvinyl acetate emulsion) was added at this temperature, and the reaction was allowed to proceed with stirring for 16 hours. . Thereafter, 32 parts of DBP was added to obtain an aqueous adhesive composition having a nonvolatile content of 46.3%, a viscosity of 5.3 Pa · s / 30 ° C., and a residual isocyanate group of 0.3 mol%.
[0029]
(Example 4)
As the isocyanate compound, the same amount of Coronate 3053 (trade name of self-emulsifying MDI manufactured by Nippon Polyurethane Industry Co., Ltd.) was used instead of Millionate MR-200, and the non-volatile content was 46. An aqueous adhesive composition having 5%, a viscosity of 5.5 Pa · s / 30 ° C., and a residual isocyanate group of 0.2 mol% was obtained.
[0030]
(Example 5)
The non-volatile content of 45.5 was the same as in Example 3 except that the same amount of Coronate L (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name of TDI adduct) was used as the isocyanate compound instead of Millionate MR-200. %, A viscosity of 5.4 Pa · s / 30 ° C., and an aqueous adhesive composition having a residual isocyanate group of 0.4 mol% was obtained.
[0031]
(Example 6)
As the isocyanate compound, the same amount of Aquanate 110 (Nippon Polyurethane Industry Co., Ltd., trade name of self-emulsifying HDI) was used instead of Millionate MR-200, in the same manner as in Example 3, except that the nonvolatile content was 46 An aqueous adhesive composition having a viscosity of 6.3 Pa · s / 30 ° C. and a residual isocyanate group of 0.3 mol% was obtained.
[0032]
(Comparative Example 1)
A water-based adhesive composition having a non-volatile content of 40.4% and a viscosity of 4.8 Pa · s / 30 ° C. was obtained in the same manner as in Example 1 except that Millionate MR-200 was not added.
[0033]
(Comparative Example 2)
The non-volatile content was 40.9% and the viscosity was the same as in Example 1 except that the amount of Millionate MR-200 was 10 parts (2.5 parts relative to 100 parts of the solid content of the polyvinyl acetate emulsion). An aqueous adhesive composition having 5.2 Pa · s / 30 ° C. and a residual isocyanate group of 0.1 mol% was obtained.
[0034]
(Comparative Example 3)
A water-based adhesive composition having a nonvolatile content of 43.7% and a viscosity of 4.0 Pa · s / 30 ° C. was obtained in the same manner as in Example 3 except that Millionate MR-200 was not added.
[0035]
(Comparative Example 4)
The non-volatile content was 44.2% and the viscosity was the same as in Example 1 except that the amount of Millionate MR-200 was 10 parts (2.2 parts relative to 100 parts of the solid content of the polyvinyl acetate emulsion). An aqueous adhesive composition having 4.5 Pa · s / 30 ° C. and a residual isocyanate group of 0.1 mol% was obtained.
[0036]
(Comparative Example 5)
Except that the amount of Millionate MR-200 added was 250 parts (54 parts based on 100 parts of the solid content of the polyvinyl acetate emulsion), the non-volatile content was 52.3% and the viscosity was 9. An aqueous adhesive composition having 5 Pa · s / 30 ° C. and a residual isocyanate group of 0.5 mol% was obtained. However, since this composition had low fluidity and the adhesive could not be uniformly applied to the test piece, the adhesion performance test described later was not performed.
[0037]
(Comparative Example 6)
Immediately before the heat adhesion suitability test described later, 11.7 parts of Millionate MR-200 were added to and mixed with 100 parts of the nonvolatile content of the aqueous adhesive composition of Comparative Example 3 to obtain a nonvolatile content of 43.9% and a viscosity of 4 A water-based adhesive composition having 2 Pa · s / 30 ° C. and a residual isocyanate group of 92 mol% was prepared.
[0038]
The following adhesive performance test was done about the obtained adhesive composition.
(1) Compression shear bond strength test (conforms to JIS K 6852)
Using the adhesive compositions of Examples 1 to 6 and Comparative Examples 1 to 4, test pieces were prepared under the following bonding conditions, and the compression shear bond strength (N / mm 2 ) was measured by the following test method. did. The results are shown in Tables 1 and 2.
In Tables 1 and 2, “PVA” represents polyvinyl alcohol, and “AA-modified PVA” represents acetoacetylated polyvinyl alcohol.
[Adhesion conditions]
Substrate: glazing material x glazing material application amount (solid): 200 g / m 2
Clamping pressure: 1 MPa
Clamping time: 24 hours (23 ± 2 ° C)
Curing time: 48 hours (23 ± 2 ° C)
[Test method]
Normal test: Measured under the same conditions after preparing the test piece.
Heat resistance test: The test piece is measured after being left in a thermostat at 60 ± 3 ° C. for 2 hours.
Water resistance test: A test piece is left in water at 30 ± 1 ° C. for 3 hours, then immersed in water at room temperature until it cools, and measurement is performed in a wet state.
[0039]
[Table 1]
[0040]
[Table 2]
[0041]
As can be seen from Tables 1 and 2, the adhesive compositions of Examples 1 to 6 exhibited high compression shear adhesive strength in any of the tests of normal state, heat resistance and water resistance. Among these, Examples 3 to 6 using acetoacetylated polyvinyl alcohol as a protective colloid were further bonded as compared with Examples 1 and 2 using unmodified polyvinyl alcohol as a protective colloid when making a polyvinyl acetate emulsion. The strength was high, and in particular, the adhesive compositions of Examples 3 and 4 showed sufficient adhesive strength to cause material breakage even at high temperatures.
On the other hand, in Comparative Examples 1 and 3 in which the polyisocyanate compound was not reacted and in Comparative Examples 2 and 4 in which the amount of the polyisocyanate compound used was small, the compression shear adhesive strength was lower than in the corresponding Examples 1 and 3. Further, in Comparative Example 5 in which the amount of the polyisocyanate compound used was too large, the composition could not be uniformly applied to the adherend as described above.
[0042]
(2) Heat adhesion suitability test Using the adhesive compositions of Examples 1 to 6 and Comparative Examples 1 to 4 and 6, hot pressing was performed under the following adhesion conditions, and the following items were evaluated. The results are shown in Table 3 and Table 4.
[Adhesion conditions]
Substrate: 1 mm thick spruce decorative veneer x 30 mm thick tsuga laminated wood application amount (solid): 120 g / m 2 (applied to the tsuga laminated wood side)
Hot plate surface temperature: 110 ° C
Clamping pressure: 0.7 MPa
Clamping time: 90 seconds Curing time: 48 hours (23 ± 2 ° C)
[Test method]
Adhesion state immediately after decompression: The presence or absence of peeling of the spruce decorative veneer and the presence or absence of adhesion of the adhesive to the hot platen are visually evaluated.
Immersion peeling test: The test piece after curing is evaluated by a Japanese Agricultural Standard (JAS) immersion peeling test.
[0043]
[Table 3]
[0044]
[Table 4]
[0045]
As shown in Tables 3 and 4, since the adhesive compositions of Examples 1 to 6 have high heat resistance, the wood bonded by this composition does not cause peeling immediately after the hot press is decompressed. It was. Moreover, the wood bonded with these adhesive compositions passed the JAS immersion peel test.
On the other hand, unmodified polyvinyl alcohol is used as a protective colloid, and the wood bonded with the adhesive composition of Comparative Examples 1 and 2 in which the polyisocyanate compound is not used or the amount used is small is poor in both heat resistance and water resistance. Although the water resistance of the adhesive compositions of Comparative Examples 3 and 4 using acetoacetylated polyvinyl alcohol as a protective colloid was improved, the performance was still insufficient in terms of heat resistance. Then, according to the adhesive composition of Comparative Example 6 in which the polyisocyanate compound was blended immediately before bonding, the adhesive protruding from the wood at the time of pressing adheres to the hot platen, and because of this adhesive, the wood after heat bonding is heated. There was a problem that it could not be removed from the board.
[0046]
In addition, in this invention, it can restrict to what is shown to the said specific Example, It can be set as the Example variously changed within the range of this invention according to the objective and the use.
[0047]
【The invention's effect】
Since the adhesive composition of the present invention exhibits high heat resistance and water resistance, it is particularly suitable for applications in which wood or the like is heated and bonded using a high frequency press or a hot press. Since this adhesive composition has a residual isocyanate group suppressed to a predetermined amount or less, the adhesive composition exhibits sufficient adhesiveness to wood and is not suitable for a high-frequency press pole plate or a hot press hot platen. Workability is good because there is no need to bond. And since the composition of this invention is a non-formaldehyde type adhesive composition, it is useful as an adhesive etc. for building materials manufacture.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33565398A JP4387480B2 (en) | 1998-11-26 | 1998-11-26 | Adhesive composition and method for producing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33565398A JP4387480B2 (en) | 1998-11-26 | 1998-11-26 | Adhesive composition and method for producing the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000160126A JP2000160126A (en) | 2000-06-13 |
| JP4387480B2 true JP4387480B2 (en) | 2009-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP33565398A Expired - Lifetime JP4387480B2 (en) | 1998-11-26 | 1998-11-26 | Adhesive composition and method for producing the same |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002038108A (en) * | 2000-07-19 | 2002-02-06 | Sekisui Chem Co Ltd | Method of heating metal member and method of joining metal member and member to be joined |
| JP4585948B2 (en) * | 2005-09-12 | 2010-11-24 | 株式会社オーシカ | Highly water-resistant adhesive composition |
| JP5006534B2 (en) * | 2005-09-29 | 2012-08-22 | アイカ工業株式会社 | Adhesive composition |
| JP2013136195A (en) * | 2011-12-28 | 2013-07-11 | Sumitomo Chemical Co Ltd | Method for manufacturing laminated structure |
| CN107108767B (en) * | 2014-12-26 | 2019-04-30 | 株式会社可乐丽 | Aqueous emulsions and adhesives using them |
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1998
- 1998-11-26 JP JP33565398A patent/JP4387480B2/en not_active Expired - Lifetime
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| JP2000160126A (en) | 2000-06-13 |
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