JP4387938B2 - Substrate processing equipment - Google Patents

Description

  In the manufacturing process of a liquid crystal display device (LCD), a plasma display device (PDP), a semiconductor device, etc., the present invention performs various processes such as a cleaning process on a glass substrate for LCD or PDP, a semiconductor substrate, a printed circuit board, etc. The present invention relates to a substrate processing apparatus.

  Conventionally, in a substrate production line such as a glass substrate for LCD or PDP, a substrate cleaning mechanism has been provided after a specific processing apparatus using a chemical solution such as an etching process to remove foreign matters such as thin films and particles remaining on the substrate surface. Washing and removal is performed. As a substrate processing apparatus having such a substrate cleaning mechanism, for example, as shown in Patent Document 1, while supplying a processing liquid such as pure water to a substrate transported by transporting means such as a roller conveyor, the substrate The thing which makes a cylindrical roll brush contact | abut on the surface is proposed.

Further, as shown in Patent Document 2, a plurality of rod-like brushes are arranged at predetermined intervals on the upper surface side and the lower surface side of the substrate to be transported, and reciprocated in a direction perpendicular to the substrate transport direction. Also, a cleaning device for removing dust on the substrate has been proposed.
JP 9-326377 A Japanese Patent Laid-Open No. 10-34090

  However, since the substrate processing apparatus disclosed in Patent Document 1 cleans a substrate using a roll brush, it is difficult to manufacture a roll brush having the accuracy required for cleaning a large-sized substrate. That is, with the increase in the size of the substrate, the length of the roll brush extending in the horizontal direction orthogonal to the substrate transport direction is increased, and therefore the deflection of the central portion in the length direction occurs due to the weight of the roll brush itself, It is difficult to keep the distance between the roll brush constant, and it is not easy to manufacture a cleaning mechanism in which the distance between the substrate and the roll brush is constant.

  In the case of the cleaning apparatus shown in Patent Document 2, the brush cannot be uniformly slidably contacted with the main surface of the substrate unless the plane formed at the tip of the brush bristle bundle is uniform. It is difficult for processing to make the plane uniform. Further, in order to ensure sufficient cleaning performance with such a rod-shaped brush that is orthogonal to the substrate surface, the pressing force on the substrate surface must be increased. There is a possibility that the substrate conveyance may be hindered by the pressure, or the substrate may meander and be conveyed. Furthermore, it is necessary to press the brush with the plane of the brush tip parallel to the main surface of the substrate, but as the substrate size increases, the brush length extending in the horizontal direction perpendicular to the substrate transport direction becomes longer. Because the weight of the brush itself is likely to cause bending near the center in the longitudinal direction, the brush is not inclined up and down in the longitudinal direction of the brush, and the distance between the substrate and the brush is kept constant. It is difficult to press the brush body against the main surface of the substrate because high accuracy is required.

  The present invention has been made to solve the above-described problems, and can provide a substrate processing apparatus that can accurately transport a substrate while ensuring a sufficient cleaning function, and that can easily manufacture a substrate cleaning mechanism. An object of the present invention is to provide a substrate processing method.

According to a first aspect of the present invention, there is provided a conveying means for conveying a substrate, and a brush extending in a direction intersecting with a substrate feeding direction by the conveying means and parallel to the main surface of the substrate being conveyed. And a substrate processing apparatus having a sliding contact means for supporting the brush and slidingly contacting the substrate being transported , wherein the brush has a hair bundle formed by bundling a plurality of hairs at one end side. This hair bundle has a hair leg positioned on the downstream side of the upstream side in the substrate transport direction, so that the tip surface of the hair bundle is inclined with respect to the axial direction of the hair. The sliding contact means bends along the principal surface of the substrate from the upstream side to the downstream side in the substrate conveyance direction as the substrate is conveyed. In such a state that the It is intended to support the city.

In this configuration, the tip of the bristles of the brush is in sliding contact with the main surface of the substrate in a bent state ( bent state ) along the main surface of the substrate. For this reason, stress that tends to return to the straight state acts on the tip of the bent bristle bundle, so that the tip of the bristle bundle is urged toward the main surface of the substrate. As a result, for example, the flat surface formed by the tip of the hair bundle of the brush is uneven, or due to the length of the brush, the weight of the brush itself causes the deflection in the vicinity of the central portion in the length direction of the brush, Even if the brush is slightly tilted up and down in the longitudinal direction of the brush, the tip of the bristles of the brush can be slidably contacted with the main surface of the substrate. In addition, when the bristles of the brush are in sliding contact with the main surface of the substrate and bent, the tip of the brush expands in a fan shape in a side view, increasing the number of hairs acting on the main surface of the substrate. , Cleaning processing efficiency is improved. That is, if the tip of the brush bundle is not obliquely cut, the hair is stacked when the brush bundle comes into sliding contact with the main surface of the substrate, and the hair located above the bent portion of the bundle is Although there are some which do not act on the main surface of the substrate, according to the above configuration, occurrence of such a situation can be reduced.

The invention described in Claim 2 is a substrate processing apparatus according to claim 1, wherein the sliding contact means, before Symbol substrate conveyance direction than tip base end portion of the front listen bundle so as to be positioned downstream, it is shall be supported in a state of being inclined to the brush.

According to this configuration, since the brushes are arranged so as not Kowa in conveyance direction of the substrate, even if the state of being in sliding contact with the brush to the substrate main surface, it is possible to transport the substrate smoothly. In this case, for example, the inclination angle of the front end surface of the hair bundle with respect to the surface orthogonal to the axial direction of the hair is defined as the end surface angle, and the inclination angle of the hair bundle with respect to the direction orthogonal to the main surface of the substrate is defined as the brush angle. In this case, it is preferable that the sliding contact means supports the brush in a state where the brush angle is larger than the end face angle.

The invention according to claim 4 is the substrate processing apparatus according to any one of claims 1 to 3, wherein the sliding contact means reciprocates the brush along the longitudinal direction of the substrate. The main surface is slidably contacted.

According to this configuration, the tip of the bristles of the brush is bent toward the downstream side in the substrate conveyance direction with respect to the main surface of the substrate to be conveyed, and the brush is moved along the longitudinal direction thereof. The substrate can be brought into sliding contact with the main surface of the substrate while being reciprocated.

The invention described in Claim 5 is a substrate processing apparatus according to any one of claims 1 to 4, in which several of the brush along the substrate transfer direction is disposed in parallel is there.

In this configuration, a plurality of brushes are arranged in parallel along the substrate transport direction to continuously remove dirt from the substrate surface with the brush, thereby increasing the cleaning power for the substrate main surface.

The invention described in Claim 6 is a substrate processing apparatus according to any one of claims 1 to 5, wherein the brush multiple on the main surface side of both the substrate to be conveyed by said conveying means Each is arranged.

  In this configuration, by disposing a plurality of brushes on both main surface sides of the substrate, the cleaning power of both main surfaces of the substrate by the brush is enhanced.

The invention described in Claim 7 is a substrate processing apparatus according to claim 6, sliding the sliding means said brush to said main surface of the substrate while reciprocating along its longitudinal direction The plurality of brushes are arranged opposite to each other on both main surface sides of the substrate conveyed by the conveying means, and the sliding contact means is arranged so that the brushes are arranged opposite to each other in a non-conveying state of the substrate. The brushes are supported so that the tip portions of the brushes come into contact with each other , and the tip portions of the brushes are brought into sliding contact with each other by reciprocating the brushes arranged opposite to each other while the substrate is not transported . Is.

In this configuration, in a state where the board is not conveyed, abut each other tip of each brush is in sliding contact means and the oppositely disposed tips of the brushes is brought into sliding contact with each other, both The front ends of the hair bundles of the brush portions are rubbed with each other so that the front ends of both the hair bundles of each brush are washed.

The invention according to claim 8, claim 1乃The substrate processing apparatus according to what Re of Itaru 7, wherein the brush has a flexed state in sliding contact with the main surface of the substrate And a treatment liquid supply means for supplying a treatment liquid toward the tip of the hair bundle.

  According to these configurations, by supplying the treatment liquid toward the tip of the bristles of the brush, objects (foreign matter) generated by the sliding contact of the brush with the main surface of the substrate can be discharged out of the brush. Efficiency is improved.

According to the first aspect of the present invention, the tip of the bristle bundle of the brush is in sliding contact with the main surface of the substrate to be conveyed while being bent, and the brush in the bent state. The tip of the hair bundle is subjected to a stress that tends to return to a straight state, and the tip of the brush hair bundle is biased toward the main surface of the substrate. Even if the length of the brush is not uniform and the weight of the brush itself causes deflection near the center of the length direction of the brush, and the brush is slightly inclined up and down in the length direction of the brush The tip of the bristles of the brush can be slid uniformly with respect to the main surface of the substrate. In addition, when the bristles of the brush are in sliding contact with the main surface of the substrate and bent, the tip of the brush expands in a fan shape in a side view, increasing the number of hairs acting on the main surface of the substrate. , Cleaning processing efficiency is improved.

According to the invention described in claim 2 and 3, since the brush is arranged so as not Kowa based Ita搬 feeding direction, even if the state of being in sliding contact with the brush to the substrate main surface, smooth substrate Can be conveyed.

According to invention of Claim 4, a brush can be reciprocated along the longitudinal direction in the state which made the front-end | tip part of the hair | bristle bundle | flux of a brush contact the board | substrate main surface uniformly.

According to the fifth aspect of the present invention, the brushes are continuously scraped off from the substrate surface by the parallel arrangement of the plurality of brushes along the substrate transport direction, thereby increasing the cleaning power for the substrate main surface. be able to.

According to invention of Claim 6 , the cleaning power with respect to both the main surfaces of the board | substrate by a brush can be heightened by arrange | positioning a several brush to the both main surface sides of the said board | substrate.

According to the invention described in claim 7, in a state where the board is not conveyed, sliding means, wherein are oppositely arranged with sliding contact with each other the tips of the brush, bristles of both brushes The tip ends of the bundles can be rubbed together to clean the tips of both hair bundles of each brush.

According to the invention described in claim 8, by supplying the treatment liquid toward the tip of the bristle bundle of the brush, the matter (foreign matter) generated by the sliding contact of the brush with the substrate main surface can be discharged out of the brush. Processing (cleaning) efficiency is improved.

  Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing an outline of a substrate cleaning apparatus provided in a substrate processing apparatus according to an embodiment of the present invention. The substrate cleaning apparatus 10 provided in the substrate processing apparatus 1 includes a brush cleaning chamber 2 that performs chemical treatment on the substrate B to be processed, and a rinse chamber 3 that rinses the substrate B that has passed through the brush cleaning chamber 2. And an air knife chamber 4. Moreover, it is preferable that the board | substrate B is conveyed with the attitude | position inclined from the horizontal direction orthogonal to the conveyance direction of the board | substrate B. FIG. By transporting the substrate B in this posture, the liquid supplied to the substrate B in the brush cleaning chamber 2 and the rinsing chamber 3 can be easily dropped downward, and the liquid breakage from the surface of the substrate B is improved. ing.

For example, the brush cleaning chamber 2 is in contact with the transport roller 21 that receives and transports the substrate B that has been processed in the previous process such as the etching process and the peeling process, and the upper surface of the substrate B that is transported by the transport roller 21. The brush part 221 to be cleaned, the brush part 222 to be in contact with the lower surface of the substrate B, and the upper surface of the substrate B can be applied with a processing liquid such as pure water (various processing liquids used for substrate cleaning can be applied. A pure water is an example), and a processing liquid supply nozzle (liquid supply unit) 231 for supplying the processing liquid and a processing liquid supply nozzle 232 for supplying the processing liquid to the lower surface of the substrate B are provided. A plurality of these brush portions 221 and 222 and a plurality of treatment liquid supply nozzles 231 and 232 are provided. Further, the treatment liquid supply nozzles 231 and 232 are disposed upstream of the brush portions 221 and 222 in the substrate transport direction in order to prevent damage to the surface due to the brushes 221 and 222 slidingly contacting the surface of the dry substrate B. It is also disposed at a position on the side (before sliding contact of the substrate B by the brush portions 221 and 222), and the treatment liquid discharge direction is directed to the downstream side in the substrate transport direction. The processing liquid supply nozzles 231 and 232 are connected to a processing liquid supply source (not shown).

  The rinsing chamber 3 performs a rinsing process on the substrate B that has been processed in the brush cleaning chamber 2. The rinse chamber 3 includes a transport roller 31 that receives and transports the substrate B from the brush cleaning chamber 2, a rinse liquid supply nozzle 32 that supplies pure water or the like as a rinse liquid to the upper surface of the substrate B, and a rinse liquid on the lower surface of the substrate B A rinsing liquid supply nozzle 33 for supplying

The air knife chamber 4 receives and transports the substrate B transported from the rinse chamber 3, and blows air onto the upper surface of the substrate B transported by the transport roller 41 to dry the upper surface of the substrate B. It has an air knife 421 and an air knife 422 that blows air against the lower surface of the substrate B to dry it.

  FIG. 2 is a configuration diagram simply showing the brush unit 221 provided in the brush cleaning chamber 2 of the substrate cleaning apparatus 10 and its driving mechanism. The brush unit 222 has the same configuration as the brush unit 221. The brush unit 221 of the brush cleaning chamber 2 includes a brush bristle bundle 50 for cleaning the surface of the substrate B, and a flat brush base 51 on which the brush bristle bundle 50 is erected (planted). The brush portion 221 including the brush bristle bundle 50 and the brush base portion 51 has a shape extending in a long shape in a direction perpendicular to or in the direction perpendicular to the conveyance direction of the substrate B and parallel to the upper surface of the substrate B. ing. Further, the brush portion 221 is inclined such that the tip 50H side of the bristle bundle 50 is directed downstream in the conveyance direction of the substrate B from a posture orthogonal to the surface of the substrate B. (Details will be described later).

  A support member 60 that supports the brush portion 221 in a suspended manner is attached to the upper surface portion 111 side of the brush base portion 51, and the brush portion 221 is attached to a brush attachment base 61 made of a rigid member by the support member 60. . A swinging mechanism 8 is attached to the brush mounting base 61, and the brush mounting base 61 is placed on the upper surface of the substrate B perpendicular to the transport direction of the substrate B by the driving force in the horizontal lateral direction given from the swinging mechanism 8. The tip 50H of the bristle bundle 50 of the brush part 221 attached to the brush attachment base 61 is parallel to the upper surface of the substrate B by swinging in a parallel direction (for example, the horizontal direction in FIG. 2). Is swung. The mechanism of the swing mechanism 8 will be described later. The support member 60 is provided so as to be movable with respect to the brush mounting base 61 so that the distance G shown in FIG. The support member 60, the brush mounting base 61, and the swing mechanism 8 are examples of sliding contact means (the configuration of the sliding contact means is not intended to be limited to this).

  The operation of the substrate cleaning apparatus 10 configured as described above will be described. First, the height position of the brush base 51 is set. This height position is determined by considering the diameter and material of each bristles constituting the bristles 50, the angle (inclination) of the bristles 50 with respect to the upper surface of the substrate B, the particle size of the particles to be cleaned, and the like. It is determined from the viewpoint of how much pressure and how much contact area the tip 50H of the brush bristle bundle 50 is brought into contact with the upper surface of the substrate B to be processed.

  The operation of finely adjusting the position of the tip 50H of the brush bristle bundle 50 with respect to the upper surface of the substrate B is also possible by adjusting the position of the support member 60 with respect to the brush mounting base 61. For example, when the brush base 51 has a long shape corresponding to a large substrate, the substantially central portion in the longitudinal direction of the brush base 51 is easily bent downward. In such a case, by adjusting the position of the support member 60 near the bent portion with respect to the brush mounting base 61 and lifting the bent portion upward, the substrate B of the tip 50H of the brush bristle bundle 50 is lifted. The positional relationship with respect to the upper surface can be made uniform in the longitudinal direction of the brush portion 222.

Thus, the cleaning process of the substrate B is performed after the positional relationship of the tip 50H of the bristle bundle 50 with respect to the upper surface of the substrate B is adjusted. During this cleaning process, while ejecting the processing liquid supply nozzle 231 or treated liquid toward the substrate B, and the brush mounting base 61 is swung by the swing mechanism 8. As a result, the tip 50H of the bristle bundle 50 is tilted with respect to the substrate B as described above on the surface of the substrate B being conveyed, and swings and contacts in the presence of the processing liquid. The brush hair bundle 50 acts on the substrate B to remove particles and the like.

  Next, a specific aspect of the swing mechanism 8 will be described. FIG. 3 shows a swinging motion that causes the brush mounting base 61 (brush tip 50H) to reciprocate linearly in a direction (indicated by arrow c in the figure) perpendicular to the direction of travel of the substrate B (indicated by arrow b in the figure). 3 is a plan view showing an outline of a moving mechanism 8. FIG.

  The crank mechanism 80 is driven by an electric motor (drive source) 82, and a shaft support pin 812 is provided in the vicinity of the outer peripheral portion of a rotary disk 811 coupled to the rotary shaft 821 of the drive source 82. A connecting hole provided on one end side of the drive shaft 813 is loosely fitted to the shaft support pin 812. A connecting hole provided on the other end side of the drive shaft 813 and a shaft support portion 611 protruding from the side end edge of the brush mounting base 61 are rotatably connected by a connecting pin 612.

  On the other hand, the brush mounting base 61 is supported by a linear guide 613 so as to be capable of linear reciprocation in the direction of arrow c in the figure. Instead of the linear guide 613, a linear bush or the like may be used.

  In such a configuration, when the driving source 82 is driven, the rotating disk 811 coupled to the rotating shaft 821 of the driving source 82 is rotated, and the shaft support pin 812 projecting from the rotating disk 811 is rotated. The drive shaft 813 to which one end side is connected performs a crank operation in the horizontal direction of the drawing. By this crank operation, the brush mounting base 61 connected to the drive shaft 813 by the connecting pin 612 reciprocates in the direction of arrow c in the figure while being guided by the linear guide 613. That is, the brush portion 221 has the tip 50H of the bristle bundle 50 in contact with the upper surface of the substrate B in a posture inclined by an angle θ1 from a posture orthogonal to the substrate B, and reciprocates in the direction of arrow c in the figure. Thus, the dirt on the surface of the substrate B is scraped off and cleaned. Instead of such a linear reciprocating mechanism using the crank mechanism 80 and the drive source 82, a linear reciprocating mechanism using an air cylinder or the like may be adopted.

Next, the structure of the brush part 221 will be described. 4 is a side sectional view of the brush portion 221 shown in FIG. As described above, the brush part 221 includes the brush bristle bundle 50 for cleaning the surface of the substrate B and the flat brush base part 51 on which the brush bristle bundle 50 is erected (planted). The brush bristle bundle 50 has a large number of bristles in which a shaft 52 is sandwiched at a substantially central portion in the length direction, and a brush base 51 is covered from above the brush bristle bundle 50 portion sandwiching the shaft 52. . The brush base 51 has a substantially “U” shape in cross section when viewed from the side, and has a tapered shape when viewed from the side toward the lower opening. The brush base portion 51 of such a shape, brush tufts 50 parts sandwiching the shaft 52 is housed inside the brush base 51, there is a state where the brush base 51, or crimped.

  Each of the bristles constituting the bristle bundle 50 is made of, for example, nylon, Teflon (registered trademark), or vinyl chloride (PVC), and has a diameter of 0.05 to 0.2 (mm). The brush bristle bundle 50 is a portion exposed from the brush base 51, and the length L of the longest leg is 10 ≦ L ≦ 40 (mm).

  Further, the width dimension W in the substrate transport direction of the brush base 51 is preferably as small as possible so long as the bristle bundle 50 can be erected (planted), and specifically, it is preferably 10 mm or less. The length direction dimension of the brush base 51 is sequentially set according to the dimension in the direction orthogonal to the transport direction of the substrate to be processed.

  FIG. 5 is a side view showing the arrangement of the brush portions 221 and 222 and the treatment liquid supply nozzles 231 and 232 with respect to the substrate B. The brush portions 221 and 222 are disposed above or below the substrate B, respectively.

The brush portions 221 and 222 are tilted by a predetermined angle θ1 from a posture orthogonal to the upper surface or the lower surface of the substrate B with the tip 50H side of the brush bristle bundle 50 facing downstream in the transport direction of the substrate B. It is said that. This angle θ1 is 5 to 20 ° (more preferably 15 °). By arranging the brush portions 221 and 222 in such a manner as to be inclined with respect to each surface of the substrate B, the gap adjustment between the tip 50H of the brush bristle bundle 50 of the brush portions 221 and 222 and each surface of the substrate B is adjusted. Accuracy is not required, and there is a gap between the tip 50H of the bristle bundle 50 and each surface of the substrate B without setting the inclination angle θ1 of the brush portions 221 and 222 with high accuracy. There is very little possibility of causing a problem that each surface of the substrate B is unnecessarily pressed by the tip 50H.

The processing liquid supply nozzles 231 and 232 are, for example, (1) a high-pressure nozzle that mainly discharges pure water at a high pressure, and (2) liquid-like liquid and gas are supplied by spraying the liquid to the substrate by pressure. A two-fluid nozzle that ejects two fluids, and (3) an ultrasonic nozzle that discharges pure water to which ultrasonic vibration is applied. The processing liquid supply nozzles 231 and 232 are disposed above or below the substrate B on the downstream side of the brush portions 221 and 222 in the substrate transport direction. In the treatment liquid supply nozzles 231 and 232, the treatment liquid from the treatment liquid supply nozzles 231 and 232 is such that the tip 50 </ b> H of the brush bristle bundle 50, the upper or lower surface of the substrate B, and the tip 50 </ b> H of the brush bristle bundle 50 and the substrate B The arrangement position and the arrangement angle are set so as to be sprayed (supplied) to the contact portion of the upper surface or the lower surface. Thereby, both the cleaning of each surface of the substrate B and the cleaning of the tip 50H of the brush bristle bundle 50 can be performed.

  FIG. 6 is a side view showing the arrangement of the brush portions 221 and 222 and the treatment liquid supply nozzles 231 and 232 with respect to the substrate B, and shows a state where the substrate B is not present. As shown in FIG. 6, the brush portion 221 and the brush portion 222 are disposed at positions where the tips 50H of the brush bristle bundle 50 come into contact with each other when there is no substrate B therebetween. preferable. The brush unit 221 and the brush unit 222 are arranged in this manner, and the swing mechanism 8 is driven in a state where the substrate B does not exist in the substrate transport path between the brush unit 221 and the brush unit 222 to drive the brush unit 221 and the brush unit. If the 222 is reciprocated (vibrated) in the direction c of FIG. 3, the tips 50H of the bristle bundle 50 of the brush part 221 and the brush part 222 can be rubbed together, and the brushes of the brush part 221 and the brush part 222 can be rubbed together. The tip 50H of the hair bundle 50 can be cleaned.

FIG. 7 is a side view showing a state in which a plurality of brush portions 221 and 222 and a plurality of treatment liquid supply nozzles 231 and 232 are arranged. A plurality of brush portions 221 and 222 and processing liquid supply nozzles 231 and 232 are provided in the brush cleaning chamber 2, and the brush portions 221 and the processing liquid supply nozzles 231 are alternately arranged in the transport direction of the substrate B. Similarly, The brush portions 222 and the treatment liquid supply nozzles 232 are also alternately arranged in the transport direction of the substrate B. According to this structure, the scraping dirt from the substrate B surfaces with a brush portion 221 and 222, without providing the relatively time difference and stain removal by washing liquid supplied from the treatment liquid supply nozzle 231, 232 Therefore, the cleaning power for each surface of the substrate B can be increased.

Another embodiment of the present invention will be described. For example, in the above embodiment, the structure of the brush portion 222 is such that the lower surface portion of the tip 50H of the bristle bundle 50 has a shape parallel to the horizontal plane as shown in FIG. As shown in FIG. 8, it is good also as a shape which has inclination-angle ( theta) 2 (end surface angle of this invention ) of 5-20 degrees (more preferably 15 degrees) with respect to a horizontal surface . Accordingly, the lower surface portion of the tip 50H of the bristle bundle 50 is made to follow the upper surface or the lower surface of the substrate B. In this case, the brush bristle bundle 50 is a portion exposed from the brush base 51, and the length L of the longest leg is 10 ≦ L ≦ 40 (mm).

FIG. 9 is a side view showing the arrangement of the brush portions 221 and 222 and the treatment liquid supply nozzles 231 and 232 that are formed of the brush bristle bundle 50 having the inclination angle θ2. Even when the brush portions 221 and 222 including the bristle bundle 50 having the inclination angle θ2 (the brush angle of the present invention) are disposed, the brush portions 221 and 222 are arranged so that the tip 50H side of the brush bristle bundle 50 faces the substrate B. The posture is inclined by a predetermined angle θ3 from the posture orthogonal to the upper surface or the lower surface of the substrate B toward the downstream side in the transport direction. The relationship between the angles θ2 and θ3 is θ2 <θ3 ( For example, 15 ° <20 °). By arranging the brush portions 221 and 222 in such a posture inclined with respect to each surface of the substrate B, almost the entire surface of the surface where the tip 50H of the brush bristle bundle 50 faces the upper surface or the lower surface of the substrate B, It can be brought into contact with the upper surface or the lower surface of the substrate B.

Furthermore, when supplying the treatment liquid toward the bent portion ( curved portion ) of the tip 50H of the hair bundle 50 of the brush portions 221, 222, the tip of the hair bundle where the inclined surface having the inclination angle θ2 is not formed. Compared with the portion, the hair bundle 50 having the inclined surface has a fan-like shape when it abuts against the main surface of the substrate B, so that the thickness of the tip 50H becomes thin (presentation of hair). Therefore, the treatment liquid easily penetrates between the hair bundle 50 and the main surface of the substrate B, and the treatment efficiency by the treatment liquid is improved.

  Even if the setting of the inclination angle θ3 of the brush portions 221 and 222 and the adjustment for making the angle θ3 and the angle θ2 substantially equal to each other are not performed with high accuracy, the brush portions 221 and 222 are inclined to each of the substrates B. Since the surfaces are in contact with each other, a gap is generated between the tip 50H of the bristle bundle 50 and each surface of the substrate B, and each surface of the substrate B is unnecessarily pressed by the tip 50H. There is very little possibility.

The present invention is not limited to the configuration of the above embodiment, and various modifications can be made. For example. In the said embodiment, although the brush parts 221 and 222 are provided in the position facing both the main surfaces of the board | substrate B, you may provide in any one main surface side. Further, the brush portions 221 and 222 are arranged in such a posture that the tip 50H is inclined with respect to the main surface of the substrate B toward the conveyance direction side of the substrate B, but the tip 50H of the brush bristle bundle 50 is arranged. If the brush portions 221 and 222 are in contact with the main surface of the substrate B in a state of being bent along the main surface of the substrate B, the brush portions 221 and 222 are positioned substantially perpendicular to the main surface of the substrate B or in the opposite direction. It is also possible to dispose in a posture other than the above-mentioned tilted posture, such as a tilted tilted posture.

  Moreover, in the said embodiment, although the case where the brush parts 221 and 222 were applied to the brush cleaning chamber 2 was demonstrated as an example, application of this brush part 221 and 222 is not limited to the brush cleaning chamber 2. The present invention can also be applied to a case where a process is performed with a brush in a processing chamber that performs other processes such as a peeling process and a developing process.

  In the above-described embodiment, the configuration in which the treatment liquid is supplied to the brush portions 221 and 222 by the treatment liquid supply nozzles 231 and 232 in the brush cleaning chamber 2 is shown. You may provide the mechanism supplied toward the board | substrate B from the base of the brush parts 221,222.

  In the above embodiment, the brush cleaning chamber 2 has been described as being connected to the processing chamber for the previous process. However, the brush cleaning chamber 2 to which the brush portions 221 and 222 are applied is limited to the above. And can be widely applied. For example, it may be applied to a substrate cleaning mechanism or the like that is disposed as a single cleaning device and that cleans a substrate that has been processed by another single device for pre-process (such as an etching device).

  In the above-described embodiment, the brush portions 221 and 222 are swung in a predetermined direction by the swing mechanism 8. However, the present invention can be configured without providing the swing mechanism 8. .

It is a figure which shows the outline of the substrate cleaning apparatus with which the substrate processing apparatus which concerns on one Embodiment of this invention is equipped. It is a block diagram which shows simply the brush part with which the chemical | medical solution process chamber of a board | substrate cleaning apparatus is equipped, and its drive mechanism. It is a top view which shows the outline of the rocking | fluctuation mechanism which reciprocates a brush attachment base. It is a sectional side view of a brush part. It is a side view which shows arrangement | positioning of the brush part with respect to a board | substrate, and a process liquid supply nozzle. It is a side view which shows arrangement | positioning of the brush part and process liquid supply nozzle with respect to a board | substrate, Comprising: The state without a board | substrate is shown. It is a side view which shows the state by which multiple brush parts and process liquid supply nozzles are each arrange | positioned. It is a sectional side view which shows other embodiment of a brush part. It is a side view which shows arrangement | positioning of the brush part and process liquid supply nozzle which concern on other embodiment.

1 the substrate processing apparatus 2 chemical processing chamber 3 a rinse chamber 4 air knife chambers 8 rocker structure
1 0 Substrate cleaning device 21, 31 Conveying roller 32, 33 Rinse liquid supply nozzle 50 Brush hair bundle 50H Tip 51 Brush base 52 Winding shaft 221, 222 Brush part 231, 232 Processing liquid supply nozzle B Substrate

Claims (8)

A transport means for transporting the substrate, a brush extending in a direction intersecting the substrate feeding direction by the transport means and parallel to the main surface of the substrate being transported, and a substrate being transported by supporting the brush A substrate processing apparatus having sliding contact means for sliding contact ,
The brush has a hair bundle formed by bundling a plurality of hairs on one end side, and the hair bundle is a hair leg located on the downstream side of the upstream side in the substrate transport direction. Is formed so that the tip surface of the hair bundle becomes a plane inclined with respect to the axial direction of the hair,
The sliding contact means slidably contacts the main surface in a state where the tip of the hair is bent along the main surface of the substrate from the upstream side to the downstream side in the substrate transport direction as the substrate is transported. A substrate processing apparatus that supports the brush . The sliding contact means, so that the tip portion of the bristle bundle is located on the downstream side in the substrate conveying direction than the proximal portion, claim 1 you, characterized in that the support in a state of being inclined to the brush 2. The substrate processing apparatus according to 1. When the inclination angle of the front end surface of the hair bundle with respect to the surface orthogonal to the axial direction of the hair is an end surface angle, the inclination angle of the hair bundle with respect to the direction orthogonal to the main surface of the substrate is a brush angle.
The sliding contact means, the brush angle substrate processing apparatus according to claim 2 you, characterized in that for supporting the brush in a larger state than the end face angle. The sliding contact means, the substrate processing apparatus according to any one of claims 1 to 3, characterized in that sliding contact the brush on the main surface of the substrate while reciprocating along the longitudinal direction thereof. The substrate processing apparatus according to any one of claims 1 to 4, wherein a plurality of the brush along the substrate transfer direction are arranged in parallel. The substrate processing apparatus according to any one of claims 1 to 5, characterized in that it is arranged a plurality of the brush on the main surface side of both the substrate conveyed by the conveying means. The slidable contact means slidably contacts the main surface of the substrate while reciprocating the brush along its longitudinal direction;
A plurality of the brushes are arranged opposite to each other on both main surface sides of the substrate conveyed by the conveying means,
The sliding contact means supports the brushes so that the tip portions of the brushes arranged to face each other in a non-carrying state of the substrate, and is arranged to face each other during the non-carrying of the substrate. the substrate processing apparatus according to claim 6 you characterized thereby mutually sliding contact with the tip portion of the brush by the respective brush to the reciprocating movement. The processing liquid supply means for supplying a processing liquid toward the tip of the bristle bundle of the brush that is in a state of being slidably contacted with the main surface of the substrate. Substrate processing equipment.

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