JP4393941B2 - Substrate processing equipment - Google Patents

Description

The present invention relates to a semiconductor wafer, a liquid crystal display device glass substrate and PDP (plasma display panel) for the surface of the substrate such as a glass substrate, relates to a substrate processing apparatus for performing a process such as for element formation.

  2. Description of the Related Art Conventionally, as shown in, for example, Patent Document 1 below, a substrate processing apparatus that is a device that performs a series of processes for element formation on a surface of a substrate has a process of ejecting (discharging) a processing liquid onto the substrate. There is something. 6 and 7 are side views showing the outline of a configuration of a unit (for example, an etching unit) that performs a process of spraying a processing liquid onto a substrate and a processing liquid spraying operation, which are a part of a conventional substrate processing apparatus. The processing liquid is sprayed onto the substrate W from the shower nozzle 12 connected to the shower pipe 11 (shown in the drawing is a cross section of the pipe) to etch the substrate W. Each shower pipe 11 is reciprocally rotated about the longitudinal direction thereof by a link mechanism 42 or the like according to the rotation of a motor (not shown) to swing the shower nozzle 12.

FIG. 6 shows the direction of the shower nozzle 12 and the treatment liquid injection at one end (start position) of the swing of the shower nozzle 12 in the etching unit 1. FIG. 7 shows the direction of the shower nozzle 12 and the treatment liquid injection at the other end of the swing of the shower nozzle 12. The treatment liquid is ejected while the shower nozzle 12 is swung between the above two directions. Further, in order to prevent the processing liquid from flowing in one direction (from higher to lower) on the substrate W and causing uneven etching, the substrate W is swung (jet shower 12) of the processing liquid jet. It is placed in an inclined direction (so that the processing liquid strikes at a right angle at a position on the higher side of the substrate). The shower nozzle 12 is fixed to the shower pipe 11 so as to form a right angle with the rotation axis (longitudinal direction) of the shower pipe 11.
JP 2000-188272 A

  However, in the case of the above prior art, the difference in the distance between the discharge port and the substrate in the central direction of the discharge changes greatly between the swing angles. When the difference in the distance to the substrate becomes longer, the difference in the striking force of the processing liquid due to the discharge becomes larger, for example, a difference occurs in the adhesion force of the processing liquid and so on.

The present invention has been made in view of the above problems, and an object thereof is to provide a substrate processing apparatus having a liquid ejection mechanism has small difference in discharge distance of the treatment liquid by the position on the substrate.

According to a first aspect of the present invention, there is provided a substrate processing apparatus comprising: a support unit configured to support the substrate while being inclined with respect to a horizontal plane; and a liquid discharge mechanism for discharging a processing liquid onto the substrate. And the line indicating the central direction of the discharge of the processing liquid is perpendicular to a line parallel to the rotation axis of the oscillation shaft and does not intersect the rotation axis of the oscillation shaft. A discharge port that is directly or indirectly attached to the shaft and discharges the processing liquid, and a rotational position where the line indicating the central direction of the processing liquid discharge is substantially perpendicular to the substrate. And a control means for performing control between the rotation position and a rotation position rotated by a predetermined angle in a rotation direction in which a distance between the discharge port and the substrate is once shortened. wherein the between the upper side and the lower side of the tilt of the substrate supported by the supporting means ejection There the liquid discharge mechanism is provided so as to swing.

According to this configuration, the line indicating the central direction of the treatment liquid discharge is orthogonal to the line parallel to the rotation axis of the swing shaft and does not intersect with the rotation axis of the swing shaft. In the discharge start state in which the line indicating the central direction of the substrate is substantially perpendicular to the substrate, the distance between the discharge port and the substrate in the central direction of the processing liquid discharge is not the shortest, that is, in the middle of swinging Since the state where the distance between the discharge port and the substrate is shortest is reached, the difference between the shortest and longest discharge distance is reduced, and the difference in the striking force of the processing liquid depending on the position of the substrate surface can be further reduced.

According to a second aspect of the present invention, there is provided a substrate processing apparatus comprising: a support unit configured to support the substrate while being inclined with respect to a horizontal plane; and a liquid discharge mechanism for discharging a processing liquid onto the substrate. And the distance from the discharge port to the substrate in the direction perpendicular to the substrate when the distance becomes the shortest by the rotation of the swing shaft, and the center direction of the discharge of the processing liquid When the line and the substrate are perpendicular to each other, they are directly or indirectly attached to the swing shaft so as not to be the same, and the discharge port for discharging the processing liquid and the swing swing of the swing shaft. The rotation position in which the line indicating the central direction of the processing liquid discharge is substantially perpendicular to the substrate, and the rotation direction from which the distance between the discharge port and the substrate is once shortened are determined in advance. Control to be performed between the rotation position rotated by a specified angle And control means, said liquid discharge mechanism is provided so that the discharge is swung between the upper side and the lower side of the tilt of the substrate supported by the supporting means.

  According to this configuration, since the state where the distance between the discharge port and the substrate is shortest during the swinging, the difference between the shortest and longest discharge distance is reduced, and the striking force of the processing liquid depending on the position of the substrate surface is reduced. The disparity can be further reduced.

In any of the substrate processing apparatuses, the discharge of the processing liquid from the liquid discharge mechanism is directed substantially perpendicular to the substrate on the upper side of the substrate tilt and toward the lower side of the substrate on the lower side of the substrate. In addition, since it is swung between the upper side and the lower side, the processing liquid easily flows in one direction from the upper side to the lower side.

  A liquid discharge mechanism according to a third aspect is the liquid discharge mechanism according to the first or second aspect, wherein the discharge port is attached to the swing shaft via a swing arm. According to this configuration, even when it is desired to provide the discharge port at a position away from the swing shaft, the discharge port can be easily connected to the swing shaft.

According to the first or second aspect of the invention, since the state where the distance between the discharge port and the substrate is shortest during the swinging is reached, the difference between the shortest and longest discharge distance is reduced, and the position of the substrate surface is reduced. The disparity in the striking power of the treatment liquid due to can be further reduced. Thereby, product defects can be reduced. Further, the above-described effect can be obtained only by exchanging the tip of the swing shaft without changing the conventional swing mechanism. The upper and lower sides of the processing liquid are discharged from the liquid discharging mechanism so that the processing liquid is discharged at a substantially right angle with respect to the substrate on the upper side of the inclination of the substrate and on the lower side of the substrate on the lower side of the substrate. Therefore, the processing liquid easily flows in one direction from the upper side to the lower side. Thereby, it is possible to prevent the processing liquid from being fixed (for example, etching unevenness) to the substrate, and to reduce product defects.

  According to the third aspect of the present invention, even when it is desired to provide the discharge port at a position away from the swing shaft, the discharge port can be easily connected to the swing shaft.

  Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an outline of the configuration of an etching unit 1 of a substrate processing apparatus. The substrate processing apparatus is an apparatus that performs a series of processes for forming elements on the surface of the substrate. The etching unit 1 injects a processing liquid (etching liquid) onto the substrate as one process performed by the substrate processing apparatus. Etching is performed. The processing liquid is sprayed from the shower nozzle 12 of the shower pipe 11 to the substrate W that has been carried in from the substrate carry-in port 13a, thereby etching the substrate W. Each shower pipe 11 is reciprocally rotated about the longitudinal direction by the link mechanism 42 or the like according to the rotation of the motor 41, and the shower nozzle 12 is swung.

  2 and 3 are side views schematically showing a cross section along the XY plane of the etching unit 1. FIG. 2 shows that the shower nozzle 12 and the treatment liquid ejection direction at one end (start position) of the swing of the shower nozzle 12 in the etching unit 1 (hereinafter, the direction of the shower nozzle 12 and the treatment liquid ejection direction are the same. ). In this case, the treatment liquid ejection direction is substantially perpendicular to the substrate W. FIG. 3 shows the direction of the shower nozzle 12 and the treatment liquid injection at the other end of the swing of the shower nozzle 12. The other end has a swing angle at which the spray distance of the processing liquid (distance between the shower nozzle 12 and the substrate W in the processing liquid spray direction) is shortest and a swing angle at which the processing liquid spray direction is parallel to the substrate. (It does not include both ends). The jet of the processing liquid is swung between one end and the other end of the swing.

  As shown in FIGS. 2 and 3, the substrate W is moved by the substrate support unit 15 in the swinging direction (from the swinging start position of the shower nozzle 12) toward the other end of the processing liquid injection (shower nozzle 12) (on the higher side of the substrate). It is placed tilted (so that the treatment liquid strikes it at a right angle). The processing liquid is ejected onto the substrate W in combination with the processing liquid ejection direction (substantially at right angles on the high side of the substrate and toward the low side on the low side) accompanying the swing of the shower nozzle 12 and the inclination of the substrate. In one direction (from higher to lower), for example, etching unevenness can be prevented.

  The shower nozzle 12 is attached to the shower pipe 11 via an arm 13. The arm 13 is fixed to the rotation axis (longitudinal direction) of the shower pipe 11 so as to form a right angle and is attached to the shower pipe 11. Further, the shower nozzle 12 has an arm in an oscillating direction (from the oscillating start position toward the other end) at the end of the arm 13 (on the side opposite to the end connected to the shower pipe 11). The fixed connection is made at 13 and a predetermined angle θ of less than 180 degrees (preferably 90 degrees or more). However, the shower nozzle 12 is positioned so that the spray direction (indicating line) of the processing liquid is on a plane perpendicular to the rotation axis of the shower pipe 11. That is, the shower nozzle 12 is attached to the arm 13 so that the line indicating the spray direction of the processing liquid is orthogonal to the line parallel to the rotation axis of the shower pipe 11 and does not intersect the rotation axis of the shower pipe 11. . The processing liquid is sprayed from the shower nozzle 21 so as to gradually spread in a conical shape. The center line of this cone (a line perpendicular to the bottom of the cone and passing through the apex of the cone) is taken as a line indicating the center direction of discharge.

FIG. 4 is a diagram schematically showing the change in the discharge distance when the shower nozzle 12 is swung (in the XY cross section). In this figure, the tube thickness of the shower pipe 11 and the arm 13 and the length of the shower nozzle 12 are set to zero. A line 13 ′ indicates the position of the arm 13 at the swing start position (one end of the swing), and a line 14 ′ indicates the treatment liquid ejection direction at this time. A line 13 ″ indicates the position of the arm 13 at the other end of the swing, and a line 14 ″ indicates the treatment liquid ejection direction at this time. For example, the angle θ between the treatment liquid ejection direction and the arm 13 is 90 degrees, the arm length (the length of the line 13 ′ and the line 13 ″) is N / 3 (arbitrary unit), and the swing start position When the distance between the shower nozzle 12 and the substrate W (the length of the line 14 ') is N (arbitrary unit) and the swing angle γ is 45 degrees, the shower nozzle 12 and the substrate at the other end of the swing The distance from W (the length of the line 14 ″) is about 1.08 N (arbitrary unit). The distance between the shower nozzle 12 and the substrate W when the swing angle γ during the swing is 30 degrees is about 0.96 N (arbitrary unit), which is shorter than N.

  On the other hand, a similar calculation for the above-described conventional example is shown below. FIG. 8 is a diagram schematically showing the change in the discharge distance when the shower nozzle 12 is swung (in the XY sectional view). Also in this figure, the thickness of the shower pipe 11 and the length of the shower nozzle 12 are set to zero. A line 114 ′ indicates the processing liquid ejection direction at the oscillation start position (one end of the oscillation), and a line 114 ″ indicates the processing liquid ejection direction at the other end of the oscillation. For example, when the distance (the length of the line 114 ′) between the shower nozzle 12 and the substrate W at the swing start position is N (arbitrary unit) and the swing angle γ is 45 degrees, the swing end position is The distance between the shower nozzle 12 and the substrate W (the length of the line 114 ″) is about 1.41 N (arbitrary unit). The difference in discharge distance is larger in the conventional example.

  As described above, according to the present embodiment, the change in the distance from the shower nozzle 12 to the substrate W in the swing of the shower nozzle 12 is smaller than that in the conventional technique, and thus is caused by the distance from the shower nozzle 12 to the substrate W. Thus, the change in the striking force of the processing liquid is reduced, and the processing liquid can be sprayed more uniformly over the entire substrate W surface.

  In addition, this invention is not limited to the thing of the said embodiment, The aspect described below can be employ | adopted. In the present embodiment, the discharge distance is obtained when the angle θ between the arm 13 and the processing liquid ejection direction is 90 degrees (for the sake of simplicity of calculation). The angle θ between them is not necessarily 90 degrees, and may be less than 180 degrees (preferably 90 degrees or more). FIG. 5A shows an example in which the angle θ between the arm 13 and the treatment liquid ejection direction is not 90 degrees. In the example shown in FIG. 5A, the angle θ formed by the arm 13a connected to the shower pipe 11a and the shower nozzle 12a (treatment liquid injection direction) is larger than 90 degrees. Also in this case, the discharge distance is shortest in the middle of the swing angle of the shower nozzle 12a (other than both ends) (in the case of the conventional example, the discharge distance is shortest at one end of the swing angle). As a result, the change in the discharge distance is smaller than in the conventional example. The angle θ and the length of the arm 13a are not particularly limited, but it is desirable to determine so that the change in the distance from the shower nozzle 12a to the substrate W becomes smaller.

  As shown in FIG. 5B, the arm 13 may not be provided, and the shower nozzle 12b may be directly connected to the shower pipe 11b. In this case, in order to increase the distance from the shower pipe 11b to the shower nozzle 12b, for example, the diameter of the shower pipe 11b may be increased. When the shower nozzle 12b is directly connected to the shower pipe 11b, the positional relationship between the swing axis of the shower pipe 11b and the shower nozzle 12b is such that the shower pipe 11 and the shower nozzle 12 are Since the shower nozzle 12b is directly connected to the shower pipe 11b, the shower nozzle 12 is connected to the shower pipe 11 via the arm 13 because the shower nozzle 12b is directly connected to the shower pipe 11b. It is clear that the same effect is obtained as in the case of

In the present embodiment, the processing liquid is conveyed to the shower nozzle 12 through the shower pipe 11 and the arm 13, but the processing liquid sprayed from the shower nozzle 12 is not necessarily in the shower pipe 11 and the arm 13. It does not have to be carried to the shower nozzle 12 through. In the present embodiment, the shower nozzle 12 is connected to the end of the arm 13, but the shower nozzle 12 does not necessarily have to be connected to the end of the arm 13.

It is a perspective view which shows the structure of the etching unit in one Embodiment of this invention. It is sectional drawing of the etching unit in one Embodiment of this invention. It is sectional drawing of the etching unit in one Embodiment of this invention. It is a figure which shows the outline of the liquid discharge mechanism in one Embodiment of this invention. It is a figure which shows the modification of the liquid discharge mechanism of this invention. It is sectional drawing of the etching unit in a prior art. It is sectional drawing of the etching unit in a prior art. It is a figure which shows the outline of the liquid discharge mechanism in a prior art.

1 Etching unit (substrate processing equipment)
11 Shower pipe (oscillating shaft)
12 Shower nozzle 12 (discharge port)
13 Arm (swing arm)
15 Substrate support (support means)
2 Liquid discharge mechanism 41 Motor (control means)
42 Link mechanism (control means)
W substrate

Claims (3)

A support means for supporting the substrate by tilting with respect to a horizontal plane;
A liquid discharge mechanism for discharging a processing liquid onto the substrate;
This liquid discharge mechanism
A pivoting pivot shaft;
A line indicating the central direction of the discharge of the processing liquid is perpendicular to the line parallel to the rotation axis of the rocking shaft and directly or indirectly to the rocking shaft at a position not intersecting with the rotation axis of the rocking shaft. And a discharge port for discharging the processing liquid,
The pivoting of the swinging shaft is performed by rotating a position where a line indicating the center direction of the processing liquid discharge is substantially perpendicular to the substrate, and a distance between the discharge port and the substrate from the rotating position. Control means for performing control between a rotational position rotated by a predetermined angle in the rotational direction once shortened , and
A substrate processing apparatus comprising the liquid discharge mechanism so that the discharge is swung between an upper side and a lower side of an inclination of a substrate supported by the support means. A support means for supporting the substrate by tilting with respect to a horizontal plane;
A liquid discharge mechanism for discharging a processing liquid onto the substrate;
This liquid discharge mechanism
A pivoting pivot shaft;
When the distance from the discharge port to the substrate in a direction perpendicular to the substrate is the shortest due to the rotation of the swing shaft, a line indicating the center direction of discharge of the processing liquid and the substrate A discharge port that is directly or indirectly attached to the swing shaft so as not to be the same when it becomes vertical, and discharges the processing liquid;
The pivoting of the swinging shaft is performed by rotating a position where a line indicating the center direction of the processing liquid discharge is substantially perpendicular to the substrate, and a distance between the discharge port and the substrate from the rotating position. Control means for performing control between a rotational position rotated by a predetermined angle in the rotational direction once shortened , and
A substrate processing apparatus comprising the liquid discharge mechanism so that the discharge is swung between an upper side and a lower side of an inclination of a substrate supported by the support means. The substrate processing apparatus according to claim 1, wherein the discharge port is attached to the swing shaft via a swing arm.

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