JP4398262B2 - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP4398262B2 JP4398262B2 JP2004002670A JP2004002670A JP4398262B2 JP 4398262 B2 JP4398262 B2 JP 4398262B2 JP 2004002670 A JP2004002670 A JP 2004002670A JP 2004002670 A JP2004002670 A JP 2004002670A JP 4398262 B2 JP4398262 B2 JP 4398262B2
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70925—Cleaning, i.e. actively freeing apparatus from pollutants, e.g. using plasma cleaning
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
- G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
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- Epidemiology (AREA)
- Health & Medical Sciences (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Weting (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Description
以上のような作用により、チャンバの内部雰囲気と外部雰囲気とを常時、確実に隔絶することができる。
図1は、この発明の実施形態の1例を示し、基板処理装置の概略構成を模式的に示す図である。なお、図1においては(図3においても)、エアー、窒素ガス等の気体供給機構や気体排出機構についての図示を省略している。
10、32、80、106,106a、106b、110 チャンバ
12、34、82 チャンバの基板搬入口
14、36、84 チャンバの基板搬出口
16 超音波・高圧ジェット洗浄・水洗処理部
18 エアーナイフ乾燥処理部
20、22 ローラコンベア
90a、90b、98a、98b エアー供給管
94a、94b、102a、102b 排気管
38 エッチング処理部
86、104,104a、104b、108a、108b 処理ツール
88a、88b、96a、96b エアー吐出通路
92a、92b、100a、100b エアー吸入通路
Claims (2)
- 基板入口および基板出口を有する密閉型のチャンバと、
このチャンバの内部に配設され基板に対して所定の処理を施す処理ツールと、
この処理ツールに対し基板を相対的に移動させる移動手段と、
を備えた基板処理装置において、
前記処理ツールが配設されたチャンバと基板とを相対的に移動させるようにし、
前記チャンバの基板入口に基板の相対的移動路を挟んでその上方側および下方側にそれぞれに配設され、基板の相対的移動路に近接して対向する気体吐出口をそれぞれ有し、その気体吐出口から基板の相対的移動路に向けてカーテン用気体をそれぞれ吐出する上・下一対の入口側気体吐出手段と、
前記チャンバの基板入口に基板の相対的移動路を挟んでその上方側および下方側にそれぞれに配設され、基板の相対的移動路に近接して対向する気体吸入口をそれぞれ有し、その気体吸入口を通してカーテン用気体をそれぞれ吸入する上・下一対の入口側気体吸入手段と、
前記チャンバの基板出口に基板の相対的移動路を挟んでその上方側および下方側にそれぞれに配設され、基板の相対的移動路に近接して対向する気体吐出口をそれぞれ有し、その気体吐出口から基板の相対的移動路に向けてカーテン用気体をそれぞれ吐出する上・下一対の出口側気体吐出手段と、
前記チャンバの基板出口に基板の相対的移動路を挟んでその上方側および下方側にそれぞれに配設され、基板の相対的移動路に近接して対向する気体吸入口をそれぞれ有し、その気体吸入口を通してカーテン用気体をそれぞれ吸入する上・下一対の出口側気体吸入手段と、
前記チャンバの基板入口に基板が存在するときは、前記上・下一対の入口側気体吐出手段と前記上・下一対の入口側気体吸入手段とをそれぞれ作動させ、前記チャンバの基板出口に基板が存在するときは、前記上・下一対の出口側気体吐出手段と前記上・下一対の出口側気体吸入手段とをそれぞれ作動させ、前記チャンバの基板入口に基板が存在しないときは、前記上方側または下方側の入口側気体吐出手段と前記下方側または上方側の入口側気体吸入手段とをそれぞれ作動させ、前記チャンバの基板出口に基板が存在しないときは、前記上方側または下方側の出口側気体吐出手段と前記下方側または上方側の出口側気体吸入手段とをそれぞれ作動させるように切り替える切替手段と、
を備えたことを特徴とする基板処理装置。 - 請求項1に記載の基板処理装置において、
前記チャンバが、基板の相対的移動方向に複数連設されたことを特徴とする基板処理装置。
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004002670A JP4398262B2 (ja) | 2004-01-08 | 2004-01-08 | 基板処理装置 |
| TW093139789A TWI283013B (en) | 2004-01-08 | 2004-12-21 | Apparatus for processing a substrate |
| CNB2005100039939A CN100350555C (zh) | 2004-01-08 | 2005-01-07 | 基板处理装置 |
| KR1020050001639A KR100731420B1 (ko) | 2004-01-08 | 2005-01-07 | 기판 처리 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004002670A JP4398262B2 (ja) | 2004-01-08 | 2004-01-08 | 基板処理装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005197487A JP2005197487A (ja) | 2005-07-21 |
| JP4398262B2 true JP4398262B2 (ja) | 2010-01-13 |
Family
ID=34817796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004002670A Expired - Fee Related JP4398262B2 (ja) | 2004-01-08 | 2004-01-08 | 基板処理装置 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4398262B2 (ja) |
| KR (1) | KR100731420B1 (ja) |
| CN (1) | CN100350555C (ja) |
| TW (1) | TWI283013B (ja) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4584821B2 (ja) * | 2005-12-14 | 2010-11-24 | 東京エレクトロン株式会社 | 真空処理装置及び帯状気流形成装置 |
| CN100552352C (zh) * | 2006-09-12 | 2009-10-21 | 健鼎科技股份有限公司 | 电路基板干燥装置 |
| JP5076749B2 (ja) * | 2007-09-03 | 2012-11-21 | 株式会社日立プラントテクノロジー | シート印刷システム |
| KR100860294B1 (ko) * | 2008-01-09 | 2008-09-25 | 주식회사 이코니 | 유리기판 에칭 장치와 상기 에칭 장치에 의하여 제조된유리박판 |
| CN101284604B (zh) * | 2008-05-21 | 2011-06-15 | 友达光电股份有限公司 | 除尘输送装置 |
| KR101073546B1 (ko) | 2009-08-13 | 2011-10-17 | 삼성모바일디스플레이주식회사 | 스토커 |
| JP5562759B2 (ja) * | 2009-11-04 | 2014-07-30 | 東京エレクトロン株式会社 | 基板処理装置 |
| KR101125568B1 (ko) * | 2009-12-14 | 2012-03-22 | 삼성모바일디스플레이주식회사 | 식각 장치 |
| JP2011129758A (ja) * | 2009-12-18 | 2011-06-30 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| WO2013119383A1 (en) * | 2012-02-08 | 2013-08-15 | Applied Materials, Inc. | Dynamic load lock with cellular structure for discrete substrates |
| JP6050630B2 (ja) * | 2012-07-27 | 2016-12-21 | 株式会社Screenホールディングス | 基板処理装置および基板処理システム |
| KR102108307B1 (ko) * | 2013-07-26 | 2020-05-11 | 세메스 주식회사 | 기판 처리 설비 |
| CN105742205A (zh) * | 2014-12-11 | 2016-07-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 基片处理腔室及半导体加工设备 |
| JP6465489B2 (ja) * | 2015-10-23 | 2019-02-06 | ヒューグル開発株式会社 | クリーニングヘッドおよび清掃方法 |
| EP3465746A4 (en) * | 2016-06-02 | 2020-03-04 | Applied Materials, Inc. | SLIDE VALVE FOR PROCESSING A CONTINUOUS ROPE |
| JP6665760B2 (ja) * | 2016-11-16 | 2020-03-13 | 日本電気硝子株式会社 | ガラス基板の製造装置及び製造方法 |
| JP6732213B2 (ja) * | 2016-11-16 | 2020-07-29 | 日本電気硝子株式会社 | ガラス基板の製造方法 |
| JP6700605B2 (ja) * | 2016-11-16 | 2020-05-27 | 日本電気硝子株式会社 | ガラス基板の製造方法 |
| CN110556322B (zh) * | 2019-09-16 | 2022-02-15 | 中电九天智能科技有限公司 | 一种激光剥离前玻璃自动风干系统及方法 |
| CN112744419B (zh) * | 2020-11-27 | 2023-11-03 | 乐金显示光电科技(中国)有限公司 | 显示面板斑点抑制方法及抑制设备 |
| KR102618629B1 (ko) | 2021-08-24 | 2023-12-27 | 세메스 주식회사 | 기판 처리 장치 및 방법 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3511441B2 (ja) * | 1996-11-29 | 2004-03-29 | 忠弘 大見 | 洗浄やエッチング、現像、剥離等を含むウエット処理に用いる省液型の液体供給ノズル、ウエット処理装置及びウエット処理方法 |
| JP3934281B2 (ja) * | 1999-07-02 | 2007-06-20 | 三菱電機株式会社 | コンベア炉 |
| CN1267776C (zh) * | 2001-10-03 | 2006-08-02 | 日东电工株式会社 | 偏光板和具有偏光板的液晶显示装置 |
-
2004
- 2004-01-08 JP JP2004002670A patent/JP4398262B2/ja not_active Expired - Fee Related
- 2004-12-21 TW TW093139789A patent/TWI283013B/zh not_active IP Right Cessation
-
2005
- 2005-01-07 KR KR1020050001639A patent/KR100731420B1/ko not_active Expired - Fee Related
- 2005-01-07 CN CNB2005100039939A patent/CN100350555C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW200527503A (en) | 2005-08-16 |
| CN100350555C (zh) | 2007-11-21 |
| TWI283013B (en) | 2007-06-21 |
| KR100731420B1 (ko) | 2007-06-21 |
| KR20050073420A (ko) | 2005-07-13 |
| JP2005197487A (ja) | 2005-07-21 |
| CN1638033A (zh) | 2005-07-13 |
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