JP4401210B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that sucks an electronic component with a suction nozzle provided in a mounting head and mounts the electronic component on a circuit board.

  Conventionally, an electronic component mounting apparatus for mounting an electronic component on a circuit board has been proposed. The electronic component mounting apparatus disclosed in Japanese Patent Laid-Open No. 4-196299 (Patent Document 1) scans a plurality of times at different positions on the electronic component while the electronic component passes through the scanning line of the one-dimensional photosensor. The scanning result of the sensor is taken into the memory device. This apparatus obtains two-dimensional image information of an electronic component viewed from one direction by using a plurality of line image information having different scanning positions.

JP-A-4-196299 (FIG. 3)

  However, the electronic component mounting apparatus of Patent Document 1 obtains two-dimensional image information viewed from one direction. For this reason, regarding electronic components with similar two-dimensional image information viewed from one direction, the electronic components sucked by the suction nozzle are the same electronic components even if they are different from the electronic components actually intended to be mounted. It may be judged that it is erroneously mounted. For example, a cylindrical part and a prismatic part may be recognized as the same part depending on the projection direction.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an electronic component mounting apparatus that can recognize an electronic component more reliably.

In order to solve the above problem, the invention according to claim 1
A suction nozzle (9) capable of sucking electronic components;
Vertical movement means (24) for moving the suction nozzle up and down;
A rotating means (25) for rotating the suction nozzle;
A mounting head (8) that holds the suction nozzle and is movable in the XY horizontal direction;
Detection means (37, 47) provided on the mounting head and including a light projecting unit that irradiates parallel light along the X direction and a light receiving unit thereof;
Input means (28) for inputting component data representing the shape of the electronic component;
In an electronic component mounting apparatus for recognizing a positional deviation between the electronic component sucked by the suction nozzle and the suction nozzle and mounting the electronic component on a circuit board,
By the vertical movement means, said while moving the electronic component sucked by the suction nozzle up and down, by a different position of the component to capture the light shielding length as an output value of the detection means, the first projection of the electronic component While getting the figure data,
After rotating the electronic component by a predetermined amount by the rotating means, the electronic component sucked by the suction nozzle is moved up and down by the up- and- down moving means , and as an output value of the detecting means at different positions of the parts To obtain the second projection data of the electronic component by taking
First, the comparing component the first projection view data for the data, then the comparing part and the second projection view data for the data, based on these comparison results, the electronic component It was set as the structure which has the control means (23) which recognizes a kind and its vertical and horizontal dimension .
According to the first aspect of the present invention, the first projection map data and the second projection map data are acquired as image data of one electronic component viewed from two directions. Then, the first projection map data is first compared with the component data input from the input means, and then the second projection map data is compared with the component data. Based on these comparison results, Recognizes the type, vertical and horizontal dimensions of the electronic component.

  At this time, for example, if the electronic component type and its vertical and horizontal dimensions are within a specified range by comparing two predetermined directions, the electronic component is mounted (mounted) on the circuit board. Further, when the value is not within the specified value range, control is performed so as not to mount the electronic component on the circuit board.

The invention according to claim 2 is the electronic component mounting apparatus according to claim 1,
The first projection data is obtained by rotating the suction nozzle by the rotating unit and acquiring the electronic component at a position where the light shielding length detected by the detecting unit is minimized,
The second projection map data is acquired at a position rotated by 45 degrees or 90 degrees from the position where the first projection map data was acquired by the rotating means.

The invention according to claim 3 is the electronic component mounting apparatus according to claims 1 and 2,
The control means controls an acquisition position and a range of the first projection map data and the second projection map data according to a component type.

  According to the first aspect of the present invention, since the image data of both the first projection drawing data and the second projection drawing is compared with the component data, the component recognition can be performed accurately.

  According to the second aspect of the present invention, since the acquisition positions of the first projection map data and the second projection map data are defined, the image data of the electronic component can be acquired from the optimal two directions. Component recognition can be performed.

  According to the third aspect of the present invention, since the acquisition position and range of the first projection map data and the second projection map data are controlled according to the component type, the component recognition can be performed more accurately.

A first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a perspective view of an apparatus according to the first embodiment. FIG. 2 is a detailed view of the mounting head after the cover is removed. FIG. 3 is a detailed view of the optical sensor. FIG. 4 is a block diagram showing the configuration of the control system of the apparatus. 5 and 6 are explanatory diagrams in the case of measuring the component length by the optical sensor. FIG. 7 is an explanatory diagram showing changes in the component length when the suction nozzle is rotated. FIG. 8 is a projection view seen from one direction. FIG. 9 is a projection view seen from two directions.

  As for the electronic component mounting apparatus 1, the plate-shaped base 2 is installed in the bottom face. The pedestal 2 is fixed to a machine frame (not shown) and stands up from the floor. A pair of substrate transport rails 3 and 3 are arranged on the base 2 from the right side to the left side in FIG. The substrate transport rails 3 and 3 are equipped with a transport belt (not shown) at the top thereof. By driving the transport belt, the substrate 4 moves along the X direction.

  In addition, a pair of Y frames 5 and 5 are disposed on the pedestal 2 on the right and left sides in the figure so as to straddle the substrate transport rails 3 and 3. The Y frames 5 and 5 are arranged along the Y direction orthogonal to the X direction. Guide rails 6 and 6 are fixed to the upper portions of the Y frames 5 and 5, respectively.

  An X frame 7 is disposed on the guide rails 6 and 6 along the X direction. The X frame 7 is elongated and has a plate shape. Both ends of the X frame 7 are provided with leg portions 7a and 7a extending toward the lower guide rails 6 and 6, respectively. A linear guide with a bearing (not shown) is mounted on the bottom surface of the legs 7a, 7a. The linear guide supports a plurality of balls that engage with the guide rail 6 on the inner surface side. Therefore, the X frame 7 is supported by the linear motion guide (nut) and the guide rails (rails) 6 and 6 so as to be movable along the Y direction.

  A pair of pulleys 16, 17, 16, and 17 are disposed at both ends of the Y frames 5 and 5, respectively. Although not shown, these pulleys 16, 17, 16, and 17 are rotatably supported by the Y frames 5 and 5, respectively. Belts 18 and 18 are wound around the pulleys 16 and 17, respectively. The belts 18 and 18 are individually fixed and connected to the leg portions 7a and 7a of the X frame.

  Y-axis drive motors 19 and 19 are individually connected to the pulleys 16 and 16. When the Y-axis drive motors 19 and 19 are rotated in synchronization, the X frame 7 moves in the Y direction via the second belts 18 and 18. The X frame 7 is equipped with a mounting head 8. For this reason, when the Y-axis drive motors 19 are driven, the mounting head 8 is moved in the Y direction.

  A guide rail (not shown) is fixed to one side surface of the X frame 7. The mounting head 8 is disposed so as to cover a part of the guide rail. The mounting head 8 is mounted with a linear motion guide with a bearing (not shown) on the back side thereof. The linear guide supports a plurality of balls engaging with the guide rail on the inner surface. Therefore, the mounting head 8 is supported by the linear motion guide and the guide rail so as to be movable along the X direction.

  Pulleys 11 and 12 are disposed at both ends of the X frame 7. Although not shown, the pulleys 11 and 12 are rotatably supported by the X frame 7. A first belt 13 is wound around the pulleys 11 and 12. After the first belt 13 is wound around the pulleys 11 and 12, both ends thereof are fixed by a holding plate (not shown) and the mounting head 8. An X-axis drive motor 15 is connected to one pulley 12. When the X-axis drive motor 15 rotates, the mounting head 8 moves in the X direction via the first belt 13.

  The mounting head 8 is supported by the Y frames 5, 5 and the X frame 7 so as to be movable in the X direction, the Y direction, that is, the horizontal direction. The mounting head 8 is moved in the horizontal direction by driving the moving means. This moving means is composed of Y-axis drive motors 19, 19, pulleys 16, 17, 16, 17, second belts 18, 18, X-axis drive motor 15, pulleys 11, 12, first belt 13, and the like. .

  A plurality of tape feeders 21 are arranged in parallel on one end side of the base 2. The tape feeder 21 sequentially sends electronic components stored in the tape storage unit to the opening.

As shown in FIG. 2, the mounting head 8 is provided with four suction nozzles 9 along the X direction.
The suction nozzle 9 is fixed to the bracket 33. The bracket 33 and the suction nozzle 9 are supported by a guide (not shown) fixed to the frame 34 so as to be movable in the vertical direction. The suction nozzle 9 is individually attached with a θ-axis motor 25 as a rotating means. When the θ-axis motor 25 rotates, the suction nozzle 9 rotates about the nozzle center axis.

  Four Z-axis motors 24 as vertical movement means are fixed to the frame 34 of the mounting head 8 for each suction nozzle. The Z-axis motor 24 is connected to a ball screw 35. The ball screw 35 is engaged with a nut 36 fixed to the bracket 33. When the Z-axis motor 24 rotates, the suction nozzle 9 individually moves up and down. Further, the suction nozzle 9 communicates with the vacuum mechanism 26 and can suck and desorb electronic components at the tip of the suction nozzle 9.

  A one-dimensional optical sensor 37 as a detection means is fixed to the lower part of the mounting head 8. The one-dimensional optical sensor 37 includes a light projecting unit 38 and a light receiving unit 39 arranged in parallel along the X direction. The light projecting unit 38 includes a light emitting element 40 that emits laser light, and a lens 41 that converts the emitted light into parallel light and irradiates the light receiving unit 39. The light receiving unit 39 is provided with a line sensor 42 made of a linear CCD array, a linear CMOS array, or the like as an element. The line sensor 42 arranges elements in the X direction and detects an object in a line field.

  The light projecting unit 38 and the light receiving unit 39 of the mounting head 8 are precisely positioned. For this reason, when the adsorbed electronic component 32 is disposed in a one-dimensional optical sensor (optical sensor) 37, the position and orientation of the component can be detected by detecting the length and position of the light shielding portion of the laser beam. .

FIG. 4 is a block diagram showing the configuration of the control system of the electronic component mounting apparatus.
Reference numeral 23 denotes a controller (control means) which includes a microcomputer (CPU) for controlling the entire apparatus, RAM, ROM, and the like. The controller 23 is connected to the following components and controls them.

The X-axis drive motor 15 moves the mounting head 8 in the X direction via the first belt 13.
The Y-axis drive motors 19 and 19 move the mounting head 8 in the Y direction via the second belts 18 and 18. The Z-axis motor 24 is a drive source that moves the suction nozzle 9 up and down. Further, the θ-axis motor 25 rotates the suction nozzle 9 around the nozzle central axis. The vacuum mechanism 26 generates a vacuum and applies a suction force to the suction nozzle 9.
In FIG. 4, only one Z-axis motor 24, θ-axis motor 25, and vacuum mechanism 26 are illustrated, but they are individually provided as many as the number of suction nozzles 9 to be mounted.

  The image recognition device 27 performs image recognition of the component 32 sucked by each of the suction nozzles 9. The image recognition device 27 includes a CPU 27a, a memory 27b, and a one-dimensional photosensor 37. When the sucked electronic component 32 is arranged in the one-dimensional optical sensor 37, the length and position of the laser light shielding portion are output as a digital signal and stored in the memory 27b. Then, based on the data, the CPU 27a calculates a displacement amount and a suction angle shift of the suction position of the sucked electronic component 32.

  A keyboard 28a and a mouse 28b as the input means 28 are used for inputting data such as component data. The component data is composed of component size such as outer dimensions and lead terminal information for each type of mounted component. The lead terminal information includes the lead terminal width, length, pitch, and number of terminals.

The storage device 30 is composed of a flash memory or the like, and is used to store component data input by the keyboard 28a and the mouse 28B or component data supplied from a host computer (input means) (not shown).
The monitor (display device) 31 displays component data, calculation data, image data of a projection view of the sucked electronic component 32, and the like.

The operation of the first embodiment will be described.
Prior to the start of production, component data such as component size and lead terminal information is input for each type of mounted component using a keyboard 28a as an input means. The component size is an external dimension or the like of the electronic component, and the lead terminal information includes the width, length, pitch, and number of terminals of the lead terminal.
The following operations are executed by the controller 23 as control means. The description will be made when one suction nozzle 9 is used. When a plurality of suction nozzles 9 are used, when the suction operation is completed for each of the plurality of suction nozzles 9, the recognition operation and the mounting operation are performed next. Run in order.

  First, the X-axis drive motor 15 and the Y-axis drive motor 19 are driven to place the mounting head 8 on the opening of the tape feeder 21 that is a predetermined part. Next, the Z-axis motor 24 is driven to lower the suction nozzle 9. Then, after applying vacuum negative pressure from the vacuum mechanism 26 to suck and hold the electronic component 32, the suction nozzle 9 is raised.

Next, the X-axis drive motor 15 and the Y-axis drive motor 19 are driven to move the mounting head 8 to the component mounting position on the circuit board 4. During the movement to the mounting position, the electronic component 32 is recognized.
The electronic component recognition operation drives the Z-axis motor 24 to raise the suction nozzle 9. Then, the electronic component 32 sucked and held by the suction nozzle 9 is moved to a recognition position sensed by the one-dimensional optical sensor 37. 5 and 6 show a state in which the electronic component 32 is in the recognition position.

  When the electronic component 32 at the recognition position is irradiated with laser light from the light projecting unit 38 of the one-dimensional optical sensor 37, the light shielding length L1 which is the length shielded by the electronic component 32 is obtained as a line sensor of the light receiving unit 39. 42 detects.

  Next, when the θ-axis motor 25 is driven, the electronic component 32 sucked by the suction nozzle 9 rotates. By this rotation, in the case of a rectangular parallelepiped electronic component, the light shielding length L1 changes as shown in FIG. When the electronic component 32 is a rectangular parallelepiped, the position where the light shielding length L1 is minimized (hereinafter referred to as the light shielding length minimum position) is a position where the short side of the rectangular parallelepiped and the laser beam 43 of the one-dimensional optical sensor 37 are parallel. The θ-axis motor 25 is stopped at the minimum light shielding length position. Then, by recognizing the light shielding width L1 of the electronic component 32, the light shielding position of the electronic component 32, and the axis of the suction nozzle 9 at the minimum light shielding length position, the positional deviation between the electronic component 32 and the suction nozzle 9 is recognized. can do.

Next, the Z-axis motor 24 is driven, and the one-dimensional optical sensor 37 moves to a position where the lower side of the electronic component 32 can be detected.
Next, the Z-axis motor 24 is driven with respect to the electronic component 32 in the minimum light shielding length position, and the electronic component 32 is lowered. At this time, for example, the one-dimensional optical sensor 37 captures the light shielding length L1 as the output value of the optical sensor 37 into the memory 27b at intervals of 10 μm, for example. And if it falls to the position which detects the suction nozzle 9, the Z-axis motor 24 will be stopped. FIG. 8 is a two-dimensional projection view (first projection view) as image data viewed from one direction, obtained by taking in the memory 27b the light shielding length L1 as the output value of the optical sensor 37 at every 10 μm interval. It is.

  In this first projection view, the optical sensor 37 is scanned at different positions of the electronic component while the electronic component is moved up and down by the vertical movement means. This scan data is image data created by fetching it into the memory 27b.

Next, the θ-axis motor 25 is driven to rotate the electronic component 32 by 90 degrees.
Next, the Z-axis motor 24 is driven to raise the electronic component 32. Then, for example, the light shielding length as the output value of the one-dimensional optical sensor 37 is taken into the memory every 10 μm interval. As a result, a two-dimensional projection view (second projection view) as image data viewed from the other direction can be obtained.
FIG. 9 shows a first projection and a second projection of a cylindrical part.

Next, the reference component data is compared using the image data of both the first projection map data and the second projection map data. That is, the image data of the first projection view data and the second projection view data when the component is viewed from two directions is compared with the reference component data (component data). First, the first projection view data is compared with the component data, then the first projection view data is compared with the component data first, and then the component data. The second projection map data is compared with each other, the second projection map data is compared based on the comparison results, and the electronic component is controlled based on the comparison results.
In this comparison, it is determined whether or not the vertical and horizontal dimensions of the electronic component are within a specified range in every two predetermined directions. At this time, component data is input by the input means for every two predetermined directions.

As a result of comparison, if the value is within the specified value range, the position deviation and angle deviation of the electronic component 32 with respect to the suction nozzle 9 can be reduced by driving the θ-axis motor 25, the X-axis drive motor 15, and the Y-axis drive motor 19. adjust.
Next, the electronic component 32 is moved to the mounting position of the circuit board 4.
Next, based on the electronic component bottom surface height obtained from the first and second projection views, the Z-axis motor is driven, the suction nozzle 9 is lowered, and the electronic component 32 is mounted on the circuit board 4. .

If the result of the comparison is outside the range of the specified value, it is determined that there is an abnormality, and the electronic component is left in the error component storage place without being mounted on the circuit board.
According to the first embodiment, first projection map data and second projection map data are acquired as image data of one electronic component viewed from two directions. Thereafter, the component data input from the input means is compared using the image data of both the first projection map data and the second projection map.

  At this time, for example, if the vertical and horizontal dimensions of the electronic component viewed from two predetermined directions are within a specified value range, the electronic component is mounted (mounted) on the circuit board. Further, when the value is not within the specified value range, control is performed so as not to mount the electronic component on the circuit board.

  For this reason, while being able to recognize components reliably, electronic components can be mounted accurately.

Further, since the acquisition positions of the first projection map data and the second projection map data are defined, the image data of the electronic component can be acquired from the optimal two directions, so that the component recognition can be performed more accurately.
Further, since the one-dimensional optical sensor 37 having the light projecting part and the light receiving part is used as the detecting means, the mounting head is reduced in weight compared to the case where the camera is used. In addition, data processing is easy because of the digital signal.

  In the first embodiment, using the first projection data and the second projection data obtained by the one-dimensional optical sensor 37, in addition to the suction position recognition, the suction nozzles such as the presence / absence of parts, types, defects, parts standing, etc. It is also possible to easily recognize the suction state of the sucked electronic component.

The present invention can be variously modified without being limited to the above embodiment.
For example, in the first embodiment, the second projection map data is acquired at a position rotated 90 degrees from the first projection map data. Instead of this, it is easily conceivable to acquire the second projection map data at a position rotated 45 degrees from the first projection map data. As a result, a lead bending defect of the electronic component 51 is detected from the first projection view data shown in FIG. 10, and a ball chipping failure of the electronic component 52 is detected from the second projection view data shown in FIG.

In the first embodiment, as shown in FIG. 3, the plurality of suction nozzles 9 are arranged so as to be orthogonal to the parallel light 43 of the one-dimensional optical sensor 37. On the other hand, as shown in FIG. 12, the four suction nozzles 9 are arranged so as to be parallel to the parallel light 43, and the suction nozzles 9 are individually moved up and down to suck the sucked electronic components. It can be easily considered.
In addition, as shown in FIG. 13, it is easy to arrange the four suction nozzles 9 so as to intersect the parallel light 43.

  Moreover, in the said embodiment, the one-dimensional photosensor 37 is arrange | positioned along the X direction. Instead of this, it is easily conceivable to arrange the one-dimensional photosensor 47 along the vertical direction Z as shown in FIG. At this time, the axis 9a of the suction nozzle 9 and the line sensor central axis 46a are offset from 0.1 mm to 6 mm. Thus, since it is offset, if the suction nozzle 9 is rotated, component projection drawing data can be acquired from a plurality of angles, and the suction state of the electronic component can be detected.

  In the above embodiment, in addition to the suction position recognition, the one-dimensional optical sensor 37 is used to recognize the suction state of the electronic component sucked by the suction nozzle, such as the presence / absence of the component, type, defect, and component standing. Instead of this, it is also conceivable to provide a camera near the tape feeder, and to share the roles so that the suction position recognition is performed by the camera and other recognition is performed by the one-dimensional optical sensor.

  In the above-described embodiment, the first projection map data is acquired at a position where the light shielding length is minimum, and the second projection map data is acquired at a position rotated by 45 degrees or 90 degrees from the position. Instead of this, it is also conceivable that the first projection map data and the second projection map data are acquired at arbitrary two positions and compared with the component data.

  In the case of a rectangular parallelepiped electronic component, only the outer dimensions are recognized, but it is also conceivable that complicated lead components and connector components can be easily recognized by acquiring projection drawing data from a plurality of positions.

  It is also conceivable to easily control the data acquisition position and the acquisition range of the first projection map data and the second projection map data depending on the component type. That is, in the case of a large electronic component, it is easy to recognize the component more accurately by increasing the data acquisition range, or in the case of a small precision component, by shortening the interval between scanning lines for capturing images.

  In the above-described embodiment, the component recognition is performed by comparing the first projection map data and the second projection map data obtained by viewing the component from two directions with respect to the component data. In addition to this, it is easily conceivable to acquire the third projection data obtained by viewing the component from the third direction and perform the component recognition.

  In addition, depending on one component, the component recognition is performed only with the first projection map data, and the other component is selected and controlled so that the component recognition is performed with the first projection map data and the second projection map data. Is also easily considered.

It is a perspective view of a 1st embodiment. It is a perspective view of the mounting head after removing a cover. It is detail drawing of a one-dimensional photosensor. It is a block diagram which shows the structure of the control system of an apparatus. It is explanatory drawing which shows the state which the one-dimensional photosensor has recognized the electronic component. It is explanatory drawing which shows the state which the one-dimensional photosensor has recognized the electronic component. It is explanatory drawing which shows the change of the light-shielding length at the time of rotating an electronic component. It is the projection view seen from one direction. It is the projection figure which looked at the electronic component from two directions. It is the projection figure which detected lead bending. It is the projection figure which detected the lack of a ball. It is a modification of arrangement | positioning of a one-dimensional photosensor and a nozzle head. It is a modification of arrangement | positioning of a one-dimensional photosensor and a nozzle head. This is an embodiment when a one-dimensional photosensor is provided in the vertical direction.

Explanation of symbols

9 ... Suction nozzle 24..Z-axis motor (vertical movement means)
25 ・ ・ θ-axis motor (rotating means)
9: Mounting head 37 .. One-dimensional optical sensor (detection means)
28..Input means 23..Control means 47..One-dimensional optical sensor (detection means)

Claims (3)

A suction nozzle that can pick up electronic components;
A vertically moving means for vertically moving the suction nozzle;
A rotating means for rotating the suction nozzle;
A mounting head that holds the suction nozzle and is movable in the XY horizontal direction;
A detecting means provided on the mounting head, and comprising a light projecting unit that irradiates parallel light along the X direction and a light receiving unit thereof;
Input means for inputting component data representing the shape of the electronic component,
In an electronic component mounting apparatus for recognizing a positional deviation between the electronic component sucked by the suction nozzle and the suction nozzle and mounting the electronic component on a circuit board,
By the vertical movement means, said while moving the electronic component sucked by the suction nozzle up and down, by a different position of the component to capture the light shielding length as an output value of the detection means, the first projection of the electronic component While getting the figure data,
After rotating the electronic component by a predetermined amount by the rotating means, the electronic component sucked by the suction nozzle is moved up and down by the up- and- down moving means , and as an output value of the detecting means at different positions of the parts To obtain the second projection data of the electronic component by taking
First, the comparing component the first projection view data for the data, then the comparing part and the second projection view data for the data, based on these comparison results, the electronic component An electronic component mounting apparatus comprising control means for recognizing a type and its vertical and horizontal dimensions . The electronic component mounting apparatus according to claim 1,
The first projection data is obtained by rotating the suction nozzle by the rotating unit and acquiring the electronic component at a position where the light shielding length detected by the detecting unit is minimized,
The electronic component mounting apparatus according to claim 1, wherein the second projection map data is acquired at a position rotated by 45 degrees or 90 degrees from the position at which the first projection map data is acquired by the rotating means. The electronic component mounting apparatus according to claim 1 or 2,
The electronic component mounting apparatus, wherein the control means controls the position and range of the first projection view data and the second projection view data according to a component type.

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