JP4402883B2 - 分断装置および分断システム並びに分断方法 - Google Patents
分断装置および分断システム並びに分断方法 Download PDFInfo
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- JP4402883B2 JP4402883B2 JP2002557877A JP2002557877A JP4402883B2 JP 4402883 B2 JP4402883 B2 JP 4402883B2 JP 2002557877 A JP2002557877 A JP 2002557877A JP 2002557877 A JP2002557877 A JP 2002557877A JP 4402883 B2 JP4402883 B2 JP 4402883B2
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- 238000000034 method Methods 0.000 title claims description 12
- 239000000758 substrate Substances 0.000 claims description 151
- 238000005520 cutting process Methods 0.000 claims description 127
- 239000000463 material Substances 0.000 claims description 24
- 238000005452 bending Methods 0.000 claims description 5
- 238000005096 rolling process Methods 0.000 claims description 3
- 238000013467 fragmentation Methods 0.000 claims 1
- 238000006062 fragmentation reaction Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 description 394
- 239000011521 glass Substances 0.000 description 71
- 230000007246 mechanism Effects 0.000 description 59
- 230000032258 transport Effects 0.000 description 17
- 238000010586 diagram Methods 0.000 description 11
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- 229920006351 engineering plastic Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
- C03B33/033—Apparatus for opening score lines in glass sheets
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/307—Combined with preliminary weakener or with nonbreaking cutter
- Y10T225/321—Preliminary weakener
- Y10T225/325—With means to apply moment of force to weakened work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/329—Plural breakers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T225/00—Severing by tearing or breaking
- Y10T225/30—Breaking or tearing apparatus
- Y10T225/371—Movable breaking tool
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0363—Plural independent scoring blades
- Y10T83/037—Rotary scoring blades
- Y10T83/0378—On opposite sides of work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/02—Other than completely through work thickness
- Y10T83/0333—Scoring
- Y10T83/0385—Rotary scoring blade
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/04—Processes
- Y10T83/0581—Cutting part way through from opposite sides of work
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Liquid Crystal (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Description
実施の形態1に係る液晶パネル分断ラインは、液晶マザーパネルを液晶パネルに分断する。図1は、実施の形態1に係る液晶パネル分断ライン100の平面図である。液晶パネル分断ライン100は、液晶マザーパネル8をストックするローダ12を備えている。液晶パネル分断ライン100には、給材ロボット13が設けられている。給材ロボット13は、ローダ12にストックされた液晶マザーパネル8を1枚ずつ吸引して、コンベア14上に載置する。コンベア14上に載置された液晶マザーパネル8は、液晶パネル分断ライン100の前方(図1において右方向)へ搬送され、位置決めされる。
実施の形態2に係る液晶パネル分断ラインは、実施の形態1と同様に液晶マザーパネルを液晶パネルに分断する。図17は、実施の形態2に係る液晶パネル分断ライン200の平面図である。実施の形態1に係る液晶パネル分断ライン100の構成要素と同一の構成要素には同一の参照符号を付している。これらの構成要素の詳細な説明は省略する。
図32を参照すると、上流テーブル5Bに最後の液晶マザーパネル8が残される。図33を参照すると、吸着搬送部20は、液晶マザーパネル8の左端に設定されたさらに他のスクライブ予定ラインが、スクライブ部42に設けられたカッターホイールチップ51とスクライブ部43に設けられたカッターホイールチップ51との間に位置するように、液晶マザーパネル8の左端が下流テーブル6Bからはみ出す位置へ液晶マザーパネル8を搬送する。
実施の形態3に係る液晶パネル分断装置は、液晶マザーパネルをスクライブする工程のタクトタイムを短縮する。
Claims (7)
- 脆性材料によって構成されたマザー基板の表面および裏面をそれぞれスクライブするために上下にそれぞれ対向して設けられた第1スクライブ手段および第2スクライブ手段と、
該マザー基板のスクライブ予定ラインが該第1スクライブ手段および第2スクライブ手段の間に位置するように、該マザー基板を保持して搬送する保持搬送手段と、
該保持搬送手段によって該第1スクライブ手段および第2スクライブ手段の間へ移動される該マザー基板が戴置される第1テーブルと
を備え、
該第1スクライブ手段および第2スクライブ手段は、該第1スクライブ手段および第2スクライブ手段によってスクライブラインが形成された該マザー基板を該スクライブラインに沿って分断するように、該マザー基板に所定の圧力を加えながら該スクライブラインに沿って該マザー基板上を転動する第1および第2ローラをそれぞれ有している分断装置。 - 前記第1ローラと前記第2ローラとは、前記スクライブラインを中心として前記マザー基板に曲げモーメントを作用させるように転動する、請求項1記載の分断装置。
- 前記第1ローラは、前記スクライブラインに対して前記第2ローラの反対側を転動する、請求項1記載の分断装置。
- 前記第1スクライブ手段および第2スクライブ手段は、前記マザー基板をスクライブする第1および第2カッターホイールチップをそれぞれ有している、請求項1記載の分断装置。
- 両面が脆性材料によって構成されたマザー基板を保持搬送手段によって保持する工程と、
上下に対向して設けられた第1スクライブ手段と第2スクライブ手段との間に前記マザー基板のスクライブ予定ラインが位置するように、前記保持搬送手段によって前記マザー基板を搬送して第1テーブルにセットする工程と、
前記マザー基板上のスクライブ予定ラインに沿って前記第1スクライブ手段および前記第2スクライブ手段を移動させ、前記第1スクライブ手段および前記第2スクライブ手段によって前記マザー基板にスクライブラインを形成する工程と、
前記第1スクライブ手段および前記第2スクライブ手段に備えられた第1ローラおよび第2ローラを、前記マザー基板の前記スクライブラインに沿って所定の圧力を加えるように転動させて分断するブレイク工程と
を包含することを特徴とする分断方法。 - 前記第1ローラと前記第2ローラとは、前記スクライブラインを中心として前記マザー基板に曲げモーメントを作用させるように転動する、請求項5記載の分断方法。
- 前記第1ローラは、前記スクライブラインに対して前記第2ローラの反対側を転動する、請求項5記載の分断方法。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001008796 | 2001-01-17 | ||
| JP2001008796 | 2001-01-17 | ||
| PCT/JP2002/000258 WO2002057192A1 (en) | 2001-01-17 | 2002-01-16 | Separator and separating system |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008178310A Division JP5044751B2 (ja) | 2001-01-17 | 2008-07-08 | 分断装置および分断方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2002057192A1 JPWO2002057192A1 (ja) | 2004-05-20 |
| JP4402883B2 true JP4402883B2 (ja) | 2010-01-20 |
Family
ID=18876362
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002557877A Expired - Fee Related JP4402883B2 (ja) | 2001-01-17 | 2002-01-16 | 分断装置および分断システム並びに分断方法 |
| JP2008178310A Expired - Fee Related JP5044751B2 (ja) | 2001-01-17 | 2008-07-08 | 分断装置および分断方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008178310A Expired - Fee Related JP5044751B2 (ja) | 2001-01-17 | 2008-07-08 | 分断装置および分断方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US7131562B2 (ja) |
| JP (2) | JP4402883B2 (ja) |
| KR (1) | KR100748159B1 (ja) |
| CN (1) | CN1486285B (ja) |
| TW (1) | TW528735B (ja) |
| WO (1) | WO2002057192A1 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101329819B1 (ko) * | 2012-01-31 | 2013-11-15 | 주식회사 티이에스 | 기판 분단 시스템 및 기판 분단 방법 |
| TWI468774B (ja) * | 2010-05-25 | 2015-01-11 | ||
| JP2020111047A (ja) * | 2019-01-09 | 2020-07-27 | 三星ダイヤモンド工業株式会社 | 端材除去装置 |
Families Citing this family (138)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI226877B (en) * | 2001-07-12 | 2005-01-21 | Mitsuboshi Diamond Ind Co Ltd | Method of manufacturing adhered brittle material substrates and method of separating adhered brittle material substrates |
| DE10161813A1 (de) * | 2001-12-14 | 2003-06-26 | Albat & Wirsam Software Vertri | Verfahren und Vorrichtung zum Teilen von Glasplatten in Zuschnitte |
| CN1649799A (zh) * | 2002-01-16 | 2005-08-03 | 三星钻石工业股份有限公司 | 脆性材料基板的划刻器、脆性材料基板的处理机械、脆性材料基板的抛光装置以及脆性材料基板的划刻和断开系统 |
| KR100832292B1 (ko) * | 2002-02-19 | 2008-05-26 | 엘지디스플레이 주식회사 | 액정 패널의 절단 장치 |
| TW200408061A (en) * | 2002-07-02 | 2004-05-16 | Mitsuboshi Diamond Ind Co Ltd | Substrate slicing system for sealed substrates and the substrate slicing method |
| KR100724474B1 (ko) * | 2002-10-22 | 2007-06-04 | 엘지.필립스 엘시디 주식회사 | 액정 표시패널의 절단 장치 및 이를 이용한 절단방법 |
| CN101596723B (zh) * | 2002-11-22 | 2012-05-30 | 三星钻石工业股份有限公司 | 基板分断方法 |
| JP4606325B2 (ja) * | 2003-01-29 | 2011-01-05 | 三星ダイヤモンド工業株式会社 | 基板分断装置および基板分断方法 |
| CN1809512B (zh) * | 2003-04-28 | 2012-11-21 | 三星钻石工业株式会社 | 脆性基板分断系统与脆性基板分断方法 |
| EP1666221A4 (en) * | 2003-09-24 | 2010-09-08 | Mitsuboshi Diamond Ind Co Ltd | SUBSTRATE CUTTING SYSTEM, SUBSTRATE MANUFACTURER AND SUBSTRATE CUTTING METHOD |
| US20080190981A1 (en) * | 2003-12-04 | 2008-08-14 | Yasutomo Okajima | Method for Processing Substrate, Apparatus for Processing Substrate, Method for Conveying Substrate and Mechanism for Conveying Substrate |
| CN100572004C (zh) * | 2004-03-15 | 2009-12-23 | 三星钻石工业株式会社 | 基片切割系统、基片制造设备、基片划线方法以及基片切割方法 |
| DE102004021959A1 (de) * | 2004-05-04 | 2005-12-01 | Heidelberger Druckmaschinen Ag | Vorrichtung zum Beschnitt von Broschuren |
| EP1747867A1 (en) * | 2004-05-20 | 2007-01-31 | Mitsuboshi Diamond Industrial Co., Ltd. | Motherboard cutting method, motherboard scribing apparatus, program and recording medium |
| ITMI20041250A1 (it) * | 2004-06-22 | 2004-09-22 | Bavelloni Z Spa | Procedimento di caricamento e taglio di lastre di vetro su tavoli di taglio |
| DE102004035342B4 (de) * | 2004-07-21 | 2007-12-27 | Schott Ag | Verfahren zum Durchtrennen von Platten aus nichtmetallischen Werkstoffen |
| TWI245746B (en) * | 2004-08-10 | 2005-12-21 | Asia Optical Co Inc | Continuous type glass molding forming system |
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-
2002
- 2002-01-16 WO PCT/JP2002/000258 patent/WO2002057192A1/ja not_active Ceased
- 2002-01-16 CN CN028037898A patent/CN1486285B/zh not_active Expired - Lifetime
- 2002-01-16 JP JP2002557877A patent/JP4402883B2/ja not_active Expired - Fee Related
- 2002-01-16 US US10/450,877 patent/US7131562B2/en not_active Expired - Fee Related
- 2002-01-16 KR KR1020037008560A patent/KR100748159B1/ko not_active Expired - Fee Related
- 2002-01-17 TW TW091100672A patent/TW528735B/zh not_active IP Right Cessation
-
2006
- 2006-10-03 US US11/538,140 patent/US8011546B2/en not_active Expired - Fee Related
-
2008
- 2008-07-08 JP JP2008178310A patent/JP5044751B2/ja not_active Expired - Fee Related
- 2008-11-20 US US12/274,442 patent/US7699200B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI468774B (ja) * | 2010-05-25 | 2015-01-11 | ||
| KR101329819B1 (ko) * | 2012-01-31 | 2013-11-15 | 주식회사 티이에스 | 기판 분단 시스템 및 기판 분단 방법 |
| JP2020111047A (ja) * | 2019-01-09 | 2020-07-27 | 三星ダイヤモンド工業株式会社 | 端材除去装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW528735B (en) | 2003-04-21 |
| WO2002057192A1 (en) | 2002-07-25 |
| US20070080187A1 (en) | 2007-04-12 |
| JPWO2002057192A1 (ja) | 2004-05-20 |
| KR20030069195A (ko) | 2003-08-25 |
| CN1486285A (zh) | 2004-03-31 |
| US20040040997A1 (en) | 2004-03-04 |
| US8011546B2 (en) | 2011-09-06 |
| CN1486285B (zh) | 2013-01-16 |
| JP5044751B2 (ja) | 2012-10-10 |
| US7131562B2 (en) | 2006-11-07 |
| JP2009001484A (ja) | 2009-01-08 |
| KR100748159B1 (ko) | 2007-08-09 |
| US7699200B2 (en) | 2010-04-20 |
| US20090071995A1 (en) | 2009-03-19 |
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