Deprecated: The each() function is deprecated. This message will be suppressed on further calls in /home/zhenxiangba/zhenxiangba.com/public_html/phproxy-improved-master/index.php on line 456
JP4409079B2 - Electronic component mounting equipment - Google Patents
[go: Go Back, main page]

JP4409079B2 - Electronic component mounting equipment - Google Patents

Electronic component mounting equipment Download PDF

Info

Publication number
JP4409079B2
JP4409079B2 JP2000347814A JP2000347814A JP4409079B2 JP 4409079 B2 JP4409079 B2 JP 4409079B2 JP 2000347814 A JP2000347814 A JP 2000347814A JP 2000347814 A JP2000347814 A JP 2000347814A JP 4409079 B2 JP4409079 B2 JP 4409079B2
Authority
JP
Japan
Prior art keywords
electronic component
component mounting
opening
closing
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000347814A
Other languages
Japanese (ja)
Other versions
JP2002151899A (en
Inventor
和英 永尾
聡 門畑
康宏 柏木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2000347814A priority Critical patent/JP4409079B2/en
Publication of JP2002151899A publication Critical patent/JP2002151899A/en
Application granted granted Critical
Publication of JP4409079B2 publication Critical patent/JP4409079B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Supply And Installment Of Electrical Components (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は、電子部品を基板に実装する電子部品実装装置に関するものである。
【0002】
【従来の技術】
電子部品実装装置においては、テープフィーダなどが多数配列された供給部から搭載ヘッドによって電子部品をピックアップし、搬送路上に位置決めされた基板に搭載する実装動作が行われる。実装動作を継続する過程においては、部品補給や品種切り換えに伴う段取り替え作業を行う必要があるため、作業者は電子部品実装装置を閉塞して設けられているカバーを部分的に開放して、必要部分にアクセスする。一般に、このような作業用の開閉式のカバーは、テープフィーダなどが配設された供給部配置面、すなわち搬送路の側方に配置された供給部の前面に設けられる場合が多い。
【0003】
【発明が解決しようとする課題】
しかしながら、近年電子部品実装効率を向上させるため、電子部品の搭載ヘッド駆動機構が複数台設けられたり、また供給部における部品供給用量を増大させる目的で供給部の占有面積を増やすなどの理由によって、電子部品実装装置の奥行き寸法は増大する傾向にある。この結果、基板の搬送路近傍にアクセスする必要があるような作業を行う際の作業性が劣悪化するという問題点があった。
【0004】
そこで本発明は、装置内部へのアクセスを容易にして良好な作業性を確保することができる電子部品実装装置を提供することを目的とする。
【0005】
【課題を解決するための手段】
本発明の電子部品実装装置は、電子部品の供給部から電子部品を搭載ヘッドによってピックアップし基板上に移送搭載する電子部品実装装置であって、前記電子部品実装装置を閉塞して設けられたカバー部と、前記基板を搬送し位置決めする基板の搬送路と、この搬送路の両側に配設されるとともに少なくとも一方側は電子部品を収納したトレイを保持したトレイフィーダである電子部品の供給部とを備え、前記カバー部は、前記搬送路に直交する方向の側面を閉塞するとともに前記搬送路の上方に開閉自在に設けられた開閉部を具備する側面カバー部と、前記搬送路に平行する方向の側面を閉塞するとともに前記供給部を開閉する開閉カバーを有し、前記開閉部を介して電子部品実装装置内部へのアクセスが確保されており、且つこの開閉部が設けられた側面から前記搬送路が作業者がアクセスするのに必要な作業幅で突出している。
【0006】
本発明によれば、基板の搬送路に直交する方向の側面を閉塞する側面カバー部と、この側面カバー部の搬送路の上方に開閉自在に設けられた開閉部とを備えることにより、開閉部を介して電子部品実装装置内部へのアクセスが確保される。
【0007】
【発明の実施の形態】
次に本発明の実施の形態を図面を参照して説明する。図1、図3は本発明の一実施の形態の電子部品実装装置の斜視図、図2は本発明の一実施の形態の電子部品実装装置の平面図である。
【0008】
まず図1、図2を参照して電子部品実装装置について説明する。図1は電子部品実装装置1の全体の外観を、また図2はカバー類を取外した状態の平面を示している。図2において、架台2上には搬送路3がX方向に配設されている。搬送路3は基板4を搬送し、実装位置に位置決めする。
【0009】
搬送路3の両側には、電子部品の供給部5A,5Bが配設されている。供給部5Aには電子部品を保持したテープを供給するテープフィーダ6が多数台並設して装着される。供給部5Bには、電子部品を収納したトレイ7aを保持したトレイフィーダ7が装着される。ここで供給部5B側に装着されるトレイフィーダ7は多数のトレイ7aを保持する必要があることから占有面積が大きく、したがって供給部5Bの端面から装置中央に位置する搬送路3の中心までの奥行距離Dは従来型の電子部品実装装置と比較して大きくなっている。
【0010】
架台2の両端部には、Y軸テーブル8A,8Bが配設されている。Y軸テーブル8A,8BはそれぞれX軸テーブル9A,9BをY方向に駆動する。X軸テーブル9A,9Bには搭載ヘッド10が装着されており、X軸テーブル9A,Y軸テーブル8Aを駆動することにより、搭載ヘッド10は供給部5Aのテープフィーダ6から電子部品をピックアップし、搬送路3上の基板4に搭載する。またX軸テーブル9B,Y軸テーブル8Bを駆動することにより、搭載ヘッド10は供給部5Bのトレイフィーダ7aから電子部品をピックアップする。
【0011】
次に図1を参照して電子部品実装装置のカバー部について説明する。図1に示すように、手前側の側面(搬送路3に直交する方向の側面)には、3つの固定のカバー部材11,12,13(側面カバー部)が取り付けられている。中央のカバー部材12には、搬送路3が突出する開口部12aが設けられている。カバー部材12の搬送路3の上方には、開閉カバー15(開閉部)が設けられており、上部に設けられたヒンジ15aを支点として上方に開放可能となっている。また開閉カバー15には透明体15bが設けられ、閉状態においても装置内部の視認が可能となっている。
【0012】
また反対側の側面には全て固定のカバー部材14が取付けられており、カバー部材14の上部にはシグナルタワー19が設けられている。20はそれぞれカバー部材13,14上に配置された操作盤である。そして装置天井面はカバー部材16で覆われており、カバー部材16の両側には、供給部5A,5Bを開閉する開閉カバー17,18が設けられている。
【0013】
図3は、開閉カバー15を開放した状態を示している。開閉カバー15が設けられた側面からは、搬送路3が作業者がアクセスするのに必要な作業幅に相当する幅Bで突出しており、他装置と連結した場合においても当該側面には幅Bだけ作業スペースが確保されるようになっている。実装作業の途中において、何らかの理由により搬送路3周囲へのアクセスが必要な場合には、作業者は上記作業スペース内に入り、開閉カバー15を上方に開放する。
【0014】
これにより搬送路3の手前側には充分な作業開口が確保され、搬送路3上の基板4など、電子部品実装装置内部の必要部分へのアクセスが可能となる。このようなカバー配置を採用することにより、本実施の形態に示すように供給容量の大きなトレイフィーダのように、広い占有スペースを必要とする供給部を搬送路3の側方に配置して奥行き寸法が増大した場合にあっても、供給部5A,5B側に設けられた開閉カバー17,18以外からのアクセスが確保され、これらの部位からのアクセスが困難な搬送路近傍の作業を容易に行うことができる。
【0015】
【発明の効果】
本発明によれば、基板の搬送路に直交する方向の側面を閉塞する側面カバー部と、この側面カバー部に開閉自在に設けられた開閉部とを備えたので、搬送路の両側に広い部品供給スペースを確保した場合にあっても、開閉部を介して電子部品実装装置内部へのアクセスが確保される。
【図面の簡単な説明】
【図1】本発明の一実施の形態の電子部品実装装置の斜視図
【図2】本発明の一実施の形態の電子部品実装装置の平面図
【図3】本発明の一実施の形態の電子部品実装装置の斜視図
【符号の説明】
1 電子部品実装装置
3 搬送路
4 基板
5A,5B 供給部
7 トレイフィーダ
11,12,13,14 カバー部材
15 開閉カバー
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus for mounting electronic components on a substrate.
[0002]
[Prior art]
In the electronic component mounting apparatus, a mounting operation is performed in which an electronic component is picked up by a mounting head from a supply unit in which a large number of tape feeders and the like are arranged, and mounted on a substrate positioned on a conveyance path. In the process of continuing the mounting operation, it is necessary to perform the setup change work accompanying component replenishment and product type change, so the operator partially opens the cover provided by closing the electronic component mounting device, Access the necessary parts. In general, such an open / close cover for work is often provided on a supply unit arrangement surface on which a tape feeder or the like is arranged, that is, on a front surface of a supply unit arranged on the side of the conveyance path.
[0003]
[Problems to be solved by the invention]
However, in recent years, in order to improve the efficiency of mounting electronic components, a plurality of electronic component mounting head drive mechanisms are provided, or for the purpose of increasing the area occupied by the supply unit in order to increase the component supply amount in the supply unit, The depth dimension of the electronic component mounting apparatus tends to increase. As a result, there has been a problem that workability at the time of performing work that requires access to the vicinity of the substrate conveyance path is deteriorated.
[0004]
Accordingly, an object of the present invention is to provide an electronic component mounting apparatus that can easily access the inside of the apparatus and ensure good workability.
[0005]
[Means for Solving the Problems]
An electronic component mounting apparatus according to the present invention is an electronic component mounting apparatus that picks up an electronic component from a supply part of the electronic component by a mounting head, and transports and mounts the electronic component on a substrate . The cover is provided by closing the electronic component mounting apparatus. and parts, and the transport path of the substrate for positioning and transporting the substrate, a supply portion of the electronic part on both sides are arranged in Rutotomoni least one side of the conveying path is a tray feeder holding the tray accommodating electronic components The cover portion closes a side surface in a direction orthogonal to the transport path and includes a side cover portion provided with an opening / closing section that is openable and closable above the transport path, and a direction parallel to the transport path with closing the sides has a cover for opening and closing the supply section, are reserved access to the internal electronic component mounting apparatus through the opening portion, and the opening and closing The conveying path protrudes with working width necessary to access an operator from the provided side.
[0006]
According to the present invention, an opening / closing portion is provided by including a side cover portion that closes a side surface in a direction orthogonal to the conveyance path of the substrate, and an opening / closing portion that is openable and closable above the conveyance path of the side cover portion. Access to the inside of the electronic component mounting apparatus is ensured via the.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 and 3 are perspective views of an electronic component mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a plan view of the electronic component mounting apparatus according to an embodiment of the present invention.
[0008]
First, an electronic component mounting apparatus will be described with reference to FIGS. FIG. 1 shows the overall appearance of the electronic component mounting apparatus 1, and FIG. 2 shows a plan view with the covers removed. In FIG. 2, a conveyance path 3 is arranged on the gantry 2 in the X direction. The conveyance path 3 conveys the substrate 4 and positions it at the mounting position.
[0009]
On both sides of the transport path 3, supply parts 5A and 5B for electronic components are arranged. A large number of tape feeders 6 for supplying a tape holding electronic components are mounted side by side on the supply unit 5A. A tray feeder 7 holding a tray 7a containing electronic components is attached to the supply unit 5B. Here, the tray feeder 7 mounted on the supply unit 5B side needs to hold a large number of trays 7a, so that the occupied area is large. Therefore, from the end surface of the supply unit 5B to the center of the conveyance path 3 located at the center of the apparatus. The depth distance D is larger than that of a conventional electronic component mounting apparatus.
[0010]
Y-axis tables 8A and 8B are disposed at both ends of the gantry 2. The Y-axis tables 8A and 8B drive the X-axis tables 9A and 9B in the Y direction, respectively. A mounting head 10 is mounted on the X-axis tables 9A and 9B. By driving the X-axis table 9A and the Y-axis table 8A, the mounting head 10 picks up electronic components from the tape feeder 6 of the supply unit 5A. Mounted on the substrate 4 on the transport path 3. Further, by driving the X-axis table 9B and the Y-axis table 8B, the mounting head 10 picks up electronic components from the tray feeder 7a of the supply unit 5B.
[0011]
Next, the cover part of the electronic component mounting apparatus will be described with reference to FIG. As shown in FIG. 1, three fixed cover members 11, 12, and 13 (side cover portions) are attached to the front side surface (side surface in the direction orthogonal to the conveyance path 3). The central cover member 12 is provided with an opening 12a from which the conveyance path 3 protrudes. An opening / closing cover 15 (opening / closing portion) is provided above the conveying path 3 of the cover member 12 and can be opened upward using a hinge 15a provided at the upper portion as a fulcrum. Further, the opening / closing cover 15 is provided with a transparent body 15b, so that the inside of the apparatus can be seen even in the closed state.
[0012]
A fixed cover member 14 is attached to the opposite side surface, and a signal tower 19 is provided above the cover member 14. Reference numerals 20 denote operation panels disposed on the cover members 13 and 14, respectively. And the apparatus ceiling surface is covered with the cover member 16, and the opening and closing covers 17 and 18 which open and close the supply parts 5A and 5B are provided on both sides of the cover member 16.
[0013]
FIG. 3 shows a state in which the opening / closing cover 15 is opened. From the side surface on which the opening / closing cover 15 is provided, the conveyance path 3 protrudes with a width B corresponding to the work width necessary for the operator to access, and even when connected to other devices, the side surface has a width B. Only work space is to be secured. If access to the periphery of the conveyance path 3 is necessary for some reason during the mounting operation, the worker enters the work space and opens the opening / closing cover 15 upward.
[0014]
As a result, a sufficient work opening is ensured on the front side of the transport path 3, and access to necessary parts inside the electronic component mounting apparatus such as the substrate 4 on the transport path 3 becomes possible. By adopting such a cover arrangement, as shown in this embodiment, a supply unit that requires a large occupied space is arranged on the side of the conveyance path 3 as in a tray feeder having a large supply capacity. Even when the dimensions are increased, access from other than the opening and closing covers 17 and 18 provided on the supply parts 5A and 5B side is secured, and work near the conveyance path that is difficult to access from these parts is easily performed. It can be carried out.
[0015]
【The invention's effect】
According to the present invention, since the side cover portion that closes the side surface in the direction orthogonal to the conveyance path of the substrate and the opening / closing portion that is provided in the side cover portion so as to be openable and closable are provided, wide parts are provided on both sides of the conveyance path. Even when the supply space is secured, access to the inside of the electronic component mounting apparatus is secured through the opening / closing part.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. Perspective view of electronic component mounting equipment [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 3 Conveyance path 4 Board | substrate 5A, 5B Supply part 7 Tray feeder 11, 12, 13, 14 Cover member 15 Opening-closing cover

Claims (1)

電子部品の供給部から電子部品を搭載ヘッドによってピックアップし基板上に移送搭載する電子部品実装装置であって、前記電子部品実装装置を閉塞して設けられたカバー部と、前記基板を搬送し位置決めする基板の搬送路と、この搬送路の両側に配設されるとともに少なくとも一方側は電子部品を収納したトレイを保持したトレイフィーダである電子部品の供給部とを備え
前記カバー部は、前記搬送路に直交する方向の側面を閉塞するとともに前記搬送路の上方に開閉自在に設けられた開閉部を具備する側面カバー部と、前記搬送路に平行する方向の側面を閉塞するとともに前記供給部を開閉する開閉カバーを有し、前記開閉部を介して電子部品実装装置内部へのアクセスが確保されており、且つこの開閉部が設けられた側面から前記搬送路が作業者がアクセスするのに必要な作業幅で突出していることを特徴とする電子部品実装装置。
An electronic component mounting apparatus that picks up an electronic component from a supply section of an electronic component by a mounting head, and transfers and mounts the electronic component on a substrate, and covers and positions the cover provided by closing the electronic component mounting device. a transport path of the substrate, at least one side are arranged on both sides of the conveying path Rutotomoni is a supply portion of the electronic part is a tray feeder holding the tray accommodating electronic components,
The cover portion closes a side surface in a direction orthogonal to the conveyance path and includes a side cover portion including an opening / closing portion provided to be openable and closable above the conveyance path, and a side surface in a direction parallel to the conveyance path. An opening / closing cover that closes and opens / closes the supply unit is provided , access to the inside of the electronic component mounting apparatus is secured via the opening / closing unit, and the transport path is operated from a side surface provided with the opening / closing unit. An electronic component mounting apparatus that protrudes with a work width necessary for a person to access.
JP2000347814A 2000-11-15 2000-11-15 Electronic component mounting equipment Expired - Fee Related JP4409079B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000347814A JP4409079B2 (en) 2000-11-15 2000-11-15 Electronic component mounting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000347814A JP4409079B2 (en) 2000-11-15 2000-11-15 Electronic component mounting equipment

Publications (2)

Publication Number Publication Date
JP2002151899A JP2002151899A (en) 2002-05-24
JP4409079B2 true JP4409079B2 (en) 2010-02-03

Family

ID=18821491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000347814A Expired - Fee Related JP4409079B2 (en) 2000-11-15 2000-11-15 Electronic component mounting equipment

Country Status (1)

Country Link
JP (1) JP4409079B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005216903A (en) * 2004-01-27 2005-08-11 I-Pulse Co Ltd Substrate inspection apparatus
JP4893727B2 (en) * 2008-11-05 2012-03-07 パナソニック株式会社 Substrate transport apparatus, electronic component mounting apparatus, and electronic component mounting apparatus working method
JP6283681B2 (en) * 2013-10-16 2018-02-21 富士機械製造株式会社 Working machine

Also Published As

Publication number Publication date
JP2002151899A (en) 2002-05-24

Similar Documents

Publication Publication Date Title
JP2014111310A (en) Transport robot, housing, semiconductor manufacturing device, and sorter device
JPH04299899A (en) Parts mounting machine
JP4409079B2 (en) Electronic component mounting equipment
KR20080096312A (en) Tape Feeder for Component Mounter
JP4479082B2 (en) Electronic component mounting equipment
JP3974992B2 (en) Substrate storage container lid opening / closing device and substrate loading / unloading device
CN216916997U (en) Turnover jig for PCBA (printed circuit board assembly)
JP4164734B2 (en) Game machine
JP2001345594A (en) Substrate transfer device
JP2004024346A (en) Pachinko game machine
JP2020141000A (en) Substrate processing equipment
JP4783689B2 (en) Component mounting equipment
JPH0951195A (en) Printed circuit board supply device
JP3926265B2 (en) Glass substrate transport box
JP3957157B2 (en) Mounting machine
JP4232141B2 (en) Board layout structure for gaming machines
JP4719651B2 (en) Template sheet for common mount of component mounting apparatus and component mounting apparatus
JPH1168384A (en) Parts supply device
CN100399129C (en) Substrate cassette
JP3895676B2 (en) Substrate processing equipment
JP2000031234A (en) Substrate transfer device
JP7108808B2 (en) Component mounter and method of operating the component mounter
JPH0545866A (en) Automatic pellicle pasting device
JP4150872B2 (en) Back protection member for pachinko machines
US5944941A (en) Turning-over machine and polishing apparatus

Legal Events

Date Code Title Description
RD01 Notification of change of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7421

Effective date: 20050630

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060215

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060221

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060331

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20060425

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090904

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20091111

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121120

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121120

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131120

Year of fee payment: 4

LAPS Cancellation because of no payment of annual fees