JP4410036B2 - Component mounting device - Google Patents

Description

  The present invention relates to a component mounting apparatus that mounts a component on a board, and more particularly to a component mounting apparatus that recognizes a recognition mark formed on a board using a camera and identifies a mounting position of the component.

  Conventionally, in a component mounter such as a flip chip bonder, when recognizing a recognition mark formed on a substrate, the substrate is irradiated from the upper side of the substrate by coaxial illumination or oblique illumination and is provided on the substrate. The components are mounted after the substrate holes and the recognition marks are recognized and positioned by the position recognition camera.

  However, when recognizing recognition marks and substrate holes formed on the substrate using light from above, the material and surface state of the substrate, the condition of light reflection, the case where the substrate is thick, etc. However, there is a problem that the position of the recognition mark or the substrate hole cannot be accurately grasped due to the influence of the shadow caused by the oblique illumination.

FIG. 9 is an explanatory diagram for explaining a problem in the case of recognizing a substrate hole formed on a conventional substrate using a light source from above the substrate.
FIG. 9A is a diagram showing the positional relationship when the wavelength and the deflection component of the light reflected by the substrate 901 and the receiving portion 902 such as a stage are the same. In this case, the position recognition camera 904 cannot accurately recognize the position of the substrate hole 903.

  FIG. 9B shows a case where the position recognition camera 904 cannot correctly recognize the shape of the substrate hole 903 due to the shadow 905 generated by the incident direction of light and the thickness of the substrate 901. Since the shadow portion 905 is generated, the camera misidentifies the position of the board hole 903, and the mounting position of the component is shifted.

  Further, FIG. 9C shows that the shape of the substrate hole 903 is formed by the position recognition camera 904 because light from the light source is irregularly reflected near the substrate hole 903 due to the shape of the substrate hole 903 formed in the substrate 901. The case where it cannot recognize correctly is shown.

  9D, since the film 906 is attached to the surface including the substrate hole 903 of the substrate 901, the light from the light source is reflected on the film 906, and the position recognition camera 904 causes the substrate hole 903 to be reflected. The case where the position of cannot be recognized correctly is shown.

  Therefore, in such a conventional component mounting apparatus, light from the light source is irradiated from above the substrate, so that a recognition mark or a substrate hole formed on the substrate in the position recognition camera due to light reflection or the like. Cannot be recognized correctly. For this reason, there is a problem that the mounting position of the component is shifted.

In order to solve such a problem, a mounting state recognition device is disclosed in which an illumination device is disposed below the substrate in order to recognize a recognition mark or a substrate hole formed on the substrate (for example, a patent). Reference 1).
Japanese Patent Laid-Open No. 3-99251

  However, since the mounting state recognition device shown in Patent Document 1 has an illumination device that directly illuminates a substrate hole directly under the substrate, the device itself becomes large. In particular, in a situation where downsizing of the device in recent years is required, the device is enlarged in the vertical direction, which causes a problem in improving maintenance workability of the component mounting device.

  The present invention has been made in view of the above problems, and provides a component mounting apparatus capable of more reliably recognizing a recognition mark or a substrate hole formed on a substrate while reducing the size of the device. For the purpose.

  In order to solve the above-described problems, the present invention is a component mounting apparatus for mounting a component on a board, and images a light source, light reflecting means for reflecting light emitted from the light source toward the board, and imaging the board. Imaging means for positioning, and positioning means for relatively positioning the component and the substrate based on a result of imaging by the imaging means, wherein the substrate is placed on the light reflecting means. And

  The present invention is also used in a component mounting apparatus for mounting a component on a substrate, and is a substrate support member for supporting the substrate, wherein the substrate support member is made of a light transmissive material, and the substrate support member Is characterized in that a light reflecting slope for reflecting light from a light source for irradiating the substrate to the substrate side is formed.

  The component mounting apparatus according to the present invention irradiates the recognition mark and the substrate hole formed on the substrate from below, so that the position recognition camera recognizes the position of the substrate hole more accurately and moves it onto the component substrate. Mounting efficiency can be increased.

  In addition, since the light source included in the component mounting apparatus is disposed other than directly under the substrate, the apparatus itself can be reduced in size.

Embodiments of a component mounting apparatus according to the present invention will be described below with reference to the drawings.
(Embodiment)
FIG. 1 is a configuration diagram showing the overall configuration of a component mounting apparatus according to an embodiment of the present invention.

  The component mounting apparatus according to the present embodiment mounts a component 101 such as an IC chip at a predetermined mounting position on the substrate 102 by a flip chip mounting method. The component 101 is held and the component 101 is mounted on the substrate 102. A pressing unit 110 that presses the mounting position on the upper side, a recognition camera 401 that images a mounting site on the substrate 102 from above, a stage unit 100 on which the substrate 102 is placed, and a substrate that moves the stage unit 100 to the mounting position And an XYθ table 116.

  The pressing unit 110 includes a bonding head 111 that attracts and holds the component 101 to the component holding unit 115 at the tip, a head shaft 112, a head holder 113 for attaching the bonding head 111 to the head shaft 112, and the head shaft 112. A head elevating unit 114 that elevates and lowers the bonding head 111 in the vertical direction by driving.

  As will be described in detail later, the present invention is characterized by the stage portion 100 indicated by oblique lines, and by using a glass block for the stage portion 100, the lower portion of the substrate 102 is indicated by an arrow in FIG. Irradiate light upward from.

  FIG. 2 is an exploded perspective view for explaining the configuration of the stage unit 100 of the component mounting apparatus according to the present embodiment. A component 101 shown in FIG. 2 is a component such as an IC chip mounted on the substrate 102, and the substrate 102 is provided with a substrate hole 102a that is a through hole for position recognition.

  The stage unit 100 of the component mounting apparatus is a stage on which the component 101 is mounted on the substrate 102, and includes a glass block 103, a metal plate 104, an irradiation port 105, and a lower plate 106.

  The glass block 103 serving as a light reflecting means is a block member for receiving a substrate, and has a size of, for example, 30 to 50 mm square. The glass block 103 supports the substrate 102 when mounting the component 101 and also emits light from the irradiation port 105. Is reflected to the substrate 102 side. The glass block 103 is made of heat-resistant glass that can be heated to a high temperature. This is because the substrate is heated to a high temperature when the substrate is mounted. Further, since the glass has excellent heat insulation properties, the glass block 103 prevents the heat on the bonding head 111 side from escaping to the stage unit 100 side when the component 101 is mounted on the substrate 102, and overheats. There is also an effect of improving efficiency. The block member may be a transparent material that transmits light, and may be a transparent member other than glass, such as a transparent heat-resistant resin or prism.

  The glass block 103 is formed with a sandblasted surface 103a, which is a light reflecting slope that reflects light from the light source toward the substrate 102. The sandblasted surface 103a is roughened by roughening so as to cause irregular reflection of light. Further, as will be described later with reference to FIG. 4, the glass block 103 is formed with a substrate suction groove connected to the substrate suction hole 107 a for sucking and fixing the substrate 102 during component mounting. ing.

  Note that the block member used in the component mounting apparatus may be a plurality of types having different sizes and positions of sandblasted surfaces so that they can be exchanged during mounting according to the size of the substrate 102 and the position of the substrate hole 102a. Has been prepared.

  The metal plate 104 is made of a metal such as stainless steel, and an opening corresponding to the size of the glass block 103 is formed at the center thereof. In the metal plate 104, through-holes through which light irradiated from an irradiation port 105, which will be described later, pass are formed as necessary. In this embodiment, four through-side portions are formed. The glass block 103 is irradiated from the side surface by the light irradiated from the irradiation port 105.

  The irradiation port 105 has a function as a light source in the present invention. Light generated by a light generation unit 109 (see FIG. 4) such as an LED or a halogen lamp is transmitted from a light transmission means such as an optical fiber and then irradiated from an irradiation port 105.

  The lower receiving plate 106 is a member that fixes the glass block 103 against pressure applied during component mounting, and is made of metal, ceramic, or the like. Further, the lower plate 106 is connected to a substrate suction portion 107 connected to a vacuum device (the suction means of the present invention) for vacuum suction of the substrate 102 and a vacuum device for vacuum suction of the glass block 103. The block suction portion 108 is formed, the substrate suction portion 107 is connected to the substrate suction hole 107a, and the glass block suction portion 108 is connected to the block suction hole 108a. As will be described later, the lower plate 106 may be provided with a heater or the like for heating the glass block 103 during component mounting.

In a component mounting machine such as a flip chip bonder, the component 101 is sucked and held by the component holding unit 115 and mounted at a predetermined position on the substrate 102.
FIG. 3 shows a perspective view and a top view of the stage unit 100 of the component mounting apparatus according to the present embodiment.

FIG. 3A is a perspective view of the stage unit 100 in which the glass block 103, the metal plate 104, the irradiation port 105, and the lower plate 106 shown in FIG. 2 described above are combined.
FIG. 3B is a top view showing a portion where the glass block 103 shines brightly. When the glass block 103 is observed from the upper side, the four hatched portions appear to shine particularly brightly.

  FIG. 4 shows a side sectional view and a top view of the stage unit 100 of the component mounting apparatus according to the present embodiment. Note that an arrow is generated in the light generation unit 109 and indicates a traveling direction of light emitted from the irradiation port 105, and the light from the irradiation port 105 is directed to the substrate 102 side on the sandblasting surface 103 a formed in the glass block 103. The light is reflected and irradiated from the bottom to the top of the substrate hole 102a.

The recognition camera 401, which is an imaging means, can image the substrate hole 102a formed in the substrate 102 with this light and accurately recognize the position.
As shown in FIG. 4A, the glass block 103 is formed with a substrate suction groove 103b for sucking the substrate at the time of mounting the components, and a suction hole 103c is formed inside. The lower receiving plate 106 is formed therein with a substrate suction hole 107 a connected to the substrate suction part 107 and a glass block suction hole 108 a connected to the glass block suction part 108. The substrate suction hole 107a is connected to the substrate suction groove 103b through the suction hole 103c.

  As shown in FIG. 4A, the lower plate 106 can be provided with a heater 402 which is a heating means for heating the glass block 103. By heating the glass block 103 using the heater 402, the mounting efficiency of the component 101 can be improved by heating the substrate 102 more efficiently when the component 101 is mounted on the substrate 102.

  FIG. 4B shows a top view when the substrate 102 is placed on the stage unit 100. The substrate 102 is transported to a position where the light emitting portion of the glass block 103 and the substrate hole 102a correspond to each other, and sucks the substrate 102 in the substrate suction groove 103b.

  FIG. 5 is a flowchart showing an operation procedure during component mounting in the component mounting apparatus according to the present embodiment. The component mounting operation for mounting the component 101 on the substrate 102 is the same as the conventional one.

  First, the type of the substrate 102 and the position of the substrate hole 102a formed on the substrate 102 are specified (S501). Then, the type of the glass block 103 is specified in accordance with the type of the substrate 102 and mounted on the stage unit 100 (S502).

  Next, light from the irradiation port 105 is introduced, light from the irradiation port 105 is irregularly reflected on the sandblasted surface 103a, and light is irradiated from below to above the substrate 102 (S503).

  The following is a process for mounting the component 101 on the substrate 102 as in the conventional case, but the substrate 102 is transported to a predetermined position on the glass block 103 using a transport arm or the like (S504), and the glass block 103 is illuminated. Then, the position of the substrate hole 102a formed on the substrate 102 is imaged using the recognition camera 401 (S505).

  Next, relative positioning of the substrate 102 and the component 101 is performed on the substrate XYθ table 116 as positioning means based on the imaging result (S506), and the component 101 held in the component holding unit 115 is heated. It mounts on the board | substrate 102 (S507), and completes a series of component mounting processes in the component mounting apparatus.

  As described above, the sandblasted surface 103a, which is a ground glass-like processed surface, is formed on the side surface of the glass block 103 constituting the stage unit 100 in the component mounting apparatus according to the present invention. Yes. And the upper surface of the glass block 103 is light-emitted by irregularly reflecting the light from the irradiation port 105 in the sandblasting surface 103a. In the present embodiment, the glass block 103 itself does not emit light, but has the same effect as light irradiation from the lower surface of the substrate 102. Therefore, the recognition camera 401 can more accurately image the board hole 102a formed on the board 102, and the positioning means can accurately position the component 101 and the board 102.

In addition, since the irradiation port 105 is disposed on the side of the glass block 103, the component mounting apparatus does not increase in the vertical direction, and the apparatus itself can be downsized.
Furthermore, since the component mounting apparatus recognizes the position of the light from the irradiation port 105 using the irregularly reflected light on the sandblasted surface 103a, there is no directivity of light, and the recognition camera 401 receives the irradiation light from below. By using it, the substrate hole 102a formed on the substrate 102 can be recognized from all angles.

Furthermore, since the glass block 103 is heat-resistant glass, the substrate 102 can be heated when the component 101 is mounted on the substrate 102 as usual.
Since the type and size of the glass block 103 can be changed according to the type of the substrate 102, it is possible to perform component mounting processing on various types of substrates 102.

  In the description of the present embodiment, the irradiation port 105 has been described as being disposed only on the side surface of the glass block 103. However, the present invention is not limited to this, and the substrate 102 is similar to the conventional one. It is also conceivable to use in combination with illumination that illuminates from above.

Hereinafter, the modification of the structure of the glass block 103 used for the component mounting apparatus which concerns on this invention, and the stage part 100 is shown.
FIG. 6 is a side sectional view showing a configuration of a stage unit according to a modification of the component mounting apparatus according to the present invention. In the modification shown in FIG. 6, the stage unit is configured by separating the substrate receiving member 602 which is another substrate supporting means and the glass block 601. This is because the glass block 103 itself is expensive, and by using efficiently the substrate receiving member 602 made of an inexpensive metal or ceramic material, a more inexpensive component mounting apparatus can be achieved while maintaining the effects of the present invention. Can be realized. The substrate receiving member 602 is provided with suction holes 602a and 602b for vacuum suction of the substrate 102 and the glass block 601.

  FIG. 7 is a side cross-sectional view showing a configuration of a stage unit according to another modification. Here, the modification regarding the arrangement | positioning of the light source which irradiates the sandblasting surface formed in the glass block is shown.

  FIG. 7A shows the glass block 701 in the case where it is impossible to arrange the irradiation port 105 at four positions on the side surface of the glass block 103 as shown in FIG. It is side surface sectional drawing of a stage part at the time of providing the sandblast surface 701a in one place and making the position of the irradiation port 105 into one place of the side surface. Since light from the irradiation port 105 travels as indicated by an arrow in the figure, the recognition camera can recognize the substrate hole 102a formed on the substrate 102. In addition to the sandblast surface 701a, it is possible to attach a mirror to the notch and reflect the light from the irradiation port 105.

  FIG. 7B is a side cross-sectional view of the stage unit suitable when the irradiation port 105 cannot be disposed on the side surface due to the space problem of the component mounting apparatus. In this case, for example, the irradiation port 105 is disposed on the side and above the glass block 702. Arrows indicate the direction of light travel. Even in this case, the substrate hole 102a provided in the substrate 102 can be imaged with light from the lower side to the upper side using light from the irradiation port 105. Needless to say, the arrangement of the irradiation port 105 and the sandblasted surface 103a can be variously changed, as shown in FIG.

  FIG. 8 is an external view of a glass block according to various modifications used in the component mounting apparatus according to the present invention. FIG. 8A shows a trapezoidal glass block 801 in which two cutout portions having a function as a light reflecting slope are provided on a rectangular parallelepiped side surface, and FIG. 8B shows a cutout portion to be formed. FIG. 8C shows a glass block 803 provided with only a part of a notch, and FIG. 8D shows a substrate hole formed on the substrate 102. The glass block 804 which formed the notch part inside according to the position of is shown. Thus, it becomes possible to enlarge the irradiation area of the surface of a glass block by making the angle of the notch part formed steep. In addition, the position of the notch part formed in a glass block can be provided in various places other than the position shown to this figure.

  The present invention relates to a component mounting apparatus for mounting a component on a substrate, and a substrate support member for supporting the substrate in the component mounting apparatus, in particular, a component using a recognition camera by a recognition mark or a substrate hole formed on the substrate. As a component mounting apparatus or the like for positioning the substrate and mounting the component, for example, it can be used as a die bonder, a wire bonder, a flip chip bonder, or the like.

It is a block diagram which shows the whole structure of the components mounting apparatus which concerns on this invention. It is a disassembled perspective view for demonstrating the structure of the stage part of a components mounting apparatus. It is the perspective view and top view of the stage part of a component mounting apparatus. It is side surface sectional drawing and the top view of the stage part of a component mounting apparatus. It is a flowchart which shows the operation | movement procedure at the time of component mounting in a component mounting apparatus. It is side surface sectional drawing which shows the structure of the other stage part 1 used for a component mounting apparatus. It is side surface sectional drawing at the time of deform | transforming arrangement | positioning of the light source which irradiates the sandblast surface currently formed in the glass block. It is an external view which shows the other shape of the glass block used for a component mounting apparatus. It is explanatory drawing for demonstrating the problem in the case of recognizing the board | substrate hole currently formed on the board | substrate using the light source from the board | substrate upper direction.

Explanation of symbols

101 Parts 102 Substrate 102a Substrate hole 103 Glass block 103a Sand blasted surface 103b Substrate suction groove 104 Metal plate 105 Irradiation port 106 Substrate receiving plate 107 Substrate suction part 107a Substrate suction hole 108 Block suction part 108a Block suction hole 109 Light generation unit 401 Recognition camera 402 Heater 601, 701, 702 Glass block 602 Substrate receiving member 801-804 Glass block

Claims (5)

A component mounting apparatus for mounting a component on a board,
A light source;
A stage portion on which a substrate on which a substrate hole which is a through hole for position recognition is formed is placed;
Imaging means for imaging from above the substrate hole of the substrate placed on the stage unit using light emitted from the light source;
Positioning means for relatively positioning the component and the substrate based on an imaging result by the imaging means;
The stage unit includes light reflecting means for reflecting the light emitted from the light source to the substrate side and supporting the substrate,
The light reflecting means is formed of a transparent material that transmits light, and a light reflecting slope that reflects light emitted from the light source toward the substrate is formed on a side portion, and the light reflecting slope is roughened. A component mounting device characterized by being processed . The light source is disposed above the light reflecting means,
The component mounting apparatus according to claim 1, wherein the light reflecting means irradiates the substrate placed on the light reflecting means from below by reflecting light from the light source at least once. . The stage portion further includes
The component mounting apparatus according to claim 1, further comprising a heating unit configured to heat the light reflecting unit. The light reflecting means is a shape having a rectangular parallelepiped shape with a notch,
It said light reflecting slope, component mounting apparatus according to claim 1, wherein the a side surface of the rectangular parallelepiped is the notch portion provided at least one or more. The permeable material component mounting apparatus according to claim 1, characterized in that the heat resistance of the glass.

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